CN115145126B

CN115145126B - Photoetching light splitting device, system, method, equipment and readable storage medium

Info

Publication number: CN115145126B
Application number: CN202211043201.0A
Authority: CN
Inventors: 严振中; 吴阳; 周勇; 胡夏君
Original assignee: Hezhi Technology Suzhou Co ltd
Current assignee: Hezhi Technology Suzhou Co ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2023-01-10
Anticipated expiration: 2042-08-29
Also published as: CN115145126A

Abstract

The invention relates to the technical field of photoetching light splitting equipment, in particular to a photoetching light splitting device, a system, a method, equipment and a readable storage medium, wherein the photoetching light splitting device comprises a light splitting component, a first reflecting component, a second reflecting component and at least two groups of light setting mechanisms; the light splitting component is used for enabling incident light beams to respectively emit to the first reflecting component and the second reflecting component along at least two different projection light paths; the light setting mechanism projects the incident light beams subjected to scaling treatment to an imaging area corresponding to the first reflection assembly and an imaging area corresponding to the second reflection assembly; the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths, and at least two groups of light setting mechanisms comprise at least one light setting mechanism with scaling factor; according to the invention, through light splitting of the light splitting component, incident light beams are respectively emitted to the first reflection component and the second reflection component along at least two projection light paths and are projected to the corresponding light setting mechanism, and a double mirror does not need to be changed back and forth in the whole process, so that the photoetching efficiency and precision are effectively improved.

Description

Photoetching light splitting device, system, method, equipment and readable storage medium

Technical Field

The present invention relates to the field of lithographic beam splitting device technology, and in particular, to a lithographic beam splitting device, a lithographic beam splitting system, a lithographic beam splitting method, a lithographic beam splitting device, and a readable storage medium.

Background

In the development process of the current integrated circuit, the lithography technology plays an irreplaceable role, and mainly utilizes a light source to carry out space selective exposure, so that a designed circuit layout is transferred to a silicon wafer to form the integrated circuit. In the photoetching process, the resolution and the alignment precision of a photoetching machine directly determine the integration level of an integrated circuit, and the integrated circuit is a key index for evaluating the quality of photoetching equipment.

The light splitting scheme of the existing lithography machine usually uses a rolling type DMD (spatial light modulator), and in the same light path, the round-trip exchange of the double mirrors is performed to complete the partitioned lithography processing, however, in the round-trip exchange process of the double mirrors, the precision is deviated to some extent, and the precision and the efficiency of the subsequent lithography are reduced.

Based on the shortcomings of the prior art, it is desirable to provide an improved splitting scheme to solve the above problems.

Disclosure of Invention

In order to solve the technical problems, the invention provides a photoetching light splitting device, a photoetching light splitting system, a photoetching light splitting method, photoetching light splitting equipment and a readable storage medium, which can effectively improve photoetching precision and efficiency.

The invention discloses a photoetching light splitting device which comprises a light splitting component, a first reflecting component, a second reflecting component and at least two groups of light setting mechanisms, wherein the light splitting component comprises a first reflecting component and a second reflecting component;

the light splitting component is used for receiving incident light beams and respectively transmitting the incident light beams to the first reflecting component and the second reflecting component along at least two different projection light paths;

the first reflection assembly is used for reflecting a received incident beam to the light setting mechanism along at least one preset light path, the light setting mechanism performs scaling processing on the incident beam and then projects the incident beam to an imaging area corresponding to the first reflection assembly, the second reflection assembly is used for reflecting the received incident beam to the light setting mechanism along at least one preset light path, the light setting mechanism performs zooming processing on the incident beam and then projects the incident beam to an imaging area corresponding to the second reflection assembly, and the imaging area corresponding to the first reflection assembly and the imaging area corresponding to the second reflection assembly are located at different positions of an area to be imaged;

the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths, and the at least two groups of light setting mechanisms comprise at least two scaling factors.

Further, the light splitting component comprises a first light splitting reflection surface and a second light splitting reflection surface;

the first light splitting reflection surface faces the incident light beam and the first reflection assembly and forms a first preset angle with the first reflection assembly; the second light splitting reflection surface faces the incident light beam and the second reflection assembly and forms a second preset angle with the second reflection assembly.

Further, the light setting mechanism comprises a first light setting mechanism and a second light setting mechanism;

the incident beam is emitted to the first light splitting reflection surface to form a first projection light path and is emitted to the first reflection assembly and the first light setting mechanism; and the incident beam is emitted to the second beam splitting reflecting surface to form a second projection light path and is emitted to the second reflecting assembly and the second light setting mechanism.

Further, the first reflecting assembly comprises a first reflecting member, a second reflecting member and a third reflecting member;

the incident light beam is emitted to the first reflecting piece through the first projection light path, sequentially passes through the second reflecting piece and the third reflecting piece to form a first preset light path, and is emitted to a first light setting mechanism corresponding to the first preset light path, and the first light setting mechanism performs scaling processing on the incident light beam and then projects the light beam to a first imaging area corresponding to the first preset light path.

Further, the reflecting surface of the first reflecting member is disposed toward the reflecting surface of the light splitting assembly and the reflecting surface of the second reflecting member, and the reflecting surface of the third reflecting member is disposed toward the reflecting surface of the second reflecting member and the first light setting mechanism.

Further, the second reflecting assembly comprises a fourth reflecting member, a fifth reflecting member and a sixth reflecting member;

the incident beam is emitted to the fourth reflecting part through the second projection light path, sequentially passes through the fifth reflecting part and the sixth reflecting part to form a second preset light path, and is emitted to a second light setting mechanism corresponding to the second preset light path, and the second light setting mechanism performs scaling processing on the incident beam and then projects the incident beam to a second imaging area corresponding to the second preset light path.

Furthermore, the light splitting component further comprises a first light splitting surface and a second light splitting surface which are arranged oppositely, the first light splitting surface is arranged towards the incident light beam, and the incident light beam is emitted through the second light splitting surface after being emitted to the first light splitting surface to form a third projection light path.

Further, the light splitting assembly comprises a first light splitting part and a second light splitting part;

the first light splitting element comprises the first light splitting reflection surface and the second light splitting surface, and the second light splitting element comprises the second light splitting reflection surface and the first light splitting surface;

the first light splitting reflecting surface and the first light splitting surface have the same direction;

the incident light beam is emitted to the first light splitting surface and then reflected out through the second light splitting surface to form a third projection light path.

Further, the light splitting assembly comprises a first light splitting part;

the first light splitting component comprises the first light splitting reflection surface, the second light splitting reflection surface, the first light splitting surface and the second light splitting surface;

the first light splitting reflection surface, the second light splitting reflection surface and the first light splitting surface are arranged towards different directions respectively;

and the incident light beams are transmitted and emitted through the first light splitting surface and the second light splitting surface to form a third projection light path.

Further, the first reflection assembly further comprises a seventh reflection element and an eighth reflection element, and a reflection surface of the seventh reflection element is arranged towards a reflection surface of the second light splitting surface and a reflection surface of the eighth reflection element;

the incident light beam projected by the third projection light path forms a third preset light path through the seventh reflector and the eighth reflector, and is emitted to a third light setting mechanism corresponding to the third preset light path, and the third light setting mechanism performs scaling processing on the incident light beam and then projects the incident light beam to a third imaging area corresponding to the third preset light path.

Furthermore, the light splitting assembly further comprises a third light splitting reflection surface and a fourth light splitting reflection surface which are oppositely arranged, the first light splitting surface and the second light splitting surface are oppositely arranged, and the third light splitting reflection surface and the first light splitting surface are arranged towards the incident light beam;

the incident beam is emitted to the first light splitting surface and then emitted to the second light splitting surface to form a third projection light path; and the incident light beam is emitted to the fourth partial reflecting surface after passing through the third partial reflecting surface to form a fourth projection light path.

Further, the light splitting assembly comprises a first light splitting piece and two second light splitting pieces; the two second light splitting parts are arranged on two sides of the first light splitting part;

the first light splitting part comprises the third light splitting reflection surface and the first light splitting surface; one of said second beam splitters includes said first beam splitting reflective surface and said fourth beam splitting reflective surface; the other second light splitting element comprises the second light splitting reflecting surface and the second light splitting surface;

the incident light beam is emitted to the first light splitting surface and then reflected out through the second light splitting surface to form a third projection light path;

and the incident light beam is emitted to the fourth light splitting reflection surface after passing through the third light splitting reflection surface to form a fourth projection light path.

Further, the light splitting assembly comprises a first light splitting piece and a second light splitting piece;

the first light splitting component comprises the first light splitting reflection surface, the first light splitting surface, the second light splitting surface and the third light splitting reflection surface;

the second light splitting component comprises the second light splitting reflection surface and the fourth light splitting reflection surface;

the first light splitting reflection surface, the second light splitting reflection surface, the first light splitting reflection surface and the third light splitting reflection surface are all arranged towards the incident light beam, the first light splitting reflection surface and the second light splitting reflection surface are oppositely arranged, and the third light splitting reflection surface and the fourth light splitting reflection surface are oppositely arranged;

the incident light beam is emitted to the first light splitting surface, and the first light splitting surface transmits the incident light beam to the second light splitting surface and transmits the incident light beam out through the second light splitting surface to form a third projection light path;

Further, the first reflecting assembly further comprises a ninth reflecting element and a tenth reflecting element, and a reflecting surface of the ninth reflecting element faces the reflecting surface of the second light splitting surface and the reflecting surface of the tenth reflecting element;

the incident light beam projected by the third projection light path forms a fourth preset light path through the ninth reflector and the tenth reflector, and is emitted to a fourth light setting mechanism corresponding to the fourth preset light path, and the fourth light setting mechanism performs scaling processing on the incident light beam and projects the light beam to a fourth imaging area corresponding to the fourth preset light path.

Further, the second reflection assembly further comprises an eleventh reflection element and a twelfth reflection element; the reflecting surface of the eleventh reflecting piece is arranged towards the reflecting surface of the fourth reflecting surface and the reflecting surface of the twelfth reflecting piece;

the eleventh reflector is used for receiving and reflecting the incident light beam emitted by the fourth projection light path to the twelfth reflector to form a fifth preset light path and emitting the incident light beam to a fifth light setting mechanism corresponding to the fifth preset light path, and the fifth light setting mechanism performs scaling processing on the incident light beam and then projects the incident light beam to a fifth imaging area corresponding to the fifth preset light path.

Further, the light setting mechanism comprises a mounting frame and a functional coating arranged on one side of the emergent light beam;

the functional coating is arranged on the mounting frame and used for eliminating crosstalk of light outside the mounting frame;

the mounting frame comprises a first connecting layer, a conducting layer and a second connecting layer which are sequentially connected from top to bottom;

the thickness of the second connecting layer is smaller than that of the first connecting layer, and the conducting layer is used for conducting heat dissipation on the second connecting layer.

