CN115175441B - Vacuum low dielectric constant and low conductivity micro-current transmission circuit board - Google Patents
Vacuum low dielectric constant and low conductivity micro-current transmission circuit board Download PDFInfo
- Publication number
- CN115175441B CN115175441B CN202210914373.4A CN202210914373A CN115175441B CN 115175441 B CN115175441 B CN 115175441B CN 202210914373 A CN202210914373 A CN 202210914373A CN 115175441 B CN115175441 B CN 115175441B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conducting wire
- copper conducting
- potential copper
- dielectric constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 2
- 239000007787 solid Substances 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 abstract description 5
- 150000003839 salts Chemical class 0.000 abstract description 5
- 239000011810 insulating material Substances 0.000 abstract description 4
- 239000003595 mist Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 8
- 239000012774 insulation material Substances 0.000 description 7
- 239000012212 insulator Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity, which comprises a circuit board, wherein the circuit board comprises an insulating body, a ground potential copper conducting wire and a high potential copper conducting wire are arranged on the insulating body in a distributed mode, a mounting hole for fixing the circuit board is formed in the insulating body, a hollowed-out air gap is formed between the ground potential copper conducting wire and the high potential copper conducting wire on the circuit board, shielding covers provided with sealing rings are respectively arranged on two sides of the circuit board, sealing air nozzles for vacuumizing are arranged on the shielding covers, and conductors on the shielding covers are electrically connected with the ground potential copper conducting wire. The circuit board solves the problem that micro-current signals in high-voltage electrical equipment are measured to leak along the surface of the circuit board or solid insulating materials of the circuit board, so that effective signals entering an amplifier are reduced; meanwhile, the problem that detection current leaks along the surface of the circuit board due to high air humidity in coastal areas with serious air humidity or salt mist is solved.
Description
Technical Field
The invention relates to a vacuum low dielectric constant and low conductivity-based micro-current transmission circuit board, belonging to the field of high voltage and insulation.
Background
With the continuous growth of national economy, electric energy plays an increasingly important role in industrial production and people's life, and ultra-high voltage transmission is an important component of energy strategy in China. In order to meet the insulation standard, dielectric materials with good insulation performance are widely used for high-voltage electrical equipment. Wherein insulation resistance is an important indicator for measuring insulation properties of insulation materials or devices. Because the insulating material or insulating structure has high performance, the detection current is generally 10 percent -10 The signal is extremely weak, on the order of a or lower. Leakage current on the circuit board can have a large impact on the detected current signal. Meanwhile, as the electromagnetic environment where the detection equipment is located is bad, the space strong electromagnetic field can cause interference to effective signals through stray capacitance. Therefore, the circuit board carrying the detection current is required to have smaller leakage current and smaller leakage currentIs a distributed capacitance of (a).
Disclosure of Invention
The invention aims to provide a micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity, which aims to solve the problem that effective signals entering an amplifier are reduced due to leakage of micro-current signals in high-voltage electrical equipment along the surface of the circuit board or solid insulating materials of the circuit board; meanwhile, the problem that the circuit board is interfered by a space strong electromagnetic field to interfere with effective signals and influence the measurement result is solved; further, the problem that detection current leaks along the surface of the circuit board due to high air humidity in coastal areas with serious air humidity or salt mist is solved.
The invention aims at realizing the following technical scheme: the utility model provides a little electric current transmission circuit board based on vacuum low dielectric constant and low conductivity, includes the circuit board, the circuit board includes insulator, be provided with earth potential copper conductor wire and high potential copper conductor wire on the insulator, it is used for fixed circuit board's mounting hole to open on the insulator, be provided with the fretwork air gap between earth potential copper conductor wire and the high potential copper conductor wire on the circuit board, the circuit board both sides are added respectively and are equipped with the shield cover of sealing washer, install the sealed air cock that is used for the evacuation on the shield cover, and conductor and earth potential copper conductor wire electricity on the shield cover are connected.
