CN112841731A

CN112841731A - Electronic atomization device and power supply assembly thereof

Info

Publication number: CN112841731A
Application number: CN202110142756.XA
Authority: CN
Inventors: 徐文孝; 汪新宇
Original assignee: Shenzhen Smoore Technology Ltd
Current assignee: Shenzhen Smoore Technology Ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-05-28

Abstract

The invention relates to an electronic atomization device and a power supply assembly thereof, wherein the power supply assembly is used for the electronic atomization device and comprises a bracket, an airflow induction device arranged on the bracket and an airflow channel communicated with the airflow induction device; and the support is provided with a liquid leakage prevention structure for preventing liquid media in the airflow channel from leaking. This power supply unit prevents the leak protection liquid structure that the liquid medium of airflow channel spills through setting up on the support to reduce the corruption of liquid atomizing medium to airflow induction system and first circuit board, improve this power supply unit's performance.

Description

Electronic atomization device and power supply assembly thereof

Technical Field

The present disclosure relates to an atomizer, and more particularly, to an electronic atomizer and a power supply assembly thereof.

Background

In the related art electronic atomizer, the liquid atomized medium is liable to leak from the atomizer of the electronic atomizer and flow into the power supply assembly along the airflow channel of the airflow sensing device for activating the electronic atomizer, and contaminate the airflow sensing device and the circuit board in the power supply assembly.

Disclosure of Invention

The invention aims to provide an improved power supply assembly, and further provides an improved electronic atomization device.

The technical scheme adopted by the invention for solving the technical problems is as follows: constructing a power supply assembly for an electronic atomization device, which comprises a bracket, an airflow induction device arranged on the bracket, and an airflow channel communicated with the airflow induction device;

and the support is provided with a liquid leakage prevention structure for preventing the liquid medium of the airflow channel from leaking.

Preferably, the holder comprises a bottom wall;

the liquid leakage prevention structure is arranged on the bottom wall and is positioned in the airflow channel.

Preferably, the liquid leakage preventing structure includes a liquid suction groove for sucking the liquid medium flowing out of the air flow channel by generating a capillary force.

Preferably, the plurality of liquid suction grooves are arranged side by side along the gas flowing direction in the gas flow channel.

Preferably, the bracket is provided with a first end wall arranged opposite to an atomizer of the electronic atomization device;

and the first end wall is provided with a vent hole communicated with the airflow channel and the outside.

Preferably, the liquid suction groove is a strip-shaped groove, and the liquid suction groove extends towards two sides of the vent hole along the air inlet direction perpendicular to the vent hole.

Preferably, the liquid suction groove is a plurality of liquid suction grooves,

the plurality of liquid suction grooves are arranged side by side in the direction away from the vent hole.

Preferably, the width of the liquid suction groove is 0.3-0.4 mm.

Preferably, the liquid leakage preventing structure further comprises a groove wall, and the groove wall is arranged on the periphery of the liquid suction groove to form an embedded groove for embedding an air guide member for guiding air to the air flow induction device.

Preferably, the liquid leakage preventing structure is integrally formed with the bracket.

Preferably, the air flow channel comprises a main channel communicated with the air flow induction device; the liquid leakage preventing structure is arranged towards the main channel.

Preferably, the air flow passage further includes a first communication passage communicating with the outside and the main passage, and a second communication passage communicating with the main passage and the air flow sensing device.

Preferably, the air guide member is matched with the bracket to form the air flow channel.

Preferably, the air guide member further comprises at least one backflow groove communicating with the main channel to reduce backflow of condensate;

the liquid leakage prevention structure is arranged towards the backflow groove.

Preferably, the air guide member includes an insertion part fitted with the liquid leakage preventing structure;

the embedded part is provided with an air guide groove;

the air guide groove and the liquid leakage prevention structure form a main channel of the airflow channel together.

Preferably, the air guide member further includes a boss disposed at a side of the insertion portion opposite to the air guide groove and extending outward.

Preferably, the air guide member is a soft material.

Preferably, the power supply assembly further comprises a first circuit board connected with the airflow sensing device;

the airflow sensing device is arranged on the first circuit board.

The invention also constructs an electronic atomization device which is characterized by comprising the power supply assembly and an atomizer connected with the power supply assembly.

The electronic atomization device and the power supply assembly thereof have the following beneficial effects: this power supply unit sets up the liquid leakage prevention structure that sets up that prevents that airflow channel's liquid medium from spilling through setting up on the support to reduce the corruption of liquid atomizing medium to airflow induction system and first circuit board, improve this power supply unit's performance.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of an electronic atomizing device according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a power supply assembly of the electronic atomizer shown in FIG. 1;

FIG. 3 is a schematic diagram of a portion of the power supply assembly shown in FIG. 2;

FIG. 4 is a partial cross-sectional view of the power supply assembly of FIG. 3;

FIG. 5 is an exploded view of a portion of the power supply assembly of FIG. 3;

fig. 6 is a schematic structural diagram of a bracket assembly of the power supply assembly shown in fig. 3 accommodating a battery cell, a first circuit board and a second circuit board;

FIG. 7 is a schematic structural view of a bracket assembly of the power supply assembly of FIG. 6;

FIG. 8 is a structural schematic view of a stent of the stent assembly shown in FIG. 7;

FIG. 9 is a schematic diagram of the conductive structure of the stent assembly of FIG. 3;

FIG. 10 is a schematic view of the structure of the air directing structure of the power module shown in FIG. 3;

FIG. 11 is a schematic view of the seal of the power supply assembly of FIG. 3;

fig. 12 is a schematic structural diagram of a bracket assembly of an electronic atomizer according to a second embodiment of the present invention, which accommodates a battery cell, a first circuit board, and a second circuit board;

FIG. 13 is a schematic structural view of a bracket assembly of the power supply assembly of FIG. 12;

fig. 14 is a schematic structural diagram of a bracket assembly of an electronic atomizer according to a third embodiment of the present invention.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 shows a first embodiment of the electronic atomization device of the invention. In this embodiment, the electronic atomizer includes an atomizer a and a power supply assembly B; the atomizer a may be used to heat an atomized medium. The power supply assembly B may be mechanically and/or electrically connected to the atomizer a, and may provide electrical energy to the atomizer a.

As shown in fig. 2 to 5, further, in the present embodiment, the power supply assembly includes a housing 10, a bracket assembly 20, a battery cell 30, a first circuit board 40, a charging interface 50, and a second circuit board 60. The housing 10 is used for accommodating the bracket assembly 20, the battery cell 30 and the first circuit board 40. The support assembly 20 is disposed in the housing 10 and can support the battery cell 30 and the first circuit board 40. The battery cell 30 is disposed on the support assembly 20, and is located at a lower portion of the support assembly 20, and is capable of providing electric energy to the atomizer a. The first circuit board 40 may be disposed on the support assembly 20 and may be electrically connected to the battery cell 30. The charging interface 50 can be disposed on the bracket assembly 20 and can be used to connect with an external power source to charge the battery cell 30. The second circuit board 60 can be disposed on the bracket assembly 20 and can be electrically connected to the charging interface 50 and the first circuit board 40.

