CN115119966A - Electronic atomization device, power supply assembly and support assembly - Google Patents

Abstract

The invention relates to an electronic atomization device, a power supply assembly and a bracket assembly; the bracket assembly comprises a bracket for accommodating the battery cell and a conductive structure arranged on the bracket; the conductive structure is formed on the bracket through a laser direct forming process and forms an integral structure with the bracket. The bracket component is formed on the bracket through the laser direct forming process of the conductive structure and forms an integral structure with the bracket, so that the automatic installation of the battery cell can be conveniently realized, and the automatic installation efficiency of the battery cell is improved.

Description

Electronic atomization device, power supply assembly and support assembly

Technical Field

The present disclosure relates to an atomizer, and more particularly, to an electronic atomizer, a power supply assembly and a bracket assembly.

Background

In the assembling process of the electric core of the electronic atomization device in the related art, the operation is complex, for example, wires need to be welded manually, so that an electric core structure which is simple in structure, rapid in assembly operation, safe and reliable is needed, and automatic production of the electric core is realized.

Disclosure of Invention

The present invention is directed to an improved electronic atomizer, and a power supply assembly and a bracket assembly thereof.

The technical scheme adopted by the invention for solving the technical problems is as follows: constructing a bracket assembly, which comprises a bracket for accommodating a battery cell and a conductive structure arranged on the bracket;

the conductive structure is formed on the bracket through a laser direct forming process and forms an integral structure with the bracket.

Preferably, the holder comprises a bottom wall, and at least part of the conductive structure is formed on an inner surface of the bottom wall.

Preferably, the bracket comprises a side wall;

at least part of the conductive structure is formed on the inner surface of the side wall.

Preferably, the battery cell comprises a first end extending along the length direction and a second end arranged opposite to the first end;

the electrically conductive structure extends from the first end to the second end of the cell.

Preferably, the support comprises a first accommodating cavity for accommodating the battery cell;

the conductive structure is formed in the first accommodating cavity.

Preferably, the bracket comprises a second accommodating cavity for accommodating the first circuit board;

the conductive structure extends from the first accommodating cavity to the second accommodating cavity.

Preferably, the bracket comprises a third accommodating cavity for accommodating the second circuit board;

the conductive structure extends from the first accommodating cavity to the third accommodating cavity.

Preferably, the conductive structure comprises a first electrode extending towards the second housing cavity;

the first electrode is formed in the second accommodating cavity through the laser direct forming process to be abutted against a first elastic electrode arranged on the first circuit board.

Preferably, a first positioning boss is arranged in the second accommodating cavity;

the first electrode is formed on the first positioning boss through the laser direct forming process.

Preferably, the conductive structure comprises a second electrode extending towards the third accommodating cavity;

the second electrode is formed in the third accommodating cavity through the laser direct forming process to be abutted against a second elastic electrode arranged on the second circuit board.

Preferably, a second positioning boss is arranged in the third accommodating cavity;

the second electrode is formed on the second positioning boss through the laser direct forming process.

Preferably, the conductive structure comprises at least one conductive member;

the conductive member includes an elongated conductive connection portion formed on the support through the laser direct structuring process over an entire length thereof.

Preferably, one end of the conductive connecting portion of each of the conductive members is provided with a first electrode, and the other end thereof is provided with a second electrode.

Preferably, the conductive connection portion, the first electrode, and the second electrode are integrally formed on the support by the laser direct structuring process, and form an integral structure with the support.

Preferably, the conductive structure comprises at least two conductive members;

each conductive piece is provided with a first electrode;

the first electrodes on the two adjacent conductive pieces are arranged in mirror symmetry.

Preferably, the conductive structure comprises at least two conductive members;

each conductive piece is provided with a second electrode;

the second electrodes on the two adjacent conductive pieces are arranged in mirror symmetry.

The invention also constructs a power supply assembly, which comprises the bracket assembly and a battery cell arranged on the bracket assembly.

The invention also constructs an electronic atomization device which comprises the power supply assembly and an atomizer connected with the power supply assembly.

