CN115133339A

CN115133339A - Cable assembly, signal transmission assembly and communication system

Info

Publication number: CN115133339A
Application number: CN202110303154.8A
Authority: CN
Inventors: 李文亮; 陈永炜; 颜忠; 汪泽文
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-03-22
Filing date: 2021-03-22
Publication date: 2022-09-30
Also published as: WO2022199382A1

Abstract

The application discloses a cable assembly, a signal transmission assembly and a communication system. The signal transmission assembly comprises a first chip, a first circuit board and a cable module. The first circuit board is provided with a first through hole. The cable module comprises a first fixing seat and a cable. The first fixing seat is fixed on the first circuit board, and at least part of the first fixing seat is positioned in the first through hole. The first end of the cable is fixed on the first fixed seat. The first end of the cable may be electrically connected directly to the first chip first signal pin. In this way, the first end of the cable is connected to the first chip at substantially zero distance. The signal loss between the first chip and the first end of the cable is low. In addition, compared with the traditional signal transmission assembly, the signal transmission assembly omits an electric connector. The layout space of the first circuit board can be greatly improved.

Description

Cable assembly, signal transmission assembly and communication system

Technical Field

The application relates to the technical field of communication, in particular to a cable assembly, a signal transmission assembly and a communication system.

Background

In recent years, with an increase in the signal bandwidth of a communication system, a lower demand has been made for the loss of a communication channel. A conventional communication system includes a chip, a Printed Circuit Board (PCB), an electrical connector, and a cable. The chip and the electric connector are fixed on the PCB. The cable is electrically connected to the chip through the electrical connector and the PCB. However, the electrical connector occupies a large space of the PCB, so that the space utilization of the PCB is low.

Disclosure of Invention

The application provides a cable assembly, a signal transmission assembly and a communication system with high PCB space utilization rate.

In a first aspect, the present application provides a signal transmission assembly. The signal transmission assembly comprises a first chip, a first circuit board and a cable module. The first chip comprises a first signal pin and a second signal pin which are arranged on the same side. The first circuit board is provided with a first through hole. The second signal pin is electrically connected with the first circuit board. The cable module comprises a first fixing seat and a cable. The first fixing seat is fixed on the first circuit board, and at least part of the first fixing seat is positioned in the first through hole. The first end of the cable is fixed on the first fixing seat and electrically connected with the first signal pin.

It can be understood that, compared to the conventional signal transmission assembly, the first signal pin of the signal transmission assembly of the present embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can be connected with a zero distance approximately, that is, a section of PCB connection and an electrical connector connection between the first signal pin of the first chip and the cable can be omitted. In this way, signal loss caused by PCB traces (or PCB vias) and signal loss caused by electrical connectors can be reduced between the first signal pin and the first end of the cable. It will be appreciated that by reducing the signal loss of the PCB traces (or PCB vias) and the signal loss of the electrical connector, the loss of the signal transmission assembly can be reduced to a greater extent, which is extremely important for the signal transmission assembly to meet low loss requirements.

In addition, compared to the conventional signal transmission assembly, in the embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, a connection position between the first signal pin and the PCB, a connection position between the PCB and the electrical connector, and a connection position between the electrical connector and the cable can be omitted between the first signal pin and the first end of the cable. Therefore, the connecting position between the first signal pin and the first end part of the cable is less, the number of discontinuous points of the signal channel is less, and therefore insertion loss fluctuation and resonance of the signal channel are improved.

In addition, compared with the conventional signal transmission assembly, the signal transmission assembly of the embodiment can omit the via package of the first signal pin and the PCB, the via package of the electrical connector and the PCB, and the package of the electrical connector and the cable. The signal transmission assembly of the embodiment has a simple structure.

In addition, when the connection position between the first signal pin and the first end of the cable is reduced and the number of discontinuous points of the signal channel is small, signals outside the signal transmission assembly are not easy to couple into the signal transmission assembly through the connection position between the first signal pin and the first end of the cable, namely, the signal crosstalk coupling position is reduced, so that the signal crosstalk is reduced to a greater extent.

In addition, because the cable of the traditional signal transmission assembly is electrically connected to the PCB through the electric connector, the electric connector is arranged at the periphery of the chip and can seriously interfere the heat dissipation air duct of the chip and occupy the layout space of the PCB, and the electric connector is omitted in the signal transmission assembly of the embodiment. At this time, the heat dissipation air duct of the first chip is no longer interfered by the electrical connector. In addition, the layout space of the PCB can be greatly improved, and the space utilization rate of the PCB is also improved.

In one possible implementation manner, the number of the cables is one, and one cable is used for transmitting high-speed signals; or the number of the cables is multiple, and at least one cable is used for transmitting high-speed signals.

It will be appreciated that when the signal transmission assembly is used to transmit high speed signals, the communication system places lower loss requirements on the signal transmission assembly. If the structural arrangement of the signal transmission component is not reasonable, the loss may be increased to a large extent, so that the signal transmission component cannot meet the low-loss requirement of the communication system. In the embodiment, a brand new signal transmission assembly structure is provided to reduce the signal loss between the first chip and the cable to a greater extent, so as to meet the low loss requirement of the communication system. Even more, the maximum transmission bandwidth of the signal transmission component of the present embodiment can reach 112 Gbps.

In addition, because the first signal pin of the first chip can be directly and electrically connected to the first end of the cable, the high-speed signal does not need to be transmitted to the cable through the PCB and the electrical connector. Therefore, on one hand, the influence of the first circuit board of the low-order board material on the loss and the degradation of the high-speed signal is not needed to be considered, namely the first circuit board can be made of the low-order board material, so that the cost input of the first circuit board is greatly reduced; on the other hand, the first chip can realize signal transmission by adopting lower active driving cost, so that the power consumption of the system is reduced.

In one possible implementation, the first circuit board is used for transmitting low-speed signals, power or high-speed signals.

It can be understood that the transmission loss of the low-speed signal on the first circuit board is small, and therefore, the low-speed signal can be directly transmitted through the first circuit board to meet the requirement of low loss of the communication system. In addition, the mode of directly transmitting low-speed signals and electric power through the first circuit board is simple, the first circuit board does not need to be dug, and cost investment is low.

In addition, although the loss of high-speed signals transmitted through the first circuit board is large, for some high-speed signals with low channel loss requirements, the communication requirements can also be met by transmitting through the first circuit board. This kind of transmission mode is comparatively simple, and first circuit board need not to dig the hole, and the cost drops into lowly. Of course, for some high speed signals with higher channel loss requirements, the high speed signals can also be transmitted through the first circuit board. Although this transmission method cannot meet the communication requirement, the signal loss can be reduced by other improved methods, so that the transmission method meets the communication requirement.

In one possible implementation, the cable includes an inner conductor, a dielectric layer, and an outer conductor. The dielectric layer wraps the inner conductor. The outer conductor wraps the dielectric layer. The inner conductor is electrically connected to the first signal pin. The first chip also includes a first ground pin. The first ground pin is used for providing a ground reference for the first signal pin. The first ground pin is electrically connected to the outer conductor. It will be appreciated that the cables of this construction may generally form coaxial lines. The cable with the structure has better signal shielding effect. When the inner conductor of the cable is used for transmitting signals, the inner conductor is not easily interfered by other signals.

In one possible implementation, the cable module further includes a first pad. A part of the first pad is fixed to an end surface of the first end of the inner conductor. The other part of the first bonding pad is fixed on the end face of the first end part of the dielectric layer. The first pad is electrically connected with the inner conductor of the cable and is arranged in an insulating way with the outer conductor of the cable. The first pad is electrically connected to the first signal pin. It can be understood that the first bonding pad is arranged on the end face of the first end part of the inner conductor and the end face of the first end part of the dielectric layer, so that the connection area of the first signal pin and the inner conductor can be increased to a greater extent, and the difficulty of the connection mode of the first signal pin and the inner conductor is reduced.

In a possible implementation manner, the cable module further includes a first elastic sheet. The first elastic sheet is fixed on the first bonding pad. The first elastic sheet is electrically connected with the first signal pin.

It can be understood that, for the scheme that the first signal pin is directly fixed to the first pad, because the first signal pin and the first pad are located between the first chip and the first fixing seat, on one hand, the fixing mode of the first signal pin and the first pad is difficult, and on the other hand, when the first fixing seat is fixed to the first circuit board, the first pad is difficult to be at the same level as the pin of the first circuit board, so if the distance between the pin of the first circuit board and the second signal pin is the standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, that is, the distance between the first signal pin and the first pad is easy to have an error. Thus, the first signal pin is not easily fixed to the first pad. In the embodiment, one first elastic sheet is fixed on each first bonding pad, on one hand, although the first elastic sheet and the first signal pin are located between the first chip and the first fixing seat, the first elastic sheet can be in contact with the first signal pin to realize stable electrical connection due to the elasticity of the first elastic sheet. Therefore, the electric connection mode between the first elastic sheet and the first signal pin is simpler. On the other hand, when the first fixing base is fixed on the first circuit board, the first bonding pad is hardly in the same level with the third signal pin of the first circuit board. At this time, the first elastic sheet has elasticity, so that the first elastic sheet can absorb an error of a distance between the first elastic sheet and the first signal pin, thereby ensuring that the first signal pin can be stably electrically connected to the first elastic sheet.

In addition, the first elastic sheet is arranged on the first bonding pad, so that the assembly mode of the signal transmission assembly can be changed, and the assembly difficulty of the signal transmission assembly is reduced. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base and the first circuit board are fixed without glue. After the plurality of first elastic sheets are in one-to-one corresponding contact with the plurality of first signal pins, the first fixing seat and the first circuit board are fixed through the adhesive. Therefore, compared with the mode that the first fixing seat is fixed with the first circuit board and the first signal pin is fixed on the first elastic sheet, whether the first elastic sheet and the pin of the first circuit board are in the same level or not does not need to be considered in advance in the embodiment, and the problem of flatness of too many first fixing seats and the first circuit board does not need to be considered. Therefore, the connection mode between the first chip and the first circuit board and between the first chip and the cable module is simple. Therefore, the first elastic sheet is arranged on the first bonding pad, so that the flexibility of connection between the first chip and the first circuit board and between the first chip and the cable module can be improved.

In a possible implementation manner, the cable module further includes a first ground plane. A part of the first grounding layer is positioned on the surface of the first fixed seat. The other part of the first ground layer is located on the end face of the first end part of the outer conductor. The first grounding layer is electrically connected with the outer conductor of the cable and is arranged in an insulating way with the inner conductor of the cable. The first grounding layer is electrically connected to the first grounding pin.

It can be understood that, by disposing the first ground layer on the surface of the first fixing seat and the end surface of the first end portion of the outer conductor, the contact area between the first ground pin and the first end portion of the outer conductor can be increased, so as to reduce the difficulty in connecting the first ground pin and the first end portion of the outer conductor.

In one possible implementation, the cable module further includes a second pad. The second pad is fixed on the surface of the first grounding layer far away from the first fixed seat. The second pad is electrically connected to the first ground layer. The second pad is electrically connected to the first ground pin. It can be understood that, by providing the second pad on the first ground layer, the first ground pin is advantageously fixedly connected to the first ground layer.

In one possible implementation, the signal transmission assembly further includes a socket connector. The socket connector is arranged between the first chip and the first circuit board. The seat connector comprises a first signal elastic sheet and a second signal elastic sheet. One side of the first signal elastic sheet is electrically connected with the first signal pin. The other side is electrically connected to the first end of the cable. One side of the second signal elastic sheet is electrically connected with the second signal pin, and the other side of the second signal elastic sheet is electrically connected with the first circuit board.

It can be understood that, for the scheme that the first signal pin is directly fixed to the first end of the cable, on one hand, the fixing manner of the first signal pin and the first end of the cable is difficult, and on the other hand, when the first fixing base is fixed to the first circuit board, the first end of the cable is difficult to be at the same level as the pin of the first circuit board, so that if the distance between the pin of the first circuit board and the second signal pin is the standard distance, the distance between the first signal pin and the first end of the cable is not easy to be at the standard distance, that is, the distance between the first signal pin and the first end of the cable is easy to have an error. Thus, the first signal pin is not easily fixed with the first end of the cable. In the embodiment, the base connector is disposed between the first chip and the first circuit board, and on one hand, because the first signal spring is elastic, the first signal spring can be in contact with the first signal pin to achieve stable electrical connection, and can also be in contact with the first end of the cable to achieve stable electrical connection. Therefore, the electric connection mode between the first signal elastic sheet and the first signal pin is simpler. The first signal spring plate is electrically connected with the first end part of the cable in a simple mode. On the other hand, when the first fixing base is fixed on the first circuit board, the first signal elastic sheet is still difficult to be in the same level with the pins of the first circuit board. Because the first signal shell fragment has elasticity, both can make the first signal shell fragment can absorb the error of distance between first signal shell fragment and the first signal pin to guarantee that first signal shell fragment can be fixed in the first signal pin, can make the first signal shell fragment can absorb the error of distance between the first signal shell fragment and the first tip of cable again, thereby guarantee that first signal shell fragment can be fixed in the first tip of cable.

In addition, the base connector is arranged between the first chip and the circuit board, so that the assembly mode of the signal transmission assembly can be changed, and the assembly difficulty of the signal transmission assembly is reduced. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base and the first circuit board are fixed without glue. After the plurality of first signal shrapnels are contacted with the plurality of first signal pins in a one-to-one correspondence manner, the first fixed seat and the first circuit board are fixed by the viscose. Therefore, compared with the mode that the first fixing seat is fixed with the first circuit board and the first signal pin is fixed on the first signal elastic sheet, whether the first signal elastic sheet and the pin of the first circuit board are in the same level or not does not need to be considered in advance, and the problem of flatness of the first fixing seat and the first circuit board does not need to be considered too much. Therefore, the connection mode between the first chip and the first circuit board and between the first chip and the cable module is simple. Therefore, the socket connector is arranged between the first chip and the circuit board, so that the flexibility of connection between the first chip and the first circuit board and between the first chip and the cable module can be improved.

In one possible implementation manner, one side of the first signal elastic piece is electrically connected to the first signal pin, and the other side of the first signal elastic piece is electrically connected to the first pad. One side of the second signal elastic sheet is electrically connected with the second signal pin, and the other side of the second signal elastic sheet is electrically connected with the third signal pin of the first circuit board.