Further, in the present embodiment, the housing 10 has a cylindrical structure with an opening at one end. The housing 10 may be an injection molded part, although it will be appreciated that in other embodiments, the housing 10 may be a metal housing.

As shown in fig. 6 and 7, further, in the present embodiment, the bracket assembly 20 may include a bracket 21 and a conductive structure 22. The bracket 21 may be used to accommodate the battery cell 30 and the first circuit board 40. The conductive structure 22 may be disposed on the frame 21 and may be integrally formed with the frame 21.

Further, in the present embodiment, the support 21 may be substantially flat, and in some embodiments, the cross-section of the support 21 may be oval. The support 21 may be an insulating member, and in some embodiments, the support 21 may be an injection molded member, and preferably, the support 21 may be made of a plastic material. Of course, it is understood that in other embodiments, the frame 21 may not be limited to plastic material, and may be made of ceramic or other insulating material. Of course, it is understood that in some embodiments, the bracket 21 may not be limited to an insulating member, and may be disposed to be insulated from the conductive structure 22 by disposing an insulating member. In this embodiment, the bracket 21 may include a bottom wall 211, a side wall 212, a first end wall 213, and a second end wall 214.

The bottom wall 211 may be an elongated bottom wall, the bottom wall 211 may be provided with cut-outs 2111, the cut-outs 2111 may be spaced along the length direction of the bottom wall 211 for facilitating the cutting of the conductive structure 22, and in some embodiments, the bottom wall 211 may be further provided with positioning through holes 2112, and the positioning through holes 2112 may be used for positioning with the conductive structure 22.

The sidewalls 212 may be disposed on two opposite sides of the bottom wall 211, and may be spaced apart from the bottom wall 211. The sidewall 212 and the bottom wall 211 can be integrally formed, a hollow-out structure 2113 can be disposed between the sidewall 212 and the bottom wall 211, and the hollow-out structure 2113 can facilitate the demolding of the entire bracket 21. In some embodiments, the bracket 21 is provided with a first holding structure 2120, and particularly, the first holding structure 2120 can be located on the sidewall 212 and can be used for holding the first circuit board 40. Specifically, in some embodiments, the first clip structure 2120 may include two elastic buckles 2121, and the two elastic buckles 2121 may be located on two opposite sides of the bracket 21, may enable the entire bracket 21 to have a degree of deformation, and may be located on the two opposite side walls 212, and may be integrally formed with the side walls 212. In some embodiments, the two elastic buckles 2121 can cooperate with each other to hold the first circuit board 40, and when the manipulator holds the first circuit board 40 and mounts it on the bracket 21, the two elastic buckles 2121 can make the first circuit board 40 easier to mount and can adapt to the first circuit board 40 with a proper deviation, which is convenient for automatic production. Further, in this embodiment, the bracket 21 may be provided with a second clamping structure 2122, the second clamping structure 2122 may be configured to clamp the second circuit board 60, and the second clamping structure 2122 may be located at two opposite sides of the bracket 21, and specifically, in some embodiments, the second clamping structure 2122 may be located at the side wall 212, and may be a clamping position located at two opposite side walls, and the two clamping positions may cooperate with each other to clamp the second circuit board 60. Further, in this embodiment, a first avoiding hole 2123 may be disposed on the side wall 212, and the first avoiding hole 2123 may be used for detection by the infrared detection device. The first avoiding hole 2123 may communicate with the hollowed-out structure 2113. In this embodiment, the sidewall 212 may further include a second avoiding hole 2124, and the second avoiding hole 2124 and the first avoiding hole 2123 may be disposed at an interval along the length direction of the sidewall 212, and may be used for detection by an infrared detection device.

The first end wall 213 may be disposed at one end of the bottom wall 211, specifically, the first end wall 213 may be located at an end connected to the atomizer a, in some embodiments, a vent hole 2131 may be disposed on the first end wall 213, the vent hole 2131 may be used for transmitting gas to activate the airflow sensing device 42 on the first circuit board 40, in some embodiments, a first mounting hole 2132 may be further disposed on the first end wall 213, the first mounting hole 2132 may be used for mounting the magnetic attraction element 120, in some embodiments, the first mounting holes 2132 may be two, and the two first mounting holes 2132 may be sequentially disposed along a length direction of the first end wall 213. In some embodiments, the first end wall 213 may further include two second mounting holes 2133, and the two second mounting holes 2133 may be sequentially disposed along the length direction of the first end wall 213, may be located between the two first mounting holes 2132, and may be used for mounting the electrode pin 130.

The second end wall 214 can be disposed at the other end of the bottom wall 211, and the second end wall 214 can be formed with a plug-in port 2141, and the plug-in port 2141 can be used for plugging a power line, but it should be understood that in other embodiments, the plug-in port 2141 can be not limited to be connected to a power line, and can be used for being connected to a data line for data transmission. In some embodiments, the plug interface 2141 may be disposed corresponding to the charging interface 50, so that the charging interface 50 is connected to the power line. The first end wall 213 may be disposed parallel to the second end wall 214. The bottom wall 211, the side wall 212, the first end wall 213 and the second end wall 214 may enclose a receiving space having an opening and capable of receiving the battery cell 30 and the circuit board 40.

Further, in some embodiments, a blocking wall 210 may be further disposed on the bracket 21, and the blocking wall 210 may be used to divide the accommodating space of the bracket 21 into a first accommodating cavity 2101 and a second accommodating cavity 2102 and may support and limit the first circuit board 40, so as to prevent the conductive structure 22 from being damaged by pressure. The first accommodating cavity 2101 may be configured to accommodate the battery cell 30, and the second accommodating cavity 2102 may be configured to accommodate the first circuit board 40. In this embodiment, the first accommodating cavity 2101 and the second accommodating cavity 2102 may be independently disposed, and the first accommodating cavity 2101 and the second accommodating cavity 2102 may be isolated from each other, so as to prevent the electrolyte of the battery cell 30 from corroding the first circuit board 40, and further improve the sensitivity of the airflow sensing apparatus 42. In this embodiment, the first receiving cavity 2101 and the second receiving cavity 2102 may be rectangular, the second receiving cavity 2102 may be disposed side by side with the first receiving cavity 2101, and the second receiving cavity 2102 may be disposed near an end of the bracket 21 contacting the atomizer a. The size of the second accommodating cavity 2102 may be smaller than the size of the first accommodating cavity 2101, and specifically, the length of the second accommodating cavity 2102 is smaller than the length of the first accommodating cavity 2101, so that the electrolyte of the battery cell 30 may be better prevented from corroding the first circuit board 40, the length of the sensing air channel of the airflow sensing device 42 may be shortened, and the sensitivity of the airflow sensing device 42 may be improved. In this embodiment, the first accommodating cavity 2101 is correspondingly provided with a first opening 2104, the first opening 2104 can be used for placing the battery cell 30 into the first accommodating cavity 2101, and the first opening 2140 can be correspondingly disposed with the bottom wall 211. In this embodiment, a second opening 2105 is correspondingly disposed on the second accommodating cavity 2102, the second opening 2105 can be used for placing the first circuit board 40 into the second accommodating cavity 2102, and in this embodiment, the second opening 2105 can also be disposed opposite to the bottom wall 211. In this embodiment, the first holding structure 2120 can be located on two opposite sides of the second receiving cavity 2102.

