CN115180959A - Forming method of environment-friendly water-based gel system silicon nitride ceramic substrate - Google Patents

Forming method of environment-friendly water-based gel system silicon nitride ceramic substrate Download PDF

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CN115180959A
CN115180959A CN202210851536.9A CN202210851536A CN115180959A CN 115180959 A CN115180959 A CN 115180959A CN 202210851536 A CN202210851536 A CN 202210851536A CN 115180959 A CN115180959 A CN 115180959A
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silicon nitride
ceramic substrate
gel system
environment
nitride ceramic
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CN115180959B (en
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马成良
高正霞
刘源
李祥
赵振威
陶梦雅
刘伟
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Henan Beixing Jinggong Technology Co ltd
Zhengzhou University
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Zhengzhou University
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Abstract

The invention discloses a forming method of an environment-friendly water-based gel system silicon nitride ceramic substrate, which combines the advantages of gel injection molding and spin coating forming, selects a nontoxic isobutylene-maleic anhydride copolymer (ISOBAM) spontaneous gel system, uses deionized water as a solvent to prepare a premixed solution, performs ball milling with ceramic powder, subsequently adds a plasticizer, continues ball milling uniformly, forms a sheet-shaped blank body through spin coating, can be further processed after curing and drying, and does not need to add a binder, a dispersant, an initiator and a catalyst. The raw materials selected by the method are cheap and easily available, environment-friendly, non-toxic, green and economical, the organic matter addition amount in the process is less, the influence on the environment is small, and the subsequent rubber discharge work is easy to carry out; the gel system does not generate oxygen inhibition effect, does not need inert gas protection, and has simple process and convenient operation.

