CN115142064B - Ink jet printing type etching method and ink jet printer with etching function - Google Patents
Ink jet printing type etching method and ink jet printer with etching function Download PDFInfo
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- CN115142064B CN115142064B CN202210599922.3A CN202210599922A CN115142064B CN 115142064 B CN115142064 B CN 115142064B CN 202210599922 A CN202210599922 A CN 202210599922A CN 115142064 B CN115142064 B CN 115142064B
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- 238000005530 etching Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000007641 inkjet printing Methods 0.000 title claims abstract description 21
- 239000002904 solvent Substances 0.000 claims abstract description 52
- 238000005507 spraying Methods 0.000 claims abstract description 44
- 239000000654 additive Substances 0.000 claims abstract description 22
- 230000000996 additive effect Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 238000003384 imaging method Methods 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 38
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 27
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 15
- 150000003839 salts Chemical class 0.000 claims description 13
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims description 12
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 12
- 150000002978 peroxides Chemical class 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 11
- -1 ether compound Chemical class 0.000 claims description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000011593 sulfur Substances 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 claims description 6
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 6
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 6
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 3
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- ZKQDCIXGCQPQNV-UHFFFAOYSA-N Calcium hypochlorite Chemical compound [Ca+2].Cl[O-].Cl[O-] ZKQDCIXGCQPQNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004343 Calcium peroxide Substances 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 3
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- LHJQIRIGXXHNLA-UHFFFAOYSA-N calcium peroxide Chemical compound [Ca+2].[O-][O-] LHJQIRIGXXHNLA-UHFFFAOYSA-N 0.000 claims description 3
- 235000019402 calcium peroxide Nutrition 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 3
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 claims description 3
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 3
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 3
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims description 3
- 229910000360 iron(III) sulfate Inorganic materials 0.000 claims description 3
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 150000001451 organic peroxides Chemical class 0.000 claims description 3
- 150000008116 organic polysulfides Chemical class 0.000 claims description 3
- 239000005077 polysulfide Substances 0.000 claims description 3
- 229920001021 polysulfide Polymers 0.000 claims description 3
- 150000008117 polysulfides Polymers 0.000 claims description 3
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001487 potassium perchlorate Inorganic materials 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 3
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 claims description 3
- 229910001488 sodium perchlorate Inorganic materials 0.000 claims description 3
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 claims description 3
- 150000005846 sugar alcohols Polymers 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 238000007639 printing Methods 0.000 description 23
- 238000007650 screen-printing Methods 0.000 description 13
- 238000005406 washing Methods 0.000 description 7
- 239000002699 waste material Substances 0.000 description 5
- 238000007790 scraping Methods 0.000 description 4
- 238000007792 addition Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses an ink-jet printing type etching method and an ink-jet printer with an etching function, wherein the etching method comprises the following steps: a substrate providing step: providing a substrate comprising a metallic material having a surface to be etched; and (3) a solvent spraying step: a first spraying step of spraying solvent droplets onto a surface to be etched in an imaging pattern by an inkjet printer, an etchant spraying step: ejecting droplets of an etchant in an imaged pattern toward a surface to be etched by a second ejection of an inkjet printer to mix with a solvent and chemically react to form an etched pattern on the surface to be etched; or the etchant spraying step, the solvent spraying step, and further comprising an additive spraying step: the additive droplets are ejected in an imagewise pattern toward a mixture of etchant and solvent where the chemical reaction is incomplete by a third ejection of the inkjet printer. The invention has the advantages of simplified process, reduced time consumption and reduced cost.
Description
The present application is a divisional application of the invention patent application with application number 201911194760.X, filed on the 11 th and 28 th 2019, entitled "etching method using inkjet printing" and an inkjet printer for the etching method.
Technical Field
The invention relates to the technical field of etching, in particular to an inkjet printing type etching method and an inkjet printer with an etching function.
Background
At present, the etching of metal materials is generally realized by adopting a silk screen etching mode combining silk screen printing and metal etching, wherein the silk screen printing is to use a silk screen as a plate base, and a silk screen printing plate with pictures and texts is manufactured by a photosensitive plate making method. The screen printing consists of five major elements, namely a screen printing plate, a scraping plate, ink, a printing table and a printing stock, and is performed by utilizing the basic principle that the mesh of the image-text part of the screen printing plate can be penetrated by the ink and the mesh of the non-image-text part can not be penetrated by the ink. When in printing, ink is poured into one end of the screen printing plate, a certain pressure is applied to the ink part on the screen printing plate by the scraping plate, meanwhile, the ink moves at a constant speed towards the other end of the screen printing plate, and the ink is extruded onto a printing stock from the mesh of the image-text part by the scraping plate in the moving process. The screen printing belongs to orifice plate printing, and during printing, ink is transferred to a printing stock through meshes of an image-text part by extruding of a scraping plate, so that an image-text identical to an original document is formed, and the screen printing has the advantages of simple equipment, convenience in operation, easiness in printing and plate making, low cost, high adaptability and the like.