In this embodiment, the bracket 21 may further include a third receiving cavity 2103, the third receiving cavity 2103 may be used for receiving the charging interface 50 and the third circuit board 30, and the third receiving cavity 2103 may be disposed at an end of the first receiving cavity 2101 far from the atomizer a. The third receiving chamber 2103 may be disposed adjacent to the second end wall 214. A third opening 2106 can be arranged on the third accommodating cavity 2103; the third opening 2106 is used for placing the charging interface 50 and the second circuit board 40 into the third receiving cavity 2103. In this embodiment, the second clamping structure 2122 can be located at two opposite sides of the third receiving chamber 2103.

In this embodiment, the bracket 21 may further include a first supporting structure 215, and the first supporting structure 215 may be located on the bottom wall 211, may protrude toward the second receiving cavity 2102, may be located near the blocking wall 210, and may be configured to support the conductive structure 22. The first support structure 215 may be a boss protruding from the second receiving cavity 2102.

In this embodiment, the bracket 21 may further include a second supporting structure 216, the second supporting structure 216 may be located on the bottom wall 211, may protrude toward the second accommodating cavity 2103, and may be located at a separation position between the first accommodating cavity 2101 and the second accommodating cavity 2103 to separate the first accommodating cavity 2101 and the second accommodating cavity 2103, and the second supporting structure 216 may be configured to support the conductive structure 22.

As shown in fig. 7 to 8, in the present embodiment, the conductive structure 22 may be disposed on the bottom wall 211 and may be integrally formed with the bottom wall 211, specifically, the conductive structure 22 may be formed inside the bottom wall 211 for electrically connecting the first circuit board 40 and the second circuit board 60. Of course, it is understood that in some embodiments, the conductive structure 22 may not be limited to being formed inside the bottom wall 211, in other embodiments, the conductive structure 22 may be formed on the surface of the bottom wall, and in other embodiments, the conductive structure 22 may not be limited to connecting the first circuit board 40 and the second circuit board 60, and may be used to connect other two components requiring conductive connection. In some embodiments, the conductive structure 22 can be integrally injection molded with the bottom wall 211. Of course, it is understood that in other embodiments, the conductive structure 22 may be integrally formed with the bottom wall 211 by sintering or other methods. The conductive structure 22 may be in a sheet shape, and a thickness direction of the conductive structure 22 may be the same as a thickness direction of the bracket 21, that is, the thickness direction of the conductive structure 22 may be the same as the thickness direction of the bottom wall 211.

Further, as shown in fig. 9, in the present embodiment, the conductive structure 22 may include two

conductive members

22a,22 b. The two

conductive members

22a,22b may include a first conductive member 22a and a second conductive member 22 b; the first conductive member 22a may be a positive conductive member connected to the positive terminals of the first circuit board 40 and the second circuit board 60. The second conductive member 22b may be a negative conductive member, and may be connected to the negative terminals of the first circuit board 40 and the second circuit board 60. It is understood that in other embodiments, the

conductive members

22a,22b are not limited to two, and may be one or more than two. In the present embodiment, the first conductive member 22a and the second conductive member 22b have substantially the same structure. In some embodiments, the conductive structure 22 may be formed as a unitary structure by disposing a connecting piece between the two

conductive members

22a,22b of the conductive structure 22 before injection molding with the bottom wall 211, and after injection molding with the bottom wall 211, a punching device may be used to punch the connecting piece between the two

conductive members

22a,22b through the cut 2111 on the bottom wall 211.

Further, in the present embodiment, the

conductive elements

22a,22b may be sheet-shaped structures, and specifically, the

conductive elements

22a,22b may be metal elastic pieces, and the material of the metal elastic pieces is preferably stainless steel or phosphor copper. Of course, it is understood that in other embodiments, the metal dome may not be limited to stainless steel or phosphor copper. In the present embodiment, the width of the

conductive members

22a,22b may be greater than or equal to 1.0mm, and when the width is less than 1.0mm, deformation may easily occur in the processes of assembly, plating, etc., thereby deteriorating the uniformity of the product.

Further, in this embodiment, the

conductive members

22a and 22b may include a conductive connecting portion 221, a first elastic abutment electrode 222, and a second elastic abutment electrode 223. Both ends of the conductive connection portion 221 may be connected to the first elastic contact electrode 222 and the second elastic contact electrode 223, respectively. The first elastic contact electrode 222 may be disposed at one end of the conductive connection portion 221, and may be configured to elastically contact the first circuit board 40. The first elastic abutment electrodes of the two

conductive elements

22a,22b are oriented in the same direction. It will be appreciated that in some embodiments, the first resilient abutment electrode 222 may be omitted. The second elastic abutting electrode 223 can be disposed at the other end of the conductive connecting portion 221, and can be used for elastically abutting against the second circuit board 60, and the orientations of the second elastic abutting electrodes of the two

conductive members

22a,22b can be set in the same direction; it will be appreciated that in some embodiments, the second resilient abutment electrode 223 may be omitted. In some embodiments, the conductive connecting structure 221, the first elastic abutment electrode 222 and the second elastic abutment electrode 223 may be integrally formed. Specifically, the conductive connection structure 221, the first elastic abutment electrode 222 and the second elastic abutment electrode 223 may be formed into an integral structure by bending. In this embodiment, the bracket 21 is provided with a first hollow structure 2114, and the first hollow structure 2114 is located on the bottom wall 211 and located in the second cavity 2102, and may be disposed corresponding to the first elastic abutment electrode 222, so as to facilitate the demolding of the first elastic abutment electrode 222. In this embodiment, the bracket 21 is provided with a second hollow-out structure 2115, the second hollow-out structure 2115 may be located on the bottom wall 211 and in the third cavity 2103, and may be disposed corresponding to the second elastic abutment electrode 223, so as to facilitate demolding of the second elastic abutment electrode 223.

Further, in this embodiment, the conductive connection portion 221 may be an elongated sheet-shaped structure, the conductive connection portion 221 may be located in the first cavity 2101, and the entire length may be integrally formed on the bottom wall 211 and may be completely embedded in the bottom wall 211. Of course, it is understood that in other embodiments, the conductive connecting structure 221 can also be partially embedded in the bottom wall 211. In this embodiment, the bottom wall 211 may include a first end and a second end, the first end may be disposed to extend toward the second cavity 2102, and the second end may be disposed to extend toward the third cavity 2103. In this embodiment, the conductive connection portion 221 may extend from the first end toward the second end. In some embodiments, the conductive connection portion 221 may be provided with a through hole 2211, and the through hole 2211 may be matched with the support 21 to improve the combining force between the support 21 and the

conductive members

22a and 22b, and specifically, the through hole 2211 may be formed by combining the plastic for forming the support 21 with the

conductive members

22a and 22b through the through hole 2211 during the injection molding process to improve the combining force between the support 21 and the

conductive members

22a and 22 b.