The implementation of the electronic atomization device, the power supply assembly and the bracket assembly has the following beneficial effects: the bracket component forms the conductive structure on the bracket through the laser direct forming process and forms an integral structure with the bracket, so that the automatic installation of the battery cell can be conveniently realized, and the automatic installation efficiency of the battery cell is improved.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of an electronic atomizing device according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a power supply assembly of the electronic atomizer shown in FIG. 1;

FIG. 3 is a schematic diagram of a portion of the power supply assembly shown in FIG. 2;

FIG. 4 is an exploded view of a portion of the power supply assembly of FIG. 3;

FIG. 5 is a schematic structural view of a bracket assembly of the power supply assembly of FIG. 4;

FIG. 6 is a schematic structural view of a stent of the stent assembly shown in FIG. 5;

FIG. 7 is a schematic diagram of the conductive structure of the stent assembly of FIG. 5;

fig. 8 is a schematic structural view of a first circuit board of the power supply module shown in fig. 4;

fig. 9 is a schematic structural view of a second wiring board of the power supply module shown in fig. 4;

fig. 10 is a schematic structural diagram of a bracket assembly of an electronic atomizer according to a second embodiment of the present invention.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 shows a first embodiment of an electronic atomization device of the invention. In this embodiment, the electronic atomizer includes an atomizer a and a power supply assembly B; the atomizer a may be used to heat an atomizing medium. The power supply assembly B may be mechanically and/or electrically connected to the atomizer a, and may provide electrical energy to the atomizer a.

As shown in fig. 2 to 4, further, in the present embodiment, the power supply assembly includes a housing 10, a bracket assembly 20, a battery cell 30, a first circuit board 40, and a second circuit board 50. The housing 10 is used for accommodating the bracket assembly 20, the battery cell 30 and the first circuit board 40. The support assembly 20 is disposed in the housing 10 and can support the battery cell 30 and the first circuit board 40. The battery cell 30 is disposed on the support assembly 20, and is located at a lower portion of the support assembly 20, and is capable of providing electric energy to the atomizer a. The first circuit board 40 may be disposed on the bracket assembly 20 and may be electrically connected to the battery cell 30. The second circuit board 50 may be disposed on the bracket assembly 20, and may be electrically connected to the first circuit board 40, so as to be connected to an external power source to charge the battery cell 30.

Further, in the present embodiment, the housing 10 has a cylindrical structure with an opening at one end. The housing 10 may be an injection molded part, although it is understood that the housing 10 may be a metal housing in other embodiments.

As shown in fig. 5 to 6, further, in the present embodiment, the bracket assembly 20 may include a bracket 21 and a conductive structure 22. The bracket 21 may be used to accommodate the battery cell 30 and the first circuit board 40. The conductive structure 22 may be disposed on the frame 21 and may be integrally formed with the frame 21.

Further, in the present embodiment, the support 21 may be substantially flat, and in some embodiments, the cross-section of the support 21 may be oval. The support 21 may be an insulator, in particular, in some embodiments, the support 21 may be an injection molded part, and preferably, the support 21 is a plastic that can be laser activated. The plastic is a plastic containing an additive in the form of a specific organometallic complex which can be activated by a physicochemical reaction under irradiation of a focused laser beam. After activation, organic copper plating soaking is carried out to form a conductive circuit. Of course, it is understood that in other embodiments, the bracket 21 may not be limited to plastic material, and may be made of ceramic or other materials. Of course, it is understood that in some embodiments, the bracket 21 may not be limited to an insulating member, and may be disposed to be insulated from the conductive structure 22 by disposing an insulating member.

In this embodiment, the bracket 21 may include a bottom wall 211, a side wall 212, a first end wall 213, and a second end wall 214. The bottom wall 211 may be an elongated bottom wall, and the number of the side walls 212 is two, and the two side walls 212 may be disposed on two opposite sides of the bottom wall 211 and may be spaced apart from the bottom wall 211. The sidewall 212 and the bottom wall 211 can be integrally formed, a hollow structure 2110 can be disposed between the sidewall 212 and the bottom wall 211, and the hollow structure 2110 can facilitate the demolding of the entire support 21. The first end wall 213 can be disposed at one end of the bottom wall 211, and connected to the two side walls 212, and can be connected to the atomizer. The second end wall 214 can be disposed at the other end of the bottom wall 211, and is connected to the two side walls 212 and disposed opposite to the first end wall 213. The bottom wall 211, the side wall 212, the first end wall 213 and the second end wall 214 may form a cavity. Further, in some embodiments, the bracket 21 may also include a first partition wall 215 and a second partition wall 216; the first partition 215 may be disposed on the bottom wall 211, adjacent to the first end wall 213, and may be spaced apart from and parallel to the first end wall 213. The second partition wall 216 is disposed on the bottom wall 211, and is disposed adjacent to the second end wall 214, and may be spaced apart from and parallel to the second end wall 214. The first partition wall 215 and the second partition wall 216 can divide the chamber defined by the bottom wall 211, the side wall 212, the first end wall 213 and the second end wall 214 into three chambers. Further, in some embodiments, the bracket 21 may include a first housing cavity 2101, a second housing cavity 2102, and a third housing cavity 2103. The first accommodating cavity 2101 may be configured to accommodate a battery cell 30, and the first accommodating cavity 2101 may be located between the first partition wall 215 and the second partition wall 216; the second receiving cavity 2102 may be configured to receive the first circuit board 40 and may be located between the first end wall 213 and the first partition wall 215. The third receiving chamber 2103 may be used for receiving a second circuit board 50, and may be located between the second end wall 214 and the second partition 216.