Furthermore, the mounting frame is provided with at least two mounting holes, and the mounting holes are arranged on the mounting frame at intervals;

the light ray setting mechanism also comprises at least two times of lens mounting shells and one or more zoom lens;

the double-lens mounting shell and the mounting hole are correspondingly arranged, and the double-lens mounting shell can be arranged in the corresponding mounting hole;

when a plurality of lenses are arranged, the light setting mechanism further comprises a rotating piece; the first end of rotating member with the time mirror installation shell rotates to be connected, the second end of rotating member with a plurality of camera lenses are connected, so that the rotating member can drive a plurality of camera lenses are relative time mirror installation shell rotates.

A second aspect of the present invention provides a lithographic beam splitting system comprising a spatial light modulator, a controller and a lithographic beam splitting device as described above;

the controller is in communication connection with the spatial light modulator and is used for controlling the spatial light modulator to reflect an incident light beam corresponding to a target photoetching pattern to the photoetching light splitting device;

the photoetching light splitting device is used for receiving an incident beam emitted by the spatial light modulator and projecting the incident beam to a region to be imaged.

A third aspect of the present invention provides a lithography method applied to the lithography beam splitting system described above, the method including:

acquiring a target photoetching pattern, wherein the target photoetching pattern comprises at least two photoetching sub-patterns, and imaging areas corresponding to different photoetching sub-patterns are different;

determining photoetching distribution information and photoetching resolution corresponding to the at least two photoetching sub-patterns;

controlling a spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio so that an incident beam reflected by the spatial light modulator is emitted to a light splitting component, and the incident beam is respectively emitted to a first reflecting component and a second reflecting component along at least two different projection light paths through the light splitting component and then is respectively projected to a light setting mechanism;

and carrying out scaling treatment on incident beams emitted from the first reflection assembly and the second reflection assembly, and projecting the scaled incident beams to imaging areas corresponding to the first reflection assembly and the second reflection assembly respectively so as to carry out photoetching at different positions of an area to be imaged based on the at least two photoetching sub-patterns.

A fourth aspect of the invention provides a lithographic apparatus for carrying out the lithographic method as described above, the lithographic apparatus comprising:

the device comprises an acquisition module, a processing module and a control module, wherein the acquisition module is used for acquiring a target photoetching pattern, the target photoetching pattern comprises at least two photoetching sub-patterns, and imaging areas corresponding to different photoetching sub-patterns are different;

the determining module is used for determining photoetching distribution information and photoetching resolution corresponding to the at least two photoetching sub-patterns;

the light splitting module controls the spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio, so that incident light beams reflected by the spatial light modulator are emitted to the light splitting assembly, and are respectively emitted to the first reflecting assembly and the second reflecting assembly along at least two different projection light paths through the light splitting assembly and then are respectively projected to the light setting mechanism;

and the imaging module is used for carrying out scaling treatment on incident light beams emitted from the first reflecting assembly and the second reflecting assembly, and the incident light beams after scaling treatment are projected to imaging areas respectively corresponding to the first reflecting assembly and the second reflecting assembly so as to carry out photoetching on different positions of an area to be imaged on the basis of the at least two photoetching sub-patterns.

A fifth aspect of the invention provides a readable storage medium having stored thereon at least one instruction or at least one program which, when executed by a processor, implements a lithographic method as described above.

The embodiment of the invention has the following beneficial effects:

according to the invention, through the cooperation of the light splitting component, the first reflection component, the second reflection component and the light setting mechanism, an incident light beam can be respectively emitted to the first reflection component and the second reflection component along at least two projection light paths by light splitting of the light splitting component, so that the incident light beam is reflected to the light setting mechanism corresponding to the first reflection component along at least one preset light path and is finally projected to a corresponding imaging area, and the incident light beam is reflected to the light setting mechanism corresponding to the second reflection component along at least one preset light path and is finally projected to the corresponding imaging area.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiment or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art it is also possible to derive other drawings from them without inventive effort.

FIG. 1 is a partial block diagram of a lithographic beam splitting apparatus according to a first preferred embodiment of the present invention;

FIG. 2 is a block diagram of the optical lithography beam splitting apparatus shown in FIG. 1;

FIG. 3 is a schematic diagram of the lithographic beam splitting device of FIG. 1;

FIG. 4 is a partial block diagram of a second embodiment of a lithographic beam splitter;

FIG. 5 is a schematic diagram of the lithographic beam splitting device shown in FIG. 4;

FIG. 6 is a block diagram of a lithographic beam splitting apparatus according to a third preferred embodiment of the present invention;

FIG. 7 is a partial block diagram of the optical lithography apparatus shown in FIG. 6;

FIG. 8 is a schematic view of the lithographic beam splitting apparatus of FIG. 6;

FIG. 9 is a flow chart of a lithographic method according to the present invention;

FIG. 10 is a schematic view of a first photolithography process according to a seventh preferred embodiment of the present invention;

FIG. 11 is a schematic illustration of a second photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 12 is a schematic view of a third photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 13 is a schematic diagram of a fourth photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 14 is a schematic illustration of a fifth photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 15 is a schematic illustration of a sixth photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 16 is a schematic diagram of a seventh photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 17 is a schematic view of an eighth photolithography process according to the seventh preferred embodiment of the present invention;

FIG. 18 is a schematic illustration of a first photolithography process according to a second photolithography method according to an eighth preferred embodiment of the present invention;

FIG. 19 is a schematic illustration of a second photolithography process according to an eighth embodiment of the present invention;

FIG. 20 is a schematic view of a third photolithography process according to the eighth embodiment of the present invention;

FIG. 21 is a schematic view of a fourth photolithography process according to the eighth preferred embodiment of the present invention;

FIG. 22 is a block diagram of a third embodiment of a lithography beam splitter according to the present invention;

FIG. 23 is a block diagram of a photolithography splitting apparatus according to a fifth preferred embodiment of the present invention;

FIG. 24 is a cross-sectional view of a light setting mechanism consistent with the present invention.

Wherein the reference numbers in the figures correspond to:

1-a shell; 2-a light splitting component; 3-a first reflective component; 4-a second reflective component; 5-sub pattern A; 6-sub pattern B; 7-an imaging zone; 21-a first light splitting member; 22-a second beam splitter; 23-a first dichroic reflective surface; 24-a second dichroic reflective surface; 25-a first light splitting surface; 26-a third light reflecting surface; 27-a fourth light reflecting surface; 28-a second light splitting surface; 31-a first reflector; 32-a second reflector; 33-a third reflector; 34-a seventh reflector; 35-an eighth reflector; 36-a ninth reflector; 37-a tenth reflector; 41-a fourth reflector; 42-a fifth reflector; 43-a sixth reflector; 44-an eleventh reflector; 45-a twelfth reflector; 81-fold mirror mounting shell; 82-lens; 83-a rotating member; 84-a mounting frame; 85-functional coating.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Aiming at the defects of the prior art, the invention enables the incident beam to be respectively emitted to the first reflection assembly and the second reflection assembly along at least two projection light paths by arranging the light splitting assembly, the first reflection assembly and the second reflection assembly to be matched, further enables the incident beam to be reflected to the imaging area corresponding to the first reflection assembly along at least one preset light path, and enables the spatial light modulator to complete the sub-pattern processing of different distributions in the target photoetching pattern at one time without exchanging a multiplier mirror back and forth, thereby having high photoetching efficiency and photoetching precision, greatly reducing the production cost, improving the production efficiency and simultaneously meeting the production requirement.

Referring to fig. 1 to 8, an embodiment of the present invention provides a lithographic beam splitting apparatus, including a beam splitting assembly 2, a first reflection assembly 3, a second reflection assembly 4, and at least two sets of light setting mechanisms; the light splitting component 2 is used for receiving incident light beams and respectively transmitting the incident light beams to the first reflecting component 3 and the second reflecting component 4 along at least two different projection light paths; the first reflection assembly 3 is used for reflecting the received incident light beams to the light setting mechanism along at least one preset light path, the light setting mechanism performs scaling processing on the incident light beams and then projects the incident light beams to an imaging area corresponding to the first reflection assembly 3, the second reflection assembly 4 is used for reflecting the received incident light beams to the light setting mechanism along at least one preset light path, the light setting mechanism performs zooming processing on the incident light beams and then projects the incident light beams to an imaging area corresponding to the second reflection assembly 4, and the imaging area corresponding to the first reflection assembly 3 and the imaging area corresponding to the second reflection assembly 4 are located in different positions of an area to be imaged; the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths, and at least two groups of light setting mechanisms comprise at least two scaling factors.

Specifically, the light splitting assembly 2 may include at least one light splitting member, and the light splitting member may include at least one of a right-angle reflecting prism and a plane mirror. The incident light beams can be reflected or transmitted to different reflecting surfaces in the first reflecting assembly 3 or the second reflecting assembly 4 through different splitting surfaces on the splitting component, namely the reflecting surfaces to which different projection light paths are projected are different, so that the incident light beams are further reflected to different light setting mechanisms through different preset light paths and then projected to different positions in a region to be imaged. In some cases, the first reflecting member 3 and the second reflecting member 4 may be symmetrically disposed on both sides of the light splitting member 2.

Based on the scheme, the light splitting component 2, the first reflection component 3, the second reflection component 4 and the light setting mechanism are matched, so that an incident light beam can be respectively emitted to the first reflection component 3 and the second reflection component 4 along at least two projection light paths after being split by the light splitting component 2, the incident light beam is reflected to the light setting mechanism corresponding to the first reflection component 3 along at least one preset light path and then is projected to the imaging area corresponding to the incident light beam, the incident light beam is reflected to the light setting mechanism corresponding to the second reflection component 4 along at least one preset light path and then is projected to the imaging area corresponding to the incident light beam, and the sub-pattern processing of different photoetching resolutions or different photoetching distributions in a target photoetching pattern can be completed at one time without changing a double mirror in the whole process, so that the photoetching efficiency and the photoetching precision are effectively improved, the production cost is remarkably reduced, the production efficiency is improved, and the production demand is met.

Specifically, each light setting mechanism may include at least one magnification power mirror, and the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths.

Preferably, the at least two sets of light setting mechanisms include at least two scaling factors, and in one embodiment, the scaling factors of the light setting mechanisms on different preset optical paths are different from each other.

Therefore, the light setting mechanisms with different scaling factors are arranged on different preset light paths, sub-pattern processing with different photoetching resolutions is realized on the different preset light paths, and further, photoetching processing of different sub-patterns with different resolutions in different imaging areas can be realized on the basis of the different sub-patterns with different resolutions under the condition that a reflection assembly and the light setting mechanism are not exchanged, so that the flexibility and the efficiency of photoetching are improved.

