CN115188693A - Monolithic wet etching system and method of operation - Google Patents
Monolithic wet etching system and method of operation Download PDFInfo
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- CN115188693A CN115188693A CN202210967929.6A CN202210967929A CN115188693A CN 115188693 A CN115188693 A CN 115188693A CN 202210967929 A CN202210967929 A CN 202210967929A CN 115188693 A CN115188693 A CN 115188693A
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- 238000001039 wet etching Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 132
- 239000007788 liquid Substances 0.000 claims abstract description 90
- 238000011084 recovery Methods 0.000 claims description 21
- 238000003756 stirring Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 10
- 230000003631 expected effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 6
- 238000004064 recycling Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000005213 imbibition Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
Abstract
The invention provides a single-wafer wet etching system and an operation method, relates to the technical field of wafer etching, and solves the technical problem that etching damage is caused by different etching uniformity of each position of a wafer due to the fact that etching liquid in a wet etching system in the prior art is unevenly sprayed on the wafer. The device comprises a wafer bearing part, an etching solution supply system, a controller, a pressed piece and a lifting mechanism, wherein the pressed piece is positioned above the wafer bearing part, the lifting mechanism is connected with the pressed piece, the lifting mechanism is connected with the controller, the controller can control the lifting mechanism to push the pressed piece to move towards the direction close to or far away from the wafer bearing part, and the etching solution supply system is connected with the controller; the middle part of the pressed piece is provided with a mounting hole, a nozzle on the etching liquid supply system is arranged in the mounting hole, an inwards-concave liquid separating groove is arranged on the surface of the pressed piece and communicated with the mounting hole, and all the liquid separating grooves are distributed along the circumferential direction of the mounting hole.
Description
Technical Field
The invention relates to the technical field of wafer etching, in particular to a single-wafer wet etching system and an operation method.
Background
As shown in fig. 1, the conventional wet etching system includes a wafer carrier 1, an etching solution supply system 2, and a controller 3. The wafer bearing part 1 comprises a wafer bearing platform 11, a supporting base 12 and a rotating mechanism, wherein the wafer bearing platform 11 adsorbs a wafer 7 through negative pressure or is fixed by a clamp, the supporting base 12 is used for supporting the wafer bearing platform 11 and driving the wafer bearing platform 11 to rotate through the rotating mechanism; the etching solution supply system 2 comprises a nozzle 21, an etching solution supply source 22 and a control valve 23, wherein the nozzle 21, the control valve 23 and the etching solution supply source 22 are communicated through a pipeline, the control valve 23 is connected with the controller 3, and the controller 3 can control the control valve 23 to open and close, so that the etching solution 8 in the etching solution supply source 22 is controlled to start or stop spraying the etching solution 8 onto the wafer 7 through the nozzle 21.
As shown in fig. 2, when the etching solution 8 is spread on the surface to be etched of the entire wafer 7, an excessive amount of time is consumed, and the amount of the etching solution 8 is increased; etching liquid 8 in the existing wet etching system is unevenly sprayed on the wafer 7, so that different etching evenness of each position of the wafer 7 is caused, and etching damage is caused; the recovery form of the system is single, residual liquid on the wafer 7 is thrown out through the action of centrifugal force, so that the waste of the etching solution 8 is caused, and meanwhile, the residual liquid which is not thrown out can cause secondary etching or other pollution on the surface of the wafer 7.
Disclosure of Invention
The invention aims to provide a single-chip wet etching system and an operation method thereof, which are used for solving the technical problems that etching liquid in the wet etching system in the prior art is unevenly sprayed on a wafer, so that the etching uniformity of each position of the wafer is different, and the etching damage is caused. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the invention are described in detail in the following.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a single-wafer wet etching system which comprises a wafer bearing part, an etching solution supply system, a controller, a pressing piece and a lifting mechanism, wherein the pressing piece is positioned above the wafer bearing part, the lifting mechanism is connected with the pressing piece, the lifting mechanism is connected with the controller, the controller can control the lifting mechanism to push the pressing piece to move towards the direction close to or far away from the wafer bearing part, and the etching solution supply system is connected with the controller;
the middle part of the pressed piece is provided with a mounting hole, a nozzle on the etching liquid supply system is arranged in the mounting hole, the surface of the pressed piece is provided with an inwards-concave liquid separating tank, the liquid separating tanks are communicated with the mounting hole, the number of the liquid separating tanks is multiple, and all the liquid separating tanks are distributed along the circumferential direction of the mounting hole.
