CN115172239B - Semiconductor diode forming device - Google Patents
Semiconductor diode forming device Download PDFInfo
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- CN115172239B CN115172239B CN202210834495.2A CN202210834495A CN115172239B CN 115172239 B CN115172239 B CN 115172239B CN 202210834495 A CN202210834495 A CN 202210834495A CN 115172239 B CN115172239 B CN 115172239B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the field of diode forming, in particular to a semiconductor diode forming device, which comprises a workbench, a feeding mechanism and a cutting and bending integrated mechanism, wherein the feeding mechanism is fixedly arranged above the workbench; the feeding mechanism comprises a feeding table, a material guide plate and a feeder; the upper end surface of the feeding table is horizontally arranged; the two guide plates are respectively arranged at two sides of the feeding table, each guide plate is provided with a first guide groove matched with the diode material belt, and the feeding end of each guide plate is provided with a guide piece for guiding the diode material belt to enter the first guide groove; the middle part of each guide plate is provided with a blank position, and the feeder is arranged at the blank position of the guide plate and spans over the feeding table; this application can guarantee the steady transportation to the diode material area through the cooperation of stock guide and feeder, is provided with the guide at the feed end of stock guide, can prevent that the diode material area from blocking at the stock guide feed end.
Description
Technical Field
The invention relates to the field of diode forming, in particular to a semiconductor diode forming device.
Background
After the production of the diode is finished, a plurality of diodes are uniformly arranged on a material belt so as to be convenient for transportation and processing of the diode, when the diode is put into use, pins of the diode are required to be molded into a required shape and then are installed on a circuit board or a product, and the diodes are cut off from the material belt generally, and then the pins of the diode are bent and molded from a required position.
At present, a diode is generally cut off from a material belt by manpower or a machine, and then the cut diode is put into bending equipment for bending and forming, so that the working efficiency is affected. There is a small amount of cutting all-in-one of bending on the market, can cut and bend the shaping to the diode material area synchronization, has improved work efficiency, but, is unstable to the in-process of diode material area pay-off, very easily causes the diode material area to block to make the diode material area fracture or crooked, influence the machine-shaping to the diode.
And when current cutting all-in-one of bending is handled different batch diode material area, because the diode position of bending is not fixed, realize through changing equipment or cutter of bending generally, influence work efficiency.
Disclosure of Invention
To the problem that prior art exists, provide a semiconductor diode forming device, can guarantee the steady transportation to the diode material area through the cooperation of stock guide and feeder, be provided with the guide at the feed end of stock guide, can prevent that the diode material area from blocking at the stock guide feed end, be provided with simultaneously and be applicable to the cutting that carries out processing to the diode of different shaping positions of bending and bend integrative mechanism, improved the range of application of equipment.
In order to solve the problems in the prior art, the invention adopts the following technical scheme:
a semiconductor diode forming device is used for carrying out batch processing on diodes on a diode material belt and comprises a workbench, a feeding mechanism for conveying the diode material belt and a cutting and bending integrated mechanism which is arranged at the tail end of the feeding mechanism and is used for cutting and bending the diodes on the diode material belt, wherein the feeding mechanism is fixedly arranged above the workbench;
the feeding mechanism comprises a feeding table, a material guide plate and a feeder;
the upper end surface of the feeding table is horizontally arranged;
the two guide plates are respectively arranged at two sides of the feeding table, each guide plate is provided with a first guide groove matched with the diode material belt, and the feeding end of each guide plate is provided with a guide piece for guiding the diode material belt to enter the first guide groove;
the middle part of every stock guide is equipped with the vacancy position, and the feeder sets up in the vacancy position department of stock guide and spanes in the pay-off platform top.
Preferably, the guide member is fixedly mounted on a side wall of the feeding table;
the guide piece is provided with a second guide groove matched with the diode material belt, and the second guide groove is communicated with the first guide groove;
one end of the guide piece, which is far away from the guide plate, is provided with an upward inclined arc plate, and the lower end surface of the arc plate is tangent with the upper end surface of the second guide groove;
the guide piece is far away from one end of the guide plate and is provided with a round angle at the part below the second guide groove.
Preferably, the feeder comprises a guide seat, a horizontal moving assembly and a vertical moving assembly;
the guide seats are provided with two rectangular through grooves which are oriented to the feeding table and are respectively positioned at two sides of the feeding table, and a pushing plate is arranged in each rectangular through groove in a sliding manner along the vertical direction;
two stop blocks extending vertically upwards are arranged at one end part of each pushing plate, which is close to the feeding table, and the width of each stop block is smaller than the distance between two adjacent diodes on the diode material belt;
the upper end of each guide seat is provided with an avoidance groove for avoiding the stop block, and the avoidance groove is communicated into the rectangular through groove;
the horizontal moving assembly is provided with two guide seats respectively used for driving the two guide seats to slide along the length direction of the feeding table, and the horizontal moving assembly is positioned below the guide seats;
the vertical moving component is fixedly arranged right above the feeding table and used for controlling the two pushing plates to slide in the rectangular through groove along the vertical direction.
Preferably, each guide seat is provided with two first guide posts, the two first guide posts are vertically arranged, and two ends of each first guide post are respectively and fixedly connected with the upper end and the lower end of the rectangular through groove;
and each pushing plate is provided with a guide groove in sliding fit with the first guide post.
Preferably, the horizontal movement assembly comprises a first linear driver, a sliding seat and a sliding table;
the sliding seat is fixedly arranged on the workbench, the sliding table is connected to the sliding seat in a sliding manner, and the sliding direction of the sliding table is consistent with the length direction of the feeding table;
both ends of the sliding seat are provided with baffles for limiting the travel of the sliding table;
the first linear driver is fixedly arranged on the workbench, and an execution part of the first linear driver penetrates through one baffle plate to be fixedly connected to the sliding table;
the guide holder is fixedly arranged on the sliding table.
