CN115216263A - Hot melt adhesive for attaching clothing and cloth and preparation method thereof - Google Patents
Hot melt adhesive for attaching clothing and cloth and preparation method thereof Download PDFInfo
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- CN115216263A CN115216263A CN202211026554.XA CN202211026554A CN115216263A CN 115216263 A CN115216263 A CN 115216263A CN 202211026554 A CN202211026554 A CN 202211026554A CN 115216263 A CN115216263 A CN 115216263A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
- Y02P70/62—Manufacturing or production processes characterised by the final manufactured product related technologies for production or treatment of textile or flexible materials or products thereof, including footwear
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application relates to the field of adhesives, and particularly discloses a hot melt adhesive for clothing and fabric attachment and a preparation method thereof. The raw material of the hot melt adhesive for clothing and fabric attachment comprises 100 parts of modified polyamide resin; 10-18 parts of a viscosity regulator; 20-30 parts of a tackifier; 7-13 parts of inorganic metal oxide filler; 0.1-0.5 part of antioxidant; the preparation method comprises the following steps: s1: mixing the modified polyamide resin, the viscosity regulator, the tackifier, the inorganic metal oxide filler and the antioxidant, and then uniformly stirring under the condition of inert gas; s2: reacting at 270-300 deg.c and 1.5-2.0MPa to obtain the hot melt adhesive. The heat-resistant polyamide resin has the advantages that the heat-resistant performance of the polyamide resin is improved, and the seepage of the hot melt adhesive from the lining cloth is further reduced.
Description
Technical Field
The application relates to the field of adhesives, in particular to a hot melt adhesive for attaching clothing and cloth and a preparation method thereof.
Background
The hot melt adhesive is an adhesive which is bonded under the condition that the adhesive is heated and melted. It features no solvent, solid state at room temp, liquid state when heated to its smelting point, flowability and excellent adhesion performance, and can quickly adhere to other objects to form high-strength adhesive after cooling.
The adhesive does not need to volatilize a solvent in the using process, does not bring pollution to the environment, and is beneficial to the regeneration of resources and the protection of the environment; but also can be made into blocks, films, strips or particles, so that the packaging, the storage and the use are very convenient; in addition, the hot melt adhesive is convenient to use and high in bonding speed, and meets the requirements of automation and high efficiency of industrial production. Because the hot melt adhesive has the characteristics, the hot melt adhesive is one of the fastest-developing varieties in the adhesive forming agents and is widely applied to various industries.
At present, an adhesive lining is often used in the field of clothes, and the adhesive lining is a lining coated with hot melt adhesive and is one of auxiliary materials frequently used in fabric manufacturing. The adhesive interlining is attached to the back of the cloth through heating and ironing, and can be embodied by adding the adhesive interlining when the cloth needs to express stiffness and thickness. When bonding a liner to a fabric, polyamide hot melt adhesives are often used to coat the fabric.
With respect to the related art among the above, the inventors consider that the following drawbacks exist: the main raw material of the polyamide hot melt adhesive is polyamide resin with high sensitivity to temperature, and when the temperature is too high, the phenomenon that the polyamide resin seeps out of the lining cloth can occur.
Disclosure of Invention
In order to improve the heat resistance of polyamide resin and further reduce the leakage of a hot melt adhesive from a lining cloth, the application provides the hot melt adhesive for attaching clothing and cloth and a preparation method thereof.
In a first aspect, the application provides a hot melt adhesive for clothing and fabric attachment, which adopts the following technical scheme:
a hot melt adhesive for clothes and cloth adhesion is prepared from the following raw materials in parts by weight:
100 parts of modified polyamide resin;
10-18 parts of a viscosity regulator;
20-30 parts of a tackifier;
7-13 parts of inorganic metal oxide filler;
0.1-0.5 part of antioxidant;
the modified polyamide resin is prepared by grafting dicarboxylic acid on polyamide resin and then reducing carbonyl of the dicarboxylic acid into hydroxyl in a reducing atmosphere.
