CN115233269A - Tank body for metal anodic oxidation and electroplating - Google Patents

Tank body for metal anodic oxidation and electroplating Download PDF

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Publication number
CN115233269A
CN115233269A CN202210853377.6A CN202210853377A CN115233269A CN 115233269 A CN115233269 A CN 115233269A CN 202210853377 A CN202210853377 A CN 202210853377A CN 115233269 A CN115233269 A CN 115233269A
Authority
CN
China
Prior art keywords
metal
panel
polar plate
plate
anodic oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210853377.6A
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Chinese (zh)
Inventor
陈建
王雪深
李劲劲
王振宇
徐骁龙
李万
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Metrology
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National Institute of Metrology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Metrology filed Critical National Institute of Metrology
Priority to CN202210853377.6A priority Critical patent/CN115233269A/en
Publication of CN115233269A publication Critical patent/CN115233269A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/26—Anodisation of refractory metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a tank body for metal anodic oxidation and electroplating, which comprises an accommodating cavity with an upward opening, wherein a first polar plate and a second polar plate are vertically arranged in the accommodating cavity, and the first polar plate and the second polar plate are connected with the positive pole and the negative pole of a power supply; when the metal plate in the first polar plate is connected with the negative pole of the power supply and the metal conducting strip in the second polar plate is connected with the positive pole of the power supply, the tank body is used for metal anodic oxidation; when the metal plate in the first polar plate is connected with the anode of the power supply and the metal conducting strip in the second polar plate is connected with the cathode of the power supply, the groove body is used for electroplating metal. The application provides a cell body that can be used to metal anodic oxidation and also can be used to electroplate, and this cell body is applicable to the 2-8 inch surface metal and treats the wafer of oxidation or electroplating metal, and its metal film performance is even stable, and repeatability is good.

