CN1151602C - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- CN1151602C CN1151602C CNB001043102A CN00104310A CN1151602C CN 1151602 C CN1151602 C CN 1151602C CN B001043102 A CNB001043102 A CN B001043102A CN 00104310 A CN00104310 A CN 00104310A CN 1151602 C CN1151602 C CN 1151602C
- Authority
- CN
- China
- Prior art keywords
- opening
- edge
- electronic unit
- protuberance
- conductive cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229940037003 alum Drugs 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Terminal electrodes and an insulating layer are formed on a case substrate, and piezoelectric elements are mounted on the case substrate, and a metallic cap is jointed to the case substrate with an insulating adhesive between them. In this electronic component, a projecting part, which projects downward relative to other parts, is formed in the aperture edge of the metallic cap and is jointed to conductive paste fingers which are electrically connected to terminal electrodes connected to the ground potential, the metallic cap and the terminal electrode are electrically connected, and the insulating layer and the metallic cap are jointed by the insulating adhesive.
Description
Technical field
The present invention relates to a kind of electronic unit such as piezo-electric resonator or piezoelectric filter, the invention particularly relates to a kind of like this electronic unit, wherein electronic component unit is contained in the encapsulation, described encapsulation comprises housing substrate and conductive cap.
Background technology
The structure of piezoelectric filter is such, that is, a piezoelectric element is accommodated in the encapsulation that is made of housing substrate and conductive cap.Usually metal lid is used as conductive cap, is used for being encapsulated in wherein and providing electromagnetic shielding piezoelectric element.
Disclosed the example of such electronic unit in the 9-307397 Japanese Patent Application Publication bulletin.As shown in Figure 6, in the electronic unit that in this patent announcement, discloses, terminal electrode 52,53 and 54 is arranged on the housing substrate 51.In addition, insulating barrier 55 is arranged on the housing substrate 51, yet insulating barrier 55 is shown as with housing substrate 51 and separates in Fig. 6.Insulating barrier 55 has the shape of rectangle.Rectangular layer 56 and 57 (being made by conductive paste) is positioned at about mid portion of the longer side of insulating barrier 55.
By the circular layer of making by conductive paste 59,60 and 61 capacitor 58 is connected to terminal electrode 52,53 and 54, thereby capacitor 58 is connected electrically to terminal electrode 52,53 and 54.Piezo-electric resonator 62 is connected to the upper surface of capacitor 58 by the circular layer of being made by conductive paste 63 and 64.
By said method, capacitor 58 and piezo-electric resonator 62 are installed on the housing substrate 51.In addition, by insulation stick 66 metal lid 65 is connected to insulating barrier 55 on the housing substrate 51, and metal lid 65 is used for encapsulated capacitor 58 and piezo-electric resonator 62.
At the part place that conductive paste layer 56 and 57 are set, insulation stick 66 moves on to the zone that is positioned on its both sides from the lower edge of metal lid 65.As a result, metal lid 65 is connected electrically to conductive paste layer 56 and 57.
Thus, behind the insulating barrier 55 that metal lid 65 is connected to by insulation stick 66 on the housing substrate 51, before 66 hardening of insulation stick, metal lid 65 is pressed onto on the housing substrate 51, so that metal lid 65 is contacted with 57 with conductive paste layer 56.By such processing, metal lid 65 is connected electrically to the terminal electrode 53 of ground connection, thereby metal lid 65 provides electromagnetic shielding.
But, the electronic unit of relevant prior art has significant disadvantages in the following areas, even when the edge of opening of metal lid 65 has an even surface, if the surface curvature of housing substrate 51 or inhomogeneous then becomes insufficient by being electrically connected of conductive paste layer 56 and 57 between metal lid 65 and the terminal electrode 53.
Summary of the invention
In order to address the above problem, preferred embodiment of the present invention provides a kind of its conductive cap to be provided with to such an extent that the electronic unit of the conductive cap of electromagnetic shielding is provided reliably.
Preferred embodiment of the present invention provides a kind of electronic unit, it comprises the housing substrate that has grounding electrode on its upper surface, is installed in the on-chip electronic unit element of housing and has opening and around the conductive cap of the edge of opening of opening, and conductive cap is connected to by the insulation stick on the upper surface of housing substrate to encapsulate this electronic component unit.Protuberance is positioned at edge of opening, thereby protuberance extends from the edge.Protuberance is connected on the grounding electrode of housing substrate by conductive connecting material, thereby conductive cap is connected electrically on the electrode.