It can be understood that the light spot of the light beam emitted by the light ray setting mechanism with high zoom ratio is small, and the light spot of the light beam emitted by the light ray setting mechanism with low zoom ratio is small, so that the light ray setting mechanism with high zoom ratio can realize sub-graph photoetching with high resolution ratio, and further realize high-precision photoetching; and the corresponding photoetching area in unit time of the light setting mechanism with low zoom ratio is larger than that of the light setting mechanism with high zoom ratio, so that the light setting mechanism with low zoom ratio can realize high-speed photoetching. In this way, the sub-pattern corresponding to the light setting mechanism with high magnification can meet the requirement of high-precision lithography, and the sub-pattern corresponding to the light setting mechanism with low magnification can meet the requirement of high-speed lithography, so that high-precision lithography under high magnification and high-speed lithography under low magnification can be simultaneously realized, namely different lithography requirements can be simultaneously met.

In other possible embodiments, the lithography splitting apparatus may further configure a doubler in the light setting mechanism in advance according to the resolution information and the distribution information of the sub-patterns in the target lithography pattern, for example, when the target lithography pattern includes sub-patterns with different distributions, configure the light setting mechanism according to a preset light path; the photoetching light splitting device can also be provided with a light setting mechanism according to a preset light path when the target photoetching pattern contains sub-patterns with different resolutions, wherein the light setting mechanism comprises a pair of lenses which are in one-to-one correspondence with the resolutions, so that the photoetching light splitting device can be adapted to the target photoetching patterns with different sub-patterns, the adaptation degree of the photoetching light splitting device is improved to a certain extent, meanwhile, the photoetching processing of the sub-patterns with different resolutions is realized, the double lenses do not need to be switched back and forth, and the photoetching precision and the efficiency are improved.

In some possible embodiments, the scaling factor of the light setting mechanism is affected by the resolution of the sub-pattern, and it can be understood that the scaling factor type of the light setting mechanism corresponds to the resolution type of the sub-pattern one to one, in other words, when there are sub-patterns of two resolutions, there are two scaling factors for the light setting mechanism, and so on.

Based on above-mentioned some or all embodiments, in some possible embodiments, the lithography beam splitting device further includes a moving component, the moving component is connected with the transmission of the beam splitting component 2, and is used for driving the beam splitting component 2 to move along a preset path, and the beam splitting component 2 can be adjusted along the preset path under the driving of the beam splitting component, so as to be precisely matched with the spatial light modulator, so as to ensure the precise imaging of the incident beam in the region to be imaged, avoid the imaging error, and also change the size of the projection region of the incident beam on the beam splitting surface of the beam splitting component 2.

Specifically, the moving assembly can drive the light splitting assembly 2 to adjust the position relationship between the light splitting assembly 2 and the first reflecting assembly 3 and the second reflecting assembly 4 along a preset path, so that the light path between the incident light beam reflected by the light splitting assembly 2 and the first reflecting assembly 3 and the second reflecting assembly 4 is changed, and the light splitting assembly 2 can be matched with the position of the spatial light modulator to realize accurate imaging of the incident light beam in the region to be imaged.

It should be noted that: in this embodiment, the specific structure of the moving component is not limited, as long as it is ensured that the moving component can drive the light splitting component 2 to move along the preset path, and the preset path can be set based on the actual requirements of light beam focusing and alignment of the to-be-imaged area.

In some possible embodiments, the lithographic beam splitting device further comprises a housing 1; the shell 1 is provided with a light inlet and a plurality of light outlets, the light inlet is arranged opposite to the light splitting assembly 2 and configured to project incident light beams to the light splitting assembly 2 through the light inlet; the light outlet hole and the light inlet hole are arranged oppositely, and the incident light beam split by the light splitting component 2 is projected to the light setting mechanism through the light outlet hole.

Further, in order to ensure that an incident light beam projected into the housing 1 can be imaged in a corresponding imaging area through a corresponding light exit hole, the housing 1 is provided with a plurality of light exit holes, in this embodiment, the number and the positions of the light exit holes are not limited, as long as it is ensured that the incident light beam can be imaged in the corresponding imaging area through the corresponding light exit hole.

Specifically, a first direction is defined as a height direction of the housing 1, a second direction is defined as a width direction of the housing 1, and the first reflection assembly 3 and the second reflection assembly 4 are arranged along the width direction of the housing 1. In addition, the moving component can drive the light splitting component 2 to move along the first direction and/or the second direction.

Specifically, first reflection subassembly 3, second reflection subassembly 4 and removal subassembly are all fixed on casing 1, guarantee first reflection subassembly 3 and second reflection subassembly 4 use precision, avoid first reflection subassembly 3 and second reflection subassembly 4 to take place to shift when using, and imaging error appears.

In the present embodiment, the structure of the housing 1 is not limited as long as the housing 1 can be fixedly connected with the first reflecting assembly 3, the second reflecting assembly 4 and the moving assembly.

Further, the photoetching splitting device also comprises a base, wherein the base is detachably connected or integrally connected with the shell 1 and used for lifting the shell 1 so as to be convenient for photoetching operation.

In some possible embodiments, as shown in fig. 24, the light setting mechanism includes a mounting frame 84 and a functional coating 85 disposed on the side of the outgoing beam; a functional coating 85 is disposed on the mounting frame 84, and the functional coating 85 is used for eliminating crosstalk of light outside the mounting frame 84; the mounting frame 84 includes a first connection layer, a conductive layer, and a second connection layer connected in sequence from top to bottom; the thickness of the second connecting layer is smaller than that of the first connecting layer, and the conducting layer is used for conducting heat dissipation on the second connecting layer.

Specifically, the conductive layer is disposed proximate to a lower surface of mounting frame 84; the functional coating 85 is disposed on the lower surface of the second connection layer, the functional coating 85 absorbs external stray light to raise the temperature of the second connection layer, and the conductive layer is used for dissipating heat from the second connection layer to ensure the stability of the mounting frame 84, thereby further improving the photolithography precision.

Specifically, the conducting layer is made of a material with good heat conductivity, and the conducting layer absorbs heat and then conducts the heat to the outside.

Further, the height of the two ends of the conductive layer is higher than that of the middle part, so that the better heat dissipation effect can be obtained.

In some possible embodiments, the mounting frame 84 is provided with at least two mounting holes, and the mounting holes are spaced apart from each other on the mounting frame 84;

the light ray setting mechanism further comprises at least two times of mirror mounting shells 81 and one or more zoom lens 82; the double-lens mounting shell 81 and the mounting hole are correspondingly arranged, and the double-lens mounting shell 81 can be arranged in the corresponding mounting hole; when the number of the lenses 82 is multiple, the light setting mechanism further comprises a rotating member 83; the first end of the rotating member 83 is rotatably connected to the double mirror mounting case 81, and the second end of the rotating member 83 is connected to the plurality of lenses 82, so that the rotating member 83 can drive the plurality of lenses 82 to rotate relative to the double mirror mounting case 81.

Specifically, when the light setting mechanism includes a plurality of lenses 82, each light setting mechanism includes at least two zoom magnifications; meanwhile, after one photoetching operation is finished, the next photoetching operation can be carried out only by switching the lens 82 through the rotating piece 83 without return operation, so that the operation precision is ensured, the photoetching precision is further ensured, and the photoetching efficiency is improved.

In some possible embodiments, the magnification of the lens 82 under each ray setting mechanism is within a respective preset magnification range. Such as: the first light setting mechanism is in a range of 1x to 5x (lower multiplying power), and the second light setting mechanism is in a range of 10x to 50x (higher multiplying power).

Specifically, the number of lenses 82 under different light setting mechanisms may be the same or different.

Specifically, the rotary member 83 may be driven and controlled manually or by connecting a driving member such as an external piezoelectric motor.

Specifically, the functional coating 85 is disposed on the lower surface of the mounting frame 84, and absorbs external interference light to prevent the mounting frame 84 from reflecting external light to cause crosstalk to light projected from the lens 82.

Specifically, the functional coating 85 covers the peripheral area of the light setting mechanism to better absorb external interference light, thereby avoiding crosstalk to the light projected by the lens 82.

It should be noted that: the functional coating 85 absorbs external light to raise the temperature of the mounting frame 84, and needs heat dissipation to prevent the mounting frame 84 from being deformed due to heating, which causes deviation of projection light and affects the lithography precision.

The second aspect of the invention provides a photoetching light splitting system, which comprises a spatial light modulator, a controller and the photoetching light splitting device; the controller is in communication connection with the spatial light modulator and is used for controlling the spatial light modulator to reflect an incident beam corresponding to a target photoetching pattern to the photoetching light splitting device; the photoetching light splitting device is used for receiving an incident beam emitted by the spatial light modulator and projecting the incident beam to a region to be imaged.

It should be noted that: the photoetching light splitting system is also suitable for photoetching of patterns with large sizes, and by arranging the photoetching light splitting device, the problem that the spatial light modulator can only scan for photoetching for fixing the width once due to the self width limitation is solved, repeated operation for many times is not needed, one-step forming is realized, the efficiency is high, a plurality of spatial light modulators are not needed to be arranged for realizing photoetching of large-size patterns, and the cost is low.

A third aspect of the present invention provides a lithography method, which is applied to the lithography beam splitting system as above, the method including:

s101: acquiring a target photoetching pattern, wherein the target photoetching pattern comprises at least two photoetching sub-patterns, and imaging areas corresponding to different photoetching sub-patterns are different;

s102: determining photoetching distribution information and photoetching resolution corresponding to at least two photoetching sub-patterns;

s103: controlling the spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio so that an incident beam reflected by the spatial light modulator is emitted to the light splitting assembly 2, and is respectively emitted to the first reflection assembly 3 and the second reflection assembly 4 along at least two different projection light paths through the light splitting assembly 2 and then is respectively projected to the light setting mechanism;

s104: and carrying out scaling treatment on incident light beams emitted from the first reflection assembly 3 and the second reflection assembly 4, and projecting the incident light beams subjected to scaling treatment to imaging areas corresponding to the first reflection assembly 3 and the second reflection assembly 4 respectively so as to carry out photoetching at different positions of an area to be imaged based on at least two photoetching sub-patterns.

It should be noted that: according to the photoetching method provided by the embodiment of the invention, the sub-patterns with different resolutions or different distribution information in the target photoetching pattern can be processed at one time without changing the double-lens to and fro, so that the precision error caused by changing the double-lens to and fro is avoided, and the photoetching efficiency and precision are effectively improved.

In this embodiment, determining the lithography distribution information and the lithography resolution corresponding to the at least two lithography sub-patterns comprises the steps of:

s1021: carrying out resolution identification on the target photoetching pattern to obtain photoetching resolutions corresponding to different areas in the target photoetching pattern;

s1022: sub-pattern division with the same photoetching resolution is carried out on the target photoetching pattern according to the photoetching resolution to obtain pattern division information of the sub-pattern; wherein the pattern division information includes position information and number of sub-patterns;

s1023: according to the number of the target photoetching patterns and the sub-patterns, carrying out position distribution identification on the positions of the sub-patterns to obtain photoetching distribution information of the target photoetching patterns; the lithography distribution information is used to represent the lithography order and the arrangement mode of each sub-pattern in the target lithography pattern, and the arrangement mode may include, but is not limited to, left-right distribution, top-bottom distribution, and the like.

