CN115150727A - MEMS microphone, mobile terminal and MEMS microphone manufacturing method - Google Patents

MEMS microphone, mobile terminal and MEMS microphone manufacturing method Download PDF

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Publication number
CN115150727A
CN115150727A CN202210692994.2A CN202210692994A CN115150727A CN 115150727 A CN115150727 A CN 115150727A CN 202210692994 A CN202210692994 A CN 202210692994A CN 115150727 A CN115150727 A CN 115150727A
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CN
China
Prior art keywords
chip
mems
circuit board
microphone
asic chip
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CN202210692994.2A
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Chinese (zh)
Inventor
李小波
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Nanchang Huaqin Electronic Technology Co ltd
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Nanchang Huaqin Electronic Technology Co ltd
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Priority to CN202210692994.2A priority Critical patent/CN115150727A/en
Publication of CN115150727A publication Critical patent/CN115150727A/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The invention provides an MEMS microphone, a mobile terminal and an MEMS microphone manufacturing method. The MEMS acoustoelectric chip and the ASIC chip are arranged on the circuit board in a mounting mode in the manufacturing process of the MEMS microphone, the MEMS acoustoelectric chip and the ASIC chip do not need to be glued in the assembling process, glue curing time is saved, gold wires and equipment connected by the gold wires are omitted, and cost is saved.

