CN115189124B - E-plane low-cross-coupling patch linear array antenna - Google Patents
E-plane low-cross-coupling patch linear array antenna Download PDFInfo
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- CN115189124B CN115189124B CN202210819394.8A CN202210819394A CN115189124B CN 115189124 B CN115189124 B CN 115189124B CN 202210819394 A CN202210819394 A CN 202210819394A CN 115189124 B CN115189124 B CN 115189124B
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- 238000006880 cross-coupling reaction Methods 0.000 title claims description 19
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000010168 coupling process Methods 0.000 claims abstract description 34
- 238000005859 coupling reaction Methods 0.000 claims abstract description 34
- 230000008878 coupling Effects 0.000 claims abstract description 26
- 239000000523 sample Substances 0.000 claims abstract description 14
- 230000010287 polarization Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005388 cross polarization Methods 0.000 abstract description 8
- 230000000087 stabilizing effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 10
- 230000005684 electric field Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
Abstract
The invention discloses an E-plane low-mutual-coupling patch linear array antenna which comprises a plurality of metal patches, a plurality of dielectric substrates and a metal ground substrate, wherein the metal patches, the dielectric substrates and the metal ground substrate are connected through metal probes, the dielectric substrates comprise a top dielectric substrate, a middle dielectric substrate and a bottom dielectric substrate which are sequentially stacked, the metal patches are embedded in the top dielectric substrate, a plurality of non-metallized through holes are arranged in the middle dielectric substrate, the non-metallized through holes are periodically arranged into a plurality of rectangular areas, the position of each rectangular area corresponds to each metal patch, and one side of each rectangular area is mutually flush with one side of the corresponding metal patch. The invention can realize low mutual coupling of E surface without increasing the size and section of the antenna system, reducing efficiency, preventing back leakage, stabilizing cross polarization and improving performance.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to an E-plane low-cross-coupling patch linear array antenna.
Background
The patch antenna can be realized through a printed circuit board, has the advantages of low profile, small size, mature process and the like, and is widely applied to microwave and millimeter wave frequency bands. Although a single patch antenna can transmit and receive electromagnetic waves, in a scenario requiring high gain or beam scanning, multiple patch elements are often required to make up an antenna array. The patches of the patch linear array are arranged on a straight line, so that the wave beam can be compressed in the arrangement direction, the gain is improved, or the wave beam scanning is performed. In a patch linear array, the compact arrangement between patch units may cause strong electromagnetic coupling, which may cause problems such as deterioration of impedance matching of the array, pattern deflection, reduction of radiation efficiency, reduction of scan angle range, and the like. Therefore, it is necessary to study the patch linear array with low mutual coupling to ensure good antenna system operation performance.
In general, in a linear array with low mutual coupling, three types of technologies for realizing low mutual coupling are mainly used, and the first type is to partition surface waves or space waves between units by using a periodic structure or a defected ground structure so as to reduce the mutual coupling, but the problems of complex structure, increased size or profile, back leakage and the like are faced. The second type is to use a parasitic structure or a decoupling network to form a new coupling path, and counter-phase the coupling signals of the original coupling path to achieve the effect of decoupling, but the radiation efficiency is reduced, the antenna size is increased or additional feed circuits are introduced to increase the difficulty of system integration. The third is to connect two antenna elements using a neutral line, and cancel the induced current generated by the induced current and coupling to form a decoupling effect, but this method is currently only used for a dual element array, and the antenna adds an additional metal structure, resulting in an increase in size.
That is, the existing low-mutual-coupling patch linear array needs to realize the isolation or cancellation of coupling signals by means of the external structure of the antenna unit, so that the problems of complex structure, increased size or section, back leakage, reduced efficiency, increased cross polarization, increased system integration difficulty and the like are faced. Therefore, the patch linear array with low mutual coupling based on the self structure of the patch antenna unit is beneficial to comprehensively solving the problem.
Disclosure of Invention
Aiming at the problems in the related art, the invention provides the E-plane low-mutual-coupling patch linear array antenna, which can realize the E-plane low-mutual-coupling without increasing the size and the section of an antenna system, reducing the efficiency, preventing back leakage, stabilizing cross polarization and comprehensively improving the performance.
The technical scheme of the invention is realized as follows:
the utility model provides a E face low cross coupling paster linear array antenna, includes a plurality of metal paster, a plurality of dielectric substrate and metal earth base plate, pass through metal probe through connection between metal paster dielectric substrate and the metal earth base plate, dielectric substrate is including top layer dielectric substrate, intermediate level dielectric substrate and the bottom dielectric substrate of laminating in proper order, the metal paster inlay in the top layer dielectric substrate, just be provided with a plurality of non-metallized via holes in the intermediate level dielectric substrate, a plurality of non-metallized via holes are periodically arranged to a plurality of rectangle regions, and the position of every rectangle region is corresponding with every metal paster, and one side of every rectangle region and one side of corresponding metal paster are flush with each other.