It can be understood that, for the scheme that the first signal pin is directly fixed to the first pad, because the first signal pin and the first pad are located between the first chip and the first fixing seat, on one hand, the fixing manner of the first signal pin and the first pad is difficult, and on the other hand, when the first fixing seat is fixed to the first circuit board, the first pad is difficult to be at the same level as the third signal pin of the first circuit board, so that if the distance between the third signal pin and the second signal pin of the first circuit board is the standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, that is, the distance between the first signal pin and the first pad is easy to have an error. Thus, the first signal pin is not easily fixed to the first pad. In this embodiment, the socket connector is disposed between the first chip and the first circuit board, on one hand, although the first signal elastic piece, the first signal pin and the first pad are still located between the first chip and the first fixing base, since the first signal elastic piece has elasticity, the first signal elastic piece can be in contact with the first signal pin to realize stable electrical connection, and can also be in contact with the first pad to realize stable electrical connection. Therefore, the electric connection mode between the first signal elastic sheet and the first signal pin is simpler. The electric connection mode between the first signal spring plate and the first bonding pad is simpler. On the other hand, when the first fixing base is fixed on the first circuit board, the first signal elastic sheet is still difficult to be in the same level with the pins of the first circuit board. Because the first signal shell fragment has elasticity, both can make the first signal shell fragment can absorb the error of the distance between first signal shell fragment and the first signal pin to guarantee that first signal shell fragment can be fixed in the first signal pin, can make the first signal shell fragment can absorb the error of the distance between first signal shell fragment and the first pad again, thereby guarantee that first signal shell fragment can be fixed in the first pad.

In one possible implementation, the first fixing seat is in interference fit with the hole wall of the first through hole. Therefore, the first fixing seat and the first circuit board are better in connection firmness and simpler in assembly mode.

In one possible implementation, the first chip further includes a second ground pin. The second ground pin is used for providing a ground reference for the second signal pin. The second grounding pin is electrically connected to the first circuit board and is grounded through the first circuit board. It is understood that the second ground pin may shield signals on other signal pins (e.g., the first signal pin), thereby improving the second signal pin's ability to resist signal crosstalk.

In a possible implementation manner, the cable module further includes a second fixing seat. Along the extending direction of cable, the middle part of cable is fixed in the second fixing base. It can be understood that the middle part of the cable is fixed through the second fixing seat, so that the plurality of cables are more tidy.

In one possible implementation, the signal transmission assembly further includes a second circuit board and a second chip. The second chip comprises a first signal end and a second signal end which are arranged on the same side. The second circuit board is provided with a third through hole. The second signal end is electrically connected to the second circuit board. The cable module further comprises a third fixing seat. The third fixing seat is fixed on the second circuit board and at least partially positioned in the third through hole. The second end of the cable is fixed on the third fixing seat and is electrically connected to the first signal end. It will be appreciated that high speed signals, low speed signals, and power may be transferred between the first circuit board and the second circuit board, i.e., inter-board jumpers.

In a possible implementation manner, the second circuit board and the first circuit board are an integrated structure, that is, the first circuit board and the second circuit board are an integral body. Thus, high-speed signals, low-speed signals and power can be transmitted between the first chip and the second chip of the same circuit board, namely, the on-board jumper.

In a second aspect, the present application provides a communication system. A communication system comprises a connector and a signal transmission assembly as described above. The connector electrically connects the second end of the cable. The connector is also electrically connected with the first circuit board so as to be electrically connected with the second signal pin through the first circuit board.

It can be understood that when the signal transmission assembly is applied to a communication system, the signal loss of the communication system is low and the PCB space utilization rate is high.

In one possible implementation, the connector is a backplane connector. The backplane connector comprises a backplane connector female socket and a backplane connector male socket. The backplane connector female seat is fixed on the first circuit board. The backplane connector female socket is electrically connected with the second end part of the cable so as to be electrically connected with the first signal pin through the cable. The backplane connector female seat is also electrically connected with the first circuit board so as to be electrically connected to the second signal pins through the first circuit board. The communication system also includes a backplane. The backboard connector male seat is fixed on the backboard and electrically connected with the backboard. The backplane connector female seat is electrically connected with the backplane connector male seat.

In one possible implementation, the connector is an I/O connector. The communication system also includes a system circuit board and a functional module. The I/O connector is electrically connected to the system circuit board. The functional module is fixed on the system circuit board. The functional module is electrically connected to the system circuit board to be electrically connected to the I/O connector through the system circuit board.

In a third aspect, the present application provides a cable assembly. The cable assembly comprises a first circuit board and a cable module. The first circuit board is provided with a first through hole. The first circuit board is used for being electrically connected with the second signal pin of the first chip. The cable module comprises a first fixing seat and a cable. The first fixing seat is fixed on the first circuit board, and at least part of the first fixing seat is positioned in the first through hole. The first end of the cable is fixed on the first fixed seat. The first end of the cable is used for being electrically connected with the first signal pin of the first chip.

It can be understood that, compared to the conventional signal transmission assembly, the first signal pin of the first chip of the embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can be connected with a zero distance approximately, that is, a section of PCB connection and an electrical connector connection between the first signal pin of the first chip and the cable can be omitted. In this way, signal loss caused by PCB traces (or PCB vias) and signal loss caused by electrical connectors can be reduced between the first signal pin and the first end of the cable. It will be appreciated that by reducing the signal loss of the PCB traces (or PCB vias) and the signal loss of the electrical connector, the loss of the signal transmission assembly can be reduced to a greater extent, which is extremely important for the signal transmission assembly to meet low loss requirements.

In addition, compared to the conventional signal transmission assembly, in the embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, a connection position between the first signal pin and the PCB, a connection position between the PCB and the electrical connector, and a connection position between the electrical connector and the cable can be omitted between the first signal pin and the first end of the cable. Therefore, the connecting positions between the first signal pin and the first end part of the cable are fewer, and the number of discontinuous points of the signal channel is fewer, so that the insertion loss fluctuation and the resonance of the signal channel are favorably improved.

In addition, when the connection position between the first signal pin and the first end of the cable is reduced and the number of discontinuous points of the signal channel is small, signals outside the signal transmission assembly are not easily coupled into the signal transmission assembly through the connection position between the first signal pin and the first end of the cable, that is, the signal crosstalk coupling position is reduced, so that the signal crosstalk is reduced to a large extent.

It can be appreciated that when the signal transmission assembly is used to transmit high speed signals, the communication system places lower loss requirements on the signal transmission assembly. If the structural arrangement of the signal transmission component is not reasonable, the loss may be increased to a large extent, so that the signal transmission component cannot meet the low-loss requirement of the communication system. In the present embodiment, a brand new signal transmission assembly structure is provided to reduce the signal loss between the first chip and the cable to a greater extent, so as to meet the low loss requirement of the communication system. Even more, the maximum transmission bandwidth of the signal transmission component of the present embodiment can reach 112 Gbps.

In addition, because the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the high-speed signal does not need to be transmitted to the cable through the PCB and the electric connector. Therefore, on one hand, the influence of the first circuit board of the low-order board material on the loss and the degradation of the high-speed signal is not needed to be considered, namely the first circuit board can be made of the low-order board material, so that the cost input of the first circuit board is greatly reduced; on the other hand, the first chip can realize signal transmission by adopting lower active driving cost, so that the power consumption of the system is reduced.

It can be understood that the transmission loss of the low-speed signal on the first circuit board is small, and therefore, the low-speed signal can be directly transmitted through the first circuit board to meet the requirement of low loss of the communication system. In addition, the mode of directly transmitting low-speed signals and electric power through the first circuit board is simpler, the first circuit board does not need to be dug, and the cost investment is lower.

In addition, although the loss of transmitting a high-speed signal through the first circuit board is large, for some high-speed signals with low channel loss requirements, the communication requirements can also be met by transmitting through the first circuit board. The transmission mode is simple, the first circuit board does not need to be dug, and the cost investment is low. Of course, for some high speed signals with higher channel loss requirements, the high speed signals can also be transmitted through the first circuit board. Although this transmission method cannot meet the communication requirement, the signal loss can be reduced by other improved methods, so that the transmission method meets the communication requirement.

In one possible implementation, a cable includes an inner conductor, a dielectric layer, and an outer conductor. The dielectric layer wraps the inner conductor, and the outer conductor wraps the dielectric layer. The inner conductor is used for being electrically connected with a first signal pin of the first chip. The outer conductor is used for being electrically connected with the first grounding pin of the first chip. The first ground pin is used for providing a ground reference for the first signal pin. It will be appreciated that the cables of this construction may generally form coaxial lines. The cable with the structure has better signal shielding effect. When the inner conductor of the cable is used for transmitting signals, the inner conductor is not easily interfered by other signals.

In one possible implementation, the cable module further includes a first pad. A part of the first pad is fixed to an end face of the first end of the inner conductor. The other part of the first bonding pad is fixed on the end face of the first end part of the dielectric layer. The first pad is electrically connected with the inner conductor of the cable and is arranged in an insulating way with the outer conductor of the cable. The first bonding pad is used for being electrically connected with a first signal pin of the first chip. It can be understood that the first bonding pad is arranged on the end face of the first end portion of the inner conductor and the end face of the first end portion of the dielectric layer, so that the connection area of the first signal pin and the inner conductor can be increased to a large extent, and the difficulty of the connection mode of the first signal pin and the inner conductor is reduced.

In a possible implementation manner, the cable module further includes a first elastic sheet. The first elastic sheet is fixed on the first bonding pad. The first elastic sheet is used for being electrically connected with the first signal pin of the first chip.

In addition, the first elastic sheet is arranged on the first bonding pad, so that the assembly mode of the signal transmission assembly can be changed, and the assembly difficulty of the signal transmission assembly is reduced. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base and the first circuit board are fixed without glue. After the plurality of first elastic sheets are in one-to-one corresponding contact with the plurality of first signal pins, the first fixing seat and the first circuit board are fixed through the adhesive. Therefore, compared with the mode that the first fixing seat is fixed with the first circuit board firstly and then the first signal pin is fixed on the first elastic sheet, whether the first elastic sheet and the pin of the first circuit board are in the same level or not does not need to be considered in advance in the embodiment, namely, the problem of flatness of too many first fixing seats and the first circuit board does not need to be considered. Therefore, the connection mode between the first chip and the first circuit board and between the first chip and the cable module is simple. Therefore, the first elastic sheet is arranged on the first bonding pad, so that the flexibility of connection between the first chip and the first circuit board and between the first chip and the cable module can be improved.

In a possible implementation manner, the cable module further includes a first ground layer. A part of the first grounding layer is positioned on the surface of the first fixed seat. The other part of the first ground layer is located on the end face of the first end part of the outer conductor. The first ground plane is electrically connected to the outer conductor of the cable. The first ground plane is also arranged in an insulated manner from the inner conductor of the cable. The first grounding layer is used for being electrically connected with the first grounding pin of the first chip. It can be understood that, by disposing the first ground layer on the surface of the first fixing seat and the end surface of the first end portion of the outer conductor, the contact area between the first ground pin and the first end portion of the outer conductor can be increased, so as to reduce the difficulty in connecting the first ground pin and the first end portion of the outer conductor.

In a possible implementation manner, the cable module further includes a second pad. The second pad is fixed on the surface of the first grounding layer far away from the first fixed seat. The second pad is electrically connected to the first ground layer. The second pad is disposed in insulation from the inner conductor of the cable. The second bonding pad is used for being electrically connected with the first grounding pin of the first chip. It can be understood that the first ground pin is advantageously fixedly connected to the first ground layer by providing the second pad on the first ground layer.

In one possible implementation, the cable assembly further includes a socket connector. The seat connector is arranged on the same side of the first circuit board and the first fixed seat. The seat connector comprises a first signal elastic sheet and a second signal elastic sheet. One side of the first signal elastic sheet is used for being electrically connected with the first signal pin, and the other side of the first signal elastic sheet is electrically connected with the first end part of the cable. One side of the second signal elastic sheet is used for being electrically connected with the second signal pin, and the other side of the second signal elastic sheet is electrically connected with the first circuit board.

It can be understood that, for the scheme that the first signal pin is directly fixed to the first pad, because the first signal pin and the first pad are located between the first chip and the first fixing seat, on one hand, the fixing manner of the first signal pin and the first pad is difficult, and on the other hand, when the first fixing seat is fixed to the first circuit board, the first pad is difficult to be at the same level as the third signal pin of the first circuit board, so that if the distance between the third signal pin and the second signal pin of the first circuit board is the standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, that is, the distance between the first signal pin and the first pad is easy to have an error. Thus, the first signal pin is not easily fixed to the first pad. In this embodiment, the socket connector is disposed between the first chip and the first circuit board, on one hand, although the first signal elastic piece, the first signal pin and the first pad are still located between the first chip and the first fixing base, since the first signal elastic piece has elasticity, the first signal elastic piece can be in contact with the first signal pin to realize stable electrical connection, and can also be in contact with the first pad to realize stable electrical connection. Therefore, the electric connection mode between the first signal elastic sheet and the first signal pin is simpler. The electric connection mode between the first signal elastic sheet and the first bonding pad is simpler. On the other hand, when the first fixing base is fixed on the first circuit board, the first signal elastic sheet is still difficult to be in the same level with the third signal pin of the first circuit board. Because the first signal shell fragment has elasticity, both can make the first signal shell fragment can absorb the error of the distance between first signal shell fragment and the first signal pin to guarantee that first signal shell fragment can be fixed in the first signal pin, can make the first signal shell fragment can absorb the error of the distance between first signal shell fragment and the first pad again, thereby guarantee that first signal shell fragment can be fixed in the first pad.

In addition, the base connector is arranged between the first chip and the circuit board, so that the assembly mode of the signal transmission assembly can be changed, and the assembly difficulty of the signal transmission assembly is reduced. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base and the first circuit board are fixed without glue. After the plurality of first signal shrapnels are contacted with the plurality of first signal pins in a one-to-one correspondence manner, the first fixing seat and the first circuit board are fixed through the viscose. Therefore, compared with the mode of fixing the first fixing seat and the first circuit board at first and then fixing the first signal pin on the first signal elastic sheet, the implementation mode does not need to consider whether the first signal elastic sheet and the third signal pin of the first circuit board are in the same level in advance, namely does not need to consider too many flatness problems of the first fixing seat and the first circuit board. Therefore, the connection mode between the first chip and the first circuit board and between the first chip and the cable module is simple. Therefore, the socket connector is arranged between the first chip and the circuit board, so that the flexibility of connection between the first chip and the first circuit board and between the first chip and the cable module can be improved.

In a possible implementation manner, the cable module further includes a second fixing seat. Along the extending direction of the cable, the middle part of the cable is fixed on the second fixed seat. It can be understood that the middle part of the cable is fixed through the second fixing seat, so that the plurality of cables are more tidy.

In one possible implementation, the cable assembly further includes a second circuit board. The second circuit board is provided with a third through hole. The second circuit board is used for being electrically connected with the second signal end of the second chip. The cable module further comprises a third fixing seat. The third fixing seat is fixed on the second circuit board, and at least part of the third fixing seat is positioned in the third through hole. The second end of the cable is fixed on the third fixing seat. The second end of the cable is used for being electrically connected with the first signal end of the second chip.

In one possible implementation, the second circuit board and the first circuit board are an integrated structure.

In a fourth aspect, the present application provides a signal transmission assembly. The signal transmission assembly comprises a first chip and a cable module. The first chip includes a first signal pin. The cable module comprises a first fixing seat and a cable. The first end of the cable is fixed on the first fixing seat and is electrically connected to the first signal pin.