Optionally, the surface of the pressing member is provided with a plurality of liquid stirring blocks protruding outwards.
Optionally, the pressing member is a disc-type structure.
Optionally, the diameter of the pressing member is greater than or equal to the diameter of the wafer.
Optionally, still include recovery system, recovery system includes suction nozzle, accumulator, pump body and valve body, the suction nozzle with the accumulator is linked together through the imbibition pipeline, the accumulator with etching liquid supply system is linked together through the liquid outlet pipe, the pump body sets up on the imbibition pipeline, the valve body sets up on the liquid outlet pipe, the pump body with the valve body all with the controller is connected, the suction nozzle sets up on the pressfitting.
Optionally, a plurality of matching holes are formed in the pressed part, the number of the suction nozzles is consistent with that of the matching holes, the suction nozzles are arranged in the matching holes, and all the matching holes are distributed along the circumferential direction of the mounting hole.
Optionally, the etching solution supply system includes an etching solution supply source and a control valve, the etching solution supply source is communicated with the control valve through a first pipeline, the control valve is communicated with the nozzle through a second pipeline, the liquid outlet pipeline is communicated with the second pipeline, and the control valve is connected with the controller.
Optionally, the wafer bearing component includes a wafer bearing platform, a supporting base and a rotating mechanism, the rotating mechanism is arranged on the supporting base, the wafer bearing platform is located on the supporting base and connected with the rotating mechanism, the rotating mechanism can drive the wafer bearing platform to rotate, and the wafer bearing platform is used for bearing a wafer.
Optionally, the lifting mechanism is an electric push rod mechanism.
The invention provides an operation method of a single-wafer wet etching system, which comprises the following steps:
step A: fixing a wafer on a wafer bearing table, and controlling a lifting mechanism to push a pressing piece to move towards the direction close to the wafer through a controller until the pressing piece moves to a specified position, wherein the controller controls the lifting mechanism to stop moving;
and B, step B: the controller controls the control valve to open, etching liquid in the etching liquid supply source is sprayed out through the nozzle, the etching liquid is guided onto the wafer under the action of the pressing piece, then the wafer bearing table is driven by the rotating mechanism to rotate at a set first speed, the wafer bearing table drives the wafer to rotate, and in the rotating process of the wafer, the etching liquid can be flatly laid on the wafer by the liquid stirring block on the pressing piece;
and C: after the etching solution is uniformly spread on the wafer, the controller controls the control valve to be closed, and the etching solution etches the wafer within a set time;
step D: after etching is finished, the controller controls the pump body to be opened, meanwhile, the rotating mechanism drives the wafer bearing table to rotate at a set second speed, and the suction nozzle can suck etching liquid on the wafer into the recovery tank;
step F: after the etching solution on the wafer is recovered, the controller controls the lifting mechanism to push the pressing piece to move in the direction away from the wafer, meanwhile, the rotating mechanism stops rotating, the wafer is taken down, the etching effect of the wafer is checked, and if the etching effect of the wafer does not reach the expected effect, the steps A to F are continuously repeated; if the etching effect of the wafer reaches the expected effect, the etching is completed.
