CN115202134A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN115202134A CN115202134A CN202210953316.7A CN202210953316A CN115202134A CN 115202134 A CN115202134 A CN 115202134A CN 202210953316 A CN202210953316 A CN 202210953316A CN 115202134 A CN115202134 A CN 115202134A
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- light guide
- imaging chip
- light
- electromagnetic coil
- camera module
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims description 44
- 238000003825 pressing Methods 0.000 claims description 23
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- 230000000903 blocking effect Effects 0.000 claims description 17
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- 230000002349 favourable effect Effects 0.000 description 4
- 206010070834 Sensitisation Diseases 0.000 description 3
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
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Abstract
The embodiment of the application provides a camera module and electronic equipment. This camera module includes: the lens comprises a shell, a base, a lens component, a circuit board, an imaging chip and a light guide heat sink; the shell is connected with one end of the base, the other end of the base is connected with the circuit board, the imaging chip is arranged on the circuit board, and the base surrounds the imaging chip; the imaging chip is provided with a photosensitive surface facing the lens component, at least one of the shell and the base is provided with a notch, the notch forms a heat dissipation channel, the external space of the shell is communicated with the internal space of the shell through the heat dissipation channel, the light guide heat dissipation part is arranged in the heat dissipation channel in a penetrating mode, part of the light guide heat dissipation part is located between the photosensitive surface and the lens component and is in contact with the photosensitive surface, and the other part of the light guide heat dissipation part is located in the external space of the shell and is used for dissipating heat of the imaging chip.
Description
Technical Field
The application relates to the technical field of camera modules, in particular to a camera module and electronic equipment.
Background
With the development of science and technology, electronic devices are more and more widely applied. Generally, a camera module is installed in an electronic device, and a picture can be taken or a video can be taken through the camera module.
Referring to fig. 1, a schematic view of a camera module in the related art is shown, and as shown in fig. 1, the camera module includes a housing 10, a base 20, an imaging chip 50, an infrared filter 201, a lens assembly 30, a circuit board 40, and a motor 101. The shell 10 is connected with one end of the base 20, the other end of the base 20 is connected with the circuit board 40, the imaging chip 50 is arranged on the circuit board 40, the base 20 surrounds the imaging chip 50, the infrared filter 201 is arranged on the base 20, the lens and the motor 101 are both located in the shell 10, the motor 101 is connected with the lens, and the infrared filter 201 is located between the imaging chip 50 and the lens assembly 30. When using the camera module, the motor 101 can drive the lens assembly 30 to stretch and contract, and the imaging chip 50 can convert light into an image, so that the camera module can shoot.
However, the imaging chip 50 is easy to generate heat during the operation, and the heat is accumulated in the housing 10 and the base 20, so that the temperature of the camera module is increased, the imaging effect of the imaging chip 50 is affected, and the shooting effect of the camera module is finally affected.
Disclosure of Invention
The embodiment of the application provides a camera module to solve the problem that imaging chip generates heat easily among the correlation technique, finally influences the shooting effect of camera module.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a camera module, which includes: the lens comprises a shell, a base, a lens component, a circuit board, an imaging chip and a light guide and heat dissipation part;
the shell is connected with one end of the base, the other end of the base is connected with the circuit board, the imaging chip is arranged on the circuit board, and the base surrounds the imaging chip;
the imaging chip has a photosensitive surface, the photosensitive surface is towards the lens subassembly, the casing with at least one in the base goes up the breach, the breach forms the heat dissipation passageway, the exterior space of casing with the inner space of casing passes through the heat dissipation passageway intercommunication, leaded light radiating part wears to locate the heat dissipation passageway, and part leaded light radiating part be located the photosensitive surface with between the lens subassembly, and with the photosensitive surface contact, part in addition leaded light radiating part is located the exterior space of casing, leaded light radiating part be used for right the imaging chip dispels the heat.
In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes the camera module in the first aspect.
In this application embodiment, because the casing is connected with the one end of base, the other end and the circuit board of base are connected, and imaging chip sets up on the circuit board, and imaging chip has the photosurface, and the photosurface is towards the camera lens subassembly, consequently, when using the camera module to shoot, light can pass the camera lens subassembly and shine on imaging chip's photosurface to imaging chip converts light into the image, makes the camera module can shoot. Because the shell is provided with the first notch and/or the base is provided with the second notch, the first notch and/or the second notch form a heat radiation channel, the external space of the shell is communicated with the internal space of the shell through the heat radiation channel, the light guide heat radiation piece is arranged in the heat radiation channel in a penetrating way, part of the light guide heat radiation piece is positioned between the photosensitive surface and the lens component and is contacted with the photosensitive surface, and the other part of the light guide heat radiation piece is positioned in the external space of the shell. That is, in this application embodiment, through setting up the leaded light radiating piece, and partial leaded light radiating piece and the contact of sensitization face, partial leaded light radiating piece is located the exterior space of casing to leaded light radiating piece can conduct the heat that the imaging chip produced, makes the heat that the imaging chip produced be conducted to the exterior space of casing, avoids the heat to gather in the casing, thereby can improve the shooting effect of camera module.