In addition, because the first signal pin of the first chip can be directly and electrically connected to the first end of the cable, the high-speed signal does not need to be transmitted to the cable through the PCB and the electrical connector. Therefore, on one hand, the influence of the first circuit board of the low-order board material on the loss and the degradation of the high-speed signal does not need to be considered, namely the first circuit board can be made of the low-order board material, so that the cost input of the first circuit board is greatly reduced; on the other hand, the first chip can realize signal transmission by adopting lower active driving cost, so that the power consumption of the system is reduced.

It can be understood that the transmission loss of the low-speed signal on the first circuit board is small, and therefore, the low-speed signal can be directly transmitted through the first circuit board to meet the low-loss requirement of the communication system. In addition, the mode of directly transmitting low-speed signals and electric power through the first circuit board is simple, the first circuit board does not need to be dug, and cost investment is low.

In a possible implementation manner, the cable module further includes a first pad. A part of the first pad is fixed to an end surface of the first end of the inner conductor. The other part of the first bonding pad is fixed on the end face of the first end part of the dielectric layer. The first pad is electrically connected with the inner conductor of the cable and is arranged in an insulating way with the outer conductor of the cable. The first pad is electrically connected to the first signal pin. It can be understood that the first bonding pad is arranged on the end face of the first end part of the inner conductor and the end face of the first end part of the dielectric layer, so that the connection area of the first signal pin and the inner conductor can be increased to a greater extent, and the difficulty of the connection mode of the first signal pin and the inner conductor is reduced.

In a possible implementation manner, the cable module further includes a first ground layer. A part of the first grounding layer is positioned on the surface of the first fixed seat. The other part of the first ground layer is located on the end face of the first end of the outer conductor. The first grounding layer is electrically connected with the outer conductor of the cable and is arranged in an insulating way with the inner conductor of the cable. The first grounding layer is electrically connected to the first grounding pin.

In one possible implementation, the cable module further includes a second pad. The second pad is fixed on the surface of the first grounding layer far away from the first fixed seat. The second pad is electrically connected to the first ground layer. The second pad is electrically connected to the first ground pin. It can be understood that the first ground pin is advantageously fixedly connected to the first ground layer by providing the second pad on the first ground layer.

In one possible implementation, the signal transmission assembly further includes a socket connector. The seat connector is arranged between the first chip and the cable module. The base connector comprises a first signal spring piece. One side of the first signal elastic sheet is electrically connected with the first signal pin. The other side is electrically connected to the first end of the cable.

In one possible implementation manner, one side of the first signal elastic piece is electrically connected to the first signal pin, and the other side of the first signal elastic piece is electrically connected to the first pad.

In a possible implementation manner, the cable module further includes a second fixing seat. Along the extending direction of the cable, the middle part of the cable is fixed on the second fixed seat. It can be understood that the middle part of the cable is fixed by the second fixing seat, so that the plurality of cables are more orderly.

In a possible implementation, the signal transmission assembly further includes a second chip. The second chip includes a first signal terminal. The cable module further comprises a third fixing seat. The second end of the cable is fixed on the third fixing seat and is electrically connected to the first signal end.

In a possible implementation manner, the second circuit board and the first circuit board are an integrated structure, that is, the first circuit board and the second circuit board are an integral body.

Drawings

In order to explain the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

Fig. 1a is a schematic structural diagram of an embodiment of an electronic device provided in this embodiment;

fig. 1b is a schematic structural diagram of another embodiment of the electronic device provided in this embodiment;

FIG. 1c is a schematic diagram of a portion of the electronic device shown in FIG. 1 a;

FIG. 1d is a schematic block diagram illustrating one embodiment of a signal transmission assembly according to the present disclosure;

FIG. 2 is an exploded view of the signal transmission assembly shown in FIG. 1 d;

FIG. 3 is a schematic diagram of the first chip shown in FIG. 2 at another angle;

FIG. 4 is a schematic view of the first circuit board shown in FIG. 2 at another angle;

FIG. 5 is a schematic partial cross-sectional view of the signal transmission assembly of FIG. 1d at line A-A;

FIG. 6 is an exploded schematic view of the cable module shown in FIG. 2;

FIG. 7 is a schematic view of the first mounting bracket of the cable module shown in FIG. 6 at another angle;

FIG. 8 is a schematic structural view of a cable of the cable module shown in FIG. 6;

FIG. 9a is an enlarged schematic view of the cable shown in FIG. 8 at line B1;

FIG. 9B is a cross-sectional view of the cable shown in FIG. 8 at line B2-B2;

FIG. 10 is a schematic view of the cable module shown in FIG. 2 at another angle;

FIG. 11 is an enlarged schematic view of the cable module shown in FIG. 10 at C;

FIG. 12 is an enlarged schematic view of the cable module shown in FIG. 2 at D;

FIG. 13 is a cross-sectional view of the cable module of FIG. 12 at E-E;

FIG. 14 is a schematic cross-sectional view of the signal transmission assembly of FIG. 1d at line A-A;

FIG. 15a is a cross-sectional schematic view of another embodiment of the signal transmission assembly shown in FIG. 1d at line A-A;

FIG. 15b is an enlarged schematic view of the signal transmission assembly shown in FIG. 15a at F;

FIG. 16 is a schematic structural view of a receptacle connector provided in an embodiment of the present application;

FIG. 17 is a cross-sectional view of yet another embodiment of the signal transmission assembly of FIG. 1d at line A-A;

FIG. 18 is a schematic structural view of another embodiment of the cable module shown in FIG. 2;

fig. 19 is a schematic structural diagram of an implementation manner of a communication system according to an embodiment of the present application;

fig. 20 is a schematic structural diagram of another implementation manner of a communication system provided in an embodiment of the present application;

FIG. 21 is a schematic block diagram illustrating another embodiment of a signal transmission assembly provided herein;

FIG. 22 is an exploded schematic view of the signal transmission assembly shown in FIG. 21;

FIG. 23 is a schematic diagram of the structure of the second chip shown in FIG. 22;

FIG. 24 is a schematic structural diagram illustrating yet another exemplary implementation of a signal transmission assembly according to an embodiment of the present disclosure;

fig. 25 is an exploded schematic view of the signal transmission assembly shown in fig. 24.

Detailed Description

To facilitate understanding of the communication system provided in the embodiments of the present application, the terms referred to in the present application are to be interpreted:

gbps: the unit of the transmission rate means that the number of bits of data transmission per unit time per second is 10 ⁹ A bit.

Crosstalk: crosstalk refers to the coupling effect of unwanted signals passing from one network to another.

Loss: loss refers to energy loss occurring when a signal propagates along a transmission line, and can be generated by five ways, namely dielectric loss, wire loss, radiation out, impedance mismatch reflection, coupling out to a neighboring network, and the like. Losses are typically characterized and measured by S-parameters.

Impedance: mainly the characteristic impedance of a transmission line, which is defined as the ratio of the voltage to the current at any point on the transmission line.

PCB packaging: the printed circuit board is a bonding pad and a via hole arrangement pattern matched with corresponding pins of devices including Ball Grid Array (BGA) chips, electric connectors and the like, provides an area via hole and bonding pad arrangement scheme, and is a part matched with the devices on the printed circuit board.

Ground: a transmission line generally consists of two wires having a length, one of which is used as a signal path to transmit a signal and the other of which is used as a return path to transmit a return current of the signal, and the return path is commonly referred to as "ground".

The embodiments of the present application will be described below with reference to the drawings.

In the description of the embodiments of the present application, it should be noted that the terms "mounted" and "connected" are to be interpreted broadly, unless explicitly stated or limited otherwise, and for example, "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate. The term "fixed" means that they are connected to each other and the relative positional relationship after the connection is not changed. The directional terms used in the embodiments of the present application, such as "upper", "lower", "inner", "outer", etc., are used solely in the direction of reference to the drawings, and thus, are used for better and clearer illustration and understanding of the embodiments of the present application, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the embodiments of the present application. "plurality" means at least two.

Referring to fig. 1a and fig. 1b, fig. 1a is a schematic structural diagram of an embodiment of an electronic device 2000 provided in this embodiment. Fig. 1b is a schematic structural diagram of another embodiment of the electronic device 2000 provided in this embodiment. The electronic device 2000 may be a switch, a router, a server, a wavelength division device, an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or the like. In addition, the electronic device 2000 may be a box device (e.g., a box switch, a box router, etc.) or a box device (e.g., a box switch, a box router, etc.). In this embodiment, fig. 1a schematically shows a configuration in which the electronic device 2000 is a frame switch. Fig. 1b schematically shows a configuration in which the electronic device 2000 is a box switch.

Referring to fig. 1c, fig. 1c is a partial structural schematic diagram of the electronic device 2000 shown in fig. 1 a. The electronic apparatus 2000 includes a housing 2100 and a function board 2200. The function board 2200 is provided in the housing 2100. The housing 2100 is used to carry the function board 2200. Functional single board 2200 may be used to transmit signals. The functional single board 2200 includes a first chip, a first circuit board, a cable module, and a connector, which will be mentioned later. The details of which are described below in connection with the associated drawings. And will not be described in detail herein. It should be noted that, hereinafter, the present application will provide a communication system. The communication system may be a system formed by a plurality of electronic devices 2000 (for example, a system formed by a plurality of electronic devices of the same type or a system formed by a plurality of electronic devices of different types), may also be a system formed by one electronic device 2000, and may also be a system formed by some components (for example, the function board 2200 or a part of the function board 2200) in the electronic device 2000. Functional single board 2200 may include a main control board, a switch board, or a line card, etc., according to different implementations of functions thereof. The number of the main control board, the switch board or the line card is not particularly limited.

Referring to fig. 1d, fig. 1d is a schematic structural diagram of an embodiment of a signal transmission device 100 provided in the present application. The signal transmission assembly 100 is used for transmitting a high-speed signal and a low-speed signal. The high-speed signal may be a signal having a transmission rate greater than or equal to 1Gbps and a rise and fall time of the signal less than or equal to 350 ps. For example, the high speed signal may be ethernet Serdes or PCIE 5.0, etc. The low speed signal may be a signal less than 1Gbps and the rise and fall times of the signal are greater than 350 ps. For example, the low speed signal may be an I2C signal, an SPI signal, a Cat5 cable signal, or the like. The signal transmission assembly 100 has less loss and better signal crosstalk resistance. The details will be described in detail below, and will not be described herein. In the present embodiment, the signal transmission assembly 100 has a plurality of arrangements. The signal transmission assembly 100 of various embodiments will be described in detail below with reference to the associated drawings.

The first embodiment: referring to fig. 2 in conjunction with fig. 1d, fig. 2 is an exploded view of the signal transmission assembly 100 shown in fig. 1 d. The signal transmission assembly 100 includes a first chip 10, a first circuit board 20, and a cable module 30. The first circuit board 20 and the cable module 30 cooperate to form a cable assembly 101. The first chip 10 is used for transmitting high-speed signals and low-speed signals. The present application is not particularly limited with respect to the kind of the first chip 10. The first circuit board 20 may be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The first circuit board 20 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid Rogers and FR-4 dielectric board, or the like. Where FR-4 is a code for a grade of flame resistant material. The Rogers dielectric plate is a high frequency plate. The present application is also not particularly limited with respect to the kind of the first circuit board 20.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the first chip 10 shown in fig. 2 at another angle. The first chip 10 includes a first chip body 11, a plurality of first signal pins 12, a plurality of first ground pins 13, a plurality of second signal pins 14, and a plurality of second ground pins 15.

Fig. 3 illustrates the first signal pin 12, the first ground pin 13, the second signal pin 14, and the second ground pin 15 with different fillers. In this embodiment, the structures of the plurality of first signal pins 12 are the same, and the same reference numerals may be used for the first signal pins 12. Furthermore, fig. 3 is only illustrated on one first signal pin 12 for the sake of simplicity of the drawing. In other embodiments, the structure of the plurality of first signal pins 12 may also be different. The first signal pin 12 may take different numbers. The first ground pin 13, the second signal pin 14 and the second ground pin 15 are labeled in the same manner as the first signal pin 12. In addition, when a plurality of the same components appear below, the reference numerals may refer to those of the first signal pin 12. The details will not be described further below.

In other embodiments, the number of the first signal pins 12 may be one. The number of the first ground pins 13 may also be one. The second signal pin 14 may be one. The second ground pin 1 may be one. Specifically, the present embodiment is not limited.

The first signal pins 12 may be solder balls, solder pads, elastic pins, or pogo pins. The specific application is not limited, and the method can be flexibly selected according to the product requirements. The first signal pin 12 of the present embodiment is described by taking a solder ball as an example. In addition, the arrangement of the first ground pin 13, the second signal pin 14 and the second ground pin 15 can refer to the arrangement of the first signal pin 12.

Referring to fig. 3 again, the first chip body 11 includes an upper end surface 111 (see fig. 2) and a lower end surface 112 facing opposite directions. The lower end surface 112 of the first chip body 11 includes a first region 1121, a second region 1122, and a third region 1123 which are connected in this order. Note that fig. 3 schematically distinguishes the first region 1121, the second region 1122, and the third region 1123 by a dotted line. It is to be understood that the number, position, shape, and size of the first region 1121, second region 1122, and third region 1123 are not limited to those of fig. 3 in the present embodiment.

The first signal pins 12 and the first ground pins 13 are located in the first region 1121. The first ground pin 13 is located at the periphery of the first signal pin 12. The plurality of first signal pins 12 and the plurality of first ground pins 13 may be arranged in an array. It should be understood that the arrangement of the first signal pin 12 and the first ground pin 13 in the first region 1121 is not limited to the arrangement illustrated in fig. 3.

In addition, a plurality of second signal pins 14 and a plurality of second ground pins 15 are located in the third region 1123. The second signal pin 14 is located on the same side of the first chip body 11 as the first signal pin 12. The second ground pin 15 is located at the periphery of the second signal pin 14. The second signal pins 14 and the second ground pins 15 may be arranged in multiple rows and multiple columns. It should be understood that the arrangement of the second signal pin 14 and the second ground pin 15 in the third region 1123 is not limited to the arrangement illustrated in fig. 3.

In addition, the second region 1122 is a blank region, that is, the second region 1122 is not provided with a structure such as a pin. In this way, the first signal pin 12 and the first ground pin 13 may be separated from the second signal pin 14 and the second ground pin 15 by the second region 1122. In other embodiments, the first chip body 11 may not include the second region 1122. At this time, the first region 1121 is directly connected to the third region 1123.

In the present embodiment, the first signal pin 12 is used for transmitting a high-speed signal. For example, the first signal pin 12 is used to transmit a high-speed signal greater than or equal to 25 Gbps. The first ground pin 13 is a ground reference of the first signal pin 12, i.e., a return path of the high-speed signal. The first ground pin 13 may shield signals on other signal pins (e.g., the second signal pin 14), thereby improving the first signal pin 12's ability to resist signal crosstalk. In other embodiments, the signal transmitted by the first signal pin 12 is not particularly limited.