Preferably, the edge of opening of conductive cap has the polygonal shape that a plurality of sides are arranged, and protuberance is positioned on its at least one side.In this case, protuberance preferably is positioned at the position corresponding to grounding electrode.Perhaps, the edge of opening of conductive cap has the polygonal shape that a plurality of sides are arranged, and the entire portion of at least one side is determined protuberance.In this case, protuberance can easily form when forming edge of opening.
Various types of electronic component units can be attached in the preferred embodiment of the present invention.In the concrete preferred embodiment that is described below, with a piezo-electric resonator combination of elements in electronic unit.In this case, obtain a kind of piezoelectric resonance component that the good electrical magnetic screening effect is provided by conductive cap.
Preferably, metal lid is used as conductive cap.In this case, protuberance can easily form, thereby can easily produce the electronic unit according to preferred embodiment of the present invention.
Preferably, electrode is arranged on the housing substrate, thereby electrode extends on the perimeter of conductive cap.In this case, electronic unit can be connected electrically to external circuit by being positioned at the on-chip electrode of housing.That is, can provide a kind of electromagnetic shielding fabulous and sheet shape electronic unit that can mounted on surface.
In another preferred embodiment of the present invention, a kind of method of making electronic unit may further comprise the steps: the surface is gone up the housing substrate with grounding electrode is set thereon, electronic unit is installed on the housing substrate, setting has the conductive cap of edge of opening, thereby forming the protuberance protuberance on edge of opening extends from edge of opening, connect conductive cap and housing substrate, thereby protuberance and grounding electrode are electrically connected.
With reference to preferred embodiment of the present invention and accompanying drawing, describe other characteristics of the present invention, key element and advantage in detail below.
Description of drawings
Fig. 1 is the decomposition diagram according to the electronic unit of preferred embodiment of the present invention;
Fig. 2 A is the plane graph that is used for according to the piezoelectric element of the electronic unit of preferred embodiment of the present invention;
Fig. 2 B is the upward view of the piezoelectric element of Fig. 2 A;
Fig. 3 is the end view with the metal lid that acts on the conductive cap in the preferred embodiment of the present invention;
Fig. 4 is the partial cross section figure that is used to describe the protuberance effect that is formed on the metal lid;
Fig. 5 is the end view of another preferred embodiment that is used for the present invention's conductive cap;
Fig. 6 is the decomposition diagram of the electronic unit in the correlation technique.
Embodiment
Fig. 1 is the decomposition diagram according to the electronic unit of preferred embodiment of the present invention.In the electronic unit of this preferred embodiment, use haply housing substrate 1 as rectangle.Housing substrate 1 preferably can be by the insulating material such as synthetic resin, or the insulating ceramic materials such as alum clay is made.Preferably, terminal electrode 2,3,4 and 5 is arranged on the upper surface of housing substrate 1.Note, between terminal electrode 2,3,4 and 5, terminal electrode 3 best ground connection.Preferably, recess 1a, 1b and 1c are arranged on the side surface of housing substrate 1, and on the side surface of another opposite side, form recess 1d, 1e and 1f.Respectively the relative end of terminal electrode 2 is provided with to such an extent that extend to recess 1a and 1d.The opposed end of terminal electrode 3 is provided with to such an extent that extend to recess 1b and 1e.Be provided with the end of terminal electrode 4 and 5 to such an extent that extend to recess 1f and 1c.
Owing to be provided with terminal electrode 2,3,4 and 5 to such an extent that extend to recess 1a respectively to 1f, each terminal electrode 2,3,4 and 5 can be connected electrically to an external circuit, and method is to make external circuit be connected to recess 1a in the 1f.The insulating barrier 6 that is preferably approximately rectangle is set on housing substrate 1.Insulating barrier 6 be provided with prevent terminal electrode 2,4 and 5 and metal lid 7 between the conduction, this will be described below.Material for insulating barrier 6 is not specifically limited, and preferably, can use the insulating material such as epoxy resin or glass.
