CN115194955A - Ultra-precision machining method for silicon carbide ceramic deep small holes - Google Patents
Ultra-precision machining method for silicon carbide ceramic deep small holes Download PDFInfo
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- CN115194955A CN115194955A CN202210988689.8A CN202210988689A CN115194955A CN 115194955 A CN115194955 A CN 115194955A CN 202210988689 A CN202210988689 A CN 202210988689A CN 115194955 A CN115194955 A CN 115194955A
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- 238000003754 machining Methods 0.000 title claims abstract description 45
- 239000000919 ceramic Substances 0.000 title claims abstract description 44
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 23
- 239000000428 dust Substances 0.000 claims description 10
- 239000000110 cooling liquid Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010892 electric spark Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011226 reinforced ceramic Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
An ultra-precision machining method for silicon carbide ceramic deep small holes belongs to the technical field of machining, and specifically comprises the following steps: firstly, fixing a silicon carbide ceramic block on an ultrasonic auxiliary grinding machine tool; step two, processing a plurality of deep small holes I with the same diameter as the cutter under the action of axial ultrasonic vibration, and reserving allowance I; the feeding speed of the cutter is 25-35mm/min, the rotating speed of the main shaft is 6000-10000rpm, the feeding speed is reduced to 20mm/min at an inlet, and the rotating speed of the main shaft is increased to 10000rpm; step three, reducing the feeding speed to 20mm/min at the outlet, increasing the rotating speed of the main shaft to 10000rpm, and reserving a margin II; and step four, removing the allowance I and the allowance II under the action of axial ultrasonic vibration, wherein the feeding speed of the cutter is 15-20mm/min, the rotating speed of a main shaft is 8000-10000rpm, and thus obtaining the silicon carbide ceramic deep small hole II.
Description
Technical Field
The invention belongs to the technical field of machining, and particularly relates to an ultra-precision machining method for silicon carbide ceramic deep small holes.
Background
There are many different classification methods for engineering materials, and a more scientific method is to classify materials according to their nature or the nature of their binding bonds. Engineering materials are generally classified into four categories, namely ceramic materials, metal materials, high polymer materials and composite materials. Among them, ceramic materials are the earliest materials used by people. In recent years, engineering ceramic materials have a great number of engineering advantages such as high strength, corrosion resistance, abrasion resistance, ablation resistance and strong oxidation resistance, and are increasingly widely applied to strategic emerging industrial fields such as aerospace, electronic information, new energy, energy conservation, environmental protection, ocean engineering, bioengineering, new materials and the like besides the traditional industries such as machinery, chemical engineering, metallurgy and the like, which is a new growth point of the development of the engineering ceramic industry and greatly promotes the development of human science and technology. In the field of aerospace, materials are mostly used in extreme harsh environments such as ultrahigh temperature, ultrahigh vacuum and strong irradiation, so that the materials are required to have the characteristics of high specific strength, high specific modulus, high temperature resistance, ablation resistance and the like. Many ceramic fiber reinforced ceramic matrix composites have become indispensable materials for rocket nozzles, thrust chambers, etc., and are increasingly used especially for complex housings with numerous pore systems (such as housings of aircraft engines, etc.). The engineering ceramic material has excellent performance, and the processing difficulty is determined. The engineering ceramic material has the characteristics of high brittleness, low fracture toughness and the like, so that the engineering ceramic material is easy to generate defects such as a deformation layer, microcracks, residual stress and the like in the processing process,the presence of these factors also limits the use and further development of engineered ceramic materials to some extent. The silicon carbide ceramic has excellent normal-temperature mechanical properties such as higher bending strength, oxidation resistance, corrosion resistance, abrasion resistance and low friction coefficient, and also has good high-temperature mechanical properties (strength, creep resistance and the like), and is widely applied in the fields of aerospace, electronic communication, biomedical treatment and the like, so that the research on the high-efficiency processing technology of the silicon carbide ceramic material in the direction of deep small holes is particularly important. The common deep small hole processing technology of the engineering ceramics has great operation difficulty, and the processing quality and the processing efficiency are difficult to ensure, which is caused by the structure of the deep small hole and the attribute of the processing material. In general mechanical drilling, the length of a hole machining tool is always larger than the diameter of a hole, deformation is easily generated under the action of cutting force, and thus machining quality and machining efficiency are affected, and the use of a slender drill bit causes the rigidity and strength of the hole machining tool to be reduced, torque resistance to be poor, deflection and vibration to be easily generated, and the influence on machining precision is not negligible [1-2] . The engineering ceramic material has the problems of small linear expansion coefficient, high hardness, easy generation of cracks, poor tensile and impact resistance, easy generation of overlarge edge breakage, low precision and the like, belongs to a typical hard and brittle material which is difficult to process, and the surface quality which meets the requirements is difficult to realize by common mechanical processing.
