CN115166916A - Temperature self-adaptive shunt - Google Patents
Temperature self-adaptive shunt Download PDFInfo
- Publication number
- CN115166916A CN115166916A CN202210485783.1A CN202210485783A CN115166916A CN 115166916 A CN115166916 A CN 115166916A CN 202210485783 A CN202210485783 A CN 202210485783A CN 115166916 A CN115166916 A CN 115166916A
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- Prior art keywords
- temperature
- heat dissipation
- heating
- assembly
- shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 claims abstract description 56
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 43
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 230000003044 adaptive effect Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 26
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4439—Auxiliary devices
Abstract
The invention provides a temperature self-adaptive branching unit, which comprises a shell, a temperature control system and a temperature adjusting component, wherein the temperature control system is connected with the temperature adjusting component; the shell comprises an encapsulation box and an encapsulation cover for encapsulating the encapsulation box; the packaging box comprises two groups of opposite side surfaces, wherein one group of opposite side surfaces are respectively provided with an interface, and the other group of opposite side surfaces are respectively provided with an air vent; the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly; the refrigeration assembly comprises a semiconductor refrigeration piece and a heat dissipation device, the cold surface of the semiconductor refrigeration piece faces the inner side of the shell, and the heat dissipation device is arranged on one side of the hot surface of the semiconductor refrigeration piece; the heating assembly comprises a heating sheet; the heating plate and the semiconductor refrigerating plate are respectively connected with a temperature control system. When the environmental temperature changes greatly, the temperature control system controls the operation of the refrigerating assembly and the heating assembly respectively and independently, so that the aim of adjusting the temperature in the shell is fulfilled, the temperature is always maintained in the temperature environment applicable to the shunt, and the normal work of the shunt is maintained.
Description
Technical Field
The invention relates to the technical field of splitters, in particular to a temperature self-adaptive splitter.
Background
The splitter can split a plurality of frequency band signals input on the line in the wireless communication system into a single frequency band and output the single frequency band to different communication lines. In the field of communications, splitters are devices used to separate telephone channels from data channels.
At present, can meet different environment usually when using, the temperature condition diverse of different environment, especially in some great environment of change, temperature variation is big, each branching unit is to the adaptability diverse of temperature, therefore different branching units need be changed usually under the different environment, so greatly increased the cost, simultaneously, under the higher condition of temperature, lead to the optic fibre to become soft and ageing the condition easily, can cause certain damage to the branching unit equally, influence its life, thereby cause the loss of property.
Therefore, the actual use process of the existing splitter in the temperature change environment is not perfect, and further perfection is needed urgently.
Disclosure of Invention
In view of the above, the present invention has been developed to provide a temperature adaptive splitter that overcomes, or at least partially solves, the above-mentioned problems.
In order to solve the above problems, the present invention discloses a temperature adaptive splitter, comprising: the temperature control system is connected with the temperature adjusting component; the temperature control system and the temperature adjusting assembly are respectively arranged in the shell;
the shell comprises a packaging box and a packaging cover for packaging the packaging box; the packaging box comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces are respectively provided with an interface, and the other group of the opposite side surfaces are respectively provided with an air vent;
the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly, and the refrigerating assembly and the heating assembly are respectively arranged close to the two air vents; the refrigerating assembly comprises a semiconductor refrigerating piece and a heat radiating device, the cold surface of the semiconductor refrigerating piece faces the inner side of the shell, the heat radiating device is arranged on one side of the hot surface of the semiconductor refrigerating piece, and the heat radiating device is arranged close to the air vent; the heating assembly comprises a heating sheet; the heating plate and the semiconductor refrigerating plate are respectively connected with the temperature control system.
Preferably, the temperature control system comprises a temperature control plate, a temperature sensor and a refrigerating and heating switch, the temperature sensor and the refrigerating and heating switch are respectively connected with the temperature control plate through leads, and the semiconductor refrigerating piece and the heating piece are respectively connected with the refrigerating and heating switch through leads; the temperature sensor is arranged on the side wall of the shell and used for detecting the temperature outside and inside the shell.
Preferably, the heat dissipation device comprises a heat dissipation fin and a heat dissipation fan, the heat dissipation fin is arranged on the hot surface of the semiconductor refrigeration fin, the heat dissipation fan is fixed on the heat dissipation fin, and the heat dissipation fin and the heat dissipation fan are connected with the refrigeration heating changeover switch through a wire.