Preferably, paired piezoelectric element 8 and 9 is installed on the housing substrate 1.The structure of piezoelectric element is described with reference to Fig. 2 A and 2B below.Fig. 2 A and 2B are the plane graph and the upward views of piezoelectric element 8, and they show its electrode structure.With reference to Fig. 2 A and 2B, preferably, piezoelectric element 8 comprises the elongated piezoelectric substrate 10 of rectangle that is haply.Piezoelectric substrate 10 is preferably by the piezoceramic material such as the lead zirconium titanate pottery, or the piezoelectric monocrystal such as quartz is made.When piezoelectric substrate 10 was made by piezoelectric ceramic, piezoelectric substrate 10 was preferably along the direction polarization that is parallel to the first type surface of substrate 10.
First and second exciting electrodes 11 and 12 are arranged on the upper surface of piezoelectric substrate 10, predetermined gap is arranged between them.Public electrode 13 is arranged on the lower surface of piezoelectric substrate 10, thereby public electrode 13 is faced in the face of exciting electrode 11 and 12 by piezoelectric substrate 10.Exciting electrode 11 and 12 and public electrode 13 constitute the first piezoelectric resonator part.
Similarly, third and fourth exciting electrode 14 and 15 is arranged on the upper surface of piezoelectric substrate 10, predetermined gap is arranged between them, and on the lower surface of piezoelectric substrate 10, determine a public electrode 16, thereby public electrode 16 is faced exciting electrode 14 and 15 by piezoelectric substrate 10.Exciting electrode 14 and 15 and public electrode 16 constitute the second piezoelectric resonator part.
In addition, between the second and the 3rd exciting electrode 12 and 14, electrode for capacitors 17 is set, and another electrode for capacitors 18 is set on the lower surface of piezoelectric substrate 10.
First exciting electrode 11 is connected electrically to the terminal electrode 19 that is provided with along an end face of piezoelectric substrate 10.Similarly, the 4th exciting electrode 15 is connected electrically to the terminal electrode 20 that is provided with along another end face of piezoelectric substrate 10.Be provided with each terminal electrode 19 and 20 to such an extent that extend to the lower surface of piezoelectric substrate 10 by corresponding end surfaces.Notice that piezoelectric element 9 has the structure identical with piezoelectric element 8 preferably.
Terminal electrode 19 and 20 and electrode for capacitors 18 between be electrically connected and make each piezoelectric element 8 and 9 can be as utilizing the piezoelectric filter of thickness tangential vibrations pattern.In addition, being electrically connected between the terminal electrode 19 by piezoelectric element 8 and the terminal electrode 19 of piezoelectric element 9 produces the secondary piezoelectric filter.In using the secondary piezoelectric filter, input signal is imposed on the terminal electrode 20 of piezoelectric element 8, and with electrode for capacitors 18 ground connection of piezoelectric element 8 and 9.Thus, can obtain output signal from the terminal electrode 20 of piezoelectric element 9.
Note, piezoelectric element 8 and 9 is connected electrically to above-mentioned terminal electrode 2 to 5.Referring now to Fig. 1, piezoelectric element 8 is connected to terminal electrode 2,3 and 4 by conductive paste layer 21,22 and 23 preferably.More particularly, the part that terminal electrode 19 is extended to the lower surface of piezoelectric substrate 10 is connected electrically to the terminal electrode 2 of housing substrate 1 by conductive paste layer 21.Electrode for capacitors 18 is connected electrically to the terminal electrode 3 of housing substrate 1 by conductive paste layer 22.The part that terminal electrode 20 is extended to the lower surface of piezoelectric substrate 10 is connected electrically to the terminal electrode 4 of housing substrate 1 by conductive paste layer 23.Similarly, piezoelectric element 9 is connected to terminal electrode 2,3 and 5 by conductive paste layer 24,25 and 26.
After piezoelectric element 8 and 9 is connected to housing substrate 1 by conductive paste layer 21 to 26, conductive paste layer 27 and 28 is set on the insulating barrier 6.Preferably conductive paste layer 27 and 28 is provided with to such an extent that cross over insulating barrier 6, so that set up and being electrically connected of terminal electrode 3.In other words, the inner and the outer end with conductive paste layer 27 and 28 all is connected electrically to terminal electrode 3.Note, through hole can be arranged in the insulating barrier 6, so as to set up conductive paste layer 27 and 28 and terminal electrode 3 between be electrically connected.When metal lid 7 is connected to housing substrate 1, at first conductive paste layer 27 and 28 is arranged on the insulating barrier 6, the stick 29 that will insulate then is applied to the edge of opening of metal lid 7, then metal lid 7 is connected to housing substrate 1.The edge of opening of metal lid 7 preferably has the polygonal shape that a plurality of sides are arranged.Edge of opening is positioned at the part of longer side 7a and 7b preferably down with respect to shorter side 7c and 7d protrusion, thereby determines the protuberance X according to preferred embodiment of the present invention.That is, shown in the end view of Fig. 3, the mid portion of longer side 7 preferably protrudes down so that protuberance X to be provided.Note, in Fig. 3, describe protuberance, thereby the protrusion amount of protuberance X is greater than actual protrusion amount among Fig. 3 in the mode of exaggeration.
