CN115145101A - Heat dissipation assembly, heat dissipation device and projection equipment - Google Patents

Abstract

The embodiment of the invention provides a heat dissipation assembly for dissipating heat of a spatial light modulator, which comprises a heat conduction substrate and a heat radiator. A gap is formed between the heat-conducting substrate and the front window surface, and the heat-conducting substrate is used for radiating heat of the front window surface. The heat sink is mounted on the heat-conducting substrate, and heat generated by the spatial light modulator is transferred from the front window surface to the heat sink through the heat-conducting substrate. According to the heat dissipation assembly provided by the invention, the gap is formed between the heat conduction substrate and the front window surface of the spatial light modulator, so that heat on the heat conduction substrate bearing stray light and useless light cannot be transferred to the front window surface of the spatial light modulator, and heat generated by the spatial light modulator can be transferred to the radiator from the front window surface through the heat conduction substrate, so that the heat dissipation efficiency of the heat dissipation assembly on the spatial light modulator is improved, and the service life of the spatial light modulator is prolonged. The embodiment of the invention also provides a heat dissipation device and projection equipment.

Description

Heat dissipation assembly, heat dissipation device and projection equipment

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation assembly, a heat dissipation device and projection equipment.

Background

For a projection device with multiple spatial light modulators, the temperature specification of the spatial light modulator is a bottleneck for the brightness of the projection device. In the existing projection equipment, the heat dissipation efficiency of the spatial light modulator is not high, so that the spatial light modulator is difficult to meet the temperature control specification, and improvement is urgently needed.

Disclosure of Invention

An embodiment of the invention provides a heat dissipation assembly, a heat dissipation device and a projection apparatus to solve the above problems. The embodiment of the invention realizes the aim through the following technical scheme.

In a first aspect, an embodiment of the present invention provides a heat dissipation assembly for dissipating heat of a spatial light modulator, where the heat dissipation assembly includes a heat conducting substrate and a heat sink. A gap is formed between the heat-conducting substrate and the front window surface, and the heat-conducting substrate is used for radiating heat of the front window surface. The heat sink is mounted on the heat-conducting substrate, and heat generated by the spatial light modulator is transferred from the front window surface to the heat sink through the heat-conducting substrate.

In one embodiment, the heat dissipation assembly further comprises a heat sink and a thermal bridge, the heat sink being attachable to the back side. The thermal bridge is connected between the heat conducting substrate and the heat sink and used for transferring heat generated by the spatial light modulator to the heat sink from the front window surface through the heat conducting substrate and the thermal bridge.

In one embodiment, the heat dissipation assembly further includes a heat pipe embedded in the heat conductive substrate and connected to the heat sink.

In one embodiment, the heat pipe includes an evaporation end and a condensation end, the heat dissipation assembly further includes a mounting protrusion disposed on the heat conductive substrate and used for mounting the spatial light modulator, the evaporation end is connected to the mounting protrusion, and the condensation end is connected to the heat sink.

In one embodiment, the heat dissipation assembly further comprises a waste light heat sink coupled to the thermally conductive substrate and configured to receive waste light.

In one embodiment, the waste heat sink includes a waste heat conduction substrate, a waste heat conduction pipe and a waste heat sink, the waste heat conduction pipe and the waste heat sink are mounted on the waste heat conduction substrate, the waste heat conduction pipe includes a heat conduction evaporation end and a heat conduction condensation end, the heat conduction evaporation end is used for receiving waste heat, and the heat conduction condensation end is connected with the waste heat sink.

In one embodiment, the heat sink assembly further comprises a thermal insulation portion between the waste heat sink and the heat sink, and between the waste heat transfer heat pipe and the heat pipe.

In one embodiment, the gap is between 0.2mm and 1mm in size.

In one embodiment, the heat-conducting substrate comprises a mounting surface and a mounting back surface which are opposite to each other, a gap is arranged between the mounting surface and the front window surface, and the heat dissipation assembly further comprises a light extinction layer which is arranged on the mounting back surface and the surface of the heat sink.

In a second aspect, an embodiment of the present invention further provides a heat dissipation apparatus, which is adapted to dissipate heat of an optical system, where the optical system includes a plurality of spatial light modulators, and the heat dissipation apparatus includes a plurality of heat dissipation assemblies, where the plurality of heat dissipation assemblies are spaced apart from each other and are adapted to be applied to the plurality of spatial light modulators in a one-to-one correspondence manner, and each spatial light modulator is mounted on a corresponding heat dissipation assembly.

In one embodiment, the heat sink further comprises a plurality of fans facing the plurality of heat dissipating components.

In one embodiment, the plurality of heat sinks include a first spatial light modulator heat sink, a second spatial light modulator heat sink, and a third spatial light modulator heat sink, the plurality of fans include a first fan, a second fan, a third fan, and a fourth fan, the first fan and the second fan face the first spatial light modulator heat sink, the second fan faces the first spatial light modulator heat sink and the second spatial light modulator heat sink, the third fan faces the second spatial light modulator heat sink and the third spatial light modulator heat sink, and the fourth fan faces the third spatial light modulator heat sink.

In a third aspect, an embodiment of the present invention further provides a projection apparatus, including a light source device, a housing, any one of the heat dissipation devices, and a plurality of spatial light modulators, where the light source device is configured to emit illumination light, the plurality of spatial light modulators modulate the illumination light and generate heat, and correspond to the plurality of heat dissipation assemblies one to one, each spatial light modulator is installed in a corresponding heat dissipation assembly, and the heat dissipation device absorbs the heat generated by the plurality of spatial light modulators.

In one embodiment, the projection apparatus further includes a prism assembly, the prism assembly being installed in the housing, the prism assembly including a plurality of light splitting prisms and a reflection prism, the plurality of light splitting prisms being one-to-one opposite to the plurality of spatial light modulators.

In one embodiment, the projection apparatus further comprises a prism top surface heat sink and a prism side surface heat sink, the prism top surface heat sink and the prism side surface heat sink being mounted in the housing, the prism top surface heat sink being connected to the beam splitting prism, at least one of the plurality of reflection prisms being connected to the prism side surface heat sink.

