CN115186449A - Envelope condition acquisition method for domestic CQFP256 packaging device for aerospace - Google Patents

Envelope condition acquisition method for domestic CQFP256 packaging device for aerospace Download PDF

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CN115186449A
CN115186449A CN202210692054.3A CN202210692054A CN115186449A CN 115186449 A CN115186449 A CN 115186449A CN 202210692054 A CN202210692054 A CN 202210692054A CN 115186449 A CN115186449 A CN 115186449A
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China
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cqfp256
domestic
packaged device
frequency
stress
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张宁
于广良
李军
梁洁玫
王继晓
周月阁
丁颖
刘波
于方
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Beijing Institute of Control Engineering
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Beijing Institute of Control Engineering
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation

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  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

An envelope condition obtaining method for a domestic CQFP256 packaging device for aerospace belongs to the technical field of mechanical reliability of electronic products and comprises the following steps: obtaining a stress-life curve of a domestic CQFP256 packaging device; constructing a characteristic quantity matrix of a domestic CQFP256 packaging device; simulating the packaged device in a typical characteristic quantity matrix and calculating the predicted service life of the domestic CQFP256 packaged device; and determining the envelope condition of the domestic CQFP256 packaged device. The method of the invention provides support for the design condition of high-efficiency verification of mechanical reliability of the model product of the subsequently selected domestic CQFP256 packaging device. Meanwhile, on the basis of meeting the mechanical load condition, powerful guidance and support can be provided for the aspects of chassis configuration selection, device layout position optimization, process reinforcement mode determination and the like.