The invention has the advantages that: through carrying out fluting, set up the fretwork air gap around carrying the conductive line of little current signal on the circuit board, utilize in the air or vacuum environment carrier quantity less, electron collision is less to lead to vacuum environment resistivity to be higher than solid insulation or gas insulation material and gas insulation material resistivity is higher than the characteristic of solid insulation material resistivity, increased the resistance around carrying little current signal conductive line, and then effectually solved the problem that little current signal leaks along circuit board solid insulation material and circuit board surface in the circuit, the condition that the effective signal that gets into the amplifier reduces has been solved, make the measuring result more accurate. Meanwhile, the metal covers with the sealing rings are additionally arranged on the two sides of the circuit board, and the sealing air tap capable of being vacuumized is arranged, so that the circuit board works in a vacuum environment, the promotion effect of the environmental humidity and the salt content on the leakage current is further reduced, and the leakage current of the circuit board can be further reduced without influencing the leakage current of the circuit board due to the environment, so that the circuit board has higher stability. Furthermore, the metal cover is grounded, so that space electromagnetic interference can be shielded, and accuracy of test current is improved.
Because stray capacitance exists between wires with different potentials on the circuit board, the capacitive capacitance flows through the circuit board at high frequency, and the influence on signals is larger. Therefore, through hollowed-out treatment among conductors with different electric potentials, air is used for replacing an epoxy plate to reduce stray capacitance (the stray capacitance is in direct proportion to the relative dielectric constant, the relative dielectric constant of the epoxy plate is 4.2-4.7, the relative dielectric constant of air in a standard state is 1.00053, and the theoretical stray capacitance can be reduced by 75%). In addition, the metal shielding cover with the sealing function is added outside the epoxy board, electromagnetic waves are shielded, and meanwhile, the influence of the external environment on signals on the circuit board is reduced (the influence on the signals due to high humidity and salt fog weight in coastal areas).
The upper side and the lower side of the circuit board are additionally provided with metal covers, and the metal covers are provided with a suction nozzle, a sealing belt and a clamping device, wherein the clamping device is made of metal and is used for electrically connecting the upper metal cover and the lower metal cover to form a shielding cover.
Vacuum or negative pressure is formed in the shielding case through air suction, so that the electric conductivity is further reduced compared with an air environment, and leakage current increase caused by overlarge humidity of an operating environment can be avoided; the upper metal cover and the lower metal cover form a shielding cover, which can shield space electromagnetic waves and reduce the interference of external electromagnetic environment on transmission signals. The circuit board hollowed-out processing reduces stray capacitance between different potential conductors on the circuit board, and can reduce signal interference of the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity according to the present invention.
Fig. 2 is a schematic diagram of a circuit board assembly of the hollowed-out treatment of the micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity according to the present invention.
In the figure: 1. an insulating body; 2. a ground potential copper conductive line; 3. a high potential copper conductive line; 4. a metal pad; 5. hollow air gaps; 6. a mounting hole; 7. a seal ring; 8. a shield; 9. sealing the air tap; 10. and a clamping device.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention are included in the protection scope of the present invention.
The following description of the present embodiment is made with reference to fig. 1 and 2, where the micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity in this embodiment includes a circuit board, the circuit board includes an insulation body 1, a ground potential copper conductive wire 2 and a high potential copper conductive wire 3 are arranged on the insulation body 1, a mounting hole 6 for fixing the circuit board is formed in the insulation body 1, a hollowed-out air gap 5 is formed between the ground potential copper conductive wire 2 and the high potential copper conductive wire 3 on the circuit board, shielding covers 8 provided with sealing rings 7 are respectively added on two sides of the circuit board, sealing air nozzles 9 for vacuumizing are mounted on the shielding covers 8, the sealing air suction nozzles can be automatically locked and kept sealed after vacuumizing, and the conductors on the shielding covers 8 are electrically connected with the ground potential copper conductive wire 2.
Further, the insulating body 1 material on the circuit board is an epoxy glass fiber cloth laminated board.
Further, the hollowed-out air gap 5 is arranged on the circuit board and penetrates through the circuit board, so that leakage of the micro-current signal on the high-potential copper conducting wire 3 of the micro-current signal obtained by conducting measurement is reduced. When the hollow air gap is arranged in the slotting process, slotting operation is carried out along the adjacent area of the high-potential copper conducting wire 3 of the micro-current signal obtained by conducting measurement as far as possible, and the hollow air gap area of the adjacent area of the high-potential copper conducting wire 3 of the micro-current signal obtained by conducting measurement is increased as far as possible under the precondition that the mechanical supporting effect of the circuit board on the high-potential copper conducting wire 3 of the micro-current signal obtained by conducting measurement is ensured.
