CN115197461A - Preparation method and application of composite high-elastic foaming beads - Google Patents
Preparation method and application of composite high-elastic foaming beads Download PDFInfo
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- CN115197461A CN115197461A CN202210960373.8A CN202210960373A CN115197461A CN 115197461 A CN115197461 A CN 115197461A CN 202210960373 A CN202210960373 A CN 202210960373A CN 115197461 A CN115197461 A CN 115197461A
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- composite high
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- foaming
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- 238000005187 foaming Methods 0.000 title claims abstract description 58
- 239000002131 composite material Substances 0.000 title claims abstract description 55
- 239000011324 bead Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 47
- 239000010703 silicon Substances 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 230000007306 turnover Effects 0.000 claims abstract description 19
- 239000004743 Polypropylene Substances 0.000 claims abstract description 18
- 229920001155 polypropylene Polymers 0.000 claims abstract description 18
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 15
- -1 polypropylene Polymers 0.000 claims abstract description 14
- 238000012856 packing Methods 0.000 claims abstract description 11
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 9
- 239000011246 composite particle Substances 0.000 claims abstract description 8
- 230000006911 nucleation Effects 0.000 claims abstract description 5
- 238000010899 nucleation Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 22
- 238000005192 partition Methods 0.000 claims description 21
- 238000000926 separation method Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 16
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 10
- 239000012792 core layer Substances 0.000 claims description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical group [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 7
- 230000003139 buffering effect Effects 0.000 abstract description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004064 recycling Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000006261 foam material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920006248 expandable polystyrene Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920006342 thermoplastic vulcanizate Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
- C08J9/122—Hydrogen, oxygen, CO2, nitrogen or noble gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/3415—Heating or cooling
- B29C44/3426—Heating by introducing steam in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/36—Feeding the material to be shaped
- B29C44/38—Feeding the material to be shaped into a closed space, i.e. to make articles of definite length
- B29C44/40—Feeding the material to be shaped into a closed space, i.e. to make articles of definite length by gravity, e.g. by casting
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J2323/12—Polypropene
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- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/36—Silica
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Abstract
The invention provides a preparation method and application of composite high-elastic foaming beads, wherein in the preparation method of the composite high-elastic foaming beads, polypropylene and a nucleation auxiliary agent are mixed, a thermoplastic elastomer and an antistatic auxiliary agent are mixed, two mixed products are extruded through a composite die head to obtain composite particles, and then the composite particles are added into a foaming kettle to prepare the composite high-elastic foaming beads; the application of the prepared composite high-elastic foaming bead comprises the preparation of a composite high-elastic foaming material component and the preparation of a turnover packing box of the photovoltaic silicon wafer by utilizing the composite high-elastic foaming material component. The composite high-elasticity foaming bead prepared by the invention has the advantages of rigidity and buffering protection performance required by packaging, excellent scratch resistance and puncture resistance, and two advantages make up for each other.
Description
Technical Field
The invention belongs to the technical field of silicon wafer packaging in the photovoltaic industry, and particularly relates to a preparation method and application of composite high-elasticity foaming beads.
Background
The silicon chip is the most important component in the photovoltaic industry, is the bottom layer carrier of the cell, is extremely thin in thickness and is easy to crack under the action of external force, so that the packaging of the photovoltaic silicon chip is particularly important. The existing silicon chip package mostly adopts a hollow plate to clamp a certain amount of silicon chips in the middle, and a PE film or a PE bag is wound on the silicon chip package, then the silicon chip package is placed in a buffer package made of foamed polystyrene (EPS) or pearl wool (EPE), and finally the silicon chip package is placed in a common carton and is sealed by tape adhesion. The packaging mode has more material types and operation steps, and is not beneficial to realizing automatic packaging.
At present, people redesign the silicon wafer package, and the integrated EPP material is adopted to replace the traditional buffer material, carton, adhesive tape and the like, so that the packaging process is simplified, and the silicon wafer packaging efficiency and the recycling efficiency are greatly improved. However, the EPP material is a hard foaming material, and the surface of the EPP material is a thin PP material, so that the scratch resistance, the puncture resistance and the like are poor. In the process of packaging and transporting, the silicon wafer with sharp edge and the EPP inevitably rub and collide, so that the surface of an EPP part is very easy to scratch, even the silicon wafer is embedded into the EPP package, and finally the damage rate of the silicon wafer is influenced; secondly, scraping the surface of the EPP package, namely, the surface of the EPP package is slightly damaged, so that the EPP package is not beneficial to cleaning, and the number of times of circulating is greatly reduced; meanwhile, for the packaging requirements of different silicon wafer manufacturers, the inner partition in the design is of a fixed size, and the universality is poor.