Description

Envelope condition acquisition method for domestic CQFP256 packaging device for aerospace
Technical Field
The invention relates to an envelope condition acquisition method for a domestic CQFP256 packaged device for aerospace, which is mainly used for efficiently verifying the mechanical applicability of the domestic CQFP256 packaged in an electronic product under the condition of random vibration in the using process and belongs to the field of electronic product reliability.
Background
With the increasing degree of localization of devices, CQFP256 package devices represented by SiP2115 have been widely used. The device has the characteristics of heavy mass, large volume, sensitivity to mechanical load, easy failure and the like. Under the large background that the single-machine product is modularized and the production trend is obvious, the phenomena of device pin fracture and single-machine function abnormity occur for many times under the comprehensive influence of a plurality of factors such as structural configuration, single-board layout, fixing and sealing process and the like under the action of severer mechanical load conditions, the model development progress is seriously influenced, the product development cost is increased, and the design risk of mechanical reliability is increased.
Considering the characteristics of complexity and diversity of electronic products, the following bottlenecks mainly exist in the research on the mechanical adaptability of the domestic CQFP256 device at present:
(1) The simulation analysis is generally realized only by developing the simulation analysis of single-machine products one by one, the simulation work is complicated, the analysis period is long, and the early guidance of the analysis result on the product reliability design is limited;
(2) Due to numerous factors influencing the mechanical reliability of the domestic CQFP256 device, the traditional method cannot be comprehensively considered, so that the simulation analysis result lacks effective check judgment;
(3) The method aims at solving the problems that when a domestic CQFP256 device carries out physical verification, the failure time of the device is difficult to accurately capture, and a verification method and an iterative mode correction method are lacked for a long time, so that a conclusion on the applicability of the device cannot be provided.
Disclosure of Invention
The invention solves the technical problems that: the method overcomes the defects of the prior art, provides a method for acquiring the envelope condition of a domestic CQFP256 packaged device for aerospace, and determines the envelope condition of the CQFP256 device; and further, on the basis of comprehensively considering influence factors, the mechanical envelope range of the device is quantized.
The technical solution of the invention is as follows: an envelope condition acquisition method for a domestic CQFP256 packaged device for aerospace comprises the following steps:
obtaining a stress-life curve of a domestic CQFP256 packaging device;
constructing a characteristic quantity matrix of a domestic CQFP256 packaging device;
simulating the packaged device in a typical characteristic quantity matrix and calculating the predicted service life of the domestic CQFP256 packaged device;
and determining the envelope condition of the domestic CQFP256 packaged device.
Further, the method for obtaining the stress-life curve of the domestic CQFP256 package device is to use a daisy chain circuit board to carry out life test under the condition of constant frequency vibration and obtain the stress-life curve by combining finite element simulation analysis.
Furthermore, the frequency of the fixed-frequency vibration is obtained by carrying out small-order frequency sweeping on the single plate, wherein the frequency sweeping order is 0.1g, and the frequency sweeping range is 10-500Hz.
Further, the frequency of the fixed-frequency vibration is selected as a first-order natural frequency value of the single plate in the frequency sweeping process.
Further, the life time in the constant frequency vibration process is determined according to the first resistance increase time when the dynamic resistance value is continuously increased by more than 30% for 5 times.
Further, the package device is subjected to preliminary mode verification before simulation in the typical characteristic quantity matrix, specifically, a single-board fundamental frequency and a single-board vibration response amplification factor are selected for verification.
Further, through simulation modeling analysis, the maximum stress value of the CQFP256 packaged device under the condition of a combination of various influence factors is calculated, and the predicted service life of the CQFP256 packaged device is calculated by utilizing the stress-service life curve.
An envelope condition acquisition system for a domestic CQFP256 packaged device for aerospace comprises:
the first module is used for acquiring a stress-life curve of a domestic CQFP256 packaging device;
the second module is used for constructing a characteristic quantity matrix of a domestic CQFP256 packaging device;
the third module is used for simulating the packaged device in the typical characteristic quantity matrix and calculating the predicted service life of the domestic CQFP256 packaged device;
and the fourth module is used for determining the envelope condition of the domestic CQFP256 packaged device.
Furthermore, the method for acquiring the stress-life curve of the domestic CQFP256 package device is to utilize the daisy chain circuit board to carry out life test under the condition of fixed frequency vibration and combine finite element simulation analysis to acquire the stress-life curve;
the frequency of the fixed-frequency vibration is obtained by carrying out small-magnitude frequency sweeping on the single plate, wherein the frequency sweeping magnitude is 0.1g, and the frequency sweeping range is 10-500Hz;