Further, in the present embodiment, the first elastic abutment electrode 222 can penetrate from the bottom wall 211 to the second cavity 2102, and has an elastic deformation capability, and can elastically abut against the first circuit board 40. In this embodiment, the first elastic contact electrode 222 may extend upward along the plane of the conductive connection portion 221 and then extend toward one side of the conductive connection portion 221. The first elastic contact electrode 222 may form a predetermined angle with the plane of the conductive connection portion 221. The set angle may be a right angle or an obtuse angle. In some embodiments, the first elastic abutment electrode 222 may extend from one side of the first supporting and positioning structure 215, and may be supported and positioned by the first supporting and positioning structure 215, so as to improve the stability of the contact with the first circuit board 40. In this embodiment, the height of the first elastic abutment electrode 222 can be set lower than the second opening 2105, but it is understood that in other embodiments, the height of the first elastic abutment electrode 222 can also be set higher than the second opening 2105.

Further, in the present embodiment, the first elastic abutment electrode 222 may include a first main body portion 2221, a first coupling portion 2222, a second coupling portion 2223, a first abutment portion 2224, and a first guiding portion 2225. The first main body 2221, the first coupling portion 2222, the second coupling portion 2223, the first contact portion 2224, and the first guide portion 2225 may be integrally formed.

The first body portion 2221 may be disposed parallel to the conductive connection portion 221, but it is understood that the first body portion 2221 may not be limited to being parallel to the conductive connection portion 221 in other embodiments. The first main body 2221 may be shaped like a sheet and may be located between the first abutting portion 2224 and the second coupling portion 2223.

The first combining portion 2222 may be disposed on a sidewall of one end of the conductive connecting portion 221, and may be combined with the conductive connecting portion 221, and may be disposed perpendicular to the conductive connecting portion 221, although it is understood that in other embodiments, the first combining portion 2222 may not be limited to being disposed perpendicular to the conductive connecting portion 221. In some embodiments, the first coupling portion 2222 may be integrally formed on the bracket 21, and in particular, in some embodiments, the first coupling portion 2222 may be integrally formed in the first supporting and positioning structure 215, and may be integrally formed with the first supporting and positioning structure 215 by injection molding, so as to better fix the first elastic abutment electrode 222.

The second connecting portion 2223 can be curved to connect the first connecting portion 2222 with the first main body portion 2221, and further connect the first connecting portion 2222 with the first abutting portion 2224.

In some embodiments, the first abutting portion 2224 can be disposed at an end of the first main body portion 2221 away from the first connecting portion 2222, and is disposed obliquely to the first main body portion 2221, specifically, the first abutting portion 2224 is disposed to extend obliquely upward along the first main body portion 2221. The first abutting portion 2224 can be used to abut against a circuit board on the bracket, and specifically, in some embodiments, the first abutting portion 2224 can elastically abut against the first circuit board 40. The first circuit board 40 is electrically connected to the

conductive members

22a and 22b by means of elastic contact, so that soldering can be reduced and the process can be simplified. The first contact portion 2224 can make the first elastic contact electrode 222 have an elastic deformation space, so that the first elastic contact electrode 222 can make good contact with the first circuit board 40. In some embodiments, the width of the first abutting portion 2224 may be smaller than the width of the first main body portion 2221, so that the elastic force exerted by the first abutting portion 2224 on the first circuit board 40 can be reduced. In some embodiments, the junction of the first main body portion 2221 and the first abutting portion 2224 may be bent to form a first deformation portion 2226, so that the deformation of the first abutting portion 2224 becomes controllable.

In some embodiments, the first guiding portion 2225 can be disposed at an end of the first abutting portion 2224, and specifically, the first guiding portion 2225 can be disposed at an end of the first abutting portion 2224 away from the first main body portion 2221, and is bent from the first abutting portion 2224. The first guiding portion 2225 can be used to guide the first abutting portion 2224 to abut against the first circuit board 40, and facilitate the first abutting portion 2224 to be elastically deformed. In some embodiments, a first conductive layer is disposed at a contact end of the first elastic contact electrode 222 and the first circuit board 40, and in particular, in this embodiment, the first conductive layer may be disposed at a position where the first contact portion 2224 and the first guiding portion 2225 are connected. The first conductive layer may be a metal conductive layer, and a material of the metal conductive layer may preferably be gold. The metal conductive layer can be disposed on the surface of the joint of the first contact portion 2224 and the first guiding portion 2225 by electroplating, so as to reduce the resistance, and make the conductive connection between the first elastic contact electrode 222 and the first circuit board 40 more reliable.

Further, in the present embodiment, the second elastic abutting electrode 223 can penetrate from the bottom wall 211 to the second accommodating cavity 2103, and has an elastic deformation capability, and can abut against the second circuit board 60. In this embodiment, the second elastic contact electrode 223 may extend upward along the plane of the conductive connection portion 221, and then extend toward one side of the conductive connection portion 221. The second elastic contact electrode 223 may form a predetermined angle with the plane of the conductive connection portion 221. The set angle may be a right angle or an obtuse angle. In some embodiments, the second elastic abutment electrode 223 can extend from one side of the second supporting and positioning structure 216, and can be supported and positioned by the second supporting and positioning structure 216, so as to improve the stability of the contact with the second circuit board 60. In this embodiment, the height of the second elastic abutment electrode 223 can be set lower than the third opening 2106, but it is understood that in other embodiments, the height of the second elastic abutment electrode 223 can also be set higher than the third opening 2106. In this embodiment, the first elastic abutment electrode 222 and the second elastic abutment electrode 223 which are located on the same conductive connection portion 221 may be located on the same side of the conductive connection portion 221.

Further, in this embodiment, the second elastic abutment electrode 223 may include a second main body portion 2231, a second combining portion 2232, a fourth combining portion 2233, a second abutment portion 2234, and a second guide portion 2235. The second body 2231, the third joining portion 2232, the fourth joining portion 2233, the second contact portion 2234, and the second guide portion 2235 may be integrally formed.

The second body portion 2231 may be disposed parallel to the conductive connection portion 221, but it is understood that the second body portion 2231 may not be limited to being parallel to the conductive connection portion 221 in other embodiments. The second body 2231 may have a sheet shape and may be located between the second abutting portion 2234 and the fourth connecting portion 2233.

The third combining portion 2232 may be disposed on a sidewall of one end of the conductive connection portion 221, and may be combined with the conductive connection portion 221, and may be disposed perpendicular to the conductive connection portion 221, although it is understood that in other embodiments, the third combining portion 2232 may not be limited to being disposed perpendicular to the conductive connection portion 221. In some embodiments, the third combining portion 2232 can be integrally formed on the bracket 21, and in particular, in some embodiments, the third combining portion 2232 can be integrally formed in the second supporting and positioning structure 216 and can be integrally formed with the second supporting and positioning structure 216 by injection molding, so as to better fix the second elastic abutment electrode 223.

The fourth connecting portion 2233 may have an arc shape, and may connect the third connecting portion 2232 and the second main body portion 2231, and further connect the third connecting portion 2232 and the second abutting portion 2234.