The invention provides a single-wafer wet etching system, wherein a nozzle on an etching liquid supply system is arranged in the middle of a pressed piece, a concave liquid separating groove is arranged on the surface of the pressed piece, the liquid separating groove faces to a wafer, a plurality of liquid separating grooves are distributed along the circumferential direction of a mounting hole, when the pressed piece works, the pressed piece needs to be moved to a specified position, so that a gap exists between the pressed piece and the wafer, when the nozzle sprays etching liquid to the wafer, the etching liquid cannot be accumulated in the middle of the wafer due to the limitation of the pressed piece on the space above the wafer, but the etching liquid is dispersed under the pressing of the pressed piece, and when the nozzle sprays the etching liquid, part of the etching liquid flows to the liquid separating grooves and flows to the periphery of the wafer from the liquid separating grooves, and simultaneously, under the rotation of the wafer, the etching liquid is quickly paved to the wafer, so that the spraying time is shortened, and the etching liquid is uniformly paved to the wafer, and the technical problem that the etching liquid in the prior art is unevenly sprayed on the wafer, so that the etching liquid in each position is different in etching uniformity and causes etching damage to the wafer is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a prior art wet etching system;
FIG. 2 is a schematic diagram of a prior art wet etching system performing etching;
FIG. 3 is a schematic structural diagram of a single wafer wet etching system provided by an embodiment of the invention;
FIG. 4 is a top view of a compact of a monolithic wet etching system provided by an embodiment of the invention;
FIG. 5 is a schematic diagram of a beginning-spraying configuration in a method of operating a monolithic wet etching system according to an embodiment of the invention;
FIG. 6 is a schematic structural diagram illustrating a method of operating a single wafer wet etching system according to an embodiment of the present invention, in which an etching solution is uniformly spread over a wafer;
FIG. 7 is a schematic structural diagram of a recovered etching solution in a method of operating a single wafer wet etching system according to an embodiment of the present invention;
in fig. 1, a wafer carrier; 11. a wafer bearing table; 12. a support base; 2. an etching solution supply system; 21. a nozzle; 22. an etching solution supply source; 23. a control valve; 3. a controller; 4. pressing the workpiece; 41. mounting holes; 42. a liquid separating tank; 43. stirring the liquid block; 44. a mating hole; 5. a lifting mechanism; 6. a recovery system; 61. a suction nozzle; 62. a recovery tank; 63. a pump body; 64. a valve body; 7. a wafer; 8. and (4) etching liquid.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
In the description of the present invention, it is to be noted that "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
Example 1:
the invention provides a single-wafer wet etching system, which comprises a wafer bearing part 1, an etching solution supply system 2, a controller 3, a pressed part 4 and a lifting mechanism 5, wherein the pressed part 4 is positioned above the wafer bearing part 1, a wafer 7 can be placed on the wafer bearing part 1, the wafer bearing part 1 can push the wafer 7 to rotate, the lifting mechanism 5 is connected with the pressed part 4, the lifting mechanism 5 is connected with the controller 3, the controller 3 can control the lifting mechanism 5 to push the pressed part 4 to move towards the direction close to or far away from the wafer bearing part 1, and the etching solution supply system 2 is connected with the controller 3;
the middle part of the pressed piece 4 is provided with a mounting hole 41, the nozzle 21 on the etching solution supply system 2 is arranged in the mounting hole 41, the nozzle 21 vertically faces the wafer 7, the surface of the pressed piece 4 is provided with an inward-concave liquid separating groove 42, the length direction of the liquid separating groove 42 is consistent with the radial direction of the pressed piece 4, the liquid separating grooves 42 are communicated with the mounting hole 41, the number of the liquid separating grooves 42 is multiple, and all the liquid separating grooves 42 are distributed along the circumferential direction of the mounting hole 41. The invention provides a single-wafer wet etching system, a nozzle 21 on an etching liquid supply system 2 is arranged in the middle of a pressed piece 4, a liquid separating groove 42 which is concave inwards is arranged on the surface of the pressed piece 4, the liquid separating groove 42 faces a wafer, a plurality of liquid separating grooves 42 are distributed along the circumferential direction of a mounting hole 41, when the pressed piece 4 works, the pressed piece 4 needs to be moved to a specified position, so that a gap exists between the pressed piece 4 and the wafer 7, when the nozzle 21 sprays etching liquid 8 to the wafer 7, due to the limitation of the pressed piece 4 on the space above the wafer 7, the etching liquid 8 cannot be accumulated in the middle of the wafer 7, but the etching liquid 8 is dispersed under the pressing of the pressed piece, when the nozzle 21 sprays the etching liquid 8, part of the etching liquid 8 flows to the liquid separating grooves 42, flows to the periphery of the wafer 7 from the liquid separating grooves 42, and simultaneously, under the rotation of the wafer 7, the etching liquid 8 is fully spread on the wafer 7, so that the etching liquid 8 is uniformly spread on the wafer, the wafer 7, the problem of the uneven etching liquid in the prior art, which causes different etching liquid spraying damages on the wafer, and the wafer 7, is solved.