By adopting the technical scheme, the fabric bonding hot melt adhesive is prepared by taking modified polyamide resin as a base material, wherein the modified polyamide resin is obtained by grafting dicarboxylic acid onto the polyamide resin, and the toughness of the polyamide resin can be improved by grafting the dicarboxylic acid onto the polyamide resin. The heat resistance of the polyamide resin is improved by reducing carbonyl groups on the polyamide resin to hydroxyl groups and then combining the resulting product with an inorganic metal oxide filler. Meanwhile, viscosity adjustment is carried out on the polyamide resin through the tackifier and the viscosity regulator, so that the polyamide hot melt adhesive is quickly and better adhered to the lining cloth, the antioxidant is added, the polyamide hot melt adhesive is protected from being applied and mixed in a molten state, and meanwhile, the polyamide hot melt adhesive is also protected from being oxidized along with the lapse of time. After the dicarboxylic acid is used for modifying the polyamide resin, the carbonyl on the dicarboxylic acid is reduced to prepare the modified polyamide resin, and after the modified polyamide resin and the inorganic metal oxide filler are compounded, the sensitivity of the polyamide hot melt adhesive to temperature is reduced, and the heat resistance of the polyamide hot melt adhesive is improved.
Preferably, the specific preparation method of the modified polyamide comprises the following steps:
s1: mixing a polyamide resin with a dicarboxylic acid according to (1-3): 1, dripping phosphoric acid, stirring in a vacuum environment, heating for reaction, and cooling to obtain an intermediate;
s2: and introducing hydrogen and a catalyst into the intermediate, reacting, and cooling to obtain the modified polyamide resin.
By adopting the technical scheme, in the S1, the carboxyl in dicarboxylic acid and the amido bond of polyamide resin are subjected to dehydration condensation reaction; in the reaction, hydrogen bonds existing between hydrogen of amide bonds originally are broken, carbonyl groups formed after carboxyl dehydroxylation are connected with nitrogen after the amide bonds are dehydrogenated, so that the distance between molecules is increased, the toughness of the polyamide resin is further improved, and in S2, the carbonyl groups on the grafted polyamide resin are reduced into hydroxyl groups: the heat resistance of the polyamide can be improved by adding hydrogen and then adding a catalyst, reducing carbonyl into hydroxyl under certain conditions by the reducibility of the hydrogen, and matching the hydroxyl with an inorganic metal oxide filler in the raw material.
Preferably, the inorganic metal oxide filler is selected from at least one of alumina and magnesia.
By adopting the technical scheme, the alumina and the magnesia are both in crystal structures, and after the inorganic metal oxide filler is mixed and reacted with the modified polyamide resin at high temperature, hydroxyl groups on the modified polyamide resin and aluminum ions in the alumina and the magnesia can perform inorganic polymerization reaction to generate an inorganic polymer with a three-dimensional structure, so that the heat resistance of the polyamide hot melt adhesive is improved.
Preferably, the inorganic metal oxide filler is alumina and magnesia, and the mass ratio of the alumina to the magnesia is (0.5-1.5): 1.
by adopting the technical scheme, the mass ratio of the aluminum oxide to the magnesium oxide is (0.5-1.5): 1, under the heating condition, the hydroxyl group in the modified polyamide resin has the most obvious effect of combining with aluminum ions and magnesium ions, and the content of the generated inorganic polymer with a three-dimensional structure is the most, so that more excellent heat resistance is shown.
Preferably, the concentration of phosphoric acid in S1 is 83-87%.
By adopting the technical scheme, the phosphoric acid with the concentration of 83-87% is a viscous solution and is easy to crystallize, meanwhile, the phosphoric acid is a ternary medium-strong acid, is ionized in three steps, has the general acidity, and can be combined with water generated by condensation to generate hemihydrate crystals in the dehydration condensation process of the polyamide resin and dicarboxylic acid, so that the phosphoric acid has the effect of promoting the condensation reaction.
Preferably, the temperature in S1 is firstly increased to 250-270 ℃, and then is reduced to 160-200 ℃.
