CN115235257A - Temperature control method and semiconductor device - Google Patents
Temperature control method and semiconductor device Download PDFInfo
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- CN115235257A CN115235257A CN202211060301.4A CN202211060301A CN115235257A CN 115235257 A CN115235257 A CN 115235257A CN 202211060301 A CN202211060301 A CN 202211060301A CN 115235257 A CN115235257 A CN 115235257A
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- H01L21/67248—Temperature monitoring
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Abstract
The application discloses a temperature control method and semiconductor equipment. According to the method, whether the abnormal condition of the temperature detection value belongs to the jump type abnormality or not can be distinguished according to the abnormal duration period of the temperature detection value of the temperature control section, namely when the abnormal duration period of the temperature detection value is smaller than the preset period number, the abnormal condition of the temperature detection value is considered to belong to the jump type abnormality; and when the abnormal continuous period of the temperature detection value is not less than the preset period number, the abnormal condition of the temperature detection value is considered not to belong to the jump type abnormality and to belong to the obvious abnormal condition. According to the method, the obvious abnormal condition of the temperature detection value is not processed, and only the jumping abnormal condition of the temperature detection value is processed, namely, the jumping variation constant is filtered, so that the problem of jumping of the temperature detection value in the process is solved, and the process result is prevented from being influenced by abnormal fluctuation of the temperature; on the other hand, the judgment of obvious abnormal conditions of the temperature detection value is not influenced.
Description
Technical Field
The present disclosure relates to the field of semiconductor processes, and more particularly, to a temperature control method and a semiconductor device.
Background
In the process of semiconductor equipment (such as semiconductor vertical furnace equipment), the uniformity and stability of the temperature of a furnace body directly determine the process quality. At present, the control scheme of the furnace body temperature of the semiconductor equipment is as follows: and under each temperature control period, detecting the temperature of the furnace body through a temperature sensor, and controlling the heating power of the furnace body based on the detected temperature of the furnace body so as to stabilize the temperature of the furnace body at a preset target temperature value.
Specifically, in the process of controlling the furnace body temperature of the semiconductor equipment, the furnace body temperature value sampled by the temperature sensor is read once in each temperature control period, but sometimes the situation that the furnace body temperature sampling value jumps may occur, namely the furnace body temperature sampling value is abnormal suddenly, the abnormal value only occurs in one or a few temperature control periods, the furnace body temperature sampling value is automatically recovered to be normal in the subsequent temperature control periods, and the reason of the abnormal value is unknown. However, the abnormal value may participate in the furnace body temperature control, resulting in abnormal fluctuation of the furnace body temperature and affecting the process result.
Disclosure of Invention
The purpose of the present application is to provide a temperature control method and a semiconductor device, which do not process the obvious abnormal condition of the temperature detection value, but only process the abnormal condition of the jump of the temperature detection value, on one hand, to solve the problem of the jump of the temperature detection value in the process, thereby avoiding the influence of the abnormal fluctuation of the temperature on the process result; on the other hand, the method does not affect the judgment of obvious abnormal conditions of the temperature detection values.
In order to solve the above technical problem, the present application provides a temperature control method, which is applied to a semiconductor device, a temperature control area of the semiconductor device is divided into a plurality of temperature control sections, each of the temperature control sections is provided with a first temperature sensor and a power controller, and the temperature control method includes:
determining a temperature detection value of a target temperature control section in a current temperature control period based on a first target temperature sensor corresponding to the target temperature control section; wherein the target temperature control section is any one of the temperature control sections;
when the first target temperature sensor is in a normal detection state and the target temperature control section meets a preset jump abnormity processing condition, judging whether the temperature detection value in the current temperature control period is abnormal according to a preset abnormity judgment strategy;
if so, calculating a temperature control power value corresponding to the temperature detection value in a previous temperature control period based on a first temperature control mode corresponding to the first target temperature sensor when the abnormal continuous period of the temperature detection value is smaller than a preset period number; when the abnormal continuous period is not less than the preset period number, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode;
if not, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode;
and sending the calculated temperature control power value to a target power controller corresponding to the target temperature control section so that the target power controller controls the temperature of the target temperature control section based on the temperature control power value.
Optionally, the determining, based on a first target temperature sensor corresponding to a target temperature control section, a temperature detection value of the target temperature control section in a current temperature control cycle includes:
in each temperature control period, reading temperature sampling values of the first target temperature sensor every other preset first time period so as to read a preset number of temperature sampling values;
and calculating the average value of the preset number of temperature sampling values in the current temperature control period, and taking the average value as the temperature detection value of the target temperature control section in the current temperature control period.
Optionally, before the first target temperature sensor is in a normal detection state, the temperature control method further includes:
reading decoupling alarm information corresponding to the first target temperature sensor;
judging whether the first target temperature sensor has a decoupling condition or not based on the decoupling alarm information;
and if the first target temperature sensor does not have the decoupling condition, judging that the first target temperature sensor is in a normal detection state.