A fourth aspect of the invention provides a lithographic apparatus for implementing a lithographic method as above, the lithographic apparatus comprising:

the system comprises an acquisition module, a processing module and a control module, wherein the acquisition module is used for acquiring a target photoetching pattern, the target photoetching pattern comprises at least two photoetching sub-patterns, and imaging areas corresponding to different photoetching sub-patterns are different;

the determining module is used for determining photoetching distribution information and photoetching resolution corresponding to at least two photoetching sub-patterns;

the light splitting module controls the spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio so that incident light beams reflected by the spatial light modulator are emitted to the light splitting component 2, and are respectively emitted to the first reflecting component 3 and the second reflecting component 4 along at least two different projection light paths through the light splitting component 2 and then are respectively projected to the light setting mechanism;

and the imaging module is used for carrying out scaling treatment on incident beams emitted from the first reflection assembly 3 and the second reflection assembly 4, and the incident beams after scaling treatment are projected to imaging areas corresponding to the first reflection assembly 3 and the second reflection assembly 4 respectively so as to carry out photoetching at different positions of an area to be imaged based on at least two photoetching sub-patterns.

A fifth aspect of the invention provides a readable storage medium having stored thereon at least one instruction or at least one program, which when executed by a processor, implements a lithographic method as above.

Optionally, in this embodiment, the storage medium may be located in at least one network server of a plurality of network servers of a computer network. Optionally, in this embodiment, the storage medium may include, but is not limited to: various media capable of storing program codes, such as a usb disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic disk, or an optical disk.

Example 1

The embodiment provides a lithography beam splitting apparatus, which is shown in fig. 1 to 3 and comprises a beam splitting assembly 2, a first reflecting assembly 3, a second reflecting assembly 4 and at least two groups of light setting mechanisms; the light splitting component 2 is used for receiving incident light beams and respectively emitting the incident light beams to the first reflecting component 3 and the second reflecting component 4 along at least two different projection light paths; the first reflection assembly 3 is used for reflecting the received incident light beams to the light setting mechanism along at least one preset light path, the light setting mechanism performs scaling processing on the incident light beams and then projects the incident light beams to an imaging area corresponding to the first reflection assembly 3, the second reflection assembly 4 is used for reflecting the received incident light beams to the light setting mechanism along at least one preset light path, the light setting mechanism performs zooming processing on the incident light beams and then projects the incident light beams to an imaging area corresponding to the second reflection assembly 4, and the imaging area corresponding to the first reflection assembly 3 and the imaging area corresponding to the second reflection assembly 4 are located in different positions of an area to be imaged; the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths, and at least two groups of light setting mechanisms comprise at least two scaling factors.

In some possible embodiments, the light splitting assembly 2 comprises a first light splitting reflection surface 23 and a second light splitting reflection surface 24; the first light splitting reflection surface 23 is arranged towards the incident light beam and the first reflection assembly 3, and forms a first preset angle with the first reflection assembly 3; the second sub-reflecting surface 24 faces the incident light beam and the second reflecting assembly 4, and forms a second preset angle with the second reflecting assembly 4; it is understood that the first preset angle and the second preset angle may be set based on the structure of the light splitting assembly 2, the structure of the reflection assembly, and the actual requirement of the preset light path.

Specifically, the first light splitting reflection surface 23 and the second light splitting reflection surface 24 are both arranged towards the light inlet hole of the shell 1, and the first light splitting reflection surface 23 and the second light splitting reflection surface 24 are both arranged perpendicular to the bottom surface of the shell 1; the light ray setting mechanism comprises a first light ray setting mechanism and a second light ray setting mechanism; the light splitting component 2 is used for receiving incident light beams and respectively emitting the incident light beams to the first reflecting component 3 and the second reflecting component 4 along two different preset light paths; the first reflection assembly 3 is configured to reflect the received incident light beam to a first light setting mechanism corresponding thereto along a preset light path, and further project the incident light beam to a first imaging area corresponding to the first light setting mechanism. The second reflection assembly 4 is configured to reflect the received incident light beam to a second light setting mechanism corresponding thereto along another preset light path, and further project the incident light beam to a second imaging area corresponding to the second light setting mechanism.

In some possible embodiments, the light splitting assembly 2 comprises a first light splitting element 21, the first light splitting element 21 comprising a first light splitting reflecting surface 23 and a second light splitting reflecting surface 24.

In other possible embodiments, the light splitting assembly 2 comprises two first light splitting members 21, one first light splitting member 21 comprising a first light splitting reflecting surface 23 and the other first light splitting member 21 comprising a second light splitting reflecting surface 24.

In some possible embodiments, the incident light beam is emitted to the first light splitting reflection surface 23 to form a first projection light path, and is emitted to the first reflection assembly 3 and the first light setting mechanism; the incident beam forms a second projection light path after being emitted to the second beam splitting reflecting surface 24 and is emitted to the second reflecting component 4 and the second light setting mechanism; the first reflection assembly 3 is used for reflecting the received incident light beam to the corresponding first light setting mechanism along a first preset light path, and then projecting the incident light beam onto the corresponding first imaging area, and the second reflection assembly 4 has the same function as the first reflection assembly 3.

Specifically, the first projection light path is: the incident beam is emitted to the first reflecting assembly 3 along the first light splitting reflecting surface 23; the second projection light path is: the incident beam is directed along the second dichroic reflective surface 24 towards the second reflective component 4.

In one embodiment, the scaling factors of the first light setting mechanism and the second light setting mechanism are different, and the photolithography resolutions of the corresponding sub-patterns on the corresponding preset light path are also different.

In some possible embodiments, the imaging zone comprises a first imaging zone corresponding to the first reflective assembly 3, the first reflective assembly 3 comprising a first reflective element 31, a second reflective element 32 and a third reflective element 33; the incident beam is emitted to the first reflecting part 31 through the first projection light path, and sequentially forms a first preset light path through the second reflecting part 32 and the third reflecting part 33, and is emitted to a first light setting mechanism corresponding to the first preset light path, and the first light setting mechanism performs scaling processing on the incident beam and then projects the incident beam to a first imaging area corresponding to the first preset light path.

Specifically, the first reflecting member 31 includes at least one first reflecting surface, the second reflecting member 32 includes at least one second reflecting surface, and the third reflecting member 33 includes at least one third reflecting surface; the first reflecting surface is arranged towards the first light splitting reflecting surface 23 and the second reflecting surface, and is used for receiving the incident light beam reflected by the first light splitting reflecting surface 23 and reflecting the incident light beam to the second reflecting surface; the second reflecting surface faces the first reflecting surface and the third reflecting surface and is used for receiving the incident light beam reflected by the first reflecting surface and reflecting the incident light beam to the third reflecting surface; the third reflecting surface is further arranged towards the first light setting mechanism and used for receiving incident light beams reflected by the second reflecting surface, reflecting the incident light beams to the first light setting mechanism corresponding to the third reflecting surface, and further projecting the incident light beams to the first imaging area corresponding to the first reflecting assembly 3, so that the incident light beams can be projected to the first light setting mechanism under multiple reflections of all assemblies in the first reflecting assembly 3.

In some possible embodiments, the imaging area comprises a second imaging area corresponding to the second reflecting assembly 4, the second reflecting assembly 4 comprising a fourth reflecting member 41, a fifth reflecting member 42 and a sixth reflecting member 43; the incident beam is emitted to the fourth reflecting part 41 through the second projection light path, and sequentially forms a second preset light path through the fifth reflecting part 42 and the sixth reflecting part 43, and is emitted to a second light setting mechanism corresponding to the second preset light path, and the second light setting mechanism performs scaling processing on the incident beam and then projects the incident beam to a second imaging area corresponding to the second preset light path.

Specifically, the fourth reflecting member 41 includes at least a seventh reflecting surface, the fifth reflecting member 42 includes at least an eighth reflecting surface, and the sixth reflecting member 43 includes at least a ninth reflecting surface; the seventh reflecting surface is arranged facing the second light splitting reflecting surface 24 and the eighth reflecting surface, and the seventh reflecting surface is used for receiving the incident light beam reflected by the second light splitting reflecting surface 24 and reflecting the incident light beam to the eighth reflecting surface; the eighth reflecting surface is arranged towards the seventh reflecting surface and the ninth reflecting surface, and the ninth reflecting surface is also arranged towards the second light setting mechanism and is used for receiving incident light beams reflected by the eighth reflecting surface, reflecting the incident light beams to the second light setting mechanism corresponding to the incident light beams, and transmitting the incident light beams to the second imaging area corresponding to the second reflecting assembly 4.

Specifically, the first predetermined optical path of the first reflection assembly 3 is for the incident light beam to be projected to the first imaging area along the first reflection member 31, the second reflection member 32, the third reflection member 33 and the first light setting mechanism. The projection principle of the second predetermined light path of the second reflecting component 4 is the same as that of the first predetermined light path of the first reflecting component 3.

Specifically, as shown by the dotted line in fig. 1, the overall optical path through the first reflective component 3 for imaging is: the incident light beam is reflected to the first reflecting surface of the first reflecting member 31, the second reflecting surface of the second reflecting member 32, the third reflecting surface of the third reflecting member 33 and the first light setting mechanism along the first light splitting reflecting surface 23 in sequence and then is projected to the first imaging area; the whole optical path imaged by the second reflecting component 4 is as follows: the incident light beam is reflected to the seventh reflecting surface of the fourth reflecting member 41, the eighth reflecting surface of the fifth reflecting member 42, the ninth reflecting surface of the sixth reflecting member 43, and the second light setting mechanism along the second beam splitting reflecting surface 24 in sequence, and then is projected to the second imaging area.

Specifically, the included angle between the first beam splitting reflection surface 23 and the incident beam ranges from 0 to 180 °, and the included angle between the second beam splitting reflection surface 24 and the incident beam ranges from 0 to 180 °.

Furthermore, the reflector is a right-angle prism, and it can be understood that the right-angle positions of the first reflector 31 to the sixth reflector 43 are all connected to the housing 1, so as to facilitate the installation and fixation of the reflectors and ensure the installation strength of the whole photolithography beam splitting device.