As an alternative embodiment, the surface of the pressing member 4 is provided with a plurality of outward-protruding stirring blocks 43, all the stirring blocks 43 are dispersed on the surface of the pressing member 4, the stirring blocks 43 face the wafer 7, and during the rotation of the wafer 7, the stirring blocks 43 scatter the etching solution 8 accumulated on the wafer 7, so that the etching solution 8 is uniformly dispersed on the wafer 7. The liquid stirring blocks 43 are distributed along the curved direction, so that each liquid stirring block 43 can stir a specific area of the wafer 7.
As an alternative embodiment, the pressing member 4 is a disk-shaped structure, and the diameter of the pressing member 4 is greater than or equal to the diameter of the wafer 7. In order to allow the wafer 7 to be covered by the pressing member 4, so that the wafer 7 can be filled with the etching liquid 8.
As an optional embodiment, the wafer etching system further comprises a recycling system 6, the recycling system 6 can recycle the etching solution 8 on the wafer 7 and can recycle the etching solution 8, the recycling system 6 comprises a suction nozzle 61, a recycling groove 62, a pump body 63 and a valve body 64, the suction nozzle 61 is communicated with the recycling groove 62 through a suction pipeline, the recycling groove 62 is communicated with the etching solution supply system 2 through a liquid outlet pipeline, the pump body 63 is arranged on the suction pipeline, the valve body 64 is arranged on the liquid outlet pipeline, the pump body 63 and the valve body 64 are both connected with the controller 3, and the suction nozzle 61 is arranged on the pressing member 4. When the etching solution 8 is recovered, the controller 3 controls the pump 63 to open, so that the suction nozzle 61 can suck the etching solution 8 on the wafer 7 into the liquid suction pipeline and enter the recovery tank 62 along the liquid suction pipeline, and when the suction nozzle 61 recovers the etching solution 8 on the wafer 7, the wafer 7 rotates under the movement of the wafer bearing part 1, so that the etching solution 8 at each position on the wafer 7 is positioned below the suction nozzle 61, and the suction nozzle 61 can conveniently and quickly recover the etching solution 8. At the same time, the wafer 7 is rotated at a very low speed, so as to prevent the etching solution 8 from being thrown out, and to provide a recovery time for the suction nozzle 61. When the controller 3 controls the valve body 64 to open, the etching solution 8 in the recovery tank 62 can enter the nozzle 21 through the liquid outlet pipe and be sprayed onto the wafer 7 from the nozzle 21, so that the etching solution 8 is recovered and reused.
As an alternative embodiment, the pressing member 4 is provided with a plurality of matching holes 44, the number of the suction nozzles 61 is the same as the number of the matching holes 44, the suction nozzles 61 are arranged in the matching holes 44, all the matching holes 44 are distributed along the circumferential direction of the mounting hole 41, the suction nozzles 61 are communicated with the recovery groove 62 through suction pipes, the suction nozzles 61 can work simultaneously, and the etching solution 8 on the wafer 7 can be recovered quickly.
As an alternative embodiment, the etching solution supply system 2 includes an etching solution supply source 22 and a control valve 23, the etching solution supply source 22 is used for containing the etching solution 8, the etching solution supply source 22 and the control valve 23 are communicated through a first pipeline, the control valve 23 and the nozzle 21 are communicated through a second pipeline, one end of the liquid outlet pipeline is communicated with the second pipeline, the other end of the liquid outlet pipeline is communicated with the recovery tank 62, the control valve 23 is connected with the controller 3, and the controller 3 can control the control valve 23 to open and close.
