CN115132415A - 兼具粘合性和机械性能的低电阻聚乙烯护套 - Google Patents
兼具粘合性和机械性能的低电阻聚乙烯护套 Download PDFInfo
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Abstract
本发明涉及用于封装电缆芯的防水层,其中防水层包括厚度为t1的金属箔层和厚度为t2的半导体聚乙烯类聚合物单层,其中比率t2:t1为至少7,并且通过在至少100℃的挤出温度挤出,从而将半导体聚乙烯类聚合物单层沉积至金属箔层上,其中将金属箔层预热至至少100℃的温度。本发明还涉及包括所述防水层的电力电缆,以及用于制造这种防水层的方法。
Description
技术领域
本发明涉及一种适用于海底动力电力电缆的轻质、无铅且机械增强的防水层。
背景技术
电力电缆的载流部件通常需要保持干燥。湿气或水的侵入可导致电力电缆绝缘系统的电击穿。因此,通常由电缆芯周围径向布置的防水层保护电力电缆的芯部分。由于已经证明了铅是可靠且坚固的护套材料,因此迄今为止,用于电力电缆的防水层的主要材料为铅。
已知用于为海底电力电缆提供防水层的绝缘系统的若干解决方案,但这些解决方案都具有应当被克服的各种缺点。一个缺点是铅为高密度材料,从而显著增加了电缆的重量。重的重量会在包括制造、运输、储存、部署以及电缆达到其使用期限之后被丢弃在内的整个价值链中产生额外成本。另一缺点是铅具有相对低的抗疲劳性,使得铅防水层不太适用于动力电力电缆。此外,铅是相当有毒的材料,越来越受到环境法规的限制。因此,需要铅的环境友好的替代品作为电力电缆中的防水层。
EP 2 312 591公开了一种海底电力电缆,其包括由绝缘体围绕的电导体,所述绝缘体由金属防潮层围绕,其特征在于,电缆还包括围绕所述金属防潮层的半导体粘合剂层,以及围绕所述半导体粘合剂层的能够与海水电接触的半导体聚合物保护套,由金属防潮层、半导体粘合剂层和半导体聚合物保护套叠加而形成3层护套。
WO 2019/223878公开了一种电力电缆,其包括绝缘导体;铜防水层,其以具有焊接线的管形式围绕各绝缘导体;以及围绕各铜防水层的聚合物护套。铜防水层具有一定厚度并且聚合物护套具有一定厚度,使得铜防水层的厚度和聚合物护套的厚度之间的比率为至多0.15。
发明内容
发明目的
本发明的主要目的是提供一种适用于海底动力电力电缆的轻质、无铅且机械增强的防水层。
发明概述
本发明由所附权利要求书和以下内容限定。
本发明的目的可以通过以下方式实现:在电力电缆芯周围以周向方式铺设的Al、Cu或Fe或它们的合金的箔上使用半导体聚乙烯类聚合物单层,并且其中通过使半导体聚乙烯类聚合物单层具有相对于金属箔层的最小层厚度,从而赋予半导体聚乙烯类聚合物单层所需的机械强度。
另一目的是在金属箔层和半导体聚乙烯类聚合物单层之间实现足够的粘合性。这一目的可以通过在至少100℃的挤出温度挤出,从而将半导体聚乙烯类聚合物单层沉积至金属箔层上来实现,优选地,还将金属箔层加热至至少100℃的温度。
因此,在第一方面,本发明涉及一种用于围绕电缆芯的防水层,其中该防水层包括:
厚度为t1的作为内层的金属箔的层,以及
厚度为t2的作为外层的半导体聚乙烯类聚合物单层,
其中
比率t2:t1为至少7。
厚度差异,即比率t2:t1提供了所需的机械增强作用,使得防水层抗疲劳,并且能够耐受电缆弯曲而金属箔层不皱折。
如本文使用的术语“金属箔的层”或“金属箔层”是指作为防水层的金属层。本发明不局限于使用任何特定的金属/金属合金或金属箔的厚度。可以应用本领域技术人员已知的适用于电力电缆的防水层的任何厚度的任何金属/金属合金。可以焊接金属箔或以其他方式放置,使得金属箔形成防水层。
在示例性实施方案中,通过在至少100℃、至少110℃、至少120℃、至少130℃、至少140℃或至少150℃的挤出温度挤出,可以将半导体聚乙烯类聚合物单层沉积至金属箔层上。在另一实施方案中,挤出温度在100℃和150℃之间。在另一实施方案中,挤出温度在150℃和200℃之间。在另一实施方案中,挤出温度在200℃和250℃之间。