Optionally, the first reflection assembly 3 and the second reflection assembly 4 have the same structure or different structures, so as to ensure that the beam splitting purpose can be achieved; when the first reflection assembly 3 and the second reflection assembly 4 are asymmetrically arranged on two sides of the light splitting assembly 2, the whole size can be optimized to the maximum extent, the space occupation of the photoetching light splitting device is reduced, and the production cost is reduced; when the first reflection assembly 3 and the second reflection assembly 4 are identical in structure and symmetrically arranged on two sides of the light splitting assembly 2, the installation difficulty and parameter adjusting difficulty of the device are reduced, the processing and installation are facilitated, and meanwhile the overall attractiveness of the photoetching light splitting device is improved.

In one embodiment, referring to fig. 1 to 3, the light splitting element 2 is a right-angle reflecting prism, such as a triangular prism. The first reflector 31 to the sixth reflector 43 are also right-angle reflecting prisms, and are respectively provided with a reflecting surface.

Example 2

Referring to fig. 4 to 5, the lithography beam splitter of the present embodiment is different from the lithography beam splitter of embodiment 1 in that:

in this embodiment, the light splitting component 2 further includes a first light splitting surface 25 and a second light splitting surface 28, which are oppositely disposed, the first light splitting surface 25 is disposed toward the incident light beam, and the incident light beam is emitted through the second light splitting surface 28 after being emitted toward the first light splitting surface 25, so as to form a third projection light path.

In some possible embodiments, the light-splitting assembly 2 comprises a first light-splitting element 21; the first beam splitter 21 includes a first beam splitting reflection surface 23, a second beam splitting reflection surface 24, a first beam splitting surface 25, and a second beam splitting surface 28; the first light splitting reflection surface 23, the second light splitting reflection surface 24 and the first light splitting surface 25 are respectively arranged towards different directions; the incident beam is transmitted through the first beam splitter 25 and the second beam splitter 28 to form a third projection beam path.

In some possible embodiments, the system further comprises a third light setting mechanism; the imaging area comprises a third imaging area corresponding to the first reflecting assembly 3, the first reflecting assembly 3 further comprises a seventh reflecting member 34 and an eighth reflecting member 35, and the reflecting surface of the seventh reflecting member 34 faces the reflecting surface of the second light splitting surface 28 and the reflecting surface of the eighth reflecting member 35; the incident light beam projected by the third projection light path forms a third preset light path through the seventh reflector 34 and the eighth reflector 35, and is emitted to a third light setting mechanism corresponding to the third preset light path, and the third light setting mechanism performs scaling processing on the incident light beam and projects the light beam to a third imaging area corresponding to the third preset light path.

Specifically, the light splitting assembly 2 is configured to receive an incident light beam and transmit the incident light beam to the first reflecting assembly 3 and the second reflecting assembly 4 along three projection light paths, respectively; the first reflection assembly 3 is used for reflecting the received incident light beams to the light setting mechanism corresponding to the first reflection assembly 3 along two preset light paths, and finally projecting the incident light beams to the respective corresponding imaging areas; the second reflection assembly 4 is configured to reflect the received incident light beam to a second light setting mechanism corresponding to the second reflection assembly 4 along a preset light path, and finally project the incident light beam to a corresponding second imaging area. The first light splitting reflection surface 23, the second light splitting reflection surface 24 and the first light splitting surface 25 are all arranged towards the light inlet of the housing 1, the first light splitting reflection surface 23 and the second light splitting reflection surface 24 are both arranged perpendicular to the bottom surface of the housing 1, and the first light splitting surface 25 and the second light splitting surface 28 are arranged in parallel.

Specifically, the seventh reflecting member 34 includes at least one fourth reflecting surface, and the eighth reflecting member 35 includes at least one fifth reflecting surface; the fourth reflecting surface is arranged opposite to the fifth reflecting surface, receives and reflects the incident beam transmitted by the second light splitting surface 28 to the fifth reflecting surface, and the incident beam is reflected by the fifth reflecting surface, then emitted to the third light setting mechanism, and finally projected to the third imaging area.

Specifically, the second light-dividing surface 28 is disposed toward the fourth reflecting surface of the seventh reflecting member 34, the fourth reflecting surface is disposed toward the second light-dividing surface 28 and the fifth reflecting surface, and the fifth reflecting surface is disposed toward the fourth reflecting surface and the third light adjusting mechanism.

Specifically, the incident light beams may be directed to the first light splitting reflecting surface 23, the first light splitting surface 25 and the second light splitting reflecting surface 24 respectively or simultaneously, and accordingly, the light splitting assembly 2 is configured to receive the incident light beams and direct the incident light beams to the first reflecting assembly 3 and the second reflecting assembly 4 along three projection light paths respectively. The first reflection assembly 3 receives incident light beams of the first projection light path and the third projection light path through different reflection surfaces, and reflects the incident light beams to a first imaging area corresponding to the first light setting mechanism and a third imaging area corresponding to the third light setting mechanism along the first preset light path and the third preset light path respectively.

Specifically, the third projection optical path is: the incident light beam is transmitted along the first and second light splitting surfaces 25 and 28 towards the first reflective component 3.

Specifically, the third preset optical path is: the incident light beam is directed to the third imaging zone along the seventh reflector 34, the eighth reflector 35, and the third light setting mechanism.

In an embodiment, the first light setting mechanism, the second light setting mechanism, and the third light setting mechanism include at least two zoom ratios, for example, the zoom ratios of the first preset optical path and the second preset optical path may be the same, and the zoom ratio of the third preset optical path is different from the zoom ratios of the first preset optical path and the second preset optical path, and it can be understood that the zoom ratios of different preset optical paths may be set based on actual requirements, and are not limited to the above examples.

Specifically, as shown by the dashed line in fig. 4, the overall optical path for imaging through the first reflecting assembly 3 is: the incident beam is reflected to the first reflecting surface, the second reflecting surface, the third reflecting surface, the first light setting mechanism and the first imaging area along the first light splitting reflecting surface 23 in sequence; the incident light beam is further reflected to a fourth reflecting surface, a fifth reflecting surface, a third light setting mechanism and a third imaging area along the first light splitting surface 25 and the second light splitting surface 28 in sequence; the overall light path through the second reflecting assembly 4 is: the incident light beam is reflected to the seventh reflecting surface, the eighth reflecting surface, the ninth reflecting surface, the second light setting mechanism and the second imaging area along the second beam splitting reflecting surface 24 in sequence.

Specifically, the included angle between the first light splitting reflection surface 23 and the incident light beam ranges from 0 to 180 °, the included angle between the second light splitting reflection surface 24 and the incident light beam ranges from 0 to 180 °, and the included angle between the first light splitting surface 25 and the incident light beam ranges from 0 to 180 °.

Furthermore, the first reflector 31 to the eighth reflector 35 are right-angled triangular prisms, and right-angled positions of the first reflector 31 to the eighth reflector 35 are all connected to the housing 1, so that the first reflector 31 to the eighth reflector 35 can be conveniently mounted and fixed, and the mounting strength of the whole photolithography beam splitting device is ensured.

Specifically, the first reflection member 3 and the second reflection member 4 are different in structure at this time.

Example 3

Referring to fig. 22, the lithography beam splitter of the present embodiment is different from the lithography beam splitter of embodiment 2 in that:

in the present embodiment, the light splitting assembly 2 includes a first light splitting member 21 and a second light splitting member 22; the first beam splitter 21 comprises a first beam splitter reflection surface 23 and a second beam splitter surface 28, and the second beam splitter 22 comprises a second beam splitter reflection surface 24 and a first beam splitter surface 25; the first light splitting reflecting surface 23 and the first light splitting surface 25 face the same direction; the incident beam is emitted to the first beam splitter 25 and then reflected by the second beam splitter 28 to form a third projection beam path.

Specifically, the first light splitter 21 is a mirror, and the second light splitter 22 is a prism; the first light splitter 21 is disposed at one side of the second light splitter 22, and the second light splitter 28 is disposed opposite to the first light splitter 25, so that the incident light beam is emitted to the first light splitter 25 and then reflected by the second light splitter 28 to form a third projection light path.

Example 4

Referring to fig. 6 to 8, the lithography beam splitter of the present embodiment is different from the lithography beam splitter of embodiment 1 in that:

in this embodiment, the light splitting assembly 2 further includes a third light splitting reflective surface 26 and a fourth light splitting reflective surface 27 which are oppositely disposed, the first light splitting reflective surface 25 is oppositely disposed to the second light splitting reflective surface 28, and the third light splitting reflective surface 26 and the first light splitting reflective surface 25 are disposed toward the incident light beam; the incident light beam is emitted to the first light splitting surface 25 and then emitted to the second light splitting surface 28 to form a third projection light path; the incident beam passes through the third light splitting reflective surface 26 and then is emitted to the fourth light splitting reflective surface 27, forming a fourth projection optical path.

It is understood that the light splitting assembly 2 can be configured as a plurality of reflecting structures capable of meeting the setting requirement of the multi-light splitting reflecting surface, so as to project the incident light beam to different directions, for example, to at least two directions to form at least two projection light paths.

Furthermore, the light splitting component 2 is used for receiving the incident light beams and emitting the incident light beams to the first reflecting component 3 and the second reflecting component 4 along four projection light paths respectively; the first reflection assembly 3 is used for reflecting the received incident light beams to the light setting mechanism corresponding to the first reflection assembly 3 along two preset light paths and finally projecting the received incident light beams to the corresponding imaging area, and the second reflection assembly 4 is used for reflecting the received incident light beams to the light setting mechanism corresponding to the second reflection assembly 4 along two preset light paths and finally projecting the received incident light beams to the corresponding imaging area; the first light splitting reflecting surface 23, the second light splitting reflecting surface 24, the third light splitting reflecting surface 26 and the first light splitting surface 25 are all arranged towards the light inlet hole of the shell 1, and the first light splitting reflecting surface 23 and the second light splitting reflecting surface 24 are all arranged perpendicular to the bottom surface of the shell 1.

In some possible embodiments, when the light splitting assembly 2 comprises a first light splitting reflection surface 23, a second light splitting reflection surface 24, a fourth light splitting reflection surface 27, a third light splitting reflection surface 26, a first light splitting surface 25 and a first light splitting surface 25, the light splitting assembly 2 comprises a first light splitting member 21 and two second light splitting members 22; two second beam splitters 22 are disposed at both sides of the first beam splitter 21; the first light splitting member 21 includes a third light splitting reflection surface 26 and a first light splitting surface 25; a second beam splitter 22 comprising a first beam splitting reflective surface 23 and a fourth beam splitting reflective surface 27; the other second beam splitter 22 includes a second beam splitting reflective surface 24 and a second beam splitting surface 28; the incident beam is emitted to the first light splitting surface 25 and then reflected by the second light splitting surface 28 to form a third projection light path; the incident beam passes through the third light splitting reflective surface 26 and then is emitted to the fourth light splitting reflective surface 27, forming a fourth projection optical path.

Specifically, the first beam splitter 21 is a triangular prism, and the second beam splitter 22 is a mirror.