Disclosure of Invention
The invention aims to provide a preparation method and application of composite high-elasticity foaming beads, which are characterized in that a high-resilience foaming material is developed from the material research and development angle, the problems of poor scratch resistance and puncture resistance of an EPP (expanded polypropylene) material are solved, the material is made into a member made of the high-elasticity foaming material and then made into a turnover packing box for photovoltaic silicon wafers, the recycling times are effectively increased, and the packing universality and the automatic adaptability of a box body are improved.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: the composite high-elasticity foamed bead comprises a skin layer and a core layer, wherein the skin layer is a thermoplastic elastomer, and the core layer is polypropylene; the composite high-elastic foaming bead is prepared by the following steps:
firstly, mixing polypropylene and a nucleating aid, mixing a thermoplastic elastomer and an antistatic aid, and extruding two mixed products through a composite die head to obtain composite particles;
and step two, adding the composite particles into a foaming kettle, introducing carbon dioxide gas by taking water as a medium, setting the target temperature to be 148-149 ℃ and the target pressure to be 3.0-3.2MPa, raising the temperature and the pressure, and opening a foaming valve after the set conditions are met to obtain the composite high-elasticity foaming beads.
The melting point of the polypropylene is 142-148 ℃.
The nucleation auxiliary agent is calcium carbonate, zinc borate, barium sulfate or silicon dioxide.
The nucleating aid is added in the form of spherical powder, and the addition amount is 500-1200ppm.
The thermoplastic elastomer is one of TPU, TPS, TPO, TPV and PA.
The thickness of the skin layer is 8-12 μm.
The invention also provides specific applications of the composite high-elastic expanded beads prepared by the method, which comprise the following two applications.
The first application is as follows: a preparation method of a composite high-elastic foaming material component comprises the steps of firstly, keeping the composite high-elastic foaming beads prepared by the method under the prepressing pressure of 0.5MPa for 12 hours, then conveying the beads into a die cavity of forming equipment through a pipeline, introducing steam for hot press forming, and placing the obtained product in a drying room at the temperature of 80 ℃ for 12 hours to obtain the composite high-elastic foaming material component.
The second application is as follows: a turnover packaging box for photovoltaic silicon wafers comprises a box body and a cover, wherein the top of the box body is open, and the box body and the cover are both composite high-elastic foaming material components in the first application; the box body is internally provided with a baffle, two side plate surfaces of the baffle and the inner wall of the box body opposite to each side plate surface are respectively provided with a plurality of partition grooves with equal intervals, and baffle plates for separating spaces are inserted into the two opposite partition grooves; the separation groove of the inner wall of the box body is arranged on a lining plate which is integrally formed with the box body, the heights of the lining plate and the separation baffle are equal, the heights of the lining plate and the separation baffle are all lower than the edge of the top of the box body, the length and width of the cover are matched with the length and width of the inner side of the edge of the top of the box body, and the periphery of the cover is supported on the tops of the lining plate and the separation baffle.
The bottom of the box body is provided with a fork groove which is convenient for the fork leg of the pallet fork to enter and exit, and the edge of the top opening of the box body is provided with an upper notch which vertically corresponds to the fork groove; the lateral surface of box is provided with and snatchs the recess, the box of being convenient for manual work or manipulator take.
The cover is provided with an uncovering groove convenient to take and place.
The beneficial effects of the invention are: the invention develops a special packaging material for photovoltaic silicon wafers, namely composite high-elastic foaming beads. The composite high-elasticity foaming bead combines the unique mechanical property (having rigidity and buffering protection property required by packaging) of the EPP material and the excellent scratch resistance and puncture resistance of the high-resilience material, and has advantages in two aspects, and the prepared photovoltaic silicon wafer packaging box has the advantages of greatly improving the universality, the protection, the automatic adaptability, the convenience, the recycling property and other properties through unique structural design.
The invention compounds the elastomer on the material skin, greatly improves the surface wear resistance of the packaging box body, greatly enhances the wear resistance of the inevitable friction phenomenon generated in the silicon wafer transportation process compared with the traditional packaging scheme, correspondingly prolongs the cycle service cycle of the silicon wafer, and is beneficial to the sustainable utilization of resources.