Preferably, the vertical movement assembly comprises a support frame, a second linear driver and a pressing plate;
the support frame comprises a top plate, two mounting bottom plates and two second guide posts, wherein the two second guide posts extend from the two bottom plates to the lower end of the top plate respectively and are fixedly connected with the top plate;
the top plate is positioned right above the feeding table, and the two mounting bottom plates are respectively and fixedly arranged at the upper ends of the two guide seats;
the pressing plate is arranged on the second guide posts in a sliding manner along the vertical direction, two first sliding grooves which are in sliding fit with the two second guide posts are formed in the pressing plate, connecting plates which extend vertically downwards are arranged at two ends of the pressing plate, and the two connecting plates are respectively and fixedly arranged at the upper ends of the two pushing plates;
the second linear driver is fixedly arranged on the top plate, and an execution part of the second linear driver penetrates through the top plate and is fixedly connected with the pressing plate.
Preferably, the upper ends of the two guide plates are fixedly provided with strip-shaped plates, and the two strip-shaped plates are respectively positioned at the vacant positions of the two guide plates.
Preferably, the cutting and bending integrated mechanism comprises a portal frame, a knife board, a third linear driver, a fourth linear driver and a blocking piece;
the portal frame comprises two upright posts and a transverse plate fixedly connected to the upper ends of the two upright posts, the two upright posts are fixedly arranged on the workbench, and the two upright posts are symmetrically arranged on two sides of the feeding table;
the cutter plate is arranged between the feeding table and the transverse plate in a sliding manner along the vertical direction, two third guide posts are symmetrically arranged at the upper end of the cutter plate, and the third guide posts penetrate through the transverse plate;
the lower end of the cutter plate is symmetrically provided with two cutting knives and two bending knives, the two bending knives are positioned between the two cutting knives, and the length of the cutting knives is greater than that of the bending knives;
the feeding table is provided with a containing cavity, the top of the containing cavity is provided with two containing grooves which extend vertically upwards and penetrate through the feeding table, and the two containing grooves are symmetrically distributed;
the blocking piece is arranged in the accommodating cavity in a sliding manner along the vertical direction and comprises a supporting plate and vertical plates extending upwards vertically from two sides of the supporting plate, and the two vertical plates are respectively positioned in the two accommodating grooves;
a bending plate is arranged between each vertical plate and the accommodating groove, and the upper end of the bending plate is flush with the upper end of the feeding table;
the opposite ends of the two cutting knives are respectively positioned in the same vertical plane with the deviating ends of the two vertical plates;
the distance between the opposite ends of the two bending knives is greater than the distance between the opposite ends of the two bending plates;
the third linear driver is fixedly arranged in the accommodating cavity and positioned below the supporting plate, and an executing part of the third linear driver is fixedly connected with the supporting plate;
the fourth linear driver is fixedly arranged at the upper end of the transverse plate, and an execution part of the fourth linear driver penetrates through the transverse plate and is fixedly connected with the cutter plate.
Preferably, the cutting and bending integrated mechanism further comprises a first bolt and a second bolt;
two first strip-shaped grooves are symmetrically formed in the upper end of the cutter plate, second strip-shaped grooves penetrating through the cutter plate are formed in the bottoms of the two first strip-shaped grooves, the width of each second strip-shaped groove is smaller than that of each first strip-shaped groove, and four first bolts penetrate through the second strip-shaped grooves from the upper side of the cutter plate to be in threaded connection with the cutting knife or the bending knife;
the feeding table is also provided with a second chute communicated with the two accommodating grooves;
one end of each bending plate, which is close to the second chute, is provided with a sliding column in sliding fit with the second chute;
the upper end of the feeding table is provided with a third strip-shaped groove, the bottom of the third strip-shaped groove is provided with a fourth strip-shaped groove penetrating into the second sliding groove, and the width of the fourth strip-shaped groove is smaller than that of the third strip-shaped groove;
the second bolts are two and respectively connected to the two slide posts through the fourth bar-shaped grooves from the upper part of the feeding table.
Preferably, the feeding table is also provided with a material pressing mechanism, and the material pressing mechanism is positioned at one end of the cutting and bending integrated mechanism, which is far away from the feeder;
the material pressing mechanism comprises a supporting base, a rotating rod, a material pressing plate and a rotary driver;
the two support bases are symmetrically arranged on the feeding table, the rotating rod is positioned between the two support bases, and each support base is provided with a round hole which is rotationally connected with the rotating rod;
the two pressing plates are provided with two pressing plates, one ends of the two pressing plates are respectively fixedly arranged at two ends of the rotating rod, and the other ends of the two pressing plates are propped against the diode material belt positioned below the cutting and bending integrated mechanism in the working state;
the rotary driver is fixedly arranged on the outer side of one of the support bases, and an executing part of the rotary driver is fixedly connected with one end of the rotating rod.
Preferably, two waste boxes symmetrically distributed on two sides of the feeding table are arranged on the workbench, and the two waste boxes are respectively located below the tail ends of the two material guide plates.
Compared with the prior art, the beneficial effects of this application are:
1. this application can prevent through two stock guides that the diode material area from taking place askew at the in-process of carrying, through being provided with the guide at the front end of stock guide, can prevent that the diode material area from blocking when getting into first baffle box.
2. This application is through all setting up the sword of bending and the board of bending into adjustable position to can be applicable to the diode to different positions of bending and produce according to the needs of production.
