CN115165032A - Liquid interface position microwave measuring device and method - Google Patents

Abstract

The present disclosure provides a liquid interface position microwave measurement device for measuring the position of liquid interface, the liquid interface forms between first liquid layer and second liquid layer, microwave measurement device includes: a sinking microwave measuring unit arranged in the first liquid layer and used for transmitting an initial microwave measuring signal to a detector; a detector immersed in the first liquid layer and the second liquid layer, such that the initial microwave measurement signals are transmitted along the detector, echo signals are generated by signal reflections at the interface of the first liquid layer and the second liquid layer and/or at the reflecting structure, and a position measurement of the liquid interface and a position measurement of the reflecting structure are determined on the basis of the time difference between the transmitted initial signals and the received echo signals. The sinking microwave measuring unit is arranged in the first liquid layer, so that the path of a signal transmitted in the liquid is short, and the measuring error caused by the change of the liquid medium is improved. The disclosure also provides a correction and calibration method of the liquid interface position.

Description

Liquid interface position microwave measuring device and method

Technical Field

The disclosure relates to the technical field of radars, in particular to a liquid interface position microwave measuring device and method.

Background

The industrial field needs to measure the internal boundary surface of a container, for example, the upper layer of a traditional oil tank area is distributed as an oil layer, and a water layer with a certain thickness exists below the oil layer.

At present, a plurality of technologies can accurately measure the liquid level of an oil layer, but the thickness of a water layer below the oil layer, namely the position of an interface between the water layer and the oil layer, is lack of a high-precision measuring means, and if the thickness measurement of the water layer below the oil layer is not accurate enough, the liquid level measurement of an upper oil layer loses significance.

The traditional method for measuring the position of an oil-water interface adopts a capacitance or radio frequency admittance principle, the measurement principles of the capacitance and the radio frequency admittance are to detect the change of capacitance, and because the dielectric constant of petroleum is changed under the influence of water content, temperature and petroleum products, the measurement result of an instrument adopting the capacitance detection principle is greatly influenced by the dielectric constant of the petroleum.

Therefore, the instrument utilizing the capacitance or radio frequency admittance principle is difficult to realize the accurate measurement of the position of an oil-water interface, and for a large-range oil storage tank, when a signal penetrates through a thick oil measurement oil-water interface during measurement, the traditional guided wave radar method is often weak in collected and received echo signals, and is difficult to realize stable and accurate measurement.

Disclosure of Invention

In order to solve at least one of the above technical problems, the present disclosure provides a liquid interface microwave measuring device and method.

According to one aspect of the present disclosure, there is provided a liquid interface position microwave measuring device for measuring a position of a liquid interface formed between a first liquid layer and a second liquid layer, the liquid interface position microwave measuring device comprising:

a sinking microwave measurement unit disposed in the first liquid layer for transmitting an initial microwave measurement signal to a detector;

and the detector is immersed in the first liquid layer and the second liquid layer, so that the initial microwave measuring signal is transmitted along the detector, and the signal reflection is carried out at the interface of the first liquid layer and the second liquid layer and/or the reflection structure to generate an echo signal.

The liquid interface position microwave measuring device further comprises a high-frequency circuit signal processing module and a meter head, wherein the high-frequency circuit signal processing module is arranged in the sinking microwave measuring unit or the meter head and is used for generating an initial signal and receiving echo information;

the gauge head is not in contact with the liquid layer, and the sinking microwave measuring unit is connected with the gauge head through a connecting passage section.

According to at least one embodiment of this disclosure, the liquid interface position microwave measuring device, the microwave measuring unit that sinks includes:

the signal acquisition and processing module is connected with the high-frequency circuit signal processing module and is used for processing and transmitting the initial signal, acquiring and processing an echo signal into echo information and transmitting the echo information to the high-frequency circuit signal processing module;

the signal converter is connected with the signal acquisition and processing module, receives an initial signal transmitted by the signal acquisition and processing module, converts the initial signal into an initial microwave measurement signal, transmits the initial microwave measurement signal through the detector, receives and converts an echo signal transmitted by the detector, and transmits the echo signal to the signal acquisition and processing module;

the high-frequency circuit signal processing module obtains the measured value of the position of the echo signal based on the time difference between the transmitted initial signal and the echo signal in the received echo information, so that the measured value of the position of the liquid interface and/or the measured value of the position of the reflecting structure are/is determined.

According to the liquid interface position microwave measuring device of at least one embodiment of the present disclosure, the structure type of the detector is a single-rod structure, a single-cable structure, a multi-rod structure or a coaxial structure;

the multi-rod structure comprises a measuring probe rod and a grounding rod, wherein the measuring probe rod and the grounding rod are arranged in parallel, and the number of the grounding rods is at least one, preferably four; the coaxial structure is composed of a central detection rod and an outer cylinder.

According to the liquid interface position microwave measuring device of at least one embodiment of the present disclosure, the bottom end of the probe is provided with a heavy hammer for preventing the liquid interface position microwave measuring device from floating upwards due to buoyancy after entering the liquid layer to affect measurement.

According to the liquid interface position microwave measuring device of at least one embodiment of the present disclosure, more than one echo reflection structure is arranged on the detector, and the echo reflection structure is used for generating a reference echo signal, so that the liquid interface position microwave measuring device performs correction and/or distance calibration on the measured value of the liquid interface position.

According to the liquid interface position microwave measuring device of at least one embodiment of the present disclosure, the echo reflection structure comprises a reflection structure formed at the connection part of the detector and the signal converter, a reflection structure formed by changing the diameter of the measuring probe, a branch structure arranged on the measuring probe or a reflection component arranged on the grounding rod.