As an alternative embodiment, the wafer carrier 1 includes a wafer stage 11, a supporting base 12 and a rotating mechanism, the rotating mechanism is disposed on the supporting base 12, the wafer stage 11 is located on the supporting base 12, and the wafer stage 11 is connected with the rotating mechanism, the rotating mechanism can drive the wafer stage 11 to rotate, and the wafer stage 11 is used for carrying the wafer 7.
As an alternative embodiment, the lifting mechanism 5 may be an electric push rod mechanism.
Example 2:
the invention provides an operation method of a single-wafer wet etching system, which comprises the following steps:
step A: fixing a wafer 7 on a wafer bearing table 11, and then controlling a lifting mechanism 5 to push a pressing piece 4 to move towards the direction close to the wafer 7 through a controller 3 until the pressing piece 4 moves to a specified position, and controlling the lifting mechanism 5 to stop moving by the controller 3;
and B: the controller 3 controls the control valve 23 to open, the etching solution 8 in the etching solution supply source 22 is sprayed out through the nozzle 21, the etching solution 8 is guided to the wafer 7 under the action of the pressing piece 4, then the rotating mechanism drives the wafer bearing table 11 to rotate at a set first speed, the wafer bearing table 11 drives the wafer 7 to rotate, and in the rotating process of the wafer 7, the etching solution 8 can be flatly laid on the wafer 7 through the liquid stirring block 43 on the pressing piece 4;
step C: after the etching solution 8 is uniformly spread on the wafer 7, the controller 3 controls the control valve 23 to close, and the etching solution 8 etches the wafer 7 within a set time;
step D: after etching is finished, the controller 3 controls the pump body 63 to be opened, and meanwhile, the rotating mechanism drives the wafer bearing table 11 to rotate at a set second speed, at the moment, the second speed is lower, the suction nozzle 61 sucks the etching solution 8 on the wafer 7 into the recovery tank 62, and the etching solution 8 in the recovery tank 62 can be used for the next time;
step F: after the recovery of the etching solution 8 on the wafer 7 is finished, the controller 3 controls the lifting mechanism 5 to push the pressing piece 4 to move in the direction away from the wafer 7, meanwhile, the rotating mechanism stops rotating, the wafer 7 is taken down, the etching effect of the wafer 7 is checked, and if the etching effect of the wafer 7 does not reach the expected effect, the steps A to F are continuously repeated; if the etching effect of the wafer 7 is expected, the etching is completed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A single wafer wet etching system, comprising a wafer carrier (1), an etching solution supply system (2), a controller (3), a pressing member (4) and a lifting mechanism (5), wherein,
the pressing piece (4) is positioned above the wafer bearing part (1), the lifting mechanism (5) is connected with the pressing piece (4), the lifting mechanism (5) is connected with the controller (3), the controller (3) can control the lifting mechanism (5) to push the pressing piece (4) to move towards the direction close to or away from the wafer bearing part (1), and the etching solution supply system (2) is connected with the controller (3);
the middle of the pressing piece (4) is provided with a mounting hole (41), a nozzle (21) on the etching liquid supply system (2) is arranged in the mounting hole (41), the surface of the pressing piece (4) is provided with an inwards-concave liquid separating groove (42), the liquid separating grooves (42) are communicated with the mounting hole (41), the number of the liquid separating grooves (42) is multiple, and all the liquid separating grooves (42) are distributed along the circumferential direction of the mounting hole (41).
2. The single wafer wet etching system according to claim 1, wherein the pressing member (4) has a plurality of outward protruding paddle blocks (43) provided on a surface thereof.
3. The monolithic wet etching system according to claim 1, wherein the pressing member (4) is a disc-shaped structure.
4. The monolithic wet etching system according to claim 3, wherein the diameter of the pressing member (4) is greater than or equal to the diameter of the wafer (7).
5. The wet single wafer etching system according to claim 1, further comprising a recovery system (6), wherein the recovery system (6) comprises a suction nozzle (61), a recovery tank (62), a pump body (63) and a valve body (64), the suction nozzle (61) and the recovery tank (62) are communicated through a suction pipe, the recovery tank (62) and the etching solution supply system (2) are communicated through a liquid outlet pipe, the pump body (63) is disposed on the suction pipe, the valve body (64) is disposed on the liquid outlet pipe, the pump body (63) and the valve body (64) are both connected to the controller (3), and the suction nozzle (61) is disposed on the pressing member (4).