Optionally, the determining, according to a preset abnormality determination policy, whether the temperature detection value in the current temperature control period is abnormal includes:
obtaining the temperature detection value x of the target temperature control section in the nth temperature control period n And calculating the average value of the temperature detection values of the target temperature control section in the previous m temperature control periods
And the standard deviation sigma; wherein the previous m temperature control cycles are from the (n-m + 1) th temperature control cycle to the nth temperature control cycle, and m is a preset cycle threshold;
according to the temperature detection value x n The average value
And calculating a critical value of the standard deviation sigma;
finding a reference critical value corresponding to the nth temperature control period under a preselected confidence interval from a preset Grubbs critical value table, and judging whether the critical value is greater than the reference critical value and whether the standard deviation is greater than a preset standard deviation threshold value; wherein the preset grubbs critical value table represents: corresponding relation between the temperature control cycle number and the reference critical value in different confidence intervals;
if the critical value is larger than the reference critical value and the standard deviation is larger than the preset standard deviation threshold value, judging that the temperature detection value under the nth temperature control period is abnormal;
and if the critical value is not larger than the reference critical value and/or the standard deviation is not larger than the preset standard deviation threshold value, judging that the temperature detection value under the nth temperature control period is not abnormal.
Optionally, the temperature control method further comprises:
when the abnormal continuous period is smaller than the preset period number, performing abnormal recording;
and when the abnormal continuous period is not less than the preset period number, performing abnormal alarm.
Optionally, before the target temperature control section meets a preset jump exception handling condition, the temperature control method further includes:
judging whether the current temperature control period of the target temperature control section belongs to the first m temperature control periods when the temperature of the target temperature control section is just started, and whether an abnormal alarm exists in the target temperature control section within a preset second time period; wherein m is a preset period threshold;
and if the current temperature control period does not belong to the first m temperature control periods of the temperature control at the beginning and the target temperature control section has no abnormal alarm in a preset second time period, judging that the target temperature control section meets a preset jump abnormity processing condition.
Optionally, the temperature control method further comprises:
and when the first target temperature sensor is in a normal detection state and the target temperature control section does not meet a preset jump abnormity processing condition, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode, and taking the calculated temperature control power value as the temperature control power value sent to the target power controller in the current temperature control period.
Optionally, each temperature control section is further provided with a second temperature sensor correspondingly;
the temperature control method further includes:
when the first target temperature sensor is not in a normal detection state, determining the actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor corresponding to the target temperature control section, and calculating the temperature control power value corresponding to the actual temperature value in the current temperature control period based on a second temperature control mode corresponding to the second target temperature sensor so as to take the calculated temperature control power value as the temperature control power value sent to the target power controller in the current temperature control period.
Optionally, each of the second temperature sensors comprises a primary temperature sensor and a backup temperature sensor;
the determining an actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor corresponding to the target temperature control section includes:
judging whether a main temperature sensor in the second target temperature sensors is in a normal detection state or not;
if yes, determining an actual temperature value of the target temperature control section in the current temperature control period based on a main temperature sensor in the second target temperature sensor;
if not, determining the actual temperature value of the target temperature control section in the current temperature control period based on the standby temperature sensor in the second target temperature sensor.
In order to solve the above technical problem, the present application further provides a semiconductor device, including:
a furnace body; the temperature control area of the furnace body is divided into a plurality of temperature control sections, and each temperature control section is correspondingly provided with a first temperature sensor and a power controller;
and the temperature controller is used for controlling the temperature of the temperature control area by adopting any one of the temperature control methods.
The application provides a temperature control method, which is applied to semiconductor equipment, wherein a temperature control area of the semiconductor equipment is divided into a plurality of temperature control sections, each temperature control section is correspondingly provided with a first temperature sensor and a power controller, and the temperature control method comprises the following steps: determining a temperature detection value of the target temperature control section in the current temperature control period based on a first target temperature sensor corresponding to the target temperature control section; when the first target temperature sensor is in a normal detection state and the target temperature control section meets a preset jump abnormity processing condition, judging whether a temperature detection value in a current temperature control period is abnormal or not according to a preset abnormity judgment strategy; if so, calculating a temperature control power value corresponding to the temperature detection value in the previous temperature control period based on a first temperature control mode corresponding to the first target temperature sensor when the abnormal duration period of the temperature detection value is smaller than the preset period number; when the abnormal duration period is not less than the preset period number, calculating a temperature control power value corresponding to a temperature detection value in the current temperature control period based on the first temperature control mode; if not, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode; and sending the calculated temperature control power value to a target power controller corresponding to the target temperature control section so that the target power controller controls the temperature of the target temperature control section based on the temperature control power value.
Therefore, the method can distinguish whether the abnormal condition of the temperature detection value belongs to the jump type abnormality or not according to the abnormal duration period of the temperature detection value of the temperature control section, namely when the abnormal duration period of the temperature detection value is smaller than the preset period number, the abnormal condition of the temperature detection value is considered to belong to the jump type abnormality; and when the abnormal continuous period of the temperature detection value is not less than the preset period number, the abnormal condition of the temperature detection value is considered not to belong to the jump type abnormality and to belong to the obvious abnormal condition. According to the method, the obvious abnormal condition of the temperature detection value is not processed, and only the jumping abnormal condition of the temperature detection value is processed, namely, the jumping variation constant is filtered, so that the problem of jumping of the temperature detection value in the process is solved, and the process result is prevented from being influenced by abnormal fluctuation of the temperature; on the other hand, the judgment of obvious abnormal conditions of the temperature detection value is not influenced.