Drawings
FIG. 1 is a perspective view of the present application;
FIG. 2 is a top view of the hidden work table of the present application;
FIG. 3 is a schematic perspective view of a feeder and diode tape of the present application;
FIG. 4 is a perspective view of the pusher plate of the present application;
FIG. 5 is a schematic perspective view of a pusher plate and guide holder of the present application;
FIG. 6 is an exploded view of the three-dimensional structure of the support frame, the pressure plate and the connecting plate of the present application;
FIG. 7 is a perspective view of the guide plate, strip and guide of the present application;
FIG. 8 is a perspective view of the feeder table of the present application;
FIG. 9 is a perspective view of the feed table and cutting and bending integrated mechanism of the present application;
FIG. 10 is a perspective cross-sectional view of FIG. 2 of the present application taken along section A-A;
FIG. 11 is a perspective cross-sectional view of FIG. 2 of the present application taken along section B-B;
FIG. 12 is a perspective view of a knife plate of the present application;
FIG. 13 is a schematic perspective view of a knife plate, a cutting knife, a bending knife and a first bolt of the present application;
FIG. 14 is a perspective view of a stop and a bending plate of the present application;
FIG. 15 is a perspective view of the support base of the present application;
the reference numerals in the figures are:
1-a diode strip;
2-a workbench;
3-a feeding mechanism; 3 A-A feeding table; 3a 1-a receiving cavity; 3a 2-a receiving groove; 3a 3-a second chute; 3a 4-a third slot; 3a 5-fourth grooves; 3 b-a material guiding plate; 3b 1-a first guide chute; 3b 2-a strip; 3 c-feeding device; 3c 1-a guide seat; 3c 11-rectangular through grooves; 3c 12-avoiding grooves; 3c 13-guide posts; 3c 2-a horizontal movement assembly; 3c 21-first linear drive; 3c 22-slide; 3c 221-baffle; 3c 23-slipway; 3c 3-a vertical movement assembly; 3c 31-supporting frames; 3c 311-top plate; 3c 312-mounting base plate; 3c 313-a second guide post; 3c 32-a second linear drive; 3c 33-pressing plate; 3c 331-a first chute; 3c 332-connecting plates; 3c 4-pushing plates; 3c 41-stop; 3c 42-guide grooves; 3 d-guides; 3d 1-a second guide chute; 3d 2-arc plate; 3d 3-fillets;
4-a cutting and bending integrated mechanism; 4 A-A portal frame; 4a 1-upright posts; 4a 2-cross plate; 4 b-knife board; 4b 1-a cutting knife; 4b 2-bending knife; 4b 3-third guide post; 4b 4-a first bar slot; 4b 5-a second slot; 4 c-a third linear drive; 4 d-a fourth linear drive; 4 e-barriers; 4e 1-supporting plate; 4e 2-risers; 4 f-bending the plate; 4f 1-spool; 4 g-first bolt; 4 h-a second bolt;
5-a material pressing mechanism; 5 A-A support base; 5a 1-round holes; 5 b-a rotating lever; 5 c-a material pressing plate; a5 d-rotation driver;
6-waste box.
Description of the embodiments
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1 to 15, a semiconductor diode forming device is used for batch processing of diodes on a diode material belt 1, and comprises a workbench 2, a feeding mechanism 3 used for conveying the diode material belt 1 and a cutting and bending integrated mechanism 4 arranged at the tail end of the feeding mechanism 3 and used for cutting and bending the diodes on the diode material belt 1, wherein the feeding mechanism 3 is fixedly arranged above the workbench 2;
the feeding mechanism 3 comprises a feeding table 3a, a material guide plate 3b and a feeder 3c;
the upper end surface of the feeding table 3a is horizontally arranged;
the two guide plates 3b are respectively arranged at two sides of the feeding table 3a, each guide plate 3b is provided with a first guide groove 3b1 matched with the diode material belt 1, and the feeding end of each guide plate 3b is provided with a guide piece 3d for guiding the diode material belt 1 to enter the first guide groove 3b 1;
the middle part of each guide plate 3b is provided with a blank position, and the feeder 3c is arranged at the blank position of the guide plate 3b and spans over the feeding table 3 a.
During operation, the staff passes guide 3d with the front end of diode material area 1 get into in the first baffle box 3b1 to draw the diode material area 1 to the below of feeding mechanism 3, at this moment, starting equipment, diode material area 1 can be under the drive of feeding mechanism 3 constantly carry to the direction of cutting integrative mechanism 4 of bending, when diode material area 1 carried to the cutting under the integrative mechanism 4 of bending, cut and bend the diode on the diode material area 1 by cutting integrative mechanism 4 of bending, finally take off the diode after the shaping of bending from the pay-off platform 3a by the staff, equipment continues to operate after the diode after the staff takes off the shaping, up to this completion of a duty cycle, can prevent through two guide plates 3b that diode material area 1 from taking place to skew at the in-process of carrying, when can preventing that diode material area 1 from getting into first baffle box 3b1 through being provided with guide 3d, thereby cause the fracture of diode material area 1, be provided with cutting integrative mechanism 4 of bending again, the effective improvement of the efficiency of bending the diode material area 1 has been carried out to the diode material area 1 simultaneously.
Referring to fig. 1 and 7, a guide 3d is fixedly installed on a side wall of the feeding stage 3 a;
a second guide groove 3d1 matched with the diode material belt 1 is formed in the guide piece 3d, and the second guide groove 3d1 is communicated with the first guide groove 3b 1;
one end of the guide piece 3d, which is far away from the guide plate 3b, is provided with an upward-inclined arc plate 3d2, and the lower end surface of the arc plate 3d2 is tangent with the upper end surface of the second guide groove 3d 1;
the part of the guide piece 3d, which is far away from one end of the guide plate 3b and is positioned below the second guide groove 3d1, is provided with a round corner 3d3.
Through set up the second baffle box 3d1 mutually supporting with diode material area 1 on guide 3d to second baffle box 3d1 communicates with first baffle box 3b1, can make diode material area 1 steady by second baffle box 3d1 get into in the first baffle box 3b1, simultaneously, be provided with arc 3d2 and set up fillet 3d3 in the part that guide 3d kept away from the one end of deflector 3b and is located second baffle box 3d1 below, can guarantee that diode material area 1 by the oblique top of guide 3d or oblique below all can be smooth get into in the second baffle box 3d1, then get into in the first baffle box 3b1 by second baffle box 3d1 again, prevent that diode material area 1 from blocking at the feed end of deflector 3 b.