In some possible embodiments, the system further comprises a fourth light setting mechanism; the imaging area comprises a fourth imaging area corresponding to the first reflecting assembly 3, the first reflecting assembly 3 further comprises a ninth reflecting member 36 and a tenth reflecting member 37, and the reflecting surface of the ninth reflecting member 36 is arranged towards the reflecting surface of the second light splitting surface 28 and the reflecting surface of the tenth reflecting member 37; the incident light beam projected by the third projection light path forms a fourth preset light path through the ninth reflector 36 and the tenth reflector 37, and is emitted to a fourth light setting mechanism corresponding to the fourth preset light path, and the fourth light setting mechanism performs scaling processing on the incident light beam and then projects the incident light beam to a fourth imaging area corresponding to the fourth preset light path.

Specifically, the ninth reflecting member 36 includes at least a tenth reflecting surface, and the tenth reflecting member 37 includes at least an eleventh reflecting surface; the tenth reflecting surface is opposite to the eleventh reflecting surface, and the tenth reflecting surface is used for receiving and reflecting the incident light beams emitted by the third projection light path and reflecting the incident light beams to the corresponding eleventh reflecting surface; the eleventh reflecting surface is used for receiving the incident beam, emitting the incident beam to the fourth light setting mechanism and projecting the incident beam to the fourth imaging area.

Furthermore, a fifth light setting mechanism is further included, the imaging area comprises a fifth imaging area corresponding to the second reflection assembly 4, and the second reflection assembly 4 further comprises an eleventh reflection piece 44 and a twelfth reflection piece 45; the reflection surface of the eleventh reflection member 44 is disposed toward the reflection surface of the fourth light reflection surface 27 and the reflection surface of the twelfth reflection member 45; the eleventh reflector 44 is configured to receive and reflect an incident light beam emitted from the fourth projection light path to the twelfth reflector 45 to form a fifth preset light path, and emit the fifth preset light path to a fifth light setting mechanism corresponding to the fifth preset light path, where the fifth light setting mechanism performs scaling processing on the incident light beam and projects the scaled incident light beam to a fifth imaging area corresponding to the fifth preset light path.

Specifically, the eleventh reflecting member 44 includes at least a twelfth reflecting surface, and the twelfth reflecting member 45 includes at least a thirteenth reflecting surface.

Specifically, the second light splitting surface 28 is further provided toward the twelfth reflecting surface of the eleventh reflecting member 44, the twelfth reflecting surface of the eleventh reflecting member 44 is further provided toward the thirteenth reflecting surface of the twelfth reflecting member 45, and the thirteenth reflecting surface of the twelfth reflecting member 45 is provided by the fifth ray adjusting mechanism.

Specifically, the third projection optical path is: the incident light beam is directed to the first reflective component 3 along the first light splitting surface 25 and the second light splitting surface 28; the fourth projection light path is: the incident beam is directed along the third light dividing reflective surface 26 and the fourth light dividing reflective surface 27 towards the second reflective component 4.

Specifically, the fourth preset optical path is: the incident light beam is emitted to the fourth imaging area along the ninth reflector 36, the tenth reflector 37 and the fourth light setting mechanism; the fifth preset light path is as follows: the incident light beam is emitted to the fifth imaging area along the eleventh reflecting element 44, the twelfth reflecting element 45 and the fifth light setting mechanism.

Specifically, as shown by the dashed line in fig. 7, the overall optical path for imaging through the first reflecting assembly 3 is: the incident beam is reflected to the first reflecting surface of the first reflecting member 31, the second reflecting surface of the second reflecting member 32, the third reflecting surface of the third reflecting member 33, the first light setting mechanism and the first imaging area along the first light splitting reflecting surface 23 in sequence; the incident light beam is further reflected to a tenth reflection surface of the ninth reflection element 36, an eleventh reflection surface of the tenth reflection element 37, a fourth light setting mechanism and a fourth imaging area along the first light splitting surface 25 and the second light splitting surface 28 in sequence; the whole optical path imaged by the second reflecting component 4 is as follows: the incident light beam is reflected to the seventh reflecting surface of the fourth reflecting part 41, the eighth reflecting surface of the fifth reflecting part 42, the ninth reflecting surface of the sixth reflecting part 43, the second light setting mechanism and the second imaging area along the second partial reflecting surface 24 in sequence; the incident light beam is further reflected to the twelfth reflection surface of the eleventh reflection member 44, the thirteenth reflection surface of the twelfth reflection member 45, the fifth light setting mechanism and the fifth imaging area along the third light splitting reflection surface 26 and the fourth light splitting reflection surface 27 in sequence.

Specifically, the included angle between the first light splitting reflection surface 23 and the incident light beam ranges from 0 to 180 °, the included angle between the second light splitting reflection surface 24 and the incident light beam ranges from 0 to 180 °, the included angle between the third light splitting reflection surface 26 and the incident light beam ranges from 0 to 180 °, and the included angle between the first light splitting surface 25 and the incident light beam ranges from 0 to 180 °.

Furthermore, the first reflector 31 to the twelfth reflector 45 are right-angled triangular prisms, and right-angled positions of the first reflector 31 to the twelfth reflector 45 are all connected with the housing 1, so that the first reflector 31 and the twelfth reflector 45 can be conveniently installed and fixed, and the installation strength of the whole photoetching light splitting device is ensured.

It should be noted that: the scaling factors corresponding to the first light ray setting mechanism, the second light ray setting mechanism, the third light ray setting mechanism, the fourth light ray setting mechanism and the fifth light ray setting mechanism can be the same or different, and setting is not performed here as long as the light ray setting mechanism and the corresponding preset light path thereof can be imaged in the corresponding imaging area and requirements are met.

In an embodiment, the first light setting mechanism, the second light setting mechanism, the third light setting mechanism, the fourth light setting mechanism, and the fifth light setting mechanism include at least two scaling factors, for example, the scaling factors of the first preset light path, the second preset light path, and the third preset light path may be the same, and the scaling factor of the fourth preset light path is different from the scaling factors of the first preset light path, the second preset light path, and the third preset light path, it can be understood that the scaling factors of the different preset light paths may be set based on actual requirements, and the examples are not limited to the above examples.

It should be noted that: in this embodiment, the condition that more than four incident beams are incident simultaneously or in a time-sharing manner and are projected to more than four imaging areas through a plurality of preset light paths for imaging is also protected. In some cases, every time two incident light beams are added, four splitting reflection surfaces are correspondingly added to the splitting assembly 2, and two corresponding sixth light setting mechanisms and seventh light setting mechanisms are added at the same time.

In some possible embodiments, two second beam splitters 22 are added on both sides of the first beam splitter 21 for each additional two diverging beams to achieve imaging of the six beams of the incident beam simultaneously or in a time-shared manner, and so on, to achieve imaging of the multiple beams of the incident beam simultaneously or in a time-shared manner.

Taking the incident beam as an example of six beams simultaneously or time-divisionally, the difference from the incident beam being divided into four beams is that: the light splitting component 2 further comprises a seventh light splitting reflection surface, an eighth light splitting reflection surface, a ninth light splitting reflection surface and a tenth light reflection surface, and the light splitting component 2 is used for receiving incident light beams and respectively transmitting the incident light beams to the first reflection component 3 and the second reflection component 4 along six projection light paths; the seventh light splitting reflecting surface and the eighth light splitting reflecting surface are arranged oppositely, the ninth light splitting reflecting surface and the tenth light splitting reflecting surface are arranged oppositely, and the seventh light splitting reflecting surface and the ninth light splitting reflecting surface are used for receiving incident light beams.

The reflecting surface of the first reflecting component 3 is further configured to receive an incident light beam of the fifth projection light path, and reflect the incident light beam to the sixth imaging area along the sixth preset light path respectively; the second reflection assembly is further used for reflecting the incident light beam received by the sixth projection light path to the seventh imaging area along the seventh preset light path.

Specifically, the fifth projection light path is: the incident light beam emits to the first reflection assembly 3 along the seventh light splitting reflection surface and the eighth light splitting reflection surface; the sixth projection light path is: the incident light beam is emitted to the second reflecting component 4 along the ninth dichroic reflecting surface and the tenth dichroic reflecting surface.

Specifically, the first reflection assembly 3 corresponding to the seventh dichroic reflection surface further includes a thirteenth reflection member and a fourteenth reflection member; the second reflection assembly 4 corresponding to the ninth dichroic reflection surface further includes a fifteenth reflection element and a sixteenth reflection element.

Specifically, the fifth preset light path is a sixth imaging area of the incident light beam emitted along the thirteenth reflecting piece and the fourteenth reflecting piece and the sixth light setting mechanism; the sixth preset light path is that the incident light beam is emitted to the seventh imaging area along the fifteenth reflecting piece, the sixteenth reflecting piece and the seventh light setting mechanism.

Example 5

Referring to fig. 23, the lithography beam splitter of the present embodiment is different from the lithography beam splitter of embodiment 4 in that:

in the present embodiment, the spectroscopic assembly 2 includes a first spectroscopic member 21 and a second spectroscopic member 22;

the first beam splitter 21 comprises a first beam splitting reflection surface 23, a first beam splitting surface 25, a second beam splitting surface 28 and a third beam splitting reflection surface 26; the second beam splitter 22 comprises a second beam splitting reflective surface 24 and a fourth beam splitting reflective surface 27; the first light splitting reflection surface 23, the second light splitting reflection surface 24, the first light splitting reflection surface 25 and the third light splitting reflection surface 26 are all arranged towards an incident light beam, the first light splitting reflection surface 25 and the second light splitting reflection surface 28 are oppositely arranged, and the third light splitting reflection surface 26 and the fourth light splitting reflection surface 27 are oppositely arranged; the incident light beam emits to the first light splitting surface 25, and the first light splitting surface 25 transmits the incident light beam to the second light splitting surface 28 and transmits and emits the incident light beam through the second light splitting surface 28 to form a third projection light path; the incident beam passes through the third light splitting reflecting surface 26 and then is emitted to the fourth light splitting reflecting surface 27, so as to form a fourth projection light path.

Specifically, the first light splitting element 21 is a prism with a trapezoidal cross section, and the first light splitting surface 25 and the second light splitting surface 28 are arranged in parallel; the second light splitting member 22 is a mirror, and the first light splitting member 21 is disposed at one side of the second light splitting member 22.

It should be noted that: in this embodiment, the condition that more than four incident beams are incident simultaneously or in a time-sharing manner and are projected to more than four imaging areas through a plurality of preset light paths for imaging is also protected. In some cases, each time one incident light beam is added, two splitting reflection surfaces are correspondingly added to the splitting assembly 2, and an eighth light setting mechanism corresponding to the splitting reflection surfaces is added.

In some possible embodiments, for each additional divergent beam, a second beam splitter 22 is added to one side of the first beam splitter 21 to achieve simultaneous or time-shared imaging of five beams of the incident beam, and so on, to achieve simultaneous or time-shared imaging of multiple beams of the incident beam.