The liquid interface position microwave measuring device according to at least one embodiment of this disclosure further includes:

the temperature detection processing module is arranged in the gauge head of the liquid interface position microwave measuring device and used for receiving temperature information transmitted by the temperature measuring sensor;

the temperature measuring sensors are arranged inside the sealing layer of the connecting passage section and used for acquiring temperature information of the positions where the temperature measuring sensors are located and transmitting the temperature information to the temperature detection processing module.

The liquid interface position microwave measuring device according to at least one embodiment of this disclosure further includes:

the power supply module is used for receiving external power supply and then supplying power to all parts in the gauge head, and supplying power to the sinking microwave measuring unit and the sinking microwave measuring unit of the sinking microwave measuring unit through the connecting passage section;

the communication module is used for internal communication and external communication, the internal communication refers to data communication inside the liquid interface position microwave measuring device, and the external communication refers to data communication between the liquid interface position microwave measuring device and external equipment;

the display module is used for displaying data processed by the high-frequency circuit signal processing module and data transmitted by the temperature detection processing module;

the power module, the communication module and the display module are arranged in the gauge outfit.

According to another aspect of the disclosure, a correction method of a microwave measuring device based on a liquid interface position is provided, which comprises the following steps:

the microwave measuring device generates an initial signal through the high-frequency circuit signal processing module, and the initial signal passes through the signal acquisition and processing module, the signal converter and the detector and then generates an echo signal of a liquid interface at the liquid interface and generates a reference echo signal at the ith reflection structure;

the echo signal of the liquid interface and the reference echo signal of the ith reflection structure pass through the detector and the signal converter respectively and then are acquired by the signal acquisition and processing module to obtain echo information;

the high-frequency circuit signal processing module receives echo information, obtains a measured value of a position of a reference echo signal corresponding to an ith reflection structure through a time difference between a transmitted initial signal and a received time difference of the reference echo signal corresponding to the ith reflection structure, obtains an actual value of the position of the reference echo signal generated by the ith reflection structure due to the known position of the ith reflection structure, and further obtains a relation between the measured value and the actual value of the position of the reference echo signal of the ith reflection structure;

the high-frequency circuit signal processing module obtains a measured value of the liquid interface position through the time difference received by the echo signal corresponding to the transmitting initial signal and the liquid interface position; and

correcting the measured value of the liquid interface position based on the relation between the actual value of the ith reflection structure reference echo signal position and the measured value of the ith reflection structure reference echo signal position; wherein i is a natural number of 1 or more.

According to still another aspect of the present disclosure, there is provided a correction method for a microwave measuring device based on a liquid interface position, including:

the measuring device transmits an initial signal through the high-frequency circuit signal processing module, when the nth time and the (N + 1) th time of measurement are carried out, the initial signal is transmitted to the ith reflection structure and the liquid interface through the signal acquisition and processing module, the signal converter and the detector, and the nth time and the (N + 1) th time of measurement respectively generate a reference echo signal corresponding to the ith reflection structure and an echo signal corresponding to the liquid interface;

calculating a measured value of the position of the nth reference echo signal according to the nth reference echo signal corresponding to the ith reflecting structure;

calculating a measured value of the position of the (N + 1) th reference echo signal according to the (N + 1) th reference echo signal corresponding to the ith reflection structure;

obtaining the relation between the measured values of the reference echo signal positions corresponding to the nth reflection structure and the (N + 1) th reflection structure;

calculating the measured value of the liquid interface position of the (N + 1) th time according to the echo signal corresponding to the liquid interface position of the (N + 1) th time;

correcting the measured value of the echo signal position corresponding to the liquid interface at the (N + 1) th time based on the relation between the measured values of the reference echo signal positions corresponding to the ith reflection structure at the nth time and the (N + 1) th time;

wherein i is a natural number not less than 1, and N is a natural number not less than 1.

According to at least one embodiment of the present disclosure, the correction method of the microwave measuring device based on the liquid interface position further includes: and carrying out distance calibration on the corrected measured value of the liquid interface position:

obtaining a corrected measured value of the position of the liquid interface;

the position of the ith reflection structure is fixed and known, and the actual height position information of the ith reflection structure in the container is obtained, so that the actual height value of the reference echo signal position generated by the ith reflection structure in the container is obtained;

the high-frequency circuit signal processing module obtains a position measurement value of a reference echo signal generated by the ith reflection structure each time according to the reference echo signal correspondingly generated by the ith reflection structure received each time, so as to obtain a relation between the position measurement value of the reference echo signal generated by the ith reflection structure each time and the measurement value of the liquid interface position corrected each time;

and performing distance calibration on the corrected measured value of the liquid interface position based on the actual height value of the reference echo signal position generated by the ith reflection structure in the container, the relationship between the measured value of the reference echo signal position generated by the ith reflection structure every time and the measured value of the liquid interface position corrected every time, so as to obtain the actual height position information of the liquid interface position in the container.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

FIG. 1 is a schematic structural diagram of a liquid interface position microwave measuring device for measuring a liquid interface according to one embodiment of the disclosure.

FIG. 2 is a schematic block diagram of a liquid interface position microwave measurement device according to one embodiment of the present disclosure.

FIG. 3 is a block diagram schematic structure of a liquid interface position microwave measuring device according to one embodiment of the disclosure.

FIG. 4 is a schematic flow diagram of a method for correcting a liquid interface position by a liquid interface position microwave measuring device according to one embodiment of the disclosure.

FIG. 5 is a schematic flow diagram of a method for correcting a liquid interface position by a liquid interface position microwave measuring device according to yet another embodiment of the disclosure.