Drawings
Fig. 1 is a schematic view of a camera module according to the related art;
fig. 2 is a schematic view of a camera module according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a light-guiding heat sink and a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating a contact of a pressing structure with a light-guiding heat sink according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of an imaging chip disposed on a circuit board according to an embodiment of the present disclosure;
fig. 6 shows a second schematic diagram of an imaging chip disposed on a circuit board according to an embodiment of the present application;
FIG. 7 is a schematic view of a base according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a connection between a base and a circuit board according to an embodiment of the present disclosure;
fig. 9 is a second schematic diagram illustrating a connection between a base and a circuit board according to an embodiment of the present application;
fig. 10 is a partial schematic view of a camera module according to an embodiment of the present disclosure;
FIG. 11 is a schematic diagram of an embodiment of the present application showing an extrusion structure extruding a light guiding liquid;
FIG. 12 is a schematic view of an exemplary location of an extrusion arrangement according to an embodiment of the present disclosure;
fig. 13 shows a second schematic view of the arrangement position of an extrusion structure according to the embodiment of the present application.
Reference numerals are as follows:
10: a housing; 20: a base; 30: a lens assembly; 40: a circuit board; 50: an imaging chip; 60: a light guiding heat sink; 70: extruding the structure; 11: a housing; 12: a carrier; 21: a boss; 61: light guide liquid; 62: a light directing film; 71: an electromagnetic coil; 72: a magnetic member; 73: an electro-deformable member; 74: a stopper; 101: a motor; 201: an infrared filter; 211: a notch; 401: a board-to-board connector; 402: and a support plate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As shown in fig. 2 to 13, the camera module includes: the lens module comprises a housing 10, a base 20, a lens assembly 30, a circuit board 40, an imaging chip 50 and a light-guiding heat sink 60.
The case 10 is connected to one end of the base 20, the other end of the base 20 is connected to the circuit board 40, the imaging chip 50 is disposed on the circuit board 40, and the base 20 surrounds the imaging chip 50. The imaging chip 50 has a light-sensing surface facing the lens assembly 30, at least one of the housing 10 and the base 20 has a notch 211, the notch 211 forms a heat dissipation channel, an external space of the housing 10 is communicated with an internal space of the housing 10 through the heat dissipation channel, the light-guiding heat dissipation member 60 is disposed through the heat dissipation channel, a part of the light-guiding heat dissipation member 60 is disposed between the light-sensing surface and the lens assembly 30 and contacts with the light-sensing surface, another part of the light-guiding heat dissipation member 60 is disposed in the external space of the housing 10, and the light-guiding heat dissipation member 60 is used for dissipating heat of the imaging chip 50.
In this embodiment, because the casing 10 is connected with the one end of base 20, the other end of base 20 is connected with circuit board 40, imaging chip 50 sets up on circuit board 40, imaging chip 50 has the photosurface, and the photosurface is towards lens subassembly 30, consequently, when using the camera module to shoot, light can pass lens subassembly 30 and shine on imaging chip 50's photosurface to imaging chip 50 converts light into the image, makes the camera module can shoot. Because at least one of the housing 10 and the base 20 has a notch, the notch 211 forms a heat dissipation channel, the external space of the housing 10 is communicated with the internal space of the housing 10 through the heat dissipation channel, the light guide heat sink 60 is disposed through the heat dissipation channel, and part of the light guide heat sink 60 is located between the photosensitive surface and the lens assembly 30 and contacts with the photosensitive surface, and another part of the light guide heat sink 60 is located in the external space of the housing 10, therefore, when the imaging chip 50 generates heat, the heat is transferred to the light guide heat sink 60, that is, the heat is first transferred to the part of the light guide heat sink 60 contacting with the photosensitive surface, and then the heat is transferred along the light guide heat sink 60, that is, the light guide heat sink 60 conducts the heat and transfers the heat to the part of the light guide heat sink 60 located in the external space of the housing 10, and the heat generated by the imaging chip 50 is finally conducted to the external space of the housing 10 and dissipated, thereby preventing the heat generated by the imaging chip 50 from being collected in the housing 10 and affecting the shooting effect of the camera module. That is, in the embodiment of the present application, by providing the light guiding heat dissipating member 60, and contacting part of the light guiding heat dissipating member 60 with the light sensing surface, part of the light guiding heat dissipating member 60 is located in the external space of the housing 10, so that the light guiding heat dissipating member 60 can conduct the heat generated by the imaging chip 50, the heat generated by the imaging chip 50 is conducted to the external space of the housing 10, the heat is prevented from being accumulated in the housing 10, and the shooting effect of the camera module can be improved.