The composite high-elastic foaming bead has extremely wide temperature resistance range from-40 ℃ to 80 ℃, can adapt to various extremely cold or extremely hot storage and transportation environments, provides enough protection for photovoltaic silicon wafers, and has more benefits for reducing the breakage rate of the silicon wafers.
The partition in the box body is designed into a movable structure, so that on one hand, the yield in the molding production process can be improved, and on the other hand, the proper partition span can be selected according to the silicon wafer packaging modes with different layers, so that the packaging universality is stronger.
The turnover packaging box body for the photovoltaic silicon wafers, which is designed by the invention, has the advantages that all automatic packaging modes in the existing packaging process are taken into consideration on the peripheral structure, the direct replacement of the box body can be completed without changing an automatic production line by a manufacturer, the replacement cost of a circulating turnover box adopted by a silicon wafer related enterprise is reduced, the integral replacement of the whole silicon wafer industry is facilitated, and the universality is strong.
Drawings
FIG. 1 is a schematic structural view of the turnaround packaging box of the present invention;
FIG. 2 is a top view of the case;
FIG. 3 is a bottom view of the case;
FIG. 4 is a schematic view of the structure of the cover;
FIG. 5 is a schematic view of the structure of the partition;
the labels in the figure are: 1. the box body, 2, the cover, 3, the grabbing groove, 4, the fork groove, 5, the support legs, 6, the label clamping position, 7, the partition, 8, the cover opening groove, 9, the partition groove, 10, the lining plate, 11, the upper notch, 12 and the longitudinal partition plate.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and examples, but the invention is not limited thereto.
The invention provides a composite high-elastic foaming bead which is used for manufacturing a component made of a composite high-elastic foaming material, and then the component is manufactured into a turnover packaging box of a photovoltaic silicon wafer.
Example 1: the composite high-elasticity foaming bead is of a composite structure and comprises a skin layer and a core layer, wherein the skin layer is a high-resilience thermoplastic elastomer, such as one of a polyurethane material (TPU), a styrene thermoplastic elastomer (TPS), an olefin thermoplastic elastomer (TPO, TPV) or a nylon elastomer (PA), the thickness of the skin layer is controlled to be 8-12 mu m, and the core layer is polypropylene (PP) with high melt strength and a melting point of 142-148 ℃.
The high-resilience thermoplastic elastomer material is used as the skin layer, so that the forming pressure in the bead welding process can be reduced, a better elastic protection film layer can be formed on the surface of a formed part, excellent surface resilience performance is given to packaging, and the scraping resistance of a packaging product is greatly improved.
The preparation method of the composite high-elastic foaming bead and the corresponding component comprises the following steps:
the method comprises the following steps: carrying out screw mixing on polypropylene with high melt strength and a nucleation auxiliary agent (the addition amount is 500-1200ppm, inorganic spherical powder), mixing a thermoplastic elastomer and an antistatic auxiliary agent through screws, connecting two sets of screw mixing equipment in parallel, and extruding through a composite die head to obtain composite particles (the single weight is 1.8 +/-0.1 mg);
step two: adding the composite particles into a foaming kettle, introducing carbon dioxide by taking water as a medium, setting the target temperature to be 148-149 ℃ and the target pressure to be 3.0-3.2MPa, raising the temperature and the pressure, opening a foaming valve after the set conditions are reached, and obtaining the composite high-elasticity foaming beads due to the fact that the carbon dioxide in the particles is rapidly gasified and expanded at the moment when the particles enter the atmospheric pressure;
step three: the composite high-elastic foaming beads prepared in the last step are firstly subjected to a prepressing process (keeping at 0.5MPa for 12 hours), then conveyed into a die cavity of forming equipment through a pipeline, introduced with steam for hot-press forming, and the obtained finished piece is placed in a drying room at 80 ℃ for 12 hours to obtain a component made of the composite high-elastic foaming material.
The nucleation auxiliary agent in the step one is calcium carbonate, zinc borate, barium sulfate or silicon dioxide. The antistatic auxiliary agent is an internal addition type permanent antistatic agent, a non-ionic antistatic agent, such as ethoxylated alkylamine or a composite auxiliary agent of several antistatic agents.
Furthermore, the thermoplastic elastomer is selected from thermoplastic polyurethane elastomer (TPU), the thickness of the skin layer of the composite high-elasticity foaming bead is controlled to be 8 mu m, and the core layer is polypropylene (PP) with high melt strength and the melting point of 145 ℃; foaming on ETPU foaming equipment of new Wudao stone material Co., ltd (foaming temperature: 148.2, foaming pressure: 3.0 MPa) to obtain composite high-elastic foamed beads with bulk density of 55-60 g/L.