Description of the reference numerals

1000. Liquid interface position microwave measuring device

1001. High-frequency circuit signal processing module

1002. Signal acquisition and processing module

1003. Signal converter

1004. Detector

1005. Temperature detection processing module

1006. Power supply module

1007. Communication module

1008. Display module

1009. Sinking microwave measuring unit

1010. Watch head

1011. Connecting passage section

1012. Temperature measuring sensor

1013. Heavy hammer

1014. First reflecting structure

1015. Second reflecting structure

1016. Measuring probe rod

1017. A ground rod.

Detailed Description

The present disclosure will be described in further detail with reference to the drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the present disclosure. It should be further noted that, for the convenience of description, only the portions relevant to the present disclosure are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict. Technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Unless otherwise indicated, the illustrated exemplary embodiments/examples are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure may be practiced. Accordingly, unless otherwise indicated, features of the various embodiments may be additionally combined, separated, interchanged, and/or rearranged without departing from the technical concept of the present disclosure.

The use of cross-hatching and/or shading in the drawings is generally used to clarify the boundaries between adjacent components. As such, unless otherwise noted, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, proportion, commonality between the illustrated components and/or any other characteristic, attribute, property, etc., of a component. Further, in the drawings, the size and relative sizes of components may be exaggerated for clarity and/or descriptive purposes. While example embodiments may be practiced differently, the specific process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously or in reverse order to that described. In addition, like reference numerals denote like parts.

When an element is referred to as being "on" or "on," "connected to" or "coupled to" another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. However, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there are no intervening elements present. For purposes of this disclosure, the term "connected" may refer to physically, electrically, etc., and may or may not have intermediate components.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising" and variations thereof are used in this specification, the presence of stated features, integers, steps, operations, elements, components and/or groups thereof are stated but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. It is also noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximate terms and not as degree terms, and as such, are used to interpret inherent deviations in measured values, calculated values, and/or provided values that would be recognized by one of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of a liquid interface position microwave measuring device for measuring a liquid interface according to an embodiment of the present disclosure, in this embodiment, the liquid interface position microwave measuring device can be installed on the top of a container, a gas layer, a first liquid layer, and a second liquid layer are distributed in the container from top to bottom, and a liquid interface is formed between the first liquid layer and the second liquid layer. FIG. 2 is a schematic block diagram of the structure of a liquid interface position microwave measuring device according to one embodiment of the disclosure.

Referring to fig. 1 and 2, the liquid interface position microwave measuring device 1000 of the present embodiment includes: a sinking microwave measuring unit 1009, the sinking microwave measuring unit 1009 is disposed in the first liquid layer, and is configured to transmit the initial microwave measuring signal to the detector 1004;

and a detector 1004, wherein the detector 1004 is immersed in the first liquid layer and the second liquid layer, so that the initial microwave measurement signal is transmitted along the detector 1004, and an echo signal is generated by signal reflection at the interface position of the first liquid layer and the second liquid layer and/or at the reflection structure, namely the echo signal comprises an echo signal at the liquid interface and/or a reference echo signal at the reflection structure.

Referring to fig. 2, the liquid interface position microwave measuring device 1000 of the present disclosure further includes a gauge head 1010, the gauge head 1010 can be installed on the top of the container and is not in contact with the liquid layers (the first liquid layer, the second liquid layer, etc.), and the sinking microwave measuring unit 1009 is connected to the gauge head 1010 through a connection path 1011 to implement power supply, communication and signal transmission. It should be noted here that the gauge head 1010 may be mounted at other positions as long as it does not contact the liquid layer, instead of being mounted at the top of the container.

FIG. 3 is a schematic block diagram of the structure of a liquid interface position microwave measuring device according to still another embodiment of the disclosure.

Fig. 3 is different from fig. 2 in that the high frequency circuit signal processing module 1001 is disposed at a different position, the high frequency circuit signal processing module 1001 is disposed in the header 1010 in fig. 2, and the high frequency circuit signal processing module 1001 is disposed in the dip microwave measuring unit 1009 in fig. 3.

The high-frequency circuit signal processing module 1001 of the liquid interface position microwave measuring device 1000 may be disposed in the sinking microwave measuring unit 1009 or in the header 1010, and is configured to generate an initial signal and receive echo information, where the header 1010 may be mounted on the top of the container and is not in contact with the liquid layer, and the sinking microwave measuring unit 1009 is connected to the header 1010 through a connection path 1011; the high frequency circuit signal processing module 1001 is used for generating an initial signal and for receiving echo information.

Referring to fig. 2, in some embodiments of the present disclosure, a sinking microwave measurement unit 1009 of the liquid interface position microwave measurement device 1000 includes:

the signal acquisition and processing module 1002 is connected to the high-frequency circuit signal processing module 1001, and is configured to transmit an initial signal, acquire and process an echo signal into echo information, and transmit the echo information to the high-frequency circuit signal processing module 1001;

the signal converter 1003 is connected with the signal acquisition and processing module 1002, the signal converter 1003 receives an initial signal transmitted by the signal acquisition and processing module 1002, converts the initial signal into an initial microwave measurement signal, transmits and receives the initial microwave measurement signal through the detector 1004, and the signal converter 1003 converts an echo signal transmitted by the detector 1004 and transmits the echo signal to the signal acquisition and processing module 1002;

the high-frequency circuit signal processing module 1001 obtains a measurement value of the position of the echo signal based on the time difference between the transmitted initial signal and the echo signal received in the echo information, thereby determining a measurement value of the position of the liquid interface (the interface between the first liquid layer and the second liquid layer) and a measurement value of the position at the reflective structure.