Referring to fig. 1, 3 to 5, the feeder 3c includes a guide holder 3c1, a horizontal moving assembly 3c2, and a vertical moving assembly 3c3;
the guide seats 3c1 are provided with two rectangular through grooves 3c11 pointing to the feeding table 3a, and each rectangular through groove 3c11 is internally provided with a pushing plate 3c4 in a sliding manner along the vertical direction, and the two rectangular through grooves 3c1 are respectively positioned at two sides of the feeding table 3 a;
two stop blocks 3c41 extending vertically upwards are arranged at one end part of each pushing plate 3c4 close to the feeding table 3a, and the width of each stop block 3c41 is smaller than the distance between two adjacent diodes on the diode material belt 1;
the upper end of each guide seat 3c1 is provided with an avoidance groove 3c12 for avoiding the stop block 3c41, and the avoidance grooves 3c12 are communicated into the rectangular through grooves 3c 11;
the horizontal moving assembly 3c2 is provided with two guide seats 3c1 respectively for driving the two guide seats 3c1 to slide along the length direction of the feeding table 3a, and the horizontal moving assembly 3c2 is positioned below the guide seats 3c 1;
the vertical moving assembly 3c3 is fixedly arranged right above the feeding table 3a and is used for controlling the two pushing plates 3c4 to slide in the rectangular through groove 3c11 along the vertical direction.
During operation, the vertical moving component 3c3 drives the pushing plate 3c4 to move upwards in the rectangular through groove 3c11, the stop block 3c41 on the pushing plate 3c4 can pass through the avoidance groove 3c12 to the vacant position of the guide plate 3b, when the pushing plate 3c4 moves to be abutted against the uppermost end of the rectangular through groove 3c11, the pushing plate 3c4 reaches the upper limit, at the moment, the stop block 3c41 is inserted between two adjacent diodes of the diode material belt 1, at the moment, the horizontal moving component 3c2 drives the guide seat 3c1 to move along the horizontal direction towards the direction of the cutting and bending integrated mechanism 4, the guide seat 3c1 moves to drive the pushing plate 3c4 to move together, the stop block 3c41 on the pushing plate 3c4 can drive the diode material belt 1 to move forward, after the diode material belt 1 advances a certain distance, the vertical moving component 3c3 is reset, and then the horizontal moving component 3c2 resets to complete a working cycle, so that the diode material belt 1 can be driven to move forward continuously.
Referring to fig. 4 and 5, each guide seat 3c1 is provided with two first guide posts 3c13, the two first guide posts 3c13 are vertically arranged, and two ends of the first guide posts 3c13 are respectively and fixedly connected with the upper end and the lower end of the rectangular through groove 3c 11;
each pushing plate 3c4 is provided with a guide groove 3c42 which is in sliding fit with the first guide post 3c 13.
Through all being equipped with first guide post 3c13 on every guide holder 3c1 to set up on every pushing plate 3c4 with first guide post 3c13 sliding fit's guide way 3c42, can carry out spacingly when sliding in rectangle through groove 3c11 to pushing plate 3c4, guaranteed that pushing plate 3c4 can vertically slide and prevent that pushing plate 3c4 from sliding unstably in rectangle through groove 3c 11.
Referring to fig. 1 and 3, the horizontal movement assembly 3c2 includes a first linear actuator 3c21, a slider 3c22, and a slide table 3c23;
the sliding seat 3c22 is fixedly arranged on the workbench 2, the sliding table 3c23 is connected to the sliding seat 3c22 in a sliding manner, and the sliding direction of the sliding table 3c23 is consistent with the length direction of the feeding table 3 a;
both ends of the slide base 3c22 are provided with a baffle 3c221 for limiting the travel of the slide table 3c23;
the first linear driver 3c21 is fixedly arranged on the workbench 2, and an execution part of the first linear driver 3c21 penetrates through one baffle plate 3c221 and is fixedly connected to the sliding table 3c23;
the guide holder 3c1 is fixedly mounted on the slide table 3c 23.
The sliding table 3c23 can be driven to move on the sliding seat 3c22 through the first linear driver 3c21, the sliding table 3c23 moves to drive the guide seat 3c1 to move, the two baffles 3c221 can prevent the sliding table 3c23 from sliding to be limited and falling off from the sliding seat 3c22, a worker can adjust the travel range of the first linear driver 3c21 according to actual conditions, and the moving distance of the diode material belt 1 is consistent in each working cycle, so that the cutting and bending integrated mechanism 4 can carry out forming processing on a fixed number of diodes on the diode material belt 1 each time.
Referring to fig. 1, 3 and 6, the vertical moving assembly 3c3 includes a support frame 3c31, a second linear actuator 3c32 and a pressing plate 3c33;
the support frame 3c31 comprises a top plate 3c311, two mounting bottom plates 3c312 and two second guide posts 3c313, wherein the two second guide posts 3c313 extend from the two bottom plates to the lower end of the top plate 3c311 respectively, and the two second guide posts 3c313 are fixedly connected with the top plate 3c 311;
the top plate 3c311 is positioned right above the feeding table 3a, and the two mounting bottom plates 3c312 are respectively and fixedly arranged at the upper ends of the two guide seats 3c 1;
the pressing plate 3c33 is arranged on the second guide posts 3c313 in a sliding manner along the vertical direction, two first sliding grooves 3c331 which are in sliding fit with the two second guide posts 3c313 are formed in the pressing plate 3c33, connecting plates 3c332 which extend vertically downwards are arranged at two ends of the pressing plate 3c33, and the two connecting plates 3c332 are respectively fixedly arranged at the upper ends of the two pushing plates 3c4;
the second linear actuator 3c32 is fixedly mounted on the top plate 3c311, and an actuator portion of the second linear actuator 3c32 is fixedly connected to the platen 3c33 through the top plate 3c 311.
The second linear driver 3c32 can drive the pressing plate 3c33 to slide up and down, the two pushing plates 3c4 can slide up and down along the pressing plate 3c33 through the connecting plate 3c332, and the pressing plate 3c33 can slide up and down along the second guide post 3c313 through arranging the supporting frame 3c31 for limiting the pressing plate 3c33, so that the sliding process is more stable.
Referring to fig. 1, 3 and 7, the upper ends of the two guide plates 3b are fixedly provided with strip plates 3b2, and the two strip plates 3b2 are respectively positioned at the vacant positions of the two guide plates 3 b.