Because protuberance X, when being connected to the insulating barrier 6 of housing substrate 1 on by the insulation stick metal lid 7 as shown in Figure 1, as shown in Figure 4, the protuberance X of metal lid 7 contacts with conductive paste layer in reliable mode, is electrically connected thereby set up reliably between metal lid 7 and terminal electrode 3.
The result, even when housing substrate 1 is bent, or insulation stick 29 is when being applied to metal lid 7 unevenly, because the protuberance X of above-mentioned metal lid 7, when metal lid 7 is crushed on the insulating barrier 6, it is Conductive Grease layer 27 and 28 reliably, and this part is compared with the other parts of metal lid 7, is more prone to and contacts with 28 with conductive paste layer 27 reliably.Correspondingly, realize the mechanical connection between metal lid 7 and the insulating barrier 6 not only reliable and securely, realized being electrically connected between metal lid 7 and the terminal electrode 3 also reliable and securely.Thus, metal lid 7 can provide electromagnetic shielding in reliable mode.
In above-mentioned preferred embodiment, the similar entire portion of longer side 7a of each of the edge of opening of metal lid 7 and 7b (but not being whole) is all protruded down so that protuberance X to be provided.But shown in the end view of Fig. 5, the mid portion of each side of longer side 7a and 7b can protrude the part down, so that a protuberance X to be provided.Perhaps, the entire portion of each side of longer side 7a and 7b can be protruded down so that protuberance X to be provided.In addition, the shape of the edge of opening of metal lid 7 is not limited to rectangular shape haply, can be such as pentagon, circle or other suitable shape.Also have, can use the conductive cap alternative metals lid 7 of making and be coated with electric conducting material by ceramic material.Notice that the position that is arranged on the protuberance on the edge of opening of conductive cap can be according to the position of the terminal electrode of ground connection on the housing substrate, and be provided be connected to the conductive paste layer of terminal electrode location-appropriate ground determine.
Though specifically illustrate and described the present invention with reference to preferred embodiment of the present invention, the people who is familiar with this area knows, under the condition that does not deviate from the spirit and scope of the invention, can have above-mentioned and other formal and details on change.
Claims (19)
1. electronic unit is characterized in that comprising:
The housing substrate that has grounding electrode on its upper surface;
Be installed in the on-chip electronic component unit of described housing;
Conductive cap with edge of opening;
Be arranged on the protuberance on the described edge of opening, described protuberance is arranged to extend from edge of opening, and the edge of opening of wherein said conductive cap is connected to the upper surface of described housing substrate; With
Be arranged on the insulation stick on the lid opening edge, it is connected to the edge of opening of conductive cap the upper surface of housing substrate.
2. electronic unit as claimed in claim 1 is characterized in that, described protuberance contacts with grounding electrode is electric.
3. electronic unit as claimed in claim 2 is characterized in that also comprising the electric conducting material on the grounding electrode, and wherein protuberance contacts electric conducting material, thereby protuberance is connected electrically to grounding electrode.
4. electronic unit as claimed in claim 1 is characterized in that the edge of opening of conductive cap has the polygonal shape that a plurality of sides are arranged, and wherein protuberance is arranged on described at least one side.
5. electronic unit as claimed in claim 1, the edge of opening that it is characterized in that conductive cap is for circular.
6. electronic unit as claimed in claim 4 is characterized in that protuberance is arranged on the whole edge of described at least one side of conductive cap.
7. electronic unit as claimed in claim 1 is characterized in that electronic component unit is the piezo-electric resonator element.
8. electronic unit as claimed in claim 1 is characterized in that conductive cap is a metal lid.
9. electronic unit as claimed in claim 1 is characterized in that, described grounding electrode extends to the zone beyond the conductive cap.
10. electronic unit as claimed in claim 3 is characterized in that electric conducting material is a conductive paste layer.