Compared with the prior art, the heat dissipation assembly, the heat dissipation device and the projection equipment provided by the embodiment of the invention have the advantages that the heat dissipation assembly is used for dissipating heat of the spatial light modulator, the gap is arranged between the heat conduction substrate and the front window surface of the spatial light modulator, so that heat on the heat conduction substrate bearing stray light and useless light cannot be transferred to the front window surface of the spatial light modulator, heat generated by the spatial light modulator can be transferred to the radiator from the front window surface through the heat conduction substrate, the heat dissipation efficiency of the heat dissipation assembly on the spatial light modulator is improved, and the service life of the spatial light modulator is prolonged.

These and other aspects of the invention are apparent from and will be elucidated with reference to the embodiments described hereinafter.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a prism-DMD module according to an embodiment of the invention.

Fig. 2 is a schematic structural diagram of a heat dissipation assembly provided in an embodiment of the present invention in a viewing angle.

Fig. 3 is a schematic structural diagram of a heat dissipation assembly according to another view angle.

Fig. 4 is a schematic structural diagram of a heat dissipation assembly according to another view angle.

Fig. 5 is a schematic view of an assembly structure of a heat dissipation assembly according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a waste light heat sink according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a second spatial light modulator heat sink assembly according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a heat sink assembly of a third spatial light modulator according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a projection apparatus provided in an embodiment of the present invention.

Fig. 11 is a schematic view of a combined structure of the first spatial light modulator heat dissipation assembly, the first fan and the second fan according to an embodiment of the present invention.

Fig. 12 is an assembly view of a heat dissipation assembly mounted to a prism assembly according to an embodiment of the present invention.

Fig. 13 is a graph of the light energy distribution of a red spatial light modulator on a red reflecting prism in the OFF state according to an embodiment of the present invention.

Fig. 14 is a graph showing the distribution of light energy ON the red reflecting prism of the red spatial light modulator according to the embodiment of the present invention in the ON state.

Fig. 15 is a graph of the light energy distribution of a green spatial light modulator on a green reflecting prism in the OFF state according to an embodiment of the present invention.

FIG. 16 is a graph of the distribution of light energy ON the green reflecting prism for a green spatial light modulator in the ON state according to an embodiment of the present invention.

Fig. 17 is a graph of the light energy distribution of a blue spatial light modulator on a blue light reflecting prism in the OFF state according to an embodiment of the present invention.

Fig. 18 is a graph showing the distribution of light energy of a blue spatial light modulator ON a blue light reflecting prism in an ON state according to an embodiment of the present invention.

Fig. 19 is a schematic diagram of heat dissipation of a prism assembly according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The inventors of the present application have found that spatial light modulators are widely used in projection devices. Referring to fig. 1, for example, a DMD is taken as an example, the DMD includes a front window surface and a back surface opposite to the front window surface, the light power that the DMD can bear often limits the brightness of a projection device, and the maximum light power that the DMD can bear is limited by the upper temperature limit that the DMD can bear. For a DMD to have good long-term reliability, according to the specifications provided by TI (Texas Instruments), it is necessary to ensure the temperature T of the front window of the DMD _WINDOW And temperature of the back side of the DMD (temperature of the DMD package internal micromirror array) T _BACK Within a certain range and the absolute value | T of the temperature difference between the two is guaranteed _DELTA I is within a certain range.

Temperature T of DMD front Window _WINDOW The increase in (d) results from the optical energy directly absorbed by its package, including stray light and the spot size tolerance (overfilll) of the incident DMD in the optical design; although the internal micromirror array of the DMD emits most of the light, a small portion of the light is leaked due to the gap between the micromirror arrays, so that the light is irradiated onto the substrate of the micromirror array, resulting in a temperature T at the back of the DMD _BACK And (4) rising. Since the temperature of the micromirror array inside the DMD package cannot be directly measured, the temperature of the micromirror array inside the DMD package is usually measured as the temperature T of the back surface of the DMD _BACK To indicate.

How to increase the light power that the spatial light modulator can bear without increasing the number of the spatial light modulator to the maximum extent so as to improve the brightness of the projection equipment, for the temperature of the front window surface of the spatial light modulatorDegree T _WINDOW Temperature T of the back of the spatial light modulator _BACK And absolute value | T of temperature difference between the two _DELTA Control of | is crucial.

In terms of optical design, the distance between the front window of the spatial light modulator and the optical machine prism of the projection device is generally small, and in order to control the temperature of the front window of the spatial light modulator in a narrow space, the heat dissipation design should be as simple and reliable as possible. For a projection device with general brightness, the heat dissipation design of the projection device only needs to consider the back heat dissipation measure of the spatial light modulator. When the brightness of the projector is high, that is, the optical power received by the spatial light modulator is high, the thermal conductivity of the material (for example, kovar alloy) used for packaging the spatial light modulator itself is not high (about 17W/m × K), so that the heat absorbed by the front window of the spatial light modulator is not as long as the heat sink conducting to the back side of the spatial light modulator, and the temperature T of the front window of the spatial light modulator is caused _WINDOW Too high, or absolute value of temperature difference | T of front and back of spatial light modulator _DELTA If | exceeds the use specification of the spatial light modulator, the reliability and the service life of the spatial light modulator will be significantly affected.

In the prior art solutions, the temperature of the soaking plate is considered by those skilled in the art to be lower than the temperature T of the front window of the DMD _WINDOW Therefore, in designing the heat dissipation of the DMD front window, the heat of the DMD is reduced by dissipating the heat from the front window in direct contact with the DMD front window, but in the actual research, the inventors found that the temperature of the soaking plate is actually higher than the temperature T of the DMD front window in the presence of stray light _WINDOW This results in the heat of the vapor chamber receiving stray light and waste light being transferred to the DMD front window surface, not only not cooling the DMD front window surface, but also further increasing the probability of the DMD front window surface failing.

In the related art, a thin heat dissipation plate with high thermal conductivity is used on the front window surface of the spatial light modulator, and the thin heat dissipation plate is clamped by a clamp to be in contact with the front window surface, so that the heat dissipation area of the front window surface is increased by the thin heat dissipation plate. However, when the brightness of the whole machine is high, the thin heat dissipation plate can bear limited heat, resulting in poor heat dissipation effect. In addition, the heat dissipation device in the related art contains flowing refrigerants and is arranged on the front window surface of the spatial light modulator, the cooling effect of the refrigerant mode is good, but the manufacturing difficulty of the heat dissipation device is high due to the fact that the distance between the front window surface of the spatial light modulator and the prism is usually small and is in the millimeter level, the heat dissipation device is not easy to manufacture devices with small size and complex structure, and meanwhile the cost is increased.