selecting the frequency of the fixed-frequency vibration as a first-order inherent frequency value of the single plate in the frequency sweeping process;
the life time in the fixed-frequency vibration process is judged according to the corresponding first resistance increasing time when the dynamic resistance value is continuously increased by more than 30% for 5 times;
performing preliminary die verification on the packaged device before simulation in the typical characteristic quantity matrix, specifically selecting a single-board fundamental frequency and a single-board vibration response amplification factor for verification;
through simulation modeling analysis, the maximum stress value of the CQFP256 packaged device under the condition of a plurality of influence factor combinations is calculated, and the predicted service life of the CQFP256 packaged device is calculated by utilizing the stress-service life curve.
An envelope condition acquisition device for an aerospace domestic CQFP256 packaged device comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor realizes the steps of the envelope condition acquisition method for the aerospace domestic CQFP256 packaged device when executing the computer program.
Compared with the prior art, the invention has the advantages that:
the method of the invention provides support for the design condition of high-efficiency verification of mechanical reliability of model products of domestic CQFP256 packaging devices. Meanwhile, on the basis of meeting the mechanical load condition, powerful guidance and support can be provided for the aspects of chassis configuration selection, device layout position optimization, process reinforcement mode determination and the like.
Drawings
FIG. 1 is a flow chart of mechanical envelope acquisition of a CQFP256 package device of the present invention;
FIG. 2 is a dynamic resistance test curve of the CQFP256 package device of the present invention;
FIG. 3 is a dynamic resistance test curve of the CQFP256 package device of the present invention.
Detailed Description
In order to better understand the technical solutions, the technical solutions of the present application are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present application are detailed descriptions of the technical solutions of the present application, and are not limitations of the technical solutions of the present application, and the technical features in the embodiments and examples of the present application may be combined with each other without conflict.
The envelope condition obtaining method for a domestic CQFP256 packaged device for aerospace provided by the embodiments of the present application is described in further detail below with reference to the drawings in the specification, and specific implementation manners may include (as shown in fig. 1 to 3):
step 1, obtaining stress-life curve of domestic CQFP256 packaging device
The parameter dynamic monitoring of the domestic CQFP256 packaged device is carried out by utilizing the special daisy chain verification board, and the failure time and the corresponding service life value of the device are accurately obtained. And obtaining the dangerous positions, stress and other parameter values of the device by a simulation analysis method, and drawing a stress-life parameter curve of the formed device.
Step 2, characteristic quantity matrix construction of domestic CQFP256 packaging device
Aiming at the domestic CQFP256 packaged device, application tracks, product configuration, layout positions, process reinforcement and mechanical load condition carding of a single machine product are carried out to form a characteristic quantity matrix of the domestic CQFP256 packaged device, and the matrix information is as follows:
numbering Name (R) Track type One-machine configuration Layout position Process reinforcement mode Mechanical load
1. XX…1 Low rail XX…1 Placing area 1 Mode 2 Vibration Condition 1
2. XX…2 Middle and high rail XX…2 Placing area 5 Mode 3 Vibration Condition 2
3. XX…3 Space station XX…2 Placing area 6 Mode 1 Vibration Condition 3
4. …… …… …… …… …… ……
Step 3, simulation result output and service life prediction of packaged device in typical characteristic quantity matrix
And (3) primarily screening the characteristic quantity matrix, determining typical characteristic conditions, carrying out mechanical simulation analysis, obtaining the maximum stress simulation result of the domestic CQFP256 packaging device, and carrying out service life prediction of the packaging device by combining the maximum stress simulation result with the stress-service life parameter curve of the device in the step (1) and taking the failure criterion of the device as the basis.
Step 4, determining envelope conditions of domestic CQFP256 packaged devices
And on the basis of completing the step 3, sampling and combining related parameters in the characteristic quantity matrix, supplementing verification samples, and realizing the iterative analysis of the mechanical envelope conditions under the condition of multiple characteristic quantity combinations. Meanwhile, by combining the previous test conclusion, if the device is intact after being inspected, the characteristic quantity information can be used as a reference to be compared with the subsequent characteristic quantity, and the iteration efficiency is improved. And finally, the solidification determination of the mechanical load successful envelope of the domestic CQFP256 packaging device under different single mechanism types is completed.
In the solution provided in the embodiment of the present application, as shown in fig. 1, the method specifically includes the following steps:
step 1, obtaining stress-life curve of domestic CQFP256 packaging device