The signal acquisition and processing module 1002 and the signal converter 1003 are arranged in a sinking microwave measuring unit 1009 at the liquid interface position, the high-frequency circuit signal processing module 1001 is arranged in a gauge head 1010 of the liquid interface position microwave measuring device 1000, and the sinking microwave measuring unit 1009 is connected with the gauge head 1010 through a connecting passage section 1011.

When the microwave measuring device 1000 is used for measuring at the liquid interface position, the signal acquisition and processing module 1002 and the signal converter 1003 are located in the first liquid layer, and are used for transmitting and converting the initial signal generated by the high-frequency circuit signal processing module 1001 into an initial microwave measuring signal and transmitting the initial microwave measuring signal to the detector 1004.

The probe 1004 is immersed in the first liquid layer and the second liquid layer, and in the process of transmitting the initial microwave measurement signal from top to bottom, when the initial microwave measurement signal meets the interface and/or the reflection structure of the first liquid layer and the second liquid layer, the initial microwave measurement signal is reflected to form an echo signal, and the echo signal is transmitted through the connection path 1011 after being transmitted by the probe 1004, converted by the signal converter 1003, collected and received by the signal collecting and processing module 1002, and finally received by the high-frequency circuit signal processing module 1001.

The hf-circuit signal processing module 1001 determines a measurement of the position of the liquid interface (the interface of the first liquid layer with the second liquid layer) and/or a measurement of the position at the reflecting structure by comparing the time difference of the echo signals in the transmitted initial signal and the received echo information.

Referring to fig. 3, in some embodiments of the present disclosure, the sinking microwave measuring unit 1009 of the liquid interface position microwave measuring device 1000 includes, in addition to the high-frequency circuit signal processing module 1001:

the signal acquisition and processing module 1002 is connected to the high-frequency circuit signal processing module 1001, and is configured to transmit an initial signal, acquire and process an echo signal into echo information, and transmit the echo information to the high-frequency circuit signal processing module 1001;

the signal converter 1003 is connected with the signal acquisition and processing module 1002, receives an initial signal transmitted by the signal acquisition and processing module 1002, converts the initial signal into an initial microwave measurement signal, transmits the initial microwave measurement signal through the detector 1004, receives and converts an echo signal transmitted by the detector 1004, and transmits the echo signal to the signal acquisition and processing module 1002;

the high-frequency circuit signal processing module 1001 obtains a measurement value of the position of the echo signal based on the time difference between the transmission of the initial signal and the reception of the echo signal in the echo information, thereby determining a measurement value of the position of the liquid interface (the interface of the first liquid layer and the second liquid layer) and/or a measurement value of the position at the reflective structure.

The high-frequency circuit signal processing module 1001, the signal acquisition and processing module 1002, and the signal converter 1003 are disposed in the sinking microwave measuring unit 1009, the detector 1004 is immersed in the first liquid layer and the second liquid layer, because the sinking microwave measuring unit 1009 is located in the first liquid layer, that is, when the microwave measuring device 1000 measures at the liquid interface position, the high-frequency circuit signal processing module 1001, the signal acquisition and processing module 1002, and the signal converter 1003 are all located in the first liquid layer, when the initial signal generated by the high-frequency circuit signal processing module 1001 is transmitted and converted into the initial microwave measuring signal and transmitted to the detector 1004, and in the process that the detector 1004 transmits the initial microwave measuring signal from top to bottom, when the initial microwave measuring signal encounters the interface and/or the reflecting structure between the first liquid layer and the second liquid layer, the initial microwave measuring signal is reflected to form an echo signal, and the echo signal is transmitted by the detector 1004, converted by the signal converter 1003, and is directly acquired and received by the signal acquisition and processing module 1002.

In the existing measurement method, the collection of echo signals is arranged in the gauge head, the gauge head is arranged on a container outside the liquid layer, and thus the transmission distance of the echo signals is relatively long.

When the high-frequency circuit signal processing module 1001 is disposed in the sink microwave measuring unit 1009 in the first liquid layer, since the initial signal generated by the high-frequency circuit signal processing module 1001 is transmitted from the initial signal to the position where it meets the interface between the first liquid layer and the second liquid layer and/or the reflection structure, the transmission path is also reduced, and since the larger the transmission distance of the initial signal is, the more the signal is attenuated, the effect of enhancing the echo signal can also be achieved.

Referring to fig. 1-3, the probe 1004 of the present disclosure includes a mechanical structure capable of transmitting an initial microwave measurement signal, an echo signal. The structure type of the detector is a single-rod structure, a single-cable structure, a coaxial structure or a multi-rod structure.

In some embodiments of the present disclosure, referring to fig. 1, the multi-rod structure includes a measurement probe 1016 and a ground rod 1017, wherein the ground rod 1017 is disposed in parallel with the measurement probe 1016, and the number of the ground rods 1017 is one or more, preferably four, and the ground rod 1017 can increase the strength/amplitude of the echo signal.

In some embodiments of the present disclosure, when the probe 1004 of the liquid interface position microwave measuring device 1000 is a coaxial structure, it preferably comprises a central probe rod and an outer cylinder.

According to the preferred embodiment of the present disclosure, the bottom end of the probe 1004 is provided with a weight 1013 for preventing the liquid interface position from floating upwards to affect the measurement due to buoyancy after the microwave measuring device 1000 enters the liquid layer. The shape of the weight 1013 is not particularly limited, and may be square, circular, triangular, conical, or other irregular shapes.

According to the preferred embodiment of the present disclosure, more than one echo reflection structure is disposed on the probe 1004, and the echo reflection structure is used for generating a reference echo signal, and correcting and distance calibrating the measurement value of the liquid interface position by referring to the measurement value of the echo signal position, so as to output the liquid level interface position with high precision.