Description

Forming method of environment-friendly water-based gel system silicon nitride ceramic substrate
Technical Field
The invention relates to a forming method of an environment-friendly water-based gel system silicon nitride ceramic substrate, belonging to the field of inorganic nonmetal.
Background
In order to solve energy and environmental problems, electric energy is gradually replacing fossil energy to become the mainstream of world development. Driven by the need for efficient control and conversion of power, power electronics technology is moving toward higher voltages, higher currents, higher power densities, and smaller sizes. However, high power can generate large thermal stresses in the device, which poses a significant challenge to the assembly and packaging materials of the device, particularly brittle ceramic substrates having electrical insulation and heat dissipation functions. Due to silicon nitride (Si) 3 N 4 ) The ceramic has the advantages of high thermal conductivity, excellent mechanical property, low thermal expansion coefficient and the like, and becomes a high-power electronic device substrate with great potential.
At present, in the film-making process, the spin coating and blade coating technologies are widely applied. The non-water-based slurry forming system has the advantages of low boiling point, easiness in drying, low surface tension, hydration inhibition, short production time and the like, and is already used for industrial production, but almost all non-water-based forming systems have the defects of being toxic to human bodies, harmful to the environment after volatilization, flammable, explosive and the like. With the development trend of environmental protection and clean production, particularly the development strategy of 'carbon neutralization' is put forward in China, and the water-based slurry forming technology becomes a hot point of attention of people due to the characteristics of no toxicity, cleanness, low cost and the like.
The principle of the gel casting process is that ceramic powder is dispersed in a solution containing an organic monomer and a cross-linking agent to prepare a suspension with low viscosity and high solid content, then an initiator and a catalyst are added, and the ceramic powder is uniformly distributed in a three-dimensional network structure formed by a high polymer by utilizing the polymerization in-situ solidification forming of the organic monomer, so that a green body which has a uniform structure, high density, certain strength and can be further processed is prepared. On the basis, a gel casting technology is combined with a spin coating technology, and a new forming method is researched.
In the patent of CN 114538935A, "a method for forming a high thermal conductivity silicon nitride substrate", alcohol-soluble gel monomers such as acrylamide and methacrylamide, alcohol organic compounds as solvents, and a dispersant, a plasticizer and an initiator are added to prepare a casting sheet with certain strength and toughness, thereby realizing the preparation of a high performance silicon nitride ceramic substrate. However, the organic monomer used in the method has certain toxicity, and can affect the health of people and the natural environment.
Therefore, the invention provides a novel gel coating and forming scheme for preparing the silicon nitride ceramic substrate, which is low in cost, non-toxic and environment-friendly.
Disclosure of Invention
The isobutylene-maleic anhydride copolymer (ISOBAM) is a novel nontoxic and environment-friendly water-soluble copolymer and is a spontaneous gelling agent. The method selects the ISOBAM gel system, takes silicon powder as the starting raw material, reduces the addition of organic matters, has simple steps and saves the cost, and provides the method for forming the silicon nitride ceramic substrate of the environment-friendly water-based gel system.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
(1) Preparing materials and performing ball milling, namely mechanically stirring and mixing ISOBAM and deionized water to prepare a premixed liquid, and then mixing the premixed liquid, silicon powder and sintering aid powder, adding silicon nitride grinding balls into the premixed liquid and performing ball milling;
(2) Adding a plasticizer, and continuing to perform secondary ball milling after adding the plasticizer into the slurry subjected to the primary ball milling;
(3) Removing bubbles in vacuum, namely removing bubbles in vacuum in the slurry obtained after the ball milling for two times;
(4) And (3) molding, namely preparing a flaky biscuit with the thickness of 0.25-0.80 mm by using the slurry subjected to defoaming treatment by a rotary coating method, curing, drying and cutting.
Preferably, the adding amount of the ISOBAM is 1-10% of the mass of the ceramic powder, and the solid content of the slurry is 40-68%.
Preferably, the sintering aid is a mixture of rare earth oxide and magnesium oxide, and the total content of the sintering aid is 2-15 mol%.
Preferably, the plasticizer is one or a mixture of polyethylene glycol and glycerol, so that the formed biscuit has certain flexibility, and the addition amount is 2-15% of the mass of the ceramic powder.
Preferably, the time of the first ball milling in the step is 2-8 h, and the time of the second ball milling in the step is 6-16 h.
Preferably, the vacuum defoaming time is 5 to 30min, and if the defoaming time is too short, pores cannot be sufficiently removed, and conversely, if the defoaming time is too long, unnecessary evaporation of liquid and change in rheology of the slurry may be caused.
Preferably, the rotation speed of the spin-coating substrate is 700-800 r/min, a static spin-coating mode is adopted, and the spin-coating time is 5-90 s.