The metal etching is carried out after the pattern to be etched is formed on the printing stock made of the metal material through screen printing, and the surface impurities of the metal material can be removed only through two washing procedures of acid liquor and screen washing water after the metal etching, so that the procedures are time-consuming, the waste liquid generated in the washing procedures can pollute the environment if being directly discharged, and the extra cost is increased because the waste liquid needs to be neutralized by alkali if the waste liquid is purified, and the manpower and material resources are wasted.
Therefore, there is a need to provide an inkjet printing etching method and an inkjet printer having an etching function, which have simplified processes, reduced time consumption, and reduced cost.
Disclosure of Invention
In order to achieve one object of the present invention, the present invention provides an inkjet printing etching method, comprising the steps of: a substrate providing step: providing a substrate comprising a metallic material having a surface to be etched; and (3) a solvent spraying step: a first spraying step of spraying solvent droplets onto a surface to be etched in an imaging pattern by an inkjet printer, an etchant spraying step: ejecting droplets of an etchant in an imaged pattern toward a surface to be etched by a second ejection of an inkjet printer to mix with a solvent and chemically react to form an etched pattern on the surface to be etched; alternatively, the etchant spraying step: ejecting droplets of an etchant in an imaged pattern onto a surface to be etched by a first ejection of an inkjet printer; and (3) a solvent spraying step: ejecting droplets of a solvent in an imaged pattern toward a surface to be etched by a second ejection of an inkjet printer to mix with and chemically react with an etchant to form an etched pattern on the surface to be etched; and an additive spraying step: the additive droplets are ejected in an imagewise pattern toward a mixture of etchant and solvent where the chemical reaction is incomplete by a third ejection of the inkjet printer.
Further, the etchant includes one or more of the following: hypochlorous acid or/and hypochlorite, permanganic acid or/and permanganate, perchloric acid or/and perchlorate, dichromic acid or/and dichromate, cupric salt, ferric salt, peroxide or/and mixture of peroxide and acid, and the acid is inorganic acid or/and organic acid, mixture of peroxide and complexing agent, sulfur simple substance comprising nano sulfur dispersion and solution of sulfur, polysulfide comprising inorganic and organic polysulfide.
Further, hypochlorite includes sodium hypochlorite, calcium hypochlorite or potassium hypochlorite, permanganate includes potassium permanganate, perchlorate includes sodium perchlorate or potassium perchlorate, dichromate includes potassium dichromate, cupric salt includes copper acetate, copper nitrate or copper sulfate, ferric salt includes ferric nitrate, ferric chloride or ferric sulfate, and peroxide includes sodium peroxide, hydrogen peroxide, organic peroxide, calcium peroxide or potassium peroxide.
Further, the solvent comprises one or more of monohydric alcohol, dihydric alcohol, polyhydric alcohol, alcohol ether, ether compound, ketone compound and aldehyde compound.
Further, the monohydric alcohol comprises methanol, ethanol or isopropanol, the dihydric alcohol comprises ethylene glycol or propylene glycol, and the alcohol ether comprises ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether or diethylene glycol diethyl ether.
Further, the additive comprises one or more of a surfactant, an antifoaming agent, a pH adjuster, a viscosity adjuster, and a soluble resin.
Further, the etching method further comprises the following steps: a print head moving step: the spray heads for spraying the solvent, the etchant and the additive sequentially move in a direction away from the surface to be etched so as to correspondingly perform second spraying and third spraying.
Further, after the first spray of the spray solvent or the spray etchant has been performed and before the spray solvent or the spray etchant is performed as the second spray, the spray head is moved a distance in a direction away from the surface to be etched, and after the second spray has been performed and before the spray additive is performed as the third spray, the spray head is moved a further distance in a direction away from the surface to be etched.
In order to achieve another object of the present invention, the present invention also provides an inkjet printer having an etching function, which applies any one of the above etching methods, the inkjet printer including a frame for supporting and fixing a substrate, and a controller for controlling ejection of the inkjet printer.
Further, the ink jet printer includes a head for ejecting and a gas-liquid separation film provided adjacent to the head.