It should be understood that the number of the first signal pins 12 of the present embodiment is plural. Each of the first signal pins 12 is used for transmitting a high-speed signal. In other embodiments, when the number of the first signal pins 12 is one. One first signal pin 12 may transmit a high-speed signal. When the number of the first signal pins 12 is plural, at least one first signal pin 12 is used for transmitting a high-speed signal. For example, when the number of the first signal pins 12 is two, one first signal pin 12 is used to transmit a high-speed signal, and the other first signal pin 12 is used to transmit a low-speed signal or power.

In the present embodiment, the second signal pin 14 is used to transmit a low-speed signal or power. The second ground pin 15 is a ground reference for the second signal pin 14. The second ground pin 15 may shield signals on other signal pins (e.g., the first signal pin 12) to improve the second signal pin 14's resistance to signal crosstalk. In other embodiments, the signal transmitted by the second signal pin 14 is not particularly limited.

In another embodiment, a heat sink (not shown) is fixed to the upper end surface 111 of the first chip body 11, so that when the first chip body 11 generates heat, the heat sink can lower the temperature of the first chip body 11, thereby improving the reliability of the first chip 10.

Referring to fig. 4 in conjunction with fig. 2, fig. 4 is a schematic structural diagram of the first circuit board 20 shown in fig. 2 at another angle. The first circuit board 20 includes an upper end surface 21 and a lower end surface 22 facing opposite directions (see fig. 2). The first circuit board 20 is provided with a first through hole 23. The first through hole 23 penetrates from the upper end surface 21 of the first circuit board 20 to the lower end surface 22 of the first circuit board 20, that is, the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the lower end surface 22 of the first circuit board 20. The position, size and shape of the first through hole 23 are not limited to those illustrated in fig. 2 and 4.

In addition, the first circuit board 20 has a plurality of third signal pins 24 and a plurality of third ground pins 25. The third signal pin 24 may be a pad, a solder ball, an elastic pin, a pogo pin, or the like. The specific application is not limited, and the method can be flexibly selected according to the product requirements. The third signal pin 24 of the present embodiment is described by taking a pad as an example. In addition, the arrangement of the third ground pin 25 can refer to the arrangement of the third signal pin 24.

In addition, the third signal pins 24 and the third ground pins 25 are located on the upper surface 21 of the first circuit board 20. A plurality of third signal pins 24 and a plurality of third ground pins 25 are disposed around the first via 23. The plurality of third signal pins 24 and the plurality of third ground pins 25 may be arranged in a plurality of rows and a plurality of columns. The third ground pin 25 is located at the periphery of the third signal pin 24. For example, the third signal pins 24 are arranged on the first circuit board 20 in the same manner as the second signal pins 14 (see fig. 3) are arranged on the first chip body 11 (see fig. 3). The third ground pins 25 are arranged on the first circuit board 20 in the same way as the second ground pins 15 (see fig. 3) are arranged on the first chip body 11.

Referring to fig. 5 in conjunction with fig. 3 and 4, fig. 5 is a partial cross-sectional view of the signal transmission assembly 100 shown in fig. 1d at the line a-a. The first chip 10 is fixed to the first circuit board 20 and electrically connected to the first circuit board 20. The lower end surface 112 of the first chip body 11 is disposed opposite to the upper end surface 21 of the first circuit board 20, that is, the upper end surface 21 of the first circuit board 20 faces the first chip 10. The upper end surface 111 of the first chip body 11 is disposed opposite to the upper end surface 21 of the first circuit board 20. The lower end surface 22 of the first circuit board 20 is disposed opposite to the lower end surface 112 of the first chip body 11. In addition, the first region 1121 of the first chip body 11 is disposed opposite to the first through hole 23 of the first circuit board 20.

In addition, the plurality of second signal pins 14 of the first chip 10 and the plurality of third signal pins 24 of the first circuit board 20 are fixed and electrically connected in a one-to-one correspondence. Illustratively, the second signal pin 14 may be connected to the third signal pin 24 using a laser welding or induction welding process. At this time, the low-speed signal or the power of the first chip 10 may be transmitted into the first circuit board 20 through the second signal pin 14 and the third signal pin 24.

In addition, the plurality of second ground pins 15 of the first chip 10 and the plurality of third ground pins 25 of the first circuit board 20 are fixed and electrically connected in a one-to-one correspondence. For example, the second ground pin 15 may be connected to the third ground pin 25 by laser welding or induction welding. In this way, the second ground pin 15 may be grounded through the third ground pin 25.

Referring to fig. 6, fig. 6 is an exploded view of the cable module 30 shown in fig. 2. The cable module 30 includes a first fixing base 31 and a plurality of cables 32. It should be understood that the number, size and shape of the cables 32 are not limited to those illustrated in fig. 6. Illustratively, the number of wires 32 is the same as the number of first signal pins 12.

Referring to fig. 7 in combination with fig. 6, fig. 7 is a schematic structural view of the first fixing seat 31 of the cable module 30 shown in fig. 6 at another angle, and the first fixing seat 31 includes an upper end surface 311 and a lower end surface 312 facing opposite directions. The first fixing base 31 is provided with a plurality of second through holes 313. Each second through hole 313 penetrates from the upper end surface 311 of the first fixed seat 31 to the lower end surface 312 of the first fixed seat 31, that is, each second through hole 313 penetrates through the upper end surface 311 of the first fixed seat 31 and the lower end surface 312 of the first fixed seat 31. It should be understood that the position, size and shape of the second through hole 313 are not limited to those illustrated in fig. 6 and 7.

Illustratively, the number of second through holes 313 is the same as the number of cables 32. The second through holes 313 are arranged in the same manner as the first signal pins 12 (see fig. 3).

Referring to fig. 7 again, and referring to fig. 6, the material of the first fixing base 31 is Liquid Crystal Polymer (LCP). Thus, the first fixing base 31 has better strength, corrosion resistance and electrical insulation. In other embodiments, the material of the first fixing base 31 may be other plastic materials or insulating materials.

For example, the first fixing seat 31 may be formed through an injection molding process. At this time, the steps for forming the first fixing seat 31 are less, and the processing cost is lower.

Illustratively, the first fixing seat 31 may also be formed by a computer numerical control machine (CNC) machine. Thus, the size of the first fixing seat 31 and the size of the second through hole 313 are accurate.

Referring to fig. 8, fig. 8 is a schematic structural diagram of the cable 32 of the cable module 30 shown in fig. 6. Since the structure of each cable 32 of the present embodiment is the same, the following description will be given taking one of the cables 32 as an example. The cable 32 includes a first end 321, a middle 322, and a second end 323 connected in series. It should be noted that the first end 321 of the cable 32, the middle 322 of the cable 32, and the second end 323 of the cable 32 are not strictly defined.

Referring to fig. 9a and 9B, fig. 9a is an enlarged schematic view of the cable shown in fig. 8 at line B1, and fig. 9B is a schematic cross-sectional view of the cable 32 shown in fig. 8 at line B2-B2. Cable 32 includes an inner conductor 324, a dielectric layer 325, and an outer conductor 326. Dielectric layer 325 is disposed around outer circumferential surface 3241 of inner conductor 324 and wraps around outer circumferential surface 3241 of inner conductor 324. The outer conductor 326 is disposed around the outer perimeter 3251 of the dielectric layer 325 and wraps around the outer perimeter 3251 of the dielectric layer 325. A dielectric layer 325 is located between the inner conductor 324 and the outer conductor 326. A dielectric layer 325 separates the inner conductor 324 from the outer conductor 326. At this time, the cable 32 is formed substantially coaxially. It should be noted that, since the inner conductor 324 and the dielectric layer 325 are located inside the cable 32, fig. 9a illustrates the inner conductor 324 and the dielectric layer 325 by different dotted lines.

Referring again to fig. 9a in conjunction with fig. 8, the first end portion 321 of the cable 32 includes a first end portion 3242 of the inner conductor 324, a first end portion 3252 of the dielectric layer 325, and a first end portion 3261 of the outer conductor 326. End face 3211 of first end 321 of cable 32 includes end face 3243 of first end 3242 of inner conductor 324, end face 3253 of first end 3252 of dielectric layer 325, and end face 3262 of first end 3261 of outer conductor 326. Similarly, the middle portion 322 of the cable 32 and the second end portion 323 of the cable 32 also include respective portions of an inner conductor 324, a dielectric layer 325, and an outer conductor 326. The details are not described herein.

In the present embodiment, the inner conductor 324 is composed of one wire. In an embodiment thereof, the inner conductor 324 may also be composed of a plurality of wires. A plurality of wires may be intertwined to form a unitary body.

In this embodiment, the material of the inner conductor 324 may be a conductive material of a metal material. For example, the material of the inner conductor 324 is copper, tin, aluminum, gold, silver, copper-nickel alloy, or the like.

In this embodiment, the dielectric layer 325 is made of an insulating material. Dielectric layer 325 may electrically insulate inner conductor 324 from outer conductor 326. For example, the material of dielectric layer 325 may be Fluorinated Ethylene Propylene (FEP) or Polyolefin (polyofein).

In this embodiment, the material of the outer conductor 326 may be a conductive material of a metal material. For example, the material of the outer conductor 326 is copper, nickel, gold, silver, or copper-nickel alloy. The outer conductor 326 may be formed on the outer circumferential surface 3251 of the dielectric layer 325 by a plating process. At this time, the connection between the outer conductor 326 and the dielectric layer 325 is strong.

In other embodiments, the cable 32 further includes a protective layer (not shown). The protective layer is disposed around the outer conductor 326 and wraps around the outer conductor 326. At this time, the protective layer may serve to protect the outer conductor 326. The protective layer may be made of polyethylene terephthalate (PET) or mylar (mylar, a tough polymer of polyester).

Referring to fig. 10 and 11, fig. 10 is a schematic structural view of the cable module 30 shown in fig. 2 at another angle. Fig. 11 is an enlarged schematic view of the cable module 30 shown in fig. 10 at C. The first end 321 of each cable 32 is fixed to the first fixed seat 31. Specifically, the first end portions 321 of the cables 32 are fixed in the second through holes 313 of the first fixing base 31 in a one-to-one correspondence manner, that is, the first end portion 321 of one cable 32 is fixed to the wall of one second through hole 313. It should be understood that the first end 321 of the cable 32 may be entirely located within the second through hole 313 or partially located within the second through hole 313. The first end 321 of the cable 32 is partially positioned within the second through hole 313 in this embodiment.

The connection between the first end 321 of the cable 32 and the first fixing seat 31 has a plurality of modes:

in one embodiment, after the first fixing base 31 is formed, the first end 321 of each cable 32 is inserted into one of the second through holes 313. And then the space between the first end 321 of the cable 32 and the wall of the second through hole 313 is filled with glue. When the adhesive is cured, the first end 321 of the cable 32 is secured within the second through hole 313.

In one embodiment, a plurality of cables 32 are bundled together. The first ends 321 of the plurality of cables 32 are injection molded by a mold. After the plastic material is cured, the first fixing seat 31 is formed. At this time, the first ends 321 of the cables 32 are also fixed to the first fixing base 31.

In the present embodiment, since the second through holes 313 are arranged in the same manner as the first signal pins 12 (see fig. 3), when the first ends 321 of the cables 32 are fixed in the second through holes 313 of the first fixing base 31 in a one-to-one correspondence manner, the first ends 321 of the cables 32 are arranged in the same manner as the first signal pins 12.

In the present embodiment, the first end 321 of each cable 32 is fixed to the first fixing base 31, so that the plurality of cables 32 can be combined and fixed as a whole. Fig. 2 and 10 both show that the second end 323 of each cable 32 is an open end, that is, the first fixing seat 31 is not disposed at the second end 323 of the cable 32. In other embodiments, the cable module 30 may also include a third fixing seat. The third fixing seat fixes the second end 323 of the cable 32. With regard to this aspect, the following detailed description will be made in conjunction with the associated drawings. And will not be described in detail herein.

Referring to fig. 11 again, in combination with fig. 9a, when the first end 321 of the cable 32 is fixed to the first fixing base 31, the end surface 3243 of the first end portion 3242 of the inner conductor 324, the end surface 3253 of the first end portion 3252 of the dielectric layer 325, and the end surface 3262 of the first end portion 3261 of the outer conductor 326 are exposed relative to the upper end surface 311 of the first fixing base 31.

Illustratively, the end face 3243 of the first end portion 3242 of the inner conductor 324, the end face 3253 of the first end portion 3252 of the dielectric layer 325, and the end face 3262 of the first end portion 3261 of the outer conductor 326 are flush with the upper end face 311 of the first fixed base 31. Thus, the inner conductor 324, the dielectric layer 325 and the outer conductor 326 do not affect the flatness of the upper end surface 311 of the first fixed seat 31 to a large extent.

It should be understood that, when the first ends 321 of the plurality of cables 32 are fixed on the first fixing base 31, the first fixing base 31 and the plurality of cables 32 may be cut so that the inner conductor 324, the dielectric layer 325 and the outer conductor 326 are exposed relative to the upper end surface 311 of the first fixing base 31. At this time, the first fixing base 31, the inner conductor 324, the dielectric layer 325 and the outer conductor 326 are polished, so that the end face 3243 of the first end portion 3242 of the inner conductor 324, the end face 3253 of the first end portion 3252 of the dielectric layer 325 and the end face 3262 of the first end portion 3261 of the outer conductor 326 are flush with the upper end face 311 of the first fixing base 31.

Referring to fig. 12 and 13, fig. 12 is an enlarged schematic view of the cable module 30 shown in fig. 2 at D. Fig. 13 is a cross-sectional view of the cable module 30 shown in fig. 12 at E-E. The cable module 30 further includes a first ground plane 314. A portion of the first ground layer 314 is located on the upper end surface 311 of the first fixed base 31. Another portion of the first ground plane 314 is located at the end face 3262 of the first end portion 3261 of the outer conductor 326. The material of the first ground layer 314 may be a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

The first ground layer 314 is fixed to the outer conductor 326 of each cable 32. At this time, the outer conductors 326 of the adjacent two cables 32 are fixed by the first ground layer 314. In addition, the first ground layer 314 is also electrically connected to the outer conductor 326 of each cable 32, i.e., the first ground layer 314 and the outer conductor 326 of each cable 32 can be in conduction with each other. Thus, when the first ground plane 314 is grounded, the outer conductor 326 of each cable 32 is also grounded.

Illustratively, the first ground plane 314 is secured to and electrically connected to the outer conductor 326 of each cable 32 by plating, sputtering, deposition, evaporation, or the like.

In addition, the first ground layer 314 is also disposed in insulation from the inner conductor 324 of each cable 32. Illustratively, the first ground layer 314 is disposed by being disconnected from the inner conductor 324 of each cable 32, i.e., the first ground layer 314 is not in contact with the inner conductor 324 of each cable 32. Thus, the first ground plane 314 is disposed in isolation from the inner conductor 324 of each cable 32.

In other embodiments, the cable module 30 may not include the first ground layer 314.