In some embodiments, the second abutting portion 2234 can be disposed at an end of the second main body portion 2231 away from the fourth combining portion 2233, and is disposed obliquely to the second main body portion 2231, specifically, the second abutting portion 2234 extends obliquely upward along the second main body portion 2231. The second abutting portion 2234 can be configured to abut against a circuit board on the bracket, and in particular, in some embodiments, the second abutting portion 2234 can be elastically abutted against the second circuit board 60. The second circuit board 60 is electrically connected to the

conductive members

22a and 22b by means of elastic contact, so that soldering can be reduced and the process can be simplified. The second abutting portion 2234 can make the second elastic abutting electrode 223 have an elastic deformation space, so that the second elastic abutting electrode 223 can make good contact with the second circuit board 60. In some embodiments, the width of the second abutting portion 2234 can be smaller than the width of the second main body portion 2231, so that the elastic force exerted by the second abutting portion 2234 on the second circuit board 60 can be reduced. In some embodiments, the junction of the second main body portion 2231 and the second abutment portion 2234 can be bent to form a second deformation portion 2236, such that the deformation of the second abutment portion 2234 becomes controllable.

In some embodiments, the second guiding portion 2235 can be disposed at an end of the second abutting portion 2234, and in particular, the second guiding portion 2235 can be disposed at an end of the second abutting portion 2234 away from the second main body portion 2231 and bent away from the second abutting portion 2234. The second guide portion 2235 can be used to guide the second abutting portion 2234 to abut against the second circuit board 60, and facilitate elastic deformation of the second abutting portion 2234. In some embodiments, a second conductive layer is disposed at a contact end of the second elastic abutting electrode 223 and the second circuit board 60, and in particular, in this embodiment, the second conductive layer may be disposed at a position where the second abutting portion 2234 and the second guiding portion 2235 meet. The second conductive layer may be a metal conductive layer, and a material of the metal conductive layer may preferably be gold. The metal conductive layer can be disposed on the surface of the joint of the second abutting portion 2234 and the second guiding portion 2235 by electroplating, so as to reduce the resistance and make the conductive connection between the second elastic abutting electrode 223 and the second circuit board 60 more reliable.

In this embodiment, the first elastic abutment electrodes 222 of the two

conductive devices

22a and 22b can extend toward the first end of the battery cell, and the extending directions of the first elastic abutment electrodes 222 of the two or more

conductive devices

22a and 22b are set to be the same, which can facilitate the realization of automated assembly. The connection of the top ends of the first elastic abutting electrodes 222 of the two conductive members 22a,22b can be intersected with the side wall 212 of the bracket 21, so as to perform infrared detection on the first elastic abutting electrodes 222 of the two conductive members 22a,22b, that is, when the first elastic abutting electrodes 222 are arranged lower than the side wall 212, the top ends of the first elastic abutting electrodes 222 can be observed through the first avoiding hole 2123, and the infrared detection device emits an infrared light source from the first avoiding hole 2123 to the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22 b; in this embodiment, the first elastic abutting electrodes 222 of the two adjacent conductive members 22a and 22b may be disposed in mirror symmetry, that is, the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b may be disposed in mirror symmetry, specifically, the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22b may extend along the width direction of the bottom wall 211 and in opposite directions, so as to facilitate the infrared detection performed by the infrared detection device on the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22 b. It is understood that in other embodiments, the first elastic abutment electrodes 222 of the two

conductive members

22a,22b are not limited to mirror symmetry. In this embodiment, the first end wall 213 includes a flat surface disposed opposite the

conductive members

22a,22 b. The first elastic abutment electrodes 222 of the two adjacent

conductive members

22a,22b may extend in a direction parallel to the plane of the first end wall 213, and are respectively disposed corresponding to the first avoiding hole 2123. After the first and second conductive members 22a and 22b and the bracket 21 are injection molded, a conventional infrared detection device may be used to emit an infrared light source from the first avoiding hole 2123 to the first elastic abutting electrodes 222 of the first and second conductive members 22a and 22b and obtain infrared images of the first elastic abutting electrodes 222 of the first and second conductive members 22a and 22b, and the infrared images are identified to determine whether the first and second conductive members 22a and 22b are completely overlapped, specifically, whether the infrared images of the first abutting portions 2224 of the first elastic abutting electrodes 222 of the first and second conductive members 22a and 22b are completely overlapped is determined, where complete overlapping means that the deviation of the infrared images of the first elastic abutting electrodes 222 of the first and second conductive members 22a and 22b in the horizontal direction and the vertical direction is within a predetermined range, when the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped, the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are installed on the same horizontal line, and the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b can be in good contact with the first circuit board 40. When the first elastic abutment electrodes 222 of the first and second

conductive members

22a and 22b are largely or entirely misaligned (the overlapping range is not within the predetermined range), the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are not mounted on the same horizontal line, after the first circuit board 40 is mounted with the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b, the pre-stress applied by the first circuit board 40 to the first elastic abutment electrode 222 of the first conductive member 22a and the first elastic abutment electrode 222 of the second conductive member 22b will be different, so that there is a difference in contact resistance between the first elastic abutment electrode 222 of the first conductive member 22a and the first elastic abutment electrode 222 of the second conductive member 22b and the first wiring board 40, so that the contact stability of the first conductive member 22a and the second conductive member 22b with the first circuit board 40 is not good.

In this embodiment, the second elastic abutting electrodes 223 of the two

conductive devices

22a,22b may extend towards the second end of the battery cell, and the extending directions of the second elastic abutting electrodes 223 of the two or more

conductive devices

22a,22b are set to be the same, which may facilitate the realization of automated assembly. The connection of the top ends of the second elastic abutting electrodes 223 of the two conductive members 22a,22b can be intersected with the side wall 212 of the bracket 21, so as to perform infrared detection on the second elastic abutting electrodes 223 of the two conductive members 22a,22b, that is, when the second elastic abutting electrodes 223 are arranged lower than the side wall 212, the top ends of the second elastic abutting electrodes 223 can be observed through the first avoiding hole 2123, and the infrared detection device emits an infrared light source from the first avoiding hole 2123 to the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22 b; in this embodiment, the second elastic abutting electrodes 223 of the two adjacent conductive members 22a,22b may be disposed in mirror symmetry, that is, the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b may be disposed in mirror symmetry, specifically, the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22b may extend along the width direction of the bottom wall 211 and in opposite directions, so as to facilitate the infrared detection performed by the infrared detection device on the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22 b. It is understood that in other embodiments, the second elastic abutment electrodes 223 of the two

conductive members

22a,22b are not limited to mirror symmetry. In this embodiment, the second end wall 214 includes a flat surface disposed opposite the

conductive members

22a,22 b. The second elastic abutment electrodes 223 of the two adjacent

conductive members

22a,22b may extend toward a plane parallel to the second end wall 214, and are respectively disposed corresponding to the second avoiding holes 2124. After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device may be used to emit an infrared light source from the second avoiding hole 2124 to the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b and obtain an infrared image of the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b, and by performing recognition processing on the infrared image, it may be determined whether the first conductive member 22a and the second conductive member 22b are completely overlapped, specifically, whether the infrared image of the second abutting portion 2234 of the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b is completely overlapped, where completely overlapping means that deviation of the infrared image of the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b in the horizontal direction and the vertical direction is within a predetermined range, when the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b are completely overlapped, the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b are installed on the same horizontal line, and the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b can be in good contact with the second circuit board 60. When the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are mostly overlapped or completely misaligned (the overlapping range is not within the predetermined range), the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are not mounted on the same horizontal line, after the second circuit board 60 is mounted with the second elastic abutment electrodes 223 of the first and second

conductive members

22a and 22b, the pre-stress applied by the second circuit board 60 to the second elastic abutment electrode 223 of the first conductive member 22a and the second elastic abutment electrode 223 of the second conductive member 22b will be different, so that there is a difference in contact resistance between the second elastic abutment electrode 223 of the first conductive member 22a and the second elastic abutment electrode 223 of the second conductive member 22b and the second circuit board 60, so that the contact stability of the first and second

conductive members

22a and 22b with the second circuit board 60 is not good.