The present application also provides a semiconductor device having the same advantageous effects as the above temperature control method.
Drawings
In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic configuration diagram of a temperature sensor on a semiconductor device according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a temperature control method according to an embodiment of the present disclosure;
fig. 3 is a detailed flowchart of a temperature control method according to an embodiment of the present disclosure.
Detailed Description
The core of the application is to provide a temperature control method and semiconductor equipment, which do not process the obvious abnormal condition of the temperature detection value, and only process the jumping abnormal condition of the temperature detection value, on one hand, the problem of jumping of the temperature detection value in the process is solved, thereby avoiding the influence of abnormal fluctuation of the temperature on the process result; on the other hand, the method does not affect the judgment of obvious abnormal conditions of the temperature detection values.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic configuration diagram of a temperature sensor on a semiconductor device according to an embodiment of the present disclosure. As shown in fig. 1, a temperature control area (a range wrapped by a furnace body heating wire) of a semiconductor device (such as a semiconductor vertical furnace device) is divided into 5 temperature control sections, namely Zone1 to Zone5 (or divided into other number of temperature control sections (including a case that the whole temperature control area has only one temperature control section), which is determined according to actual situations); each temperature control section is provided with an independent power controller for controlling the temperature; the furnace body is provided with three groups of temperature sensors (other temperature sensors can be arranged, and the temperature sensors can be thermocouples according to actual conditions), namely Profile TC, innerTC and OuterTC; each group of temperature sensors comprises 5 temperature sensors, and the 5 temperature sensors are in one-to-one correspondence with the 5 temperature control sections and are used for detecting the temperatures of the corresponding temperature control sections; wherein, the Profile TC is arranged in the inner pipe of the semiconductor device and is close to the silicon chip mounting position as much as possible (the Profile TC can not be arranged); innerTC is arranged in the process tube of the semiconductor equipment or between the inner tube and the outer tube of the double-layer tube and is mainly used for temperature control in the actual process; the OuterTC is arranged near the furnace body heating wire and used for detecting the temperature of the furnace body heating wire area, standby temperature control in the actual process and the like.
The control scheme of the furnace body temperature of the existing semiconductor equipment is as follows: and reading the furnace body temperature value sampled by a temperature sensor (InnerTC) once in each temperature control period, and controlling the heating power of the furnace body based on the read furnace body temperature value so as to stabilize the furnace body temperature at a preset target temperature value. However, sometimes, the furnace body temperature sampling value jumps, that is, the furnace body temperature sampling value suddenly becomes abnormal, the abnormal value only appears in one or a few temperature control cycles, the furnace body temperature sampling value automatically returns to normal in the subsequent temperature control cycles, the reason of the abnormal value is unknown, but the abnormal value participates in the furnace body temperature control, so that the furnace body temperature abnormally fluctuates, and the process result is influenced.
In view of the above technical problems, the present application provides a new temperature control method. Referring to fig. 2, fig. 2 is a flowchart of a temperature control method according to an embodiment of the present disclosure. As shown in fig. 2, the temperature control method is applied to a semiconductor apparatus, and includes the steps of:
step S1: and determining the temperature detection value of the target temperature control section in the current temperature control period based on the first target temperature sensor corresponding to the target temperature control section.
In the embodiment of the present application, the temperature control region of the semiconductor device is divided into a plurality of temperature control sections (or in the case that the whole temperature control region has only one temperature control section), and each temperature control section is correspondingly provided with the first temperature sensor (e.g., innerTC) and the power controller. The target temperature control section is any temperature control section, and the first target temperature sensor is a first temperature sensor correspondingly arranged in the target temperature control section. The temperature control period may be set to 2s, or other times.
Step S2: when the first target temperature sensor is in a normal detection state and the target temperature control section meets a preset jump abnormity processing condition, judging whether the temperature detection value in the current temperature control period is abnormal or not according to a preset abnormity judgment strategy; if yes, executing step S3; if not, executing step S4.
And step S3: when the abnormal continuous period of the temperature detection value is smaller than the preset period number, calculating a temperature control power value corresponding to the temperature detection value in the previous temperature control period based on a first temperature control mode corresponding to the first target temperature sensor; and when the abnormal continuous period is not less than the preset period number, calculating the temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode.
And step S4: and calculating the temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode.
In the embodiment of the application, each temperature sensor has a temperature control mode corresponding to the temperature sensor, for example, lnnertc corresponds to an lnnercas temperature control mode, and OuterTC corresponds to a MixRatio0 temperature control mode. The temperature control logic in each temperature control mode is as follows: and calculating a temperature control power value corresponding to the temperature currently detected by the temperature sensor based on the target temperature value (the temperature value required to be reached by the furnace body temperature), wherein the temperature control power value is used as the heating power of the furnace body, so that the furnace body temperature is controlled at the target temperature value.