It should be noted that, in the embodiment of the present application, a motor 101 may be further disposed in the housing 10, the motor 101 is connected to the lens assembly 30, and the motor 101 may drive the lens assembly 30 to extend and retract, that is, the lens assembly 30 extends out of the housing 10 or retracts into the housing 10.
In addition, in the embodiment of the present application, the housing 10 may include a shell 11 and a carrier 12, the shell 11 is connected to the carrier 12, and the carrier 12 is connected to the base 20.
In addition, in the embodiment of the present application, only the gap 211 may be formed on the housing 10, and at this time, the gap 211 forms a heat dissipation channel; the base 20 may be provided with a notch 211 only, and at this time, the notch 211 forms a heat dissipation channel; certainly, the housing 10 may be provided with a notch 211, and the base 20 may also be provided with a notch 211, and the notch 211 on the housing 10 is opposite to the notch 211 on the base 20, and the two notches 211 jointly form a heat dissipation channel.
In addition, in the embodiment of the present application, the Circuit Board 40 may be a Flexible Printed Circuit (FPC), and of course, the Circuit Board 40 may also be a Printed Circuit Board (PCB). The embodiments of the present application are not limited thereto. In addition, in the embodiment of the present application, when the circuit board 40 is a flexible circuit board, at this time, the imaging chip 50 may be disposed on a first surface of the flexible circuit board, and the support plate 402 may be disposed on a second surface of the flexible circuit board. The supporting plate 402 may be a steel plate or an iron plate.
In addition, in the embodiment of the present application, a Board-To-Board connector 401 (Board To Board, BTB) may be disposed on the circuit Board 40, so that after the camera module is applied in the electronic device, the camera module can be connected To other devices through the Board-To-Board connector 401.
In addition, in some embodiments, as shown in fig. 12 or 13, light guiding heat sink 60 may include light guiding liquid 61 and light guiding film 62. The light guide film 62 covers the light guide liquid 61, a part of the light guide film 62 contacts the light sensing surface, and a part of the light guide film 62 is located in the external space of the housing 10.
Because light guide film 62 coats light guide liquid 61, part of light guide film 62 contacts with the photosurface, and part of light guide film 62 is located the outer space of casing 10, therefore, after imaging chip 50 generates heat, the photosurface can transmit the heat to light guide film 62 contacting with the photosurface, and then transmit to light guide liquid 61, light guide liquid 61 can conduct the heat, the heat can be in light guide liquid 61 in the outer space of casing 10 with conducting, and then the heat gives off, thereby make imaging chip 50 can dispel the heat. In addition, the light guiding film 62 and the light guiding liquid 61 do not affect the transmission of the light, that is, the light passing through the lens assembly 30 can continue to be transmitted after being transmitted to the light guiding film 62, and finally transmitted to the light sensing surface. That is, by setting up light guide liquid 61 and light guide film 62, not only can make imaging chip 50's heat distribute by light guide liquid 61, can not influence light transmission to imaging chip 50's photosurface yet, and then can not influence imaging chip 50 and convert light into the image.
Additionally, in some embodiments, as shown in fig. 3, the camera module may further include an extruded structure 70. The pressing structure 70 is located in the housing 10, and the pressing structure 70 is in contact with the light guiding film 62, and the pressing structure 70 is used for pressing the light guiding film 62 in the direction from the imaging chip 50 to the lens assembly 30, or pressing the light guiding film 62 in the direction from the lens assembly 30 to the imaging chip 50, so as to make the light guiding liquid 61 flow, and change the curvature of the light guiding film 62 away from the light sensing surface.
Because the pressing structure 70 is located in the housing 10, and the pressing structure 70 is in contact with the light guide film 62, the light guide film 62 can be pressed by the pressing structure 70, and after the light guide film 62 is pressed, the light guide film 62 can be deformed, so that the light guide liquid 61 flows. And partial sensitization film contacts with imaging chip 50's photosurface, and after photosurface led light liquid 61 with imaging chip 50's heat transfer, the extrusion of extrusion structure 70 can accelerate the flow of leaded light liquid 61 to accelerate thermal conduction, make the heat can be quick be transmitted to the outside of casing 10, and then make imaging chip 50 can dispel the heat fast. In addition, when the pressing structure 70 presses the light guide film 62 so that the light guide liquid 61 flows, the light guide film 62 that is away from the light sensing surface is also deformed by the flow of the light guide liquid 61 and the pressing by the pressing structure 70, so that the curvature of the light guide film 62 changes. When the curvature of the light guide film 62 changes, the distance between the light guide film 62 and the lens assembly 30 changes, so that the focal length of the camera module changes. That is, through setting up extrusion structure 70, extrude leaded light film 62 through extrusion structure 70, not only can be favorable to the imaging chip 50 heat dissipation, also can make the focus of camera module change, play the focus effect of adjustment camera module promptly.
