CN115232494A - Graphene inorganic high-thermal-conductivity heat dissipation coating and preparation method and application thereof - Google Patents
Graphene inorganic high-thermal-conductivity heat dissipation coating and preparation method and application thereof Download PDFInfo
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- CN115232494A CN115232494A CN202211053690.8A CN202211053690A CN115232494A CN 115232494 A CN115232494 A CN 115232494A CN 202211053690 A CN202211053690 A CN 202211053690A CN 115232494 A CN115232494 A CN 115232494A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 91
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 58
- 239000011248 coating agent Substances 0.000 title claims abstract description 54
- 238000000576 coating method Methods 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000002002 slurry Substances 0.000 claims abstract description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000007822 coupling agent Substances 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 238000000053 physical method Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 7
- 238000011084 recovery Methods 0.000 abstract description 7
- 238000004134 energy conservation Methods 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 5
- 238000005054 agglomeration Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
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Abstract
The invention belongs to the technical field of high-thermal-conductivity heat dissipation materials, and provides a graphene inorganic high-thermal-conductivity heat dissipation coating which comprises the following raw materials in parts by mass: 4-6 parts of graphene powder and 94-96 parts of simple substance silicon system inorganic slurry; the raw materials for preparing the elemental silicon system inorganic slurry comprise nanoscale elemental silicon, alcohol, a coupling agent and water. The invention also provides a preparation method and application of the graphene inorganic high-thermal-conductivity heat dissipation coating. The graphene inorganic high-heat-conductivity heat-dissipation coating aluminum plate system is high in heat exchange efficiency, the heat conduction coefficient is improved, the recovery life of a condenser is obviously shortened, the equipment stability is improved, and energy conservation and emission reduction are realized. Inorganic high heat conduction heat dissipation coating aluminum plate system of graphite alkeneThe heat exchange efficiency of the system is improved by 14-21% compared with that of the original energy-saving system, and the heat conduction coefficient of the graphene inorganic high-heat-conduction heat-dissipation coating aluminum plate system is 2.15-2.3 multiplied by 10 5 W/m 2 K, twice as much as the original energy saving system.
Description
Technical Field
The invention relates to the technical field of high-thermal-conductivity heat dissipation materials, in particular to a graphene inorganic high-thermal-conductivity heat dissipation coating and a preparation method and application thereof.
Background
At present, with the miniaturization, microminiaturization and continuous development of integration technologies of electronic components, the electronic components still can work normally with high reliability at the use environment temperature, the timely heat dissipation capability becomes an important limiting factor influencing the service life of the electronic components, and the heat conduction materials are required to have high enough heat conduction performance. The common heat-conducting and heat-dissipating coating mainly uses a high polymer material as a film-forming substance, is matched with a high-heat-conductivity filler, and comprises a traditional metal filler and some non-metal fillers with higher heat conductivity coefficients to strengthen the heat conductivity of the coating so as to achieve the purpose of cooling and dissipating heat. However, the heat dissipation materials such as copper foil and aluminum foil are expensive, and the heat dissipation effect cannot meet the requirement of the existing electronic products for heat conduction and heat dissipation.
Graphene is an atomic thick sp2 hybridized carbon layer, is tightly packed into a two-dimensional honeycomb structure, and is a two-dimensional material. The graphene has unique carrier characteristics, and the electron mobility is up to 200000cm under the room temperature condition 2 V.S; experimental research shows that the single-layer graphene can have the high thermal conductivity of 5300W/m.K at room temperature, and meanwhile, the graphene has a large specific surface area, can be fully filled in a base material, increases the heat dissipation surface area of the base material, and has great development potential and high research value in the field of heat conduction and heat dissipation. However, due to the strong interaction forces between graphene lamellae, graphene is highly susceptible to agglomeration, and this agglomeration is irreversible and must be re-dispersed by strong external forces. Along with the agglomeration of graphene, the heat conduction and heat dissipation performance of the graphene heat dissipation coating is also reduced. The method for dispersing graphene generally uses a solvent with good graphene dispersibility, such as N-methylpyrrolidone and N, N-dimethylformamide, but the solvent has a very slow volatilization speed and a small application range.