As shown in fig. 5 and 7, in the present embodiment, the conductive structure 22 may be formed on the support 21 by a Laser Direct Structuring (LDS) process and is formed as an integral structure with the support 21. Specifically, in the present embodiment, the conductive structure 22 may be formed entirely on the bottom wall 211, and located on the inner surface of the bottom wall 211, and integrally formed with the bottom wall 211. Of course, it is understood that in other embodiments, the conductive structure 22 may be partially formed on the bottom wall 211 and may be integrally formed with the bottom wall 211, and in other embodiments, the conductive structure 22 may not be limited to being formed on the inner surface of the bottom wall 211. In this embodiment, the conductive structure 22 may be formed in the first accommodating cavity 2101, and one end of the conductive structure may extend from the first accommodating cavity 2101 to the second accommodating cavity 2102, and the other end of the conductive structure may extend from the first accommodating cavity 2101 to the third accommodating cavity 2103, and is electrically connected to the first circuit board 40 and the second circuit board 50, respectively. Of course, it is understood that in other embodiments, the conductive structure 22 may not be limited to being disposed in the first accommodating cavity 2101, and is not limited to extending from the first accommodating cavity 2101 to the second accommodating cavity 2102 and extending from the first accommodating cavity 2101 to the second accommodating cavity 2103.

Further, in the present embodiment, the conductive structure 22 may include two conductive members 22a and 22 b. The two conductive members 22a,22b may include a first conductive member 22a and a second conductive member 22 b; the first conductive member 22a may be a positive conductive member connected to the positive terminals of the first circuit board 40 and the second circuit board 50. The second conductive member 22b may be a negative conductive member, and may be connected to the negative terminals of the first circuit board 40 and the second circuit board 50. It is understood that in other embodiments, the conductive members 22a,22b are not limited to two, and may be one or more than two. In the present embodiment, the first conductive member 22a and the second conductive member 22b have substantially the same structure. In the present embodiment, both the two conductive members 22a,22b can be formed on the bottom wall 211 of the bracket 21 by a Laser Direct Structuring (LDS) process.

Further, in the present embodiment, the conductive members 22a and 22b may include a conductive connection portion 221, a first electrode 222, and a second electrode 223. The conductive connection portion 221, the first electrode 222, and the second electrode 223 may be integrally formed, and may be formed on the support 21 by a Laser Direct Structuring (LDS) process, and may be respectively formed as an integral structure with the support 21. In this embodiment, the first electrodes 222 on the two conductive elements 22a,22b may be arranged in a mirror symmetry manner, and the second electrodes 223 on the two conductive elements 22a,22b may be arranged in a mirror symmetry manner; of course, it is understood that in other embodiments, the first electrodes 222 of the two conductive elements 22a,22b may not be limited to being arranged in mirror symmetry, and the second electrodes 223 of the two conductive elements 22a,22b may not be limited to being arranged in mirror symmetry.

The conductive connection portion 221 may be an elongated sheet-shaped structure, and may be formed on the bracket 21 by a laser direct structuring process (LDS process) along the entire length, specifically, the conductive connection portion 221 may be formed on the inner surface of the bottom wall 211 by a laser direct structuring process (LDS process), and may be located in the first accommodating cavity 2101, and two ends of the conductive connection portion extend towards the second accommodating cavity 2102 and the second accommodating cavity 2103, respectively. It will be understood, of course, that in other embodiments, the conductive connection is not limited to being formed on the support 21 through a laser direct structuring process (LDS process) along the entire length thereof.

