CN115133248A - Broadband negative group time delay microwave circuit based on laminated coupling patch - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及微波电路技术领域,具体而言,尤其涉及一种基于叠层耦合贴片的宽带负群时延微波电路。The present invention relates to the technical field of microwave circuits, in particular, to a broadband negative group delay microwave circuit based on laminated coupling patches.
背景技术Background technique
群时延失真是电路或系统中具有挑战性的问题之一,它会引入码间干扰而使信号失真,因此,基于负群时延微波电路的时延均衡技术应运而生,使得越来越多的学者展开了对高性能负群时延微波电路的研究。在通信系统中,放大器的线性度是影响系统性能的重要指标。前馈放大器的出现,使得线性度的问题变得相对容易,但是其缺点在于所使用的延时线体积过大,直接影响了整体系统集成度的提高,而用负群时延微波电路替代延时线可以有效解决这一问题。在宽带导航系统中,群时延失真会导致相关峰变形,而相关峰的畸变将导致相关器难以确定此相关峰主峰的真正位置,即相关器采样点的中心可能并不是信号到达的真正时间,从而导致测距偏差。消除群时延偏差或者减小其对测距的影响,是实现高精度导航不可回避的技术难题。负群时延微波电路可以均衡群时延特性,进而提高宽带卫星导航系统的定位精度。Group delay distortion is one of the challenging problems in circuits or systems. It will introduce intersymbol interference and distort the signal. Therefore, the delay equalization technology based on negative group delay microwave circuits emerges as the times require. Many scholars have carried out research on high-performance negative group delay microwave circuits. In the communication system, the linearity of the amplifier is an important index that affects the system performance. The emergence of the feedforward amplifier makes the problem of linearity relatively easy, but its disadvantage is that the delay line used is too large, which directly affects the improvement of the overall system integration, and the negative group delay microwave circuit is used instead of the delay line. Timeline can effectively solve this problem. In the broadband navigation system, the distortion of the group delay will lead to the distortion of the correlation peak, and the distortion of the correlation peak will make it difficult for the correlator to determine the true position of the main peak of the correlation peak, that is, the center of the sampling point of the correlator may not be the real time of arrival of the signal , resulting in a ranging bias. Eliminating the group delay deviation or reducing its impact on ranging is an unavoidable technical problem in realizing high-precision navigation. The negative group delay microwave circuit can balance the group delay characteristics, thereby improving the positioning accuracy of the broadband satellite navigation system.
随着无线通信技术的发展,越来越多的新型通信标准被应用,支持宽频带工作的微波设备是必不可缺的。而微波电路的工作带宽直接影响了微波设备对宽频带通信的兼容性。目前,通常实现宽频带负群时延电路的方法是设计一个单频的负群时延电路,再改变其中心频率,最后将两个中心频率接近的负群时延电路组合到一起实现宽频带功能。但是,这种方法需要进行级联,会增加负群时延电路的插入损耗以及电路尺寸,不利于电路集成。因此,具有低损耗的小型宽带负群时延电路对于现代无线通信系统的发展是非常必要的。With the development of wireless communication technology, more and more new communication standards are applied, and microwave equipment that supports broadband operation is indispensable. The working bandwidth of microwave circuits directly affects the compatibility of microwave equipment for broadband communications. At present, the usual method to realize a broadband negative group delay circuit is to design a single-frequency negative group delay circuit, then change its center frequency, and finally combine two negative group delay circuits with close center frequencies to realize broadband. Function. However, this method needs to be cascaded, which will increase the insertion loss and circuit size of the negative group delay circuit, which is not conducive to circuit integration. Therefore, a small wideband negative group delay circuit with low loss is very necessary for the development of modern wireless communication systems.