Therefore, the research on the graphene inorganic high-heat-conductivity heat-dissipation coating which is capable of preventing graphene from agglomerating, has an excellent heat-conduction heat-dissipation effect and prolongs the service life of heat exchange equipment has important value and significance.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a graphene inorganic high-thermal-conductivity heat dissipation coating as well as a preparation method and application thereof.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a graphene inorganic high-thermal-conductivity heat-dissipation coating which comprises the following raw materials in parts by mass:
4-6 parts of graphene powder and 94-96 parts of simple substance silicon system inorganic slurry;
the raw materials for preparing the elemental silicon system inorganic slurry comprise nanoscale elemental silicon, alcohol, a coupling agent and water.
Preferably, the particle size of the graphene powder is 6-80 μm, and the graphene powder is obtained by stripping graphene by a physical method.
Preferably, the purity of the graphene powder is more than or equal to 99.5 percent, and the oxygen content is less than or equal to 1ppm.
Preferably, the mass ratio of the nanoscale simple substance silicon to the alcohol to the coupling agent to the water is 83-88: 4 to 8:0.3 to 0.8:6 to 10.
Preferably, the coupling agent is a silane coupling agent.
Preferably, the particle size of the graphene inorganic high-thermal-conductivity heat dissipation coating is 1-5 μm.
The invention also provides a preparation method of the graphene inorganic high-thermal-conductivity heat dissipation coating, which comprises the following steps:
and mixing and grinding the graphene powder and the elemental silicon system inorganic slurry to obtain the graphene inorganic high-thermal-conductivity heat-dissipation coating.
The invention also provides application of the graphene inorganic high-thermal-conductivity heat dissipation coating in heat exchange equipment.
Preferably, the thickness of the graphene inorganic high-thermal-conductivity heat dissipation coating applied on the heat exchange equipment is 8-12 microns.
The beneficial effects of the invention include:
the graphene inorganic high-heat-conductivity heat dissipation coating disclosed by the invention has the advantages that the components are reasonably selected, the component proportion and the particle size are controlled, the graphene agglomeration can be effectively prevented, the heat exchange efficiency of the graphene inorganic high-heat-conductivity heat dissipation coating aluminum plate system is high, the heat conduction coefficient is improved, the recovery life of a condensing machine is obviously shortened, the stability of heat exchange equipment is improved, the service life of the equipment is prolonged, and the energy conservation and emission reduction are realized. The heat exchange efficiency of the graphene inorganic high-heat-conductivity heat-dissipation coating aluminum plate system is improved by 14-21% compared with that of the original energy-saving system, and the heat conduction coefficient of the graphene inorganic high-heat-conductivity heat-dissipation coating aluminum plate system is 2.15-2.3 multiplied by 10 5 W/m 2 K is the original energy saving systemTwice as much as the system.
Detailed Description
The invention provides a graphene inorganic high-thermal-conductivity heat-dissipation coating which comprises the following raw materials in parts by mass:
4-6 parts of graphene powder and 94-96 parts of simple substance silicon system inorganic slurry;
the raw materials for preparing the elemental silicon system inorganic slurry comprise nanoscale elemental silicon, alcohol, a coupling agent and water.
The graphene inorganic high-thermal-conductivity heat dissipation coating comprises 4-6 parts of graphene powder, preferably 4.3-5.7 parts, and further preferably 4.8-5.2 parts.
In the present invention, the particle size of the graphene powder is preferably 6 to 80 μm, more preferably 10 to 70 μm, and still more preferably 20 to 50 μm; the graphene powder is preferably obtained by stripping graphene by a physical method, and the particle size of the graphene powder obtained by the physical stripping method is more controllable than that of the graphene powder obtained by a chemical method.
In the invention, the purity of the graphene powder is preferably more than or equal to 99.5 percent, and more preferably more than or equal to 99.7 percent; the oxygen content of the graphene powder is preferably less than or equal to 1ppm.
The graphene inorganic high-thermal-conductivity heat dissipation coating comprises 94-96 parts of simple substance silicon system inorganic slurry, preferably 94.3-95.7 parts, and further preferably 94.8-95.2 parts.
The mass ratio of the nanoscale simple substance silicon to the alcohol to the coupling agent to the water is preferably 83-88: 4 to 8:0.3 to 0.8:6 to 10, more preferably 84 to 87:5 to 7:0.4 to 0.7:7 to 9, more preferably 85 to 86:6: 0.5-0.6: 8.
the coupling agent of the present invention is preferably a silane coupling agent.
In the present invention, the particle size of the graphene inorganic high thermal conductive heat dissipation coating is preferably 1 to 5 μm, more preferably 2 to 4 μm, and still more preferably 3 μm.
