CN113390484B - Ultrasonic flow transducer and electrical switching mechanism - Google Patents
Ultrasonic flow transducer and electrical switching mechanism Download PDFInfo
- Publication number
- CN113390484B CN113390484B CN202110604464.3A CN202110604464A CN113390484B CN 113390484 B CN113390484 B CN 113390484B CN 202110604464 A CN202110604464 A CN 202110604464A CN 113390484 B CN113390484 B CN 113390484B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 35
- 230000026683 transduction Effects 0.000 claims description 53
- 238000010361 transduction Methods 0.000 claims description 53
- 238000004382 potting Methods 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/18—Supports or connecting means for meters
- G01F15/185—Connecting means, e.g. bypass conduits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
- G01F1/667—Arrangements of transducers for ultrasonic flowmeters; Circuits for operating ultrasonic flowmeters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
- H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Measuring Volume Flow (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention relates to an ultrasonic flow transducer and an electrical switching mechanism. The electrical switching mechanism comprises: the piezoelectric transducer comprises a PCB (printed circuit board) adapter, a mounting shell, a piezoelectric transducer and a signal wire, wherein the piezoelectric transducer is arranged inside the mounting shell, the PCB adapter is fixedly matched with the mounting shell, the PCB adapter is electrically communicated with the piezoelectric transducer through the signal wire, and a thimble assembly used for electrically contacting with an electrical element is arranged on the PCB adapter. Above-mentioned electrical property switching mechanism carries out the switching installation through the PCB adaptor, can avoid the signal line to carry out bonding wire or twist the line to make ultrasonic flow transducer's installation more convenient.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to an ultrasonic flow transducer and an electrical switching mechanism.
Background
The measurement of the liquid flow or the liquid concentration can be realized by the ultrasonic transducer. Currently, the ultrasonic flow transducer in the market needs to be directly electrically connected with an electrical element (such as a driving board) by using a signal wire, and in this process, the signal wire needs to be soldered or screwed, so that the installation of the ultrasonic flow transducer is very complicated.
Disclosure of Invention
Based on this, it is necessary to provide an ultrasonic flow transducer and an electrical switching mechanism for the problem that the installation of the conventional ultrasonic flow transducer is very complicated.
An electrical switching mechanism. The electrical switching mechanism comprises: the piezoelectric transducer comprises a PCB (printed circuit board) adapter, a mounting shell, a piezoelectric transducer and a signal wire, wherein the piezoelectric transducer is arranged inside the mounting shell, the PCB adapter is fixedly matched with the mounting shell, the PCB adapter is electrically communicated with the piezoelectric transducer through the signal wire, and a thimble assembly used for electrically contacting with an electrical element is arranged on the PCB adapter.
The ultrasonic flow transducer comprises the electrical switching mechanism and further comprises a driving plate, and the PCB switching piece is electrically connected with the driving plate through the thimble assembly.
In one embodiment, the mounting housing comprises a mounting upper housing and a mounting lower housing, the mounting upper housing is detachably mounted and matched with the mounting lower housing, a first mounting cavity is formed in the mounting upper housing, a second mounting cavity is formed in the mounting lower housing, the first mounting cavity is communicated with the second mounting cavity, the PCB adaptor is mounted at the end of the mounting upper housing, the piezoelectric transduction piece is located in the second mounting cavity, one end of the signal wire is inserted into the first mounting cavity and is electrically connected with the PCB adaptor, and the other end of the signal wire is inserted into the second mounting cavity and is electrically connected with the piezoelectric transduction piece.
In one embodiment, a clamping convex part is arranged at one end of the mounting upper shell, which is far away from the PCB adapter, along the circumferential direction of the mounting upper shell, a clamping concave part is arranged at one end of the mounting lower shell, which is far away from the piezoelectric transduction piece, along the circumferential direction of the mounting lower shell, and when the mounting upper shell is assembled with the mounting lower shell, the clamping convex part is matched with the clamping concave part in a clamping way.