Referring to fig. 12 and 13 again, the cable module 30 includes a plurality of first pads 315. The first pad 315 and the first ground layer 314 are located on the same side of the first fixed base 31. The shape of the first pad 315 is not limited to the disk shape illustrated in fig. 12. The first bonding pad 315 may be made of a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

In addition, the plurality of first pads 315 are fixed in one-to-one correspondence with the inner conductors 324 of the plurality of cables 32. The first pads 315 are electrically connected to the inner conductors 324 of the cables 32 in a one-to-one correspondence, that is, one first pad 315 and the inner conductor 324 of one cable 32 can be conducted to each other. Taking one of the first pads 315 as an example for description, a portion of the first pad 315 is fixed to the end face 3243 of the first end portion 3242 of the inner conductor 324. Another portion of first pad 315 is secured to end face 3253 of first end portion 3252 of dielectric layer 325.

In addition, each first pad 315 is also disposed insulated from the first ground layer 314. Illustratively, the first ground layer 314 is disposed to be insulated from each first pad 315 by disconnecting the first ground layer 314 from each first pad 315, i.e., the first ground layer 314 is not in contact with each first pad 315.

Illustratively, the first pad 315 is secured to the inner conductor 324 of each wire 32 and electrically connected to the first pad 315 by a plating, sputtering, deposition, or evaporation process.

In the present embodiment, since the arrangement of the plurality of wires 32 is the same as the arrangement of the first signal pins 12 (see fig. 3), when the plurality of first pads 315 and the inner conductors 324 of the plurality of wires 32 are fixed in a one-to-one correspondence, the arrangement of the first pads 315 is also the same as the arrangement of the first signal pins 12.

In other embodiments, the cable module 30 may not include the first pad 315.

Referring to fig. 12 and 13 again, the cable module 30 includes a plurality of second pads 316. The shape of the second pad 316 is not limited to the disk shape illustrated in fig. 12. The second bonding pad 316 may be made of a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

In addition, the second pads 316 are fixed on the surface of the first ground layer 314 away from the first fixing base 31. At this time, the plurality of second pads 316 are formed integrally with the first ground layer 314. In addition, each of the second pads 316 is electrically connected to the first ground layer 314. When the first ground layer 314 is grounded, each of the second pads 316 may also be grounded.

Each second pad 316 is illustratively secured to the first ground plane 314 by plating, sputtering, deposition, or evaporation.

In addition, a plurality of second pads 316 are provided insulated from each of the first pads 315. Illustratively, each second pad 316 is disposed to be insulated from each first pad 315 by being disconnected from each first pad 315, i.e., each second pad 316 is not in contact with each first pad 315.

Illustratively, the second pads 316 are arranged in the same manner as the first ground pins 13 (see fig. 3).

In other embodiments, the cable module 30 may not include the second pad 316.

Referring to fig. 14, fig. 14 is a cross-sectional view of the signal transmission assembly 100 shown in fig. 1d at a line a-a. At least a portion of the first fixing seat 31 of the cable module 30 is located in the first through hole 23 of the first circuit board 20, and the first fixing seat 31 fixes the first circuit board 20. The first fixing seat 31 may be partially located in the first through hole 23, or may be entirely located in the first through hole 23. Fig. 14 illustrates a portion of the first fixing seat 31 located in the first through hole 23. In addition, the end surface 3211 of the first end portion 321 of the cable 32 faces the first chip 10, that is, the end surface 3211 of the first end portion 321 of the cable 32 and the upper end surface 21 of the first circuit board 20 both face the same side of the first fixing base 31.

It should be understood that the way of fixing the first fixing seat 31 to the first circuit board 20 has various ways.

In one embodiment, the first fixing seat 31 is fixed to the hole wall of the first through hole 23 by interference fit.

In one embodiment, the first fixing seat 31 is fixed to the first circuit board 20 by a structural member or a locking member.

Illustratively, the first fixing seat 31 is adhered to the first circuit board 20 by disposing an adhesive (e.g., glue or double-sided adhesive) between the first fixing seat 31 and the hole wall of the first through hole 23.

Illustratively, the first fixing base 31 is fastened to the first circuit board 20 by fasteners (e.g., screws, pins, etc.). It should be understood that the shape of the first fixing base 31 can be flexibly adjusted according to requirements, so as to facilitate the fastening member to lock the first fixing base 31 to the first circuit board 20.

In the present embodiment, when the first fixing seat 31 of the cable module 30 fixes the first circuit board 20, the cable module 30 and the first circuit board 20 form a whole, i.e. the cable assembly 101. The cable assembly 101 may be provided as a stand-alone product.

Referring to fig. 14 again, the first pads 315 and the first signal pins 12 are fixed in a one-to-one correspondence, that is, one first pad 315 and one first signal pin 12 can be fixed. In addition, the plurality of first pads 315 are electrically connected to the plurality of first signal pins 12 in a one-to-one correspondence, that is, one first pad 315 may be electrically connected to one first signal pin 12. For example, the first signal pin 12 may be fixed to the first pad 315 using a laser welding or induction welding process. At this time, the high-speed signal of the first chip 10 may be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 and the first pad 315.

In the present embodiment, the number of cables 32 is plural. The inner conductor 324 of each cable 32 is used to transmit high speed signals. In other embodiments, when the number of cables 32 is one. The inner conductor 324 of one cable 32 may transmit high speed signals. When the number of the cables 32 is plural, the inner conductor 324 of at least one cable 32 is used for transmitting a high-speed signal. For example, when the number of the cables 32 is two, the inner conductor 324 of one cable 32 is used to transmit a high-speed signal, and the inner conductor 324 of the other cable 32 is used to transmit a low-speed signal or power.

In other embodiments, when the cable module 30 is not provided with the first pads 315, the plurality of first signal pins 12 of the first chip 10 are fixed in one-to-one correspondence with the inner conductors 324 of the plurality of cables 32. In addition, the plurality of first signal pins 12 of the first chip 10 are electrically connected to the inner conductors 324 of the plurality of wires 32 in a one-to-one correspondence.

Referring to fig. 14 again, the second pads 316 are fixed to the first ground pins 13 in a one-to-one correspondence manner, that is, one second pad 316 is fixed to one first ground pin 13. In addition, the plurality of second pads 316 are electrically connected to the plurality of first ground pins 13 in a one-to-one correspondence, that is, one second pad 316 is electrically connected to one first ground pin 13. In this way, the first ground pin 13 may be electrically connected to the outer conductor 326 of the cable 32 through the second pad 316 and the first ground layer 314.

Illustratively, the first ground pin 13 may be fixed to the second pad 316 using a laser welding or induction welding process.

In other embodiments, when the cable module 30 is not provided with the second pads 316, the plurality of first ground pins 13 are all fixed to the first ground layer 314. In addition, the plurality of first ground pins 13 are electrically connected to the first ground layer 314.

In other embodiments, when the cable module 30 is not provided with the first ground layer 314, the first ground pin 13 may be directly electrically connected to the outer conductor 326 of the cable 32.

The structure of a signal transmission assembly 100 is described above in detail in connection with the relevant figures. Wherein the signal transmission assembly 100 can transmit high-speed signals. The maximum transmission bandwidth of high-speed signals can reach 112 Gbps. It should be appreciated that the communication system places lower loss requirements on signal transmission assembly 100 when signal transmission assembly 100 can transmit high speed signals. For example, the requirements of the CEI-112G-LR-PAM4 standard for signal transmission components are 28dB @ fb/2(fb is the nyquist frequency point of the signal), in other words, although the maximum transmission bandwidth of the signal transmission components can reach 112Gbps, the loss of the signal transmission components is greater than 28dB @ fb/2, and the signal transmission components cannot be applied to the communication system, however, in this embodiment, by providing a completely new structure of the signal transmission component 100, the first signal pin 12 (pin for transmitting high-speed signals) of the first chip 10 can be directly electrically connected to the cable 32, so that the maximum transmission bandwidth of the signal transmission component 100 can reach 112Gbps, and the signal loss can be greatly reduced, and the low loss requirement of the communication system can be met.

First, a cable module 30 structure is provided. The cable module 30 includes a first fixing base 31 and a plurality of cables 32. The first fixing base 31 is provided with a plurality of second through holes 313. Each second through hole 313 penetrates from the upper end surface 311 of the first fixed seat 31 to the lower end surface 312 of the first fixed seat 31, that is, each second through hole 313 penetrates through the upper end surface 311 of the first fixed seat 31 and the lower end surface 312 of the first fixed seat 31. The first end portions 321 of the cables 32 are fixed in the second through holes 313 of the first fixing base 31 in a one-to-one correspondence.

Next, a first circuit board 20 structure is provided. The first circuit board 20 is provided with a first through hole 23. The first through hole 23 penetrates from the upper end surface 21 of the first circuit board 20 to the lower end surface 22 of the first circuit board 20, that is, the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the lower end surface 22 of the first circuit board 20.

Finally, a signal transmission assembly 100 structure is provided. The first fixing seat 31 of the cable module 30 is fixed in the first through hole 23 of the first circuit board 20. The plurality of first signal pins 12 of the first chip 10 are electrically connected to the inner conductors 324 of the plurality of wires 32 in a one-to-one correspondence.

It should be understood that the first signal pin 12 of the signal transmission assembly 100 of the present embodiment may be directly electrically connected to the inner conductor 324 of the cable 32, compared to the conventional signal transmission assembly. The first chip 10 and the cable 32 may be connected with a substantially zero distance, i.e. a length of PCB connection and electrical connector connection between the first signal pin 12 of the first chip 10 and the cable 32 may be omitted. In this way, signal loss caused by PCB traces (or PCB vias) and signal loss caused by electrical connectors can be reduced between the first signal pin 12 and the inner conductor 324 of the cable 32. It should be appreciated that by reducing the signal loss of the PCB trace (or PCB via) and the signal loss of the electrical connector, the loss of the signal transmission assembly 100 can be reduced to a greater extent, which is extremely important for the signal transmission assembly 100 to meet low loss requirements.

Secondly, the signal transmission assembly 100 of the present embodiment can also solve some technical problems. The method comprises the following specific steps:

compared to the conventional signal transmission assembly, in the present embodiment, since the first signal pin 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32, the connection position between the first signal pin 12 and the PCB, the connection position between the PCB and the electrical connector, and the connection position between the electrical connector and the cable 32 can be omitted between the first signal pin 12 and the inner conductor 324 of the cable 32. In this way, there are fewer connection locations between the first signal pin 12 and the inner conductor 324 of the cable 32 and fewer discontinuities in the signal path, thereby facilitating improved signal path insertion ripple and resonance.

In addition, compared to the conventional signal transmission assembly, the signal transmission assembly 100 of the present embodiment can omit the first signal pin 12 and the via package of the PCB, the electrical connector and the via package of the PCB, and the electrical connector and the cable package. The signal transmission assembly 100 of the present embodiment has a simple structure.

In addition, when the connection position between the first signal pin 12 and the inner conductor 324 of the cable 32 is reduced and the number of the discontinuous points of the signal channel is small, signals outside the signal transmission assembly 100 are not easily coupled into the signal transmission assembly 100 through the connection position between the first signal pin 12 and the inner conductor 324 of the cable 32, that is, the signal crosstalk coupling position is reduced, thereby greatly reducing the signal crosstalk.

In addition, since the first signal pins 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32, high-speed signals do not need to be transmitted to the cable 32 via the PCB and the electrical connector. Therefore, on one hand, the first circuit board 20 of a low-grade board material does not need to be considered to have the influence on the loss and the degradation of the high-speed signal, that is, the first circuit board 20 can be made of the low-grade board material, so that the cost input of the first circuit board 20 is greatly reduced; on the other hand, the first chip 10 can implement signal transmission with a lower active driving cost, thereby reducing system power consumption.

In addition, since the cable of the conventional signal transmission assembly is electrically connected to the PCB through the electrical connector, the electrical connector disposed at the periphery of the chip may seriously interfere with the heat dissipation duct of the chip and occupy the layout space of the PCB, and the signal transmission assembly 100 of the present embodiment omits the electrical connector. At this time, the heat dissipation duct of the first chip 10 is no longer interfered by the electrical connector. In addition, the layout space of the PCB can be greatly improved, and the space utilization rate of the PCB is also improved.

In this embodiment, the signal transmission assembly 100 also has some advantages. The method comprises the following specific steps:

first, the cable module 30 further includes a plurality of first pads 315. The plurality of first pads 315 are fixed in one-to-one correspondence with the inner conductors 324 of the plurality of cables 32. In this way, the inner conductors 324 of the plurality of cables 32 can be fixed to the plurality of first signal pins 12 in a one-to-one correspondence by fixing the plurality of first pads 315 to the plurality of first signal pins 12 in a one-to-one correspondence. It should be appreciated that the first pad 315 may increase the end surface area of the inner conductor 324 of the cable 32. The connection process between the first bonding pad 315 and the first signal pin 12 is simpler, which is beneficial to reducing the assembly difficulty of the cable module 30.

Further, since the first ground layer 314 is provided on the upper end surface 311 of the first fixed base 31, the first ground layer 314 is fixed to the outer conductor 326 of each cable 32. The first ground plane 314 may connect the outer conductors 326 of each cable 32 to form a unitary body. In this way, the plurality of first ground pins 13 and the outer conductors 326 of the plurality of cables 32 are connected by fixing the first ground layer 314 to the plurality of first ground pins 13 of the first chip 10. It should be appreciated that the first ground plane 314 may increase the end surface area of the outer conductor 326 of the cable 32. The connection process between the first ground layer 314 and the first ground pin 13 is simpler, which is beneficial to reducing the assembly difficulty of the cable module 30.

In addition, the cable module 30 includes a plurality of second pads 316. The second pads 316 are fixed to the surface of the first ground layer 314 away from the first fixing base 31. The second pad 316 facilitates the fixed connection of the first ground pin 13 and the first ground layer 314.

A signal transmission assembly 100 is described above in detail with reference to the accompanying drawings, and a method of manufacturing the signal transmission assembly 100 is described below in detail. The method of making the signal transmission assembly 100 includes:

referring to fig. 11 again, with reference to fig. 9a, the first end 321 of the cable 32 is fixed to the first fixing seat 31, wherein an end surface 3211 of the first end 321 of the cable 32 is exposed relative to the first fixing seat 31;

illustratively, the first ends 321 of the plurality of cables 32 are injection molded by a mold. After the plastic material is cured, the first fixing seat 31 is formed. At this time, the first ends 321 of the cables 32 are also fixed to the first fixing base 31. The first fixing seat 31 and the plurality of cables 32 are cut, so that the end surface of the first end portion 321 of each cable 32 is exposed relative to the first fixing seat 31.

Illustratively, the first fixing seat 31 is formed by CNC machining. The first end 321 of each cable 32 is inserted into one of the second through holes 313 and exposed relative to the first fixing base 31. And then the adhesive is filled between the first end 321 of the cable 32 and the wall of the second through hole 313. When the adhesive is cured, the first end 321 of the cable 32 is secured within the second through hole 313.

Referring to fig. 14 again, the first fixing base 31 is fixed in the first through hole 23 of the first circuit board 20, wherein the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the lower end surface 22 of the first circuit board 20.

Illustratively, the first fixing seat 31 is fixed to the hole wall of the first through hole 23 by interference fit.