Preferably, the heat dissipation fan is disposed inside the air vent and located in the middle of the heat dissipation fin.
Preferably, at least one flow guide channel is arranged in the heat radiating fin, and the tail end of the flow guide channel faces the outer side of the shell, extends into the vent hole and is communicated with the vent hole.
Preferably, a layer of heat-conducting silicone grease is coated on the contact surface of the radiating fin and the semiconductor refrigerating fin.
Preferably, the vent is comprised of a plurality of louvered spaces disposed obliquely downward.
Preferably, two opposite inner sides of the top of the packaging box are provided with sliding grooves, two opposite outer sides of the packaging cover are correspondingly provided with sliding rails, and the packaging cover is in sliding connection with the packaging box.
Preferably, the temperature control system further comprises an alarm, and the alarm is connected with the temperature sensor.
Preferably, the semiconductor refrigeration piece is a single-stage or multi-stage bismuth telluride semiconductor refrigeration piece.
The invention has the following advantages:
in an embodiment of the application, the temperature control system is connected with the temperature adjusting component through a shell, a temperature control system and the temperature adjusting component; the temperature control system and the temperature adjusting assembly are respectively arranged in the shell; the shell comprises an encapsulation box and an encapsulation cover for encapsulating the encapsulation box; the packaging box comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces are respectively provided with an interface, and the other group of the opposite side surfaces are respectively provided with an air vent; the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly, and the refrigerating assembly and the heating assembly are respectively arranged close to the two air vents; the refrigerating assembly comprises a semiconductor refrigerating piece and a heat radiating device, the cold surface of the semiconductor refrigerating piece faces the inner side of the shell, and the heat radiating device is arranged on one side of the hot surface of the semiconductor refrigerating piece, wherein the heat radiating device is arranged close to the air vent; the heating assembly comprises a heating sheet; the heating plate and the semiconductor refrigerating plate are respectively connected with the temperature control system. When the ambient temperature is greatly changed, the operation of the refrigerating assembly and the heating assembly is respectively and independently controlled by the temperature control system, so that the aim of adjusting the temperature in the shell is fulfilled, the temperature is always maintained in the temperature environment applicable to the shunt, and the normal work of the shunt is maintained.
Drawings
FIG. 1 is a schematic diagram of a temperature adaptive splitter according to the present invention;
fig. 2 is an open-lid top view of a temperature-adaptive splitter of the present invention.
Description of the drawings: 1. the device comprises a shell, 11, a packaging cover, 12, a packaging box, 13, an interface, 2, a refrigerating assembly, 21, a semiconductor refrigerating sheet, 22, a radiating fin, 23, a radiating fan, 24, a flow guide channel, 3, a heating assembly, 31, a heating sheet, 4 and an air vent.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description thereof.
Referring to fig. 1-2, fig. 1 is a schematic diagram illustrating a temperature adaptive splitter according to the present invention; fig. 2 is an open-cover top view of the temperature adaptive splitter of the present invention, which may specifically include:
the temperature control device comprises a shell 1, a temperature control system and a temperature adjusting assembly, wherein the temperature control system is connected with the temperature adjusting assembly; the temperature control system and the temperature adjusting assembly are respectively arranged in the shell 1;
the shell 1 comprises an encapsulation box 12 and an encapsulation cover 11 for encapsulating the encapsulation box 12; the packaging box 12 comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces is respectively provided with a port 13, and the other group of the opposite side surfaces is respectively provided with a vent 4;
the temperature adjusting assembly comprises a refrigerating assembly 2 and a heating assembly 3, and the refrigerating assembly 2 and the heating assembly 3 are respectively arranged close to the two air vents 4; the refrigerating assembly 2 comprises a semiconductor refrigerating sheet 21 and a heat dissipation device, the cold surface of the semiconductor refrigerating sheet 21 faces the inner side of the shell 1, and the heat dissipation device is arranged on one side of the hot surface of the semiconductor refrigerating sheet 21 and is tightly attached to the air vent 4; the heating assembly 3 comprises a heating plate 31; the heating plate 31 and the semiconductor refrigerating plate 21 are respectively connected with the temperature control system.