By adopting the technical scheme, when the temperature is firstly raised to the temperature range of 250-270 ℃, the efficiency of phosphoric acid combined with water is highest, and the dehydration reaction of polyamide and dicarboxylic acid is more sufficient. When the reaction is finished, the temperature is reduced to the temperature range of 160-200 ℃, and then hydrogen is introduced for reduction reaction, under the temperature range, the catalyst sodium borohydride can carry out catalytic reduction reaction on the intermediate prepared in the S1 process most efficiently, so that the carbonyl group on the grafted carboxyl group on the polyamide resin is changed into hydroxyl group to the maximum extent.
Preferably, the viscosity modifier is a microcrystalline wax; the tackifier is terpene resin; the antioxidant is N, N, N ', N' -tetraphenylaminomethane.
By adopting the technical scheme, the N, N, N ', N' -tetraphenylaminomethane is used as an antioxidant, and has high antioxidant effect, small pollution and small colorability. The composite material has the outstanding advantages of small mobility, low pollution, low toxicity, good heat resistance and good oxygen resistance; the microcrystalline wax is mainly C31-70 branched saturated hydrocarbon, contains a small amount of cyclic and straight chain hydrocarbon, has ash content of below 0.05%, has high viscosity and ductility, is not fragile at low temperature, and has the characteristic of preventing molten resin from separating and precipitating when being mixed with the molten resin; the terpene resin has the advantages of light color, low odor, high hardness, high adhesion, good oxidation resistance, good thermal stability, good compatibility and solubility, and the like.
In a second aspect, the application provides a preparation method of a hot melt adhesive for clothing and fabric attachment, which adopts the following technical scheme:
a preparation method of a hot melt adhesive for clothing and fabric attachment comprises the following preparation steps:
s1: mixing the modified polyamide resin, the viscosity regulator, the tackifier, the filler and the antioxidant, and then uniformly stirring under the inert gas condition;
s2: reacting at 270-300 deg.c and 1.5-2.0MPa to obtain the hot melt adhesive.
By adopting the technical scheme, all the raw materials are mixed and heated to react, so that all the raw materials can be fused together well and sufficiently, the inert gas is used for replacing the gas in the reaction kettle, the explosion of some inflammable and explosive gases in the reaction kettle can be prevented, and secondly, the performance of the finally obtained hot melt adhesive is optimal in order to ensure that the reaction is more sufficient after stirring and vacuum pressurization reaction, so that the heat resistance is realized, and the toughness is also enhanced.
In summary, the present application has the following beneficial effects:
1. the fabric-bonded hot melt adhesive is prepared by grafting dicarboxylic acid onto polyamide resin and reducing carbonyl groups on the polyamide resin into hydroxyl groups, so that the toughness of the polyamide resin is improved. The obtained modified polyamide resin is combined with a metal oxide-free filler to improve the heat resistance of the polyamide resin.
2. Phosphoric acid of 83-87% concentration is preferred in this application, and phosphoric acid in this concentration range is a viscous solution and is easily crystallized. Phosphoric acid has general acidity, and 83-87% phosphoric acid can be combined with water generated by condensation to form hemihydrate crystals in the dehydration condensation process of polyamide resin and dicarboxylic acid, and has the effect of promoting the condensation reaction.
3. The method, N, N, N ', N' -tetraphenylaminomethane is used as an antioxidant, and has high antioxidant effect, low pollution and low coloring. The composite material has the outstanding advantages of small mobility, low pollution, low toxicity, good heat resistance and good oxygen resistance; the microcrystalline wax is mainly C31-70 branched saturated hydrocarbon, contains a small amount of cyclic and straight chain hydrocarbon, has ash content of below 0.05%, has high viscosity and ductility, is not fragile at low temperature, and has the characteristic of preventing molten resin from separating and precipitating when being mixed with the molten resin; the terpene resin has the advantages of light color, low odor, high hardness, high adhesion, good oxidation resistance, good thermal stability, good compatibility and solubility, and the like.