The beneficial effects of the invention are as follows: the ink jet printing etching method sprays the solvent and the etchant twice without adopting two washing procedures of acid liquor and screen washing water in the prior art, thereby simplifying the procedures, reducing the time consumption, reducing the cost and being beneficial to environmental protection. The inkjet printer with the etching function can achieve an excellent etching effect by utilizing the advantage of high-resolution printing of the inkjet printer while realizing the etching method.
Drawings
FIG. 1 is a schematic flow chart of an ink jet printing etching method according to the present invention;
FIG. 2 is a schematic flow chart of an ink jet printing etching method according to the present invention;
FIG. 3 is a schematic flow chart corresponding to FIG. 1 with the addition of a solvent spraying step;
fig. 4 is a schematic flow chart corresponding to fig. 2 with the addition of a solvent spraying step.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
Referring to fig. 1 and 2, the present invention provides an etching method using inkjet printing, the etching method comprising the steps of: a substrate providing step S10, a solvent spraying step and an etchant spraying step, wherein in the substrate providing step S10, a substrate including a metal material having a surface to be etched is provided, the metal material may be copper, aluminum, titanium, tungsten, or the like, the substrate may be other materials than the metal material, that is, the metal material is fixed on the substrate, the two are in a split structure, and in addition, the substrate may be integrally formed with the metal material. Compared with the traditional screen printing technology, the ink-jet printing technology has the advantages of simple process, high printing resolution, less material waste and the like. While ink jet printers print images or text by controlling a nozzle to eject ink drops onto a print medium. According to different printing modes, the inkjet printing is divided into two types of scanning printing and one-pass printing, in the scanning printing, a spray head is arranged on a printing trolley, the printing trolley makes reciprocating motion so as to spray ink drops on a printing medium, and the printing medium makes stepping motion. In the one-pass printing, the nozzle is mounted on the printing module, the printing module is fixed, and the nozzle performs ink-jet printing on the printing medium continuously conveyed below. The etching method using ink-jet printing of the present invention uses an ink-jet printer to eject solvent, etchant, and even additive, so that droplets of solvent, etchant, and even additive can be controlled to form the ejection of an imaging pattern with reference to the existing ink-jet printer ejection control method, and will not be described in detail herein. The solvent spraying step and the etchant spraying step may take two different orders, and the solvent and the etchant may be stored in corresponding different cartridges, respectively, and in one embodiment, the solvent spraying step S20 sprays the solvent droplets in an image pattern onto the surface to be etched through a first spray of an inkjet printer, and the etchant spraying step S30 sprays the etchant droplets in an image pattern onto the surface to be etched through a second spray of an inkjet printer to mix and chemically react with the solvent to form an etching pattern on the surface to be etched. In another embodiment, the etchant spraying step S20 sprays the etchant droplets in an imaged pattern onto the surface to be etched by a first spray of an inkjet printer, and the solvent spraying step S30 sprays the solvent droplets in an imaged pattern onto the surface to be etched by a second spray of an inkjet printer to mix and chemically react with the etchant to form an etched pattern on the surface to be etched. It is known that the imaging pattern corresponds to the etching pattern. Therefore, the etching method of the invention uses the ink jet printing to spray the solvent and the etchant in different orders by using the ink jet printing in a high resolution imaging pattern mode, thereby avoiding two washing procedures in the prior art, simplifying the procedures, avoiding the hidden trouble that the waste liquid generated in the washing procedure directly pollutes the environment if being directly discharged.
Preferably, the etchant includes one or more of the following: hypochlorous acid or/and hypochlorite, permanganic acid or/and permanganate, perchloric acid or/and perchlorate, dichromic acid or/and dichromate, cupric salt, ferric salt, peroxide or/and mixture of peroxide and acid, and the acid is inorganic acid or/and organic acid, mixture of peroxide and complexing agent, sulfur simple substance comprising nano sulfur dispersion and solution of sulfur, polysulfide comprising inorganic and organic polysulfide.
Specifically, hypochlorite includes sodium hypochlorite, calcium hypochlorite or potassium hypochlorite, permanganate includes potassium permanganate, perchlorate includes sodium perchlorate or potassium perchlorate, dichromate includes potassium dichromate, cupric salt includes copper acetate, copper nitrate or copper sulfate, ferric salt includes ferric nitrate, ferric chloride or ferric sulfate, and peroxide includes sodium peroxide, hydrogen peroxide, organic peroxide, calcium peroxide or potassium peroxide. In addition, the complexing agent includes ammonium salts, aqueous ammonia, organic amine compounds or EDTA and salts thereof.