In view of the above problems, the inventors propose the heat dissipation assembly, the heat dissipation device, and the projection apparatus of the present application, and the embodiments of the present application will be described in detail below with reference to the drawings.

It should be noted that the spatial light modulator has two operating states, including an ON state and an OFF state, and generally speaking, when incident light irradiates to the two operating states, the DMD reflects the waste light, and it can be understood that the light energy distribution of the waste light reflected by the DMD in the OFF state is greater than that of the waste light reflected by the DMD in the ON state, and therefore, different heat dissipation methods can be adopted for the waste light in different states to perform targeted heat dissipation.

Referring to fig. 2, fig. 3 and fig. 4, a heat dissipation assembly 100 for dissipating heat of a spatial light modulator is provided in an embodiment of the present invention, and the heat dissipation assembly 100 includes a heat conductive substrate 110 and a heat sink 120. The heat conductive substrate 110 serves to dissipate heat from the front window surface. The heat sink 120 is mounted on the heat conductive substrate 110, so that heat generated by the spatial light modulator can be conducted and dissipated from the front window surface through the first heat conduction path R1. The first heat conducting path R1 is from the front window to the heat sink 120 through the heat conducting substrate 110.

The heat conducting substrate 110 can receive the stray light and the waste light, and is used for conducting the heat generated by the spatial light modulator and the heat generated by the stray light and the waste light to the heat spreader 120 or the heat sink 130, and then the heat is dissipated through the heat spreader 120 or the heat sink 130, so as to realize the heat dissipation of the spatial light modulator. In the present embodiment, the material of the heat conducting substrate 110 is red copper C1100, which has better heat uniformity than aluminum and aluminum alloys. The thermally conductive substrate 110 may be configured in different structures and sizes according to the spatial structure of the spatial light modulator.

In the present embodiment, the heat conducting substrate 110 has a gap G1 with the front window surface, and is used for dissipating heat from the front window surface. Through setting up clearance G1, when guaranteeing that the structure is miniaturized, cut off DMD front window and heat conduction substrate 110's direct contact for on the heat conduction substrate 110 of accepting stray light and useless light can't transmit the DMD front window, be favorable to cooling down DMD, prolong DMD's life. The size of the gap G1 is related to the focal length of the lens, the distance between the DMD front window surface and the prism, the thickness of the heat conducting substrate 110, the size of the DMD alignment member, and the like, and in this embodiment, the size of the gap G1 is 0.2-1mm. Preferably, when the size of the gap G1 is 1mm, the heat dissipation capability of the heat dissipation assembly 100 is optimal.

Referring to fig. 3 and 4, the heat-conducting substrate 110 includes a mounting surface 112 and a mounting back surface 114 opposite to each other, wherein a gap G1 is formed between the mounting surface 112 and the front window surface. The mounting back 114 may be used for fixing the heat conductive substrate 110 by optical adhesive or by screw locking.

The heat conductive substrate 110 is provided with a light transmission hole 116, the light transmission hole 116 penetrates the mounting surface 112 and the mounting back surface 114, the light transmission hole 116 can be used for light transmission, so that light can be incident to the spatial light modulator through the light transmission hole 116, and light emitted from the spatial light modulator can be emitted through the light transmission hole 116.

Referring to fig. 2, in the present embodiment, the heat sink 120 may be made of AL6063-T5, which is a common aluminum alloy, and may be a cross pin type heat sink to improve the turbulence effect. The specific number and size of the heat sinks 120 may be set according to actual heat dissipation requirements. As an example, the number or size of the heat sinks 120 may be increased when the heat dissipation requirements are high. Conversely, the number or size of the heat sinks 120 may be reduced.

The heat dissipation assembly 100 also includes a heat sink 130 and a thermal bridge 140. The heat sink 130 may be attached to the back surface such that heat generated by the spatial light modulator may be conducted away from the back surface second thermal conduction path R2. Wherein the second thermal conduction path R2 is directly transferred from the back surface to the heat sink 130. The thermal bridge 140 is connected between the heat-conducting substrate 110 and the heat sink 130, and is used for transferring heat generated by the spatial light modulator to the heat sink 130 through the third heat-conducting path R3 via heat conduction from the front window surface. The third thermal conduction path R3 is transmitted from the front window to the heat sink 130 through the thermal conductive substrate 110 and the thermal bridge 140 in sequence. That is, the heat generated by the spatial light modulator has multiple heat conducting paths, so that the heat dissipation efficiency of the heat dissipation assembly 100 for the spatial light modulator is improved, and the spatial light modulator can meet the temperature control specification.

In this embodiment, the heat sink 130 may be made of red copper C1100, which has better heat uniformity than aluminum and aluminum alloys. Can be used with thermoelectric refrigeration elements, cold plates and water cooling systems. In order to prevent condensation and improve heat transfer efficiency, all heat sinks which are close to the thermoelectric refrigeration element and have the temperature lower than the ambient temperature can be wrapped by heat insulation materials, wherein the heat insulation materials can be heat insulation foam.

Due to the structural space limitation, the thermal bridge 140 can be used as a compact auxiliary heat dissipation device to complete the heat transfer between the front window surface and the back surface of the spatial light modulator in a narrow space so as to reduce the absolute value | T of the temperature difference between the front window surface and the back surface of the spatial light modulator _DELTA And the reliability of the spatial light modulator is improved. In this embodiment, the thermal bridge 140 and the heat conducting substrate 110 are made of the same material, one end of the thermal bridge 140 may be welded to the heat conducting substrate 110 through a welding material, and the other end of the thermal bridge 140 may be locked to the heat sink 130 through a screw, preferably, the welding material and the screw may also be made of the same material as the heat conducting substrate 110, so as to further improve the heat dissipation capability, and thus, the heat generated by the front window surface of the spatial light modulator is transferred to the heat sink 130, so that the subsequent heat is dissipated through the heat sink 130. The junction of the thermal bridge 140 and the heat conductive substrate 110, and the junction of the thermal bridge 140 and the heat sink 130 may be coated or added with an interface material, such as a thermal conductive paste, a thermal conductive pad, a graphite sheet, or graphene, to reduce the thermal resistance of the junction.