Additionally, in some embodiments, as shown in fig. 12, the extrusion structure 70 may include an electromagnetic coil 71 and a magnetic member 72. Magnetic element 72 is located on a side of light guiding film 62 facing away from imaging chip 50, electromagnetic coil 71 is located on a side of light guiding film 62 facing towards imaging chip 50, electromagnetic coil 71 is located opposite to magnetic element 72, and a portion of light guiding film 62 is located between magnetic element 72 and electromagnetic coil 71. Alternatively, the magnetic element 72 is located on the side of the light guide film 62 facing the imaging chip 50, the electromagnetic coil 71 is located on the side of the light guide film 62 facing away from the imaging chip 50, the electromagnetic coil 71 is located opposite to the magnetic element 72, and a part of the light guide film 62 is located between the magnetic element 72 and the electromagnetic coil 71. When the electromagnetic coil 71 is energized, the electromagnetic coil 71 attracts the magnetic member 72 so that the magnetic member 72 presses the light guide film 62; when the electromagnetic coil 71 is deenergized, the electromagnetic coil 71 stops attracting the magnetic member 72, so that the magnetic member 72 stops pressing the light guide film 62.
When the magnetic element 72 is located on the side of the light guide film 62 away from the imaging chip 50, the electromagnetic coil 71 is located on the side of the light guide film 62 facing the imaging chip 50, and the electromagnetic coil 71 is opposite to the magnetic element 72, at this time, when the electromagnetic coil 71 is energized, the electromagnetic coil 71 and the magnetic element 72 are attracted to each other, that is, the distance between the electromagnetic coil 71 and the magnetic element 72 is reduced, so that the magnetic element 72 and the electromagnetic coil 71 interact with each other to press the light guide film 62, so that the light guide liquid 61 in the light guide film 62 flows, and the curvature of the light guide film 62 away from the imaging chip 50 is changed, and when the curvature of the light guide film 62 is changed, the focal length of the camera module is changed, that is, the focal length of the camera module is adjusted; under the condition that the electromagnetic coil 71 is powered off, the electromagnetic coil 71 no longer has magnetism, so that the electromagnetic coil 71 stops attracting the magnetic piece 72, the magnetic piece 72 stops pressing the light guide film 62, that is, the curvature of the light guide film 62 away from the imaging chip 50 is fixed, and the focal length adjustment of the camera module can be completed.
Similarly, when the magnetic element 72 is located on the side of the light guiding film 62 facing the imaging chip 50, the electromagnetic coil 71 is located on the side of the light guiding film 62 facing away from the imaging chip 50, and the electromagnetic coil 71 is opposite to the magnetic element 72, at this time, when the electromagnetic coil 71 is energized, the electromagnetic coil 71 and the magnetic element 72 will attract each other, that is, the distance between the electromagnetic coil 71 and the magnetic element 72 is reduced, so that the magnetic element 72 and the electromagnetic coil 71 interact with each other to press the light guiding film 62, so that the light guiding liquid 61 in the light guiding film 62 flows, and the curvature of the light guiding film 62 facing away from the imaging chip 50 changes, and when the curvature of the light guiding film 62 changes, the focal length of the camera module will change, that is, the focal length of the camera module will be adjusted; under the condition that the electromagnetic coil 71 is powered off, the electromagnetic coil 71 no longer has magnetism, so that the electromagnetic coil 71 stops attracting the magnetic piece 72, the magnetic piece 72 stops pressing the light guide film 62, that is, the curvature of the light guide film 62 away from the imaging chip 50 is fixed, and the focal length adjustment of the camera module can be completed.
It should be noted that, the current passing through the electromagnetic coil 71 can be controlled, and then the magnetism of the electromagnetic coil 71 is controlled, so that the distance between the electromagnetic coil 71 and the magnetic member 72 is different, that is, the extrusion degree of the magnetic member 72 extruding the light guide film 62 is different, so that the curvature of the light guide film 62 departing from the imaging chip 50 is different, and different focusing effects on the camera module are achieved.
In addition, in the present embodiment, light guiding film 62 may have elasticity such that light guiding film 62 presses light guiding liquid 61 when light guiding film 62 is pressed, and light guiding liquid 61 may flow such that light guiding film 62 returns to the initial state when light guiding film 62 stops being pressed.
In addition, in the embodiment of the present application, a first current may be applied to the electromagnetic coil 71, so that the electromagnetic coil 71 and the magnetic member 72 are attracted to each other, and a second current may be applied to the electromagnetic coil 71, so that the electromagnetic coil 71 and the magnetic member 72 are repelled from each other. When the electromagnetic coil 71 and the magnetic piece 72 attract each other, the magnetic piece 72 can extrude the light guide film 62 to focus the camera module; when the electromagnetic coil 71 and the magnetic element 72 repel each other, the magnetic element 72 stops pressing the light guiding film 62, and the light guiding film 62 can be restored to the original state under the action of the light guiding liquid 61, that is, the camera module can be restored to the original focal length.