In specific application, after the temperature detection value of the target temperature control section in the current temperature control period is determined based on the first target temperature sensor corresponding to the target temperature control section, whether the first target temperature sensor is in a normal detection state is judged; if the first target temperature sensor is in a normal detection state, judging whether the target temperature control section meets a preset jump abnormity processing condition; if the target temperature control section meets the preset jump abnormity processing condition, which indicates that the jump abnormity detection and the jump abnormity processing of the temperature detection value are necessary, judging whether the temperature detection value of the target temperature control section in the current temperature control period is abnormal according to a preset abnormity judgment strategy; if the temperature detection value of the target temperature control section in the current temperature control period is abnormal, judging whether the abnormal continuous period of the temperature detection value is smaller than the preset period number (for example, 3 periods, other values can be adopted); if the abnormal continuous period of the temperature detection value is less than the preset period number, the abnormal condition of the temperature detection value is considered to belong to the jump type abnormality, and the temperature control power value corresponding to the temperature detection value of the target temperature control section in the previous temperature control period is calculated based on the temperature control mode (called as a first temperature control mode) corresponding to the first target temperature sensor, namely jump variation constant points are filtered out, so that the problem of jump of the temperature detection value is solved; if the abnormal continuous period of the temperature detection value is not less than the preset period number, the abnormal condition of the temperature detection value is considered not to belong to the jump type abnormality and to belong to the obvious abnormal condition, the temperature control power value corresponding to the temperature detection value of the target temperature control section in the current temperature control period is calculated based on the first temperature control mode, namely, the abnormal point is not filtered out, so that the judgment of the obvious abnormal condition of the temperature detection value is not influenced; if the temperature detection value of the target temperature control section in the current temperature control period is not abnormal, which indicates that the abnormal processing of the temperature detection value is not needed, the temperature control power value corresponding to the temperature detection value of the target temperature control section in the current temperature control period is calculated based on the first temperature control mode.
Step S5: and sending the calculated temperature control power value to a target power controller corresponding to the target temperature control section so that the target power controller controls the temperature of the target temperature control section based on the temperature control power value.
In a specific application, the temperature control power value corresponding to the target temperature control section calculated in each temperature control period is sent to a power controller (called a target power controller) corresponding to the target temperature control section, and the target power controller can perform temperature control on the target temperature control section based on the received temperature control power value, so that the temperature of the target temperature control section is stabilized at a target temperature value, and the temperature of the whole temperature control area of the semiconductor device is stabilized at the target temperature value.
According to the temperature control method, whether the abnormal condition of the temperature detection value belongs to the jump type abnormality or not can be distinguished according to the abnormal duration period of the temperature detection value of the temperature control section, namely when the abnormal duration period of the temperature detection value is smaller than the preset period number, the abnormal condition of the temperature detection value is considered to belong to the jump type abnormality; and when the abnormal continuous period of the temperature detection value is not less than the preset period number, the abnormal condition of the temperature detection value is considered not to belong to the jump type abnormality and to belong to the obvious abnormal condition. According to the method, the obvious abnormal condition of the temperature detection value is not processed, and only the jumping abnormal condition of the temperature detection value is processed, namely, the jumping variation constant is filtered, so that the problem of jumping of the temperature detection value in the process is solved, and the process result is prevented from being influenced by abnormal fluctuation of the temperature; on the other hand, the judgment of obvious abnormal conditions of the temperature detection value is not influenced.
On the basis of the above-described embodiment:
as an optional embodiment, the step S1 "determining the temperature detection value of the target temperature control section in the current temperature control cycle based on the first target temperature sensor corresponding to the target temperature control section" includes the following steps:
in each temperature control period, reading temperature sampling values of a first target temperature sensor every other preset first time period so as to read a preset number of temperature sampling values;
and calculating the average value of the preset number of temperature sampling values in the current temperature control period, and taking the average value as the temperature detection value of the target temperature control section in the current temperature control period.
In specific application, taking a target temperature control period (any temperature control period) as an example, when the target temperature control period is reached, the temperature sampling values of the first target temperature sensor are read, and after a first time period (such as 200 ms) is delayed, whether the number of the temperature sampling values of the first target temperature sensor read in the target temperature control period reaches a preset number (such as 10) is judged; if the preset number is not reached, returning to the step of reading the temperature sampling value of the first target temperature sensor; if the preset number is reached, calculating the average value of the temperature sampling values of the first target temperature sensors with the preset number in the target temperature control period, and taking the average value calculated at the stage as the temperature detection value of the target temperature control section in the target temperature control period.
As an alternative embodiment, before the first target temperature sensor is in the normal detection state, the temperature control method further includes:
reading decoupling alarm information corresponding to the first target temperature sensor;
judging whether the first target temperature sensor has a decoupling condition or not based on the decoupling alarm information;
and if the first target temperature sensor does not have the decoupling condition, judging that the first target temperature sensor is in a normal detection state.