The heat dissipation assembly 100 further includes a mounting protrusion 150, and the mounting protrusion 150 is disposed on a side of the heat conductive substrate 110 facing the heat sink 130 and is used for mounting the spatial light modulator. The mounting bumps 150 protruding from the thermal substrate 110 and surrounding the light transmissive holes 116 may be used for mounting the spatial light modulator. In this embodiment, the mounting protrusion 150 may be integrally formed with the heat conducting substrate 110, that is, the material of the mounting protrusion 150 is the same as the material of the heat conducting substrate 110, and is also red copper C1100. In other embodiments, the mounting protrusion 150 may also be adhered to the heat conductive substrate 110.

In the course of research, the inventors found that the inevitable through holes and threaded holes on the heat conducting substrate 110 increase the conductive thermal resistance of the heat conducting substrate 110, and for this reason, the heat pipe 160 is also added to the heat dissipating assembly 100.

Referring to fig. 2 and 3, the heat pipe 160 is embedded in the heat conductive substrate 110 and connected to the heat sink 120 to transfer heat to the heat sink 120, and then the heat is dissipated through the heat sink 120. The first heat conduction path R1 is from the front window to the heat sink 120 through the heat conduction substrate 110 and the heat pipe 160 embedded in the heat conduction substrate 110. The heat pipe 160 not only can achieve the function of heat conduction, but also can achieve the function of heat equalization of the heat conducting substrate 110 due to the heat pipe 160 being embedded in the heat conducting substrate 110, that is, the heat can be uniformly dissipated around the heat pipe 160, and the heat can be prevented from accumulating on the heat conducting substrate 110. The heat pipe 160 can improve the heat conduction performance of the heat dissipation assembly 100 to well cope with the problems of heat defocusing, pixel separation and the like. The heat pipe 160 may also be soldered to the heat conductive substrate 110, and the heat conductive substrate 110 may serve to strengthen the structure of the heat pipe 160 embedded and soldered in the heat conductive substrate 110. Specifically, the heat pipe 160 may be flattened and then welded in the sinking groove of the heat conducting substrate 110, and the heat pipe 160 is not easily failed due to the structural reinforcement of the heat conducting substrate 110. In this embodiment, the material of the heat pipe 160 may be copper or aluminum. In other embodiments, the material of the heat pipe 160 may also be a composite high thermal conductive material such as graphene. In the present embodiment, the number of the heat pipes 160 is two. In other embodiments, the number, length and thickness of the heat pipes 160 may be set according to the heat dissipation requirement and spatial limitation of the spatial light modulator.

The heat pipe 160 includes an evaporation end 162 and a condensation end 164 opposite to each other, the evaporation end 162 is connected to the mounting protrusion 150, and the condensation end 164 is connected to the heat sink 120, so that the heat pipe 160 can transfer heat generated by the spatial light modulator mounted on the mounting protrusion 150 to the heat sink 120 and then radiate the heat via the heat sink 120.

Referring to fig. 5, the heat dissipation assembly 100 may further include a waste light heat sink 170, wherein the waste light heat sink 170 is connected to the heat conductive substrate 110 and is used for receiving waste light and stray light, and reducing pixel separation, defocusing and thermal deformation caused by the stray light or the waste light, wherein the waste light and the stray light mainly originate from the prism assembly during the light combination and splitting processes. Specifically, the waste light radiator 170 is arranged in this embodiment to absorb and radiate the waste light and the stray light, so as to avoid the phenomena that the waste light and the stray light directly irradiate the glue or the bonding surface and the structural member with the adjusting and positioning functions, so that the glue or the bonding surface fails to work, and the glue or the bonding surface falls off or the positioning fails. For example, when the waste light heat sink 170 is fixed to another optical element by glue, if the waste light is directly incident on the glue, the glue absorbs heat and softens, which may cause the waste light heat sink 170 to fall off.

Referring to fig. 6, the waste heat sink 170 includes a waste heat conduction substrate 172, a waste heat conduction pipe 174, and a waste heat sink 176, the waste heat conduction pipe 174 and the waste heat sink 176 are mounted on the waste heat conduction substrate 172, and the waste heat conduction pipe 174 transfers heat generated by the received waste heat to the waste heat sink 176.

The material of the waste light heat conduction substrate 172 may be the same as that of the heat conduction substrate 110, that is, red copper C1100 may be used. The waste heat conducting substrate 172 may be set to have different sizes according to the spatial structure of the spatial light modulator.

Specifically, the waste heat transfer pipe 174 includes opposite heat conductive evaporation end 1741 and heat conductive condensation end 1743, and the heat conductive evaporation end 1741 is configured to receive waste heat, as an example, with an area of 15 × 15mm ² The light energy distribution of the waste light that can be received is 25w. A thermally conductive condensation end 1743 is connected to the waste heat sink 176 for transferring heat generated by the waste light received by the thermally conductive evaporation end 1741 to the waste heat sink 176. Waste heat transfer pipe 174 and heatThe tube 160 may be of the same material, i.e., copper or aluminum.

The waste heat sink 176 may also be made of Al6063-T5, which is a common aluminum alloy, to improve the turbulence effect. The specific number and size of the waste heat sinks 176 may be set according to actual heat dissipation requirements. By using the waste heat sink 176 in conjunction with the heat sink 120, the spatial light modulator can be guaranteed to work within the thermal specification of the spatial light modulator no matter whether it is in the OFF state or the ON state, i.e., the spatial light modulator can meet the temperature control specification.

