CN115133279A

CN115133279A - Miniaturized paster broadband microstrip antenna

Info

Publication number: CN115133279A
Application number: CN202210888885.8A
Authority: CN
Inventors: 刘爽; 刘玉辉
Original assignee: Inner Mongolia Xianhong Science Co ltd
Current assignee: Inner Mongolia Xianhong Science Co ltd
Priority date: 2022-07-27
Filing date: 2022-07-27
Publication date: 2022-09-30

Abstract

The invention discloses a miniaturized paster broadband microstrip antenna, which comprises: the antenna comprises a first radiator, a second radiator, a third radiator, a fourth radiator, a feed through hole, a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a microstrip line and a ground loop. The miniaturized paster wide band microstrip antenna has small size and limited occupied space, can be directly pasted on a PCB like an inductor and a capacitor, can be directly arranged in small electronic equipment, and provides great convenience for ID design and structural design. And for the user, the development cost of the antenna is close to zero.

Description

Miniaturized paster broadband microstrip antenna

Technical Field

The invention relates to the technical field of electronic equipment, in particular to a miniaturized paster wide-band microstrip antenna applied to electronic equipment.

Background

With the great popularization of the internet of things in the future, the communication demand of small equipment is higher and higher. The built-in antenna is necessarily required to be miniaturized and meet the requirement of a communication frequency band.

The miniaturization of the device brings challenges to the development of antennas for device development teams, however, not all development teams have an antenna development engineer, and therefore, a universal broadband miniaturized antenna is an urgent need.

Disclosure of Invention

The invention mainly aims to provide a universal broadband miniaturized patch-mountable microstrip antenna, which is greatly convenient for a team without antenna development members to design electronic products.

In order to achieve the above object, the present invention provides a miniaturized patch-attachable broadband microstrip antenna, the antenna comprising: first radiator, second radiator, third radiator, fourth radiator, feed through-hole, first dielectric substrate, second dielectric substrate, third dielectric substrate, microstrip line and ground loop, wherein:

the first radiator, the second radiator and the third radiator are sequentially arranged in a layered manner;

the first dielectric substrate is filled between the first radiator and the second radiator, the second dielectric substrate is filled between the second radiator and the third radiator, and the third dielectric substrate is filled between the third radiator and the ground loop;

the fourth radiator is arranged around the first radiator and penetrates through the first dielectric substrate, the second dielectric substrate and the third dielectric substrate;

the feed through hole is connected with the second radiator and connected with the microstrip line through the third radiator.

The first radiator, the second radiator, the third radiator, the fourth radiator, the feed through hole, the microstrip line and the ground loop are all made of metal materials; the relative dielectric constant of the second dielectric substrate is larger than that of the first dielectric substrate and that of the third dielectric substrate.

The third radiator is provided with an opening through which the feed through hole passes, and the opening in the third radiator is not physically connected with the feed through hole.

The radius of a round hole formed in the third radiator is more than twice of the radius of the feed through hole; the third radiator is paved on the upper surface of the third dielectric substrate, and the surface areas of the first radiator and the second radiator are smaller than the surface area of the third radiator.

The surface areas of the first radiator and the second radiator are the same, and the centers of the first radiator and the second radiator are on the same vertical line.

The fourth radiator is a group of through holes which penetrate through all the dielectric substrates; the fourth radiator is coupled with the second radiator; the fourth radiator penetrates through the third radiator and is connected with the third radiator; and the fourth radiator passes through the third dielectric substrate and then is connected with the ground loop.

The grounding loop is laid along the edge of the third dielectric substrate for a circle, and the width of the grounding loop is larger than 2 mm; the ground loop is provided with an opening near the microstrip line.

The microstrip line consists of five metal line segments, and the resonant frequency of the antenna is adjusted by adjusting the overall length of the microstrip line; the impedance of the antenna is finely adjusted by adjusting the width of each section of the wire.

And the tail end of the microstrip line and the outer surface of the grounding loop are provided with copper-exposed tin points for mounting the antenna patch on the printed circuit board.

The printed circuit board is provided with copper exposing points, and the size of the copper exposing points is larger than that of the outline of the copper exposing and tin adding points of the antenna.