Description

MEMS microphone, mobile terminal and MEMS microphone manufacturing method
Technical Field
The invention belongs to the technical field of microphones, and particularly relates to an MEMS (micro-electromechanical systems) microphone, a mobile terminal and an MEMS microphone manufacturing method.
Background
Microelectromechanical Systems (MEMS) microphones are microphones that are manufactured based on microelectromechanical technology. Compared with the polymeric material diaphragm of ECM, MEMS microphones have stable performance at different temperatures, sensitivity that is not affected by temperature, vibration, humidity and time, and are therefore favored by most microphones.
A conventional MEMS microphone product generally uses a Circuit board and a housing to form a cavity to form a package of the MEMS microphone, and a bonding pad may be disposed on an outer surface of the Circuit board for fixing the MEMS microphone and electrically connecting to an external Circuit, and an Application Specific Integrated Circuit (ASIC) chip is mounted inside the cavity.
Fig. 1 is a schematic structural diagram of a conventional MEMS microphone, please refer to fig. 1, in the prior art, an MEMS acoustic-electric chip 1' and an ASIC chip 2' are bonded to a circuit board 3' by glue, the MEMS acoustic-electric chip 1', the ASIC chip 2' and the circuit board 3' are connected by a gold wire 4' to achieve circuit conduction, during manufacturing of the MEMS microphone, after the MEMS acoustic-electric chip 1' and the ASIC chip 2' are bonded by glue, high temperature curing of the glue is required, a connection point between the gold wire 4' and the ASIC chip 2' needs to be covered and protected by the glue, and the manufacturing process is complicated and the manufacturing cost is high.
Disclosure of Invention
The embodiment of the invention aims to provide an MEMS microphone, a mobile terminal and an MEMS microphone manufacturing method, and aims to solve the technical problems that an MEMS microphone manufacturing process is complicated and manufacturing cost is high in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: the invention provides an MEMS microphone in a first aspect, which comprises an MEMS acoustoelectric chip, an ASIC chip, a circuit board and a shell;
the shell and the circuit board form a sealed cavity, the MEMS acousto-electric chip and the ASIC chip are positioned in the cavity, and the circuit board is provided with a through hole corresponding to the MEMS acousto-electric chip;
the MEMS acoustoelectric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, and the MEMS acoustoelectric chip is electrically connected with the ASIC chip.
In one embodiment, the MEMS acousto-electric chip and the ASIC chip are electrically connected by a wire.
In one embodiment, the conductive lines are located on an inner layer of the circuit board.
In an embodiment, a first bonding pad corresponding to the MEMS acoustic-electric chip is disposed on the circuit board, a second bonding pad corresponding to the ASIC chip is disposed on the circuit board, and the first bonding pad and the second bonding pad are both solder paste bonding pads.
A first aspect of the invention provides a mobile terminal comprising a MEMS microphone as described above.
In an embodiment, the mobile terminal is a mobile phone.
The invention provides a method for manufacturing an MEMS microphone, which is characterized by comprising the following steps:
providing a circuit board, manufacturing an MEMS sound-electricity chip bonding pad and an ASIC chip bonding pad on the circuit board, wherein the circuit board is provided with a through hole corresponding to the MEMS sound-electricity chip;
an MEMS sound and electricity chip is pasted on the MEMS sound and electricity chip bonding pad, an ASIC chip is pasted on the ASIC chip bonding pad, and the MEMS sound and electricity chip is electrically connected with the ASIC chip;
providing a microphone shell, combining the microphone shell and the circuit board to form a sealed cavity, wherein the MEMS sound-electricity chip and the ASIC chip are both positioned in the cavity.
In an embodiment, the MEMS sound-electricity chip is disposed on the MEMS sound-electricity chip bonding pad by a surface mount technology, and the ASIC chip is disposed on the ASIC chip bonding pad by a surface mount technology.
In one embodiment, the microphone housing is connected to the circuit board by surface mount technology, and the microphone housing is a metal housing.
The MEMS microphone provided by the invention comprises an MEMS acousto-electric chip, an ASIC chip, a circuit board and a shell; the casing and the circuit board form a sealed cavity, the MEMS acoustoelectric chip and the ASIC chip are located in the cavity, the circuit board is provided with a through hole corresponding to the MEMS acoustoelectric chip, the MEMS acoustoelectric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, the MEMS acoustoelectric chip is electrically connected with the ASIC chip, the MEMS acoustoelectric chip and the ASIC chip are arranged on the circuit board in a mounting mode in the manufacturing process of the MEMS microphone, the MEMS acoustoelectric chip and the ASIC chip do not need to be glued in the assembling process, the glue curing time is saved, gold wires and equipment connected with the gold wires are cancelled, and the cost is saved.
The mobile terminal provided by the invention comprises the MEMS microphone, the MEMS acoustic-electric chip and the ASIC chip are arranged on the circuit board in a mounting mode in the manufacturing process of the MEMS microphone, the MEMS acousto-electric chip and the ASIC chip do not need to be glued in the assembling process, the glue curing time is saved, gold wires and equipment connected by the gold wires are omitted, and the cost is saved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a conventional MEMS microphone;