By providing the strip plate 3b2 at the empty position of the guide plate 3b, when the stopper 3c41 pushes the diode strip 1 forward, the strip plate 3b2 can prevent the diode strip 1 from bending upward at the empty position of the guide plate 3b, thereby making the front end of the diode strip immovable and causing the diode strip 1 to be stacked at the empty position of the guide plate 3 b.
Referring to fig. 1, 8 to 14, the cutting and bending integrated mechanism 4 includes a gantry 4a, a blade 4b, a third linear driver 4c, a fourth linear driver 4d, and a stopper 4e;
the portal frame 4a comprises two upright posts 4a1 and a transverse plate 4a2 fixedly connected to the upper ends of the two upright posts 4a1, the two upright posts 4a1 are fixedly arranged on the workbench 2, and the two upright posts 4a1 are symmetrically arranged on two sides of the feeding table 3 a;
the cutter plate 4b is arranged between the feeding table 3a and the transverse plate 4a2 in a sliding manner along the vertical direction, two third guide posts 4b3 are symmetrically arranged at the upper end of the cutter plate 4b, and the third guide posts 4b3 penetrate through the transverse plate 4a2;
the lower end of the cutter plate 4b is symmetrically provided with two cutting cutters 4b1 and two bending cutters 4b2, the two bending cutters 4b2 are positioned between the two cutting cutters 4b1, and the length of the cutting cutters 4b1 is longer than that of the bending cutters 4b 2;
the feeding table 3a is provided with a containing cavity 3a1, the top of the containing cavity 3a1 is provided with two containing grooves 3a2 which vertically extend upwards and penetrate through the feeding table 3a, and the two containing grooves 3a2 are symmetrically distributed;
the blocking piece 4e is arranged in the accommodating cavity 3a1 in a sliding manner along the vertical direction, the blocking piece 4e comprises a supporting plate 4e1 and vertical plates 4e2 which vertically extend upwards from two sides of the supporting plate 4e1, and the two vertical plates 4e2 are respectively positioned in the two accommodating grooves 3a 2;
a bending plate 4f is arranged between each vertical plate 4e2 and the accommodating groove 3a2, and the upper end of the bending plate 4f is flush with the upper end of the feeding table 3 a;
the opposite ends of the two cutting knives 4b1 are respectively positioned in the same vertical plane with the opposite ends of the two vertical plates 4e 2;
the distance between the opposite ends of the two bending knives 4b2 is greater than the distance between the opposite ends of the two bending plates 4 f;
the third linear actuator 4c is fixedly arranged in the accommodating cavity 3a1 and is positioned below the supporting plate 4e1, and an execution part of the third linear actuator 4c is fixedly connected with the supporting plate 4e 1;
the fourth linear actuator 4d is fixedly mounted at the upper end of the transverse plate 4a2, and an actuator portion of the fourth linear actuator 4d is fixedly connected to the blade 4b through the transverse plate 4a 2.
When the feeding mechanism 3 moves the diode material belt 1 to the position right below the cutting and bending integrated mechanism 4, the feeding mechanism 3 stops running, at this time, the third linear driver 4c drives the supporting plate 4e1 to ascend until the two vertical plates 4e2 are positioned at the same horizontal plane with the upper end of the feeding table 3a, then the fourth linear driver 4d drives the cutter plate 4b to slide downwards, when the cutter 4b1 contacts the diode on the diode material belt 1, the cutter plate 4b continues to slide downwards, the opposite ends of the two cutter plates 4b1 are respectively positioned at the same vertical plane with the deviating ends of the two vertical plates 4e2, so that the cutter plates 4b1 continue to slide downwards to cut off the diode, the cutter plates 4b2 do not contact the diode at this time because the length of the cutter plates 4b1 is longer than that of the bending cutter plates 4b2, then the third linear driver 4c resets, the third linear driver 4c drives the supporting plate 4e1 to descend, the two risers 4e2 descend along with the supporting plate 4e1, at this time, the fourth linear driver 4d continuously drives the cutter plate 4b to descend, due to the descending of the riser 4e2, a reserved space for bending the diode is provided, the cutter 4b2 continuously descends after contacting the diode, due to the fact that the distance between the opposite ends of the two cutter 4b2 is greater than the distance between the opposite ends of the two cutter 4f, the cutter 4b2 continuously descends, the diode can be used as an inflection point for the cutter 4f, the cutter 4b2 descends to bend downwards, so that the pins of the diode bend to form a vertical angle, before use, the fourth linear driver 4d has two sections of displacement in the descending process, the first section of displacement of the fourth linear driver 4d is controlled in the range that the cutter 4b1 cuts off the diode and the cutter 4b2 does not contact the diode, the third linear driver 4c resets after the first displacement of the fourth linear driver 4d is finished, then the fourth linear driver 4d continues to displace downwards for the second section, and the second displacement of the fourth linear driver 4d moves downwards to the lower limit.
Referring to fig. 1, 8 to 14, the cutting and bending integrated mechanism 4 further includes a first bolt 4g and a second bolt 4h;
two first strip-shaped grooves 4b4 are symmetrically formed in the upper end of the cutter plate 4b, second strip-shaped grooves 4b5 penetrating through the cutter plate 4b are formed in the bottoms of the two first strip-shaped grooves 4b4, the width of each second strip-shaped groove 4b5 is smaller than that of each first strip-shaped groove 4b4, and four first bolts 4g penetrate through the second strip-shaped grooves 4b5 from the upper side of the cutter plate 4b and are in threaded connection with the cutter 4b1 or the bending cutter 4b 2;
the feeding table 3a is also provided with a second chute 3a3 communicated with the two accommodating grooves 3a 2;
one end of each bending plate 4f, which is close to the second sliding groove 3a3, is provided with a sliding column 4f1 which is in sliding fit with the second sliding groove 3a3;
the upper end of the feeding table 3a is provided with a third strip-shaped groove 3a4, the bottom of the third strip-shaped groove 3a4 is provided with a fourth strip-shaped groove 3a5 penetrating into the second chute 3a3, and the width of the fourth strip-shaped groove 3a5 is smaller than the width of the third strip-shaped groove 3a 4;
the second bolts 4h are provided with two and are respectively screwed on the two slide posts 4f1 from above the feeding table 3a through the fourth bar-shaped grooves 3a 5.