In one embodiment, the clamping concave portion comprises a first clamping ring and a second clamping ring, the first clamping ring and the second clamping ring are sleeved at one end of the mounting upper shell, which is far away from the PCB adapter, the first clamping ring and the second clamping ring are in overlapping fit, and the surface radius of the first clamping ring is larger than the surface radius of the second clamping ring; the clamping concave part comprises a first clamping groove and a second clamping groove, the radial dimension of the first clamping groove is larger than that of the second clamping groove, the first clamping groove and the second clamping groove are axially formed in the lower mounting shell and far away from one end of the piezoelectric transduction piece, and when the upper mounting shell and the lower mounting shell are assembled, the first clamping ring is clamped into the first clamping groove, and the second clamping ring is clamped into the second clamping groove.
In one embodiment, the electrical switching mechanism further comprises a mounting base, the mounting base is arranged in the second mounting cavity, the mounting base is fixedly matched with the piezoelectric transduction piece, and a mounting hole for the signal wire to pass through is formed in the mounting base.
In one embodiment, the electrical switching mechanism further comprises a potting component, after the signal wire passes through the mounting hole and is electrically connected with the piezoelectric transduction piece, the potting component is injected into the second mounting cavity, one surface of the potting component is contacted with the mounting base, and the other surface of the potting component is contacted with the mounting upper shell.
In one embodiment, the mounting base comprises an adapting plate, a first abutting plate and a second abutting plate, the first abutting plate and the second abutting plate are arranged on the adapting plate along the circumferential interval of the adapting plate, the first abutting plate and the second abutting plate are abutted against the bottom wall of the second mounting cavity, and the adapting plate, the first abutting plate, the second abutting plate and the bottom wall of the second mounting cavity form a mounting space for mounting the piezoelectric transduction piece.
In one embodiment, according to the positive electrode welding point on the piezoelectric transduction piece, a marking portion is additionally arranged on the adapting plate, the marking portion is opposite to the positive electrode welding point of the piezoelectric transduction piece, a setting portion is additionally arranged on the mounting lower shell, and the positioning portion is opposite to the marking portion.
In one embodiment, the electrical switching mechanism further includes an integrated seat, an integrated hole is formed in the integrated seat, the integrated seat is mounted inside the mounting upper shell, and the signal wire is electrically connected with the PCB adaptor through the integrated hole.
When the electrical switching mechanism is used, the size and the shape of the installation shell are determined according to the size and the shape of the PCB switching piece and the piezoelectric transduction piece, so that the PCB switching piece and the installation shell can be effectively installed and fixed, and the piezoelectric transduction piece can be effectively installed inside the installation shell. Further, according to the installation needs, can install the signal line inside the installation casing, simultaneously, realize the electric connection of signal line and piezoelectricity transduction piece and the electric connection of signal line and PCB adaptor through welded mode. The PCB adaptor is electrically matched with the electrical component, for example: in view of the influence of the structure of the mounting housing itself, in order to facilitate the mounting of the PCB adapter with the electrical components, the PCB adapter may be mounted at the end of the mounting housing. Compared with the traditional ultrasonic flow transducer, the electrical switching mechanism realizes the electrical switching of the components such as the signal wire, the piezoelectric transduction piece and the like through the PCB switching piece, and the thimble assembly is additionally arranged on the PCB switching piece so as to realize the plug-in matching with the electrical element. Therefore, the electrical switching mechanism is switched and installed through the PCB switching piece, and the signal wire can be prevented from being welded or twisted, so that the ultrasonic flow transducer is more convenient to install.
When the ultrasonic flow transducer is used, the thimble assembly is adjusted according to the position electrically connected with the driving plate, for example: the thimble assembly comprises a positive thimble and a negative thimble, the positive thimble is electrically connected with the positive position of the driving plate in an inserting mode, and the negative thimble is electrically connected with the negative position of the driving plate in an inserting mode. The electrical switching mechanism realizes the electrical switching of the components such as the signal wire, the piezoelectric transduction piece and the like through the PCB switching piece, and the thimble assembly is additionally arranged on the PCB switching piece so as to realize the plug-in matching with the electrical element. Therefore, the electrical switching mechanism is switched and installed through the PCB switching piece, and the signal wire can be prevented from being welded or twisted, so that the ultrasonic flow transducer is more convenient to install.
Drawings
FIG. 1 is a schematic diagram of an internal structure of an electrical switching mechanism;
FIG. 2 is a schematic view of the structure of a mounting base;
fig. 3 is a schematic view of a structure in which the lower case is mounted.