fig. 2 is a schematic structural diagram of a MEMS microphone according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of a method for manufacturing a MEMS microphone according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In addition, in the present application, unless otherwise expressly specified or limited, the terms "connected," "secured," "mounted," and the like are to be construed broadly, such as to encompass both mechanical and electrical connections; the terms may be directly connected or indirectly connected through an intermediate medium, and may be used for communicating between two elements or for interacting between two elements, unless otherwise specifically defined, and the specific meaning of the terms in the present application may be understood by those skilled in the art according to specific situations.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone.
The MEMS microphone, the mobile terminal and the method for manufacturing the MEMS microphone according to the present invention will be described in detail with reference to specific embodiments.
The first embodiment is as follows:
fig. 2 is a schematic structural diagram of an MEMS microphone according to an embodiment of the present invention, and please refer to fig. 2, the embodiment provides an MEMS microphone, which includes an MEMS acoustic-electric chip 1, an ASIC chip 2, a circuit board 3 and a housing 4;
the shell 4 and the circuit board 3 form a sealed cavity 5, the MEMS acousto-electric chip 1 and the ASIC chip 2 are positioned in the cavity 5, and the circuit board 3 is provided with a through hole 31 corresponding to the MEMS acousto-electric chip 1;
the MEMS acousto-electric chip 1 is attached to the circuit board 3, the ASIC chip 2 is attached to the circuit board 3, and the MEMS acousto-electric chip 1 is electrically connected with the ASIC chip 2.
The MEMS microphone of the embodiment is a microphone manufactured based on micro-electromechanical technology, compared with a vibrating membrane made of a polymer material of ECM, the MEMS microphone has stable performance at different temperatures, and the sensitivity of the MEMS microphone is not influenced by temperature, vibration, humidity and time.
The MEMS acoustoelectric chip 1 of the embodiment is attached to the circuit board 3, and the ASIC chip 2 is attached to the circuit board 3. Illustratively, the MEMS acoustic-electric chip 1 and the ASIC chip 2 of the present embodiment are directly electrically connected to the Circuit Board by Surface Mount Technology (SMT), which is the most popular Technology and process in the electronic assembly industry, and is a Circuit connection Technology that mounts a leadless or short-lead Surface-Mounted component (SMC/SMD, hereinafter referred to as a chip component) on a Surface of a Printed Circuit Board (PCB) or other substrate, and performs soldering assembly by means of reflow soldering or dip soldering, and the present embodiment does not particularly limit the specific implementation process of the SMT.
The MEMS acousto-optic chip 1 and the ASIC chip 2 of the existing MEMS microphone are bonded on the circuit board through glue, the gold wires are respectively connected with the MEMS acousto-optic chip 1, the ASIC chip 2 and the circuit board 3 to realize the connection and conduction of the circuit, after the MEMS acousto-optic chip 1 and the ASIC chip 2 are bonded through the glue, the glue needs to be cured at high temperature, and the place where the gold wires are connected with the MEMS acousto-optic chip 1 and the ASIC chip 2 needs to be covered with the glue for protection. The MEMS acousto-electric chip 1 is attached to the circuit board 3, the ASIC chip 2 is attached to the circuit board 3, the MEMS acousto-electric chip 1 is electrically connected with the ASIC chip 2, the dispensing process and the application of assembling material gold wires are reduced, and the risk of functional failure, such as functional failure caused by poor manufacture in the gold wire connection process, is reduced.
The MEMS microphone of this embodiment is under the not circular telegram circumstances, the diaphragm on the MEMS acoustoelectric chip 1 is uncharged, after the pad end application voltage of MEMS acoustoelectric chip 1, the pump voltage module of ASIC chip 2 provides stable direct current bias voltage for MEMS acoustoelectric chip 1, make the diaphragm and the back pole of MEMS acoustoelectric chip 1 form the parallel plate condenser, when the sound pressure was used, the diaphragm was started to vibrate by the sound pressure effect, thereby make the parallel plate condenser produce little capacitance change, convert voltage signal output to ASIC chip 2, export the complete machine after ASIC chip 2 enlargies at last.
The MEMS microphone provided by the embodiment comprises an MEMS acousto-electric chip, an ASIC chip, a circuit board and a shell, wherein the shell and the circuit board form a sealed cavity, the MEMS acousto-electric chip and the ASIC chip are positioned in the cavity, a through hole corresponding to the MEMS acousto-electric chip is arranged on the circuit board, the MEMS acousto-electric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, the MEMS acousto-electric chip is electrically connected with the ASIC chip, the MEMS acousto-electric chip and the ASIC chip are arranged on the circuit board in a mounting mode in the manufacturing process of the MEMS microphone, the MEMS acousto-electric chip and the ASIC chip do not need to be glued in the assembling process, the glue curing time is saved, gold wires and equipment connected by the gold wires are cancelled, and the cost is saved.
Optionally, in this embodiment, the MEMS acoustic-electric chip 1 and the ASIC chip 2 are electrically connected through a wire.