Preferably, a raised step is arranged at the edge of the spin coating equipment to form a closed frame so as to control the thickness of the spin coating film.
Preferably, the curing and drying temperature is room temperature, and the drying time is 12-24 h.
Compared with the prior art, the invention has the following beneficial effects:
1. the method selects the high-purity silicon powder as the starting material, solves the problem that imported silicon nitride powder with lower oxygen content is too expensive, has mature domestic high-purity silicon powder preparation technology, can control the oxygen content at a lower level, and can improve the heat conductivity of the product.
2. The solvent in the method is deionized water, so that the toxic solvent used in the traditional preparation of silicon nitride substrate slurry is replaced, the method is harmless to human bodies and environment, and the cost is saved.
3. The gel system ISOBAM in the method can be used as a binder for a ceramic processing technology, no additional binder is needed, the viscosity of slurry can be effectively reduced, the solid content is improved, the density of a formed biscuit can be obviously improved, the subsequent sintering is more compact, and the heat conductivity of a product is improved.
4. The ISOBAM has a dispersing function in the aqueous solution, can be used as a dispersing agent of the slurry system of the method, and omits the addition of an organic dispersing agent; in addition, ISOBAM is a spontaneous gel system, and an initiator and a catalyst which are required by a common gel system are not required to be added subsequently, so that the difficulty of the gel discharge process is reduced, and the ISOBAM is environment-friendly.
5. The method has the advantages of no oxygen inhibition effect, no need of inert gas protection, simple process and convenient operation.
6. By using the spin coating method, a very thin substrate green body can be prepared, the method has low requirement on the viscosity of slurry, and a green body sheet with higher solid content and more compactness can be easily prepared.
The gel system used in the method is safe, non-toxic, cheap and easily available, the content of the added organic matters is low, the method is green and environment-friendly, the process is simple, the operation is convenient, and the method is a silicon nitride ceramic forming method with wide development prospect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention, are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a flow chart of the method.
FIG. 2 is a photograph of a biscuit of the silicon film produced.
Detailed Description
In order to better illustrate the technical solution and the product performance of the present invention, the following will be further described with reference to specific examples. However, the examples are only illustrative and do not limit the scope of the present invention.
Example 1
The forming method of the silicon nitride ceramic substrate of the environment-friendly water-based gel system in the embodiment comprises the following steps:
(1) 5g of ISOBAM was weighed, dissolved in 100mL of deionized water and mechanically stirred for 20min.
(2) 100g of silicon powder is weighed, and yttrium oxide and magnesium oxide are weighed according to the proportion, so that the silicon nitride after complete nitridation: yttrium oxide: and (3) adding the magnesium oxide into the premixed liquid obtained in the step (1) according to the molar ratio of 93.
(3) And (3) adding PEG-600 (the mass ratio is 9.5%) into the mixture obtained in the step (2), and continuing ball milling for 12 hours to obtain slurry with certain viscosity.
(4) Vacuum defoaming for 20min; at the temperature of 30 ℃, the slurry is poured into a substrate, a 0.5mm frame is arranged, the spin-coating equipment is started, the rotating speed is 700rpm, and the spin-coating time is 60s. Curing and drying for 12h, stripping the green sheet from the substrate, and further cutting to obtain a green sheet with the thickness of 0.30-0.45 mm, smooth and compact surface and small shrinkage.
Example 2
The forming method of the silicon nitride ceramic substrate of the environment-friendly water-based gel system in the embodiment comprises the following steps:
(1) 8g of ISOBAM was weighed, dissolved in 80mL of deionized water and mechanically stirred for 20min.
(2) Weighing 100g of silicon powder, and weighing yttrium oxide and magnesium oxide according to the proportion, so that the silicon nitride after complete nitridation: yttrium oxide: and (3) adding the magnesium oxide into the premixed liquid obtained in the step (1) according to the molar ratio of 93.
(3) And (3) adding PEG-600 (the mass ratio is 12%) into the mixture obtained in the step (2), and continuing ball milling for 12 hours to obtain slurry with certain viscosity.
(4) Vacuum defoaming for 20min; at the temperature of 30 ℃, the slurry is poured into a substrate, a 0.5mm frame is arranged, the spin coating equipment is started, the rotating speed is 800rpm, and the spin coating time is 60s. Curing and drying for 12h, stripping the green body sheet from the substrate, and further cutting to obtain a green body sheet with the thickness of 0.40-0.50 mm, wherein the green body sheet has a smooth and compact surface, certain toughness and small shrinkage rate.
The above description is only a specific description of the present technology as a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto. Those skilled in the art can easily conceive of changes or substitutions to the technical solution of the present invention, and the changes or substitutions are intended to be included within the scope of the claims of the present invention without departing from the spirit and scope of the present invention.