发明内容SUMMARY OF THE INVENTION
根据上述提出为了在实现宽带负群时延的同时,解决级联方法引起的插入损耗大的技术问题,本发明提供一种基于叠层耦合贴片的宽带负群时延微波电路。本发明在不需要RLC谐振器等集总元件,不进行级联操作的情况下,实现了宽带负群时延,且具有插入损耗低、电路结构简单的特点。According to the above proposal, in order to solve the technical problem of large insertion loss caused by the cascading method while realizing the broadband negative group delay, the present invention provides a broadband negative group delay microwave circuit based on stacked coupling patches. The invention realizes the wideband negative group delay without needing lumped elements such as RLC resonators and without cascading operation, and has the characteristics of low insertion loss and simple circuit structure.
本发明采用的技术手段如下:The technical means adopted in the present invention are as follows:
一种基于叠层耦合贴片的宽带负群时延微波电路,包括:耦合贴片、传输线、介质板、金属地板、支撑材料、输入连接器和输出连接器;其中:A broadband negative group delay microwave circuit based on a laminated coupling patch, comprising: a coupling patch, a transmission line, a dielectric plate, a metal floor, a supporting material, an input connector and an output connector; wherein:
介质板包括下层介质板和上层介质板;The dielectric board includes a lower dielectric board and an upper dielectric board;
耦合贴片包括下层耦合贴片和上层耦合贴片;下层耦合贴片设置在下层介质板的上表面,上层耦合贴片设置在上层介质板的下表面;The coupling patch includes a lower-layer coupling patch and an upper-layer coupling patch; the lower-layer coupling patch is arranged on the upper surface of the lower-layer dielectric plate, and the upper-layer coupling patch is arranged on the lower surface of the upper-layer dielectric plate;
传输线设置在下层介质板的上表面;The transmission line is arranged on the upper surface of the lower dielectric plate;
金属地板设置在下层介质板的下表面;The metal floor is arranged on the lower surface of the lower dielectric board;
支撑材料包括支撑材料Ⅰ和支撑材料Ⅱ;Support material includes support material I and support material II;
下层介质板和上层介质板通过支撑材料固定到一起;The lower dielectric board and the upper dielectric board are fixed together by supporting materials;
输入连接器的内导体与传输线相连接,输入连接器的外导体与金属地板相连接;输出连接器的内导体与传输线相连接,输出连接器的外导体与金属地板相连接。The inner conductor of the input connector is connected with the transmission line, the outer conductor of the input connector is connected with the metal floor; the inner conductor of the output connector is connected with the transmission line, and the outer conductor of the output connector is connected with the metal floor.
进一步地,所述下层耦合贴片和上层耦合贴片均为正方形贴片,且尺寸相等。Further, the lower-layer coupling patch and the upper-layer coupling patch are both square patches and have the same size.
进一步地,所述支撑材料Ⅰ和所述支撑材料Ⅱ分别设置在下层介质板和上层介质板之间,且分布在下层介质板和上层介质板之间的两端。Further, the supporting material I and the supporting material II are respectively disposed between the lower dielectric plate and the upper dielectric plate, and are distributed at both ends between the lower dielectric plate and the upper dielectric plate.
进一步地,所述支撑材料Ⅰ和所述支撑材料Ⅱ的高度相同且可调整,通过调整所述支撑材料Ⅰ和所述支撑材料Ⅱ的高度从而调节负群时延微波电路的负群时延带宽。Further, the heights of the support material I and the support material II are the same and can be adjusted, and the negative group delay bandwidth of the negative group delay microwave circuit can be adjusted by adjusting the heights of the support material I and the support material II. .
进一步地,所述下层耦合贴片与传输线的间距可调整,通过调整所述下层耦合贴片与传输线的间距从而调节中心频率处的负群时延值。Further, the distance between the lower coupling patch and the transmission line can be adjusted, and the negative group delay value at the center frequency can be adjusted by adjusting the distance between the lower coupling patch and the transmission line.