In specific application, the logic for judging whether the first target temperature sensor is in a normal detection state is as follows: judging whether the first target temperature sensor has a decoupling condition or not based on decoupling alarm information corresponding to the first target temperature sensor; if the first target temperature sensor does not have the decoupling condition, judging that the first target temperature sensor is in a normal detection state; and if the first target temperature sensor has a decoupling condition, judging that the first target temperature sensor is not in a normal detection state.
As an optional embodiment, the step S2 of "determining whether the temperature detection value in the current temperature control cycle is abnormal according to a preset abnormality determination policy" includes the following steps:
obtaining the temperature detection value x of the target temperature control section in the nth temperature control period n And calculating the average value of the temperature detection values of the target temperature control section in the previous m temperature control periods
And the standard deviation sigma; wherein the first m temperature control periods are from the (n-m + 1) th temperature control period to the nth temperature control period, and m is a preset period threshold;
according to
Calculating a critical value G n (ii) a Wherein abs represents the absolute value;
finding out the parameter corresponding to the nth temperature control period in the pre-selected confidence interval from the preset Grubbs critical value tableExamining and determining a critical value G n Whether the standard deviation sigma is greater than a preset standard deviation threshold value or not; wherein, the preset Grubbs critical value table represents: corresponding relation between temperature control periodicity and reference critical value in different confidence intervals;
if the critical value G n If the standard deviation sigma is larger than the preset standard deviation threshold value, judging that the temperature detection value in the nth temperature control period is abnormal;
if the critical value G n And if the standard deviation sigma is not larger than the preset standard deviation threshold value, judging that the temperature detection value under the nth temperature control period has no abnormity.
In the embodiment of the present application, the preset grubbs critical value table is set in advance, and represents a corresponding relationship between the temperature control cycle number and the reference critical value in different confidence intervals, as shown in table 1 below:
TABLE 1
In specific application, the preset abnormality determination logic of the abnormality determination strategy is as follows (taking a target temperature control zone as an example): 1) Obtaining the temperature detection value x of the target temperature control section in the nth temperature control period n And calculating the average value of the temperature detection values of the target temperature control section in the previous m temperature control periods
And the standard deviation sigma of the temperature detection values of the target temperature control section in the previous m temperature control periods (the previous m temperature control periods refer to the (n-m + 1) th to the nth temperature control periods, if m is 5, the previous m temperature control periods are the 2 nd to the 6 th temperature control periods in the 6 th temperature control period); 2) According to a preset Grubbs calculation formula
Calculating the critical value G corresponding to the nth temperature control period of the target temperature control section n And finding out a reference critical value GR corresponding to the nth temperature control period under a preselected confidence interval from a preset Grubbs critical value table n (As shown in Table 1, above, if the preselected confidence interval is 99.00%, then at the 6 th temperature control cycle, the reference threshold GR is determined 6 = 1.944); 3) Determining the critical value G corresponding to the nth temperature control period n Whether greater than a reference threshold value GR n (ii) a If not greater than the reference threshold value G ns Judging that the temperature detection value of the target temperature control section in the nth temperature control period is not abnormal; if it is greater than the reference threshold value GR n Judging whether the standard deviation sigma of the temperature detection values of the target temperature control section in the previous m temperature control periods is larger than a preset standard deviation threshold (based on the variation trend of the temperature detection values in the temperature control process, the standard deviation threshold is 4, the purpose of screening abnormal temperature detection values by the aid of the Grubbs method can be realized, other values can be selected according to the data characteristics of the temperature detection values in the temperature control process), and if the standard deviation sigma is not larger than the preset standard deviation threshold, judging that the temperature detection values of the target temperature control section in the nth temperature control period are not abnormal; if the temperature is larger than the preset standard deviation threshold value, the temperature detection value of the target temperature control section in the nth temperature control period is judged to be abnormal.
It can be seen that the preset anomaly determination strategy includes two anomaly determination conditions, namely, the grubbs method and the standard deviation method, because: in the experimental process, it is found that although the grubbs method can effectively detect the abnormal value, the grubbs method has a condition that the normal value is determined as the abnormal value, as shown in the last column of data in the following table 2, a condition that the normal value is misjudged exists (the table 2 gives temperature detection data of a certain temperature control section under 7 groups of 5 temperature control periods, 3 groups of data have abnormality in the 5 th temperature control period, and the rest 4 groups of data have no abnormality in the 5 temperature control periods), and the table 2 simultaneously gives an average value of temperature detection values of the temperature control section under the previous m temperature control periods (where m is 5, which means from the 1 st temperature control period to the 5 th temperature control period)
And standard deviation sigma, and reference critical value GR corresponding to the 5 th temperature control period 5 =1.75, according to a predetermined grubbs calculation formula
Calculating the threshold value G corresponding to the last column of data in the following Table 2 5 =2, if the temperature detection value in the 5 th temperature control period is abnormal only according to the grubbs method, because of the critical value G 5 Greater than a reference threshold value GR 5 Therefore, the judgment conclusion is that the temperature detection value in the 5 th temperature control cycle is abnormal, but the actual situation is that the temperature detection value in the 5 th temperature control cycle is not abnormal, namely, the grubbs method misjudges the normal value, in order to avoid the situation that the grubbs method misjudges the normal value, the judgment of the standard deviation is added when the abnormal value is judged, the standard deviation corresponding to the normal data is found to be very small in the experimental process, and therefore, after the grubbs method judges the abnormal value, the step of judging whether the standard deviation is larger than the preset standard deviation threshold value is added, so that the obtained abnormal value is more reliable through judgment (for example, the preset standard deviation threshold value is 4, the standard deviation corresponding to the last column of data in the following table 2 is 0.08, and as the standard deviation is smaller than the preset standard deviation threshold value, the judgment conclusion combining the grubbs method and the standard deviation method is that the temperature detection value in the 5 th temperature control cycle is not abnormal and meets the actual situation), namely, the method combining the grubbs method and the standard deviation method for judging the abnormal value can be used for avoiding the situation that the abnormal temperature detection value is misjudged by the single grubbs method.