Further, the lead is located on an inner layer of the circuit board 3. In this embodiment, the conductive wires may be disposed on an inner layer of the circuit board 3 to form a built-in conductive wire, and the ASIC chip 2 is connected to the MEMS acoustic-electric chip 1 through the built-in conductive wire disposed on the inner layer of the circuit board 3, preferably, the built-in conductive wire is disposed on the inner layer of the circuit board 3 when the circuit board 3 is manufactured, so as to save space on the circuit board 3 and reduce connecting wires on the circuit board 3.
The shell 4 is a metal shell, and the shell 4 is attached to the circuit board 3. The housing 4 of this embodiment may be directly stamped from a single piece of metal material. The shell 4 is attached to the circuit board 3, the metal shell 4 does not need to be glued in the assembling process, glue curing time is saved, and gold wires and gold wire connection equipment are omitted.
Preferably, a first bonding pad 11 corresponding to the MEMS acoustic-electric chip 1 is arranged on the circuit board 3, a second bonding pad 21 corresponding to the ASIC chip 2 is arranged on the circuit board 3, and the first bonding pad 11 and the second bonding pad 21 are both solder paste bonding pads. The present embodiment does not particularly limit the specific positions of the first pad 11 and the second pad 21. The tin paste is prepared by strictly producing high-purity low-oxidation spherical alloy solder powder and micro chemical additives such as soldering flux and the like, and has good continuous printing property and tin dropping property. The effect is consistent with that of printing after long-time printing, micro solder balls and collapse cannot be generated, the surface mounted device cannot deviate, and the solder paste has good welding performance. Can show proper wettability in different positions, and has small corrosion of residues after welding.
The MEMS microphone provided by the embodiment of the invention comprises an MEMS sound and electricity chip, an ASIC chip, a circuit board and a shell, wherein the shell and the circuit board form a sealed cavity, the MEMS sound and electricity chip and the ASIC chip are positioned in the cavity, a through hole corresponding to the MEMS sound and electricity chip is arranged on the circuit board, the MEMS sound and electricity chip is attached to the circuit board, the ASIC chip is attached to the circuit board, the MEMS sound and electricity chip is electrically connected with the ASIC chip, the MEMS sound and electricity chip and the ASIC chip are arranged on the circuit board in an attaching mode in the manufacturing process of the MEMS microphone, the MEMS sound and electricity chip and the ASIC chip do not need to be glued in the assembling process, the glue curing gold thread time is saved, gold thread and gold thread connection equipment are cancelled, and the cost is saved.
The second embodiment:
the embodiment provides a mobile terminal, which comprises the MEMS microphone described in the above embodiment. For example: the MEMS microphone comprises an MEMS acousto-electric chip, an ASIC chip, a circuit board and a shell;
the shell and the circuit board form a sealed cavity, the MEMS acousto-electric chip and the ASIC chip are positioned in the cavity, and the circuit board is provided with a through hole corresponding to the MEMS acousto-electric chip;
the MEMS acoustoelectric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, and the MEMS acoustoelectric chip is electrically connected with the ASIC chip.
The MEMS microphone of the mobile terminal comprises an MEMS acousto-electric chip, an ASIC chip, a circuit board and a shell, wherein the shell and the circuit board form a sealed cavity, the MEMS acousto-electric chip and the ASIC chip are located in the cavity, a through hole corresponding to the MEMS acousto-electric chip is formed in the circuit board, the MEMS acousto-electric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, the MEMS acousto-electric chip is electrically connected with the ASIC chip, the MEMS acousto-electric chip and the ASIC chip are arranged on the circuit board in a mounting mode in the manufacturing process of the MEMS microphone, the MEMS acousto-electric chip and the ASIC chip do not need to be glued in the assembling process, the glue curing time is saved, gold wire and gold wire connection equipment are cancelled, and the cost is saved.
Example three:
fig. 3 is a schematic flow chart of a method for manufacturing an MEMS microphone according to an embodiment of the present invention, and referring to fig. 3, the embodiment provides a method for manufacturing an MEMS microphone, where the method includes:
s101, providing a circuit board, manufacturing an MEMS (micro electro mechanical system) acoustoelectric chip bonding pad and an ASIC (application specific integrated circuit) chip bonding pad on the circuit board, wherein the circuit board is provided with a through hole corresponding to the MEMS acoustoelectric chip;
specifically, the MEMS acousto-optic chip pad and the ASIC chip pad of this embodiment are both tin paste pads, the main component of the tin paste pads is tin alloy, and the tin paste pads can play a role in conducting the MEMS acousto-optic chip, the ASIC chip and the PCB after sintering.
S102, mounting an MEMS (micro electro mechanical System) acousto-electric chip on a bonding pad of the MEMS acousto-electric chip, mounting an ASIC (application specific integrated circuit) chip on the bonding pad of the ASIC chip, and electrically connecting the MEMS acousto-electric chip and the ASIC chip;