In the embodiment of the application, the temperature control system is connected with the temperature adjusting component through the shell 1, the temperature control system and the temperature adjusting component; the temperature control system and the temperature adjusting component are respectively arranged in the shell 1; the shell 1 comprises an encapsulation box 12 and an encapsulation cover 11 for encapsulating the encapsulation box 12; the packaging box 12 comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces is respectively provided with a port 13, and the other group of the opposite side surfaces is respectively provided with a vent 4; the temperature adjusting assembly comprises a refrigerating assembly 2 and a heating assembly 3, and the refrigerating assembly 2 and the heating assembly 3 are respectively arranged close to the two air vents 4; the refrigerating assembly 2 comprises a semiconductor refrigerating sheet 21 and a heat dissipation device, the cold surface of the semiconductor refrigerating sheet 21 faces the inner side of the shell 1, and the heat dissipation device is arranged on one side of the hot surface of the semiconductor refrigerating sheet 21 and is tightly attached to the air vent 4; the heating assembly 3 comprises a heating plate 31; the heating plate 31 and the semiconductor refrigerating plate 21 are respectively connected with the temperature control system. When the environmental temperature changes greatly, the temperature control system controls the operation of the refrigerating assembly 2 and the heating assembly 3 separately, so as to adjust the temperature in the shell 1, maintain the temperature in the temperature environment suitable for the shunt all the time and maintain the normal work of the shunt.
Next, the temperature adaptive splitter in the present exemplary embodiment will be further described.
In one embodiment of the present application, the housing 1 includes an enclosure 12 and an enclosure cover 11 enclosing the enclosure 12; the packaging box 12 comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces is respectively provided with an interface 13, and the other group of the opposite side surfaces is respectively provided with an air vent 4; the top of the packaging box 12 is provided with sliding grooves on two opposite inner sides, the two opposite outer sides of the packaging cover 11 are correspondingly provided with sliding rails, and the packaging cover 11 is connected with the packaging box 12 in a sliding manner.
As an example, the enclosure 12 has a mounting cavity and an upper end opening, the enclosure 12 has a left side opened with a plurality of input interfaces 13, the enclosure 12 has a right side opened with a plurality of output interfaces 13, and a connecting line and an optical waveguide splitter placed inside the enclosure 12 can be respectively connected and used through the output interfaces 13 and the input interfaces 13. Similarly, the front side and the rear side of the packaging box 12 are provided with air vents 4; specifically, the vent 4 is composed of a plurality of obliquely downward arranged louver blades at intervals to form a plurality of obliquely downward vent 4 arranged in parallel, and the louver blades are obliquely downward, so that the air can be kept smooth, and meanwhile, a part of external dust can be prevented from entering the inside of the shell 1 to cause internal dust deposition. The packaging cover 11 is provided with a convex block, the convex block is positioned at one end of the packaging cover 11 close to the opening, and an operator opens the packaging cover 11, so that the packaging cover 11 slides outwards through the convex block, the operation is convenient, the phenomenon that the packaging cover 11 and the packaging box 12 are too tight and cannot slide easily is avoided, and the labor can be saved and the packaging box can slide easily by means of the convex block.
In an embodiment of the present application, the temperature adjustment assembly includes a cooling assembly 2 and a heating assembly 3, and the cooling assembly 2 and the heating assembly 3 are respectively disposed near the two air vents 4; the refrigeration assembly 2 comprises a semiconductor refrigeration piece 21 and a heat dissipation device, the semiconductor refrigeration piece 21 is a single-stage or multi-stage bismuth telluride semiconductor refrigeration piece 21, the cold surface of the semiconductor refrigeration piece 21 faces the inner side of the shell 1, and the heat dissipation device is arranged on one side of the hot surface of the semiconductor refrigeration piece 21, wherein the heat dissipation device is tightly attached to the vent 4, so that heat flow can be conveniently led out from the vent 4, and the refrigeration effect is prevented from being influenced; the heating assembly 3 comprises a heating plate 31; the heating plate 31 and the semiconductor refrigerating plate 21 are respectively connected with the temperature control system; the temperature control system comprises a temperature control plate, a temperature sensor and a refrigerating and heating change-over switch, the temperature sensor and the refrigerating and heating change-over switch are respectively connected with the temperature control plate through leads, and the semiconductor refrigerating piece 21 and the heating piece 31 are respectively connected with the refrigerating and heating change-over switch through leads; the temperature sensor is arranged on the side wall of the shell 1 and used for detecting the temperature outside and inside the shell 1.