在另一实施方案中,将金属箔层的外表面预热至至少100℃的所述挤出温度。在另一实施方案中,表面温度在100℃和150℃之间。在另一实施方案中,表面温度在150℃和200℃之间。在另一实施方案中,表面温度在200℃和250℃之间。
在另一实施方案中,比率t2:t1可以在10和100之间。在另一实施方案中,比率t2:t1在15和50之间。在另一实施方案中,比率t2:t1在20和40之间。在另一实施方案中,比率t2:t1在25和30之间。在另一实施方案中,比率t2:t1在7和20之间。
在一个特定实施方案中,半导体聚乙烯类聚合物单层的挤出温度和金属箔层的表面温度基本上相同。
在另一实施方案中,在该过程之前,彻底清洁金属箔层的油脂和污垢。
在示例性实施方案中,金属箔可为以下中的一者:Al/Al合金,例如(如)美国铝业协会标准中的纯Al、AA1xxx系列、AA5xxx系列或AA6xxx系列;或Cu/Cu合金,例如(如)纯Cu、CuNi合金或CuNiSi合金;或Fe/Fe合金,例如(如)纯Fe、不锈钢合金SS316或不锈钢合金S32750。
在另一实施方案中,金属箔可为铜合金。在一个优选实施方案中,金属箔可为纯铜或CuNiSi合金。本文使用的术语“纯”是指杂质小于1重量%。
在另一实施方案中,金属箔(或金属管)可不起皱,以在半导体聚乙烯类聚合物单层和所述金属箔层(或金属管)之间获得基本上100%无空隙的界面。
在示例性实施方案中,金属箔层的厚度t1可为以下范围中的一者:10μm至1000μm,优选为10μm至700μm,更优选为10μm至500μm,更优选为10μm至250μm,并且最优选为10μm至75μm。
如本文使用的术语“半导体聚乙烯类聚合物单层”是指铺设在金属箔层上的聚合物层,并且起到使金属箔层防水层机械增强的作用。换句话说,聚合物层直接铺设在金属箔层上,而没有粘合剂中间层。
在一个示例性实施方案中,聚乙烯类聚合物可由以下制成:由丙烯酸、甲基丙烯酸、甲基丙烯酸缩水甘油酯、马来酸或马来酸酐中的一种或多种极性单体与乙烯的共聚物组成的低密度聚乙烯(LDPE)、线型低密度聚乙烯(LLDPE)、中密度聚乙烯(MDPE)或高密度聚乙烯(HDPE)。
合适的聚乙烯类聚合物的实例包括但不限于:乙烯和丙烯酸乙酯或类似的丙烯酸酯的共聚物;乙烯和乙基丙烯酸、甲基丙烯酸或类似物的共聚物;乙烯和甲基丙烯酸缩水甘油酯或类似的环氧基单体如1,2-环氧-1-丁烯或类似物的共聚物;或乙烯和马来酸酐或类似物的共聚物。当通过在至少100℃的高温挤出聚合物从而沉积,并使金属箔层的外表面处于至少100℃时,乙烯与一种或多种极性单体的这些共聚物将获得对金属箔层的优异粘合性。
在一个实施方案中,根据IEC62067,半导体聚合物层在金属箔层上的粘合力值大于0.5N/mm。在一个可供选择的实施方案中,根据IEC62067,粘合力值在0.5N/mm至5N/mm的范围内。在一个可供选择的实施方案中,根据IEC62067,粘合力值在1.0N/mm至1.5N/mm的范围内。
在一个示例性实施方案中,可以通过在聚合物主体中添加4重量%至40重量%的粒状碳、银或铝并使它们均匀分散,以使得能够带走电容性电荷,从而使聚乙烯类聚合物半导电。
合适的粒状碳的实例包括但不限于:粉末状石油焦、粉末状无烟煤、粉末状焦炭、炭黑、碳纳米管等。
在另一实施方案中,粒状碳可为炭黑。
如本文使用的术语“半导体的”是指电导率为中等水平,即处于电导体和电绝缘体的电导率之间的电导率。
在第二方面,本发明涉及一种电力电缆,其包括根据本发明的第一方面所述的防水层。
在电力电缆的一个实施方案中,防水层可为电力电缆的最外层。
在电力电缆的另一实施方案中,防水层可以覆盖有铠装层或外部外壳。
在另一方面,本发明涉及一种制造用于围绕电缆芯的防水层的方法,该方法包括以下步骤:
a)提供厚度为t1的无铅金属箔层,
b)将所述层焊接在电缆芯周围,
c)将聚乙烯类聚合物加热至至少100℃的挤出温度,
d)将金属箔层的外表面加热至至少100℃的温度,