Detailed Description
The present application will be described in further detail with reference to examples.
Preparation example of hot melt adhesive for clothing and cloth adhesion
The polyamide resin is 011 resin;
the dicarboxylic acid is undecane dicarboxylic acid;
preparation example 1
The preparation method of the modified polyamide resin comprises the following steps:
s1: mixing 25kg of polyamide resin and 15kg of dicarboxylic acid, adding the mixture into a reactor with a vacuumizing and condensing system, wherein the vacuum degree is 670mmHg, dropwise adding 0.02kg of phosphoric acid with the concentration of 85%, heating to 260 ℃ under stirring, reacting for 1h, and cooling to 180 ℃ to obtain an intermediate;
s2: and introducing hydrogen into the intermediate, adding 0.7kg of sodium borohydride, reacting for 1 hour, and cooling to room temperature to obtain the modified polyamide resin.
Preparation example 2
The preparation method of the modified polyamide resin comprises the following steps:
s1: mixing 20kg of polyamide resin and 20kg of dicarboxylic acid, adding the mixture into a reactor with a vacuumizing and condensing system, wherein the vacuum degree is 670mmHg, dropwise adding 0.03kg of phosphoric acid with the concentration of 85%, heating to 260 ℃ under stirring, reacting for 1h, and cooling to 180 ℃ to obtain an intermediate;
s2: and introducing hydrogen into the intermediate, adding 0.5kg of sodium borohydride, reacting for 1 hour, and cooling to room temperature to obtain the modified polyamide resin.
Preparation example 3
The preparation method of the modified polyamide resin comprises the following steps:
s1: mixing 30kg of polyamide resin and 10kg of dicarboxylic acid, adding the mixture into a reactor with a vacuumizing and condensing system, wherein the vacuum degree is 670mmHg, dropwise adding 0.01kg of 85% phosphoric acid, heating to 260 ℃ under stirring, reacting for 1 hour, and cooling to 180 ℃ to obtain an intermediate;
s2: and introducing hydrogen into the intermediate, adding 0.9kg of sodium borohydride, reacting for 1 hour, and cooling to room temperature to obtain the modified polyamide resin.
Preparation example 4
The preparation method of the modified polyamide resin comprises the following steps:
s1: 25kg of polyamide resin and 15kg of dicarboxylic acid were mixed, the mixture was charged into a reactor equipped with a vacuum-pumping and condensing system under a vacuum degree of 670mmHg, 0.02kg of 85% phosphoric acid was added dropwise, the mixture was heated to 260 ℃ under stirring to react for 1 hour, and then cooled to obtain a modified polyamide resin.
Examples
Example 1
The preparation method of the hot melt adhesive for cloth bonding comprises the following steps:
(1): heating 100kg of modified polyamide resin, 14kg of microcrystalline wax, 25kg of terpene resin, 10kg of alumina and 0.3kg of N, N' -tetraphenylaminomethane to 200 ℃, introducing nitrogen for gas replacement, and keeping the temperature and stirring to obtain the modified polyamide resin;
(2): and (2) heating the product prepared in the step (1), keeping the temperature within 270-300 ℃ for continuously reacting for 1h when the temperature is raised to 280 ℃, keeping the pressure within 1.5-2.0MPa, continuously reacting for 2h, and cooling to obtain the hot melt adhesive.
The modified polyamide resin in preparation example 1 was selected as the raw material.
Examples 2 to 3
The difference between the hot melt adhesive for clothing and fabric lamination and the embodiment 1 is that the raw materials and the corresponding parts by weight are shown in table 2.
TABLE 2 materials and weights (kg) thereof in examples 1-3
Example 4
The difference between the hot melt adhesive for clothing and fabric lamination and the embodiment 1 is that the modified polyamide resin in the preparation example 2 is selected as a raw material.
Example 5
The difference between the hot melt adhesive for clothing and fabric lamination and the embodiment 1 is that the modified polyamide resin in the preparation example 3 is selected as a raw material.
