CN115206683A - Method for manufacturing capacitor composite diaphragm for electronic circuit board - Google Patents
Method for manufacturing capacitor composite diaphragm for electronic circuit board Download PDFInfo
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- CN115206683A CN115206683A CN202210892063.7A CN202210892063A CN115206683A CN 115206683 A CN115206683 A CN 115206683A CN 202210892063 A CN202210892063 A CN 202210892063A CN 115206683 A CN115206683 A CN 115206683A
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- capacitor
- materials
- coating
- high dielectric
- dielectric strength
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- 239000003990 capacitor Substances 0.000 title claims abstract description 80
- 239000002131 composite material Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 79
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 8
- 239000002861 polymer material Substances 0.000 claims abstract description 7
- 239000011229 interlayer Substances 0.000 claims abstract description 5
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 238000003618 dip coating Methods 0.000 claims description 3
- 238000001548 drop coating Methods 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 230000010354 integration Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/02—Diaphragms; Separators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0032—Processes of manufacture formation of the dielectric layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
- H01M50/403—Manufacturing processes of separators, membranes or diaphragms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
- H01M50/409—Separators, membranes or diaphragms characterised by the material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a capacitor composite diaphragm for an electronic circuit board, which comprises the following steps: step one, preparing materials; step two, preparing a capacitor; step three, preparing a capacitor; in the first step, the high dielectric constant material includes but is not limited to ceramic particles, carbon particles, metal conductive particles, polymer materials, organic salts, inorganic salts, and other materials; the capacitor diaphragm is manufactured by coating composite materials with different proportions in a layered manner, the dielectric constant of the materials is improved, the dielectric strength of the materials is improved, the requirements of improving the dielectric constant of the capacitor diaphragm and reducing the thickness are met, the capacitor diaphragm can improve the capacity of a capacitor by more than 2 orders of magnitude under the condition of the same area, the integration of an electronic circuit board can be effectively improved, and the manufacturing cost of the electronic circuit board is reduced; the invention can improve the withstand voltage and the capacity of the capacitor by adopting the method of connecting the adjacent layer capacitors in series and connecting the interlayer capacitors in parallel to prepare the capacitor.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a capacitor composite diaphragm for an electronic circuit board.
Background
The electronic circuit board is a key electronic interconnection device of an electronic product, the electronic device can be directly manufactured when the electronic circuit board is manufactured, such as a resistor, a capacitor, an inductor, an antenna and the like, according to the manufacturing principle of the capacitor, the capacitance is in direct proportion to the area of two electrodes of the capacitor, is in inverse proportion to the distance between the two electrodes of the capacitor, and is also in direct proportion to the dielectric coefficient of a diaphragm material between the two electrodes of the capacitor, and because the area of the capacitor manufactured by the space limitation of the electronic circuit board is relatively limited, the difficulty of directly manufacturing the capacitor on the electronic circuit board is mainly two aspects, namely, the thickness of the capacitor diaphragm and the material dielectric constant and the dielectric strength of the capacitor diaphragm, the distance between the two electrodes of the capacitor needs to be reduced when the capacitor with larger capacity is manufactured in the same area, the thickness of the capacitor diaphragm is reduced, or the dielectric constant of the capacitor diaphragm is increased.
However, the dielectric constant and dielectric strength of various materials used for the capacitor diaphragm are determined by the inherent properties of the materials, and the reduced thickness of the capacitor diaphragm can simultaneously reduce the voltage resistance of the capacitor, so the dielectric strength of the material of the capacitor diaphragm limits the thickness, and the materials which can be generally used for the capacitor diaphragm are few, the materials with high dielectric constant have low dielectric strength, the materials with good dielectric strength have low dielectric constant, and the materials are difficult to be used for the capacitor diaphragm, so that a method which can improve the dielectric constant and dielectric strength of the capacitor diaphragm and can reduce the thickness of the capacitor diaphragm is lacked.