100. The PCB adapter, 110, thimble assembly, 200, installation casing, 210, installation upper shell, 211, first installation chamber, 220, installation lower shell, 221, second installation chamber, 222, location portion, 230, joint convex part, 240, joint concave part, 250, installation base, 251, mounting hole, 252, adaptation board, 2521, identification portion, 253, first conflict board, 254, second conflict board, 260, embedment assembly, 261, embedment layer, 262, silica gel layer, 270, integration seat, 300, piezoelectricity transduction piece, 400, signal line.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
Referring to fig. 1, in one embodiment, the electrical switching mechanism includes: the PCB adaptor 100, the installation shell 200, the piezoelectric transduction piece 300 and the signal wire 400, wherein the piezoelectric transduction piece 300 is arranged inside the installation shell 200, the PCB adaptor 100 is fixedly matched with the installation shell 200, the PCB adaptor 100 is electrically communicated with the piezoelectric transduction piece 300 through the signal wire 400, and the PCB adaptor 100 is provided with the thimble assembly 110 which is electrically contacted with an electrical element.
When the electrical switching mechanism is used, the size and shape of the mounting housing 200 are determined according to the size and shape of the PCB adaptor 100 and the piezoelectric transduction piece 300, so that the PCB adaptor 100 and the mounting housing 200 can be effectively mounted and fixed, and the piezoelectric transduction piece 300 can be effectively mounted inside the mounting housing 200. Further, according to the installation requirement, the signal wire 400 may be installed inside the installation housing 200, and at the same time, the electrical connection between the signal wire 400 and the piezoelectric transduction piece 300 and the electrical connection between the signal wire 400 and the PCB adaptor 100 are realized by means of soldering. The PCB adapter 100 is electrically engaged with electrical components, for example: in order to facilitate the mounting of the PCB adapter 100 with the electrical components in consideration of the influence of the structure of the mounting housing 200 itself, the PCB adapter 100 may be mounted at the end of the mounting housing 200. Compared with the traditional ultrasonic flow transducer, the electrical switching mechanism realizes the electrical switching of the components such as the signal wire 400 and the piezoelectric transduction piece 300 through the PCB switching piece 100, and the thimble assembly 110 is additionally arranged on the PCB switching piece 100, so that the electrical switching mechanism can realize the plug-in matching with the electrical components. Therefore, the electrical switching mechanism is switched and installed through the PCB adaptor 100, so that the signal wire 400 is prevented from being welded or twisted, and the ultrasonic flow transducer is more convenient to install.
Referring to fig. 1, in one embodiment, the mounting housing 200 includes a mounting upper case 210 and a mounting lower case 220, the mounting upper case 210 is detachably mounted with the mounting lower case 220, a first mounting cavity 211 is provided inside the mounting upper case 210, a second mounting cavity 221 is provided inside the mounting lower case 220, the first mounting cavity 211 is communicated with the second mounting cavity 221, the PCB adaptor 100 is mounted at an end of the mounting upper case 210, the piezoelectric transduction piece 300 is located in the second mounting cavity 221, one end of the signal wire 400 is inserted into the first mounting cavity 211 and electrically connected with the PCB adaptor 100, and the other end of the signal wire 400 is inserted into the second mounting cavity 221 and electrically connected with the piezoelectric transduction piece 300. Specifically, the upper and lower mounting cases 210 and 220 may be specifically designed according to the shapes and sizes of the PCB adaptor 100, the piezoelectric transduction piece 300, and the like. When the upper and lower installation shells 210 and 220 are assembled, the upper and lower installation shells 210 and 220 may be fixed by plugging or clamping. Further, the signal wires 400 are located in the first mounting cavity 211 and the second mounting cavity 221, so as to improve the integration of the electrical switching mechanism.
In one embodiment, the PCB adapter 100 is a PCB board or PCB adapter. The PCB adapter 100 and the mounting upper case 210 may be fastened by a snap fit or screw thread.