Example 6
A hot melt adhesive for clothing fabric lamination is different from that in example 1 in that only magnesium oxide is selected as an inorganic metal oxide filler.
Example 7
A hot melt adhesive for attaching clothing and fabric, which is different from the hot melt adhesive in example 1 in that only alumina is selected as an inorganic metal oxide filler.
Comparative example
Comparative example 1
A hot melt adhesive for clothing fabric lamination is different from that in example 1 in that a modified polyamide resin is replaced with a common polyamide resin (011 resin).
Comparative example 2
A hot melt adhesive for clothing and fabric lamination, which is different from the hot melt adhesive in embodiment 1 in that an inorganic metal oxide filler is replaced by a clay filler.
Comparative example 3
The difference between the hot melt adhesive for clothing fabric lamination and the embodiment 1 is that the modified polyamide resin in the preparation example 4 is selected as a raw material.
Performance test
1. The hot melt adhesive heat resistance detection method comprises the following steps:
and pressing and ironing the hot melt adhesive into a sample strip, loading the sample strip by 200g in an oven at the temperature of 80 ℃, and comparing the complete stripping time with the heat resistance data unit of min.
2. The method for detecting the low-temperature flexibility of the hot melt adhesive comprises the following steps:
a low-temperature test chamber: the temperature fluctuation is not more than +/-1 ℃, and the temperature interval is recommended to be between room temperature and-80 ℃.
Flexibility test apparatus: the special tool comprises a mandrel support and a mandrel, wherein the diameter of the mandrel is respectively 3.2mm, 6.4mm, 12.8mm and 25.6mm, the effective length of the mandrel is 125mm, and the mandrel is made of stainless steel or brass. The diameter and length of the mandrel required may also be determined according to particular requirements.
Sample preparation: the test specimens should be cut from molded or extruded sheets or films without visually apparent cracks, blisters on the surface. It is not permissible to use a sample in which several sheets are stacked.
The size of the sample can vary according to the requirements of use. The recommended sample size is 75mmX10 mm (length X width) and the thickness is 1.25 mm. + -. 0.01mm. The thickness dimension is critical and must be precisely controlled and measured.
The test method comprises the following steps:
and putting the mandrel, the mandrel support and the test sample into a low-temperature test chamber together. The storage was carried out for 24h under the conditions of the experiment.
The mandrel with the largest diameter was mounted in the wedge-shaped notch of the mandrel holder and the flat side of the sample was placed tangentially by hand at right angles to the horizontal axis of the test mandrel.
The sample was folded 180 ° within 1s, forming an inverted "U" on the mandrel, and held in intimate contact with the mandrel.
The specimen was observed for breakage and recorded. If no breakage occurs, a new sample is taken and bent over the next mandrel of smaller diameter. Until it breaks.
The test was repeated five times using 5 new specimens on the smallest diameter mandrel without breakage, and the specimens were observed for breakage and recorded.
If four fifths of the samples in the repeated test are not broken, taking 5 new samples to wind the next mandrel with smaller diameter for testing; otherwise, 5 new samples are taken and wound on a mandrel with a larger diameter for testing. The specimen was observed for breakage and recorded.
TABLE 3
It can be seen by combining example 1, comparative example 3 and comparative example 1, and table 3, first, the difference between comparative example 1 and comparative example 3 is that example 1 has a one-step reduction process, and the reduction process has the effect of reducing the carbonyl group of the intermediate obtained in S1 to a hydroxyl group, and a three-dimensional inorganic polymer can be formed between the hydroxyl group and the metal ion in the inorganic metal oxide filler, which improves the heat resistance of the polyamide resin; secondly, in both the embodiment 1 and the comparative embodiment 3, a step of grafting dicarboxylic acid to the polyamide resin is provided, the carboxyl group in the dicarboxylic acid is combined with hydrogen in amido bond, so that hydrogen bonds formed between hydrogen in the original amido bond in the polyamide resin are broken, the dicarboxylic acid is undecanedioic acid, and the long carbon chain in the undecanedioic acid can increase the molecular distance between the polyamide resins, so that the toughness of the polyamide resin is improved, and the high temperature resistance is influenced; in comparative example 1, a hot melt adhesive prepared by using a general polyamide resin as a raw material was used, and thus the total peeling time of comparative example 1 was lower than that of example 1 and comparative example 3, but was close to that of comparative example 3; at low temperature flexibility, both example 1 and comparative example 3 were crack free, and comparative example 1 broke.