The method comprises the steps of symmetrically electrically mounting two domestic CQFP256 devices by using a specially-made 6U daisy chain verification board, introducing resistance test equipment through an external lead, and then assembling a single board and a vibration tool and fixedly sealing to realize the construction of a device test platform. And placing the test platform on a vibration table for vibration test. Dynamic parameter monitoring of the packaged device is carried out, and accurate failure time and corresponding life value of the device are obtained, as shown in fig. 2 and 3.
By means of simulation modeling and analysis, dangerous positions and stress values of the device are obtained, and finally stress-life parameter curve drawing of the domestic CQFP256 device is completed.
Step 2, characteristic quantity matrix construction of domestic CQFP256 packaging device
Aiming at a domestic CQFP256 packaged device, respectively carrying out application tracks, product configuration, layout position and process reinforcement of a single-machine product and carding mechanical load conditions to form a characteristic quantity matrix of the domestic CQFP256 packaged device, wherein the matrix information is as follows:
numbering Name(s) Track type One-machine configuration Layout position Process reinforcing mode Mechanical load
1. XX…1 Low rail XX…1 Placing area 1 Mode 2 Vibration Condition 1
2. XX…2 Middle and high rail XX…2 Placing area 5 Mode 3 Vibration Condition 2
3. XX…3 Space station XX…2 Placing area 6 Mode 1 Vibration Condition 3
4. …… …… …… …… …… ……
The single-machine configuration mainly covers the structure type of the existing main chassis; the layout position fully considers the area division of the 6U single board, and the single board is divided into 8 areas at present; the process reinforcement mode comprises 4 states; the mechanical load conditions are different in types and have larger difference according to requirements.
Step 3, simulation result output and service life prediction of packaged device in typical characteristic quantity matrix
In view of the long iterative period of the product for developing the analysis of the device level, the parameter combination in the characteristic quantity matrix is preliminarily screened in the early stage, the analysis dimension and the number of the sub samples are properly reduced on the premise of ensuring the analysis precision, and the simulation result obtaining and life prediction efficiency are improved. The process mainly adopts a characteristic clustering mode, and matrix information numbers with similar single-machine configuration, identical device layout positions, consistent process reinforcement mode and similar load conditions are classified and screened to form a typical characteristic quantity matrix of the product.
And (2) carrying out mechanical simulation analysis aiming at the combination conditions of various influencing factors to obtain the maximum stress simulation result of the domestic CQFP256 packaged device, combining the maximum stress simulation result with the stress-service life parameter curve of the device in the step (1), taking a three-interval method as a service life model, and carrying out service life prediction of the packaged device by taking the accumulated damage value D (D is more than or equal to 0.7) as a failure criterion of the device. The parameter combination needs to output a simulation result by taking a real load condition and a product state as objects.
Step 4, determining envelope conditions of domestic CQFP256 packaged devices
And (4) on the basis of completing the step (3), taking the verification sufficiency into consideration, sampling and combining the characteristic quantity matrix parameters by a Latin hyper-method sampling method, and supplementing verification samples. And (4) applying the evaluation flow method in the step (3) to realize the iterative analysis of the mechanical envelope condition under the condition of various characteristic quantity combinations. Meanwhile, by combining the previous test information conclusion, if the device is intact after being inspected, the characteristic quantity information can be used as a reference to be compared with the subsequent characteristic quantity, and the iteration efficiency is improved. On the premise of ensuring the sufficiency of the test sample, the mechanical conditions are gradually recorded and drawn, and finally the solidification determination of the mechanical load successful envelope of the domestic CQFP256 package device under different single mechanism types is completed.
On the basis of obtaining the mechanical envelope condition, the test magnitude can be directly distinguished, and a mechanical reliability design conclusion is definitely given. The patent provides a method for efficiently distinguishing the mechanical design margin of a domestic CQFP256 device, supports a plurality of model products to develop the mechanical design judgment of the domestic CQFP256 device, greatly reduces the working period and the development cost, and has a good application effect.
In conclusion, the invention has the beneficial effects that: the method provides support for efficient verification of mechanical reliability design conditions of model products of domestic CQFP256 packaged devices. Meanwhile, on the basis of meeting the mechanical load condition, powerful guidance and support can be provided for the aspects of chassis configuration selection, device layout position optimization, process reinforcement mode determination and the like.
A computer-readable storage medium having stored thereon computer instructions which, when executed on a computer, cause the computer to perform the method of fig. 1.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Those skilled in the art will appreciate that those matters not described in detail in the present specification are well known in the art.