In addition, in the embodiment of the present application, the magnetic member 72 may be movably connected to the base 20, so that when the electromagnetic coil 71 is energized, the magnetic member 72 is moved by the magnetic force of the electromagnetic coil 71 to press the light guiding film 62. In addition, in the embodiment of the present application, the electromagnetic coil 71 and the circuit board 40 may be electrically connected, and the current is supplied to the electromagnetic coil 71 through the circuit board 40. Specifically, the electromagnetic coil 71 may be electrically connected to the circuit board 40 through the flexible circuit board 40, so that the current on the circuit board 40 may flow into the electromagnetic coil 71.
In addition, in some embodiments, a metal member may be provided in the electromagnetic coil 71, and the metal member is used to enhance the magnetism of the electromagnetic coil 71 when the electromagnetic coil 71 is energized.
When a metal part is arranged in the electromagnetic coil 71, at this time, after the electromagnetic coil 71 is electrified, the magnetism of the electromagnetic coil 71 can be enhanced by the metal part, so that the magnetism of the whole formed by the electromagnetic coil 71 and the metal part is enhanced, the whole formed by the metal coil and the metal part is favorably attracted to the magnetic part 72, the magnetic part 72 is favorably extruded on the light guide film 62, and the middle light guide liquid 61 in the light guide film 62 flows. That is, by providing the metal member in the electromagnetic coil 71, it is possible to contribute to the improvement in the magnetic property of the electromagnetic coil 71 after the energization and to the flow of the light guide liquid 61.
It should be noted that the metal member may be a metal columnar structure, and may also be a metal cylindrical structure, and the specific shape of the metal member is not limited herein in the embodiments of the present application. The metal member may be made of iron, but of course, may be made of other metals, for example, steel. The specific type of the metal component is not limited herein.
Additionally, in some embodiments, as shown in fig. 13, the crush feature 70 can include an electro-deformable member 73 and a stop member 74. The electro-deformable member 73 is located on the side of the light guiding film 62 facing away from the imaging chip 50, the blocking member 74 is located on the side of the light guiding film 62 facing towards the imaging chip 50, the electro-deformable member 73 is located opposite to the blocking member 74, and a part of the light guiding film 62 is located between the magnetic member 72 and the electromagnetic coil 71. Alternatively, the electro-deformable member 73 is located on the side of the light guiding film 62 facing the imaging chip 50, the barrier member 74 is located on the side of the light guiding film 62 facing away from the imaging chip 50, the electro-deformable member 73 is located opposite to the barrier member 74, and a portion of the light guiding film 62 is located between the magnetic member 72 and the electromagnetic coil 71. When the electro-deformable member 73 is energized, the electro-deformable member 73 deforms and cooperates with the blocking member 74 to press the light guiding film 62; in the event that the electro-deformable member 73 is de-energized, the electro-deformable member 73 stops deforming, stopping squeezing the light guiding film 62.
When the electro-deformable element 73 is located on one side of the light guide film 62, which is away from the imaging chip 50, the blocking element 74 is located on one side of the light guide film 62, which is toward the imaging chip 50, and the blocking element 74 is opposite to the electro-deformable element 73, at this time, under the condition that the electro-deformable element 73 is electrified, the electro-deformable element 73 is extended, so that the distance between the electro-deformable element 73 and the blocking element 74 is reduced, so that the electro-deformable element 73 and the blocking element 74 interact with each other to press the light guide film 62, so that the light guide liquid 61 in the light guide film 62 flows, and the curvature of the light guide film 62, which is away from the imaging chip 50, changes, and when the curvature of the light guide film 62 changes, the focal length of the camera module changes, that is, the focal length of the camera module is adjusted; under the circumstances of the outage of the electro-deformation piece 73, the electro-deformation piece 73 stops deforming, so that the electro-deformation piece 73 stops extruding the light guide film 62, the curvature of the light guide film 62 deviating from the imaging chip 50 is fixed, and the focal length adjustment of the camera module can be completed.
Similarly, when the electro-deformable element 73 is located on the side of the light guide film 62 facing the imaging chip 50, the blocking element 74 is located on the side of the light guide film 62 facing away from the imaging chip 50, and the blocking element 74 is opposite to the electro-deformable element 73, at this time, under the condition that the electro-deformable element 73 is powered on, the electro-deformable element 73 can extend, so that the distance between the electro-deformable element 73 and the blocking element 74 is reduced, so that the light guide film 62 can be squeezed by the interaction between the electro-deformable element 73 and the blocking element 74, the light guide liquid 61 in the light guide film 62 flows, the curvature of the light guide film 62 facing away from the imaging chip 50 changes, and when the curvature of the light guide film 62 changes, the focal length of the camera module changes, that is, the focal length of the camera module can be adjusted; under the condition that the power of the electro-deformable piece 73 is cut off, the electro-deformable piece 73 stops deforming, so that the electro-deformable piece 73 stops extruding the light guide film 62, namely, the curvature of the light guide film 62 departing from the imaging chip 50 is fixed, and the focal length adjustment of the camera module can be completed.