11. electronic unit as claimed in claim 1 is characterized in that conductive cap made by ceramic material, and coated with conductive material.
12. an electronic unit is characterized in that comprising:
The housing substrate that has grounding electrode on its upper surface;
Be installed in the on-chip electronic component unit of housing;
Housing, described housing has upper surface, a plurality of sidewalls that extend and determined an opening portion by upper surface, and have at least a protuberance to be arranged on the described opening portion, thereby described at least one protuberance extends from opening portion, the opening portion of its middle shell is connected to the upper surface of housing substrate, thereby at least one projection contacts with grounding electrode is electric; With
Be arranged on the insulation stick on the lid opening edge, it is connected to the edge of opening of conductive cap the upper surface of housing substrate.
13. electronic unit as claimed in claim 12 is characterized in that also comprising the electric conducting material on the grounding electrode, wherein protuberance contacts electric conducting material, thereby described protuberance is connected electrically to described grounding electrode.
14. electronic unit as claimed in claim 12 is characterized in that housing is a metal shell.
15. electronic unit as claimed in claim 12 is characterized in that housing made by ceramic material, and coated with conductive material.
16. electronic unit as claimed in claim 12 is characterized in that electronic component unit is the piezoelectric element unit.
17. a method of making electronic unit is characterized in that comprising following steps:
The housing substrate is provided, has grounding electrode on the upper surface of described housing substrate;
Electronic unit is installed on the described housing substrate;
Conductive cap with edge of opening is provided;
On described edge of opening, form protuberance, thereby protuberance extends from edge of opening;
Connect conductive cap and housing substrate, thereby protuberance contacts with grounding electrode is electric;
The insulation stick is set on the lid opening edge, thereby the edge of opening of conductive cap is connected to the upper surface of housing substrate.
18. the method for manufacturing electronic unit as claimed in claim 17 is characterized in that providing the step of conductive cap also to comprise making edge of opening to form to such an extent that have a plurality of sides.
19. the method for manufacturing electronic unit as claimed in claim 18, the step that it is characterized in that forming protuberance also are included at least one side of edge of opening and form protuberance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP070498/1999 | 1999-03-16 | ||
| JP07049899A JP3646776B2 (en) | 1999-03-16 | 1999-03-16 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1267131A CN1267131A (en) | 2000-09-20 |
| CN1151602C true CN1151602C (en) | 2004-05-26 |
Family
ID=13433259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001043102A Expired - Lifetime CN1151602C (en) | 1999-03-16 | 2000-03-15 | Electronic component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3646776B2 (en) |
| CN (1) | CN1151602C (en) |
| DE (1) | DE10003501C2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3762313B2 (en) * | 2002-02-27 | 2006-04-05 | 富士通株式会社 | Metal enclosure |
| JP4752875B2 (en) * | 2008-06-25 | 2011-08-17 | ソニー株式会社 | Drive device and track jump method |
| JP5463173B2 (en) * | 2010-03-12 | 2014-04-09 | 日立オートモティブシステムズ株式会社 | Angular velocity detector |
| KR20130058956A (en) * | 2011-11-28 | 2013-06-05 | 삼성전기주식회사 | Ultrasonic sensor and manufacturing method thereof |
| TWI656543B (en) * | 2015-10-16 | 2019-04-11 | 日商村田製作所股份有限公司 | Electronic parts |
| KR102653201B1 (en) * | 2016-03-30 | 2024-04-01 | 삼성전기주식회사 | Acoustic wave device and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291594A (en) * | 1993-03-31 | 1994-10-18 | Matsushita Electric Ind Co Ltd | Electronic part and manufacture of the same |
| JP3183169B2 (en) * | 1996-05-09 | 2001-07-03 | 株式会社村田製作所 | Electronic component manufacturing method |
-
1999
- 1999-03-16 JP JP07049899A patent/JP3646776B2/en not_active Expired - Lifetime
-
2000
- 2000-01-27 DE DE2000103501 patent/DE10003501C2/en not_active Expired - Lifetime
- 2000-03-15 CN CNB001043102A patent/CN1151602C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1267131A (en) | 2000-09-20 |
| DE10003501C2 (en) | 2003-04-24 |
| JP2000269772A (en) | 2000-09-29 |
| DE10003501A1 (en) | 2000-10-12 |
| JP3646776B2 (en) | 2005-05-11 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20040526 |