In some embodiments of the present disclosure, the echo reflecting structure includes a reflecting structure formed at the connection of the probe 1004 and the signal converter 1003, a reflecting structure formed by changing the diameter of the measurement probe 1016, a branching structure provided on the measurement probe 1016, or a reflecting structure mounted on the ground rod 1017.

For example, when the diameter of the measurement probe 1016 is changed to form the reflection structure, the reflection structure may be formed by setting the diameter of the upper portion measurement probe to be smaller than the diameter of the lower portion measurement probe or the diameter of the upper portion measurement probe to be larger than the diameter of the lower portion measurement probe.

Referring to fig. 1, 2, 3, in some embodiments of the present disclosure, the liquid interface position microwave measurement device 1000 of the present disclosure further comprises:

the temperature detection processing module 1005, the temperature detection processing module 1005 is arranged in the gauge head 1010 of the liquid interface position microwave measuring device 1000, and is used for receiving the temperature information transmitted by the temperature measuring sensor;

the number of the temperature measurement sensors 1012 (refer to fig. 1) is at least one, and the temperature measurement sensors 1012 are disposed inside the sealing layer connected to the path section 1011, and are configured to acquire temperature information of a position where the temperature measurement sensor 1012 is located and transmit the temperature information to the temperature detection processing module 1005.

The temperature detection processing module 1005 includes a detection circuit or an MCU.

One or more temperature measuring sensors 1012 are arranged at preset mounting positions inside the sealing layer connected with the passage sections 1011. The plurality of temperature measurement sensors 1012 may be installed at equal intervals or at unequal intervals.

The temperature detection processing module 1005 is preset with position information of the temperature measurement sensor, and the temperature detection processing module 1005 detects and receives the temperature information transmitted by each temperature measurement sensor and processes the temperature information to obtain the temperature value at each position.

Wherein the temperature measurement sensor 1012 comprises a resistive temperature sensor or a digital temperature sensor. The resistance temperature sensor, such as pt100, uses a platinum thermistor, the resistance of which changes with the temperature and has a certain functional relationship, and the temperature detection processing module 1005 detects the change of the resistance to determine the temperature. The digital temperature sensor directly obtains a temperature value and outputs the temperature value to the temperature detection processing module 1005.

In some embodiments of the present disclosure, a plurality of temperature measurement sensors 1012 are arranged in a connection path section 1011 between the sinking microwave measurement unit 1009 and the header 1010 to form a multi-point temperature measurement system, which realizes integration of multi-point temperature measurement and liquid interface microwave measurement devices.

Referring to fig. 1-3, in some embodiments of the present disclosure, the liquid interface position microwave measurement device 1000 of the present disclosure further comprises:

the power module 1006 is used for receiving external power supply, supplying power to each component in the gauge outfit 1010, and supplying power to the sinking microwave measuring unit 1009 through a connecting passage 1011;

the communication module 1007, the communication module 1007 is used for internal communication and external communication, the internal communication refers to data communication inside the liquid interface position microwave measuring device 1000, and the external communication refers to data communication between the liquid interface position microwave measuring device 1000 and external equipment;

the display module 1008, the display module 1008 is used for displaying the data processed by the high frequency circuit signal processing module 1001 and the data transmitted by the temperature detection processing module 1005;

the power module 1006, the communication module 1007 and the display module 1008 are disposed in the head 1010 of the liquid interface measuring device 1000.

Wherein the intra-pair communication comprises: the liquid interface position value transmitted by the high-frequency circuit signal processing module 1001 and the temperature value transmitted by the temperature detection processing module 1005 are transmitted to the display module 1008, or parameters are set through the display module 1008 and are transmitted to the liquid interface position microwave measuring device for debugging control through the communication module 1007;

wherein, the external communication includes transmitting the position of the interface and the temperature values of each point to a central control room or a processing device beside the container outside the microwave measuring device 1000 of the liquid interface position through the communication module 1007, so as to facilitate the control or adjustment of the relevant processes.

The communication mode that the communication module 1007 can adopt includes wired communication or wireless communication, the wired communication includes RS485, internet access, and optical fiber, and the wireless communication is bluetooth, 4G/5G, LORA, zigBee, NB-IoT.

The outside of the sinking microwave measuring unit 1009 is provided with a sealed casing, and the sealed casing adopts the temperature resistant and corrosion resistant material or the temperature resistant material of coating anti-corrosive coating for the sinking microwave measuring unit 1009 soaks for a long time in liquid and measures, and liquid can not get into and do not receive the corruption.

According to the preferred embodiment of the present disclosure, at least one reflection structure is disposed on the probe 1004 of the liquid interface position microwave measuring device 1000, and the probe 1004 is of a single-rod structure, a single-cable structure, a coaxial structure or a multi-rod structure.

Referring to fig. 1, in some embodiments of the present disclosure, the multi-rod structure includes a measurement probe 1016, a ground rod 1017, the ground rod 1017 is disposed in parallel with the measurement probe 1016, and the number of the ground rods 1017 is one or more.

Wherein the echo reflection structure at least comprises a reflection structure formed at the connection part of the detector 1004 and the signal converter 1003, a reflection structure formed by changing the diameter of the measuring probe 1016, a branch structure arranged on the measuring probe 1016 or a reflection structure arranged on the grounding rod 1017.

Preferably, referring to FIG. 1, two echo reflecting structures, a first reflecting structure 1014 and a second reflecting structure 1015, are disposed on the probe 1004.