Disclosure of Invention
The invention aims to provide a method for manufacturing a capacitive composite diaphragm for an electronic circuit board, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a method for manufacturing a capacitive composite diaphragm for an electronic circuit board comprises the following steps: step one, preparing materials; step two, preparing a capacitor; step three, preparing a capacitor;
in the first step, different types of high-dielectric-strength materials and high-dielectric-constant materials are selected and prepared into multiple parts of composite materials according to different proportions according to requirements;
in the second step, the capacitor preparation comprises the following steps:
1) Coating with pure dielectric strength material: firstly, selecting a pure dielectric strength material, and uniformly coating the pure dielectric strength material on a bottom electrode of a capacitor to obtain a first coating;
2) The material proportion of high dielectric strength in the coating is reduced in turn: uniformly coating a composite material with a high dielectric strength material and a low high dielectric constant material on the first layer of coating, and then sequentially reducing the ratio of the high dielectric strength material in the composite material and improving the ratio of the high dielectric constant material by the coated coating until the ratio of the high dielectric strength material reaches 10%;
3) The material proportion of high dielectric strength in the coating is sequentially improved: then the coating layer sequentially increases the proportion of high dielectric strength materials in the composite material and reduces the proportion of high dielectric constant materials until the high dielectric strength materials are pure;
4) Plating a capacitor top electrode: finally, plating a capacitor top electrode on the uppermost coating to obtain a finished capacitor;
and in the third step, the capacitors of the adjacent layers are connected in series, and the capacitors of the interlayer are connected in parallel, so that the finished capacitor is obtained.
Preferably, in the first step, the content of the high dielectric strength material in the composite material is reduced from 100% to 10%, and then increased from 10% to 100%.
Preferably, in the first step, the high dielectric constant material includes, but is not limited to, ceramic particles, carbon particles, metal conductive particles, polymer materials, organic salts, inorganic salts, and the like.
Preferably, in the first step, the high dielectric strength material is a high dielectric strength polymer material resistant to high voltage breakdown.
Preferably, in the second step, the coating method includes, but is not limited to, spin coating film forming, drop coating film forming, dip coating film forming and spray coating film forming.
Preferably, in the second step, the capacitor electrode is a coated ultrathin electrode, and the materials include, but are not limited to, graphene, carbon nanotubes, silver-plated electrode and copper-plated electrode.
Compared with the prior art, the invention has the beneficial effects that: the capacitor diaphragm is prepared by coating composite materials with different proportions in a layered manner, the dielectric constant of the materials is improved, the dielectric strength of the materials is improved, the requirements of improving the dielectric constant of the capacitor diaphragm and reducing the thickness are met, the capacity of a capacitor can be improved by more than 2 orders of magnitude under the condition of the same area, the integration of an electronic circuit board can be effectively improved, and the manufacturing cost of the electronic circuit board is reduced; the invention can improve the withstand voltage and the capacity of the capacitor by adopting the method of connecting the adjacent layer capacitors in series and connecting the interlayer capacitors in parallel to prepare the capacitor.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
fig. 2 is a schematic diagram of a capacitor structure according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, an embodiment of the present invention is shown: a method for manufacturing a capacitive composite diaphragm for an electronic circuit board comprises the following steps: step one, preparing materials; step two, preparing a capacitor; step three, preparing a capacitor;
in the first step, different types of high-dielectric-strength materials and high-dielectric-constant materials are selected and prepared into multiple parts of composite materials according to different proportions according to requirements; the proportion of the high dielectric strength material in the composite material is reduced from 100% to 10%, and then is increased from 10% to 100%, the high dielectric constant material comprises but is not limited to ceramic particles, carbon particles, metal conductive particles, high polymer materials, organic salts, inorganic salts and other materials, and the high dielectric strength material adopts a high dielectric strength high polymer material with high voltage breakdown resistance;
in the second step, the capacitor preparation comprises the following steps:
1) Coating with pure dielectric strength material: firstly, selecting a pure dielectric strength material, and uniformly coating the pure dielectric strength material on a bottom electrode of a capacitor to obtain a first coating; the coating method comprises but is not limited to spin coating film forming, drop coating film forming, dip coating film forming and spray film forming, the capacitor electrode adopts a coated ultrathin electrode, and the materials comprise but are not limited to graphene, carbon nano tubes, silver-plated and copper-plated electrodes;
2) The material proportion of high dielectric strength in the coating is reduced in turn: uniformly coating the composite material with high dielectric strength material and low high dielectric constant material on the first layer of coating, and then sequentially reducing the ratio of the high dielectric strength material in the composite material and improving the ratio of the high dielectric constant material by the coated coating until the ratio of the high dielectric strength material reaches 10%;
3) The material proportion of high dielectric strength in the coating is sequentially improved: then the coating layer sequentially increases the proportion of high dielectric strength materials in the composite material and reduces the proportion of high dielectric constant materials until the high dielectric strength materials are pure;
4) Plating a capacitor top electrode: finally, plating a capacitor top electrode on the uppermost coating to obtain a finished capacitor;
in the third step, the capacitors of the adjacent layers are connected in series, and the capacitors of the interlayer are connected in parallel, so that the finished capacitor is obtained.