Optionally, the center-to-center spacing between two adjacent metal patches is 0.5λ 0 。
Optionally, the length of the rectangular region formed by the non-metallized via hole in the polarization direction is 0.1λ 0 -0.15λ 0 。
Optionally, the length of the rectangular area formed by the non-metallized via hole in the direction perpendicular to the polarization direction is equal to the width of the metal patch.
Optionally, the left side of the rectangular area and the left side of the metal patch are flush with each other.
Optionally, the metal probe is located at one side of the rectangular area, and a horizontal axis of the metal probe and a horizontal symmetry line of the dielectric substrate are mutually overlapped.
Optionally, the metal probe is located on the right side of the rectangular area.
The beneficial effects are that: according to the invention, through introducing the periodically arranged non-metallized via holes in the rectangular area, the polarization component radiation impedance imaginary part of the patch antenna is adjusted, the path difference of the coupling path is compensated by combining the feed position, only a lower coupling electric field is obtained on the coupling patch, the E-plane low-cross coupling patch linear array is realized, the characteristics of small size and low profile are realized, the problems of increased size or profile of an antenna system, reduced efficiency, back leakage, cross polarization deterioration and the like are avoided, and the performance is comprehensively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an exploded view of a 1×4E-plane low cross-coupling patch linear array antenna according to an embodiment of the present invention;
fig. 2 is a schematic side view of a 1×4E-plane low cross-coupling patch linear array antenna according to an embodiment of the present invention;
fig. 3 is a diagram of comparing S parameters of a 1×4E-plane low cross-coupling patch linear array antenna with a conventional E-plane patch linear array according to an embodiment of the present invention;
fig. 4 is a diagram showing a comparison of S parameters of a 1×4E-plane low cross-coupling patch linear array antenna and a conventional E-plane patch linear array according to an embodiment of the present invention;
FIG. 5 is a graph of S-unit gain contrast for a 1×4E-plane low cross-coupled patch linear array antenna versus a conventional E-plane patch linear array in accordance with an embodiment of the present invention;
FIG. 6 is an E-plane array radiation pattern at the center frequency of a 1×4E-plane low cross-coupled patch linear array antenna in accordance with an embodiment of the present invention;
fig. 7 is an H-plane array radiation pattern at the center frequency of a 1 x 4E-plane low cross-coupled patch linear array antenna in accordance with an embodiment of the present invention.
In the figure:
1. a metal patch; 2. a dielectric substrate; 3. a metal earth base plate; 4. a metal probe; 5. a top dielectric substrate; 6. an intermediate layer dielectric substrate; 7. a bottom dielectric substrate; 8. non-metallized vias.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the invention, fall within the scope of protection of the invention.
According to an embodiment of the invention, a 1×4E-plane low-cross-coupling patch linear array antenna is provided.
As shown in fig. 1-2, the E-plane low-mutual-coupling patch linear array antenna according to the embodiment of the invention includes 4 metal patches 1, a dielectric substrate 2 and a metal ground substrate 3, where the metal patches 1, the dielectric substrate 2 and the metal ground substrate 3 are connected through metal probes 4, the dielectric substrate 2 includes a top dielectric substrate 5, a middle dielectric substrate 6 and a bottom dielectric substrate 7 that are sequentially stacked, the metal patches 1 are embedded in the top dielectric substrate 5, a plurality of non-metallized vias 8 are disposed in the middle dielectric substrate 6, the plurality of non-metallized vias 8 are periodically arranged into a plurality of rectangular areas, the position of each rectangular area corresponds to each metal patch 1, and the left side of each rectangular area is mutually level with the left side of the corresponding metal patch 1.
When the patch antenna is specifically applied, the metal patch 1, the top dielectric substrate 5, the middle dielectric substrate 6, the bottom dielectric substrate 7 and the metal ground substrate 3 are used for forming a 1 multiplied by 4 patch linear array antenna. The center-to-center spacing of the units is 0.5λ 0 (λ 0 Wavelength of free space at the center frequency), the length of the rectangular region formed by the non-metallized via 8 in the polarization direction is 0.1λ 0 -0.15λ 0 The length in the direction perpendicular to the polarization direction is equal to the width of the metal patch 1. And the metal probe 4 is located on the right side of the rectangular area, and the horizontal axis of the metal probe 4 and the horizontal symmetry line of the dielectric substrate 2 are mutually overlapped (i.e., the metal probe 4 is located on the horizontal symmetry line of the whole structure).
When the E-plane low-mutual-coupling patch linear array antenna is used, the decoupling effect of the E-plane low-mutual-coupling patch linear array antenna is realized by taking the non-metallized via holes 8 as main materials and taking the feeding position as auxiliary materials. In the working engineering, the patch antenna linear array is arranged along the E surface, and the polarized electric field components at two sides of the patch antenna unit are consistent with the arrangement direction of the linear array. Since the non-metallized vias 8 are periodically arranged to form a rectangular area and are positioned below one side of the metal patch, the vertical electric field component strength of that side is enhanced by the influence of the non-metallized vias and is no longer consistent with the polarized circuit component strength of the side without the non-metallized vias 8. Therefore, the radiation impedance imaginary parts corresponding to the polarized electric field components at the two sides are changed, and the inconsistency of the radiation impedance imaginary parts of the polarized electric field components at the two sides is just used for compensating the path difference on the coupling path by further adjusting the feeding position, so that a lower coupling electric field is finally obtained on the coupling patch antenna unit, and the effect of reducing the mutual coupling of the patch linear arrays is achieved.