Example 2: as shown in fig. 1-5, a turnover packaging box for photovoltaic silicon wafers comprises a box body 1 and a cover 2, wherein the top of the box body 1 is open, and the box body 1 and the cover 2 are both composite high-elastic foam material members prepared in example 1.
The box body 1 is designed to be open at the top and is integrally rectangular, a lining plate 10 lower than the side wall is arranged on the inner side of the side wall of the box body 1, the part, located above the lining plate 10, of the side wall of the box body 1 is defined as a box body top opening edge, the thickness of the side wall below the box body top opening edge is equal to that of the bottom of the box body and is marked as delta, the delta is 35-65mm, and the thickness of the box body top opening edge is delta/2.
Two upper notches 11 are respectively arranged on the front side and the rear side of the top opening edge of the box body 1, the bottom of the box body 1 is provided with support legs 5 with length and width dimensions smaller than those of the box body, two fork grooves 4 which are communicated from front to rear are arranged on the support legs 5, and the two fork grooves 4 are used for fork legs of a forklift to enter for transporting turnover packing boxes. The upper notch 11 and the fork groove 4 are correspondingly arranged up and down.
The length and width of the whole supporting leg 5 are consistent with the length and width of the inner side of the top opening of the box body and are also consistent with the length and width of the cover 2, and when two turnover packing boxes are stacked up and down, the fork grooves 5 of the upper box body are aligned with the upper notches 11 of the lower box body.
The outer side of the side wall of the box body 1 is also provided with a sunken label clamping position 6, the label clamping position 6 is close to the upper edge of the box body and is positioned in the middle of the long edge, and the overall size of the label clamping position 6 is 30mm multiplied by 50mm multiplied by 1mm.
As shown in fig. 1 and 2, a longitudinal partition plate 12 parallel to the long side of the box body 1 is arranged at the center of the box body 1 in the width direction, separation grooves 9 are uniformly distributed at intervals along the length direction of the box body 1 on the two sides of the longitudinal partition plate 12 and a lining plate 10 opposite to the longitudinal partition plate 12, the width of each separation groove 9 is 0.8-1.2mm, the depth of each separation groove 9 is 10-15mm, and the interval between every two adjacent separation grooves 9 is 10-20mm. The separation bars 7 are arranged in the opposite separation grooves 9, the separation bars 7 are used for separating the box body 1 into spaces containing silicon wafers with different sizes, and the positions of the separation bars can be adjusted according to the number of the placed silicon wafers. And the height and width of the whole barrier 7 arranged in the separation groove 9 are increased by 0.8-1.5mm on the basis of the size of the silicon chip arranged so as to avoid the abrasion of the edge of the silicon chip.
Furthermore, the separation groove 9 is provided with a boss in the vertical direction, the vertical depth of the groove part above the boss is 15-45mm, and the corresponding separation rail 7 is T-shaped as a whole, as shown in fig. 4.
The cover 2 is a flat plate, the thickness of the flat plate is consistent with the depth of the top opening edge of the box body, and the cover 2 can be supported at the top end of the lining plate 10 after covering the top opening edge of the box body. As shown in fig. 5, an uncapping groove 8 is provided in a position centered between the two long sides of the lid 2 so as to reach into the uncapping groove 8 to remove the lid 2, and the uncapping groove 8 has a width of 30-50mm along the long side of the lid 2 and a depth of 30-50mm along the wide side of the lid 2.
Example 3: according to the preparation method of the composite high-elastic foamed bead in the embodiment 1, the thermoplastic polyurethane elastomer (TPU) is used as a skin layer, the thickness of the TPU is controlled to be 8 mu m, the polypropylene (PP) with high melt strength and a melting point of 145 ℃ is used as a core layer, and after foaming is carried out on ETPU foaming equipment of Tandotorless New Material Co., ltd (foaming temperature: 148.2 and foaming pressure of 3.0 MPa), the high-elastic foamed bead with bulk density of 55-60g/L is obtained; and molding the high-elastic foaming beads by using specific molding equipment to obtain the silicon wafer turnover box made of the high-elastic foaming material.