The first electrode 222 may be disposed at one end of the conductive connection portion 221, and may be connected to the conductive connection portion 221, specifically, in the embodiment, the first electrode 222 may extend toward the second receiving cavity 2102, and may be formed in the second receiving cavity 2102 by a laser direct structuring process (LDS process) and may be used for being conductively connected to the first circuit board 40. Specifically, in this embodiment, the bottom wall 211 is provided with a first positioning boss 2111, the first positioning boss 2111 may be disposed to protrude toward the second receiving cavity 2102, and the first positioning boss 2111 may be integrally formed with the bottom wall 211 in the second receiving cavity 2102. The first electrode 222 may be formed on the first positioning boss 2111 through a laser direct structuring process (LDS process) so as to abut against the first circuit board 40.

The second electrode 223 may be disposed at the other end of the conductive connection portion 221, and may be connected to the conductive connection portion 221, specifically, in this embodiment, the second electrode 223 may extend toward the third accommodating cavity 2103, and may be formed in the third accommodating cavity 2103 through a laser direct structuring process (LDS process), and may be used to be conductively connected to the second circuit board 50, specifically, in this embodiment, the bottom wall 211 is disposed with a second positioning boss 2112, and the second positioning boss 2112 may protrude toward the third accommodating cavity 2103 and may be located in the third accommodating cavity 2103. The second alignment boss 2112 may be integrally formed with the bottom wall 211. The second electrode 223 may be formed on the second positioning boss 2112 through a laser direct structuring process (LDS process) so as to be electrically connected to the second wiring board 50.

Further, in this embodiment, the battery core 30 may be accommodated in the first accommodating cavity 2101, and the battery core 30 may be a rechargeable battery and may be powered by an external power source, so as to continuously provide electric energy to the atomizer, thereby improving the cyclicity of the power supply assembly and reducing resource waste. In this embodiment, the battery cell 30 may include a cell body 31 and an electrode plate 32, the cell body 31 may be accommodated in the first accommodating cavity 2101, and the electrode plate 32 may be disposed at one end of the cell body 31, may extend toward the second accommodating cavity 2102, and may be connected to the first circuit board 40. The number of the electrode tabs 311 may be two, and may be a positive electrode tab and a negative electrode tab, and may be welded to the first circuit board 40. The cell 30 may include a first end 3101 and a second end 3102; the first end 3101 and the second end 3102 may extend along the length direction of the battery cell 30. The electrically conductive structure can extend from the first end 3101 of the cell 30 toward the second end 3102 of the cell 30, at least two of the first electrodes 222 of the electrically conductive structure 22 can be located at the first end 3101 of the cell 30, and in particular, the first electrodes 222 can extend from the bottom wall 211 along the first end 3101 of the cell 30, and at least two of the second electrodes 223 of the electrically conductive structure 22 can be located at the second end of the cell 30, and in particular, the second electrodes 223 can extend from the bottom wall 211 along the second end 3102 of the cell 30.

As shown in fig. 8, in the present embodiment, the first circuit board 40 can be accommodated in the second accommodating cavity 2102, the first circuit board 40 can include a first board body 41 and a first elastic electrode 42 disposed on the first board body 41, and the first elastic electrode 42 can be disposed in one-to-one correspondence with the first electrode 222, and further can be elastically abutted against the first electrode 222. In some embodiments, the first elastic electrode 42 may be a spring structure, and may be disposed on the first board body 41 by a SMT sheet-mounting process, so as to electrically connect the conductive structure 22 and the first circuit board 40. In this embodiment, an airflow sensing device 43 may be disposed on the first plate body 41, the airflow sensing device 43 may be located on a side opposite to the first elastic electrode 42, and the airflow sensing device 43 may be electrically connected to the first circuit board 40, and may be used to start the atomizer a. In some embodiments, the airflow sensing device 43 may be a microphone or a MEMS sensor.

Further, as shown in fig. 9, in the present embodiment, the second circuit board 50 may be accommodated in the second accommodating cavity 2102, and the second circuit board 50 may include a second board body 51, a charging interface 52 disposed on the second board body 51, and a second elastic electrode 53 disposed on the second board body 51. The second plate body 51 can be electrically connected to the charging interface 52. The charging connector 52 can be accommodated in the second accommodating cavity 2102, and the second end wall 214 can be disposed on a socket 2141 correspondingly disposed on the charging connector 52. In some embodiments, the charging interface 52 may be a USB interface, and may be connected to an external power source to access electric energy to the second circuit board 50, so as to charge the battery cell 30. It is understood that in other embodiments, the charging interface 52 may not be limited to a USB interface. In this embodiment, the second elastic electrode 53 may be disposed on the second plate body 51, may be disposed in one-to-one correspondence with the second electrode 223, and may further elastically abut against the second electrode 223. In some embodiments, the second electrode 223 may be a spring structure, and may be disposed on the second board body 51 by an SMT surface mount technology, and elastically abut against the second electrode 223, so that the second circuit board 50 is electrically connected to the conductive structure 22.