6. The single wafer wet etching system according to claim 5, wherein a plurality of fitting holes (44) are provided in the pressed member (4), the number of the suction nozzles (61) is identical to the number of the fitting holes (44), the suction nozzles (61) are provided in the fitting holes (44), and all the fitting holes (44) are distributed in a circumferential direction of the mounting hole (41).
7. The monolithic wet etching system according to claim 5, wherein the etching liquid supply system (2) comprises an etching liquid supply source (22) and a control valve (23), the etching liquid supply source (22) and the control valve (23) are communicated through a first pipe, the control valve (23) and the nozzle (21) are communicated through a second pipe, the liquid outlet pipe is communicated with the second pipe, and the control valve (23) is connected with the controller (3).
8. The single wafer wet etching system according to claim 1, wherein the wafer carrying component (1) comprises a wafer carrying stage (11), a supporting base (12), and a rotating mechanism, the rotating mechanism is disposed on the supporting base (12), the wafer carrying stage (11) is disposed on the supporting base (12) and the wafer carrying stage (11) is connected with the rotating mechanism, the rotating mechanism can drive the wafer carrying stage (11) to rotate, and the wafer carrying stage (11) is used for carrying a wafer (7).
9. The single wafer wet etching system according to claim 1, wherein the lifting mechanism (5) is an electric push rod mechanism.
10. A method of operating a monolithic wet etching system, comprising:
step A: fixing a wafer (7) on a wafer bearing table (11), and then controlling a lifting mechanism (5) to push a pressing piece (4) to move towards the direction close to the wafer (7) through a controller (3), wherein the controller (3) controls the lifting mechanism (5) to stop moving until the pressing piece (4) moves to a specified position;
and B: the controller (3) controls the control valve (23) to be opened, etching liquid (8) in the etching liquid supply source (22) is sprayed out through the nozzle (21), the etching liquid (8) is guided to the wafer (7) under the action of the pressing piece (4), then the wafer bearing table (11) is driven by the rotating mechanism to rotate at a set first speed, the wafer bearing table (11) drives the wafer (7) to rotate, and in the rotating process of the wafer (7), the etching liquid (8) can be flatly laid on the wafer (7) through the liquid stirring block (43) on the pressing piece (4);
and C: after the etching solution (8) is uniformly spread on the wafer (7), the controller (3) controls the control valve (23) to be closed, and the etching solution (8) etches the wafer (7) within a set time;
step D: after etching is finished, the controller (3) controls a pump body (63) to be opened, meanwhile, the rotating mechanism drives the wafer bearing table (11) to rotate at a set second speed, and the suction nozzle (61) sucks etching liquid (8) on the wafer (7) into a recovery tank (62);
step F: after the recovery of the etching solution (8) on the wafer (7) is completed, the controller (3) controls the lifting mechanism (5) to push the pressing piece (4) to move in the direction away from the wafer (7), meanwhile, the rotating mechanism stops rotating, the wafer (7) is taken down, the etching effect of the wafer (7) is checked, and if the etching effect of the wafer (7) does not achieve the expected effect, the steps A to F are continuously repeated; if the etching effect of the wafer (7) is as desired, the etching is complete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967929.6A CN115188693A (en) | 2022-08-12 | 2022-08-12 | Monolithic wet etching system and method of operation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967929.6A CN115188693A (en) | 2022-08-12 | 2022-08-12 | Monolithic wet etching system and method of operation |
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| Publication Number | Publication Date |
|---|---|
| CN115188693A true CN115188693A (en) | 2022-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210967929.6A Pending CN115188693A (en) | 2022-08-12 | 2022-08-12 | Monolithic wet etching system and method of operation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115188693A (en) |
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2022
- 2022-08-12 CN CN202210967929.6A patent/CN115188693A/en active Pending
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