As an example, the heat dissipation device includes a heat dissipation plate 22 and a heat dissipation fan 23, the heat dissipation plate 22 is disposed on a hot surface of the semiconductor refrigeration plate 21, a layer of heat conductive silicone grease is coated on a contact surface between the heat dissipation plate 22 and the semiconductor refrigeration plate 21, so that heat generated by the hot surface of the semiconductor refrigeration plate 21 can be quickly transferred to the heat dissipation plate 22 for heat dissipation, the heat dissipation fan 23 is fixed on the heat dissipation plate 22, and the heat dissipation plate 22 and the heat dissipation fan 23 are connected to the refrigeration and heating switch through a wire.
In a specific embodiment, when the temperature sensor detects that the ambient temperature is higher than a set value, the temperature control board controls the refrigeration and heating switch to the refrigeration loop, the refrigeration piece operates, and meanwhile, the heat radiation fin 22 and the heat radiation fan 23 are started, the refrigeration piece reduces the temperature to a temperature acceptable by the shunt, so that the normal operation of the shunt is maintained, and the heat radiation fin 22 and the heat radiation fan 23 radiate heat to the refrigeration piece; on the contrary, when the temperature sensor detects that the ambient temperature is lower than the set value, the temperature control plate controls the heating sheet 31 to heat, so as to raise the temperature to the temperature acceptable by the shunt and maintain the normal operation of the shunt.
As an example, the heat dissipation fan 23 is disposed inside the air vent 4 and in the middle of the heat dissipation fin 22, at least one flow guiding channel 24 is disposed in the heat dissipation fin 22, and the end of the flow guiding channel 24 faces the outside of the housing 1 and extends into the air vent 4 to communicate with the air vent 4; through set up water conservancy diversion passageway 24 in fin 22, make the heat of fin 22 release flow out from water conservancy diversion passageway 24, through air vent 4 flow direction outside, avoid the hot current to flow to inside the casing 1, influence the refrigeration effect of refrigeration piece, preferably, water conservancy diversion passageway 24 sets up to two, is located radiator fan 23's both sides respectively, and the hot current overflows from both sides, can evenly take away the heat fast.
In an embodiment of the present application, the temperature control system further includes an alarm, and the alarm is connected to the temperature sensor. When the temperature sensor monitors that the temperature is too high or too low, an alarm is sent out through the alarm to remind relevant personnel to process.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "include", "including" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or terminal device including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or terminal device that comprises the element.
The above detailed description is provided for the temperature adaptive splitter provided by the present invention, and the principle and the implementation of the present invention are explained by applying specific examples herein, and the description of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A temperature adaptive splitter, comprising: the temperature control system is connected with the temperature adjusting component; the temperature control system and the temperature adjusting assembly are respectively arranged in the shell;
the shell comprises a packaging box and a packaging cover for packaging the packaging box; the packaging box comprises two groups of opposite side surfaces, wherein one group of the opposite side surfaces are respectively provided with an interface, and the other group of the opposite side surfaces are respectively provided with an air vent;
the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly, and the refrigerating assembly and the heating assembly are respectively arranged close to the two air vents; the refrigerating assembly comprises a semiconductor refrigerating piece and a heat radiating device, the cold surface of the semiconductor refrigerating piece faces the inner side of the shell, the heat radiating device is arranged on one side of the hot surface of the semiconductor refrigerating piece, and the heat radiating device is arranged close to the air vent; the heating assembly comprises a heating sheet; the heating plate and the semiconductor refrigerating plate are respectively connected with the temperature control system.
2. The temperature-adaptive splitter according to claim 1, wherein the temperature control system comprises a temperature control board, a temperature sensor and a cooling and heating switch, the temperature sensor and the cooling and heating switch are respectively connected to the temperature control board through wires, and the semiconductor cooling plate and the heating plate are respectively connected to the cooling and heating switch through wires; the temperature sensor is arranged on the side wall of the shell and used for detecting the temperature outside and inside the shell.
3. The temperature-adaptive splitter according to claim 2, wherein the heat dissipation device comprises a heat dissipation plate and a heat dissipation fan, the heat dissipation plate is disposed on a hot surface of the semiconductor cooling plate, the heat dissipation fan is fixed to the heat dissipation plate, and the heat dissipation plate and the heat dissipation fan are connected to the cooling and heating switch through a wire.