Based on the above, the capacitor diaphragm of the invention is made of two materials with high dielectric constant and high dielectric strength, and is coated by layers of composite materials with different proportions, so that the dielectric constant and the dielectric strength of the material of the capacitor diaphragm are properly balanced, the effect of reducing the thickness of the capacitor diaphragm and improving the dielectric constant is realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A method for manufacturing a capacitor composite diaphragm for an electronic circuit board comprises the following steps: step one, preparing materials; step two, preparing a capacitor; step three, preparing a capacitor; the method is characterized in that:
in the first step, different types of high-dielectric-strength materials and high-dielectric-constant materials are selected and prepared into multiple parts of composite materials according to different proportions according to requirements;
in the second step, the capacitor preparation comprises the following steps:
1) Coating with pure dielectric strength material: firstly, selecting a pure dielectric strength material, and uniformly coating the pure dielectric strength material on a bottom electrode of a capacitor to obtain a first coating;
2) The material proportion of high dielectric strength in the coating is reduced in turn: uniformly coating a composite material with a high dielectric strength material and a low high dielectric constant material on the first layer of coating, and then sequentially reducing the ratio of the high dielectric strength material in the composite material and improving the ratio of the high dielectric constant material by the coated coating until the ratio of the high dielectric strength material reaches 10%;
3) The material proportion of high dielectric strength in the coating is sequentially improved: then the coating layer sequentially increases the proportion of high dielectric strength materials in the composite material and reduces the proportion of high dielectric constant materials until the high dielectric strength materials are pure;
4) Plating a capacitor top electrode: finally, plating a capacitor top electrode on the uppermost coating,
obtaining a finished capacitor;
and in the third step, the capacitors of the adjacent layers are connected in series, and the capacitors of the interlayer are connected in parallel, so that the finished capacitor is obtained.
2. The method of claim 1, wherein the method comprises the steps of: in the first step, the proportion of the high dielectric strength material in the composite material is reduced from 100% to 10%, and then increased from 10% to 100%.
3. The method of claim 1, wherein the step of forming the composite capacitive diaphragm comprises: in the first step, the high dielectric constant material includes, but is not limited to, ceramic particles, carbon particles, metal conductive particles, polymer materials, organic salts, inorganic salts, and the like.
4. The method of claim 1, wherein the step of forming the composite capacitive diaphragm comprises: in the first step, the high-dielectric-strength material is a high-dielectric-strength high polymer material resistant to high-voltage breakdown.
5. The method of claim 1, wherein the method comprises the steps of: in the second step, the coating method includes, but is not limited to, spin coating film forming, drop coating film forming, dip coating film forming and spray film forming.
6. The method of claim 1, wherein the method comprises the steps of: in the second step, the capacitor electrode is a coated ultrathin electrode, and the materials include but are not limited to graphene, carbon nanotubes, silver-plated electrodes and copper-plated electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210892063.7A CN115206683B (en) | 2022-07-27 | 2022-07-27 | Manufacturing method of capacitance composite diaphragm for electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210892063.7A CN115206683B (en) | 2022-07-27 | 2022-07-27 | Manufacturing method of capacitance composite diaphragm for electronic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115206683A true CN115206683A (en) | 2022-10-18 |
| CN115206683B CN115206683B (en) | 2024-02-13 |
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| CN202210892063.7A Active CN115206683B (en) | 2022-07-27 | 2022-07-27 | Manufacturing method of capacitance composite diaphragm for electronic circuit board |
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| CN115206683B (en) | 2024-02-13 |
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