The patch unit with the non-metallized via holes 8 realizes a low cross coupling patch linear array, and other structures except the unit are not introduced in the process, so that the problems of complex structure, increased size or section, back leakage, reduced efficiency, increased cross polarization or increased system integration difficulty and the like are avoided. Meanwhile, the patch unit with the non-metallized via holes 8 can keep the normal operation of the patch antenna unit including radiation pattern, matching, cross polarization and the like while realizing low mutual coupling.
Fig. 3-5 are S-parameters and unit gains of the inventive E-plane low cross-coupling patch linear array and a conventional E-plane patch linear array, both arrays maintaining the same frequency and the same spacing. As shown in FIG. 3, the E-plane low cross coupling patch linear array of the invention works at 4.9GHz, and the 10-dB impedance matching bandwidth of the antenna unit is about 5.6%, so that the matching is not obviously changed compared with the traditional antenna. But mutual coupling between antenna elementsThe method is obviously improved, as shown in figure 4, the I S of the E-plane low-mutual-coupling patch linear array 12 I decreases from-23.1 dB to-30.6 dB, |S 23 I decreases from-24.9 dB to-35.6 dB, |S 34 The level of overall mutual coupling in the 10-dB impedance matching band drops from-26.5 dB to-34.5 dB. Furthermore, the antenna element gain is increased due to the improved overall cross-coupling level, from 6.07dBi to 6.35dBi at the center frequency, as shown in fig. 5.
While figures 6-7 are array radiation patterns at the center frequency of a 1 x 4E-plane low cross-coupling patch linear array, each unit is excited in phase with equal amplitude, the 3-dB beam width ranges of the E-plane and the H-plane are 24.3 degrees and 92.2 degrees respectively, and the cross polarization levels are-44 dB and-20.1 dB respectively.
Therefore, by means of the technical scheme, through introducing the periodically arranged non-metallized via holes in the rectangular area, the polarization component radiation impedance imaginary part of the patch antenna is adjusted, the path difference of the coupling path is compensated by combining the feeding position, only a lower coupling electric field is obtained on the coupling patch, the E-plane low-cross-coupling patch linear array is realized, the characteristics of small size and low profile are realized, the problems of increased size or profile of an antenna system, reduced efficiency, back leakage, cross polarization deterioration and the like are avoided, and the performance is comprehensively improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (4)
1. The utility model provides a E face low cross coupling paster linear array antenna, includes a plurality of metal paster (1), dielectric substrate (2) and metal earth base plate (3), metal paster (1) dielectric substrate (2) and metal earth base plate (3) between pass through metal probe (4) through-connection, a serial communication port, dielectric substrate (2) are including top layer dielectric substrate (5), intermediate level dielectric substrate (6) and bottom dielectric substrate (7) of laminating in proper order, metal paster (1) embedded in top layer dielectric substrate (5), just be provided with a plurality of non-metallized via holes in intermediate level dielectric substrate (6)8) The non-metallized through holes (8) are periodically arranged into a plurality of rectangular areas, the position of each rectangular area corresponds to that of each metal patch (1), and one side of each rectangular area is level with one side of the corresponding metal patch (1); the length of the rectangular region formed by the non-metallized via holes (8) in the polarization direction is 0.1λ 0 -0.15λ 0 The method comprises the steps of carrying out a first treatment on the surface of the The length of a rectangular area formed by the non-metallized via holes (8) in the direction perpendicular to the polarization direction is equal to the width of the metal patch (1); the metal probe (4) is positioned on one side of the rectangular area, and the horizontal axis of the metal probe (4) is mutually overlapped with the horizontal symmetry line of the dielectric substrate (2); lambda (lambda) 0 Is the wavelength of free space at the center frequency.
2. The linear array antenna of low cross-coupling patch of E-plane of claim 1, characterized in that the center-to-center distance between two adjacent metal patches (1) is 0.5λ 0 ；λ 0 Is the wavelength of free space at the center frequency.
3. The linear array antenna of the E-plane low mutual coupling patch as claimed in claim 1, characterized in that the left side of the rectangular area and the left side of the metal patch (1) are flush with each other.
4. The low cross-coupling patch linear array antenna of claim 1, wherein the metal probe (4) is located on the right side of a rectangular area.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210819394.8A CN115189124B (en) | 2022-07-12 | 2022-07-12 | E-plane low-cross-coupling patch linear array antenna |
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| CN202210819394.8A CN115189124B (en) | 2022-07-12 | 2022-07-12 | E-plane low-cross-coupling patch linear array antenna |
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| CN115189124A CN115189124A (en) | 2022-10-14 |
| CN115189124B true CN115189124B (en) | 2024-01-30 |
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