In addition, in the present embodiment, a third current may be applied to the electro-deformable member 73, so that the electro-deformable member 73 is elongated, and a fourth current may be applied to the electro-deformable member 73, so that the electro-deformable member 73 is shortened. When the electrostrictive element 73 extends, the electrostrictive element 73 can extrude the light guide film 62 to focus the camera module; when the electro-deformable member 73 is shortened, the electro-deformable member 73 stops pressing the light guide film 62, and the light guide film 62 can be restored to the initial state under the action of the light guide liquid 61, that is, the camera module can be restored to the initial focal length.
In addition, in the present embodiment, the electro-deformable member 73 and the circuit board 40 may be electrically connected, and current is supplied to the electro-deformable member 73 through the circuit board 40. Specifically, the electro-deformable member 73 may be electrically connected to the circuit board 40 through the flexible circuit board 40, so that current on the circuit board 40 may flow into the electro-deformable member 73.
In addition, in some embodiments, as shown in fig. 11, the number of the pressing structures 70 is plural, and the plural pressing structures 70 are distributed at intervals in the circumferential direction of the imaging chip 50.
Because a plurality of extrusion structures 70 are distributed along the circumferential direction of the imaging chip 50 at intervals, therefore, a plurality of extrusion structures 70 can extrude the light guide film 62 along the circumferential direction of the imaging chip 50 more uniformly, so that the flow of the light guide liquid 61 in the light guide film 62 can have more regular transformation, and the flow of the light guide liquid 61 can also be accelerated, thereby facilitating the heat transfer of the light guide liquid 61 to the outside of the housing 10. In addition, the plurality of pressing structures 70 may also enable the curvature of the light guiding film 62 facing away from the imaging chip 50 to change more regularly. That is, through setting up a plurality of extrusion structures 70, and with a plurality of extrusion structures 70 along imaging chip 50's circumferential direction interval distribution, not only be favorable to dispelling the heat through leaded light liquid 61 in the leaded light film 62, still be favorable to deviating from imaging chip 50's leaded light film 62's camber law change, and then be favorable to adjusting the focus of camera module.
In addition, in some embodiments, as shown in fig. 7, the base 20 has a boss 21 thereon, the boss 21 surrounds the imaging chip 50 along a circumferential direction of the base 20, the boss 21 extends along a direction from the base 20 to the housing 10, and the boss 21 has a second notch 211 thereon.
When the base 20 has the boss 21, the boss 21 surrounds the imaging chip 50 along the circumferential direction of the base 20, and the boss 21 extends along the direction from the base 20 to the casing 10, so that the base 20 is equivalently provided with an accommodating groove, and the light guide heat dissipation member 60 can be placed in the accommodating groove by the support, thereby avoiding the position of the light guide heat dissipation member 60 from shifting. In addition, the boss 21 has a second notch 211, and the second notch 211 may serve as a heat dissipation channel, that is, the light guide heat sink 60 may pass through the second notch 211 and extend to the external space of the housing 10. That is, by providing the boss 21 and providing the second notch 211 on the boss 21, the positioning of the light guide heat sink 60 can be facilitated, and the heat conduction and the heat dissipation of the light guide heat sink 60 can be facilitated.
In addition, in some embodiments, the light guide liquid 61 has an infrared absorbing medium therein for absorbing infrared rays of the light transmitted into the light guide liquid 61.
When the light guide liquid 61 has the infrared absorption medium therein, at this time, after the light passes through the lens assembly 30, the light may irradiate the light guide film and pass through the light guide liquid 61, and the infrared absorption medium in the light guide liquid 61 may transmit the infrared ray of the light in the light guide liquid 61, so that less infrared rays are included in the light transmitted to the light-sensing surface of the imaging chip 50, thereby facilitating the imaging chip 50 to convert the light into an image, i.e., facilitating the imaging chip 50 to perform imaging.
It should be noted that, in the embodiment of the present application, the infrared absorption medium may be an organic pigment.
In addition, in the embodiment of the present application, an infrared lens may be disposed in the lens assembly 30, and infrared rays in the light passing through the lens assembly 30 are filtered by the infrared lens, so that less infrared rays are included in the light transmitted to the light guide film 62.
In addition, in the embodiment of the present application, when the infrared lens is disposed in the lens assembly 30, an infrared absorption medium may also be disposed in the light guide liquid 61 at the same time, so that the light guide liquid 61 has the infrared absorption medium therein.