Before working, a worker determines the inflection point position of the diode required to be bent by the batch of products, then the first bolt 4g on the two bending knives 4b2 can be unscrewed, then the two bending knives 4b2 are moved to the proper position, the first bolt 4g is screwed down, so that the bending knives 4b2 are fixed, the bending plate 4f is adjusted to the proper distance by unscrewing the second bolt 4h, then the second bolt 4h is screwed down, and the position of the bending plate 4f can be fixed, so that the diode bending device is suitable for diode production at different bending positions according to production requirements.
Referring to fig. 1, 10, 11 and 15, a material pressing mechanism 5 is further arranged on the feeding table 3a, and the material pressing mechanism 5 is located at one end, far away from the feeder 3c, of the cutting and bending integrated mechanism 4;
the pressing mechanism 5 comprises a supporting base 5a, a rotating rod 5b, a pressing plate 5c and a rotary driver 5d;
the two support bases 5a are symmetrically arranged on the feeding table 3a, the rotating rod 5b is positioned between the two support bases 5a, and each support base 5a is provided with a round hole 5a1 which is rotationally connected with the rotating rod 5 b;
the two pressing plates 5c are provided with two pressing plates 5c, one ends of the two pressing plates 5c are respectively fixedly arranged at two ends of the rotating rod 5b, and the other ends of the two pressing plates 5c are propped against the diode material belt 1 positioned below the cutting and bending integrated mechanism 4 in the working state;
the rotary driver 5d is fixedly provided at an outer side of one of the support bases 5a and an execution portion of the rotary driver 5d is fixedly connected with one end of the rotary lever 5 b.
Before the cutting and bending integrated mechanism 4 operates, the rotary rod 5b can be driven to rotate through the rotary driver 5d, so that the two pressing plates 5c can rotate along with each other and are pressed on the diode material belt 1, the diode can be prevented from deforming or collapsing when the diode on the diode material belt 1 is cut or bent, after the cutting and bending integrated mechanism 4 resets, the rotary driver 5d drives the rotary rod 5b to rotate reversely, the two pressing plates 5c are far away from the diode material belt 1, at the moment, the diode after cutting and bending can be taken down by a worker, and then the semiconductor diode forming device continues the next working cycle.
Referring to fig. 1 and 11, two waste cartridges 6 symmetrically distributed on both sides of the feeding table 3a are arranged on the working table 2, and the two waste cartridges 6 are respectively located below the tail ends of the two material guiding plates 3 b.
By being provided with a scrap box 6 for receiving the residue of the diode bar 1 flowing out from the end of the guide plate 3 b.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. The utility model provides a semiconductor diode forming device for carry out batch processing to the diode on the diode material area (1), includes workstation (2), be used for carrying feeding mechanism (3) of diode material area (1) and set up at the terminal of this feeding mechanism (3) and cut and bend integrated mechanism (4) of cutting and bending to the diode on the diode material area (1), feeding mechanism (3) fixed set up in the top of workstation (2);
the feeding mechanism (3) is characterized by comprising a feeding table (3 a), a material guide plate (3 b) and a feeder (3 c);
the upper end surface of the feeding table (3 a) is horizontally arranged;
the two guide plates (3 b) are respectively arranged at two sides of the feeding table (3 a), each guide plate (3 b) is provided with a first guide groove (3 b 1) matched with the diode material belt (1), and the feeding end of each guide plate (3 b) is provided with a guide piece (3 d) for guiding the diode material belt (1) to enter the first guide groove (3 b 1);
the middle part of each guide plate (3 b) is provided with a vacant position, and a feeder (3 c) is arranged at the vacant position of each guide plate (3 b) and spans over the feeding table (3 a);
the cutting and bending integrated mechanism (4) comprises a portal frame (4 a), a cutting board (4 b), a third linear driver (4 c), a fourth linear driver (4 d) and a blocking piece (4 e);
the portal frame (4 a) comprises two upright posts (4 a 1) and a transverse plate (4 a 2) fixedly connected to the upper ends of the two upright posts (4 a 1), the two upright posts (4 a 1) are fixedly arranged on the workbench (2), and the two upright posts (4 a 1) are symmetrically arranged on two sides of the feeding table (3 a);
the cutter plate (4 b) is arranged between the feeding table (3 a) and the transverse plate (4 a 2) in a sliding manner along the vertical direction, two third guide posts (4 b 3) are symmetrically arranged at the upper end of the cutter plate (4 b), and the third guide posts (4 b 3) penetrate through the transverse plate (4 a 2);
two cutting knives (4 b 1) and two bending knives (4 b 2) are symmetrically arranged at the lower end of the knife board (4 b), the two bending knives (4 b 2) are positioned between the two cutting knives (4 b 1), and the length of the cutting knives (4 b 1) is greater than that of the bending knives (4 b 2);
the feeding table (3 a) is provided with a containing cavity (3 a 1), the top of the containing cavity (3 a 1) is provided with two containing grooves (3 a 2) which vertically extend upwards and penetrate through the feeding table (3 a), and the two containing grooves (3 a 2) are symmetrically distributed;
the blocking piece (4 e) is arranged in the accommodating cavity (3 a 1) in a sliding manner along the vertical direction, the blocking piece (4 e) comprises a supporting plate (4 e 1) and vertical plates (4 e 2) extending upwards vertically from two sides of the supporting plate (4 e 1), and the two vertical plates (4 e 2) are respectively positioned in the two accommodating grooves (3 a 2);
a bending plate (4 f) is arranged between each vertical plate (4 e 2) and the accommodating groove (3 a 2), and the upper end of the bending plate (4 f) is flush with the upper end of the feeding table (3 a);
the opposite ends of the two cutting knives (4 b 1) are respectively positioned in the same vertical plane with the deviating ends of the two vertical plates (4 e 2);
the distance between the opposite ends of the two bending knives (4 b 2) is greater than the distance between the opposite ends of the two bending plates (4 f);