Further, the hollow air gap 5 is in a groove shape, and the depth of the hollow air gap 5 occupies one half or three quarters of the thickness of the circuit board, and the hollow air gap 5 does not penetrate the circuit board. When the circuit board is a double-layer board and the circuit board cannot be completely hollowed out, the hollowed-out air gap 5 can be changed into a groove shape, so that the insulation resistance between the ground potential copper conducting wire 2 and the high potential copper conducting wire 3 for conducting the micro-current signal obtained by measurement is increased, and the leakage current between the ground potential copper conducting wire 2 and the high potential copper conducting wire 3 for conducting the micro-current signal obtained by measurement is further reduced.
Further, the width of the hollowed air gap 5 extends to the boundary between the ground potential copper conducting wire 2 and the high potential copper conducting wire 3 conducting the signal current.
Further, the two end positions of the ground potential copper conducting wire 2 and the high potential copper conducting wire 3 are respectively provided with a metal bonding pad 4 which is connected with a pin of the component in a welding mode.
Further, the high-potential copper conducting wire 3 sends the collected micro-current signal into an amplifier to form an effective signal and carries out subsequent processing.
Further, the metal pads 4 are respectively connected with the ground potential copper conductive wires 2 and the high potential copper conductive wires 3 arranged on the circuit board to form an electric path.
Further, a clamping device 10 is arranged between the metal covers 8 on two sides of the circuit board.
Further, the shield case 8 may be any one of a metal case, a glass case to which a metal plating layer is attached, and a plastic case to which a metal plating layer is attached.
At present, the adjacent area of the high-potential copper conducting wire 3 for conducting the micro-current signal obtained by measurement on the circuit board is not intentionally provided with a hollowed-out air gap due to the purpose of reducing the leakage of the micro-current signal, and when the micro-current signal flows through, the micro-current signal is leaked to the adjacent ground potential copper conducting wire 2 due to the fact that the resistivity of the solid insulating material of the circuit board is lower than that of air or vacuum state. In this embodiment, through conducting the slotting around the high potential copper conducting wire 3 of the micro-current signal that is measured and setting up the fretwork air gap on the circuit board, utilize in the air or vacuum environment carrier quantity few, electron collision is less to cause vacuum environment resistivity higher than solid insulation or gas insulation material this characteristic, increased the resistance around the conducting wire bearing micro-current signal, and then effectually solved the problem that micro-current signal leaks along circuit board solid insulation material and circuit board surface in the circuit, solved the condition that the effective signal that gets into the amplifier reduces, make the measuring result more accurate. Meanwhile, the shielding 8 covers with the sealing rings 7 are additionally arranged on two sides of the circuit board, and the sealing air tap 9 capable of being vacuumized is arranged, so that the circuit board works in a vacuum or negative pressure environment, the promotion effects of high ambient humidity and salt content on leakage current are further reduced, and the leakage current of the circuit board can be further reduced without influencing the leakage current of the circuit board due to the environment, and the circuit board has higher stability. Further, the shielding cover 8 is grounded, so that space electromagnetic interference can be shielded, and accuracy of test current is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. Micro-current transmission circuit board based on vacuum low dielectric constant and low conductivity, including the circuit board, its characterized in that: the circuit board comprises an insulating body (1), a ground potential copper conducting wire (2) and a high potential copper conducting wire (3) are arranged on the insulating body (1), a mounting hole (6) for fixing the circuit board is formed in the insulating body (1), a hollowed-out air gap (5) is formed between the ground potential copper conducting wire (2) and the high potential copper conducting wire (3) on the circuit board, shielding covers (8) provided with sealing rings (7) are respectively arranged on two sides of the circuit board in an additional mode, sealing air nozzles (9) for vacuumizing are arranged on the shielding covers (8), and conductors on the shielding covers (8) are electrically connected with the ground potential copper conducting wire (2);
the hollowed-out air gap (5) is arranged on the circuit board and penetrates through the circuit board; or the hollow air gap (5) is in a groove shape, the depth of the hollow air gap (5) occupies one half or three quarters of the thickness of the circuit board, and the hollow air gap (5) does not penetrate through the circuit board;
the high-potential copper conducting wire (3) sends the collected micro-current signal into an amplifier to form an effective signal and carries out subsequent processing;
a clamping device (10) is arranged between shielding cases (8) at two sides of the circuit board;
the shielding cover (8) comprises any one of a metal cover, a glass cover attached with a metal coating layer and a plastic cover attached with a metal coating layer.