In the embodiment of the present application, since the housing 10 is connected to one end of the base 20, the other end of the base 20 is connected to the circuit board 40, the imaging chip 50 is disposed on the circuit board 40, the imaging chip 50 has a photosensitive surface facing the lens assembly 30, and therefore, when the camera module is used for shooting, light can pass through the lens assembly 30 and irradiate on the photosensitive surface of the imaging chip 50, so that the imaging chip 50 converts the light into an image, and the camera module can shoot. Because at least one of the housing 10 and the base 20 has a notch 211, the notch 211 forms a heat dissipation channel, the external space of the housing 10 is communicated with the internal space of the housing 10 through the heat dissipation channel, the light guide heat sink 60 is disposed through the heat dissipation channel, and part of the light guide heat sink 60 is located between the photosensitive surface and the lens assembly 30 and contacts with the photosensitive surface, and another part of the light guide heat sink 60 is located in the external space of the housing 10, when the imaging chip 50 generates heat, the heat is transferred to the light guide heat sink 60, that is, the heat is first transferred to the part of the light guide heat sink 60 contacting with the photosensitive surface, and then the heat is transferred along the light guide heat sink 60, that is, the light guide heat sink 60 conducts the heat and transfers the heat to the part of the light guide heat sink 60 located in the external space of the housing 10, and the heat generated by the imaging chip 50 is finally conducted to the external space of the housing 10 and dissipated, thereby preventing the heat generated by the imaging chip 50 from being collected in the housing 10 and affecting the shooting effect of the camera module. That is, in the embodiment of the present application, by providing the light guide heat sink 60, and contacting part of the light guide heat sink 60 with the photosensitive surface, part of the light guide heat sink 60 is located outside the housing 10, so that the light guide heat sink 60 can conduct the heat generated by the imaging chip 50, the heat generated by the imaging chip 50 is conducted to the outside space of the housing 10, the heat is prevented from being accumulated in the housing 10, and the shooting effect of the camera module can be improved.
The embodiment of the application provides electronic equipment, and the electronic equipment comprises the camera module in any embodiment of the above embodiments.
In the embodiment of the present application, since the housing 10 is connected to one end of the base 20, the other end of the base 20 is connected to the circuit board 40, the imaging chip 50 is disposed on the circuit board 40, the imaging chip 50 has a photosensitive surface facing the lens assembly 30, and therefore, when the camera module is used for shooting, light can pass through the lens assembly 30 and irradiate on the photosensitive surface of the imaging chip 50, so that the imaging chip 50 converts the light into an image, and the camera module can shoot. Because the housing 10 has the first notch and/or the base 20 has the second notch 211, the first notch and/or the second notch 211 forms a heat dissipation channel, the external space of the housing 10 is communicated with the internal space of the housing 10 through the heat dissipation channel, the light guiding heat dissipating member 60 is disposed through the heat dissipation channel, and part of the light guiding heat dissipating member 60 is located between the photosensitive surface and the lens assembly 30 and contacts with the photosensitive surface, and another part of the light guiding heat dissipating member 60 is located in the external space of the housing 10, when the imaging chip 50 generates heat, the heat is transferred to the light guiding heat dissipating member 60, that is, the heat is first transferred to the part of the light guiding heat dissipating member 60 contacting with the photosensitive surface, and then the heat is transferred along the light guiding heat dissipating member 60, that is, the heat is transferred to the part of the light guiding heat dissipating member 60 located in the external space of the housing 10, and then the heat generated by the imaging chip 50 is finally transferred to the external space of the housing 10 and dissipated, thereby preventing the heat generated by the imaging chip 50 from being collected in the housing 10 and affecting the shooting effect of the camera module. That is, in this embodiment of the application, through setting up light guide heat sink 60, and part light guide heat sink 60 contacts with the sensitization surface, part light guide heat sink 60 is located the exterior space of casing 10, thereby light guide heat sink 60 can conduct the heat that imaging chip 50 produced, make the heat that imaging chip 50 produced conducted the exterior space of casing 10, avoid the heat to gather in casing 10, thereby can improve the shooting effect of camera module, and then make the user when using electronic equipment, user's use experience improves.
In addition, in this application embodiment, the electronic device may include a display screen, a virtual key is provided on the display screen, when the light guiding heat dissipating member 60 includes the electromagnetic coil 71, the electric energy introduced into the electromagnetic coil 71 may be adjusted through the virtual key, so as to adjust the focal length of the camera module, and when the light guiding heat dissipating member 60 includes the electro-deformable member 73, the electric energy introduced into the electro-deformable member 73 may also be adjusted through the virtual key, so as to adjust the focal length of the camera module.
It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional identical elements in an article or terminal device comprising the element.
While the technical solutions provided in the present application have been described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, for a person skilled in the art, according to the principles and implementations of the present application, the embodiments and application scope may vary.
Claims (10)
1. The utility model provides a camera module which characterized in that, camera module includes: the lens comprises a shell, a base, a lens component, a circuit board, an imaging chip and a light guide and heat dissipation part;
the shell is connected with one end of the base, the other end of the base is connected with the circuit board, the imaging chip is arranged on the circuit board, and the base surrounds the imaging chip;
the imaging chip has a photosurface, the photosurface faces the lens subassembly, the casing with the breach has on at least one of the bases, the breach forms the heat dissipation channel, leaded light radiating piece wears to locate heat dissipation channel, and part leaded light radiating piece be located the photosurface with between the lens subassembly, and with the photosurface contact, the other part leaded light radiating piece is located the outer space of casing.