TABLE 2
As an alternative embodiment, the temperature control method further comprises the following steps:
when the abnormal continuous period is less than the preset period number, performing abnormal recording;
and when the abnormal continuous period is not less than the preset period number, performing abnormal alarm.
In specific application, when the abnormal duration period of the temperature detection value corresponding to the target temperature control section is smaller than the preset cycle number, relevant abnormal records are carried out, for example, the abnormal value of the temperature detection value is recorded, and the abnormal duration period of the temperature detection value is recorded.
When the abnormal continuous period of the temperature detection value corresponding to the target temperature control section is not less than the preset period number, the related abnormal alarm is thrown out to remind an operator of a machine station to perform related abnormal processing.
As an optional embodiment, before the target temperature control section meets the preset condition for processing abnormal jump, the temperature control method further includes the following steps:
judging whether the current temperature control period of the target temperature control section belongs to the first m temperature control periods when the temperature of the target temperature control section is just started, and whether abnormal alarm exists in the target temperature control section within a preset second time period; wherein m is a preset period threshold;
and if the current temperature control period does not belong to the first m temperature control periods of the temperature control at the beginning and the target temperature control section has no abnormal alarm in the preset second time period, judging that the target temperature control section meets the preset jump abnormal processing condition.
In specific application, the logic for judging whether the target temperature control section meets the preset jump abnormity processing condition is as follows: judging whether the current temperature control period of the target temperature control section belongs to the first m temperature control periods of the target temperature control section, wherein the temperature control periods are consistent with the values of the first m temperature control periods in the 'average value and standard deviation of the temperature detection values of the target temperature control section under the first m temperature control periods'); if the current temperature control period belongs to the first m temperature control periods when the temperature control of the target temperature control section is just started, the temperature control program is just started, historical data does not exist, the initial parameters are all 0, the jump abnormity judgment is meaningless, and the jump abnormity processing is not carried out, so that the target temperature control section is judged not to meet the preset jump abnormity processing conditions; if the temperature control section does not belong to the first m temperature control periods of the target temperature control section in which temperature control is just started, judging whether an abnormal alarm exists in the target temperature control section within a preset second time period (such as 1 min) or not; if the abnormal alarm exists, judging that the target temperature control section does not meet the preset jump abnormity processing condition; and if the abnormal alarm does not exist, judging that the target temperature control section meets the preset jump abnormal processing condition.
As an alternative embodiment, the temperature control method further comprises the following steps:
and when the first target temperature sensor is in a normal detection state and the target temperature control section does not meet the preset jump abnormity processing condition, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode, and taking the calculated temperature control power value as the temperature control power value sent to the target power controller in the current temperature control period.
In specific application, after a temperature detection value of a target temperature control section in a current temperature control period is determined based on a first target temperature sensor corresponding to the target temperature control section, whether the first target temperature sensor is in a normal detection state is judged, and if the first target temperature sensor is in the normal detection state (the first target temperature sensor does not have a decoupling condition), whether the target temperature control section meets a preset jump abnormity processing condition is judged; and if the target temperature control section does not meet the preset jump abnormity processing condition (the current temperature control period of the target temperature control section belongs to the first m temperature control periods of the temperature control at the beginning, and/or an abnormity alarm exists in the target temperature control section in a preset second time period), calculating the temperature control power value corresponding to the temperature detection value of the target temperature control section in the current temperature control period based on the first temperature control mode.
As an optional embodiment, each temperature control section is further provided with a second temperature sensor correspondingly;
the temperature control method further comprises the following steps:
when the first target temperature sensor is not in a normal detection state, determining an actual temperature value of the target temperature control section in a current temperature control period based on a second target temperature sensor corresponding to the target temperature control section, calculating a temperature control power value corresponding to the actual temperature value in the current temperature control period based on a second temperature control mode corresponding to the second target temperature sensor, and sending the calculated temperature control power value to a target power controller as a temperature control power value in the current temperature control period.
In this embodiment, each temperature control section of the semiconductor device is further provided with a second temperature sensor (e.g., outerTC) correspondingly, and the second target temperature sensor is a second temperature sensor correspondingly provided for the target temperature control section.