较现有技术相比,本发明具有以下优点:Compared with the prior art, the present invention has the following advantages:
1、本发明提供的基于叠层耦合贴片的宽带负群时延微波电路,能够实现宽带负群时延的同时,解决级联方法引起的插入损耗大的问题。1. The broadband negative group delay microwave circuit based on the laminated coupling patch provided by the present invention can realize the broadband negative group delay and at the same time solve the problem of large insertion loss caused by the cascade method.
2、基于叠层耦合贴片的宽带负群时延微波电路,具有插入损耗低、负群时延带宽宽、电路结构简单、调节方法简便等优点。2. The broadband negative group delay microwave circuit based on the laminated coupling patch has the advantages of low insertion loss, wide negative group delay bandwidth, simple circuit structure, and simple adjustment method.
基于上述理由本发明可在微波电路与系统等领域广泛推广。Based on the above reasons, the present invention can be widely promoted in the fields of microwave circuits and systems.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图做以简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.
图1为本发明基于叠层耦合贴片的宽带负群时延微波电路的结构示意图。FIG. 1 is a schematic structural diagram of a broadband negative group delay microwave circuit based on a laminated coupling patch according to the present invention.
图2为本发明基于叠层耦合贴片的宽带负群时延微波电路的俯视图。FIG. 2 is a top view of the broadband negative group delay microwave circuit based on the laminated coupling patch of the present invention.
图3为本发明基于叠层耦合贴片的宽带负群时延微波电路的侧视图。FIG. 3 is a side view of the broadband negative group delay microwave circuit based on the laminated coupling patch of the present invention.
图4为本发明基于叠层耦合贴片的宽带负群时延微波电路的群时延曲线图。FIG. 4 is a group delay curve diagram of the broadband negative group delay microwave circuit based on the laminated coupling patch of the present invention.
图5为本发明基于叠层耦合贴片的宽带负群时延微波电路的S参数幅度曲线图。FIG. 5 is an S-parameter amplitude curve diagram of the broadband negative group delay microwave circuit based on the laminated coupling patch of the present invention.
图中:1、耦合贴片;11、下层耦合贴片;12、上层耦合贴片;2、传输线;3、介质板;31、下层介质板;32、上层介质板;4、金属地板;5、支撑材料;51、支撑材料Ⅰ;52、支撑材料Ⅱ;6、输入连接器;7、输出连接器。In the figure: 1, coupling patch; 11, lower coupling patch; 12, upper coupling patch; 2, transmission line; 3, dielectric board; 31, lower dielectric board; 32, upper dielectric board; 4, metal floor; 5 51. Supporting material I; 52. Supporting material II; 6. Input connector; 7. Output connector.
具体实施方式Detailed ways
需要说明的是,在不冲突的情况下,本发明中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本发明。It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is only a part of the embodiments of the present invention, but not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本发明的示例性实施方式。如在这里所使用的,除非上下文另外明确指出,否则单数形式也意图包括复数形式,此外,还应当理解的是,当在本说明书中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、组件和/或它们的组合。It should be noted that the terminology used herein is for the purpose of describing specific embodiments only, and is not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural as well, furthermore, it is to be understood that when the terms "comprising" and/or "including" are used in this specification, it indicates that There are features, steps, operations, devices, components and/or combinations thereof.
除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。同时,应当清楚,为了便于描述,附图中所示出的各个部分的尺寸并不是按照实际的比例关系绘制的。对于相关领域普通技术人员己知的技术、方法和设备可能不作详细讨论,但在适当情况下,所述技术、方法和设备应当被视为授权说明书的一部分。在这里示出和讨论的所有示例中,任向具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它示例可以具有不同的值。应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the invention unless specifically stated otherwise. Meanwhile, it should be understood that, for convenience of description, the dimensions of various parts shown in the accompanying drawings are not drawn in an actual proportional relationship. Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the authorized specification. In all examples shown and discussed herein, any specific values should be construed as illustrative only and not limiting. Accordingly, other examples of exemplary embodiments may have different values. It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further discussion in subsequent figures.