As shown in fig. 5 and fig. 6, further, in the embodiment, the battery cell 30 can be accommodated in the first accommodating cavity 2101, and the battery cell 30 can be a rechargeable battery and can be powered by an external power supply, so as to continuously provide electric energy to the atomizer, thereby improving the cyclicity of the power supply assembly and reducing resource waste. In the present embodiment, the battery cell 30 may include a cell body 31 and a protection plate 32, the cell body 31 may be accommodated in the first accommodating cavity 2101, and the protection plate 32 may be attached to a surface of the cell body 31. One end of the cell body 31 may be provided with two electrode tabs 311 extending toward the second accommodating cavity 2102 and connected to the first circuit board 40, where the two electrode tabs 311 may be a positive electrode tab and a negative electrode tab, and may be welded to the first circuit board 40. The cell 30 may include a first end 3101 and a second end 3102; the first end 3101 and the second end 3102 may extend along the length direction of the battery cell 30. The conductive structure may extend from the first end 3101 of the cell 30 toward the second end 3102 of the cell 30, at least two of the first elastic abutment electrodes 222 of the conductive structure 22 may be located at the first end 3101 of the cell 30, specifically, the first elastic abutment electrodes 222 may extend from the bottom wall 211 along the first end 3101 of the cell 30, and at least two of the second elastic abutment electrodes 223 of the conductive structure 22 may be located at the second end of the cell 30, specifically, the second elastic abutment electrodes 223 may extend from the bottom wall 211 along the second end 3102 of the cell 30.

Further, in the present embodiment, the first circuit board 40 can be accommodated in the second accommodating cavity 2102, and of course, in other embodiments, the first circuit board 40 can be located at the second opening 2105 of the second accommodating cavity 2102 and can be disposed higher than the second opening 2105. In this embodiment, the first circuit board 40 may be a main control board, and the first circuit board 40 may be provided with two bonding pads 41, and the two bonding pads 41 may be disposed corresponding to the two electrode pads 311 of the battery cell 30, so that the electrode pads 311 are soldered thereon. In this embodiment, the power supply module B may further include an airflow sensing device 42, and the airflow sensing device 42 may be disposed on the bracket 21, and specifically, the airflow sensing device 42 may be disposed on the first circuit board 40, may be electrically connected to the first circuit board 40, and may be used to start the atomizer a. In some embodiments, the airflow sensing device 42 may be a MEMS sensor.

Further, in this embodiment, the charging interface 50 may be located in the third receiving cavity 2103 and may be disposed corresponding to the plug interface 2141. In some embodiments, the charging interface 50 may be a USB interface, although it is understood that in other embodiments, the charging interface 50 may not be limited to a USB interface.

Further, in this embodiment, the second circuit board 60 may be a charging circuit board, and may be electrically connected to the charging interface 50 and electrically connected to the first circuit board 40 through the

conductive members

22a and 22 b. When the battery cell 30 of the electronic atomization device needs to be charged, a power line connected to an external power source may be inserted from the plug interface 2141 to be electrically connected to the charging interface 50, and electric energy may be accessed from the charging interface 50, and may flow through the second circuit board 60 and the

conductive members

22a and 22b via the first circuit board 40 to enter the battery cell 30.

Further, in this embodiment, the power supply assembly may further include an air guide member 70. The air guide member 70 may be used to guide air to the air flow inducing device 42 to facilitate activation of the air flow inducing device 42. Further, in this embodiment, the air guide member 70 may be located in the second receiving cavity 2102, and in some embodiments, the air guide member 70 may be a silicone piece. Of course, it is understood that in other embodiments, the air guide member 70 may not be limited to a silicone member, and may be made of other soft materials. The air guide member 70 may be disposed on a side of the first circuit board 40 opposite to the air flow inducing device 42, and may be in communication with the air flow inducing device 42.

As shown in fig. 4 and 10, in the present embodiment, the air guide member 70 may include an insertion portion 71, and the insertion portion 71 may be inserted into and mounted on a liquid leakage preventing structure 217 provided on the bracket 21. The insertion portion 71 may be substantially rectangular parallelepiped in shape, although it is understood that the insertion portion 71 may not be limited to being rectangular parallelepiped in other embodiments. The insertion portion 71 may be provided with an air guiding groove 711, and the air guiding groove 711 may be a main air guiding groove, may be disposed along the length direction of the insertion portion 71, may be communicated with the air hole 2131 on the first end wall 213, and may be used to guide the air for activating the air flow sensing device 42 to the air hole 2131, so that the air flow sensing device 42 generates a negative pressure. In this embodiment, the air guide grooves 711 may be linearly arranged and may be centrally disposed. In this embodiment, the air guide member 70 further includes at least one backflow groove 712, the backflow groove 712 may be disposed on the insertion portion 71, and the backflow groove 712 may be disposed on two opposite sides of the air guide groove 711. The recirculation tank 712 can be connected to the air guide tank 711, and can be used to increase the fluid path, reduce the condensate from flowing back to the first circuit board 40, and prevent the condensate from contaminating the first circuit board 40 and the airflow sensor 42. The recirculation channel 712 may be inclined with respect to the air guide channel 711 to form a set angle, which may be acute, specifically, the set angle may be 30 to 60 degrees, preferably 45 degrees, and the configuration space may be optimized by inclined the recirculation channel 712 at an acute angle with respect to the longitudinal axis of the air guide channel 711.

Further, in the present embodiment, the return tank 712 may include a flow portion 7121, a return portion 7122, and a communication portion 7123. The flow portion 7121 may communicate with the air guide groove 711, and the condensate may flow into the flow portion 7121 from the air guide groove 711. The returning part 7122 may communicate with the air guide groove 711 and the flowing part 7121, the returning part 7122 and the flowing part 7121 may be disposed in a straight line, and the flowing part 7121 and the returning part 7122 may be disposed in parallel. Of course, it is understood that in other embodiments, the return portion 7122 and the flow portion 7121 may not be limited to being disposed in a straight line, but may be disposed in a curved line. In other embodiments, the flow portion 7121 and the return portion 7122 may not be limited to be parallel, but may be distributed in a splayed shape. The communicating portion 7123 may be used to communicate the flow portion 7121 and the return portion 7122. The condensate can flow from the flow portion 7121, then flow to the return portion 7122 through the communication portion 7123, and return to the air guide groove 711 from the return portion 7122.