Preferably, the solvent comprises one or more of monohydric alcohol, dihydric alcohol, polyhydric alcohol, alcohol ether, ether compound, ketone compound and aldehyde compound.
Specifically, the monohydric alcohol includes methanol, ethanol, or isopropanol, the dihydric alcohol includes ethylene glycol or propylene glycol, and the alcohol ether includes ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether, or diethylene glycol diethyl ether. In addition, the polyol includes glycerin.
Referring further to fig. 3 and 4 in combination, in order to further enhance the etching effect of the mixture of the etchant and the solvent chemically reacting with each other, the etching method using the inkjet printing of the present invention further includes an additive spraying step S40 of spraying the additive droplets in an imaging pattern to the mixture of the etchant and the solvent, in which the chemical reaction is not completed, by a third spray of the inkjet printer. It is understood that the additive spraying step S40 is performed after the solvent spraying step S30 or the etchant spraying step S30, corresponding to a different order of the solvent spraying step and the etchant spraying step.
Preferably, the additive comprises one or more of a surfactant, an antifoaming agent, a pH adjuster, a viscosity adjuster, or a soluble resin.
As a further improvement, the etching method using ink jet printing of the present invention further includes a print head moving step S50 (not shown), in which the spray head for spraying the solvent, the etchant and the additive is sequentially moved in a direction away from the surface to be etched to perform the second spray and the third spray, that is, after the first spray of spraying the solvent or the etchant has been performed and before the spraying of the solvent or the etchant as the second spray is performed, the spray head is moved in a direction away from the surface to be etched by a certain distance, thereby preventing a certain amount of corrosive volatile substances possibly generated by the mixed chemical reaction of the solvent and the etchant from acting on the spray head, and after the second spray and before the spraying of the additive as the third spray is performed, the spray head is further moved in a direction away from the surface to be etched by a certain distance, thereby preventing a relatively large amount of corrosive volatile substances possibly generated by the mixed chemical reaction of the solvent, the etchant and the additive from acting on the spray head, that is known to be generally in a gaseous form, and the various moving distances are kept in the inkjet printer, the solvent and the etchant are well-patterned to protect the spray head from being corroded, especially well within the surface to be etched.
The present invention also provides an inkjet printer for an etching method, which is any one of the above etching methods using inkjet printing, the inkjet printer including a frame for supporting and fixing a substrate, and a controller for controlling the ejection of the inkjet printer, particularly a head, the ejection including first ejection and second ejection or first ejection, second ejection and third ejection, the controller being a CPU, a PLC, or the like, and therefore the inkjet printer has advantages brought by any one of the etching methods, which will not be described herein.
As a further improvement, the ink jet printer includes a head for ejecting two kinds of ejection agents including a solvent and an etchant or ejecting three kinds of ejection agents including a solvent, an etchant and an additive, and a gas-liquid separation film provided adjacent to the print head, the gas-liquid separation film allowing various ejection agents ejected by the head to pass and fall on a surface to be etched but preventing the passage of gaseous corrosive volatile substances such as those described above from acting on the head, and therefore, the head, particularly the piezoelectric element, can be prevented from suffering from corrosive action.
It should be noted that, the duration of each step and the duration of the interval between two steps ensure that the solvent and the etchant or the solvent, the etchant and the additive can be mixed to react to obtain the desired etching effect. The specific type and proportions of the above solvents, etchants, and additives can be determined by one skilled in the art based on the specific metal materials, etched patterns, etc.
For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present invention are not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between steps, or several steps may be performed simultaneously, after appreciating the spirit of the present invention.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (8)
1. An inkjet printing etching method, characterized by: the method comprises the following steps:
a substrate providing step: providing a substrate comprising a metallic material having a surface to be etched;
and (3) a solvent spraying step: an etchant spraying step of spraying droplets of a solvent onto the surface to be etched in an imaged pattern by a first spray of an inkjet printer: ejecting droplets of an etchant in the imaged pattern toward the surface to be etched by a second ejection of the inkjet printer to mix with the solvent and chemically react to form an etched pattern on the surface to be etched; or alternatively
And (3) an etchant spraying step: ejecting droplets of an etchant in an imaged pattern onto the surface to be etched by a first ejection of the inkjet printer; and (3) a solvent spraying step: forming an etching pattern on the surface to be etched by ejecting droplets of a solvent in the imaging pattern toward the surface to be etched by a second ejection of the inkjet printer to mix with and chemically react with the etchant;
and an additive spraying step: droplets of additive are ejected in the imaging pattern by a third ejection of the inkjet printer toward the mixture of the etchant and the solvent where the chemical reaction is incomplete.