在本发明的描述中,需要理解的是,方位词如“前、后、上、下、左、右”、“横向、竖向、垂直、水平”和“顶、底”等所指示的方位或位置关系通常是基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,在未作相反说明的情况下,这些方位词并不指示和暗示所指的装置或元件必须具有特定的方位或者以特定的方位构造和操作,因此不能理解为对本发明保护范围的限制:方位词“内、外”是指相对于各部件本身的轮廓的内外。In the description of the present invention, it should be understood that the orientations indicated by orientation words such as "front, rear, top, bottom, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" etc. Or the positional relationship is usually based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and these orientation words do not indicate or imply the indicated device or element unless otherwise stated. It must have a specific orientation or be constructed and operated in a specific orientation, so it should not be construed as a limitation on the scope of protection of the present invention: the orientation words "inside and outside" refer to the inside and outside relative to the contour of each component itself.
为了便于描述,在这里可以使用空间相对术语,如“在……之上”、“在……上方”、“在……上表面”、“上面的”等,用来描述如在图中所示的一个器件或特征与其他器件或特征的空间位置关系。应当理解的是,空间相对术语旨在包含除了器件在图中所描述的方位之外的在使用或操作中的不同方位。例如,如果附图中的器件被倒置,则描述为“在其他器件或构造上方”或“在其他器件或构造之上”的器件之后将被定位为“在其他器件或构造下方”或“在其位器件或构造之下”。因而,示例性术语“在……上方”可以包括“在……上方”和“在……下方”两种方位。该器件也可以其他不同方式定位(旋转90度或处于其他方位),并且对这里所使用的空间相对描述作出相应解释。For ease of description, spatially relative terms, such as "on", "over", "on the surface", "above", etc., may be used herein to describe what is shown in the figures. The spatial positional relationship of one device or feature shown to other devices or features. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or features would then be oriented "below" or "over" the other devices or features under its device or structure". Thus, the exemplary term "above" can encompass both an orientation of "above" and "below." The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptions used herein interpreted accordingly.
此外,需要说明的是,使用“第一”、“第二”等词语来限定零部件,仅仅是为了便于对相应零部件进行区别,如没有另行声明,上述词语并没有特殊含义,因此不能理解为对本发明保护范围的限制。In addition, it should be noted that the use of words such as "first" and "second" to define components is only for the convenience of distinguishing corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood to limit the scope of protection of the present invention.
如图1-3所示,本发明提供了一种基于叠层耦合贴片的宽带负群时延微波电路,包括:耦合贴片1、传输线2、介质板3、金属地板4、支撑材料5、输入连接器6和输出连接器7;其中:As shown in Figures 1-3, the present invention provides a broadband negative group delay microwave circuit based on laminated coupling patches, including:
介质板3包括下层介质板31和上层介质板32;The
耦合贴片1包括下层耦合贴片11和上层耦合贴片12;下层耦合贴片11设置在下层介质板31的上表面,上层耦合贴片12设置在上层介质板32的下表面;The
传输线2设置在下层介质板31的上表面;The
金属地板4设置在下层介质板31的下表面;The
支撑材料5包括支撑材料Ⅰ51和支撑材料Ⅱ52;Support material 5 includes support material I51 and support material II52;
下层介质板31和上层介质板32通过支撑材料5固定到一起;The lower
输入连接器6的内导体与传输线2相连接,输入连接器6的外导体与金属地板4相连接;输出连接器7的内导体与传输线2相连接,输出连接器7的外导体与金属地板4相连接。The inner conductor of the
具体实施时,作为本发明优选的实施方式,所述下层耦合贴片11和上层耦合贴片12均为正方形贴片,且尺寸相等。During specific implementation, as a preferred embodiment of the present invention, the lower-
具体实施时,作为本发明优选的实施方式,所述支撑材料Ⅰ51和所述支撑材料Ⅱ52分别设置在下层介质板31和上层介质板32之间,且分布在下层介质板31和上层介质板32之间的两端。在本实施例中,支撑材料Ⅰ51和支撑材料Ⅱ52均为尼龙材料。In specific implementation, as a preferred embodiment of the present invention, the supporting material I51 and the supporting material II52 are respectively disposed between the