Further, in this embodiment, the insertion portion 71 may further include a first notch 713 and a second notch 714; the first notch 713 may be disposed at one end of the air guide groove 711, may be in communication with the vent hole 2131, and may be used for liquid inflow or airflow outflow. The second notch 714 can be disposed at the other end of the air guiding groove 711, and can be used for communicating with the airflow sensing device 42, so as to output air to the air guiding groove 711.

Further, in the embodiment, the air guide member 70 may further include a boss 72, the boss 71 may be disposed on a side of the embedded portion 71 opposite to the air guide groove 711 and may be extended outward, so as to support the embedded portion 71, prevent the air guide groove 711 and the backflow groove 712 on the air guide member 70 from being deformed, and form a sealing structure with the liquid leakage prevention structure 217 on the bracket 21, so as to prevent the condensed liquid from flowing out, and enhance the sealing effect between the liquid leakage prevention structure 217 and the air guide structure 70.

As shown in fig. 5 and fig. 11, in this embodiment, a sealing member 80 may be disposed at an opening of the second receiving cavity 2102, and the sealing member 80 may be pressed on the first circuit board 40 and may be fixed to the bracket 21 by screws. In this embodiment, the sealing member 80 may include a body 81 and a positioning pillar 82 disposed on the body 81, and the positioning pillar 82 is provided with a through hole for a screw to pass through. In this embodiment, a screw hole 218 may be disposed on the bottom wall 211 of the bracket 21, and the screw hole 218 may be located in the second receiving cavity 2102, may be disposed corresponding to the positioning column 82, and may be communicated with a through hole on the positioning column 82, and may be used for screwing with a screw, so as to detachably connect the sealing member 80 and the bracket 21.

Further, in the embodiment, the power supply assembly B may further include a lamp post 90, and the lamp post 90 may be disposed on the sealing member 80, may protrude from the housing 10, may be connected to the first circuit board 40, and may be used to display the using state of the atomizer a.

Further, in the present embodiment, the power supply assembly may further include an airflow channel 100; the airflow path 100 may be an activation air path for activating the airflow sensing device 42. In this embodiment, the airflow channel 100 can communicate with the vent hole 2131 and the airflow sensing device 42. In this embodiment, the airflow passage 100 may include a main passage 100a, a first communicating passage 100b, and a second communicating passage 100 c. The main channel 100a can be in communication with the airflow sensing device 42 for activating the airflow sensing device 42, and the return channel 712 can be in communication with the main channel 100 a. The first communication passage 100b may be located at one end of the main passage 100a and may communicate with the outside and the main passage 100a, and particularly, the first communication passage 100b may be formed in the vent hole 2131 to communicate the vent hole 2131 with the main passage 100 a. The second communication passage 100c may be located at the other end of the main passage 100a and may be used to communicate the main passage 100a with the air flow inducing device 42. The second communication passage 100c may be formed in the insertion portion 71 of the air guide member 70 to communicate the second slot 714 with the air flow induction device 42.

Further, in this embodiment, a liquid leakage preventing structure 217 may be disposed in the airflow channel 100, and the liquid leakage preventing structure 217 may be located on the bracket 21, may be integrally formed with the bracket 21, and may be configured to prevent the liquid medium in the airflow channel from leaking out; the liquid leakage preventing structure 217 may be located in the second receiving cavity 2102 of the bracket 21, may be located on the bottom wall 211, and may be integrally formed with the bottom wall 211 by injection molding. Specifically, in some embodiments, the liquid leakage prevention structure 217 may be integrally formed with the bottom wall 211 by injection molding. In this embodiment, the liquid leakage preventing structure 217 may be disposed toward the return groove 712 and form the main passage 100a together with the air guide member 70, and in this embodiment, the liquid leakage preventing structure 217 may form the main passage 100a together with the air guide groove 711 of the air guide member 70.

Further, in this embodiment, the liquid leakage preventing structure 217 may include a liquid absorbing groove 2171, the liquid absorbing groove 2171 may be disposed on the bracket 21, and may be located in the second receiving cavity 2102, and may be located on the bottom wall 211, the liquid absorbing groove 2171 may be a capillary groove, and may absorb the liquid medium flowing out from the airflow channel by generating capillary force, so as to reduce corrosion of the liquid medium to the airflow sensing device 42 and the first circuit board 40. In some embodiments, the plurality of liquid suction grooves 2171 may be provided in plurality, and the plurality of liquid suction grooves 2171 are arranged side by side in a direction away from the vent hole 2131, so that the liquid medium can be stored step by step, specifically, they can be arranged side by side in the gas flow direction in the gas flow passage 100. Further, in this embodiment, the liquid suction groove 2171 may be a strip-shaped groove, and the liquid suction groove 2171 may be extended along both sides of the ventilation hole 2131 in a direction perpendicular to the air intake direction of the ventilation hole 2131, that is, may be transversely grooved, so as to slow down the time for the condensate to flow down. Further, in some embodiments, the width of the suction groove 2171 may be 0.3 to 0.4 mm.

Further, in this embodiment, the liquid leakage preventing structure 217 may further include a groove wall 2172, the groove wall 2172 may be substantially rectangular parallelepiped structure, may be a frame body, and may be disposed on the periphery of the liquid suction groove 2171, so that the plurality of liquid suction grooves 2172 are disposed therein, the groove wall 2172 may be enclosed to form an embedded groove 2173, the embedded groove 2173 may be used for embedding the air guide member 70, and specifically, in some embodiments, the embedded portion 71 of the air guide member 70 may be embedded in the embedded groove 2173 in the liquid leakage preventing structure 217, and may further be installed in cooperation with the liquid leakage preventing structure 217. In this embodiment, the boss 72 of the air guide member 70 may seal the insertion groove 2173 to prevent the liquid medium from leaking out.

Further, in this embodiment, the power supply assembly B may further include a sealing cover 110, and the sealing cover 110 may be disposed on the first end wall 213 and may be configured to form a seal with the housing 10, so as to prevent the liquid of the atomizer a from flowing into the power supply assembly B from the side wall between the housing 10 and the bracket 21. The sealing cap 110 may be a silicon cap, which has a through hole corresponding to the ventilation hole 2131 and the first mounting hole 2132.

Further, in this embodiment, the power supply assembly B may further include two magnetic attraction elements 120, where the two magnetic attraction elements 120 may be disposed at intervals, and may respectively penetrate through the sealing cover 110 and the first end wall 213, and may be installed corresponding to the first installation hole 2132, so as to connect the power supply assembly B and the atomizer a.

Further, in the embodiment, the power supply assembly B may further include two electrode pins 130, and the two electrode pins 130 may be disposed at intervals, and may be respectively disposed through the sealing cover 110 and the first end wall 213, and may be installed in the second installation hole 2133 for connecting the first circuit board 40 and the atomizer a.

Fig. 12 and 13 show a second embodiment of the electronic atomizer of the present invention, which is different from the first embodiment in that the first and second avoiding

holes

2123 and 2124 of the bracket 21 may be omitted.