Claims (9)

1. A forming method of an environment-friendly water-based gel system silicon nitride ceramic substrate is characterized by comprising the following steps:
(1) Preparing materials and ball milling, namely mechanically stirring and mixing isobutylene-maleic anhydride copolymer (ISOBAM) and deionized water to prepare premixed liquid, and then mixing the premixed liquid, silicon powder and sintering aid powder, adding silicon nitride grinding balls and carrying out ball milling;
(2) Adding a plasticizer, and continuing to perform secondary ball milling after adding the plasticizer into the slurry subjected to the primary ball milling;
(3) Removing bubbles in vacuum, namely removing bubbles in vacuum in the slurry obtained after the ball milling for two times;
(4) And (3) molding, namely preparing the slurry subjected to defoaming treatment into a sheet-shaped biscuit with the thickness of 0.25-0.80 mm by a rotary coating method, curing, drying and cutting.
2. The method for forming the silicon nitride ceramic substrate in the environment-friendly water-based gel system as claimed in claim 1, wherein the ISOBAM is added in an amount of 1-10% by mass of the ceramic powder, and the slurry has a solid content of 40-68%.
3. The method for forming an environmental-friendly water-based gel system silicon nitride ceramic substrate as claimed in claim 1, wherein the sintering aid is a mixture of rare earth oxide and magnesium oxide, and the total content of the sintering aid is 2-15 mol%.
4. The method for molding the silicon nitride ceramic substrate in the environment-friendly water-based gel system as claimed in claim 1, wherein the plasticizer is one or a mixture of polyethylene glycol and glycerol, so as to enable the molded biscuit to have certain flexibility, and the addition amount is 2-15% of the mass of the ceramic powder.
5. The method for molding the silicon nitride ceramic substrate with the environment-friendly water-based gel system as claimed in claim 1, wherein the first ball milling time in the step is 2-8 h, and the second ball milling time is 6-16 h.
6. The method for forming an environmental protection water-based gel system silicon nitride ceramic substrate according to claim 1, wherein the vacuum defoaming time is 5-30 min, if too short, the pores are not removed sufficiently, otherwise, too long time may result in unnecessary evaporation of liquid and change of slurry rheology.
7. The method for forming the silicon nitride ceramic substrate according to claim 1, wherein the rotation speed of the spin-coating substrate is 700-800 r/min, a static spin-coating mode is adopted, and the spin-coating time is 5-90 s.
8. The method for forming an environmental protection water-based gel system silicon nitride ceramic substrate according to claim 1, wherein a raised step is arranged at the edge of the spin coating device to form a closed frame to control the thickness of the spin coating film.
9. The method for forming the silicon nitride ceramic substrate according to claim 1, wherein the curing and drying temperature is room temperature, and the drying time is 12-24 h.
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Cited By (1)

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CN117303914A (en) * 2023-11-30 2023-12-29 山东合创明业精细陶瓷有限公司 Preparation method of plastic ceramic biscuit

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CN111205093A (en) * 2019-04-26 2020-05-29 中国科学院上海硅酸盐研究所 Preparation method of ultra-light silicon nitride foamed ceramic
CN111253153A (en) * 2020-01-22 2020-06-09 新沂市锡沂高新材料产业技术研究院有限公司 Method for preparing toughened large-size ultrathin YAG transparent ceramic biscuit based on Isodam gel system
CN112159236A (en) * 2020-10-19 2021-01-01 江苏贝色新材料有限公司 High-thermal-conductivity silicon nitride ceramic substrate and preparation method thereof
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JPH1087370A (en) * 1996-09-06 1998-04-07 Hitachi Ltd Silicon nitride-base composite ceramics and production thereof
CN104230345A (en) * 2014-09-15 2014-12-24 中国科学院上海硅酸盐研究所 Preparation method of porous silicon nitride ceramic material
CN106631039A (en) * 2016-11-04 2017-05-10 广东工业大学 Preparation method of silicon nitride ceramic substrate
CN108863394A (en) * 2017-05-10 2018-11-23 中国科学院上海硅酸盐研究所 A kind of method that gel pouring combination freeze-drying prepares porous ceramics
CN108276006A (en) * 2018-01-25 2018-07-13 武汉科技大学 A kind of porous SiN ceramic and preparation method thereof
CN111205093A (en) * 2019-04-26 2020-05-29 中国科学院上海硅酸盐研究所 Preparation method of ultra-light silicon nitride foamed ceramic
CN111253153A (en) * 2020-01-22 2020-06-09 新沂市锡沂高新材料产业技术研究院有限公司 Method for preparing toughened large-size ultrathin YAG transparent ceramic biscuit based on Isodam gel system
CN112159236A (en) * 2020-10-19 2021-01-01 江苏贝色新材料有限公司 High-thermal-conductivity silicon nitride ceramic substrate and preparation method thereof
CN112811913A (en) * 2021-03-11 2021-05-18 无锡辰海新材料科技有限公司 Method for preparing silicon nitride ceramic biscuit by environment-friendly gel injection molding
CN114044682A (en) * 2021-11-29 2022-02-15 上海材料研究所 Method for preparing high-thermal-conductivity silicon nitride ceramic by water-based slurry gel injection molding

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CN117303914A (en) * 2023-11-30 2023-12-29 山东合创明业精细陶瓷有限公司 Preparation method of plastic ceramic biscuit
CN117303914B (en) * 2023-11-30 2024-03-15 山东合创明业精细陶瓷有限公司 Preparation method of plastic ceramic biscuit

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