At present, there are about 50 kinds of processing methods for small holes. The most important of the methods are drilling, electric spark perforation, electrolytic machining, electric spark-electrolytic combined machining, laser machining, electron beam machining and ultrasonic machining. The drilling machining has large tool loss, and is not suitable for deep small hole machining on difficult-to-machine materials; the electric spark perforation is a main processing method for processing a deep hole with a large depth-diameter ratio, can process any conductive material, but has the problems of difficult heat dissipation, chip removal and guidance, low processing precision and the like along with the increase of the processing depth of the hole, and the hole wall often has microcracks, a heat affected zone and a recasting layer; electrolytic machining also belongs to non-contact machining, the machined hole wall has no defects of recast layer, microcrack and the like, but the electrolytic machining is not environment-friendly and has low machining efficiency(ii) a The laser processing precision and the surface roughness are not ideal enough, and the surface has a recast layer [3] 。
[1] Ma Mingjun, wang Dexin an ultra-deep small hole electro-discharge machining process using electrochemical passivation polarization [ J ] electromachining and dies 2015 (S1): 54-58.
[2] Gong Qi, shen Jingfeng, xie Jianlin, progress on processing and application of engineered ceramic materials [ J ] Artificial crystallography, 2016,45 (07): 1898-1905.
[3] Huang Shaofu, yang Pan, li Jun deep orifice machining methods overview [ J ] Machine Tool and Hydraulic pressure, 2019,47 (5): 151-155.HuANG shaofu, YANG Pan, LI Jun. Review of deep holes machining [ J ] Machine Tool and Hydraulijcs, 2019,47 (5): 151-155.
Disclosure of Invention
In order to solve the problems in the background technology, the invention provides the ultra-precision machining method of the silicon carbide ceramic deep and small hole, which has the characteristics of high efficiency, low damage, low surface roughness, better inlet and outlet quality and the like, can obviously improve the edge breakage phenomenon at the outlet of the deep and small hole, and is an efficient machining technology for machining the deep and small hole of the engineering ceramic material.
In order to achieve the purpose, the invention adopts the following technical scheme:
an ultra-precision processing method of silicon carbide ceramic deep small holes comprises the following steps:
firstly, grinding and polishing a silicon carbide ceramic block, and fixing the silicon carbide ceramic block on an ultrasonic auxiliary grinding machine tool;
step two, processing a plurality of deep small holes I with the same diameter as the cutter under the action of axial ultrasonic vibration, and reserving allowance I; the plurality of deep small holes I are uniformly distributed in the center of a deep small hole II to be processed and are mutually overlapped, the feeding speed of a cutter is 25-35mm/min, the rotating speed of a main shaft is 6000-10000rpm, the feeding speed is reduced to 20mm/min at an inlet, and the rotating speed of the main shaft is increased to 10000rpm;
step three, reducing the feeding speed to 20mm/min at the outlet, increasing the rotating speed of the main shaft to 10000rpm, and reserving a margin II;
and step four, removing the allowance I and the allowance II under the action of axial ultrasonic vibration, wherein the feeding speed of the cutter is 15-20mm/min, the rotating speed of a main shaft is 8000-10000rpm, and the silicon carbide ceramic deep small hole II is obtained.
Further, the width d of the margin II 2 Width d greater than margin I 1 And the allowance I and the allowance II are in a ladder shape.
Further, the width d of the margin II 2 Height d from the remainder II 3 The same is true.
And further, in the third step, the diameter of the through hole processed at the outlet of the deep small hole II to be processed is the same as that of the cutter.
Further, the depth-to-diameter ratio of the deep small hole II to be processed is larger than 5.
Further, in the second step, the amplitude of the cutter is 4-5 μm.
Further, each step of grinding process uses water-based cooling liquid to cool the workpiece and remove abrasive dust at the same time.