The first reflecting structure 1014 reflects the initial microwave measurement signal to generate a first reference echo signal, and the second reflecting structure 1015 reflects the initial microwave measurement signal to generate a second reference echo signal. Preferably, the junction between the measurement probe 1016 and the ground rod 1017 is a second reflective structure 1015, and the junction between the signal converter 1003 and the probe 1004 is a first reflective structure 1014.

The high-frequency circuit signal processing module 1001 of the liquid interface position microwave measuring device 1000 of the present disclosure may correct and distance-calibrate the measured value of the position of the liquid interface through the relationship between the measured value and the actual value of the position of the first/second reference echo signal, so as to obtain a more accurate position of the interface.

Preferably, the head 1010 of the liquid interface position microwave measuring device 1000 of the present disclosure is disposed at the top of the container. A connection through section 1011 is arranged between the gauge head 1010 and the sinking microwave measuring unit 1009, the connection through section 1011 forms a power supply, communication and signal transmission link, a sealing layer is arranged outside the connection through section 1011 for protection, the external sealing layer is made of a temperature-resistant and corrosion-resistant material, or an anti-corrosion coating is coated on the temperature-resistant material and used for measurement after being soaked in liquid for a long time, and the liquid medium cannot enter and is not corroded. When the high-frequency circuit signal processing module 1001 is set in the header 1010, a coaxial cable for connecting the high-frequency circuit signal processing module 1001 and the sinking microwave measuring unit 1009 is also provided in the connecting passage section 1011, protected by a sealing layer.

FIG. 4 is a schematic flow chart of a method for correcting a liquid interface position by a liquid interface position microwave measuring device according to one embodiment of the disclosure.

As shown in fig. 4, the method S100 for correcting the liquid interface position includes the following steps:

s102: the microwave measurement device 1000 transmits an initial signal transmitted by a high-frequency circuit signal processing module 1001 to a reflection structure (an ith reflection structure, which may be a first reflection structure, a second reflection structure, a third reflection structure, a fourth reflection structure, etc., i is a natural number greater than or equal to 1) and/or a liquid interface after passing through a signal acquisition and processing module 1002, a signal converter 1003 and a detector 1004, and generates an echo signal through the liquid interface and/or generates a reference echo signal through the reflection structure;

s104: the echo signal and the reference echo signal are transmitted by a detector 1004, a signal converter 1003 and a signal acquisition and processing module 1002, and then received by a high-frequency circuit signal processing module 1001;

s106: the high-frequency circuit signal processing module 1001 obtains a measurement value of a position where the reference echo signal is generated, through the initial signal and the reference echo signal, obtains an actual value of the position where the reference echo signal is generated based on the position of the known reflection structure, and further obtains a relationship between the measurement value and the actual value of the position where the reference echo signal is generated;

s108: the high-frequency circuit signal processing module 1001 calculates a liquid interface position measurement value based on a time difference between the transmission initial signal and the reception echo signal;

s110: the position measurement of the liquid interface is corrected on the basis of the relation between the actual value and the measurement value of the position at which the reference echo signal is generated.

In some embodiments of the present disclosure, the reflective structure includes a first reflective structure 1014 and/or a second reflective structure 1015.

In this case, the relationship between the measured value and the actual value of the position of the reference echo signal is generated, including but not limited to the relationship of the difference (change amount) between the two, the scaling factor, and the like. And correcting the measured value of the position of the reflection echo signal obtained each time, thereby ensuring the accuracy of the position measurement of the reflection echo signal each time, namely ensuring the accuracy of the position measurement of the interface each time.

By introducing the concept of the reference echo signal, errors caused in the transmission process during signal transmission can be improved, and the final measurement result has large errors. The reference echo signal and the interface echo signal are transmitted in the liquid medium, the influence of the change of the liquid medium on the reference echo signal and the interface echo signal is the same, and the reference echo signal is used for correcting and calibrating the interface echo signal, so that the measurement errors caused by the change of the liquid medium, such as the change of water content, temperature and quality, can be reduced as much as possible. Meanwhile, during measurement, the sinking microwave measuring unit and the detector are sunk into the liquid layer, so that the transmission distance of signals in the liquid is reduced, the influence of liquid medium change on measuring factors is reduced, echo signals can be enhanced, the signal-to-noise ratio of the echo signals is improved, and the measurement precision is improved.

FIG. 5 is a schematic flow chart of a correction method of the microwave measuring device based on the liquid interface position according to one embodiment of the disclosure.

As shown in fig. 5, a correction method S200 of the microwave measuring device based on the liquid interface position includes:

s202: the measurement device 1000 generates an initial signal through the high-frequency circuit signal processing module 1001, and when the nth time and the N +1 time pass through the signal acquisition and processing module 1002, the signal converter 1003 and the detector 1004, the initial signal is transmitted to a reflection structure (an ith reflection structure, which may be a first reflection structure, a second reflection structure, a third reflection structure, a fourth reflection structure, etc., i is a natural number greater than or equal to 1, and N is a natural number greater than or equal to 1) and/or a liquid interface, and a reference echo signal and an echo signal are respectively generated each time;

s204: the high-frequency circuit signal processing module 1001 calculates a measurement value of a position where the reference echo signal is generated N times;

s206: the high-frequency circuit signal processing module 1001 calculates a measurement value of a position where the reference echo signal is generated at the (N + 1) th time;

s208: obtaining the relation between the measurement values of the position where the reference echo signal is generated for the nth time and the N +1 th time;

s210: the high-frequency circuit signal processing module 1001 calculates a measurement value of a position where the echo signal is generated for the (N + 1) th time;

s212: the high-frequency circuit signal processing module 1001 corrects the measured value of the position where the echo signal is generated N +1 th time based on the relationship between the measured values of the positions where the reference echo signal is generated N +1 th time.