e)通过在至少100℃的挤出温度挤出,从而将厚度为t2的半导体聚乙烯类聚合物单层(5)沉积至金属箔层(4)上,
其中比率t2:t1为至少7。
附图说明
通过参考以下附图详细描述本发明:
图1a至图1b为围绕绝缘电导体的无铅抗皱折防水层的组件的截面图。
图2为具有围绕防水层的附加层的海底高压电缆的可供选择的实施方案的截面图。
具体实施方式
以超过72.5kV的最高连续电压(Um)运行的高压海底电力电缆需要是干燥的,并且这种电缆通常用IEC 60840推荐的Um>36kV的铅防水层作为护套。由于铅对环境具有负面影响,因此已经对铅护套进行了详细研究,并且未来很可能被禁止。这意味着需要开发替代的解决方案。
作为替代的解决方案,已经评价了使用无铅金属和聚乙烯层压材料作为防水层。与较硬材料(例如焊接的铜)的防水层相关的一个挑战是弯曲时的抗皱折性差。
本领域已知的无铅防水层描述了一种层压系统,其包括金属箔层、粘合剂层和聚合物保护套。
图1a和图1b示出了本发明的一种组件,干式高压海底电力电缆1。电导体2围绕有绝缘系统3。所述电导体2和绝缘系统3是本领域已知的。如图1a所示,在该绝缘电缆导体(2、3)周围,布置并焊接有厚度为t1的金属箔层4。
其后,如图1b所示,通过在至少100℃的挤出温度挤出,从而将厚度为t2的半导体聚乙烯类聚合物单层5沉积至清洁的金属箔层4上,其中将金属箔层4预热至至少100℃的温度。
金属箔层4
根据本发明的金属箔层4能够具有满足根据本发明的电学特性需求和抗疲劳性所需的厚度。
金属箔层4由导电金属材料形成,优选地由(例如)铜、钢或铝组成,并且更优选地由易于焊接的金属形成。在一个示例性实施方案中,金属箔为以下中的一者:Al/Al合金,例如(如)美国铝业协会标准中的AA1xxx系列、AA5xxx系列或AA6xxx系列合金;或Cu/Cu合金,例如(如)纯Cu、CuNi合金或CuNiSi合金;或Fe/Fe合金,例如(如)不锈钢合金SS316或不锈钢合金S32750。最优选的金属防潮层为铜合金防潮层,优选为纯Cu或CuNiSi合金。
金属箔层4的最优选设计为管,因此金属箔层4优选为金属管。
可以由金属条带获得金属箔层4,该金属条带可以缠绕在电导体的绝缘体周围。然后,可以纵向焊接金属条带以形成外焊接或自焊接的金属管。因此,焊接护套的直径可以通过拉伸或轧制而减小。
金属箔层4(或金属管)可以优选为不起皱,以在半导体聚乙烯类聚合物单层5和所述金属箔层4(或所述金属管)之间获得基本上100%无空隙的界面。
在示例性实施方案中,金属箔层4的厚度t1可为以下范围中的一者:10μm至1000μm,优选为10μm至700μm,更优选为10μm至500μm,更优选为10μm至250μm,并且最优选为10μm至75μm。
半导体聚合物层5
半导体聚合物层5中的半导体聚乙烯类聚合物通常为用于电绝缘应用的任意聚乙烯类聚合物,并且优选是可容易挤出的,通过掺入半导电填料而使该聚合物成为半导体。
在一个示例性实施方案中,聚乙烯类聚合物可为以下中的一者:由丙烯酸、甲基丙烯酸、甲基丙烯酸缩水甘油酯、马来酸、或马来酸酐或它们的任意组合中的一种或多种极性单体与乙烯的共聚物组成的低密度聚乙烯(LDPE)、线型低密度聚乙烯(LLDPE)、中密度聚乙烯(MDPE)或高密度聚乙烯(HDPE)。
合适的聚乙烯类聚合物的实例包括但不限于:
-乙烯和丙烯酸乙酯或类似的丙烯酸酯的共聚物;
-乙烯和乙基丙烯酸、甲基丙烯酸或类似物的共聚物;
-乙烯和甲基丙烯酸缩水甘油酯或类似的环氧基单体如1,2-环氧-1-丁烯或类似物的共聚物;
-乙烯和马来酸酐或类似物的共聚物。
当通过在至少100℃的高温挤出聚合物从而沉积,并使金属箔的外表面处于至少100℃时,乙烯与一种或多种极性单体的这些共聚物将获得对金属箔层4的优异粘合性。这些温度是独立选择的。根据本发明的一个具体实施方案,这些温度相同。
在一个示例性实施方案中,可以通过在聚合物主体中添加4重量%至40重量%的粒状碳、银或铝并使它们均匀分散,以使得能够带走电容性电荷,从而使聚乙烯类聚合物半导电。
合适的粒状碳的实例包括但不限于:粉末状石油焦、粉末状无烟煤、粉末状焦炭、炭黑、碳纳米管等。