As can be seen by combining example 1 and comparative example 2 and table 3, comparative example 2 replaces the inorganic metal oxide filler with the clay-based filler, and the inorganic metal oxide filler is selected from alumina and magnesia, which can ionize inorganic metal ions in a molten state, and there is a reaction between the inorganic metal ions and the modified polyamide, but the clay-based filler in comparative example 2 does not ionize the inorganic metal ions, and thus is shorter in complete exfoliation time than example 1.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (8)
1. The hot melt adhesive for attaching the clothing and the cloth is characterized by being prepared from the following raw materials in parts by weight: 100 parts of modified polyamide resin;
10-18 parts of a viscosity regulator;
20-30 parts of a tackifier;
7-13 parts of inorganic metal oxide filler;
0.1-0.5 part of antioxidant;
the modified polyamide resin is prepared by the steps of grafting dicarboxylic acid on polyamide resin, and reducing carbonyl of dicarboxylic acid into hydroxyl in a reducing atmosphere.
2. The hot melt adhesive for clothing fabric attachment according to claim 1, characterized in that: the specific preparation method of the modified polyamide comprises the following steps:
s1: mixing a polyamide resin with a dicarboxylic acid according to (1-3): 1, dripping phosphoric acid, stirring in a vacuum environment, heating for reaction, and cooling to obtain an intermediate;
s2: and introducing hydrogen and a catalyst into the intermediate, reacting, and cooling to obtain the modified polyamide resin.
3. The hot melt adhesive for garment fabric fitting according to claim 1, which is characterized in that: the inorganic metal oxide filler is at least one selected from the group consisting of alumina and magnesia.
4. The hot melt adhesive for garment fabric fitting according to claim 1, which is characterized in that: the inorganic metal oxide filler is alumina and magnesia, and the mass ratio of the alumina to the magnesia is (0.5-1.5): 1.
5. the hot melt adhesive for clothing fabric attachment according to claim 2, characterized in that: the concentration of phosphoric acid in S1 is 83-87%.
6. The hot melt adhesive for garment fabric fitting according to claim 2, wherein the hot melt adhesive comprises: in the S1, the temperature is firstly increased to 250-270 ℃, and then is reduced to 160-200 ℃.
7. The hot melt adhesive for garment fabric fitting according to claim 1, which is characterized in that:
the viscosity regulator is microcrystalline wax; the tackifier is terpene resin; the antioxidant is N, N, N ', N' -tetraphenylaminomethane.
8. The method for preparing the hot melt adhesive for clothing and fabric attachment according to any one of claims 1 to 7, wherein the method comprises the following steps: the preparation method comprises the following preparation steps:
(1): mixing the modified polyamide resin, the viscosity regulator, the tackifier, the filler and the antioxidant, and then uniformly stirring under the inert gas condition;
(2): reacting at 270-300 deg.c and 1.5-2.0MPa to obtain the hot melt adhesive.
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| CN202211026554.XA CN115216263B (en) | 2022-08-25 | 2022-08-25 | Hot melt adhesive for clothing cloth bonding and preparation method thereof |
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| CN103254868A (en) * | 2013-05-17 | 2013-08-21 | 上海凯赛生物技术研发中心有限公司 | Hot melt adhesive |
| WO2018191186A1 (en) * | 2017-04-10 | 2018-10-18 | Continental Reifen Deutschland Gmbh | Functionalized resin having a polar linker |
| CN107674632A (en) * | 2017-09-22 | 2018-02-09 | 安庆市虹泰新材料有限责任公司 | A kind of preparation method of modified polyamide thermosol |
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