Further, the cutter used was a nickel-based plated diamond cutter.
Compared with the existing method for processing the silicon carbide ceramic deep small hole, the method has the following advantages that:
1. the invention adopts an ultrasonic auxiliary grinding method, can further effectively reduce the surface roughness and the cutting force on the basis of the traditional grinding, the feeding speed is 150mm/min-550mm/min when the ceramics are processed by the ultrasonic auxiliary grinding in the existing records, the rotating speed of a main shaft is 2500-5000r/min, micro cracks and shallow inclined cracks caused by micro crushing can be generated, and the silicon carbide ceramic deep small holes with higher quality and the depth-diameter ratio of more than 5 can be obtained by adopting the technical parameters in the invention.
2. The processing track of the tool recorded by the invention considers the strength and hardness of the tool when grinding hard and brittle materials, can reduce the deformation of a grinding wheel under the action of cutting force, and improves the processing quality and the processing efficiency.
3. The invention can obtain better quality of the inlet and the outlet of the small hole when processing the silicon carbide ceramic deep small hole, and obviously improve the edge breakage phenomenon.
Drawings
FIG. 1 is a schematic structural view of a cutting tool according to the present invention and a silicon carbide ceramic workpiece;
FIG. 2 is a schematic view showing the processing of a small deep hole I in example 1 of the present invention;
FIG. 3 is a schematic view of the shape of the workpiece after step 2 in example 1 of the present invention;
fig. 4 is a schematic structural view of the stepped margin ii after step 3 in embodiment 1 of the present invention;
the tool comprises a tool 1, a silicon carbide ceramic workpiece 2, a deep small hole I, a deep small hole II, a deep small hole 5, a allowance I, a allowance II, a allowance 7 and a through hole 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
Detailed description of the invention
In the present embodiment, the deep small holes Kong Jiwei are deep small holes ii 4 to be processed.
An ultra-precision processing method of silicon carbide ceramic deep small holes comprises the following steps,
the method comprises the following steps: grinding and polishing the silicon carbide ceramic workpiece 2, placing the silicon carbide ceramic workpiece on an ultrasonic auxiliary grinding machine tool, completely fixing the workpiece by using a V-shaped block, and installing a nickel-based electroplated diamond cutter on a cutter handle;
step two: firstly, roughly machining a deep small hole II 4 on a silicon carbide ceramic workpiece 2 along the track of a cutter under the action of axial ultrasonic vibration, namely determining the track of the deep small hole II 4 according to the size of the deep small hole II 4 and the size of a grinding cutter, firstly machining a plurality of deep small holes I3 with the same diameter as the cutter 1, reserving a margin I5, uniformly distributing the plurality of deep small holes I3 at the center of the deep small hole II 4 to be machined, and mutually overlapping, wherein the feeding speed of the cutter 1 is 25mm/min-35mm/min, the rotating speed of a main shaft is 6000rpm-10000rpm, the amplitude is 4 mu m-5 mu m, properly reducing the feeding speed at an inlet, increasing the rotating speed of the main shaft to 10000rpm, reducing the feeding speed to 20mm/min, cooling by using water-based cooling liquid in the grinding process, and simultaneously removing abrasive dust.
Step three: properly reducing the feeding speed at an outlet, increasing the rotating speed of a main shaft to 10000rpm, reducing the feeding speed to 20mm/min, cooling by using water-based cooling liquid in the grinding process, simultaneously removing abrasive dust, and reserving a margin II 6, wherein the width of the margin II 6 is larger than that of the margin I5, and the margin II 6 and the margin I5 are in a step shape; preferably, the diameter of the through hole at the outlet is the same as the diameter of the tool 1, and the width and height of the margin II 6 are the same.
Step four: carrying out finish machining on the silicon carbide ceramic workpiece 2 along a cutter track (the contour line of a deep small hole II to be machined) under the action of axial ultrasonic vibration, wherein the feed speed of a cutter 1 is 15-20mm/min, the rotating speed of a main shaft is 8000-10000rpm, and the residual machining allowance I5 in the second step is removed; cooling by using water-based cooling liquid in the grinding process, and removing abrasive dust;
step five: carrying out finish machining on the silicon carbide ceramic workpiece along a cutter track (the contour line of a deep small hole II to be machined) under the action of axial ultrasonic vibration, wherein the feed speed of a cutter is 15-20mm/min, the rotating speed of a main shaft is 8000-10000rpm, the stepped allowance II 6 at an outlet is removed, water-based cooling liquid is used for cooling in the grinding process, and meanwhile, abrasive dust is removed; and finally obtaining the high-quality deep small hole II 4. The purpose of setting the stepped allowance II 6 is to reduce edge breakage at the outlet and improve the quality of the outlet.