The invention also provides a preparation method of the graphene inorganic high-thermal-conductivity heat dissipation coating, which comprises the following steps:
and mixing and grinding the graphene powder and the elemental silicon system inorganic slurry to obtain the graphene inorganic high-thermal-conductivity heat-dissipation coating.
The invention also provides application of the graphene inorganic high-thermal-conductivity heat dissipation coating in heat exchange equipment.
The heat exchange apparatus of the present invention is preferably a liquid heat exchanger, the liquid medium in the liquid heat exchanger is preferably water or oil, and the liquid heat exchanger is preferably a condensing heat exchanger or a heating system.
In the invention, the thickness of the graphene inorganic high-thermal-conductivity heat dissipation coating applied on the heat exchange equipment is preferably 8-12 μm, more preferably 9-11 μm, and even more preferably 10 μm.
The technical solutions provided by the present invention are described in detail below with reference to examples, but they should not be construed as limiting the scope of the present invention.
Example 1
And (3) mixing the following components in percentage by mass: 5:0.4:7, stirring and mixing the nanoscale elemental silicon, alcohol (the concentration of ethanol is 80%), a silane coupling agent (the model is KH 550) and water to obtain uniform elemental silicon system inorganic slurry. Stripping graphene by a physical method to obtain graphene powder (oxygen content is 1 ppm) with the particle size of 10-30 mu m and the purity of 99.55%.
Uniformly mixing 4 parts by mass of graphene powder and 96 parts by mass of simple substance silicon system inorganic slurry, and grinding to obtain the graphene inorganic high-thermal-conductivity heat-dissipation coating with the particle size of 2 microns.
Example 2
And (2) mixing the following components in percentage by mass: 6.5:0.6:9, stirring and mixing the nanoscale elemental silicon, alcohol (the concentration of ethanol is 70 percent), a silane coupling agent (the model is KH 792) and water to obtain uniform elemental silicon system inorganic slurry. Stripping graphene by a physical method to obtain graphene powder (with the oxygen content of 0.8 ppm) with the particle size of 40-60 mu m and the purity of 99.6%.
5.5 parts of graphene powder and 94.5 parts of simple substance silicon system inorganic slurry are uniformly mixed and ground to obtain the graphene inorganic high-thermal-conductivity heat dissipation coating with the particle size of 4 microns.
Example 3
Mixing the components in a mass ratio of 85.5:6:0.5:8, stirring and mixing the nanoscale elemental silicon, alcohol (the concentration of ethanol is 80%), a silane coupling agent (the model is DL 602) and water to obtain uniform elemental silicon system inorganic slurry. Stripping graphene by a physical method to obtain graphene powder (with the oxygen content of 0.7 ppm) with the particle size of 15-40 mu m and the purity of 99.7%.
Uniformly mixing 5 parts by mass of graphene powder and 95 parts by mass of simple substance silicon system inorganic slurry, and grinding to obtain the graphene inorganic high-thermal-conductivity heat dissipation coating with the particle size of 3 mu m.
The graphene inorganic high-thermal-conductivity heat dissipation coating of the embodiments 1 to 3 is respectively coated on the inner and outer walls of the condensation heat exchanger or the heat dissipation fins (preferably, the heat conduction medium is water or oil), and a coating with a thickness of 10 μm is obtained after drying, so that the graphene inorganic high-thermal-conductivity heat dissipation coating aluminum plate system is obtained. The coating systems of examples 1 to 3 and the performance of the existing energy saving system were tested using the thermodynamic conversion principle (energy conversion principle) of the Xiaoxing group of Korea. The original energy-saving system is a copper plate, the heat conduction mode is conduction and convection, and the heat conduction mode of the graphene inorganic high-heat-conduction heat-dissipation coating aluminum plate system is conduction.
The heat exchange efficiency of the graphene inorganic high-thermal-conductivity heat-dissipation coating aluminum plate systems of the embodiments 1 to 3 is respectively improved by 15%, 18% and 21% compared with that of the original energy-saving system.
The heat conduction coefficient of the original energy-saving system is 1 multiplied by 10 5 ～1.2×10 5 W/m 2 K, the heat conduction coefficients of the graphene inorganic high-thermal-conductivity heat-dissipation coating aluminum plate systems of examples 1 to 3 are 2.15 × 10 5 W/m 2 ·K、2.2×10 5 W/m 2 ·K、2.3×10 5 W/m 2 K, the heat transfer coefficient of the present invention is almost twice that of the original energy saving system. When the coating is used for heat conduction of a liquid heat exchanger (water or oil is better as a heat conduction medium), the heat conduction effect is better.