Claims (10)

1. An envelope condition acquisition method for a domestic CQFP256 packaged device for aerospace is characterized by comprising the following steps:
obtaining a stress-life curve of a domestic CQFP256 packaging device;
constructing a characteristic quantity matrix of a domestic CQFP256 packaging device;
simulating the packaged device in the characteristic quantity matrix and calculating the predicted service life of the domestic CQFP256 packaged device;
and determining the envelope condition of the domestic CQFP256 packaged device.
2. The envelope condition acquisition method for an aerospace domestic CQFP256 packaged device according to claim 1, characterized in that: the method for acquiring the stress-life curve of the domestic CQFP256 packaged device is to utilize a daisy chain circuit board to carry out life test under the condition of constant frequency vibration and combine finite element simulation analysis to acquire the stress-life curve.
3. The envelope condition acquisition method for an aerospace domestic CQFP256 packaged device according to claim 2, characterized in that: the frequency of the fixed-frequency vibration is obtained by carrying out small-magnitude frequency sweeping on the daisy chain circuit board, wherein the frequency sweeping magnitude is 0.1g, and the frequency sweeping range is 10-500Hz.
4. The envelope condition acquisition method for an aerospace domestic CQFP256 packaged device according to claim 3, characterized in that: the frequency of the fixed-frequency vibration is selected as a first-order inherent frequency value of the daisy chain circuit board in the frequency sweeping process.
5. The envelope condition acquisition method for an aerospace domestic CQFP256 packaged device according to claim 2, characterized in that: the life time in the fixed frequency vibration process is judged according to the corresponding first resistance increasing time when the dynamic resistance value is continuously increased by more than 30% for 5 times.
6. The method of claim 1 for obtaining the envelope condition of a domestic CQFP256 package device for aerospace use, characterized in that: performing early-stage mold checking on the packaged device before simulation in the characteristic quantity matrix, specifically, selecting the fundamental frequency of the daisy chain circuit board and the vibration response amplification factor of the daisy chain circuit board for verification; and the verification result is used for providing a model basis for obtaining the stress of a subsequent device after the model is calibrated.
7. The method of claim 6, wherein after the model calibration, the maximum stress value of the CQFP256 package device under the condition of a combination of multiple influencing factors is calculated through simulation modeling analysis, and the expected lifetime of the CQFP256 package device is calculated by using the stress-lifetime curve.
8. An envelope condition acquisition system for a domestic CQFP256 packaged device for aerospace, comprising:
the first module is used for acquiring a stress-life curve of a domestic CQFP256 packaging device;
the second module is used for constructing a characteristic quantity matrix of a domestic CQFP256 packaging device;
the third module is used for simulating the packaged device in the characteristic quantity matrix and calculating the estimated service life of the domestic CQFP256 packaged device;
and the fourth module is used for determining the envelope condition of the domestic CQFP256 packaged device.
9. The envelope condition acquisition system for an aerospace domestic CQFP256 packaged device as recited in claim 8, wherein: the method for acquiring the stress-life curve of the domestic CQFP256 packaged device comprises the steps of carrying out life test on a daisy chain circuit board under the condition of constant-frequency vibration and combining finite element simulation analysis to obtain the stress-life curve;
the frequency of the fixed-frequency vibration is obtained by carrying out small-magnitude frequency sweeping on the daisy chain circuit board, wherein the frequency sweeping magnitude is 0.1g, and the frequency sweeping range is 10-500Hz;
the frequency of the fixed-frequency vibration is selected as a first-order inherent frequency value of the daisy chain circuit board in the frequency sweeping process;
the life time in the fixed-frequency vibration process is judged according to the corresponding first resistance increasing time when the dynamic resistance value is continuously increased by more than 30% for 5 times;
performing preliminary mold verification on the packaged device before simulation in the typical characteristic quantity matrix, specifically, selecting fundamental frequency of the daisy chain circuit board and vibration response amplification times of the daisy chain circuit board for verification;
through simulation modeling analysis, the maximum stress value of the CQFP256 packaged device under the condition of a plurality of influence factors is calculated, and the predicted service life of the CQFP256 packaged device is calculated by utilizing the stress-service life curve.
10. An envelope condition acquisition apparatus for an aerospace domestic CQFP256 packaged device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: the processor, when executing the computer program, performs the steps of the method according to any one of claims 1 to 7.
CN202210692054.3A 2022-06-17 2022-06-17 Envelope condition acquisition method for domestic CQFP256 packaging device for aerospace Pending CN115186449A (en)

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CN202210692054.3A CN115186449A (en) 2022-06-17 2022-06-17 Envelope condition acquisition method for domestic CQFP256 packaging device for aerospace

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