Referring to fig. 5 and fig. 6, in the present embodiment, the heat dissipation assembly 100 may further include a thermal insulation portion 180, and the thermal insulation portion 180 may increase thermal resistance, so as to prevent heat generated by waste light or stray light from being conducted to the spatial light modulator to cause heat accumulation on the spatial light modulator, thereby prolonging the service life of the spatial light modulator. The heat insulating part 180 may be formed of a plurality of heat insulating through holes and/or heat insulating grooves, and the plurality of heat insulating through holes may form a heat insulating band with the heat insulating grooves to prevent heat generated by waste light or stray light from being conducted to the spatial light modulator. Specifically, the heat insulating part 180 is located between the waste heat transferring pipe 174 and the heat pipe 160, and prevents heat generated by the waste heat from being transferred to the heat pipe 160 through the waste heat transferring pipe 174, thereby being transferred to the spatial light modulator adjacent to the heat pipe 160. The heat insulating part 180 is located between the waste heat sink 176 and the heat sink 120. The heat generated by the waste light is prevented from being transferred to the heat sink 120 through the waste light heat sink 176, increasing the heat dissipation burden of the heat sink 120 and reducing the heat dissipation efficiency of the heat sink 120.

Referring to fig. 2, fig. 3 and fig. 5, in the present embodiment, the heat dissipation assembly 100 may further include an extinction layer 190, and the extinction layer 190 is disposed on the surface of the mounting back 114 and the heat sink 120. By arranging the extinction layer 190, the light absorption performance and the heat radiation performance of the heat conduction substrate 110 and the heat sink 120 can be improved, so that the waste light or the stray light can be better absorbed, and the heat generated by the waste light or the stray light can be radiated out, that is, the light absorption efficiency of the heat conduction substrate 110 is improved, and the heat radiation efficiency of the heat sink 120 is improved. In other embodiments, a light extinction layer 190 may also be disposed on the waste heat sink 176. In this embodiment, the matte layer 190 may be St.Asia LB650-031.

To sum up, the heat dissipation assembly 100 provided in the embodiment of the present invention is configured to dissipate heat of the spatial light modulator, and the gap G1 is provided between the heat conducting substrate 110 and the front window surface of the spatial light modulator, so that heat on the heat conducting substrate 110 that receives stray light and useless light cannot be transferred to the front window surface of the spatial light modulator, and heat generated by the spatial light modulator can be transferred to the heat sink 120 from the front window surface through the heat conducting substrate 110, so that the heat dissipation efficiency of the heat dissipation assembly 100 on the spatial light modulator is improved, and the service life of the spatial light modulator is prolonged.

Referring to fig. 7, the embodiment of the invention further provides a heat dissipation apparatus 10, where the heat dissipation apparatus 10 is adapted to dissipate heat of an optical system, the optical system includes a plurality of spatial light modulators, and each spatial light modulator is mounted on a corresponding heat dissipation assembly 100. In this embodiment, the plurality of spatial light modulators may include three spatial light modulators, such as a red spatial light modulator, a green spatial light modulator, and a blue spatial light modulator, and the three spatial light modulators use spatial light combination. In this other embodiment, the three spatial light modulators may combine spatial light combination and time-sequence light combination, for example, one spatial light modulator uses time-sequence light combination, and the other two spatial light modulators use spatial light combination, or two spatial light modulators use time-sequence light combination, and the other spatial light modulator uses spatial light combination.

The heat dissipation device 10 includes a plurality of heat dissipation assemblies 100, the plurality of heat dissipation assemblies 100 being spaced apart from one another and adapted to be applied to the plurality of spatial light modulators in a one-to-one correspondence to dissipate heat from the respective spatial light modulators.

In this embodiment, the plurality of heat dissipation assemblies 100 includes a first slm heat dissipation assembly 200, a second slm heat dissipation assembly 300, and a third slm heat dissipation assembly 400.

The first slm heat sink 200 may have the same structure as the heat sink 100, and in this embodiment, may be a red slm heat sink, that is, is applied to a red slm to dissipate heat to the red slm. The specific structure of the first spatial light modulator heat sink assembly 200 can be referred to fig. 2.

Referring to fig. 8, the second slm heat sink 300 may be a green slm heat sink, that is, applied to and dissipates heat to a green slm. The second slm heat dissipation assembly 300 includes a heat conductive substrate 310, a heat sink 320, a heat pipe 360, a waste heat sink 370 and a heat insulation portion 380, wherein the heat sink 320 is mounted on the heat conductive substrate 310, the heat pipe 360 can be embedded and welded on the heat conductive substrate 310, the waste heat sink 370 is connected to one side of the heat conductive substrate 310 and spaced apart from the heat sink 320 by the heat insulation portion 380, and the heat insulation portion 380 is disposed on the heat sink 320 and the waste heat sink 370. The insulation portion 380 includes both a plurality of insulation through holes 382 and an insulation groove 384, and the plurality of insulation through holes 382 are substantially aligned. The thermal isolation groove 384 extends in a direction corresponding to a straight line formed by the plurality of thermal isolation through holes 382, thereby forming a thermal isolation band with the plurality of thermal isolation through holes 382 and the thermal isolation groove 384 to prevent heat from being conducted to the spatial light modulator.

Referring to fig. 9, the third slm heat sink assembly 400 may be a blue slm heat sink assembly, i.e., applied to and dissipating heat from a blue slm. The third spatial light modulator heat sink assembly 400 includes a thermally conductive substrate 410, a heat sink 420, a thermal bridge 440, and a heat pipe 460. The heat sink 420 is mounted on the heat conductive substrate 410, the thermal bridge 440 may be soldered to the heat conductive substrate 410, and the heat pipe 460 may be embedded in and soldered to the heat conductive substrate 410.

It should be noted that each heat sink assembly 100 can also be applied to other color spatial light modulators. For example, the first spatial light modulator heat sink assembly 200 may be applied to a green spatial light modulator or a blue spatial light modulator. The second slm heat sink assembly 300 may be applied to either the red slm or the blue slm. The third slm heat sink assembly 400 may be applied to either the red slm or the green slm.

In other embodiments, under the condition that the temperature control specification of the spatial light modulator is satisfied, the heat sink 120 of one heat dissipation assembly 100 of two adjacent heat dissipation assemblies 100 may be connected to the heat conductive substrate 110 of the other heat dissipation assembly 100, that is, two heat dissipation assemblies 100 share one heat sink 120, so that the number of heat sinks 120 may be reduced, thereby reducing the cost. As an example, the heat sink 120 of the first spatial light modulator heat sink assembly 200 may be connected to the thermally conductive substrate 410 of the third spatial light modulator heat sink assembly 400.