The miniaturized paster wide-band microstrip antenna has the beneficial effects that:

the miniaturized paster wide band microstrip antenna has small size and limited occupied space, can be directly pasted on a PCB like an inductor and a capacitor, can be directly arranged in small electronic equipment, and provides great convenience for ID design and structural design. Compared with the prior art, the whole antenna adopts a miniaturized and paster-type design, is embedded into the design of an electronic product as a role of a passive device, and is greatly convenient for a team without an antenna development member to design the electronic product. And for the user, the development cost of the antenna is close to zero.

Drawings

Fig. 1 is a schematic view of an appearance structure of a miniaturized patch-attachable broadband microstrip antenna provided by the invention.

Fig. 2 is a schematic bottom structure diagram of the miniaturized patch-attachable broadband microstrip antenna provided by the invention.

Fig. 3 is a top schematic view of an internal structure of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention.

Fig. 4 is a bottom schematic view of an internal structure of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention.

Fig. 5 is a partial schematic diagram of a feed of the miniaturized patch-mountable wideband microstrip antenna provided by the present invention.

Fig. 6a, fig. 6b and fig. 6c are schematic diagrams of a patch of the miniaturized patch-able wideband microstrip antenna provided by the present invention, wherein fig. 6c is an enlarged schematic diagram of a position a in fig. 6 a.

Fig. 7 is a diagram of S11 of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.

In the description of the present application, it is to be understood that the terms "center", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", vertical "," horizontal "," top "," bottom "," inner "," outer ", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present application. Furthermore, the terms "primary" and "secondary" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "primary" or "secondary" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a miniaturized paster broadband microstrip antenna, which comprises a first radiator, a second radiator, a third radiator, a fourth radiator, a feed through hole, a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a microstrip line and a ground loop. A first dielectric substrate is filled between the first radiator and the second radiator, a second dielectric substrate is filled between the second radiator and the third radiator, a third dielectric substrate is filled between the third radiator and the ground loop, and the dielectric substrates with different dielectric constants are selected to be used for adjusting the impedance of the antenna and the maximum radiation direction of the antenna. The first radiator, the fourth radiator and the second radiator are coupled to widen the impedance bandwidth of the antenna, and the relative bandwidth reaches more than thirty percent. The copper exposure treatment of the microstrip line end part and the grounding loop at the bottom of the antenna can be directly pasted on a PCB. The whole antenna is designed in a miniaturized and pastable way and is embedded into the design of electronic products as a role of a passive device. The design of electronic products by teams without antenna development members is greatly facilitated.

As will be described in detail below.

Referring to fig. 1 and other drawings, fig. 1 is a schematic view of an appearance structure of a miniaturized patch-mountable wideband microstrip antenna provided by the present invention. Fig. 2 is a schematic bottom structure diagram of the miniaturized patch-attachable broadband microstrip antenna provided by the invention. Fig. 3 is a schematic top view of an internal structure of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention. Fig. 4 is a bottom schematic view of the internal structure of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention. Fig. 5 is a partial schematic diagram of a feeding portion of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention. Fig. 6a, 6b and 6c are schematic diagrams of the patch of the miniaturized patch-able broadband microstrip antenna provided by the invention. Fig. 7 is a diagram of S11 of the miniaturized patch-attachable broadband microstrip antenna provided by the present invention.

The microstrip antenna 100 may include a first radiator 1, a second radiator 3, a third radiator 5, a

fourth radiator

11, 12, 13, 14, 15, 16, 17, a feed through hole 7, a first dielectric substrate 2, a second dielectric substrate 4, a third dielectric substrate 6, a microstrip line 8, and a ground loop 9.

The first radiator 1, the second radiator 3, the third radiator 5, the

fourth radiator

11, 12, 13, 14, 15, 16, 17, the feed through hole 7, the microstrip line 8, and the ground loop 9 are made of a metal material, in this embodiment, copper on a printed circuit board. The constituent construction of each component will be explained in detail below.

A first dielectric substrate 2 is filled between the first radiator 1 and the second radiator 3, a second dielectric substrate 4 is filled between the second radiator 3 and the third radiator 5, and a third dielectric substrate 6 is filled between the third radiator 5 and the ground loop 9.