具体实施时,作为本发明优选的实施方式,所述支撑材料Ⅰ51和所述支撑材料Ⅱ52的高度相同且可调整,通过调整所述支撑材料Ⅰ51和所述支撑材料Ⅱ52的高度从而调节负群时延微波电路的负群时延带宽。在本实施例中,将支撑材料Ⅰ51和支撑材料Ⅱ52的高度分别调整为2mm时,此时负群时延微波电路的负群时延带宽被调节为112MHz。In specific implementation, as a preferred embodiment of the present invention, the heights of the supporting material I51 and the supporting material II52 are the same and adjustable, and the negative group can be adjusted by adjusting the heights of the supporting material I51 and the supporting material II52 Negative group delay bandwidth of microwave circuits. In this embodiment, when the heights of the supporting material I51 and the supporting material II52 are respectively adjusted to 2 mm, the negative group delay bandwidth of the negative group delay microwave circuit is adjusted to 112 MHz.
具体实施时,作为本发明优选的实施方式,所述下层耦合贴片11与传输线2的间距可调整,通过调整所述下层耦合贴片11与传输线2的间距从而调节中心频率处的负群时延值。在本实施例中,将下层耦合贴片11与传输线2的间距调整为0.35mm时,此时中心频率处的负群时延值被调节为-0.51ns。During specific implementation, as a preferred embodiment of the present invention, the distance between the
实施例Example
本实施例中列举了一种基于叠层耦合贴片的宽带负群时延微波电路,并对其在中心工作频率为2.45GHz的情况进行说明。如图4所示,本发明提供的基于叠层耦合贴片的宽带负群时延微波电路在工作频率2.45GHz处的群时延值为-0.51ns;在2.393GHz~2.505GHz频率范围内,群时延均为负值,负群时延带宽为112MHz(相对带宽为4.7%)。如图5所示,本发明提供的基于叠层耦合贴片的宽带负群时延微波电路在负群时延工作频率范围内插入损耗小于4.3dB,输入输出端口的回波损耗大于10.0dB。说明本发明提供的基于叠层耦合贴片的宽带负群时延微波电路能够实现宽带负群时延特性,同时插入损耗低,具有良好的端口匹配特性。In this embodiment, a broadband negative group delay microwave circuit based on stacked coupling patches is listed, and the case where the center operating frequency is 2.45 GHz is described. As shown in FIG. 4 , the group delay value of the broadband negative group delay microwave circuit based on the laminated coupling patch provided by the present invention is -0.51ns at the operating frequency of 2.45GHz; in the frequency range of 2.393GHz to 2.505GHz, The group delays are all negative values, and the negative group delay bandwidth is 112MHz (the relative bandwidth is 4.7%). As shown in FIG. 5 , the broadband negative group delay microwave circuit based on the laminated coupling patch provided by the present invention has an insertion loss of less than 4.3dB in the working frequency range of the negative group delay, and the return loss of the input and output ports is greater than 10.0dB. It is illustrated that the broadband negative group delay microwave circuit based on the laminated coupling patch provided by the present invention can realize the broadband negative group delay characteristic, and meanwhile has low insertion loss and good port matching characteristics.
综上所述,本发明提供的基于叠层耦合贴片的宽带负群时延微波电路实现了宽带负群时延特性,并且具有插入损耗低、相对带宽大等特点,非常适合应用于各类射频微波系统。To sum up, the broadband negative group delay microwave circuit based on the laminated coupling patch provided by the present invention realizes the broadband negative group delay characteristics, and has the characteristics of low insertion loss, large relative bandwidth, etc., and is very suitable for various applications. RF microwave system.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.
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