The first elastic abutment electrode 222 of the at least two

conductive members

22a,22b may protrude toward the first opening 2104 and its top end may be disposed higher than the sidewall 212; specifically, the first opening 2104 and the second opening 2105 may be disposed side by side and in parallel and in a flush manner, the first elastic abutment electrode 222 may protrude out of the second opening 2105 of the second accommodating cavity 2102, and a top end of the first abutment portion 2224 may protrude out of the second opening 2105, so as to be non-intersected with the sidewall 212, and the first circuit board 40 may be located above the second opening 2105 and may be elastically abutted against the first elastic abutment electrode 222. After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device may be used to emit an infrared light source from one side of the second opening 2105 to the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b, obtain infrared images of the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b, and perform recognition processing on the infrared images to determine whether the first conductive member 22a and the second conductive member 22b are completely overlapped, specifically, determine whether the infrared images of the first abutment portions 2224 of the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped, and when the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped, the completely overlapped means that the infrared images of the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are horizontally and vertically overlapped The deviation in the straight direction is within a predetermined range, the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are mounted on the same horizontal line, and the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b can make good contact with the first circuit board 40. When the first elastic abutment electrodes 222 of the first and second

conductive members

The second elastic abutment electrode 223 of the at least two

conductive elements

22a,22b may protrude towards the first opening 2104 and its top end may be disposed higher than the sidewall 212; specifically, the first opening 2104 and the third opening 2106 may be disposed side by side and in parallel and in a flush manner, the second elastic abutting electrode 223 may protrude out of the third opening 2106 of the third accommodating cavity 2103, and the top end of the first abutting portion 2224 may protrude out of the third opening 2106 and be disposed slightly higher than the third opening 2106, so as to achieve the effect of not intersecting with the sidewall 212. The second circuit board 60 may be positioned above the third opening 2106 and elastically abut against the second elastic abutment electrode 223. After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device may be used to emit an infrared light source from one side of the third opening 2106 to the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b, obtain infrared images of the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b, and perform recognition processing on the infrared images to determine whether the first conductive member 22a and the second conductive member 22b are completely overlapped, specifically, whether the infrared images of the second abutment portions 2234 of the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are completely overlapped, where completely overlapped means that the deviation of the infrared images of the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b in the horizontal direction and the vertical direction is within a predetermined range, when the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b are completely overlapped, the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b are installed on the same horizontal line, and the second elastic abutment electrodes 223 of the first and second conductive members 22a and 22b can be in good contact with the second circuit board 60. When the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are mostly misaligned or completely misaligned (the overlapping range is not within the predetermined range), the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are not mounted on the same horizontal line, after the second circuit board 60 is mounted with the second elastic abutment electrodes 223 of the first and second

conductive members

22a and 22b with the second circuit board 60 is not good.

Fig. 14 shows a third embodiment of the electronic atomizer device according to the present invention, which differs from the second embodiment in that the second holding structure 2122 of the holder 21 can be omitted. The side wall 212 and the two opposite sides of the third receiving cavity 2103 may be provided with a limiting boss 2125, and the limiting boss 2125 may make the third receiving cavity 2103 more closed and may be used for the second circuit board 60 to be loaded into the third receiving cavity 2103 for limiting, so as to prevent the second circuit board 60 from coming off.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. A power supply assembly for an electronic atomizer, comprising a support (21), an airflow sensing device (42) disposed on the support (21), and an airflow channel (100) in communication with the airflow sensing device (42);

and the bracket (21) is provided with a liquid leakage prevention structure (217) for preventing the liquid medium in the air flow channel (100) from leaking.

2. The power supply assembly according to claim 1, characterized in that said bracket (21) comprises a bottom wall (211);

the liquid leakage prevention structure (217) is arranged on the bottom wall (211) and is positioned in the air flow channel (100).

3. The power supply assembly according to claim 1, wherein the liquid leakage preventing structure (217) includes a liquid suction groove (2171) for sucking the liquid medium flowing out of the air flow channel (100) by generating a capillary force.

4. The power supply assembly according to claim 3, wherein the suction groove (2171) is plural, and plural suction grooves (2171) are provided side by side in a gas flow direction in the gas flow passage (100).

5. A supply assembly according to claim 3, characterized in that the support (21) is provided with a first end wall (213) arranged opposite the atomizer of the electronic atomizer device;

the first end wall (213) is provided with a vent hole (2131) which is communicated with the airflow channel (100) and the outside.

6. The power supply assembly according to claim 5, wherein the liquid suction groove (2171) is a strip-shaped groove, and the liquid suction groove (2171) is provided to extend to both sides of the ventilation hole (2131) in a direction perpendicular to an air intake direction of the ventilation hole (2131).

7. The power supply assembly according to claim 5, characterized in that said suction tank (2171) is plural,

the plurality of liquid suction grooves (2171) are arranged in parallel in a direction away from the vent hole (2131).

8. The power supply assembly according to claim 3, wherein the width of the liquid suction groove (2171) is 0.3-0.4 mm.

9. A power supply assembly according to claim 3, characterized in that said liquid-leakage preventing structure (217) further comprises a groove wall (2172); the tank wall (2172) is arranged at the periphery of the liquid suction tank (2171) to form an embedded tank (2173) embedded with an air guide member (70) for guiding air to the air flow induction device (42).

10. The power supply assembly of claim 1, wherein the liquid leakage prevention structure (217) is integrally formed with the bracket (21).

11. The power supply assembly of claim 1, wherein the airflow channel (100) includes a main channel (100a) in communication with the airflow sensing device (42); the liquid leakage preventing structure (217) is disposed toward the main passage (100 a).

12. The power supply assembly according to claim 12, wherein the airflow channel (100) further comprises a first communication channel (100b) communicating with the outside and the main channel (100a), and a second communication channel (100c) communicating with the main channel (100a) and the airflow sensing device (42).

13. The power supply assembly of claim 1, further comprising an air guide member (70) cooperating with the bracket (21) to form the airflow channel (100).

14. The power supply assembly according to claim 13, wherein the air guide member (70) further comprises at least one backflow groove (712) communicating with the main channel (100a) to reduce backflow of condensate;

the liquid leakage prevention structure (217) is provided toward the return tank (712).

15. The power supply assembly according to claim 13, wherein the air guide member (70) includes an insertion portion (71) fitted with the liquid leakage preventing structure (217);

the embedding part (71) is provided with an air guide groove (711);

the air guide groove (711) and the liquid leakage prevention structure (217) form a main channel (100a) of the air flow channel (100).

16. The power supply module according to claim 15, wherein the air guide member (70) further includes a boss (72) provided on a side of the insertion portion (71) opposite to the air guide groove (711) and extending outward.

17. A power supply assembly according to claim 13, characterized in that the air guide member (70) is of a soft material.

18. The power supply assembly of claim 1, further comprising a first circuit board (40);

the air flow sensing device (42) is arranged on the first circuit board (40).

19. An electronic atomizer, comprising a power supply assembly according to any one of claims 1 to 18 and an atomizer connected to said power supply assembly.