2. The camera module according to claim 1, wherein the light guiding heat sink comprises a light guiding liquid and a light guiding film;
the light guide film is coated on the light guide liquid, part of the light guide film is in contact with the photosensitive surface, and part of the light guide film is located in the outer space of the shell.
3. The camera module of claim 2, further comprising an extruded structure;
the extrusion structure is located in the casing, and extrusion structure with leaded light film contact, the extrusion structure is used for the direction extrusion of imaging chip to lens subassembly leaded light film, perhaps the lens subassembly extremely the direction extrusion of imaging chip leaded light film, so that leaded light liquid flows, and makes and deviate from the curvature change of the leaded light film of photosurface.
4. The camera module of claim 3, wherein the extrusion structure comprises an electromagnetic coil and a magnetic member;
the magnetic part is positioned on one side of the light guide film, which is far away from the imaging chip, the electromagnetic coil is positioned on one side of the light guide film, which is far towards the imaging chip, the electromagnetic coil is opposite to the magnetic part, and part of the light guide film is positioned between the magnetic part and the electromagnetic coil;
or the magnetic part is positioned on one side of the light guide film facing the imaging chip, the electromagnetic coil is positioned on one side of the light guide film departing from the imaging chip, the electromagnetic coil is opposite to the magnetic part, and part of the light guide film is positioned between the magnetic part and the electromagnetic coil;
when the electromagnetic coil is electrified, the electromagnetic coil attracts the magnetic piece so that the magnetic piece presses the light guide film;
under the condition that the electromagnetic coil is powered off, the electromagnetic coil stops attracting the magnetic piece, so that the magnetic piece stops pressing the light guide film.
5. The camera module according to claim 4, wherein a metal member is disposed in the electromagnetic coil, and the metal member is used for enhancing the magnetism of the electromagnetic coil when the electromagnetic coil is electrified.
6. The camera module of claim 3, wherein the compression structure comprises an electro-deformable member and a blocking member;
the electro-deformation piece is positioned on one side, away from the imaging chip, of the light guide film, the blocking piece is positioned on one side, facing the imaging chip, of the light guide film, the electro-deformation piece is opposite to the blocking piece in position, and part of the light guide film is positioned between the magnetic piece and the electromagnetic coil;
or the electro-deformable part is positioned on one side of the light guide film facing the imaging chip, the blocking part is positioned on one side of the light guide film facing away from the imaging chip, the electro-deformable part is opposite to the blocking part, and part of the light guide film is positioned between the magnetic part and the electromagnetic coil;
under the condition that the electric deformation piece is electrified, the electric deformation piece deforms and is matched with the blocking piece to extrude the light guide film;
and under the condition that the electric deformation piece is powered off, the electric deformation piece stops deforming and stops extruding the light guide film.
7. The camera module according to claim 3, wherein the number of the pressing structures is plural, and the plural pressing structures are distributed at intervals along a circumferential direction of the imaging chip.
8. The camera module according to claim 1, wherein the base has a boss thereon, the boss surrounds the imaging chip along a circumferential direction of the base, the boss extends along a direction from the base to the housing, and the boss has the second notch thereon.
9. The camera module of any one of claims 1-8, wherein the light-guiding liquid has an infrared absorbing medium therein, and the infrared absorbing medium is configured to absorb infrared rays of the light transmitted into the light-guiding liquid.
10. An electronic device, characterized in that the electronic device comprises the camera module of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953316.7A CN115202134A (en) | 2022-08-09 | 2022-08-09 | Camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953316.7A CN115202134A (en) | 2022-08-09 | 2022-08-09 | Camera module and electronic equipment |
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| CN115202134A true CN115202134A (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210953316.7A Pending CN115202134A (en) | 2022-08-09 | 2022-08-09 | Camera module and electronic equipment |
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| CN210640952U (en) * | 2019-11-14 | 2020-05-29 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN210725022U (en) * | 2019-11-27 | 2020-06-09 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, camera module and electronic equipment |
| CN111314590A (en) * | 2020-03-05 | 2020-06-19 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112887547A (en) * | 2021-01-22 | 2021-06-01 | 维沃移动通信有限公司 | Electronic equipment and camera module |
| US20210325627A1 (en) * | 2020-04-21 | 2021-10-21 | Triple Win Technology(Shenzhen) Co.Ltd. | Lens module and electronic device having the same |
| CN113676631A (en) * | 2021-08-09 | 2021-11-19 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN114640730A (en) * | 2020-12-16 | 2022-06-17 | 宁波舜宇光电信息有限公司 | Camera module and electronic equipment |
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| CN210640952U (en) * | 2019-11-14 | 2020-05-29 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN210725022U (en) * | 2019-11-27 | 2020-06-09 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, camera module and electronic equipment |
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| US20210325627A1 (en) * | 2020-04-21 | 2021-10-21 | Triple Win Technology(Shenzhen) Co.Ltd. | Lens module and electronic device having the same |
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