Illustratively, the first fixing seat 31 is fixed to the first circuit board 20 by a structural member or a locking member. For example, an adhesive (such as glue or a double-sided adhesive) is disposed between the first fixing seat 31 and the hole wall of the first through hole 23, so that the first fixing seat 31 is adhered to the first circuit board 20. For another example, the first fixing base 31 is fastened to the first circuit board 20 by a fastener (e.g., a screw, a pin, or the like). It should be understood that the shape of the first fixing base 31 can be flexibly adjusted according to requirements, so as to facilitate the fastening member to lock the first fixing base 31 to the first circuit board 20.

In one embodiment, before the step of fixing the first end 321 of the cable 32 to the first fixing seat 31, the method for preparing the signal transmission assembly 100 further includes:

referring again to fig. 9a, a dielectric layer 325 is formed on the outer circumferential surface 3241 of the inner conductor 324. The material of the inner conductor 324 may be a conductive material made of a metal material. For example, the material of the inner conductor 324 is copper, tin, aluminum, gold, silver, copper-nickel alloy, or the like. The dielectric layer 325 is made of an insulating material. For example, the material of dielectric layer 325 may be FEP or polyofein.

Referring again to fig. 9a, an outer conductor 326 is formed on the outer peripheral surface 3251 of the dielectric layer 325. Dielectric layer 325 may electrically insulate inner conductor 324 from outer conductor 326. Illustratively, the outer conductor 326 may be formed on the outer circumferential surface 3251 of the dielectric layer 325 by a plating process. At this time, the connection between the outer conductor 326 and the dielectric layer 325 is strong.

As shown in fig. 9a and 11, when the first end 321 of the cable 32 is fixed to the first fixing base 31, the end surface 3243 of the first end 3242 of the inner conductor 324, the end surface 3253 of the first end 3252 of the dielectric layer 325, and the end surface 3262 of the first end 3261 of the outer conductor 326 may be exposed relative to the first fixing base 31.

In one embodiment, after the step of fixing the first end 321 of the cable 32 to the first fixing seat 31, the method for preparing the signal transmission assembly 100 further includes:

referring to fig. 12 and 13, a first pad 315 is formed on an end surface 3243 of the first end portion 3242 of the inner conductor 324 and an end surface 3253 of the first end portion 3252 of the dielectric layer 325; the first pad 315 is electrically connected to the inner conductor 324 of the cable 32, and the first pad 315 is further insulated from the first ground layer 314. Illustratively, the first pad 315 is formed on the end face 3243 of the first end portion 3242 of the inner conductor 324 and the end face 3253 of the first end portion 3252 of the dielectric layer 325 by a plating, sputtering, deposition, evaporation or the like process.

referring to fig. 12 and 13, a first ground layer 314 is formed on the upper end surface 311 of the first fixing base 31, wherein the first ground layer 314 is fixed to and electrically connected to the outer conductor 326 of the cable 32, and the first ground layer 314 is further insulated from the inner conductor 324 of the cable 32. Illustratively, the first ground layer 314 is formed on the upper end surface 311 of the first fixing base 31 by electroplating, sputtering, deposition or evaporation, and is fixed with the outer conductor 326 of the cable 32.

It is understood that the first ground plane 314 may be in conductive communication with the outer conductor 326 of the cable 32. Thus, when the first ground plane 314 is grounded, the outer conductors 326 of the cable 32 are also both grounded.

In an embodiment, after the step of forming the first ground layer 314 on the upper end surface 311 of the first fixing base 31, the method for manufacturing the signal transmission assembly 100 further includes:

referring to fig. 12 and 13, a second pad 316 is formed on the surface of the first ground layer 314 away from the first fixing base 31. Illustratively, the second pad 316 is formed on the surface of the first ground layer 314 away from the first fixed base 31 by electroplating, sputtering, deposition, evaporation, or the like.

In one embodiment, after "fixing the first fixing seat 31 in the first through hole 23 of the first circuit board 20", the method for manufacturing the signal transmission assembly 100 further includes:

referring to fig. 5, the second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed on the first circuit board 20 and electrically connected to the first circuit board 20; illustratively, the second signal pin 14 may be connected to the third signal pin 24 using a laser welding or induction welding process. The second ground pin 15 may be connected to the third ground pin 25 by using a laser welding or induction welding process.

In other embodiments, the step "the second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed to the first circuit board 20, and electrically connected to the first circuit board 20" may also be performed before the step "fixing the first fixing seat 31 in the first through hole 23 of the first circuit board 20".

Referring to fig. 14, the first signal pin 12 of the first chip 10 is fixed to the inner conductor 322 of the cable 32 and electrically connected to the inner conductor 322 of the cable 32. Illustratively, the plurality of first signal pins 12 and the plurality of first pads 315 are soldered in a one-to-one correspondence by a laser soldering or an induction soldering process. At this time, the high-speed signal of the first chip 10 may be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 and the first pad 315.

The foregoing detailed description, taken in conjunction with the accompanying drawings, describes a signal transmission assembly 100 and a method for making the same, and describes a signal transmission assembly 100 that solves some of the technical problems of the conventional signal transmission assembly 100. Several arrangements of the signal transmission assembly 100 will be described in conjunction with the related drawings. The following signal transmission assembly 100 can solve not only the above technical problems but also some additional technical problems.

In the second embodiment, the same technical contents as those in the first embodiment are not described again: referring to fig. 15a and 15b, fig. 15a is a schematic cross-sectional view of another embodiment of the signal transmission assembly 100 shown in fig. 1d at a line a-a, and fig. 15b is an enlarged schematic view of the signal transmission assembly 100 shown in fig. 15a at a line F. The cable module 30 includes a plurality of first resilient pieces 317. The shape of the first resilient piece 317 is not limited to the hook shape illustrated in fig. 15a and 15 b. The first elastic piece 317 may be made of a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

Each first pad 315 is formed with a first groove 3151. The opening of the first groove 3151 faces away from the side of the cable 32. The shape of the first groove 3151 is not limited to the rectangular shape illustrated in fig. 15 b.

In addition, the first elastic pieces 317 are fixed to the first pads 315 in a one-to-one correspondence manner, and a portion of the first elastic pieces 317 is disposed in the first groove 3151.

In this embodiment, the first elastic piece 317 and the first pad 315 have various connection modes.

For example, the first resilient tab 317 may be in interference fit with a groove wall of the first groove 3151.

For example, the first resilient piece 317 may be fixed to a groove wall of the first groove 3151 through a welding process.

It should be understood that the first groove 3151 is formed in the first pad 315, and a portion of the first elastic sheet 317 is fixed in the first groove 3151, so that the connection area between the first elastic sheet 317 and the first pad 315 can be increased, the connection area between the first elastic sheet 317 and the first pad 315 is increased, and the connection stability between the first elastic sheet 317 and the first pad 315 is improved.

In other embodiments, the first pad 315 may not be opened with the first groove 3151. At this time, the first elastic pieces 317 may be directly fixed to the first pads 315 in a one-to-one correspondence.

Referring to fig. 15a and 15b again, the first elastic pieces 317 contact the first signal pins 12 in a one-to-one correspondence manner. At this time, the first resilient sheets 317 and the first signal pins 12 can also be electrically connected. Thus, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12, the first spring piece 317 and the first bonding pad 315. It should be noted that, the first signal pin 12 of the present embodiment adopts a pad form, which can increase the contact area between the first signal pin 12 and the first elastic sheet 317, and is beneficial to improving the stability of the electrical connection between the first signal pin 12 and the first elastic sheet 317. In other embodiments, the first signal pin 12 may have other structures.

It should be understood that, for the solution that the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first fixing base 31, on one hand, the fixing manner of the first signal pin 12 and the first pad 315 is difficult, and on the other hand, when the first fixing base 31 is fixed to the first circuit board 20, the first pad 315 is difficult to be at the same level as the third signal pin 24 of the first circuit board 20, so if the distance between the third signal pin 24 and the second signal pin 14 is the standard distance, the distance between the first signal pin 12 and the first pad 315 is not easy to be at the standard distance, that is, the distance between the first signal pin 12 and the first pad 315 is easy to have an error. Thus, the first signal pin 12 is not easily fixed to the first pad 315. In the embodiment, one first elastic sheet 317 is fixed on each first pad 315, on one hand, although the first elastic sheet 317 and the first signal pin 12 are located between the first chip body 11 and the first fixing base 31, the first elastic sheet 317 has elasticity, and the first elastic sheet 317 can be in contact with the first signal pin 12 to achieve stable electrical connection. Thus, the electrical connection between the first resilient piece 317 and the first signal pin 12 is simple. On the other hand, when the first fixing base 31 is fixed to the first circuit board 20, the first land 315 is hardly at the same level as the third signal pin 24 of the first circuit board 20. At this time, since the first resilient piece 317 has elasticity, the first resilient piece 317 can absorb an error in a distance between the first resilient piece 317 and the first signal pin 12, thereby ensuring that the first signal pin 12 can be electrically connected to the first resilient piece 317 stably.

In addition, the first elastic sheet 317 is arranged on the first bonding pad 315, so that the assembly mode of the signal transmission assembly 100 can be changed, and the assembly difficulty of the signal transmission assembly 100 is reduced. Specifically, when the first fixing seat 31 is inserted into the first through hole 23 of the first circuit board 20, the first fixing seat 31 and the first circuit board 20 are fixed without using glue. After the first elastic pieces 317 are in one-to-one contact with the first signal pins 12, the first fixing base 31 and the first circuit board 20 are fixed by an adhesive. Thus, compared to the way of fixing the first fixing seat 31 and the first circuit board 20 first and then fixing the first signal pin 12 to the first elastic sheet 317, the embodiment does not need to consider in advance whether the first elastic sheet 317 and the third signal pin 24 are in the same level, that is, does not need to consider too many flatness problems of the first fixing seat 31 and the first circuit board 20. Thus, the connection between the first chip 10 and the first circuit board 20 and the cable module 30 is simple. Therefore, by disposing the first elastic sheet 317 on the first bonding pad 315, the flexibility of connection between the first chip 10 and the first circuit board 20 and the cable module 30 can be increased.

Referring to fig. 15a again, the cable module 30 further includes a plurality of second elastic pieces 318. The second elastic pieces 318 are fixed to the second pads 316 in a one-to-one correspondence. The second elastic piece 318 may be located on a side of the second pad 316 away from the first ground layer 314. The arrangement of the second elastic piece 318 can refer to the arrangement of the first elastic piece 317. The connection between the second elastic piece 318 and the second bonding pad 316 can be referred to as the connection between the first elastic piece 317 and the first bonding pad 315. The connection between the second elastic sheet 318 and the first ground pin 13 of the first chip 10 can refer to the connection between the first elastic sheet 317 and the first signal pin 12. Details are not described herein.

In the third embodiment, the same technical contents as those in the first embodiment are not described again: referring to fig. 16 and 17, fig. 16 is a schematic structural diagram of a seat connector 40 according to an embodiment of the present disclosure. Fig. 17 is a cross-sectional view of still another embodiment of the signal transmission assembly 100 shown in fig. 1d at line a-a. The socket connector 40 includes a base 41, a plurality of first signal springs 42, a plurality of first ground springs 43, a plurality of second signal springs 44, and a plurality of second ground springs 45. Fig. 16 illustrates the first signal spring 42, the first ground spring 43, the second signal spring 44 and the second ground spring 45 with different fillers. It should be noted that fig. 16 and 17 only schematically show some components included in the socket connector 40, and the actual shape, actual size, and actual configuration of these components are not limited to those shown in fig. 16 and 17.

Referring to fig. 16 and 17 again, the base 41 includes an upper end 411 and a lower end 412 facing opposite to each other. The base 41 includes a first portion 4121, a second portion 4122, and a third portion 4123 connected in series. In fig. 16 and 17, the base 41 is schematically divided into a first portion 4121, a second portion 4122, and a third portion 4123 by broken lines. It should be understood that fig. 16 only schematically illustrates one embodiment of the first portion 4121, the second portion 4122, and the third portion 4123, and the number, location, shape, and size of the first portion 4121, the second portion 4122, and the third portion 4123 are not limited by fig. 16 and 17.

The first signal resilient pieces 42 and the first ground resilient pieces 43 are located in the first portion 4121. The first grounding spring 43 is located at the periphery of the first signal spring 42. In the present embodiment, the arrangement of the first signal spring 42 is the same as that of the first signal pin 12. The arrangement of the first grounding spring 43 is the same as that of the first grounding pin 13. In other embodiments, the arrangement of the first signal spring 42 and the arrangement of the first signal pins 12 may be different. The arrangement of the first grounding elastic sheet 43 and the arrangement of the first grounding pin 13 may also be different.

In addition, the second signal resilient pieces 44 and the second ground resilient pieces 45 are located in the third portion 4123. The second ground spring 45 is located around the second signal spring 44. In the present embodiment, the second signal spring 44 is arranged in the same manner as the second signal pins 14. The arrangement of the second grounding spring 45 is the same as that of the second grounding pin 15. In other embodiments, the arrangement of the second signal spring 44 and the arrangement of the second signal pins 14 may be different. The arrangement of the second grounding spring 45 and the arrangement of the second grounding pin 15 may be different.

In addition, the second portion 4122 is a blank region, i.e., the second portion 4122 is not provided with a spring structure. Thus, the first signal resilient pieces 42 and the first ground resilient pieces 43 can be separated from the second signal resilient pieces 44 and the second ground resilient pieces 45 by the second portion 4122. In other embodiments, the base 41 may not include the second portion 4122. At this time, the first portion 4121 is directly connected to the third portion 4123.

Referring to fig. 17 again, the socket connector 40 is disposed between the first chip 10 and the first circuit board 20. The socket connector 40 is disposed between the first chip 10 and the cable module 30. At this time, the socket connector 40 is located on the same side of the first circuit board 20 and the first fixing socket 31. In addition, the base 41 includes an upper end surface 411 and a lower end surface 412 facing opposite directions. The upper end face 411 of the submount 41 faces the first chip 10. The lower end surface 412 of the base 41 faces the first circuit board 20. The first signal resilient piece 42, the first grounding resilient piece 43, the second signal resilient piece 44 and the second grounding resilient piece 45 all penetrate through the upper end surface 411 of the base 41 and the lower end surface 412 of the base 41, and all extend out of the upper end surface 411 of the base 41 and the lower end surface 412 of the base 41.

One side of the first signal elastic pieces 42 is in contact with the first signal pins 12 in a one-to-one correspondence manner. The other sides of the plurality of first signal domes 42 are in one-to-one contact with the plurality of first pads 315. At this time, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12, the first signal dome 42 and the first bonding pad 315.

In addition, one side of the first grounding elastic pieces 43 is in one-to-one contact with the first grounding pins 13. The other sides of the first ground springs 43 are in one-to-one contact with the second pads 316. In this way, the first ground pin 13 may be electrically connected to the first ground layer 314 through the first ground spring 43 and the second pad 316, and electrically connected to the outer conductor 326 of the cable 32 through the first ground layer 314.