Taking the incident beam as an example of five beams simultaneously or time-divisionally, the difference from the incident beam being divided into four beams is that: the light splitting component 2 further comprises a tenth light splitting reflection surface and a tenth light splitting reflection surface, and the light splitting component 2 is used for receiving incident light beams and respectively transmitting the incident light beams to the first reflection component 3 and the second reflection component 4 along five projection light paths; the tenth light reflecting surface is used for receiving incident beams.

The reflection surface of the first reflection assembly 3 is further configured to receive the incident light beam on the seventh projection light path, and reflect the incident light beam to the eighth imaging area along the eighth preset light path, respectively.

Specifically, the seventh projection optical path is: the incident light beam is emitted to the first reflecting assembly 3 along the tenth dichroic reflecting surface and the tenth dichroic reflecting surface.

Specifically, the first reflection assembly 3 corresponding to the tenth dichroic reflection surface further includes a seventeenth reflection element and an eighteenth reflection element.

Specifically, the eighth preset optical path is: the incident light beam is along the seventeenth reflector, the eighteenth reflector and the eighth imaging area of the eighth light setting mechanism.

Example 6

Referring to fig. 3, the lithography beam splitter of the present embodiment is different from the lithography beam splitter of embodiment 1 in that:

in some possible embodiments, the first light splitting reflecting surface 23 is disposed toward the second reflecting surface of the second reflecting member 32, the second reflecting surface of the second reflecting member 32 is disposed toward the first reflecting surface of the first reflecting member 31, the first reflecting surface of the first reflecting member 31 is further disposed toward the third reflecting surface of the third reflecting member 33, and the third reflecting surface of the third reflecting member 33 is further disposed toward the first light setting mechanism.

Specifically, the second beam splitting reflective surface 24 is disposed toward the eighth reflective surface of the fifth reflective member 42, the eighth reflective surface of the fifth reflective member 42 is disposed toward the seventh reflective surface of the fourth reflective member 41, the seventh reflective surface of the fourth reflective member 41 is disposed toward the ninth reflective surface of the sixth reflective member 43, and the ninth reflective surface of the sixth reflective member 43 is disposed with the second beam adjusting mechanism.

The whole optical path for imaging through the first reflecting component 3 is as follows: the incident light beam is reflected to the second reflecting surface of the second reflecting piece 32, the first reflecting surface of the first reflecting piece 31, the third reflecting surface of the third reflecting piece 33, the first light setting mechanism and the first imaging area along the first light splitting reflecting surface 23 in sequence; the overall light path through the second reflecting assembly 4 is: the incident light beam is reflected to the eighth reflecting surface of the fifth reflecting member 42, the seventh reflecting surface of the fourth reflecting member 41, the ninth reflecting surface of the sixth reflecting member 43, the second light setting mechanism and the second imaging area along the second dichroic reflecting surface 24 in sequence.

Example 7

The invention also provides a photoetching method, which is applied to the photoetching light splitting system and comprises the following steps:

s103: controlling the spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio so that an incident beam reflected by the spatial light modulator is emitted to the light splitting assembly 2, is respectively emitted to the first reflecting assembly 3 and the second reflecting assembly 4 along at least two projection light paths through the light splitting assembly 2, and sequentially passes through a light setting mechanism corresponding to a preset light path so as to carry out scaling treatment on the incident beam emitted from the first reflecting assembly 3 and the second reflecting assembly 4, and projects the scaled incident beam to imaging areas corresponding to the first reflecting assembly 3 and the second reflecting assembly 4 so as to carry out photoetching on different imaging areas of a product to be photoetched based on photoetching sub-patterns with at least two different photoetching resolution ratios.

In some possible embodiments, as shown in fig. 10, the target lithographic pattern includes sub-patterns A5 and B6 of different resolutions, with sub-pattern A5 carrying the low power mirror and sub-pattern B6 carrying the high power mirror.

The photoetching method specifically comprises the following steps: obtaining a target photoetching pattern; determining the resolution of two sub-patterns A and B of the target lithographic pattern; controlling the spatial light modulator to move towards the imaging area based on the resolution of the sub-pattern A5 and the sub-pattern B6, forming a lithography diagram as shown in fig. 11; continuing to control the spatial light modulator to move towards the imaging area, as shown in fig. 12, matching the sub-pattern B6 reflected by the lithography beam splitting system to the imaging area 7 corresponding to the sub-pattern B6, and completing the lithography processing of the sub-pattern B6; at this time, the sub-pattern A5 has not yet reached its corresponding imaging area. Further, the spatial light modulator is continuously controlled to move toward the imaging region 7, as shown in fig. 13, the sub-pattern A5 is matched to the imaging region 7 corresponding to the sub-pattern A5, and the photolithography process of the sub-pattern A5 is completed.

It should be noted that: in this embodiment, the first light setting mechanism and the second light setting mechanism perform auxiliary imaging, and the scaling factors of the first light setting mechanism and the second light setting mechanism matched with the first light setting mechanism and the second light setting mechanism are different, so that sub-patterns with different resolutions can be configured in this embodiment.

In other possible embodiments, as shown in fig. 14, the target lithographic pattern includes sub-patterns A5 and B6 distributed up and down.

The photoetching method specifically comprises the following steps: obtaining a target photoetching pattern; determining lithography distribution information of sub-patterns A5 and B6 of the target lithography pattern; wherein, the sub-patterns A5 and B6 are distributed up and down; controlling the spatial light modulator to move towards the imaging area 7 based on the lithography distribution information of the sub-pattern A5 and the sub-pattern B6, forming a lithography diagram as shown in fig. 15; the spatial light modulator is continuously controlled to move towards the imaging area 7, as shown in fig. 16, the sub-pattern B6 reflected by the lithography beam splitting system is firstly matched to the imaging area 7 corresponding to the sub-pattern B6, and the lithography processing of the sub-pattern B6 is completed, at this time, the sub-pattern A5 does not reach the imaging area 7 corresponding to the sub-pattern a.

Further, the spatial light modulator is continuously controlled to move toward the imaging region 7, as shown in fig. 17, the sub-pattern A5 is matched to the imaging region 7 corresponding to the sub-pattern A5, and the photolithography process of the sub-pattern A5 is completed.

In this embodiment, through the matching between the lithography beam splitting device and the spatial light modulator, the lithography of patterns with different distributions and different resolutions is realized, the pattern is formed in one step, the division of regions is not needed, the efficiency is high, the return stroke is not needed to replace a double mirror, the precision error caused by the return stroke is greatly reduced, and the lithography precision is effectively improved.

Example 8

Referring to fig. 18 to 21, the difference between the photolithography method of the present embodiment and the photolithography method of embodiment 7 is:

the target lithographic pattern includes sub-patterns A5 and B6 distributed left and right.

The photoetching method specifically comprises the following steps: obtaining a target photoetching pattern; determining lithography distribution information of a sub-pattern A5 and a sub-pattern B6 of the target lithography pattern; wherein, the sub-patterns A5 and B6 are distributed left and right; controlling the spatial light modulator to move towards the imaging area 7 based on the lithography distribution information of the sub-pattern A5 and the sub-pattern B6, forming a lithography diagram as shown in fig. 19; the spatial light modulator is continuously controlled to move towards the imaging area 7, as shown in fig. 20, the sub-pattern B6 reflected by the lithography beam splitting system is firstly matched with the imaging area 7 corresponding to the sub-pattern B6, and the lithography processing of the sub-pattern B6 is completed, at this time, the sub-pattern A5 does not reach the imaging area 7 corresponding to the sub-pattern a.

Further, the spatial light modulator is continuously controlled to move toward the imaging region 7, as shown in fig. 21, the sub-pattern A5 is matched to the imaging region 7 corresponding to the sub-pattern A5, and the photolithography process of the sub-pattern A5 is completed.

Illustratively, the sub-pattern a has a larger pattern size corresponding to a portion of the original pattern to be patterned with a relatively low resolution, and the sub-pattern B has a smaller pattern size corresponding to a portion of the original pattern to be patterned with a relatively high resolution. Note that the positional relationship between the sub-pattern B and the sub-pattern a is not limited.

In this embodiment, through the matching between the lithography beam splitting device and the spatial light modulator, sub-pattern lithography with left and right distribution is realized; the DMD can be moved left and right to form sub-patterns with different left and right distribution in the imaging area 7, the embodiment can be suitable for photoetching of patterns with large sizes, the problem that the DMD can only scan the fixed width of photoetching once due to width limitation of the DMD can be avoided, repeated operation is not needed, and photoetching efficiency is high. And a plurality of DMDs are not needed to be arranged to realize the photoetching of large-size patterns, so that the cost is low.

Although the present invention has been described by way of preferred embodiments, the present invention is not limited to the embodiments described herein, and various changes and modifications may be made without departing from the scope of the present invention.

In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the invention as claimed.

The embodiments and features of the embodiments described herein above can be combined with each other without conflict.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A photoetching light splitting device is characterized in that the photoetching light splitting device is used for processing a target photoetching pattern, the target photoetching pattern comprises sub-patterns, and the target photoetching pattern comprises a light splitting component (2), a first reflecting component (3), a second reflecting component (4) and at least two groups of light setting mechanisms;

the light splitting component (2) is used for receiving incident light beams and respectively emitting the incident light beams to the first reflecting component (3) and the second reflecting component (4) along at least two different projection light paths;

the first reflection assembly (3) is used for reflecting a received incident beam to the light setting mechanism along at least one preset light path, the light setting mechanism performs scaling processing on the incident beam and then projects the incident beam to an imaging area corresponding to the first reflection assembly (3), the second reflection assembly (4) is used for reflecting the received incident beam to the light setting mechanism along at least one preset light path, the light setting mechanism performs zooming processing on the incident beam and then projects the incident beam to an imaging area corresponding to the second reflection assembly (4), and the imaging area corresponding to the first reflection assembly (3) and the imaging area corresponding to the second reflection assembly (4) are located at different positions of an area to be imaged;

the light setting mechanisms are arranged in one-to-one correspondence with the preset light paths, the scaling factors corresponding to the at least two groups of light setting mechanisms are more than or equal to two, and the at least two groups of light setting mechanisms are used for corresponding to the sub-patterns with at least two resolutions.

2. The lithographic beam splitting device according to claim 1, wherein the beam splitting assembly (2) comprises a first beam splitting reflection surface (23) and a second beam splitting reflection surface (24);

the first light splitting reflection surface (23) is arranged towards the incident light beam and the first reflection assembly (3) and forms a first preset angle with the first reflection assembly (3); the second beam splitting reflecting surface (24) is arranged towards the incident beam and the second reflecting assembly (4) and forms a second preset angle with the second reflecting assembly (4).