specifically, in this embodiment, the MEMS acoustic-electric chip is mounted on the MEMS acoustic-electric chip bonding pad by using an SMT patch technology, and the ASIC chip is mounted on the ASIC chip bonding pad by using an SMT patch technology. Preferably, the MEMS sound-electricity chip of this embodiment is disposed on the MEMS sound-electricity chip bonding pad through a surface mount technology, and the ASIC chip is disposed on the ASIC chip bonding pad through a surface mount technology. By adopting the SMT paster technology, the production efficiency can be effectively improved, the cost is reduced, the quality is ensured, and raw materials, production energy, production equipment, labor cost, production time and the like are saved to a great extent.
S103, providing a microphone shell, and combining the microphone shell and the circuit board to form a sealed cavity, wherein the MEMS sound-electricity chip and the ASIC chip are both positioned in the cavity.
Specifically, the MEMS acoustic-electric chip and the ASIC chip of the present embodiment are disposed in a sealed cavity formed by the microphone housing and the circuit board. When the microphone is used, the MEMS sound-electricity chip receives sound signals from the through hole corresponding to the MEMS sound-electricity chip, and the MEMS sound-electricity chip transmits the received sound signals to the ASIC chip for processing.
Furthermore, the microphone shell is connected with the circuit board through a surface mounting technology, and the microphone shell is a metal shell. The microphone shell of the embodiment is connected with the circuit board through the surface mounting technology, so that the production efficiency is further improved, the cost is reduced, and the quality is ensured.
According to the manufacturing method of the MEMS microphone, the MEMS sound-electricity chip and the ASIC chip are arranged on the circuit board in a mounting mode, glue does not need to be applied to the MEMS sound-electricity chip and the ASIC chip in the assembling process, glue curing time is saved, the output of the MEMS microphone in unit time is improved, glue applying equipment and glue curing equipment are omitted, gold wires and gold wire connection equipment are omitted, and cost is saved.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A MEMS microphone, characterized by:
the MEMS acoustoelectric chip comprises an MEMS acoustoelectric chip, an ASIC chip, a circuit board and a shell;
the shell and the circuit board form a sealed cavity, the MEMS acousto-electric chip and the ASIC chip are positioned in the cavity, and the circuit board is provided with a through hole corresponding to the MEMS acousto-electric chip;
the MEMS acoustoelectric chip is attached to the circuit board, the ASIC chip is attached to the circuit board, and the MEMS acoustoelectric chip is electrically connected with the ASIC chip.
2. The MEMS microphone of claim 1, wherein: the MEMS acousto-electric chip and the ASIC chip are electrically connected through a lead.
3. The MEMS microphone of claim 2, wherein: the lead is located on the inner layer of the circuit board.
4. The MEMS microphone of claim 1, wherein: the shell is a metal shell and is attached to the circuit board.
5. The MEMS microphone of claim 1, wherein: the circuit board is provided with a first bonding pad corresponding to the MEMS acousto-electric chip, the circuit board is provided with a second bonding pad corresponding to the ASIC chip, and the first bonding pad and the second bonding pad are solder paste bonding pads.
6. A mobile terminal, characterized by: the mobile terminal comprising a MEMS microphone according to any of claims 1-5.
7. The mobile terminal of claim 6, wherein: the mobile terminal is a mobile phone.
8. A method for manufacturing a MEMS microphone is characterized by comprising the following steps:
providing a circuit board, manufacturing an MEMS sound-electricity chip bonding pad and an ASIC chip bonding pad on the circuit board, wherein the circuit board is provided with a through hole corresponding to the MEMS sound-electricity chip;
an MEMS sound and electricity chip is pasted on the MEMS sound and electricity chip bonding pad, an ASIC chip is pasted on the ASIC chip bonding pad, and the MEMS sound and electricity chip is electrically connected with the ASIC chip;
providing a microphone shell, combining the microphone shell and the circuit board to form a sealed cavity, wherein the MEMS sound-electricity chip and the ASIC chip are both positioned in the cavity.
9. The method of fabricating a MEMS microphone according to claim 8, wherein: the MEMS sound and electricity chip is arranged on the bonding pad of the MEMS sound and electricity chip through the surface mounting technology, and the ASIC chip is arranged on the bonding pad of the ASIC chip through the surface mounting technology.
10. The MEMS microphone fabrication method of claim 8 or 9, wherein: the microphone shell is connected with the circuit board through a surface mounting technology, and the microphone shell is a metal shell.
CN202210692994.2A 2022-06-17 2022-06-17 MEMS microphone, mobile terminal and MEMS microphone manufacturing method Pending CN115150727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210692994.2A CN115150727A (en) 2022-06-17 2022-06-17 MEMS microphone, mobile terminal and MEMS microphone manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210692994.2A CN115150727A (en) 2022-06-17 2022-06-17 MEMS microphone, mobile terminal and MEMS microphone manufacturing method

Publications (1)

Publication Number Publication Date
CN115150727A true CN115150727A (en) 2022-10-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210692994.2A Pending CN115150727A (en) 2022-06-17 2022-06-17 MEMS microphone, mobile terminal and MEMS microphone manufacturing method

Country Status (1)

Country Link
CN (1) CN115150727A (en)

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