Referring to fig. 7, the heat dissipating device 10 further includes a plurality of fans 500, wherein the fans 500 face the heat dissipating elements 100 to remove heat accumulated by the heat dissipating elements 100. In this embodiment, the fan 500 may be a blower, and the blower has a characteristic of large wind pressure, and is suitable for use in a compact structure. In other embodiments, the fan 500 may also be other products such as a ventilator.

The plurality of fans 500 includes a first fan 510, a second fan 520, a third fan 530 and a fourth fan 540,

the first fan 510 and the second fan 520 face the first spatial light modulator heat sink assembly 200 for taking away heat from the thermally conductive substrate 110, the heat spreader 120, the heat sink 130, and the waste heat spreader 170 of the first spatial light modulator heat sink assembly 200. Specifically, the first fan 510 may face the waste heat sink 170 of the first spatial light modulator heat sink assembly 200 and the second fan 520 may face the thermally conductive substrate 110, heat sink 120, and heat sink 130 of the red spatial light modulator heat sink assembly 100.

The second fan 520 faces the first spatial light modulator heat sink assembly 200 and the second spatial light modulator heat sink assembly 300 for taking away heat from the heat conducting substrate 110, the heat spreader 120 and the heat sink 130 of the first spatial light modulator heat sink assembly 200 and heat from the heat conducting substrate 310 and the heat spreader 320 of the second spatial light modulator heat sink assembly 300. Specifically, the second fan 520 may also face the heat conducting substrate 310 and the heat sink 320 of the second spatial light modulator heat sink assembly 300.

The third fan 530 faces the second spatial light modulator heat sink assembly 300 and the third spatial light modulator heat sink assembly 400 for taking away heat on the heat conductive substrate 310 and the heat sink 320 of the second spatial light modulator heat sink assembly 300 and heat on the heat conductive substrate 410 and the heat sink 420 of the third spatial light modulator heat sink assembly 400. Specifically, the third fan 530 faces the heat-conducting substrate 310 and the heat sink 320 of the second spatial light modulator heat sink assembly 300, and faces the heat-conducting substrate 410 and the heat sink 420 of the third spatial light modulator heat sink assembly 400.

The fourth fan 540 faces the third spatial light modulator heat sink assembly 400. For carrying away heat from the thermally conductive substrate 410 and heat sink 420 of the third spatial light modulator heat sink assembly 400. Specifically, the fourth fan 540 is directed towards the heat conducting substrate 110 and the heat sink 120 of the blue spatial light modulator heat sink assembly 100.

In summary, the heat dissipation device 10 provided in the embodiment of the present invention includes a plurality of heat dissipation assemblies 100, so that the improvement of the heat dissipation efficiency of the heat dissipation assemblies 100 can improve the heat dissipation efficiency of the heat dissipation device 10. In addition, the first spatial light modulator heat dissipation assembly 200 is used for dissipating heat of the red spatial light modulator, the second spatial light modulator heat dissipation assembly 300 is used for dissipating heat of the green spatial light modulator, and the third spatial light modulator heat dissipation assembly 400 is used for dissipating heat of the blue spatial light modulator, so that the heat dissipation assemblies 100 with different structures can be arranged on different spatial light modulators, that is, the structures of the heat dissipation assemblies 100 can be set according to actual heat dissipation requirements, redundancy of devices (such as setting of the waste light heat sink 170) cannot be caused, and the adaptive performance is good.

Referring to fig. 10 and fig. 11, an embodiment of the invention further provides a projection apparatus 1, which includes a light source device (not shown), a heat sink 10, a housing 20, and a plurality of spatial light modulators 30. The light source device is used for emitting illumination light, the heat dissipation device 10 and the plurality of spatial light modulators 30 are both installed inside the housing 20, the spatial light modulators 30 modulate the illumination light emitted by the light source device and reflect image light, and generate heat at the same time, and the heat dissipation device 10 can absorb heat generated by the plurality of spatial light modulators 30 and heat generated by useless light generated by other optical elements in the projection apparatus 1 during the process of combining and splitting light.

Referring to fig. 10, the housing 20 is provided with a plurality of air inlets 21, a plurality of air outlets 23, and an air duct 25 located between the air inlets 21 and the air outlets 23, wherein each of the plurality of air inlets 21 may be provided with a fan to draw external air into the housing 20. The air flow entering the casing 20 flows to the heat dissipation device 10 through the air duct 25, takes away the heat on the heat dissipation device 10, and finally the air flow carries the heat taken away from the heat dissipation device 10 and the heat dissipated by the other optical elements to flow out from the air outlet 23, so that the heat dissipation of the heat dissipation device 10 is realized, and the service life of the projection apparatus 1 is prolonged.

Referring to fig. 2, 4 and 11, the plurality of spatial light modulators 30 correspond to the plurality of heat dissipation assemblies 100 one to one, each spatial light modulator 30 is installed between the heat conductive substrate 110 and the heat sink 130 of the corresponding heat dissipation assembly 100, specifically, the front window of the spatial light modulator 30 is connected to the heat conductive substrate 110, and the back of the spatial light modulator 30 is connected to the heat sink 130, so that the heat generated by the front window of the spatial light modulator 30 can be transferred to the heat sink 120 through the heat conductive substrate 110 for heat dissipation, that is, the heat is conducted and dissipated along the first heat conduction path R1. The heat generated by the front window surface of the spatial light modulator 30 may also be transferred to the heat sink 130 via the heat conductive substrate 110 and the thermal bridge 140 and dissipated, i.e., conducted along the third heat conduction path R3. The heat generated at the back of the spatial light modulator 30 may be directly transferred to the heat sink 130 and dissipated, i.e., conducted along the second thermal conduction path R2. That is, the heat generated by the spatial light modulator 30 has multiple heat conduction paths, so that the heat dissipation efficiency of the heat dissipation assembly 100 and the heat dissipation device 10 for the spatial light modulator 30 is improved, and the service life of the projection apparatus 1 is prolonged.

In the present embodiment, the plurality of spatial light modulators 30 includes a red spatial light modulator 31, a green spatial light modulator 32, and a blue spatial light modulator 33. Wherein the red spatial light modulator 31 is adapted to the first spatial light modulator heat sink 200 (red spatial light modulator heat sink); green spatial light modulator 32 is fitted with a second spatial light modulator heat sink 300 (green spatial light modulator heat sink); the blue spatial light modulator 33 is fitted with a third spatial light modulator heat sink assembly 400 (blue spatial light modulator heat sink assembly).