As shown in fig. 1, in one embodiment, a locking protrusion 230 is disposed at an end of the mounting upper case 210 away from the PCB adaptor 100 along a circumferential direction of the mounting upper case 210, a locking recess 240 is disposed at an end of the mounting lower case 220 away from the piezoelectric transduction piece 300 along a circumferential direction of the mounting lower case 220, and the locking protrusion 230 is locked to the locking recess 240 when the mounting upper case 210 is assembled with the mounting lower case 220. Specifically, the clamping protrusion 230 may be a clamping convex ring or a clamping convex block. For example: the number of the clamping protrusions may be plural, and the plurality of clamping protrusions are disposed on the mounting upper case 210 at intervals along the circumferential direction of the mounting upper case 210. The snap recess 240 may be a groove or a stepped groove. In the above embodiment, the engagement between the engagement convex portion 230 and the engagement concave portion 240 effectively improves the mounting tightness between the upper mounting case 210 and the lower mounting case 220.
Referring to fig. 1, in one embodiment, the clamping recess 240 includes a first clamping ring and a second clamping ring, the first clamping ring and the second clamping ring are sleeved at one end of the mounting upper case 210 away from the PCB adapter 100, the first clamping ring and the second clamping ring are in stacked fit, and a surface radius of the first clamping ring is larger than a surface radius of the second clamping ring; the clamping recess 240 includes a first clamping groove and a second clamping groove, the radial dimension of the first clamping groove is greater than the radial dimension of the second clamping groove, the first clamping groove and the second clamping groove are axially formed in the mounting lower case 220 at one end of the mounting lower case 220 away from the piezoelectric transduction piece 300, and when the mounting upper case 210 and the mounting lower case 220 are assembled, the first clamping ring is clamped into the first clamping groove, and the second clamping ring is clamped into the second clamping groove. Specifically, the first clamping ring and the second clamping ring may be a single ring body structure or a stepped ring. Namely, the first clamping ring and the second clamping ring can be overlapped to form a stepped ring structure with more than one level according to the installation requirement. The first clamping groove and the second clamping groove can be single annular grooves or stepped grooves. Namely, the first clamping groove and the second clamping groove can form a stepped annular groove with more than one level according to the installation requirement. When the upper and lower mounting cases 210 and 220 are assembled, the stepped ring mechanism is assembled with the stepped groove structure, thereby effectively improving the mounting tightness of the upper and lower mounting cases 210 and 220.
As shown in fig. 1 and 2, in one embodiment, the electrical switching mechanism further includes a mounting base 250, the mounting base 250 is installed in the second mounting cavity 221, the mounting base 250 is fixedly matched with the piezoelectric transduction piece 300, and a mounting hole 251 for the signal line 400 to pass through is formed in the mounting base 250. Specifically, the fixing effect of the piezoelectric transduction piece 300 in the second mounting cavity 221 may be improved by adding the mounting base 250 in the second mounting cavity 221. When the mounting base 250 is mounted in the second mounting cavity 221, the piezoelectric transduction piece 300 is positioned between the mounting base 250 and the bottom of the mounting lower case 220. Further, after the piezoelectric transduction piece 300 is completely fixed in the second mounting cavity 221, the signal line 400 is electrically connected to the piezoelectric transduction piece 300 through the mounting hole 251 by soldering. According to the mounting requirement, the signal wire 400 may be first electrically connected to the piezoelectric transduction piece 300 by soldering, and then the mounting base 250 is mounted in the second mounting cavity 221, while the signal wire 400 is penetrated through the mounting hole 251. Or the mounting base 250 is first fitted into the second mounting cavity 221 and then the signal wire 400 is soldered and electrically connected to the piezoelectric transduction piece 300 through the mounting hole 251.
Referring to fig. 1, in one embodiment, the electrical switching mechanism further includes a potting component 260, after the signal wire 400 is electrically connected to the piezoelectric transduction piece 300 through the mounting hole 251, the potting component 260 is injected into the second mounting cavity 221, one surface of the potting component 260 contacts the mounting base 250, and the other surface of the potting component 260 contacts the mounting upper case 210. Specifically, the potting assembly 260 may include a potting adhesive and a silicone gel, which is first injected into the second mounting chamber 221, i.e., the silicone layer 262 is formed in the second mounting chamber 221. The silica gel layer 262 is in contact with one surface of the mounting base 250 far away from the piezoelectric transduction piece 300, and then pouring the pouring sealant into the second mounting cavity 221, forming a potting layer 261 in the second mounting cavity 221, wherein one surface of the potting layer 261 is in contact with the silica gel layer 262, and the other surface of the potting layer 261 is used for abutting against the mounting upper shell 210. The embodiment can effectively improve the installation compactness of the electrical switching mechanism.