the third linear driver (4 c) is fixedly arranged in the accommodating cavity (3 a 1) and is positioned below the supporting plate (4 e 1), and an execution part of the third linear driver (4 c) is fixedly connected with the supporting plate (4 e 1);
the fourth linear driver (4 d) is fixedly arranged at the upper end of the transverse plate (4 a 2), and an execution part of the fourth linear driver (4 d) penetrates through the transverse plate (4 a 2) and is fixedly connected with the cutter plate (4 b);
when the feeding mechanism (3) moves the diode material belt (1) to the position right below the cutting and bending integrated mechanism (4), the feeding mechanism (3) stops running, the third linear driver (4 c) drives the supporting plate (4 e 1) to ascend until the two vertical plates (4 e 2) and the upper end of the feeding table (3 a) are positioned on the same horizontal plane, the fourth linear driver (4 d) drives the knife plate (4 b) to slide downwards, when the cutting knife (4 b 1) contacts the diode on the diode material belt (1), the knife plate (4 b) continuously slides, the opposite ends of the two cutting knives (4 b 1) are respectively positioned in the same vertical plane with the deviating ends of the two vertical plates (4 e 2), the cutting knife (4 b 1) continuously slides to cut off the diode, the length of the cutting knife (4 b 1) is larger than the length of the bending knife (4 b 2), the bending knife (4 b 2) is not contacted with the diode, the third linear driver (4 c) resets, the three linear driver (4 c) drives the supporting plate (4 e 1) to descend, the distance between the two vertical plates (4 e 2) is reserved because the deviating from the bending plate (4 e 2) and the bending plate (4 e 2) continuously drops, and the distance between the two vertical plates (4 e 2) is reserved, therefore, the bending knife (4 b 2) continues to descend, the diode can be used as an inflection point, the bending plate (4 f) is downwards bent by the descending of the bending knife (4 b 2), so that the pin of the diode is bent to form a vertical angle, before the diode is used, the diode is debugged by a technician, the fourth linear driver (4 d) should have two sections of displacement in the descending process, the first section of displacement of the fourth linear driver (4 d) should be controlled within the range that the cutting knife (4 b 1) cuts off the diode and the bending knife (4 b 2) is not contacted with the diode, the third linear driver (4 c) resets after the first section of displacement of the fourth linear driver (4 d) is ended, and then the fourth linear driver (4 d) continues to downwards perform the second section of displacement, and the second section of displacement of the fourth linear driver (4 d) is downwards moved to be limited downwards.
2. A semiconductor diode forming apparatus according to claim 1, wherein the guide member (3 d) is fixedly mounted on a side wall of the feed table (3 a);
a second guide groove (3 d 1) which is matched with the diode material belt (1) is formed in the guide piece (3 d), and the second guide groove (3 d 1) is communicated with the first guide groove (3 b 1);
one end of the guide piece (3 d) far away from the guide plate (3 b) is provided with an upward-inclined arc plate (3 d 2), and the lower end surface of the arc plate (3 d 2) is tangent with the upper end surface of the second guide groove (3 d 1);
a round corner (3 d 3) is formed in a part, which is far away from one end of the guide plate (3 b) and is positioned below the second guide groove (3 d 1), of the guide piece (3 d).
3. A semiconductor diode forming apparatus according to claim 1, wherein the feeder (3 c) comprises a guide holder (3 c 1), a horizontal moving member (3 c 2) and a vertical moving member (3 c 3);
the guide seats (3 c 1) are provided with two rectangular through grooves (3 c 11) pointing to the feeding table (3 a) and are respectively positioned on two sides of the feeding table (3 a), and a pushing plate (3 c 4) is arranged in each rectangular through groove (3 c 11) in a sliding manner along the vertical direction;
two stop blocks (3 c 41) extending vertically upwards are arranged at one end part of each pushing plate (3 c 4) close to the feeding table (3 a), and the width of each stop block (3 c 41) is smaller than the distance between two adjacent diodes on the diode material belt (1);
the upper end of each guide seat (3 c 1) is provided with an avoidance groove (3 c 12) for avoiding the check block (3 c 41), and the avoidance grooves (3 c 12) are communicated into the rectangular through grooves (3 c 11);
the horizontal moving assembly (3 c 2) is provided with two guide seats (3 c 1) which are respectively used for driving the two guide seats (3 c 1) to slide along the length direction of the feeding table (3 a), and the horizontal moving assembly (3 c 2) is positioned below the guide seats (3 c 1);
the vertical moving component (3 c 3) is fixedly arranged right above the feeding table (3 a) and is used for controlling the two pushing plates (3 c 4) to slide in the rectangular through groove (3 c 11) along the vertical direction.
4. A semiconductor diode forming apparatus according to claim 3, wherein each guide holder (3 c 1) is provided with two first guide posts (3 c 13), the two first guide posts (3 c 13) are vertically arranged, and two ends of the first guide posts (3 c 13) are fixedly connected to the upper and lower ends of the rectangular through groove (3 c 11), respectively;
each pushing plate (3 c 4) is provided with a guide groove (3 c 42) which is in sliding fit with the first guide column (3 c 13).
5. A semiconductor diode forming apparatus according to claim 3, wherein the horizontal movement assembly (3 c 2) comprises a first linear actuator (3 c 21), a slider (3 c 22) and a slide table (3 c 23);
the sliding seat (3 c 22) is fixedly arranged on the workbench (2), the sliding table (3 c 23) is connected to the sliding seat (3 c 22) in a sliding manner, and the sliding direction of the sliding table (3 c 23) is consistent with the length direction of the feeding table (3 a);
both ends of the sliding seat (3 c 22) are provided with baffle plates (3 c 221) for limiting the travel of the sliding table (3 c 23);
the first linear driver (3 c 21) is fixedly arranged on the workbench (2), and an execution part of the first linear driver (3 c 21) penetrates through one baffle plate (3 c 221) and is fixedly connected to the sliding table (3 c 23);
the guide seat (3 c 1) is fixedly arranged on the sliding table (3 c 23).