According to the packaging requirements of 166 type silicon wafers (size: 166mm is 166 mm), the overall size of the box body of the turnover packaging box is 748.8mm is 441.6mm is 212.8mm, the thicknesses of the bottom surface of the box body 1 and the inner wall with the lining plate 10 are 36mm, the thickness of the opening edge at the top of the box body is 18mm, the width of the grabbing grooves 3 at the left side and the right side of the outer side of the box body 1 is 220mm, the depth of the grabbing grooves 3 at the front side and the rear side of the outer side of the box body 1 is 9mm, and the depth of the grabbing grooves 3 at the front side and the rear side of the outer side of the box body 1 is 500 mm; the thickness of the longitudinal partition plate 12 in the box body is 36mm; the partition grooves 9 are arranged on the longitudinal partition plates 12 and the longitudinal lining plates 10 at intervals, a total of 84 partition grooves 9 are arranged, the intervals among the partition grooves 9 are 15mm, the width of each partition groove 9 is 0.8mm, the depth in the horizontal direction is 15mm, and the vertical depth of the part above the boss in each partition groove 9 is 35mm. The separating groove 9 is used for placing the barrier 7, the barrier 7 is in a T-shaped shape and is adaptive to the size and the shape of the separating groove 9, the height and the width of the barrier 7 placed in the separating groove 9 are 166.8mm, and the embodiment totally needs 42 barriers.
The height of the top opening edge of the box body is 10mm, and the size of the cover 2 is consistent with the size of the inner side of the top opening edge of the box body and is consistent with the outline size of the bottom foot 5 of the box body 1, and is 676.8mm multiplied by 369.6mm multiplied by 10mm. The cover opening grooves 8 formed in the front and rear long sides of the cover 2 are 30mm wide and 30mm deep.
After the 166-type silicon wafers are packaged in the turnover box and the traditional packaging box adopted in the embodiment, the test and comparison are carried out, and the results are shown in the following table:
it can be seen from the above table that the turnover packing box for 166 type photovoltaic silicon wafers prepared by the embodiment has great promotion in the aspects of surface scratch resistance, applicable environment, packing convenience and the like compared with the traditional packing scheme. The specific analysis is as follows:
(1) In the embodiment, the composite high-elasticity foaming material is innovatively developed, and a test is performed according to ASTM C1353-2009 (an H18 grinding wheel and a load of 500g are adopted), so that the turnover packaging box made of the composite high-elasticity foaming material still has no damage after 500 turns, and is obviously superior to the traditional buffer materials such as foamed polypropylene (EPP), EPS, pearl wool and the like; when a single silicon chip is directly used for a scraping test, the composite high-elasticity foam material can bear more than 25 ten thousand times and is far higher than other materials; in conclusion, the material used in the embodiment has both rigidity and high elasticity, so that the wear resistance and the scratch resistance of the surface of the prepared turnover box are obviously improved.
(2) The performance of this embodiment material has further been testified in the test of resilience ability and has promoted, especially when sharp-edged silicon chip and box contact, the produced high resilience of excellent resilience performance can ensure the integrality of box surface, is showing the rate of recovery use that improves the case, and the number of times of recycling of this turnover case has reached nearly triple of the integrative case of EPP promptly, is nearly fifty times of pearl cotton, EPS material, does benefit to the sustainable use who realizes the packing resource.
(3) Due to the addition of the TPU material, the application temperature is further widened (-40 to 80 ℃), and the material is more suitable for various extreme use environments compared with the traditional material, so that the safety of silicon wafer packaging is ensured; in the process of repeated trial assembly road test of the silicon wafer, the breakage rate of the silicon wafer obtained by calculation is far lower than that of all the current packaging schemes by recording the breakage condition of the silicon wafer.
(4) The elastic body material has larger deformation under the action of external force than other materials. However, in the embodiment, PP is innovatively used as a core layer, TPU is only used as a skin layer, and the functions of bonding and adjusting the surface resilience performance are provided, so that the deformation amount of the product is equivalent to that of EPS with high rigidity under the condition of ultimate stacking, and the product is superior to EPP and pearl wool materials; the traditional EPS and pearl cotton package needs to be matched with a corrugated carton on the outside, so that specific stacking data cannot be provided.