Further, in the present embodiment, the power supply unit may further include an air guide member 60. The air guide member 60 may be used to guide air to the air flow inducing device 43, facilitating the activation of the air flow inducing device 43. Further, in this embodiment, the air guide member 60 may be located in the second receiving cavity 2102, and in some embodiments, the air guide member 60 may be a silicone piece. Of course, it is understood that in other embodiments, the air guide member 60 may not be limited to a silicone member, and may be made of other soft materials. The air guide member 60 may be disposed on a side of the first circuit board 40 opposite to the air flow sensor 43, and may be electrically connected to the air flow sensor 43.

Further, in this embodiment, a liquid leakage preventing structure 217 may be further disposed on the bracket 21, and the liquid leakage preventing structure 217 may be integrally formed with the bracket 21 and may be configured to prevent the liquid medium in the air flow channel from leaking out; the liquid leakage preventing structure 217 may be located in the second receiving cavity 2102 of the bracket 21, may be located on the bottom wall 211, and may be integrally formed with the bottom wall 211 by injection molding. Specifically, in some embodiments, the leakage prevention structure 217 may be integrally formed with the bottom wall 211 by injection molding. In this embodiment, the liquid leakage preventing structure 217 may be disposed toward the air guide member 60, and may form a main passage of an air flow passage with the air guide member 60.

In this embodiment, the liquid leakage preventing structure 217 may include a liquid absorbing groove 2171, the liquid absorbing groove 2171 may be disposed on the bracket 21, and may be located in the second receiving cavity 2102, and may be located on the bottom wall 211, the liquid absorbing groove 2171 may be a capillary groove, and may absorb the liquid medium flowing out from the airflow channel by generating capillary force, so as to reduce corrosion of the liquid medium to the airflow sensing device 42 and the first circuit board 40. In some embodiments, the plurality of liquid suction grooves 2171 may be provided in plurality, and the plurality of liquid suction grooves 2171 are arranged side by side in a direction away from the vent hole 2131, so that the liquid medium can be stored step by step, specifically, they can be arranged side by side in the gas flow direction in the gas flow passage 100. In this embodiment, the vent hole 2131 is provided on the first end wall 213, the liquid suction groove 2171 may be a strip-shaped groove, and the liquid suction groove 2171 may be extended along both sides of the vent hole 2131 in a direction perpendicular to the air intake direction of the vent hole 2131, i.e., may be a transverse groove, so as to slow down the time for the condensate to flow down.

Further, in this embodiment, the liquid leakage preventing structure 217 may further include a groove wall 2172, the groove wall 2172 may be substantially rectangular parallelepiped structure, may be a frame body, and may be disposed on the outer periphery of the liquid suction groove 2171, so that the plurality of liquid suction grooves 2172 are disposed therein, the groove wall 2172 may enclose to form an embedded groove 2173, and the embedded groove 2173 may be used for embedding and installing the air guide member 60.

Further, in this embodiment, the power supply assembly B may further include a sealing member 70, and the sealing cover 70 may cover the opening of the second accommodating cavity 2102, may be pressed on the first circuit board 40, and may be connected and fixed with the bracket 21 through screws.

Further, in the present embodiment, the power supply module B may further include a sealing sleeve 80, and the sealing sleeve 80 may be sleeved on the first end wall 213 and may be hermetically connected to the housing 10. In some embodiments, the sealing sleeve 80 may be a silicone sleeve.

Further, in this embodiment, the power supply module B may further include two ejector pins 90, and the two ejector pins 90 may be mounted on the first end wall 213, with one end abutting against the atomizer a and the other end being electrically connected to the first circuit board 40. The first end wall 213 may be provided with through holes 2132 for the thimble 90 to correspondingly penetrate, and the through holes 2132 may be communicated with the second accommodating cavity 2102.

Further, in the embodiment, the power supply assembly B may further include a lamp post 100, and the lamp post 100 may be disposed on the sealing member 70, may protrude from the housing 10, may be connected to the first circuit board 40, and may be used to display the using state of the atomizer a.