As shown in fig. 1 and 2, in one embodiment, the mounting base 250 includes an adapting plate 252, a first abutting plate 253 and a second abutting plate 254, the first abutting plate 253 and the second abutting plate 254 are disposed on the adapting plate 252 along a circumferential interval of the adapting plate 252, the first abutting plate 253 and the second abutting plate 254 all abut against a bottom wall of the second mounting cavity 221, and the adapting plate 252, the first abutting plate 253, the second abutting plate 254 and the bottom wall of the second mounting cavity 221 form a mounting space for mounting the piezoelectric transducer 300. Specifically, after the mounting base 250 is mounted in the second mounting cavity 221, the first abutting plate 253 abuts against the second abutting plate 254 and abuts against the bottom wall of the second mounting cavity 221, and at the same time, the side portions of the first abutting plate 253 and the second abutting plate 254 are attached to the cavity wall of the second mounting cavity 221. The fixing manner can improve the fixing effect of the mounting base 250 in the second mounting cavity 221, and meanwhile, the mounting space is partitioned for the piezoelectric transduction piece 300 under the mounting of the mounting base 250, so that the piezoelectric transduction piece 300 is prevented from being damaged by extrusion.
Referring to fig. 1 to 3, in one embodiment, according to the positive electrode welding point on the piezoelectric transducer 300, a marking portion 2521 is added to the adapting plate 252, the marking portion 2521 is opposite to the positive electrode welding point of the piezoelectric transducer 300, a setting portion 222 is added to the mounting lower case 220, and the positioning portion 222 is opposite to the marking portion 2521. Specifically, the marking portion 2521 is a marking line or marking hole. The positioning portion 222 is a positioning hole or a positioning slot. When the piezoelectric transduction piece 300 is welded and electrically connected, it is necessary to determine the positive electrode welding point of the piezoelectric transduction piece 300, and therefore, the identification portion 2521 is added on the adapting plate 252 and the positioning portion 222 is added on the mounting lower case 220, so that the piezoelectric transduction piece 300, the adapting plate 252 and the mounting lower case 220 can be aligned and mounted according to the positive electrode welding point of the piezoelectric transduction piece 300, and meanwhile, the alignment manner helps to improve the consistency of the piezoelectric transduction piece 300 when receiving signals.
Referring to fig. 1, in one embodiment, the electrical switching mechanism further includes an integrated seat 270, an integrated hole is formed in the integrated seat 270, the integrated seat 270 is mounted inside the mounting upper case 210, and the signal wire 400 is electrically connected to the PCB adaptor 100 through the integrated hole. Specifically, it is considered that the signal line 400 may require two or more connectors to be electrically connected when the signal line 400 is connected to the PCB adapter 100. Therefore, by additionally arranging the integrated seat 270 in the first mounting cavity 211, the signal wire 400 passes through the integrated hole of the integrated seat 270, so that the phenomenon of winding or winding of the signal wire 400 can be avoided, and the mounting is more convenient.
In one embodiment, an ultrasonic flow transducer includes the electrical switching mechanism and further includes a driving board, and the PCB adaptor 100 is electrically connected to the driving board through the ejector pin assembly 110.