In addition, one side of the second signal springs 44 is in contact with the second signal pins 14 in a one-to-one correspondence manner. The other sides of the second signal springs 44 are in contact with the third signal pins 24 in a one-to-one correspondence. At this time, the non-high speed signals such as the low speed signal or the power signal of the first chip 10 can be transmitted into the first circuit board 20 through the second signal pin 14, the second signal spring 44 and the third signal pin 24.

In addition, one side of the second grounding elastic pieces 45 is in one-to-one corresponding contact with the second grounding pins 15. The other sides of the second grounding elastic pieces 45 are in one-to-one contact with the third grounding pins 25. In this way, the second ground pin 15 can be electrically connected to the ground of the first circuit board 20 through the second ground spring 45 and the third ground pin 25.

It should be understood that, for the solution that the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first fixing base 31, on one hand, the fixing manner of the first signal pin 12 and the first pad 315 is difficult, and on the other hand, when the first fixing base 31 is fixed to the first circuit board 20, the first pad 315 is difficult to be at the same level as the third signal pin 24 of the first circuit board 20, so if the distance between the third signal pin 24 and the second signal pin 14 is the standard distance, the distance between the first signal pin 12 and the first pad 315 is not easy to be at the standard distance, that is, the distance between the first signal pin 12 and the first pad 315 is easy to have an error. Thus, the first signal pin 12 is not easily fixed to the first pad 315. In the present embodiment, the socket connector 40 is disposed between the first chip 10 and the first circuit board 20, on one hand, although the first signal spring 42, the first signal pin 12 and the first pad 315 are still located between the first chip body 11 and the first fixing base 31, the first signal spring 42 has elasticity, and the first signal spring 42 can be in contact with the first signal pin 12 to realize stable electrical connection, and can also be in contact with the first pad 315 to realize stable electrical connection. Thus, the electrical connection between the first signal spring 42 and the first signal pin 12 is simple. The electrical connection between the first signal spring 42 and the first bonding pad 315 is simple. On the other hand, when the first fixing base 31 is fixed to the first circuit board 20, the first signal spring 42 is still hard to be at the same level with the third signal pin 24 of the first circuit board 20. Because the first signal elastic sheet 42 has elasticity, the first signal elastic sheet 42 can absorb the distance error between the first signal elastic sheet 42 and the first signal pin 12, so that the first signal elastic sheet 42 can be fixed on the first signal pin 12, and the first signal elastic sheet 42 can absorb the distance error between the first signal elastic sheet 42 and the first bonding pad 315, so that the first signal elastic sheet 42 can be fixed on the first bonding pad 315.

In addition, by disposing the socket connector 40 between the first chip 10 and the first circuit board 20, the assembly manner of the signal transmission assembly 100 can be changed, thereby reducing the assembly difficulty of the signal transmission assembly 100. Specifically, when the first fixing seat 31 is inserted into the first through hole 23 of the first circuit board 20, the first fixing seat 31 and the first circuit board 20 are fixed without using glue. After the first signal elastic pieces 42 are in one-to-one contact with the first signal pins 12, the first fixing base 31 and the first circuit board 20 are fixed by an adhesive. Thus, compared to the method of fixing the first fixing seat 31 and the first circuit board 20 first and then fixing the first signal pin 12 to the first signal spring 42, the embodiment does not need to consider in advance whether the first signal spring 42 and the third signal pin 24 are in the same level, i.e., does not need to consider too many flatness problems of the first fixing seat 31 and the first circuit board 20. Thus, the connection mode between the first chip 10 and the first circuit board 20 and the cable module 30 is simple. Therefore, by disposing the socket connector 40 between the first chip 10 and the first circuit board 20, the flexibility of connection between the first chip 10 and the first circuit board 20 and the cable module 30 can be increased.

In the fourth embodiment, the same technical contents as those in the first embodiment are not described again: referring to fig. 18, fig. 18 is a schematic structural diagram of another embodiment of the cable module 30 shown in fig. 2. The cable module 30 further includes a second holder 34. The structure of the second fixing seat 34 can refer to the structure of the first fixing seat 31. And will not be described in detail herein.

Wherein the middle portion 322 of each cable 32 passes through the second fixing seat 34. The second fixing seat 34 is used for fixing the middle portion 322 of the cable 32 in the extending direction of the cable 32, so that the plurality of cables 32 are tidier. The second fixing seat 34 can be formed in the same manner as the first fixing seat 31. The assembly manner of the second fixing seat 34 and the plurality of cables 32 can refer to the assembly manner of the first fixing seat 31 and the plurality of cables 32. And will not be described in detail herein.

In other embodiments, the cable module 30 may further include a third fixing seat, a fourth fixing seat, … …, or an mth fixing seat, where M is greater than or equal to 3. The third fixing seat, the fourth fixing seat, … …, or the mth fixing seat can be used for fixing the middle portion 322 of each cable 32, so that the plurality of cables 32 are ensured to be tidy.

Several signal transmission assemblies 100 are described above in detail in connection with the associated figures. Several embodiments of communication system 1000 are described in detail below with reference to the associated figures.

Referring to fig. 19, fig. 19 is a schematic structural diagram of an implementation manner of a communication system 1000 according to an embodiment of the present disclosure. Communication system 1000 includes signal transmission assembly 100, backplane 200, and backplane connector 300. It should be noted that fig. 19 only schematically shows some components included in the communication system 1000, and the actual shape, the actual size, the actual position, and the actual configuration of the components are not limited to fig. 19. In addition, fig. 19 illustrates that the number of signal transmission assemblies 100 is two, the number of backplanes 200 is one, and the number of backplane connectors 300 is two. In other embodiments, the number of transmission assemblies 100, the number of backplanes 200, and the number of backplane connectors 300 are not particularly limited.

The back plate 200 may be a hard back plate, a flexible back plate, or a rigid-flexible back plate. Backplane 200 may be implemented using FR-4 dielectric boards, Rogers (Rogers) dielectric boards, hybrid Rogers and FR-4 dielectric boards, and so on. The type of backsheet 200 is not specifically limited in this application.

In addition, the backplane connector 300 includes a backplane connector female socket 310 and a backplane connector female socket 320. The backplane connector female socket 310 is fixed to the first circuit board 20 of the signal transmission assembly 100 and electrically connected to the first circuit board 20. At this time, the backplane connector female 310 is electrically connected to the second signal pins 14 of the first chip 10 through the first circuit board 20. The low-speed signal or power of the first chip 10 may be transmitted to the backplane connector female header 310 via the first circuit board 20.

Referring to fig. 19 again, as shown in fig. 8 and 9a, the backplane connector female header 310 is further electrically connected to the second ends 323 of the plurality of cables 32 of the cable module 30. Specifically, the inner conductor 324 of each cable 32 is electrically connected to a signal terminal (not shown) of the backplane connector female housing 310, and the outer conductor 326 of each cable 32 is electrically connected to a ground terminal (not shown) of the backplane connector female housing 310. At this time, the backplane connector female 310 is electrically connected to the first signal pins 12 of the first chip 10 through the cables 32. The high speed signals of the first chip 10 may be transmitted to the backplane connector female header 310 via the inner conductors 324 of the respective cables 32. The first ground pin 13 of the first chip 10 may be electrically connected to the ground of the backplane connector mother mount 310 through the outer conductor 326 of the cable 32.

In addition, the backplane connector male socket 320 is fixed to the backplane 200 and electrically connected to the backplane 200. The female backplane connector receptacle 310 may be mated to the male backplane connector receptacle 320. Thus, in one aspect, the low speed signal or power of the first chip 10 can be transmitted to the backplane 200 via the first circuit board 20, the backplane connector female socket 310 and the backplane connector male socket 320. In addition, the high-speed signal of the first chip 10 can also be transmitted to the backplane 200 through the plurality of cables 32 of the cable module 30, the backplane connector female socket 310 and the backplane connector male socket 320.

In other embodiments, the positions of the backplane connector female receptacle 310 and the backplane connector male receptacle 320 may be reversed. At this time, the backplane connector male 320 is fixed to the first circuit board 20 of the signal transmission assembly 100 and electrically connected to the first circuit board 20. The backplane connector male 320 is also electrically connected to the second ends 323 of the plurality of cables 32 of the cable module 30. The backplane connector female socket 310 is fixed to the backplane 200 and electrically connected to the backplane 200.

Referring to fig. 20, fig. 20 is a schematic structural diagram of another implementation manner of a communication system 1000 according to an embodiment of the present application. The communication system 1000 includes a signal transmission assembly 100, an input/output (I/O) connector 400, a system circuit board 500, and a functional module 600. It should be noted that fig. 20 only schematically shows some components included in the communication system 1000, and the actual shape, the actual size, the actual position, and the actual configuration of the components are not limited to fig. 20.

The system circuit board 500 may be a hard circuit board, a flexible circuit board, or a rigid-flex circuit board. The system circuit board 500 may be implemented using FR-4 dielectric boards, Rogers (Rogers) dielectric boards, hybrid Rogers and FR-4 dielectric boards, and so on. The present application is not particularly limited with respect to the type of the system circuit board 500.

In addition, the functional module 600 may be a photoelectric conversion chip.

Referring to fig. 20 again, the I/O connector 400 is fixed to the first circuit board 20 of the signal transmission assembly 100 and electrically connected to the first circuit board 20. At this time, the I/O connector 400 is electrically connected to the second signal pins 14 of the first chip 10 through the first circuit board 20. The low-speed signal or power of the first chip 10 may be transmitted to the I/O connector 400 via the first circuit board 20.

Referring to fig. 20 again, as shown in fig. 8 and 9a, the I/O connector 400 is also electrically connected to the second ends 323 of the cables 32 of the cable module 30. Specifically, inner conductor 324 of each cable 32 is electrically coupled to a signal terminal (not shown) of I/O connector 400, and outer conductor 326 of each cable 32 is electrically coupled to a ground terminal (not shown) of I/O connector 400. At this time, the I/O connector 400 is electrically connected to the first signal pin 12 of the first chip 10 through the wire 32. The high-speed signals of the first chip 10 can also be transmitted to the I/O connector 400 via the plurality of cables 32 of the cable module 30.

In addition, the functional module 600 is fixed to the system circuit board 500 and electrically connected to the system circuit board 500. The system circuit board 500 may be electrically connected to the I/O connector 400. At this time, the functional module 600 is electrically connected to the I/O connector 400 through the system circuit board 500. The low-speed signal or power of the first chip 10 may be transmitted to the functional module 600 via the first circuit board 20, the I/O connector 400, and the system circuit board 500. In addition, the high-speed signal of the first chip 10 can also be transmitted to the functional module 600 through the plurality of cables 32 of the cable module 30, the I/O connector 400 and the system circuit board 500.

In other embodiments, the communication system 1000 may not include the system circuit board 500 and the functional module 600.

In other embodiments, communication system 1000 may also include a second circuit board (not shown). The second circuit board is provided separately from the first circuit board 20. The I/O connector 400 is fixed to the second circuit board and electrically connected to the second circuit board.

Several embodiments of the communication system 1000 are described above in detail in connection with the associated figures. Several embodiments of the signal transmission assembly 100 are described in detail below with reference to the associated figures.

In the fifth embodiment, the same technical contents as those in the first embodiment are not described again: referring to fig. 21 and 22, fig. 21 is a schematic structural diagram of another embodiment of the signal transmission assembly 100 provided in the present application. Fig. 22 is an exploded schematic view of the signal transmission assembly 100 shown in fig. 21. The cable module 30 further includes a third fixing seat 33. The third fixing base 33 is used for fixing the second end 323 of each cable 32. The arrangement manner of the third fixing seat 33 (e.g., the structure of the third fixing seat 33, the formation manner of the third fixing seat 33) can refer to the arrangement manner of the first fixing seat 31. The connection between the third fixing base 33 and the second end 323 of each cable 32 can also refer to the connection between the first fixing base 31 and the first end 321 of each cable 32. The details are not described herein.

The signal transmission assembly 100 further includes a second circuit board 50 and a second chip 60. The second circuit board 50 may be a hard circuit board, a flexible circuit board, or a rigid-flex circuit board. The second circuit board 50 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid Rogers and FR-4 dielectric board, or the like.

In addition, the second circuit board 50 includes an upper end surface 51 and a lower end surface 52 facing opposite. The second circuit board 50 is provided with a third through hole 53. The third through hole 53 penetrates from the upper end surface 51 of the second circuit board 50 to the lower end surface 52 of the second circuit board 50, that is, the third through hole 53 penetrates through the upper end surface 51 of the second circuit board 50 and the lower end surface 52 of the second circuit board 50. The position, size and shape of the third through hole 53 are not limited to those illustrated in fig. 21 and 22.

In the present embodiment, the structure of the second circuit board 50 is the same as that of the first circuit board 20. In other embodiments, the structure of the second circuit board 50 may be different from the structure of the first circuit board 20.

At least a portion of the third fixing seat 33 of the cable module 30 is disposed in the third through hole 53 and fixes the second circuit board 50. The connection between the third fixing seat 33 and the second circuit board 50 can refer to the connection between the first fixing seat 31 and the first circuit board 20. The details are not described herein. Thus, the end surface of the second end portion 323 of the cable 32 and the upper end surface 51 of the second circuit board 50 face the same side of the third fixing base 33.

In the present embodiment, the second chip 60 may be the same as or different from the first chip 10. The second chip 60 is not particularly limited in kind.

Referring to fig. 23, fig. 23 is a schematic structural diagram of the second chip 60 shown in fig. 22. The second chip 60 includes a second chip body 61, a plurality of first signal terminals 62, a plurality of first ground terminals 63, a plurality of second signal terminals 64, and a plurality of second ground terminals 65. The first signal terminals 62, the first ground terminals 63, the second signal terminals 64, and the second ground terminals 65 are disposed on the second chip body 61. The arrangement of the first signal terminals 62, the first ground terminals 63, the second signal terminals 64, and the second ground terminals 65 on the second chip body 61 is not limited to the arrangement illustrated in fig. 23. The arrangement of the first signal terminals 62, the first ground terminals 63, the second signal terminals 64, and the second ground terminals 65 on the second chip body 61 is not specifically limited in this application.

In addition, the first signal terminal 62 is used for transmitting a high-speed signal and transmitting the high-speed signal into the second chip body 61. The first ground terminal 63 is a ground reference of the first signal terminal 62. The first ground terminal 63 can shield signals on other signal terminals (e.g., the second signal terminal 64), thereby improving the ability of the first signal terminal 62 to resist signal crosstalk.

In addition, the second signal terminal 64 is used for transmitting a low-speed signal or power and transmitting the low-speed signal or power into the second chip body 61. The second ground terminal 65 is a ground reference of the second signal terminal 64. The second ground terminal 65 can shield signals on other signal terminals (e.g., the first signal terminal 62), thereby improving the resistance of the second signal terminal 64 to signal crosstalk.