Processing the processed deep small hole II 4 by using a low-speed cutting machine, and cutting the deep small hole II 4 along the diameter direction of the deep small hole II 4; and measuring the surface roughness of the inner surface of the cut deep pore II 4 by using a confocal microscope.
The ultrasonic vibration is axial in the grinding process, the cutting force and the surface roughness can be reduced to a certain extent due to the existence of the ultrasonic vibration amplitude, but the surface defects which are not negligible are caused when materials are removed due to the overlarge ultrasonic vibration amplitude, the surface quality is reduced, and the surface roughness is increased, so that the tool amplitude is 4-5 mu m when the silicon carbide ceramic workpiece is subjected to ultrasonic-assisted grinding. When the axial feeding speed of the spindle is increased, the ceramic material removed by diamond abrasive particles in unit time is increased, the grinding depth is increased, grinding dust is increased, micro cracks and defects on the surface of a deep small hole are increased, the number of the micro cracks and defects is increased, and the conditions of cracks, edge breakage and the like are easy to occur in the machining process due to the hard brittleness of the ceramic material.
Example 1
An ultra-precision processing method of silicon carbide ceramic deep small holes comprises the following steps:
step 1: grinding and polishing the silicon carbide ceramic block, placing the silicon carbide ceramic block on an ultrasonic auxiliary grinding machine tool, completely fixing a workpiece by using a V-shaped block, and installing a nickel-based electroplated diamond cutter on a cutter handle;
step 2: firstly, roughly machining a deep small hole II on the silicon carbide ceramic along the track of a cutter under the action of axial ultrasonic vibration, namely determining the track of the deep small hole II according to the size of the deep small hole II and the size of a grinding cutter, machining a plurality of deep small holes I with the same diameter as the cutter, and reserving a margin I; the method comprises the following steps that a plurality of deep small holes I are uniformly distributed at the centers of deep small holes II to be processed and are mutually overlapped, the track is shown in figure 2, in the embodiment, 4 deep small holes I with the diameter of 1mm of a cutter are processed firstly, the allowance with the maximum value of 0.3mm is reserved, the feeding speed of the cutter is 25mm/min-35mm/min, the rotating speed of a main shaft is 6000rpm-10000rpm, the amplitude is 4μm-5μm, the feeding speed is properly reduced at an inlet, the rotating speed of the main shaft is increased to 10000rpm, the feeding speed is reduced to 20mm/min, water-based cooling liquid is used for cooling in the grinding process, and meanwhile abrasive dust is removed;
and 3, step 3: properly reducing the feeding speed at an outlet, increasing the rotating speed of a main shaft to 10000rpm, reducing the feeding speed to 20mm/min, cooling by using water-based cooling liquid in the grinding process, simultaneously removing abrasive dust, and keeping d 3 ＝d 2 Step-shaped allowance II of =0.5mm at outletThe diameter of the through hole 7 is the same as the diameter of the cutter, as shown in fig. 4;
and 4, step 4: carrying out finish machining on the silicon carbide ceramic material workpiece along a cutter track (the contour line of a deep small hole II to be machined) under the action of axial ultrasonic vibration, wherein the cutter feeding speed is 15-20mm/min, the spindle rotating speed is 8000-10000rpm, and the residual machining allowance I in the step 2 is removed; cooling by using water-based cooling liquid in the grinding process, and removing abrasive dust;
and 5: and (3) carrying out finish machining on the silicon carbide ceramic workpiece along a cutter track (the contour line of a deep small hole II to be machined) under the action of axial ultrasonic vibration, wherein the cutter feed speed is 15-20mm/min, the main shaft rotating speed is 8000-10000rpm, and the stepped allowance II at the outlet is removed to obtain the high-quality deep small hole II with the aperture of 2mm and the hole depth of 15 mm.