Referring to fig. 11 and 12, the projection apparatus 1 further includes a prism assembly 40, and the prism assembly 40 is installed in the housing 20. When the incident light enters the different spatial light modulators 30 through the prism assembly 40, respectively, useless light and stray light are generated in the light splitting and combining processes, and the part of the light can be received by the useless light radiator 170 disposed at the corresponding position, so that pixel separation, defocusing and thermal deformation caused by the stray light or the useless light are reduced, and the contrast of the projection apparatus 1 is improved.

Referring to fig. 1, 6 and 12, the prism assembly 40 includes a reflection prism 41 (i.e., a PHILIPS prism) and a plurality of light splitting prisms 42 (i.e., TIR prisms), the reflection prism 41 is used for reflecting incident light to the light splitting prisms 42 and emitting the light modulated by the spatial light modulator to a subsequent light path; the beam splitting prisms 42 are used to split the incident light into monochromatic light to be incident to the plurality of spatial light modulators 30, respectively, that is, the plurality of beam splitting prisms 42 are in one-to-one correspondence with the plurality of spatial light modulators 30. The illumination light is reflected to the light splitting prisms 42 after being totally reflected by the reflecting prisms 41, is split by the light splitting prisms 42 and then enters the corresponding spatial light modulator 30, and the light modulated and reflected by the spatial light modulator 30 is transmitted to the reflecting prisms 41 through the light splitting prisms 42 respectively, and at this time, because the angle of the light entering the reflecting prisms 41 does not meet the total internal reflection angle, the part of the light is transmitted by the reflecting prisms 41 and then exits to a subsequent light path. For example, the plurality of beam splitting prisms 42 include a red beam splitting prism 421, a green beam splitting prism 422, and a blue beam splitting prism 423, the reflection prism 41 includes a red beam splitting prism, a green beam splitting prism, and a blue beam splitting prism, an incident surface of the red beam splitting prism 421 contacting the blue beam splitting prism 423 is coated with a red-green-blue filter, an incident surface of the green beam splitting prism 422 contacting the red beam splitting prism 421 is coated with a green-red filter, wherein the red beam splitting prism 421 faces the red spatial light modulator 31, the green beam splitting prism 422 faces the green spatial light modulator 32, the blue beam splitting prism 423 faces the blue spatial light modulator 33, the illumination light emitted by the illumination device is incident to the blue beam splitting prism 423 through the total reflection of the reflection prism 41, the light is transmitted by the blue beam splitting prism 423 and then irradiates to the incident surface of the red beam splitting prism and the blue beam splitting prism, because the incident surface of the red light splitting prism 421 contacting the blue light splitting prism 423 is coated with the red-green-blue light filter, the light is split into a blue light part and a red-green light part, the blue light part is reflected to the blue spatial light modulator for blue light modulation, the red-green light part transmits the red light splitting prism 421 and is incident on the incident surface of the green light splitting prism 422, and because the incident surface of the green light splitting prism 422 contacting the red light splitting prism 421 is coated with the green-red light filter, the red light in the red-green light is reflected to the red spatial light modulator 31, the green light is transmitted to the green spatial light modulator 32, the red, green and blue light is respectively modulated and then reflected to the reflecting prism 41, and because the incident angle of the light does not satisfy the total reflection angle, the red, green and blue light can be transmitted to the subsequent light path. In the present embodiment, the Reflection prism 41 is a TIR (Total Internal Reflection) prism, and the prism beam splitter prism 42 is a PHILIPS prism.

The reflection prism 41 may be installed between the heat conductive substrate 110 and the waste heat conductive substrate 172 such that the light absorption side of the heat sink 120 is parallel to the surface of the reflection prism 41, while a structural safety assembly interval needs to be reserved. Specifically, the heat conducting substrate 110 and the waste heat conducting substrate 172 may be mounted by being locked to a carrier (not shown) of the reflection prism 41 by screws.

Referring to fig. 4, 13 and 14, in the present embodiment, when the red spatial light modulator 31 is in the ON state, the light energy distribution ON the red beam splitter prism 421 is 27.5w, and the heat generated by the waste light in the ON state is transferred to the heat sink 120 and the heat sink 130. When the red spatial light modulator 31 is in the OFF state, the light energy distribution on the red beam splitter prism 421 is 8.2w. The heat generated by the waste light in the OFF state is transferred to the waste heat sink 176.

Referring to fig. 8, 15 and 16, when the green spatial light modulator 32 is in the ON state, the light energy distribution ON the green beam splitter prism 422 is 12.5w, and the heat generated by the waste light in the ON state is transferred to the heat sink 320. When the green spatial light modulator 32 is in the OFF state, the light energy distribution on the green beam splitter prism 422 is 7.6w. The heat generated from the waste light in the OFF state is transferred to the waste heat sink 370. Since the light energy distribution ON the green beam splitter prism 422 is smaller than the light energy distribution ON the red beam splitter prism 421 whether in the ON state or the OFF state, the heat dissipation condition of the green spatial light modulator 32 is better than that of the red spatial light modulator 31, and the risk of heat accumulation ON the green spatial light modulator 32, that is, the risk of pixel separation, thermal defocus, is smaller.

Referring to fig. 9, 17 and 18, when the blue spatial light modulator 33 is in the ON state, the light energy distribution ON the blue beam splitter prism 423 is 1.4w, and the heat generated by the waste light in the ON state is transferred to the heat sink 420. When the blue spatial light modulator 33 is in the OFF state, the light energy distribution on the blue beam splitting prism 423 is 0.9w, and therefore, the heat generated by the waste light is negligible, that is, the heat dissipation treatment is not needed. The light energy distribution on the blue splitting prism 423 is minimized, and thus the risk of heat accumulation of the blue spatial light modulator 33, that is, the risk of pixel separation, thermal defocusing is minimized.