4. The temperature-adaptive splitter of claim 3, wherein the heat dissipation fan is disposed inside the vent and in a middle portion of the heat dissipation fin.
5. The temperature-adaptive splitter of claim 4, wherein at least one flow guide channel is disposed in the heat sink, and a distal end of the flow guide channel faces an outside of the housing and extends into the vent to communicate with the vent.
6. The temperature-adaptive splitter of claim 3, wherein a contact surface of the heat sink and the semiconductor chilling plate is coated with a layer of thermally conductive silicone grease.
7. The temperature-adaptive splitter of claim 1, wherein the vent is comprised of a plurality of louver spaces disposed obliquely downward.
8. The adaptive temperature splitter of claim 1, wherein the enclosure has sliding grooves on two opposite inner sides of a top thereof, and sliding rails are correspondingly disposed on two opposite outer sides of the enclosure, wherein the enclosure is slidably connected to the enclosure.
9. The temperature-adaptive splitter of claim 2, wherein the temperature control system further comprises an alarm, the alarm being connected to the temperature sensor.
10. The temperature-adaptive splitter of claim 1, wherein the semiconductor chilling plates are single-stage or multi-stage bismuth telluride semiconductor chilling plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210485783.1A CN115166916A (en) | 2022-05-06 | 2022-05-06 | Temperature self-adaptive shunt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210485783.1A CN115166916A (en) | 2022-05-06 | 2022-05-06 | Temperature self-adaptive shunt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115166916A true CN115166916A (en) | 2022-10-11 |
Family
ID=83484005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210485783.1A Pending CN115166916A (en) | 2022-05-06 | 2022-05-06 | Temperature self-adaptive shunt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115166916A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002258076A (en) * | 2001-03-01 | 2002-09-11 | Hitachi Cable Ltd | Waveguide type optical multiplexing/branching device |
| CN105444789A (en) * | 2014-08-25 | 2016-03-30 | 同方威视技术股份有限公司 | Fiber grating demodulator and temperature control method thereof |
| CN108075828A (en) * | 2017-12-16 | 2018-05-25 | 国网湖北省电力有限公司信息通信公司 | A kind of OTDR devices based on multi-channel optical fibre optical monitoring signal |
| CN209044114U (en) * | 2018-08-22 | 2019-06-28 | 湖北省嘉迅光电科技有限公司 | A kind of Novel portable optical splitter |
| CN112863837A (en) * | 2021-01-05 | 2021-05-28 | 许昌学院 | Box-type transformer environment self-adaption system and method |
| CN214100576U (en) * | 2020-12-30 | 2021-08-31 | 重庆永德电气有限公司 | Energy-saving box-type fixed alternating-current metal closed ring network switch equipment |
| CN216285808U (en) * | 2021-11-29 | 2022-04-12 | 盛纬伦(深圳)通信技术有限公司 | Waveguide splitter |
-
2022
- 2022-05-06 CN CN202210485783.1A patent/CN115166916A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002258076A (en) * | 2001-03-01 | 2002-09-11 | Hitachi Cable Ltd | Waveguide type optical multiplexing/branching device |
| CN105444789A (en) * | 2014-08-25 | 2016-03-30 | 同方威视技术股份有限公司 | Fiber grating demodulator and temperature control method thereof |
| CN108075828A (en) * | 2017-12-16 | 2018-05-25 | 国网湖北省电力有限公司信息通信公司 | A kind of OTDR devices based on multi-channel optical fibre optical monitoring signal |
| CN209044114U (en) * | 2018-08-22 | 2019-06-28 | 湖北省嘉迅光电科技有限公司 | A kind of Novel portable optical splitter |
| CN214100576U (en) * | 2020-12-30 | 2021-08-31 | 重庆永德电气有限公司 | Energy-saving box-type fixed alternating-current metal closed ring network switch equipment |
| CN112863837A (en) * | 2021-01-05 | 2021-05-28 | 许昌学院 | Box-type transformer environment self-adaption system and method |
| CN216285808U (en) * | 2021-11-29 | 2022-04-12 | 盛纬伦(深圳)通信技术有限公司 | Waveguide splitter |
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