Referring to fig. 23 again, as shown in fig. 21 and 22, the second signal terminals 64 and the second ground terminals 65 are fixed on the second circuit board 50 and electrically connected to the second circuit board 50. The second circuit board 50 is electrically connected to the first circuit board 20. The connection between the second signal terminal 64 and the second circuit board 50 can refer to the connection between the second signal pin 14 of the first chip 10 (see fig. 5) and the first circuit board 20. The connection between the second ground 65 and the second circuit board 50 can be referred to as the connection between the second ground pin 15 (see fig. 5) of the first chip 10 and the first circuit board 20. Details are not described herein. In this way, the low-speed signal or power of the first chip 10 may be transmitted to the second chip 60 via the first circuit board 20 and the second circuit board 50.

In addition, the plurality of first signal terminals 62 are fixed in one-to-one correspondence with the second end portions 323 of the plurality of cables 32. Illustratively, the first signal terminals 62 are electrically connected to the inner conductors 324 (see fig. 9a) of the cables 32 in a one-to-one correspondence. The connection between the first signal terminal 62 and the second end 323 of the cable 32 can be referred to as the connection between the first signal pin 12 of the first chip 10 (see fig. 14) and the first end 321 of the cable 32. Details are not described herein. In this way, the high-speed signal of the first chip 10 can also be transmitted to the second chip 60 through the plurality of cables 32 of the cable module 30.

In addition, the first grounds 63 are electrically connected to the outer conductor 326 of the cable 32 (see fig. 9 a). The connection between the first ground 63 and the outer conductor 326 of the cable 32 can refer to the connection between the first ground pin 13 of the first chip 10 (see fig. 14) and the outer conductor 326 of the cable 32. Details are not described herein.

In the present embodiment, high-speed signals, low-speed signals, and power may be transferred between the first circuit board 10 and the second circuit board 50, that is, inter-board jumpers.

In other embodiments, the second end 323 of the cable 32 may also be electrically connected to the second chip 60 through the electrical connector and the second circuit board 50, or the second end 323 of the cable 32 may also be electrically connected to the second chip 60 in other conventional manners. Thus, the cable module 30 may not include the third fixing seat 33. The second circuit board 50 may not be provided with the third through hole 53.

In the sixth embodiment, the same technical contents as those in the fifth embodiment are not described again: referring to fig. 24 and 25, fig. 24 is a schematic structural diagram of another implementation of the signal transmission element 100 according to the embodiment of the present application, and fig. 25 is an exploded schematic diagram of the signal transmission element 100 shown in fig. 24. The first circuit board 20 and the second circuit board 50 are integrally formed, that is, the first circuit board 20 and the second circuit board 50 are an integral body. Fig. 24 and 25 each illustrate, by one reference numeral, the entirety of the first circuit board 20 and the second circuit board 50. In this way, high-speed signals, low-speed signals, and power may be transferred between the first chip 10 and the second chip 60 of the same circuit board, i.e., intra-board jumpers.

Two signal transmission assemblies 100 are described above in connection with the associated figures. Signal transmission assembly 100 may implement inter-board jumpers or may implement intra-board jumpers, thereby enriching the applications of signal transmission assembly 100.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A signal transmission assembly (100) is characterized by comprising a first chip (10), a first circuit board (20) and a cable module (30);

the first chip (10) comprises a first signal pin (12) and a second signal pin (14) which are arranged on the same side;

the first circuit board (20) is provided with a first through hole (23), and the second signal pin (14) is electrically connected with the first circuit board (20);

the cable module (30) comprises a first fixing seat (31) and a cable (32), the first fixing seat (31) is fixed on the first circuit board (20) and at least partially located in the first through hole (23), and a first end portion (321) of the cable (32) is fixed on the first fixing seat (31) and electrically connected with the first signal pin (12).

2. The signal transmission assembly (100) of claim 1, wherein the number of cables (32) is one, one cable (32) being used for transmitting high speed signals; or, the number of the cables (32) is a plurality, and at least one cable (32) is used for transmitting high-speed signals.

3. The signal transmission assembly (100) of claim 1 or 2, wherein the first circuit board (20) is configured to transmit low speed signals, power or high speed signals.

4. The signal transmission assembly (100) of any of claims 1 to 3, wherein the cable (32) comprises an inner conductor (324), a dielectric layer (325), and an outer conductor (326), the dielectric layer (325) encasing the inner conductor (324), the outer conductor (326) encasing the dielectric layer (325);

the inner conductor (324) is electrically connected to the first signal pin (12), the first chip (10) further includes a first ground pin (13), the first ground pin (13) is used for providing a ground reference for the first signal pin (12), and the first ground pin (13) is electrically connected to the outer conductor (326).

5. The signal transmission assembly (100) of claim 4, wherein the cable module (30) further comprises a first pad (315), a portion of the first pad (315) being secured to the end face (3243) of the first end portion (3242) of the inner conductor (324), another portion of the first pad (315) being secured to the end face (3253) of the first end portion (3252) of the dielectric layer (325);

the first pad (315) is electrically connected to an inner conductor (324) of the cable (32) and is insulated from an outer conductor (326) of the cable (32), and the first pad (315) is electrically connected to the first signal pin (12).

6. The signal transmission assembly (100) according to claim 5, wherein the cable module (30) further comprises a first resilient piece (317), the first resilient piece (317) is fixed to the first bonding pad (315), and the first resilient piece (317) is electrically connected to the first signal pin (12).

7. The signal transmission assembly (100) according to any one of claims 4 to 6, wherein the cable module (30) further includes a first ground layer (314), a portion of the first ground layer (314) is located on the surface of the first fixing base (31), and another portion of the first ground layer (314) is located on the end surface (3262) of the first end portion (3261) of the outer conductor (326);

the first grounding layer (314) is electrically connected with an outer conductor (326) of the cable (32) and is insulated from an inner conductor (324) of the cable (32), and the first grounding layer (314) is electrically connected with the first grounding pin (13).

8. The signal transmission assembly (100) according to claim 7, wherein the cable module (30) further comprises a second pad (316), the second pad (316) being fixed to a surface of the first ground layer (314) remote from the first fixing base (31);

the second pad (316) is electrically connected to the first ground layer (314), and the second pad (316) is electrically connected to the first ground pin (13).

9. The signal transmission assembly (100) of any one of claims 1 to 8, wherein the signal transmission assembly (100) further comprises a socket connector (40), the socket connector (40) being disposed between the first chip (10) and the first circuit board (20);

the seat connector (40) comprises a first signal elastic sheet (42) and a second signal elastic sheet (44);

one side of the first signal elastic sheet (42) is electrically connected to the first signal pin (12), the other side of the first signal elastic sheet is electrically connected to the first end portion (321) of the cable (32), one side of the second signal elastic sheet (44) is electrically connected to the second signal pin (14), and the other side of the second signal elastic sheet is electrically connected to the first circuit board (20).

10. The signal transmission assembly (100) according to any one of claims 1 to 9, wherein the first fixed seat (31) is in interference fit with a hole wall of the first through hole (23).

11. The signal transmission assembly (100) of any one of claims 1 to 10, wherein the first chip (10) further comprises a second ground pin (15), the second ground pin (15) being configured to provide a ground reference for the second signal pin (14), the second ground pin (15) being electrically connected to the first circuit board (20) and being grounded through the first circuit board (20).

12. The signal transmission assembly (100) according to any one of claims 1 to 11, wherein the cable module (30) further comprises a second fixing seat (34), and a middle portion (322) of the cable (32) is fixed to the second fixing seat (34) along an extending direction of the cable (32).

13. The signal transmission assembly (100) of any one of claims 1 to 12, wherein the signal transmission assembly (100) further comprises a second circuit board (50) and a second chip (60);

the second chip (60) comprises a first signal terminal (62) and a second signal terminal (64) which are arranged on the same side;

the second circuit board (50) is provided with a third through hole (53), and the second signal end (64) is electrically connected to the second circuit board (50);

the cable module (30) further comprises a third fixing seat (33), the third fixing seat (33) is fixed on the second circuit board (50) and at least partially located in the third through hole (53), and a second end portion (323) of the cable (32) is fixed on the third fixing seat (33) and electrically connected to the first signal end (62).

14. The signal transmission assembly (100) of claim 13, wherein the second circuit board (50) is of unitary construction with the first circuit board (20).

15. A communication system (1000) comprising a connector and a signal transmission assembly (100) according to any one of claims 1 to 12;

the connector electrically connects a second end (323) of the cable (32), the connector also electrically connects the first circuit board (20) to electrically connect to the second signal pin (14) through the first circuit board (20).

16. The communication system (1000) of claim 15, wherein the connector is a backplane connector (300), the backplane connector (300) comprising a backplane connector female receptacle (310) and a backplane connector male receptacle (320), the backplane connector female receptacle (310) being secured to the first circuit board (20), the backplane connector female receptacle (310) being electrically connected to the second end (323) of the cable (32) for electrical connection to the first signal pins (12) by the cable (32), the backplane connector female receptacle (310) also being electrically connected to the first circuit board (20) for electrical connection to the second signal pins (14) by the first circuit board (20);

the communication system (1000) further comprises a backplane (200), the backplane connector male socket (320) is fixed to the backplane (200) and electrically connected to the backplane (200), and the backplane connector female socket (310) is electrically connected to the backplane connector male socket (320).

17. The communication system (1000) of claim 15, wherein the connector is an I/O connector (400);

the communication system (1000) further comprises a system circuit board (500) and a functional module (600), the I/O connector (400) being electrically connected to the system circuit board (500);

the function module (600) is fixed to the system circuit board (500), and the function module (600) is electrically connected to the system circuit board (500) to be electrically connected to the I/O connector (400) through the system circuit board (500).

18. A cable assembly (101) comprising a first circuit board (20) and a cable module (30);

the first circuit board (20) is provided with a first through hole (23), and the first circuit board (20) is used for being electrically connected with the second signal pin (14) of the first chip (10);

the cable module (30) comprises a first fixing seat (31) and a cable (32), the first fixing seat (31) is fixed on the first circuit board (20) and at least partially located in the first through hole (23), a first end portion (321) of the cable (32) is fixed on the first fixing seat (31), and the first end portion (321) of the cable (32) is used for being electrically connected with the first signal pin (12) of the first chip (10).

19. The cable assembly (101) of claim 18, wherein the cable (32) includes an inner conductor (324), a dielectric layer (325), and an outer conductor (326), the dielectric layer (325) wrapping the inner conductor (324), the outer conductor (326) wrapping the dielectric layer (325);

the inner conductor (324) is used for being electrically connected with a first signal pin (12) of the first chip (10), the outer conductor (326) is used for being electrically connected with a first grounding pin (13) of the first chip (10), and the first grounding pin (13) is used for providing a grounding reference for the first signal pin (12).

20. The cable assembly (101) of claim 19, wherein the cable module (30) further comprises a first pad (315), a portion of the first pad (315) being secured to an end face (3243) of the first end portion (3242) of the inner conductor (324), another portion of the first pad (315) being secured to an end face (3253) of the first end portion (3252) of the dielectric layer (325);

the first bonding pad (315) is electrically connected with an inner conductor (324) of the cable (32) and is insulated from an outer conductor (326) of the cable (32), and the first bonding pad (315) is used for being electrically connected with a first signal pin (12) of the first chip (10).

21. The cable assembly (101) of claim 20, wherein the cable module (30) further comprises a first resilient tab (317); the first elastic sheet (317) is fixed to the first bonding pad (315), and the first elastic sheet (317) is used for being electrically connected with a first signal pin (12) of the first chip (10).

22. The cable assembly (101) of any one of claims 19 to 21, wherein the cable module (30) further comprises a first ground layer (314), a portion of the first ground layer (314) is located on the surface of the first fixing base (31), and another portion of the first ground layer (314) is located on an end surface (3262) of the first end portion (3261) of the outer conductor (326);

the first grounding layer (314) is electrically connected with an outer conductor (326) of the cable (32), the first grounding layer (314) is also arranged in an insulated mode with an inner conductor (324) of the cable (32), and the first grounding layer (314) is used for being electrically connected with a first grounding pin (13) of the first chip (10).

23. The cable assembly (101) of claim 22, wherein the cable module (30) further comprises a second pad (316), the second pad (316) being fixed to a surface of the first ground layer (314) remote from the first anchor (31);

the second bonding pad (316) is electrically connected with the first grounding layer (314), the second bonding pad (316) is arranged in an insulated mode with an inner conductor (324) of the cable (32), and the second bonding pad (316) is used for being electrically connected with a first grounding pin (13) of the first chip (10).

24. The cable assembly (101) of any one of claims 18 to 23, wherein the cable assembly (101) further comprises a socket connector (40), the socket connector (40) being disposed on the same side of the first circuit board (20) as the first fixed socket (31);

the socket connector (40) comprises a first signal elastic sheet (42) and a second signal elastic sheet (44);

one side of the first signal elastic sheet (42) is used for being electrically connected with the first signal pin (12), the other side of the first signal elastic sheet is electrically connected with the first end portion (321) of the cable (32), one side of the second signal elastic sheet (44) is used for being electrically connected with the second signal pin (14), and the other side of the second signal elastic sheet is electrically connected with the first circuit board (20).

25. The cable assembly (101) of any one of claims 18 to 24, wherein the first anchor (31) is an interference fit with a bore wall of the first through bore (23).

26. The cable assembly (101) according to any one of claims 18 to 25, wherein the cable module (30) further comprises a second fixing seat (34), a middle portion (322) of the cable (32) being fixed to the second fixing seat (34) in an extension direction of the cable (32).

27. The cable assembly (101) according to any one of claims 18 to 26, wherein the cable assembly (101) further comprises a second circuit board (50), the second circuit board (50) being provided with a third through hole (53), the second circuit board (50) being for electrical connection with the second signal terminal (64) of the second chip (60);

the cable module (30) further comprises a third fixing seat (33), the third fixing seat (33) is fixed to the second circuit board (50) and at least partially located in the third through hole (53), a second end portion (323) of the cable (32) is fixed to the third fixing seat (33), and the second end portion (323) of the cable (32) is used for being electrically connected with the first signal end (62) of the second chip (60).

28. The cable assembly (101) of any one of claims 18 to 27, wherein the number of cables (32) is one, one cable (32) being used for transmitting high speed signals; or, the number of the cables (32) is a plurality, and at least one cable (32) is used for transmitting high-speed signals.

29. A signal transmission assembly (100) comprising a first chip (10) and a cable module (30);

the first chip (10) comprises a first signal pin (12), the cable module (30) comprises a first fixing seat (31) and a cable (32), and a first end portion (321) of the cable (32) is fixed on the first fixing seat (31) and electrically connected to the first signal pin (12).

30. The signal transmission assembly (100) of claim 29, wherein the number of cables (32) is one, one cable (32) being used for transmitting high speed signals; or, the number of the cables (32) is a plurality, and at least one cable (32) is used for transmitting high-speed signals.

31. The signal transmission assembly (100) of claim 29 or 30, wherein the cable (32) comprises an inner conductor (324), a dielectric layer (325), and an outer conductor (326), the dielectric layer (325) encasing the inner conductor (324), the outer conductor (326) encasing the dielectric layer (325);