6. A semiconductor diode forming apparatus as claimed in claim 3, wherein the vertical movement assembly (3 c 3) comprises a support frame (3 c 31), a second linear actuator (3 c 32) and a platen (3 c 33);
the support frame (3 c 31) comprises a top plate (3 c 311), two mounting bottom plates (3 c 312) and two second guide posts (3 c 313), wherein the two second guide posts (3 c 313) respectively extend from the two bottom plates to the lower end of the top plate (3 c 311), and the two second guide posts (3 c 313) are fixedly connected with the top plate (3 c 311);
the top plate (3 c 311) is positioned right above the feeding table (3 a), and the two mounting bottom plates (3 c 312) are respectively and fixedly arranged at the upper ends of the two guide seats (3 c 1);
the pressing plate (3 c 33) is arranged on the second guide posts (3 c 313) in a sliding manner along the vertical direction, two first sliding grooves (3 c 331) which are in sliding fit with the two second guide posts (3 c 313) are formed in the pressing plate (3 c 33), connecting plates (3 c 332) which extend vertically downwards are arranged at two ends of the pressing plate (3 c 33), and the two connecting plates (3 c 332) are respectively fixedly arranged at the upper ends of the two pushing plates (3 c 4);
the second linear actuator (3 c 32) is fixedly mounted on the top plate (3 c 311), and an execution part of the second linear actuator (3 c 32) penetrates through the top plate (3 c 311) and is fixedly connected with the pressing plate (3 c 33).
7. A semiconductor diode forming apparatus according to claim 6, wherein the upper ends of the two guide plates (3 b) are fixedly provided with strip plates (3 b 2), and the two strip plates (3 b 2) are respectively positioned at the vacant positions of the two guide plates (3 b).
8. The semiconductor diode forming apparatus according to claim 1, wherein the dicing and bending integrated mechanism (4) further comprises a first bolt (4 g) and a second bolt (4 h);
two first strip-shaped grooves (4 b 4) are symmetrically formed in the upper end of the cutter plate (4 b), second strip-shaped grooves (4 b 5) penetrating through the cutter plate (4 b) are formed in the bottoms of the two first strip-shaped grooves (4 b 4), the width of the second strip-shaped grooves (4 b 5) is smaller than that of the first strip-shaped grooves (4 b 4), and four first bolts (4 g) penetrate through the second strip-shaped grooves (4 b 5) from the upper side of the cutter plate (4 b) and are in threaded connection with the cutter (4 b 1) or the bending cutter (4 b 2);
a second chute (3 a 3) communicated with the two accommodating grooves (3 a 2) is also formed in the feeding table (3 a);
one end of each bending plate (4 f) close to the second sliding groove (3 a 3) is provided with a sliding column (4 f 1) in sliding fit with the second sliding groove (3 a 3);
the upper end of the feeding table (3 a) is provided with a third strip-shaped groove (3 a 4), the bottom of the third strip-shaped groove (3 a 4) is provided with a fourth strip-shaped groove (3 a 5) penetrating into the second sliding groove (3 a 3), and the width of the fourth strip-shaped groove (3 a 5) is smaller than the width of the third strip-shaped groove (3 a 4);
the second bolts (4 h) are provided with two and respectively pass through the fourth strip-shaped grooves (3 a 5) from the upper part of the feeding table (3 a) to be connected with the two sliding columns (4 f 1) in a threaded manner.
9. The semiconductor diode forming device according to claim 1, wherein the feeding table (3 a) is further provided with a material pressing mechanism (5), and the material pressing mechanism (5) is positioned at one end of the cutting and bending integrated mechanism (4) far away from the feeder (3 c);
the material pressing mechanism (5) comprises a supporting base (5 a), a rotating rod (5 b), a material pressing plate (5 c) and a rotary driver (5 d);
the support bases (5 a) are two and are symmetrically arranged on the feeding table (3 a), the rotating rod (5 b) is positioned between the two support bases (5 a), and a round hole (5 a 1) which is rotationally connected with the rotating rod (5 b) is formed in each support base (5 a);
the two pressing plates (5 c) are provided with two pressing plates, one ends of the two pressing plates (5 c) are respectively fixedly arranged at two ends of the rotating rod (5 b), and the other ends of the two pressing plates (5 c) are propped against the diode material belt (1) positioned below the cutting and bending integrated mechanism (4) in the working state;
the rotary driver (5 d) is fixedly arranged on the outer side of one of the support bases (5 a), and an execution part of the rotary driver (5 d) is fixedly connected with one end of the rotary rod (5 b).
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| JP2015026772A (en) * | 2013-07-29 | 2015-02-05 | 三菱電機エンジニアリング株式会社 | Joining and cutting device for connection conductor and joining and cutting control method |
| CN113996724A (en) * | 2021-10-21 | 2022-02-01 | 先之科半导体科技(东莞)有限公司 | Pin bending device of silicon carbide diode |
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| AT508355B1 (en) * | 2009-06-29 | 2011-01-15 | Trumpf Maschinen Austria Gmbh | METHOD AND DEVICE FOR BENDING A WORKPIECE |
| KR20110014271A (en) * | 2009-07-28 | 2011-02-11 | 한테크 주식회사 | Bending and cutting machine for lead of led |
| US20130099369A1 (en) * | 2011-10-19 | 2013-04-25 | Semicoa Corporation | Hermetic Surface Mount Packages for Diodes and Transistors |
| CN107359133B (en) * | 2017-07-27 | 2023-04-14 | 重庆平伟实业股份有限公司 | Diode feeding, flattening, rib cutting and shaping integrated machine |
| CN107275274B (en) * | 2017-07-27 | 2023-06-27 | 重庆平伟实业股份有限公司 | Diode automatic feeding mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2015026772A (en) * | 2013-07-29 | 2015-02-05 | 三菱電機エンジニアリング株式会社 | Joining and cutting device for connection conductor and joining and cutting control method |
| CN113996724A (en) * | 2021-10-21 | 2022-02-01 | 先之科半导体科技(东莞)有限公司 | Pin bending device of silicon carbide diode |
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