Referring to fig. 19, the projection apparatus 1 further includes a prism top heat sink 50 and a prism side heat sink 60, wherein the prism top heat sink 50 and the prism side heat sink 60 are installed in the housing 20. The prism top surface heat sink 50 is connected to the top surface of the reflection prism 41 in a manner of bonding/gluing through a thermal interface material, and is used for supplementing heat dissipation to the reflection prism 41 in a narrow space. In this embodiment, the first fan 510, the second fan 520, the third fan 530 and the fourth fan 540 can take away heat from the prism top heat sink 50. At least one of the plurality of dichroic prisms 42 is coupled to a prism side heat sink 60. In this embodiment, the prism side heat sink 60 is connected to the blue splitting prism 423, the connection may be by thermal interface material bonding/gluing for additional heat dissipation to the blue beam splitter prism 423 in small spaces. The prism side heat sink 60 faces the fourth fan 540 so that the fourth fan 540 can take away heat of the prism side heat sink 60.

In the present embodiment, the projection apparatus 1 further includes an OFF light sink 70, and the OFF light sink 70 is configured to receive the waste light generated by the spatial light modulator 30 in the OFF state and generate heat to the waste light.

In summary, the projection apparatus 1 provided in the embodiment of the present invention includes the heat dissipation device 10, the housing 20, the plurality of spatial light modulators 30, and the light source device, so that the improvement of the heat dissipation efficiency of the heat dissipation device 10 can prolong the service lives of the plurality of spatial light modulators 30 in the projection apparatus 1, that is, the service life of the projection apparatus 1 is prolonged. By providing the gap G1 between the heat conducting substrate 110 and the front window surface of the spatial light modulator 30, the heat on the heat conducting substrate 110 that receives the stray light and the waste light cannot be transferred to the front window surface of the spatial light modulator 30, and the service lives of the plurality of spatial light modulators 30 in the projection apparatus 1 are further prolonged, that is, the service life of the projection apparatus 1 is prolonged. The waste light heat sink 170 of the heat dissipation assembly 100, which receives the waste light and the stray light generated by the prism assembly 40 splitting and combining the light, can reduce pixel separation, defocus, and thermal deformation caused by the stray light or the waste light, and thus can improve the contrast of the projection apparatus 1.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the temperature of the molten metal is controlled, the protection scope of the present invention should be subject to the appended claims.

Claims (15)

1. A heat removal assembly for removing heat from a spatial light modulator, the spatial light modulator comprising opposing front and back faces, the heat removal assembly comprising:

the heat conduction substrate is provided with a gap with the front window surface and used for dissipating heat of the front window surface; and

a heat sink mounted to the thermally conductive substrate, the heat generated by the spatial light modulator being transferred from the front window surface to the heat sink via the thermally conductive substrate.

2. The heat dissipation assembly of claim 1, further comprising a heat sink attachable to the back surface and a thermal bridge attached between the thermally conductive substrate and the heat sink for transferring heat generated by the spatial light modulator from the front window surface through the thermally conductive substrate and the thermal bridge to the heat sink.

3. The heat dissipation assembly of claim 1, further comprising a heat pipe embedded in the thermally conductive substrate and connected to the heat sink.

4. The heat dissipation assembly of claim 3, wherein the heat pipe comprises an evaporation end and a condensation end that are opposite to each other, the heat dissipation assembly further comprises a mounting protrusion disposed on the heat conductive substrate and configured to mount the spatial light modulator, the evaporation end is connected to the mounting protrusion, and the condensation end is connected to the heat sink.

5. The heat dissipation assembly of claim 1, further comprising a waste heat sink coupled to the thermally conductive substrate for receiving waste light.

6. The heat sink assembly of claim 5, wherein the waste heat sink comprises a waste heat conducting substrate, a waste heat conducting pipe and a waste heat sink, the waste heat conducting pipe and the waste heat sink being mounted to the waste heat conducting substrate, the waste heat conducting pipe comprising opposing heat conducting evaporation ends for receiving waste heat and heat conducting condensation ends connected to the waste heat sink.

7. A heat dissipation assembly as recited in claim 6, further comprising a thermal insulation between the waste heat sink and the heat sink, and between the waste heat transfer heat pipe and the heat pipe.

8. The heat dissipation assembly of claim 1, wherein the gap is 0.2mm to 1mm in size.

9. The heat dissipation assembly of any of claims 1-8, wherein the thermally conductive substrate comprises opposing mounting and mounting back surfaces, the mounting surface and the front window surface having the gap therebetween, the heat dissipation assembly further comprising an antiglare layer disposed on the mounting back surface and a surface of the heat spreader.

10. A heat sink adapted to dissipate heat from an optical system, the optical system including a plurality of spatial light modulators, the heat sink comprising a plurality of heat dissipating components according to any one of claims 1 to 9, the plurality of heat dissipating components being spaced apart from one another and adapted to be applied to the plurality of spatial light modulators in a one-to-one correspondence, each of the spatial light modulators being mounted to a corresponding one of the heat dissipating components.

11. The heat sink of claim 10, further comprising a plurality of fans directed toward a plurality of said heat dissipating components.

12. The heat dissipating device of claim 11, wherein the plurality of heat dissipating components comprise a first slm heat dissipating component, a second slm heat dissipating component, and a third slm heat dissipating component, and the plurality of fans comprise a first fan, a second fan, a third fan, and a fourth fan, the first fan and the second fan face the first slm heat dissipating component, the second fan faces the first slm heat dissipating component and the second slm heat dissipating component, the third fan faces the second slm heat dissipating component and the third slm heat dissipating component, and the fourth fan faces the third slm heat dissipating component.

13. A projection device, comprising:

a light source device for emitting illumination light;

a housing;

the heat dissipating device of any of claims 10 to 12; and

the plurality of spatial light modulators modulate the illuminating light and generate heat, the spatial light modulators correspond to the plurality of heat dissipation assemblies one by one, each spatial light modulator is installed on the corresponding heat dissipation assembly, and the heat dissipation device absorbs the heat generated by the plurality of spatial light modulators.

14. The projection apparatus of claim 13, further comprising a prism assembly mounted in the housing, the prism assembly comprising a plurality of beam splitting prisms and a reflective prism, the plurality of beam splitting prisms being in one-to-one correspondence with the plurality of spatial light modulators.

15. The projection device of claim 14, further comprising a prism top heat sink and a prism side heat sink, the prism top heat sink and the prism side heat sink being mounted within the housing, the prism top heat sink being coupled to the beam splitting prism, at least one of the plurality of reflective prisms being coupled to the prism side heat sink.

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