在优选的半导体聚合物层5中引入了大量炭黑,所述炭黑占成分组成的4重量%至30重量%。
根据本发明的具体实施方案,半导体聚合物层5可为电缆的最外层。
此外,半导体聚合物层5可以不交联。
由于在金属箔层4和半导体聚合物层5之间没有粘合剂层,因此为了使聚合物层5对金属箔层4具有更好的粘合性,可以有利地在超过100℃的高温挤出聚合物,并且有利地,还可以在超过100℃预热金属箔层4的外表面。这可以(例如)通过感应加热或通过空气加热来实现。有利地,在该过程之前,还可以彻底清洁金属箔层4的外表面的油脂和污垢。聚合物层5具有足够的厚度以保证必要的机械稳定性,也就是说聚合物层5的厚度是金属箔层4的厚度的至少七倍。
可以根据IEC62067进行半导体聚合物层5在金属箔层4上的粘合力测试。为了满足要求,按照IEC62067,剥离强度应当大于0.5N/mm。
在一个实施方案中,根据IEC62067,半导体聚合物层5在金属箔层4上的粘合力值大于0.5N/mm。在一个可供选择的实施方案中,根据IEC62067,粘合力值在0.5N/mm至5N/mm的范围内。在一个可供选择的实施方案中,根据IEC62067,粘合力值在1.0N/mm至1.5N/mm的范围内。
外层
如图2所示,根据本发明的包括防水层的海底电力电缆还可包括附加层,该附加层可(例如)为铠装层或外部外壳。
Claims (14)
1.一种用于围绕电缆芯的防水层,其中所述防水层包括:
厚度为t1的作为内层的无铅金属箔层(4),以及
厚度为t2的作为外层的半导体聚乙烯类聚合物单层(5),
其中比率t2:t1为至少7。
2.根据权利要求1所述的防水层,其中通过在至少100℃的挤出温度挤出,从而将半导体聚乙烯类聚合物单层(5)沉积至金属箔层(4)上,将所述金属箔层(4)的外表面加热至至少100℃的温度。
3.根据权利要求1或2所述的防水层,其中所述金属箔层(4)由以下中的一者组成的导体金属材料形成:
Al或Al合金,例如美国铝业协会标准中的纯Al、AA1xxx系列、AA5xxx系列或AA6xxx系列合金;或
Cu或Cu合金,例如纯Cu、CuNi合金或CuNiSi合金;或
Fe或Fe合金,例如纯Fe、不锈钢合金SS316或不锈钢合金S32750。
4.根据前述权利要求中任一项所述的防水层,其中所述金属箔层(4)由以下组成的导体金属材料形成:Cu或Cu合金,优选为纯铜、CuNi合金或CuNiSi合金。
5.根据前述权利要求中任一项所述的防水层,其中所述金属箔层(4)不起皱。
6.根据前述权利要求中任一项所述的防水层,其中所述金属箔层(4)的厚度为10μm至1000μm,优选为10μm至700μm,更优选为10μm至500μm,更优选为10μm至250μm,并且最优选为10μm至75μm。
7.根据前述权利要求中任一项所述的防水层,其中所述半导体聚乙烯类聚合物单层(5)中的所述聚乙烯类聚合物选自:由丙烯酸、甲基丙烯酸、甲基丙烯酸缩水甘油酯、马来酸、马来酸酐或它们的任意组合中的一种或多种极性单体与乙烯的共聚物组成的低密度聚乙烯、线型低密度聚乙烯、中密度聚乙烯或高密度聚乙烯。
8.根据前述权利要求中任一项所述的防水层,其中通过在聚合物主体中添加4重量%至40重量%的粒状碳、银或铝并使它们均匀分散,从而使聚乙烯类聚合物半导电。
9.根据权利要求8所述的防水层,其中所述粒状碳为粉末状石油焦、粉末状无烟煤、粉末状焦炭、炭黑或碳纳米管。
10.根据权利要求8所述的防水层,其中所述粒状碳为炭黑。
11.一种电力电缆,其包括根据前述权利要求中任一项所述的防水层,所述防水层围绕所述电力电缆的电缆芯。
12.根据权利要求11所述的电力电缆,其中所述防水层构成所述电力电缆的最外层。
13.根据权利要求11所述的电力电缆,其中所述防水层覆盖有铠装层或外部外壳。
14.一种制造用于围绕电缆芯的防水层的方法,所述方法包括以下步骤:
a)提供厚度为t1的无铅金属箔层(4),
b)将所述金属箔层(4)焊接在电缆芯周围,
c)将半导体聚乙烯类聚合物加热至至少100℃的温度,