Preferably, the second dielectric substrate 4 has a relative dielectric constant greater than that of the first dielectric substrate 2 and the third dielectric substrate 6.

In combination, the antenna 100 is comprised of three dielectric layers and four metal layers. The third radiator 5 is disposed over the entire upper surface of the third dielectric substrate 6, and is coupled to the second radiator 3 as a main ground plane to generate an upward directional pattern with a maximum radiation direction. The size of the second radiator 3 is a first consideration for the antenna design.

The antenna is designed to operate at 4.5GHz to 7.5GHz, i.e. a center frequency of 6 GHz. The second dielectric substrate 4 may be selected from commonly used materials having a relative dielectric constant of 4.6. After the central frequency and the relative dielectric constant are determined, the size of the main radiator of the antenna can be roughly determined according to an empirical formula of the microstrip antenna.

The length of the second radiator 3 in this embodiment is preferably 13mm, and the width thereof is preferably 8 mm.

The feed through hole 7 is connected with the second radiator 3, and the feed through hole 7 passes through the third radiator 5 and is connected with the microstrip line 8. The round hole on the third radiator 5 is not physically connected with the feed through hole 7.

Preferably, the radius of the circular hole opened on the third radiator 5 is more than twice the radius of the feed through hole 7.

Preferably, the third radiator 5 is distributed over the entire upper surface of the third dielectric substrate 6, and the surface area of the third radiator 5 is larger than that of the second radiator 3.

In this embodiment, the length of the third radiator 5 is preferably 20mm, and the width thereof is preferably 13 mm.

The surface areas of the first radiator 1 and the second radiator 3 are smaller than the surface area of the third radiator 5.

Preferably, the first radiator 1 and the second radiator 3 have the same surface area, and the first radiator 1 and the second radiator 2 are centered on a vertical line. The first radiator 1 and the second radiator 2 are coupled to generate resonance, so that the impedance bandwidth of the antenna 100 is widened. The relative permittivity of the first dielectric substrate 2 is preferably lower than that of the second dielectric substrate 4. In the present embodiment, the relative dielectric constant of the first dielectric substrate 2 is preferably selected to be 2.2.

The

fourth radiator

11, 12, 13, 14, 15, 16, 17 is a set of multiple through holes penetrating all the dielectric substrates. The through holes 11, 12, 13, 14 and 15 are rectangular through holes with rounded corners, and the through

holes

16 and 17 are cylindrical through holes. A rectangular through hole 15 with a rounded corner is arranged near the upper edge of the antenna 100, rectangular through

holes

14 and 13 with rounded corners are respectively arranged near the left edge of the antenna, rectangular through holes 11 and 12 with rounded corners are respectively arranged near the right edge of the antenna, and cylindrical through

holes

16 and 17 are respectively arranged near the center of the lower edge of the antenna. The

fourth radiators

11, 12, 13, 14, 15, 16, 17 are coupled to the second radiator 3, which increases the impedance bandwidth of the antenna 100. Wherein, the cuboid through hole chamfer is convenient for production.

Furthermore, the

fourth radiator

11, 12, 13, 14, 15, 16, 17 passes through the third radiator 5 and is connected to the third radiator 5. The

fourth radiators

11, 12, 13, 14, 15, 16, 17 pass through the third dielectric substrate 6 and are connected to the ground loop 9. The ground loop 9 is laid around the edge of the third dielectric substrate 6 and preferably has a width greater than 2 mm. The ground loop 9 has an opening in the vicinity of the microstrip line 8, i.e. the ground loop 9 is physically disconnected from the microstrip line 8, and the opening at the ground loop 9 and the microstrip line 8 is preferably selected to be 0.2 mm.

The microstrip line 8 is composed of five metal line segments, and the resonant frequency of the antenna can be adjusted by adjusting the whole length; the impedance of the antenna can be finely adjusted by adjusting the width of each line section.

Preferably, the length of the microstrip line 8 is 11mm, the length of the first section of the line closest to the feed through hole 7 is 1mm, and the width is 0.25 mm; the length of the second section of wire is 3mm, and the width of the second section of wire is 0.2 mm; the third section of wire is 2.4mm long and 1mm wide; the length of the fourth section of wire is 3mm, and the width of the fourth section of wire is 0.2 mm; the length of the fifth line is 1.7mm, and the width is 0.6 mm. Trimming the individual line segments can adjust the capacitive and inductive impedances of the microstrip antenna 100.