Fig. 10 shows a second embodiment of the electronic atomizer device according to the present invention, which is different from the first embodiment in that the conductive structure 22 is formed on the inner surface of the sidewall 212 in part by a Laser Direct Structuring (LDS) process, and further, in the present embodiment, the conductive structure 22 is formed on the inner surface of the sidewall 212, specifically, the conductive connection structure of the conductive structure 22 is formed on the inner surface of the sidewall 212, the first electrode 222 is formed on the inner surface of the bottom wall 211 by a Laser Direct Structuring (LDS) process and is located on the first positioning boss 2111, and the second electrode 222 is formed on the inner surface of the bottom wall 211 and is located on the second positioning boss 2111 by a laser direct structuring (LDS process). The two conductive members 22a,22b may be disposed in one-to-one correspondence with the two sidewalls 212.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims (18)

1. A rack assembly is characterized by comprising a rack (21) for accommodating a battery core (30) and a conductive structure (22) arranged on the rack (21);

the conductive structure (22) is formed on the support (21) through a laser direct forming process and forms an integral structure with the support (21).

2. The rack assembly of claim 1, wherein the rack (21) comprises a bottom wall (211), and at least part of the conductive structure (22) is formed on an inner surface of the bottom wall (211).

3. The rack assembly of claim 1, wherein the rack (21) comprises a side wall (212);

at least a portion of the conductive structure (22) is formed on an inner surface of the sidewall (212).

4. The bracket assembly of claim 1, wherein the cell (30) comprises a first end (3101) extending in a length direction, and a second end (3102) disposed opposite the first end (3101);

the electrically conductive structure (22) extends from the first end (3101) to the second end (3102) of the cell (30).

5. The rack assembly of claim 1, characterized in that the rack (21) comprises a first housing cavity (2101) housing the battery cell (30);

the conductive structure (22) is formed in the first accommodating cavity (2101).

6. The bracket assembly of claim 5, wherein the bracket (21) comprises a second receiving cavity (2102) for receiving a first circuit board (40);

the conductive structure (22) extends from the first accommodating cavity (2101) to the second accommodating cavity (2102).

7. The bracket assembly according to claim 5, wherein the bracket (21) comprises a third housing cavity (2103) housing a second circuit board (50);

the conductive structure (22) extends from the first accommodating cavity (2101) to the third accommodating cavity (2103).

8. The rack assembly of claim 6, wherein the conductive structure (22) comprises a first electrode (222) extending toward the second housing cavity (2102);

the first electrode (222) is formed in the second accommodating cavity (2102) through the laser direct structuring process to abut against a first elastic electrode (42) arranged on the first circuit board (40).

9. The rack assembly of claim 8, wherein the second housing cavity (2102) has a first locating boss (2111) disposed therein;

the first electrode (222) is formed on the first positioning boss (2111).

10. The rack assembly according to claim 7, wherein the conductive structure (22) comprises a second electrode (223) extending towards the third housing cavity (2103);

the second electrode (223) is formed in the third accommodating cavity (2103) through the laser direct forming process so as to abut against a second elastic electrode (52) arranged on the second circuit board (50).

11. The bracket assembly of claim 10, wherein a second locating boss (2112) is provided in the third housing chamber (2103);

the second electrode (223) is formed on the second positioning boss (2112).

12. The rack assembly of claim 1, wherein said conductive structure (22) comprises at least one conductive member (22a,22 b);

the conductive member (22a,22b) includes an elongated conductive connecting portion (221), and the entire length of the conductive connecting portion (221) is formed on the holder (21) by the laser direct structuring process.

13. The rack assembly according to claim 12, wherein said conductive connection portion (221) of each of said conductive members (22a,22b) is provided with a first electrode (222) at one end and a second electrode (223) at the other end.

14. The bracket assembly of claim 13, wherein the conductive connection (221), the first electrode (222), and the second electrode (223) are integrally formed on the bracket (21) by the laser direct structuring process and form an integral structure with the bracket (21).

15. The rack assembly of claim 1, wherein said conductive structure (22) comprises at least two conductive elements (22a,22 b);

a first electrode (222) is arranged on each conductive member (22a,22 b);

the first electrodes (222) on two adjacent conductive members (22a,22b) are arranged in mirror symmetry.

16. The rack assembly of claim 1, wherein said conductive structure (22) comprises at least two conductive elements (22a,22 b);

a second electrode (223) is arranged on each conductive member (22a,22 b);

the second electrodes (223) on two adjacent conductive members (22a,22b) are arranged in mirror symmetry.

17. A power supply assembly, characterized by comprising a rack assembly (20) according to any one of claims 1 to 16, and an electric core (30) arranged on the rack assembly (20).

18. An electronic atomizer device, comprising the power supply assembly of claim 17 and an atomizer connected to said power supply assembly.

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