3. The lithographic beam splitting device of claim 2, wherein the light setting mechanism comprises a first light setting mechanism and a second light setting mechanism;

the incident beam is emitted to the first light splitting reflection surface (23) to form a first projection light path and is emitted to the first reflection assembly (3) and the first light setting mechanism; the incident beam is emitted to the second light splitting reflection surface (24) to form a second projection light path and is emitted to the second reflection assembly (4) and the second light setting mechanism.

4. A lithographic beam splitting device according to claim 3, wherein the first reflective assembly (3) comprises a first reflective member (31), a second reflective member (32) and a third reflective member (33);

the incident light beam is emitted to the first reflecting piece (31) through the first projection light path, sequentially forms a first preset light path through the second reflecting piece (32) and the third reflecting piece (33), and is emitted to a first light setting mechanism corresponding to the first preset light path, and the first light setting mechanism performs scaling processing on the incident light beam and then projects the light beam to a first imaging area corresponding to the first preset light path.

5. The lithography beam splitter according to claim 4, wherein the reflecting surface of the first reflector (31) is disposed toward the reflecting surface of the beam splitter assembly (2) and the reflecting surface of the second reflector (32), and the reflecting surface of the third reflector (33) is disposed toward the reflecting surface of the second reflector (32) and the first light setting mechanism.

6. A lithographic beam splitting device according to claim 3, wherein the second reflective assembly (4) comprises a fourth reflective member (41), a fifth reflective member (42) and a sixth reflective member (43);

the incident light beam is emitted to the fourth reflecting piece (41) through the second projection light path, sequentially forms a second preset light path through the fifth reflecting piece (42) and the sixth reflecting piece (43), and is emitted to a second light setting mechanism corresponding to the second preset light path, and the second light setting mechanism performs scaling processing on the incident light beam and then projects the light beam to a second imaging area corresponding to the second preset light path.

7. The lithography beam splitter apparatus according to claim 2, wherein the beam splitter module (2) further comprises a first beam splitter surface (25) and a second beam splitter surface (28) which are oppositely disposed, the first beam splitter surface (25) is disposed towards the incident beam, and the incident beam is emitted through the second beam splitter surface (28) after being directed towards the first beam splitter surface (25) to form a third projection light path.

8. The lithographic beam splitting device according to claim 7, wherein the beam splitting assembly (2) comprises a first beam splitter (21) and a second beam splitter (22);

the first beam splitter (21) comprises the first beam splitting reflection surface (23) and the second beam splitting surface (28), and the second beam splitter (22) comprises the second beam splitting reflection surface (24) and the first beam splitting surface (25);

the first light splitting reflection surface (23) and the first light splitting surface (25) face the same direction;

the incident light beam is emitted to the first light splitting surface (25) and then reflected and emitted through the second light splitting surface (28) to form a third projection light path.

9. The lithographic beam splitting device according to claim 7, wherein the beam splitting assembly (2) comprises a first beam splitter (21);

the first light splitting member (21) includes the first light splitting reflection surface (23), the second light splitting reflection surface (24), the first light splitting surface (25), and the second light splitting surface (28);

the first light splitting reflection surface (23), the second light splitting reflection surface (24) and the first light splitting surface (25) are respectively arranged towards different directions;

the incident light beam is transmitted and emitted through the first light splitting surface (25) and the second light splitting surface (28) to form a third projection light path.

10. The lithographic beam splitting device according to claim 9, wherein the first reflective assembly (3) further comprises a seventh reflective member (34) and an eighth reflective member (35), a reflective surface of the seventh reflective member (34) being disposed toward a reflective surface of the second light splitting surface (28) and a reflective surface of the eighth reflective member (35);

an incident light beam projected by the third projection light path forms a third preset light path through the seventh reflector (34) and the eighth reflector (35), and the incident light beam is emitted to a third light setting mechanism corresponding to the third preset light path, and the third light setting mechanism performs scaling processing on the incident light beam and projects the light beam to a third imaging area corresponding to the third preset light path.

11. The lithographic beam splitting device according to claim 7, wherein the beam splitting assembly (2) further comprises a third beam splitting reflective surface (26) and a fourth beam splitting reflective surface (27) oppositely arranged, the first beam splitting surface (25) is oppositely arranged to the second beam splitting surface (28), and the third beam splitting reflective surface (26) and the first beam splitting surface (25) are arranged towards the incident light beam;

the incident light beam is emitted to the first light splitting surface (25) and then emitted to the second light splitting surface (28) to form a third projection light path; the incident light beam passes through the third light splitting reflection surface (26) and then is emitted to the fourth light splitting reflection surface (27) to form a fourth projection light path.

12. The lithographic beam splitting device according to claim 11, wherein the beam splitting assembly (2) comprises a first beam splitter (21) and two second beam splitters (22); the two second light splitting parts (22) are arranged on two sides of the first light splitting part (21);

the first light splitting element (21) comprises the third light splitting reflective surface (26) and the first light splitting surface (25); one of said second beam splitters (22) comprises said first beam splitting reflective surface (23) and said fourth beam splitting reflective surface (27); another of said second beam splitters (22) comprises said second beam splitting reflective surface (24) and said second beam splitting surface (28);

the incident light beam is emitted to the first light splitting surface (25) and then reflected out through the second light splitting surface (28) to form a third projection light path;

the incident light beam passes through the third light splitting reflection surface (26) and then is emitted to the fourth light splitting reflection surface (27) to form a fourth projection light path.

13. The lithographic beam splitting device according to claim 11, wherein the beam splitting assembly (2) comprises a first beam splitter (21) and a second beam splitter (22);

the first light splitting member (21) comprises the first light splitting reflection surface (23), the first light splitting surface (25), the second light splitting surface (28) and the third light splitting reflection surface (26);

the second beam splitter (22) comprises the second beam splitting reflective surface (24) and the fourth beam splitting reflective surface (27);

the first light splitting reflection surface (23), the second light splitting reflection surface (24), the first light splitting reflection surface (25) and the third light splitting reflection surface (26) are all arranged towards the incident light beam, the first light splitting reflection surface (25) and the second light splitting reflection surface (28) are oppositely arranged, and the third light splitting reflection surface (26) and the fourth light splitting reflection surface (27) are oppositely arranged;

the incident light beam is emitted to the first light splitting surface (25), and the first light splitting surface (25) transmits the incident light beam to the second light splitting surface (28) and transmits the incident light beam out through the second light splitting surface (28) to form the third projection light path;

14. The lithographic beam splitting device according to claim 11, wherein the first reflective assembly (3) further comprises a ninth reflective member (36) and a tenth reflective member (37), a reflective surface of the ninth reflective member (36) being disposed towards a reflective surface of the second beam splitting surface (28) and a reflective surface of the tenth reflective member (37);

the incident light beam projected by the third projection light path forms a fourth preset light path through the ninth reflector (36) and the tenth reflector (37), and the incident light beam is emitted to a fourth light setting mechanism corresponding to the fourth preset light path, and the fourth light setting mechanism performs scaling processing on the incident light beam and projects the incident light beam to a fourth imaging area corresponding to the fourth preset light path.

15. The lithographic beam splitting device according to claim 11, wherein the second reflective assembly (4) further comprises an eleventh reflective member (44) and a twelfth reflective member (45); the reflection surface of the eleventh reflection member (44) is arranged facing the reflection surface of the fourth reflection surface (27) and the reflection surface of the twelfth reflection member (45);

the eleventh reflector (44) is configured to receive and reflect an incident light beam emitted from the fourth projection light path to the twelfth reflector (45) to form a fifth preset light path, and emit the incident light beam to a fifth light setting mechanism corresponding to the fifth preset light path, where the fifth light setting mechanism performs scaling processing on the incident light beam and then projects the incident light beam to a fifth imaging area corresponding to the fifth preset light path.

16. The lithographic beam splitting device according to claim 1, wherein the light setting mechanism comprises a mounting frame (84) and a functional coating (85) arranged on the side of the outgoing beam;

the functional coating (85) is arranged on the mounting frame (84), and the functional coating (85) is used for eliminating crosstalk of external light of the mounting frame (84);

the mounting frame (84) comprises a first connecting layer, a conducting layer and a second connecting layer which are sequentially connected from top to bottom;

17. The apparatus according to claim 16, wherein the mounting frame (84) is provided with at least two mounting holes, and the mounting holes are spaced apart from each other on the mounting frame (84);

the light ray setting mechanism also comprises at least two times of mirror mounting shells (81) and one or more zoom lens (82);

the double-lens mounting shell (81) and the mounting hole are correspondingly arranged, and the double-lens mounting shell (81) can be arranged in the corresponding mounting hole;

when the number of the lenses (82) is multiple, the light ray setting mechanism further comprises a rotating piece (83); the first end of rotating member (83) with times mirror installation shell (81) rotate to be connected, the second end of rotating member (83) with a plurality of camera lenses (82) are connected, so that rotating member (83) can drive a plurality of camera lenses (82) are relative times mirror installation shell (81) rotate.

18. A lithographic beam splitting system comprising a spatial light modulator, a controller and a lithographic beam splitting device according to any one of claims 1-17;

the photoetching light splitting device is used for receiving an incident beam emitted by the spatial light modulator and projecting the incident beam to an area to be imaged.

19. A lithography method applied to the lithography beam splitting system according to claim 18, the method comprising:

controlling a spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio so that an incident beam reflected by the spatial light modulator is emitted to a light splitting assembly (2), and is respectively emitted to a first reflection assembly (3) and a second reflection assembly (4) along at least two different projection light paths through the light splitting assembly (2) and then is respectively projected to a light setting mechanism;

and carrying out scaling treatment on incident light beams emitted from the first reflecting assembly (3) and the second reflecting assembly (4), and projecting the scaled incident light beams to imaging areas corresponding to the first reflecting assembly (3) and the second reflecting assembly (4) respectively so as to carry out photoetching at different positions of an area to be imaged based on the at least two photoetching sub-patterns.

20. A lithographic apparatus for carrying out the lithographic method of claim 19, the lithographic apparatus comprising:

the light splitting module controls the spatial light modulator to move based on the photoetching distribution information and the photoetching resolution ratio, so that incident light beams reflected by the spatial light modulator are emitted to the light splitting assembly (2), and are respectively emitted to the first reflecting assembly (3) and the second reflecting assembly (4) along at least two different projection light paths through the light splitting assembly (2) and then are respectively projected to the light setting mechanism;

and the imaging module is used for carrying out scaling treatment on incident light beams emitted from the first reflecting assembly (3) and the second reflecting assembly (4), and the incident light beams after scaling treatment are projected to imaging areas respectively corresponding to the first reflecting assembly (3) and the second reflecting assembly (4) so as to carry out photoetching at different positions of an area to be imaged based on the at least two photoetching sub-patterns.

21. A readable storage medium having at least one instruction or at least one program stored thereon, wherein the at least one instruction or the at least one program when executed by a processor implements the lithographic method of claim 19.