Description

Tank body for metal anodic oxidation and electroplating
Technical Field
The invention belongs to the technical field of electrochemistry, and particularly relates to a tank body for metal anodic oxidation and electroplating.
Background
Anodic oxidation is a process of forming an oxide film on the surface (anode) of a metal or an alloy under the action of an external current under corresponding electrolyte and specific process conditions. The metal oxide film changes the surface state and properties, such as surface coloring, corrosion resistance improvement, wear resistance and hardness enhancement, metal surface protection and the like.
Electroplating is a surface processing method in which cations of a metal to be plated in a plating solution are deposited on the surface of a base metal by electrolysis using the base metal to be plated as a cathode in a salt solution containing the metal to be plated, thereby forming a plating layer. The plating performance is different from that of the base metal, and has new characteristics. Electroplating is an electrochemical process, and the basic process of electroplating is to immerse a substrate in a solution of metal salt as a cathode and a metal plate as an anode, and to connect a power supply, and then to deposit a required coating on the part.
At present, a plurality of tanks are separately used for anodic oxidation or electroplating, but no tank which can be used for anodic oxidation and electroplating at a wafer level exists.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a tank body for metal anodic oxidation and electroplating.
In order to achieve the purpose of the invention, the invention adopts the technical scheme that:
the groove body comprises an accommodating cavity with an upward opening, a first polar plate and a second polar plate are vertically arranged in the accommodating cavity, the first polar plate and the second polar plate are arranged oppositely, and the first polar plate and the second polar plate are connected with the positive pole and the negative pole of a power supply;
the first polar plate comprises a first panel and a second panel which are connected, a vertical sliding groove is formed in the first panel, a metal plate is arranged in the sliding groove, the upper end of the metal plate extends out of the sliding groove, and a first opening is formed in the second panel to expose part of the metal plate;
the second polar plate comprises a third panel and a fourth panel which are connected, the third panel is provided with a second opening and a metal conducting plate matched with the second opening, the upper end of the metal conducting plate extends out of the third panel, the fourth panel is internally provided with a groove, and a 2-8 inch wafer to be oxidized or metal-plated can be placed in the groove; the fourth panel is provided with a holding tank matched with the metal conducting strip, and the holding tank is communicated with the groove.
When the metal plate in the first polar plate is connected with the negative pole of the power supply and the metal conducting strip in the second polar plate is connected with the positive pole of the power supply, the tank body is used for metal anodic oxidation;
when the metal plate in the first polar plate is connected with the anode of the power supply and the metal conducting strip in the second polar plate is connected with the cathode of the power supply, the groove body is used for electroplating metal.
Further: the metal plate in the first polar plate is titanium platinum gold or other titanium alloy, the metal conducting strip in the second polar plate is titanium metal with gold-plated surface or other metal with good conductivity, and the metal plate and the metal conducting strip are both connected with the anode and the cathode of the power supply through a clamp and a power line.
Further: the first panel and the second panel, the third panel and the fourth panel are connected through screws.
Further: two groups of slots are vertically arranged on the inner side wall of the groove body, and a first polar plate and a second polar plate are respectively arranged in the two groups of slots.
Further: the tank body is made of an acrylic glass plate.
Further: the wafer is a wafer with 2-8 inches of surface metal to be oxidized or electroplated.
Further: when the tank body is used for metal anodic oxidation, metals capable of carrying out anodic oxidation comprise Al, nb, ti and the like.
Further: when the tank body is used for electroplating metal, the metal capable of being electroplated comprises Au, bi, cu and the like.
The invention has the beneficial effects that:
the application provides a cell body which can be used for metal anodic oxidation and electroplating, the cell body is suitable for a wafer with metal to be oxidized or electroplated on the surface of 2-8 inches, and the metal film has uniform and stable performance and good repeatability.
Drawings
Fig. 1 is a schematic view of an overall structure of a tank provided in an embodiment of the present invention;
fig. 2 is a schematic structural view of a first polar plate of a tank provided in embodiment 1 of the present invention;
fig. 3 is a schematic diagram of a second plate structure of a tank provided in embodiment 1 of the present invention;
fig. 4 is a schematic structural view of a first plate of a tank provided in embodiment 2 of the present invention;
fig. 5 is a schematic diagram of a second plate structure of a tank provided in embodiment 2 of the present invention.
Wherein: 1. an accommodating cavity; 2. a first electrode plate; 3. a second polar plate; 4. a first panel; 5. a second panel; 6. a metal plate; 7. a first opening; 8. a third panel; 9. a fourth panel; 10. a second opening; 11. a metal conductive sheet; 12. a groove; 13. accommodating grooves; 14. a chute; 15. and (4) a slot.
Detailed Description
The following description of the embodiments of the present invention is provided to facilitate the understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and it will be apparent to those skilled in the art that various changes may be made without departing from the spirit and scope of the invention as defined and defined by the appended claims, and all changes that can be made by the invention using the inventive concept are intended to be protected.
Example 1
The utility model provides a cell body for metal anodic oxidation and electroplating, includes that the opening holds cavity 1 upwards, in this embodiment, holds cavity 1 and is the square cell body that acrylic glass board made. The vertical two sets of slots 15 that are equipped with of accommodation cavity 1 inside wall is equipped with first polar plate 2 and second polar plate 3 in two sets of slots 15 respectively, and first polar plate 2 and second polar plate 3 set up relatively, and first polar plate 2 and second polar plate 3 all pass through anchor clamps and power cord connection power's positive pole or negative pole.
Specifically speaking, first polar plate 2 includes first panel 4 and second panel 5, is equipped with vertical spout 14 on the first panel 4, is equipped with metal sheet 6 in the spout 14, and spout 14 is stretched out to the upper end of metal sheet 6, and first panel 4 and second panel 5 pass through the screw and link to each other, are equipped with first opening 7 on the second panel 5, expose partial metal sheet 6, and in this embodiment, first opening 7 is square.
The second polar plate 3 comprises a third panel 8 and a fourth panel 9, the third panel 8 is provided with a second opening 10 and a metal conducting plate 11 matched with the second opening 10, the upper end of the metal conducting plate 11 extends out of the third panel 8, a groove 12 is formed in the fourth panel 9, and a wafer is arranged in the groove 12, preferably, the wafer is a wafer with 2-8 inches of surface metal to be oxidized or electroplated. Third panel 8 and fourth panel 9 pass through the screw and link to each other, and set up on the fourth panel 9 with 11 assorted holding tanks 13 of metal conducting strip, holding tanks 13 and recess 12 intercommunication. In the present embodiment, the second opening 10 is square, and correspondingly, the lower end of the metal conductive sheet 11 is square.
When the metal plate 6 in the first polar plate 2 is connected with the negative pole of a power supply and the metal conducting strip 11 in the second polar plate 3 is connected with the positive pole of the power supply, a wafer to be oxidized is placed in the groove 12 of the fourth polar plate 9, and the groove body can be used for metal anodic oxidation; solution is prepared in the tank body 1, and the anode oxidation can be carried out by inputting set current through a power supply control system. Metals that can be anodized include Al, nb, ti, and the like.
When the metal plate 6 in the first polar plate 2 is connected with the positive pole of a power supply and the metal conducting strip 11 in the second polar plate 3 is connected with the negative pole of the power supply, a wafer of metal to be electroplated is placed in the groove 12 of the fourth polar plate 9, and the groove body can be used for electroplating metal. Electroplating solution is prepared in the tank body 1, and the set current is input through a power supply control system to carry out metal electroplating. Platable metals include Au, bi, cu, and the like.
Example 2
In the present embodiment, the first opening 7 and the second opening 10 are both circular, and correspondingly, the lower end of the metal conductive sheet 11 is circular. The other structures are the same as those of embodiment 1.
The application provides a cell body that can be used to metal anodic oxidation and also can be used to electroplate, and this cell body is applicable to the 2-8 inch surface metal and treats the wafer of oxidation or electroplating metal, and its metal film performance is even stable, and repeatability is good.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (8)