In some embodiments of the present disclosure, the reference echo signal is generated by the first reflecting structure 1014 and/or the second reflecting structure 1015.

The relationship between the measured values of the position where the reference echo signal is generated N times and N +1 times includes, but is not limited to, the relationship between the difference (change amount) between the two, the proportionality coefficient, and the like. And correcting the obtained measured value of the position of the (N + 1) th reflected echo signal, thereby ensuring the accuracy of the position measurement of each reflected echo signal, namely ensuring the accuracy of the position measurement of each interface.

Obtaining a corrected measured value of the liquid interface position based on the correction methods shown in fig. 5 and 6, and then performing distance calibration on the corrected measured value of the liquid interface position, wherein the flow is as follows:

obtaining a corrected measured value of the position of the liquid interface;

the position of a reflecting structure (the ith reflecting structure can be a first reflecting structure, a second reflecting structure, a third reflecting structure, a fourth reflecting structure and the like, i is a natural number which is more than or equal to 1, and N is a natural number which is more than or equal to 1) is fixed and known, and the actual height position information of the ith reflecting structure in the container is obtained, so that the actual height value of the reference echo signal position generated by the ith reflecting structure in the container is obtained;

the high-frequency circuit signal processing module obtains a position measurement value of a reference echo signal generated by the ith reflection structure each time according to the reference echo signal correspondingly generated by the ith reflection structure received each time, so as to obtain a relation between the position measurement value of the reference echo signal generated by the ith reflection structure of the reflection structure each time and the measurement value of the liquid interface position corrected each time;

and performing distance calibration on the corrected measured value of the liquid interface position based on the actual height value of the reference echo signal position generated by the ith reflection structure in the container, the relation between the measured value of the reference echo signal position generated by the ith reflection structure every time and the measured value of the liquid interface position corrected every time, so as to obtain the actual height position information of the liquid interface position in the container.

The utility model provides a liquid interface position microwave measuring device is an improved guided wave radar, and is different from traditional guided wave radar measurement interface, and this disclosure sinks signal acquisition and signal converter into the liquid layer, has reduced the transmission distance of signal in the liquid layer to having strengthened echo signal, having improved echo signal's SNR, having reduced the influence of liquid medium's change to measuring result, guarantee measurement accuracy.

In addition, a reference point capable of generating a reference echo is further arranged at a fixed position of the detector, and the measured value of the echo position of the interface is corrected and/or distance calibrated by using the measured value of the echo position at the measured reference point, so that the high precision of the interface position is improved. Meanwhile, a plurality of temperature measuring sensors are arranged to form a multipoint temperature measuring system, and the integration of the multipoint temperature measuring instrument and the interface measuring instrument is realized.

In the description herein, reference to the description of the terms "one embodiment/implementation," "some embodiments/implementations," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/implementation or example is included in at least one embodiment/implementation or example of the present application. In this specification, the schematic representations of the terms described above are not necessarily the same embodiment/mode or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/aspects or examples and features of the various embodiments/aspects or examples described in this specification can be combined and combined by those skilled in the art without being mutually inconsistent.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

It will be understood by those skilled in the art that the foregoing embodiments are merely for clarity of illustration of the disclosure and are not intended to limit the scope of the disclosure. Other variations or modifications may occur to those skilled in the art, based on the foregoing disclosure, and are still within the scope of the present disclosure.

Claims (10)

1. A liquid interface position microwave measuring device for measuring the position of a liquid interface formed between a first liquid layer and a second liquid layer, the liquid interface position microwave measuring device comprising:

a sinking microwave measurement unit disposed in the first liquid layer for transmitting an initial microwave measurement signal to a detector; and

and the detector is immersed in the first liquid layer and the second liquid layer, so that the initial microwave measurement signal is transmitted along the detector, and signal reflection is carried out at the interface of the first liquid layer and the second liquid layer and/or the reflection structure to generate an echo signal.

2. The liquid interface position microwave measuring device according to claim 1, further comprising a high-frequency circuit signal processing module and a meter head, wherein the high-frequency circuit signal processing module is arranged in the sinking microwave measuring unit or the meter head and used for generating an initial signal and receiving echo information;

the gauge head is not in contact with the liquid layer, and the sinking microwave measuring unit is connected with the gauge head through a connecting passage section.

3. The liquid interface position microwave measurement device of claim 1, wherein the sinking microwave measurement unit comprises:

the signal acquisition and processing module is connected with the high-frequency circuit signal processing module and is used for processing and transmitting the initial signal, acquiring and processing an echo signal into echo information and transmitting the echo information to the high-frequency circuit signal processing module;

the signal converter is connected with the signal acquisition and processing module, receives an initial signal transmitted by the signal acquisition and processing module, converts the initial signal into an initial microwave measurement signal, transmits the initial microwave measurement signal through the detector, receives and converts an echo signal transmitted by the detector, and transmits the echo signal to the signal acquisition and processing module;

the high-frequency circuit signal processing module obtains the measured value of the position of the echo signal based on the time difference between the transmitted initial signal and the echo signal in the received echo information, so that the measured value of the position of the liquid interface and/or the measured value of the position of the reflecting structure are/is determined.

4. The liquid interface position microwave measuring device according to claim 1, characterized in that the structure type of the detector is a single-rod structure, a single-cable structure, a multi-rod structure or a coaxial structure;

the multi-rod structure comprises a measuring probe rod and a grounding rod, wherein the measuring probe rod and the grounding rod are arranged in parallel, and the number of the grounding rods is at least one, preferably four; the coaxial structure is composed of a central detection rod and an outer cylinder.