The recovery age (the time from the beginning of use to the recovery cost) of the condensing machine of the original energy-saving system is 5.4 years, the economy is poor, the recovery age of the condensing machine adopting the graphene inorganic high-heat-conduction heat-dissipation coating aluminum plate system is 0.3 year (the recovery age is shortened by more than 94% compared with the recovery age of a compressor of the original energy-saving system), and the economy is good.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The graphene inorganic high-thermal-conductivity heat dissipation coating is characterized by comprising the following raw materials in parts by mass:
4-6 parts of graphene powder and 94-96 parts of simple substance silicon system inorganic slurry;
the raw materials for preparing the elemental silicon system inorganic slurry comprise nanoscale elemental silicon, alcohol, a coupling agent and water.
2. The inorganic graphene high-thermal-conductivity heat dissipation coating as claimed in claim 1, wherein the particle size of the graphene powder is 6-80 μm, and the graphene powder is obtained by stripping graphene through a physical method.
3. The inorganic graphene high-thermal-conductivity heat dissipation coating as claimed in claim 1 or 2, wherein the purity of graphene powder is greater than or equal to 99.5%, and the oxygen content is less than or equal to 1ppm.
4. The inorganic graphene high-thermal-conductivity heat-dissipation coating as claimed in claim 3, wherein the mass ratio of the nanoscale elemental silicon to the alcohol to the coupling agent to the water is 83-88: 4 to 8:0.3 to 0.8:6 to 10.
5. The graphene inorganic high thermal conductive and heat dissipating coating as claimed in claim 4, wherein the coupling agent is a silane coupling agent.
6. The graphene inorganic high-thermal-conductivity heat dissipation coating as claimed in claim 4 or 5, wherein the particle size of the graphene inorganic high-thermal-conductivity heat dissipation coating is 1-5 μm.
7. The preparation method of the inorganic high thermal conductive and heat dissipating graphene coating of any one of claims 1 to 6, comprising the following steps:
and mixing and grinding the graphene powder and the elemental silicon system inorganic slurry to obtain the graphene inorganic high-thermal-conductivity heat-dissipation coating.
8. Use of the graphene inorganic high thermal conductive heat dissipation coating of any one of claims 1 to 6 in heat exchange equipment.
9. The use according to claim 8, wherein the graphene inorganic high thermal conductivity heat dissipation coating is coated on the heat exchange device at a thickness of 8-12 μm.
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| CN202211053690.8A CN115232494A (en) | 2022-08-31 | 2022-08-31 | Graphene inorganic high-thermal-conductivity heat dissipation coating and preparation method and application thereof |
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|---|---|---|---|---|
| CN109943128A (en) * | 2019-04-04 | 2019-06-28 | 苏州格瑞丰纳米科技有限公司 | A kind of thin graphene aqueous slurry, preparation method and application |
| CN110105869A (en) * | 2019-04-09 | 2019-08-09 | 广东墨睿科技有限公司 | A kind of modified graphene heat radiation coating and preparation method thereof |
| CN110105828A (en) * | 2019-04-28 | 2019-08-09 | 苏州格瑞丰纳米科技有限公司 | A kind of graphene slurry, preparation method and application for metal coating |
| CN114163851A (en) * | 2021-12-15 | 2022-03-11 | 深圳前海石墨烯产业有限公司 | Graphene heat dissipation slurry and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109943128A (en) * | 2019-04-04 | 2019-06-28 | 苏州格瑞丰纳米科技有限公司 | A kind of thin graphene aqueous slurry, preparation method and application |
| CN110105869A (en) * | 2019-04-09 | 2019-08-09 | 广东墨睿科技有限公司 | A kind of modified graphene heat radiation coating and preparation method thereof |
| CN110105828A (en) * | 2019-04-28 | 2019-08-09 | 苏州格瑞丰纳米科技有限公司 | A kind of graphene slurry, preparation method and application for metal coating |
| CN114163851A (en) * | 2021-12-15 | 2022-03-11 | 深圳前海石墨烯产业有限公司 | Graphene heat dissipation slurry and preparation method thereof |
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