1. A cell body for metal anodic oxidation and electroplating is characterized in that: the lithium battery cell comprises a containing cavity (1) with an upward opening, wherein a first polar plate (2) and a second polar plate (3) are vertically arranged in the containing cavity (1), and the first polar plate (2) and the second polar plate (3) are connected with the anode and the cathode of a power supply;
the first polar plate (2) comprises a first panel (4) and a second panel (5) which are connected, a vertical sliding groove (14) is formed in the first panel (4), a metal plate (6) is arranged in the sliding groove (14), the upper end of the metal plate (6) extends out of the sliding groove (14), a first opening (7) is formed in the second panel (5), and part of the metal plate (6) is exposed;
the second pole plate (3) comprises a third panel (8) and a fourth panel (9) which are connected, a second opening (10) and a metal conducting strip (11) matched with the second opening (10) are arranged on the third panel (8), the upper end of the metal conducting strip (11) extends out of the third panel (8), a groove (12) is formed in the fourth panel (9), and a wafer to be oxidized or plated with metal is arranged in the groove (12); an accommodating groove (13) matched with the metal conducting sheet (11) is formed in the fourth panel (9), and the accommodating groove (13) is communicated with the groove (12);
when the metal plate (6) in the first polar plate (2) is connected with the negative pole of a power supply and the metal conducting strip (11) in the second polar plate (3) is connected with the positive pole of the power supply, the groove body is used for metal anodic oxidation;
when the metal plate (6) in the first polar plate (2) is connected with the positive pole of a power supply and the metal conducting strip (11) in the second polar plate (3) is connected with the negative pole of the power supply, the groove body is used for electroplating metal.
2. The cell body for metal anodic oxidation and electroplating according to claim 1, characterized in that: the metal plate (6) is made of titanium platinum, the metal conducting strip (11) is made of titanium with gold plated on the surface, and the metal plate (6) and the metal conducting strip (11) are both connected with the anode and the cathode of a power supply through a clamp and a power line.
3. The tank body for metal anodic oxidation and electroplating according to claim 1, characterized in that: the first panel (4), the second panel (5), the third panel (8) and the fourth panel (9) are all connected through screws.
4. The tank body for metal anodic oxidation and electroplating according to claim 1, characterized in that: the cell body (1) inside wall is vertical to be equipped with two sets of slots (15), is equipped with first polar plate (2) and second polar plate (3) in two sets of slots (15) respectively.
5. The tank body for metal anodic oxidation and electroplating according to claim 1, characterized in that: the tank body (1) is made of an acrylic glass plate.
6. The tank body for metal anodic oxidation and electroplating according to claim 1, characterized in that: the wafer is a wafer with 2-8 inches of surface metal to be oxidized or electroplated.
7. The cell body for metal anodic oxidation and electroplating according to claim 1, characterized in that: when the tank body is used for metal anodic oxidation, metals for anodic oxidation comprise Al, nb and Ti.
8. The tank body for metal anodic oxidation and electroplating according to claim 1, characterized in that: when the tank body is used for electroplating metal, the metal for electroplating comprises Au, bi and Cu.
CN202210853377.6A 2022-07-08 2022-07-08 Tank body for metal anodic oxidation and electroplating Pending CN115233269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210853377.6A CN115233269A (en) 2022-07-08 2022-07-08 Tank body for metal anodic oxidation and electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210853377.6A CN115233269A (en) 2022-07-08 2022-07-08 Tank body for metal anodic oxidation and electroplating

Publications (1)

Publication Number Publication Date
CN115233269A true CN115233269A (en) 2022-10-25

Family

ID=83672903

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210853377.6A Pending CN115233269A (en) 2022-07-08 2022-07-08 Tank body for metal anodic oxidation and electroplating

Country Status (1)

Country Link
CN (1) CN115233269A (en)

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