5. The liquid interface position microwave measuring device of claim 1, wherein the bottom of the probe is provided with a weight for preventing the liquid interface position microwave measuring device from floating upwards due to buoyancy to affect the measurement after entering the liquid layer.

6. The liquid interface position microwave measuring device of claim 1, wherein more than one echo reflection structure is arranged on the detector, and the echo reflection structure is used for generating a reference echo signal so that the liquid interface position microwave measuring device can correct and/or calibrate the distance of the measured value of the liquid interface position.

7. The liquid interface position microwave measurement device of claim 6, wherein the echo reflection structure comprises a reflection structure formed at the connection of the probe and the signal converter, a reflection structure formed by changing the diameter of the measurement probe, a branch structure provided on the measurement probe, or a reflection member mounted on the ground rod;

preferably, the method further comprises the following steps:

the temperature detection processing module is arranged in the gauge head of the liquid interface position microwave measuring device and used for receiving temperature information transmitted by the temperature measuring sensor; and

the temperature measuring sensors are arranged inside the sealing layer of the connecting passage section and used for acquiring temperature information of the positions of the temperature measuring sensors and transmitting the temperature information to the temperature detection processing module;

preferably, the method further comprises the following steps:

the power supply module is used for receiving external power supply and then supplying power to all parts in the gauge head, and supplying power to the sinking microwave measuring unit and the sinking microwave measuring unit of the sinking microwave measuring unit through the connecting passage section;

the communication module is used for internal communication and external communication, the internal communication refers to data communication inside the liquid interface position microwave measuring device, and the external communication refers to data communication between the liquid interface position microwave measuring device and external equipment; and

the display module is used for displaying the data processed by the high-frequency circuit signal processing module and the data transmitted by the temperature detection processing module;

the power module, the communication module and the display module are arranged in the gauge outfit.

8. A correction method of a microwave measuring device based on a liquid interface position is characterized by comprising the following steps:

the microwave measuring device generates an initial signal through the high-frequency circuit signal processing module, and the initial signal passes through the signal acquisition and processing module, the signal converter and the detector and then generates an echo signal of a liquid interface at the liquid interface and generates a reference echo signal at the ith reflection structure;

the echo signal of the liquid interface and the reference echo signal of the ith reflection structure pass through the detector and the signal converter respectively and then are acquired by the signal acquisition and processing module to obtain echo information;

the high-frequency circuit signal processing module receives echo information, obtains a measured value of a position of a reference echo signal corresponding to an ith reflection structure through a time difference between a transmitted initial signal and a received time difference of the reference echo signal corresponding to the ith reflection structure, obtains an actual value of the position of the reference echo signal generated by the ith reflection structure due to the known position of the ith reflection structure, and further obtains a relation between the measured value and the actual value of the position of the reference echo signal of the ith reflection structure;

the high-frequency circuit signal processing module obtains a measured value of the liquid interface position through the time difference received by the echo signal corresponding to the transmitting initial signal and the liquid interface position; and

correcting the measured value of the liquid interface position based on the relation between the actual value of the ith reflection structure reference echo signal position and the measured value of the ith reflection structure reference echo signal position;

wherein i is a natural number of 1 or more.

9. A correction method of a microwave measuring device based on a liquid interface position is characterized by comprising the following steps:

the measuring device transmits an initial signal through the high-frequency circuit signal processing module, when the nth time and the (N + 1) th time of measurement are carried out, the initial signal is transmitted to the ith reflection structure and the liquid interface through the signal acquisition and processing module, the signal converter and the detector, and the nth time and the (N + 1) th time of measurement respectively generate a reference echo signal corresponding to the ith reflection structure and an echo signal corresponding to the liquid interface;

calculating a measured value of the position of the nth reference echo signal according to the nth reference echo signal corresponding to the ith reflecting structure;

calculating a measured value of the position of the reference echo signal of the (N + 1) th time according to the reference echo signal corresponding to the (N + 1) th reflection structure;

obtaining the relation between the measured values of the reference echo signal positions corresponding to the nth reflection structure and the (N + 1) th reflection structure;

calculating the measured value of the liquid interface position of the (N + 1) th time according to the echo signal corresponding to the liquid interface position of the (N + 1) th time; and

correcting the measured value of the echo signal position corresponding to the liquid interface at the (N + 1) th time based on the relation between the measured values of the reference echo signal positions corresponding to the ith reflection structure at the nth time and the (N + 1) th time;

wherein i is a natural number not less than 1, and N is a natural number not less than 1.

10. The liquid interface position-based microwave measurement device correction method according to claim 8 or 9, characterized by further comprising: and carrying out distance calibration on the corrected measured value of the liquid interface position:

obtaining a corrected measured value of the position of the liquid interface;

the position of the ith reflection structure is fixed and known, and the actual height position information of the ith reflection structure in the container is obtained, so that the actual height value of the reference echo signal position generated by the ith reflection structure in the container is obtained;

the high-frequency circuit signal processing module obtains a position measurement value of a reference echo signal generated by the ith reflection structure each time according to the reference echo signal correspondingly generated by the ith reflection structure received each time, so as to obtain a relation between the position measurement value of the reference echo signal generated by the ith reflection structure each time and the measurement value of the liquid interface position corrected each time;

and performing distance calibration on the corrected measured value of the liquid interface position based on the actual height value of the reference echo signal position generated by the ith reflection structure in the container, the relationship between the measured value of the reference echo signal position generated by the ith reflection structure every time and the measured value of the liquid interface position corrected every time, so as to obtain the actual height position information of the liquid interface position in the container.

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