Processing the processed deep small hole II by using a low-speed cutting machine, and cutting the deep small hole II along the diameter direction of the deep small hole II; the surface roughness of the inner surface of the cut deep small hole II is measured by a confocal microscope, and the surface roughness is 0.4842 mu m.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. An ultra-precision machining method for silicon carbide ceramic deep small holes is characterized by comprising the following steps:
firstly, grinding and polishing a silicon carbide ceramic block, and fixing the silicon carbide ceramic block on an ultrasonic auxiliary grinding machine tool;
step two, processing a plurality of deep small holes I with the same diameter as the cutter under the action of axial ultrasonic vibration, and reserving allowance I; the plurality of deep small holes I are uniformly distributed at the center of a deep small hole II to be processed and are overlapped with each other, the feeding speed of a cutter is 25mm/min-35mm/min, the rotating speed of a main shaft is 6000rpm-10000rpm, the feeding speed is reduced to 20mm/min at an inlet, and the rotating speed of the main shaft is increased to 10000rpm;
step three, reducing the feeding speed to 20mm/min at the outlet, increasing the rotating speed of the main shaft to 10000rpm, and reserving a margin II;
and step four, removing the allowance I and the allowance II under the action of axial ultrasonic vibration, wherein the feeding speed of the cutter is 15-20mm/min, the rotating speed of a main shaft is 8000-10000rpm, and the silicon carbide ceramic deep small hole II is obtained.
2. The ultra-precision machining method of the silicon carbide ceramic deep and small hole according to claim 1, characterized in that: width d of the margin II 2 Width d greater than margin I 1 And the allowance I and the allowance II are in a ladder shape.
3. The ultra-precision machining method of the silicon carbide ceramic deep small hole according to claim 1, characterized in that: width d of the margin II 2 Height d from the remainder II 3 The same is true.
4. The ultra-precision machining method of the silicon carbide ceramic deep small hole according to claim 1, characterized in that: and in the third step, the diameter of the through hole processed at the outlet of the deep small hole II to be processed is the same as that of the cutter.
5. The ultra-precision machining method of the silicon carbide ceramic deep and small hole according to claim 1, characterized in that: the depth and diameter ratio of the deep small hole II to be processed is more than 5.
6. The ultra-precision machining method of the silicon carbide ceramic deep small hole according to claim 1, characterized in that: in the second step, the amplitude of the cutter is 4-5 μm.
7. The ultra-precision machining method of the silicon carbide ceramic deep small hole according to claim 1, characterized in that: the grinding process of each step uses water-based cooling liquid to cool the workpiece and remove abrasive dust at the same time.
8. The ultra-precision machining method of the silicon carbide ceramic deep small hole according to claim 1, characterized in that: the used cutter is a nickel-based electroplated diamond cutter.
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| JP2002137108A (en) * | 2000-10-30 | 2002-05-14 | Mmc Kobelco Tool Kk | Drilling method for brittle material and drilling tool used therefor |
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| CN104148994A (en) * | 2014-07-28 | 2014-11-19 | 北京无线电测量研究所 | Ultrasonic vibration machining method of small-diameter deep hole of microwave deterring material |
| CN107175470A (en) * | 2017-06-02 | 2017-09-19 | 中国航发南方工业有限公司 | The special-shaped deep groove processing method of titanium alloy component |
| CN110181339A (en) * | 2018-02-23 | 2019-08-30 | 蓝思科技（长沙）有限公司 | The method in hole, slot is processed on a kind of ceramic product |
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- 2022-08-17 CN CN202210988689.8A patent/CN115194955A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002137108A (en) * | 2000-10-30 | 2002-05-14 | Mmc Kobelco Tool Kk | Drilling method for brittle material and drilling tool used therefor |
| CN103659276A (en) * | 2013-11-08 | 2014-03-26 | 中航飞机股份有限公司西安飞机分公司 | Method for numerical control machining of titanium alloy part with deep groove structure |
| CN104148994A (en) * | 2014-07-28 | 2014-11-19 | 北京无线电测量研究所 | Ultrasonic vibration machining method of small-diameter deep hole of microwave deterring material |
| CN107175470A (en) * | 2017-06-02 | 2017-09-19 | 中国航发南方工业有限公司 | The special-shaped deep groove processing method of titanium alloy component |
| CN110181339A (en) * | 2018-02-23 | 2019-08-30 | 蓝思科技（长沙）有限公司 | The method in hole, slot is processed on a kind of ceramic product |
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