When the ultrasonic flow transducer is used, the thimble assembly 110 is adjusted according to the position electrically connected with the driving plate, for example: the thimble assembly 110 includes a positive thimble and a negative thimble, the positive thimble is electrically connected to the positive position of the driving plate, and the negative thimble is electrically connected to the negative position of the driving plate. The electrical switching mechanism realizes electrical switching of the signal wire 400, the piezoelectric transduction piece 300 and other components through the PCB adaptor 100, and the thimble assembly 110 is additionally arranged on the PCB adaptor 100 to realize plug-in matching with the electrical components. Therefore, the electrical switching mechanism is switched and installed through the PCB adaptor 100, so that the signal wire 400 is prevented from being welded or twisted, and the ultrasonic flow transducer is more convenient to install.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Claims (8)
1. An electrical switching mechanism, comprising: the PCB adapter is fixedly matched with the mounting shell, the PCB adapter is electrically communicated with the piezoelectric transduction piece through the signal wire, the PCB adapter is provided with a thimble assembly which is used for electrically contacting with an electrical element, the mounting shell comprises a mounting upper shell and a mounting lower shell, a first mounting cavity is formed in the mounting upper shell, a second mounting cavity is formed in the mounting lower shell, the first mounting cavity is communicated with the second mounting cavity, the PCB adapter is arranged at the end part of the mounting upper shell, the piezoelectric transduction piece is positioned in the second mounting cavity, one end of the signal wire is inserted into the first mounting cavity and is electrically connected with the PCB adapter, and the other end of the signal wire is inserted into the second mounting cavity and is electrically connected with the piezoelectric transduction piece; and
The mounting base is arranged in the second mounting cavity and is fixedly matched with the piezoelectric transduction piece, the mounting base comprises an adapter plate, a first abutting plate and a second abutting plate, the first abutting plate and the second abutting plate are arranged on the adapter plate along the circumferential interval of the adapter plate, the first abutting plate and the second abutting plate are abutted to the bottom wall of the second mounting cavity, and the adapter plate, the first abutting plate, the second abutting plate and the bottom wall of the second mounting cavity form a mounting space for mounting the piezoelectric transduction piece;
According to the positive electrode welding spots on the piezoelectric transduction piece, a marking part is additionally arranged on the adapting plate, the marking part is opposite to the positive electrode welding spots of the piezoelectric transduction piece, a setting part is additionally arranged on the mounting lower shell, and the positioning part is opposite to the marking part.
2. The electrical switching apparatus of claim 1 wherein the mounting upper housing is removably mounted in engagement with the mounting lower housing.
3. The electrical switching apparatus as set forth in claim 2 wherein a snap-in protrusion is provided along a circumferential direction of the mounting upper case at an end of the mounting upper case remote from the PCB adaptor, and a snap-in recess is provided along a circumferential direction of the mounting lower case at an end of the mounting lower case remote from the piezoelectric transduction piece, the snap-in protrusion being snap-fitted with the snap-in recess when the mounting upper case is assembled with the mounting lower case.
4. The electrical switching apparatus as set forth in claim 3 wherein the clamping recess includes a first clamping ring and a second clamping ring, the first clamping ring and the second clamping ring are sleeved at an end of the mounting upper case away from the PCB switching member, the first clamping ring and the second clamping ring are in overlapping engagement, and a surface radius of the first clamping ring is greater than a surface radius of the second clamping ring; the clamping concave part comprises a first clamping groove and a second clamping groove, the radial dimension of the first clamping groove is larger than that of the second clamping groove, the first clamping groove and the second clamping groove are axially formed in the lower mounting shell and far away from one end of the piezoelectric transduction piece, and when the upper mounting shell and the lower mounting shell are assembled, the first clamping ring is clamped into the first clamping groove, and the second clamping ring is clamped into the second clamping groove.
5. The electrical switching apparatus as set forth in claim 2 wherein said mounting base defines mounting holes for said signal wires to pass therethrough.
6. The electrical switching apparatus of claim 5 further comprising a potting assembly, wherein after the signal wire is electrically connected to the piezoelectric transducer sheet through the mounting hole, the potting assembly is injected into the second mounting cavity, one side of the potting assembly is in contact with the mounting base, and the other side of the potting assembly is in contact with the mounting upper housing.
7. The electrical switching apparatus as set forth in claim 2 further comprising an integrated socket having an integrated hole therein, the integrated socket being mounted within the mounting upper housing, the signal wire being electrically connected to the PCB adapter through the integrated hole.
8. An ultrasonic flow transducer comprising the electrical switching mechanism of any one of claims 1 to 7, and further comprising a drive plate, wherein the PCB adaptor is electrically connected to the drive plate through the ejector pin assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110604464.3A CN113390484B (en) | 2021-05-31 | 2021-05-31 | Ultrasonic flow transducer and electrical switching mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110604464.3A CN113390484B (en) | 2021-05-31 | 2021-05-31 | Ultrasonic flow transducer and electrical switching mechanism |
Publications (2)
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