d)将所述金属箔层(4)的外表面加热至至少100℃的温度,以及
e)通过在至少100℃的挤出温度挤出,从而将厚度为t2的半导体聚乙烯类聚合物单层(5)沉积至所述金属箔层(4)的外表面上,
其中比率t2:t1为至少7。
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GB1172483A (en) * | 1968-08-15 | 1969-12-03 | Standard Telephones Cables Ltd | Improvements in electric cables |
US4145567A (en) | 1977-06-06 | 1979-03-20 | General Cable Corporation | Solid dielectric cable resistant to electrochemical trees |
US4454379A (en) * | 1982-05-21 | 1984-06-12 | General Electric Company | Semi-conductive, moisture barrier shielding tape and cable |
US4725693A (en) * | 1986-09-08 | 1988-02-16 | Arvey Corporation | Power cable and laminate providing moisture barrier for power cable |
PT2312591T (pt) | 2009-08-31 | 2020-04-23 | Nexans | Barreira metálica anti-humidade resistente à fadiga em cabo elétrico submarino |
NO20101359A1 (no) * | 2010-09-30 | 2012-04-02 | Nexans | Kraftkabel med laminert vannbarriere |
GB201305519D0 (en) * | 2013-03-26 | 2013-05-08 | Jdr Cable Systems Ltd | High Voltage Cable |
EP3438993B1 (en) * | 2017-08-02 | 2021-10-06 | Nexans | A dynamic power cable |
BR112020023427A2 (pt) | 2018-05-25 | 2021-02-23 | Prysmian S.P.A. | cabo de força |
EP3786982B1 (en) * | 2019-08-26 | 2023-06-07 | Nexans | Cunisi alloy cable sheathing |
-
2021
- 2021-03-29 EP EP21305394.5A patent/EP4068309A1/en active Pending
-
2022
- 2022-03-22 US US17/701,357 patent/US20220336121A1/en active Pending
- 2022-03-28 KR KR1020220038169A patent/KR20220136205A/ko unknown
- 2022-03-28 CN CN202210312947.0A patent/CN115132415A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4068309A1 (en) | 2022-10-05 |
KR20220136205A (ko) | 2022-10-07 |
US20220336121A1 (en) | 2022-10-20 |
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