In other words, the single high-resilience foam material is also adopted for manufacturing the box body in the embodiment, and the comprehensive performance (the recycling performance, the surface wear resistance, the breakage rate of silicon wafer packaging, the convenience of packaging operation and the like) of the box body is far better than that of the existing silicon wafer packaging scheme. Meanwhile, the automatic packing procedure is carried and placed in the box body conveying process except the crawler conveying process. The automation section that prior art was placed in the transport mainly adopts the mode of pressing from both sides armful or fork foot or sucking disc to realize. In the embodiment, the four side surfaces of the box body, namely the front side surface, the rear side surface, the left side surface and the right side surface, are provided with grooves, so that the mechanical arm can clamp or grab by a sucker from all directions; and the groove at the bottom of the box body and the notch at the upper edge can be used for the fork foot of the mechanical arm to smoothly enter for extraction. The design points are designed for the intervention of an automatic production line while considering manual carrying.
The above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the same, and it should be understood by those of ordinary skill in the art that the specific embodiments of the present invention can be modified or substituted with equivalents with reference to the above embodiments, and any modifications or equivalents without departing from the spirit and scope of the present invention are within the scope of the claims to be appended.
Claims (10)
1. A preparation method of composite high-elastic foaming beads is characterized by comprising the following steps: the composite high-elastic foaming bead comprises a skin layer and a core layer, wherein the skin layer is a thermoplastic elastomer, and the core layer is polypropylene; the composite high-elastic foaming bead is prepared by the following steps:
mixing polypropylene and a nucleating aid, mixing a thermoplastic elastomer and an antistatic aid, and extruding two mixed products through a composite die head to obtain composite particles;
and step two, adding the composite particles into a foaming kettle, introducing carbon dioxide gas by taking water as a medium, setting the target temperature to be 148-149 ℃ and the target pressure to be 3.0-3.2MPa, raising the temperature and the pressure, and opening a foaming valve after the set conditions are met to obtain the composite high-elasticity foaming beads.
2. The method for preparing composite high-elastic expanded beads according to claim 1, wherein the method comprises the following steps: the melting point of the polypropylene is 142-148 ℃.
3. The method for preparing composite high-elastic foamed beads according to claim 1, wherein the method comprises the following steps: the nucleation auxiliary agent is calcium carbonate, zinc borate, barium sulfate or silicon dioxide.
4. The method for preparing composite high-elastic expanded beads according to claim 3, wherein the method comprises the following steps: the nucleating aid is added in the form of spherical powder, and the addition amount is 500-1200ppm.
5. The method for preparing composite high-elastic foamed beads according to claim 1, wherein the method comprises the following steps: the thermoplastic elastomer is one of TPU, TPS, TPO, TPV and PA.
6. The method for preparing composite high-elastic expanded beads according to claim 1, wherein the method comprises the following steps: the thickness of the skin layer is 8-12 μm.
7. A preparation method of a composite high-elastic foaming material component is characterized by comprising the following steps: firstly, keeping the composite high-elastic foaming beads prepared by the method of any one of claims 1 to 6 under a pre-pressing pressure of 0.5MPa for 12 hours, then conveying the beads into a die cavity of a forming device through a pipeline, introducing steam for hot press forming, and placing the obtained product in a drying room at 80 ℃ for 12 hours to obtain a composite high-elastic foaming material component.
8. The utility model provides a turnover packing box of photovoltaic silicon chip, includes box and lid, and the box top is uncovered, its characterized in that: the box body and the cover are both the composite high-elasticity foaming material component in claim 7; the box body is internally provided with a baffle, two side plate surfaces of the baffle and the inner wall of the box body opposite to each side plate surface are respectively provided with a plurality of partition grooves with equal intervals, and baffle plates for separating spaces are inserted into the two opposite partition grooves; the separation groove of box inner wall sets up on a welt with box integrated into one piece, the welt equals with the height that separates the shelves, all is less than the mouth edge at box top, the length and width size of lid and the length and width size of box top mouth edge inboard are identical, support all around of lid is in the top of welt and separation shelves.
9. The turnover packaging box for photovoltaic silicon wafers as claimed in claim 8, wherein: the bottom of the box body is provided with a fork groove which is convenient for the fork leg of the pallet fork to enter and exit, and the edge of the top opening of the box body is provided with an upper notch which is vertically corresponding to the fork groove;
the lateral surface of box is provided with and snatchs the recess, the box of being convenient for manual work or manipulator take.
10. The packaging box for the turnover of photovoltaic silicon wafers as claimed in claim 8, wherein the packaging box comprises: the cover is provided with an uncovering groove convenient to take and place.
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| CN202210960373.8A CN115197461A (en) | 2022-08-11 | 2022-08-11 | Preparation method and application of composite high-elastic foaming beads |
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Application publication date: 20221018 |