Referring to fig. 5, the end of microstrip line 8 is provided with a copper-exposed tin point 81, and the outer surface of ground loop 9 is provided with a copper-exposed tin point 91, so that antenna 100 can be conveniently mounted on a printed circuit board.

Referring to fig. 6a, the antenna 100 is mounted on the printed circuit board 200. Referring to fig. 6b, the printed circuit board 200 is provided with copper-exposed dots 201, and the size of the copper-exposed dots 201 is slightly larger than the outline of the copper-exposed tin-added dots 91 on the outer surface of the ground loop 9.

See schematic 6c for an enlarged view of the vicinity of the copper-exposed tinning point 81 provided at the end of the microstrip line 8. The printed circuit board 200 is provided with a microstrip line 202 having a width equal to that of the fifth segment of the microstrip line 8, and the tail end of the microstrip line 202 is provided with a copper-exposed tin-adding point 203. After the antenna 100 is attached to the printed circuit board 200, the outer surface 91 of the ground loop 9 is physically connected to the printed circuit board 200 through the tin 204 at the copper-exposed point 201, and the copper-exposed tin-added point 81 at the tail end of the microstrip line 8 is physically connected to the printed circuit board 200 through the tin 204 at the copper-exposed tin-added point 203. The bottom of the antenna 100 is painted with an insulating treatment except for the exposed copper and tin points, which are electrically conductive. The printed circuit board 200 is painted with insulation except for the exposed copper and tin points.

After the above implementation, the schematic diagram of S11 of the antenna 100 is shown in fig. 7, where there are two resonance points of the antenna 100, and the relative bandwidth of the antenna exceeds thirty percent. The operating frequency band of the antenna 100 can be adjusted by fine-tuning the dimensions of the second radiator 3 and the microstrip line 8.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A miniaturized patchable broadband microstrip antenna, the antenna comprising: first radiator, second radiator, third radiator, fourth radiator, feed through-hole, first dielectric substrate, second dielectric substrate, third dielectric substrate, microstrip line and ground loop, wherein:

2. The antenna of claim 1, wherein the first radiator, the second radiator, the third radiator, the fourth radiator, the feed through hole, the microstrip line, and the ground loop are all of a metallic material; the relative dielectric constant of the second dielectric substrate is larger than that of the first dielectric substrate and that of the third dielectric substrate.

3. The antenna of claim 1, wherein the third radiator has an opening through which the feed via passes, and the opening of the third radiator is physically unconnected with the feed via.

4. The antenna of claim 3, wherein the radius of the circular hole opened on the third radiator is more than twice the radius of the feed through hole; the third radiator is paved on the upper surface of the third dielectric substrate, and the surface areas of the first radiator and the second radiator are smaller than the surface area of the third radiator.

5. The antenna of claim 4, wherein the first radiator and the second radiator have the same surface area and are centered on a vertical line.

6. The antenna of claim 1, wherein the fourth radiator is a set of a plurality of through holes passing through all of the dielectric substrates; the fourth radiator is coupled with the second radiator; the fourth radiator penetrates through the third radiator and is connected with the third radiator; and the fourth radiator passes through the third dielectric substrate and then is connected with the ground loop.

7. The antenna of claim 6, wherein the ground loop is laid down once along the edge of the third dielectric substrate, the ground loop having a width greater than 2 mm; the ground loop is provided with an opening near the microstrip line.

8. The antenna according to claim 1, wherein the microstrip line is composed of five metal wire segments, and the resonance frequency of the antenna is adjusted by adjusting the overall length of the microstrip line; the impedance of the antenna is finely adjusted by adjusting the width of each section of the wire.

9. The antenna of claim 1, wherein the ends of the microstrip line and the outer surface of the ground loop are provided with copper-exposed and tin-added points for mounting the antenna patch on a printed circuit board.

10. The antenna of claim 9, wherein the printed circuit board has copper exposed dots disposed thereon, the size of the copper exposed dots being greater than a size of a copper exposed and tin exposed dot profile of the antenna.