In specific application, after determining a temperature detection value of a target temperature control section in a current temperature control period based on a first target temperature sensor corresponding to the target temperature control section, the method determines whether the first target temperature sensor is in a normal detection state, determines an actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor if the first target temperature sensor is not in the normal detection state (the first target temperature sensor has a decoupling condition), and calculates a temperature control power value corresponding to the actual temperature value of the target temperature control section in the current temperature control period based on a temperature control mode (referred to as a second temperature control mode) corresponding to the second target temperature sensor.
As an alternative embodiment, each of the second temperature sensors includes a primary temperature sensor and a backup temperature sensor;
determining the actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor corresponding to the target temperature control section, comprising the following steps:
judging whether a main temperature sensor in the second target temperature sensor is in a normal detection state or not;
if yes, determining an actual temperature value of the target temperature control section in the current temperature control period based on a main temperature sensor in the second target temperature sensor;
if not, determining the actual temperature value of the target temperature control section in the current temperature control period based on the standby temperature sensor in the second target temperature sensor.
In the embodiment of the application, each second temperature sensor comprises a main temperature sensor and a standby temperature sensor, when the second temperature sensor is used, the main temperature sensor is preferentially used, and when the main temperature sensor is abnormal, the standby temperature sensor is reused.
Based on the temperature control method, the temperature control process of the present application is specifically (refer to fig. 3):
1) Reading a temperature sampling value of a first target temperature sensor in the temperature control period;
2) Delaying for 200ms;
3) Judging whether to circulate for 10 times; if yes, executing step 4); if not, returning to execute the step 1);
4) Calculating the average value of the temperature sampling values read for 10 times;
5) Taking the calculated average value as a temperature detection value of the target temperature control section in the temperature control period;
6) Reading decoupling alarm information corresponding to the first target temperature sensor;
7) Judging whether the first target temperature sensor has decoupling; if not, executing step 8); if yes, go to step 18);
8) Judging whether the temperature is in the first m temperature control periods when the temperature is just started; if not, executing step 9); if yes, executing step 17);
9) Judging whether an abnormal alarm exists in the target temperature control section within 1min or not; if not, executing step 10); if yes, executing step 17);
10 Computing average value of temperature detection values of target temperature control section in previous m temperature control periods
And the standard deviation sigma;
11 Judgment of
Whether greater than the reference threshold value GR n (ii) a If yes, executing step 12); if not, executing step 17);
12 Judging whether the standard deviation sigma is larger than 4; if yes, executing step 13); if not, executing step 17);
13 Determine x) n If the abnormal condition exists, judging whether the abnormal continuous period is less than 3 periods; if yes, executing step 14); if not, executing step 16);
14 Performing exception recording;
15 The temperature detection value of the target temperature control section in the previous temperature control period is used as the temperature value used for calculating the temperature control power value;
16 Carry on the abnormal alarm;
17 The temperature detection value of the target temperature control section in the temperature control period is used as the temperature value used for calculating the temperature control power value;
18 Determining an actual temperature value of the target temperature control section in the temperature control period according to the second target temperature sensor, and taking the actual temperature value as a temperature value used for calculating a temperature control power value;
19 Calculating the temperature control power value according to the corresponding temperature control mode;
20 The calculated temperature control power value is sent to the target power controller so that the target power controller performs temperature control on the target temperature control section.
The present application also provides a semiconductor device including:
a furnace body; the temperature control area of the furnace body is divided into a plurality of temperature control sections, and each temperature control section is correspondingly provided with a first temperature sensor and a power controller;
and the temperature controller is used for controlling the temperature of the temperature control area by adopting any one of the temperature control methods.
For the introduction of the semiconductor device provided in the present application, please refer to the above embodiments of the temperature control method, which is not described herein again.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and are merely descriptive of the manner in which objects of the same nature are distinguished in the embodiments of the application. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above-described embodiments of the apparatus are merely illustrative, and units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. Based on the understanding, the above technical solutions substantially or otherwise contributing to the prior art may be embodied in the form of a software product, which may be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method of various embodiments or some parts of embodiments.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A temperature control method is applied to semiconductor equipment, a temperature control area of the semiconductor equipment is divided into a plurality of temperature control sections, each temperature control section is correspondingly provided with a first temperature sensor and a power controller, and the temperature control method comprises the following steps:
determining a temperature detection value of a target temperature control section in a current temperature control period based on a first target temperature sensor corresponding to the target temperature control section; wherein the target temperature control section is any one of the temperature control sections;
when the first target temperature sensor is in a normal detection state and the target temperature control section meets a preset jump abnormity processing condition, judging whether the temperature detection value in the current temperature control period is abnormal according to a preset abnormity judgment strategy;
if so, calculating a temperature control power value corresponding to the temperature detection value in a previous temperature control period based on a first temperature control mode corresponding to the first target temperature sensor when the abnormal continuous period of the temperature detection value is smaller than a preset period number; when the abnormal continuous period is not less than the preset period number, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode;
if not, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode;
and sending the calculated temperature control power value to a target power controller corresponding to the target temperature control section so that the target power controller controls the temperature of the target temperature control section based on the temperature control power value.