2. The etching method according to claim 1, characterized in that:
the etchant includes one or more of the following: hypochlorous acid or/and hypochlorite, permanganic acid or/and permanganate, perchloric acid or/and perchlorate, dichromic acid or/and dichromate, cupric salt, ferric salt, peroxide or/and mixture of peroxide and acid, wherein the acid is inorganic acid or/and organic acid, mixture of peroxide and complexing agent, sulfur simple substance comprising nano sulfur dispersion liquid and solution of sulfur, polysulfide comprising inorganic and organic polysulfide.
3. The etching method according to claim 2, characterized in that:
the hypochlorite includes sodium hypochlorite, calcium hypochlorite or potassium hypochlorite, the permanganate includes potassium permanganate, the perchlorate includes sodium perchlorate or potassium perchlorate, the dichromate includes potassium dichromate, the cupric salt includes copper acetate, copper nitrate or copper sulfate, the ferric salt includes ferric nitrate, ferric chloride or ferric sulfate, and the peroxide includes sodium peroxide, hydrogen peroxide, organic peroxide, calcium peroxide or potassium peroxide.
4. The etching method according to claim 1, characterized in that:
the solvent comprises one or more of monohydric alcohol, dihydric alcohol, polyhydric alcohol, alcohol ether, ether compound, ketone compound and aldehyde compound.
5. The etching method according to claim 4, wherein:
the monohydric alcohol comprises methanol, ethanol or isopropanol, the dihydric alcohol comprises ethylene glycol or propylene glycol, and the alcohol ether comprises ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether or diethylene glycol diethyl ether.
6. The etching method according to claim 1, characterized in that:
the additive comprises one or more of a surfactant, an antifoaming agent, a pH regulator, a viscosity regulator and a soluble resin.
7. An inkjet printer having an etching function, characterized in that: the etching method according to any one of claims 1 to 6, wherein the inkjet printer comprises a frame for supporting and fixing the substrate, and a controller for controlling ejection of the inkjet printer.
8. The inkjet printer of claim 7, wherein:
the inkjet printer includes a head for the ejection and a gas-liquid separation film disposed adjacent to the head.
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| CN202210599922.3A CN115142064B (en) | 2019-11-28 | 2019-11-28 | Ink jet printing type etching method and ink jet printer with etching function |
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| KR20090109642A (en) * | 2008-04-16 | 2009-10-21 | 한국과학기술원 | Ink-jet printing system and the formation method of patterned electrodes using that |
| CN101990705A (en) * | 2008-02-01 | 2011-03-23 | 新南部创新有限公司 | Method for patterned etching of selected material |
| CN105441949A (en) * | 2016-01-26 | 2016-03-30 | 苏州诺菲纳米科技有限公司 | Nano-silver etchant, method for preparing patterned nano-silver conducting film and touch sensor |
| CN110760847B (en) * | 2019-11-28 | 2022-06-17 | 东莞市图创智能制造有限公司 | Etching method using inkjet printing and inkjet printer for the etching method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH042790A (en) * | 1990-04-18 | 1992-01-07 | Seiko Epson Corp | Method for etching silicon substrate |
| WO2011032218A1 (en) * | 2009-09-18 | 2011-03-24 | Newsouth Innovations Pty Limited | Method for texturing surfaces |
| JP6460315B2 (en) * | 2014-03-18 | 2019-01-30 | セイコーエプソン株式会社 | Inkjet discharge method and inkjet printing system |
| CN109164947B (en) * | 2016-01-26 | 2022-05-13 | 苏州诺菲纳米科技有限公司 | Preparation method of touch sensor and touch sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990705A (en) * | 2008-02-01 | 2011-03-23 | 新南部创新有限公司 | Method for patterned etching of selected material |
| KR20090109642A (en) * | 2008-04-16 | 2009-10-21 | 한국과학기술원 | Ink-jet printing system and the formation method of patterned electrodes using that |
| CN105441949A (en) * | 2016-01-26 | 2016-03-30 | 苏州诺菲纳米科技有限公司 | Nano-silver etchant, method for preparing patterned nano-silver conducting film and touch sensor |
| CN110760847B (en) * | 2019-11-28 | 2022-06-17 | 东莞市图创智能制造有限公司 | Etching method using inkjet printing and inkjet printer for the etching method |
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| CN115142064A (en) | 2022-10-04 |
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