2. The vacuum low dielectric constant and low conductivity based micro current transfer circuit board of claim 1, wherein: the insulating body (1) on the circuit board is made of epoxy glass fiber cloth laminated board.
3. The vacuum low dielectric constant and low conductivity based micro current transfer circuit board of claim 2, wherein: the width of the hollowed-out air gap (5) extends to the boundary of the ground potential copper conducting wire (2) and the high potential copper conducting wire (3) conducting signal current.
4. The vacuum low dielectric constant and low conductivity based micro current transfer circuit board of claim 3, wherein: and metal pads (4) which are connected with pins of the components in a welding mode are respectively arranged at the two end positions of the ground potential copper conducting wire (2) and the high potential copper conducting wire (3).
5. The vacuum low dielectric constant and low conductivity based micro current transfer circuit board of claim 4, wherein: the metal bonding pad (4) is respectively connected with the ground potential copper conducting wire (2) and the high potential copper conducting wire (3) which are arranged on the circuit board to form an electric path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210914373.4A CN115175441B (en) | 2022-08-01 | 2022-08-01 | Vacuum low dielectric constant and low conductivity micro-current transmission circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210914373.4A CN115175441B (en) | 2022-08-01 | 2022-08-01 | Vacuum low dielectric constant and low conductivity micro-current transmission circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115175441A CN115175441A (en) | 2022-10-11 |
| CN115175441B true CN115175441B (en) | 2024-03-12 |
Family
ID=83476550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210914373.4A Active CN115175441B (en) | 2022-08-01 | 2022-08-01 | Vacuum low dielectric constant and low conductivity micro-current transmission circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115175441B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315446A (en) * | 1998-06-16 | 2000-11-14 | Oki Electric Ind Co Ltd | Submersion detection circuit |
| JP2004228113A (en) * | 2003-01-20 | 2004-08-12 | Rion Co Ltd | Insulating structure using printed board |
| CN201197259Y (en) * | 2008-05-30 | 2009-02-18 | 青岛海信电器股份有限公司 | Electronic equipment with shielding case |
| CN102293068A (en) * | 2009-01-30 | 2011-12-21 | 佳能株式会社 | Multilayer printed circuit board |
| CN208572545U (en) * | 2018-08-06 | 2019-03-01 | 昆山华晨电子有限公司 | High-performance and high accuracy vacuum metallization processes hole circuit board |
| JP2020053533A (en) * | 2018-09-26 | 2020-04-02 | 京セラ株式会社 | Wiring board, electronic component package, and electronic apparatus |
| CN212183813U (en) * | 2020-05-29 | 2020-12-18 | 成都博宇利华科技有限公司 | PCB circuit board structure for shielding electromagnetic interference of crystal oscillator |
| CN216058116U (en) * | 2021-09-03 | 2022-03-15 | 合肥四强电子科技有限公司 | Anti-interference circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6613978B2 (en) * | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
-
2022
- 2022-08-01 CN CN202210914373.4A patent/CN115175441B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315446A (en) * | 1998-06-16 | 2000-11-14 | Oki Electric Ind Co Ltd | Submersion detection circuit |
| JP2004228113A (en) * | 2003-01-20 | 2004-08-12 | Rion Co Ltd | Insulating structure using printed board |
| CN201197259Y (en) * | 2008-05-30 | 2009-02-18 | 青岛海信电器股份有限公司 | Electronic equipment with shielding case |
| CN102293068A (en) * | 2009-01-30 | 2011-12-21 | 佳能株式会社 | Multilayer printed circuit board |
| CN208572545U (en) * | 2018-08-06 | 2019-03-01 | 昆山华晨电子有限公司 | High-performance and high accuracy vacuum metallization processes hole circuit board |
| JP2020053533A (en) * | 2018-09-26 | 2020-04-02 | 京セラ株式会社 | Wiring board, electronic component package, and electronic apparatus |
| CN212183813U (en) * | 2020-05-29 | 2020-12-18 | 成都博宇利华科技有限公司 | PCB circuit board structure for shielding electromagnetic interference of crystal oscillator |
| CN216058116U (en) * | 2021-09-03 | 2022-03-15 | 合肥四强电子科技有限公司 | Anti-interference circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115175441A (en) | 2022-10-11 |
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