2. The method according to claim 1, wherein the determining the temperature detection value of the target temperature control section in the current temperature control cycle based on the first target temperature sensor corresponding to the target temperature control section comprises:
in each temperature control cycle, reading temperature sampling values of the first target temperature sensor every other preset first time period so as to read a preset number of temperature sampling values;
and calculating the average value of the preset number of temperature sampling values in the current temperature control period, and taking the average value as the temperature detection value of the target temperature control section in the current temperature control period.
3. The temperature control method according to claim 1, wherein before the first target temperature sensor is in a normal detection state, the temperature control method further comprises:
reading decoupling alarm information corresponding to the first target temperature sensor;
judging whether the first target temperature sensor has a decoupling condition or not based on the decoupling alarm information;
and if the first target temperature sensor does not have the decoupling condition, judging that the first target temperature sensor is in a normal detection state.
4. The method according to claim 1, wherein the determining whether the temperature detection value in the current temperature control cycle is abnormal according to a preset abnormality determination strategy comprises:
obtaining the temperature detection value x of the target temperature control section in the nth temperature control period n And calculating the average value of the temperature detection values of the target temperature control section in the previous m temperature control periods
And the standard deviation sigma; wherein the previous m temperature control cycles are from the (n-m + 1) th temperature control cycle to the nth temperature control cycle, and m is a preset cycle threshold;
according to the temperature detection value x n The average value
And calculating a critical value of the standard deviation sigma;
finding a reference critical value corresponding to the nth temperature control period under a preselected confidence interval from a preset Grubbs critical value table, and judging whether the critical value is greater than the reference critical value and whether the standard deviation is greater than a preset standard deviation threshold value; wherein the preset grubbs critical value table represents: corresponding relation between temperature control periodicity and reference critical value in different confidence intervals;
if the critical value is larger than the reference critical value and the standard deviation is larger than the preset standard deviation threshold value, judging that the temperature detection value under the nth temperature control period is abnormal;
and if the critical value is not larger than the reference critical value and/or the standard deviation is not larger than the preset standard deviation threshold value, judging that the temperature detection value under the nth temperature control period is not abnormal.
5. The temperature control method of claim 1, further comprising:
when the abnormal continuous period is smaller than the preset period number, performing abnormal recording;
and when the abnormal continuous period is not less than the preset period number, performing abnormal alarm.
6. The temperature control method according to claim 5, wherein before the target temperature controlled section satisfies a preset transition exception handling condition, the temperature control method further comprises:
judging whether the current temperature control period of the target temperature control section belongs to the first m temperature control periods when the temperature of the target temperature control section is just started, and whether an abnormal alarm exists in the target temperature control section within a preset second time period; wherein m is a preset period threshold;
and if the current temperature control period does not belong to the first m temperature control periods of the temperature control at the beginning and the target temperature control section has no abnormal alarm in a preset second time period, judging that the target temperature control section meets a preset jump abnormity processing condition.
7. The temperature control method of claim 1, further comprising:
and when the first target temperature sensor is in a normal detection state and the target temperature control section does not meet a preset jump abnormity processing condition, calculating a temperature control power value corresponding to the temperature detection value in the current temperature control period based on the first temperature control mode, and taking the calculated temperature control power value as the temperature control power value sent to the target power controller in the current temperature control period.
8. The method according to any one of claims 1 to 7, wherein each of said temperature control sections is further provided with a second temperature sensor;
the temperature control method further includes:
when the first target temperature sensor is not in a normal detection state, determining the actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor corresponding to the target temperature control section, and calculating the temperature control power value corresponding to the actual temperature value in the current temperature control period based on a second temperature control mode corresponding to the second target temperature sensor so as to take the calculated temperature control power value as the temperature control power value sent to the target power controller in the current temperature control period.
9. The temperature control method of claim 8, wherein each of the second temperature sensors comprises a primary temperature sensor and a backup temperature sensor;
the determining an actual temperature value of the target temperature control section in the current temperature control period based on a second target temperature sensor corresponding to the target temperature control section includes:
judging whether a main temperature sensor in the second target temperature sensor is in a normal detection state or not;
if yes, determining an actual temperature value of the target temperature control section in the current temperature control period based on a main temperature sensor in the second target temperature sensor;
if not, determining the actual temperature value of the target temperature control section in the current temperature control period based on the standby temperature sensor in the second target temperature sensor.
10. A semiconductor device, comprising:
a furnace body; the temperature control area of the furnace body is divided into a plurality of temperature control sections, and each temperature control section is correspondingly provided with a first temperature sensor and a power controller;
a temperature controller for temperature-controlling the temperature-controlled region using the temperature control method according to any one of claims 1 to 9.
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| CN202211060301.4A CN115235257A (en) | 2022-08-31 | 2022-08-31 | Temperature control method and semiconductor device |
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| CN202211060301.4A CN115235257A (en) | 2022-08-31 | 2022-08-31 | Temperature control method and semiconductor device |
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