CN115117044A - Packaging structure of SMD opto-coupler device - Google Patents
Packaging structure of SMD opto-coupler device Download PDFInfo
- Publication number
- CN115117044A CN115117044A CN202210743553.0A CN202210743553A CN115117044A CN 115117044 A CN115117044 A CN 115117044A CN 202210743553 A CN202210743553 A CN 202210743553A CN 115117044 A CN115117044 A CN 115117044A
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- Prior art keywords
- chip
- packaging
- transmitting
- optical coupler
- coupler device
- Prior art date
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 28
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
The invention belongs to the technical field of optical coupler packaging, and discloses a packaging structure of a surface mount type optical coupler, which comprises: a package substrate having an input end and an output end; the transmitting chip is electrically connected to the input end of the packaging substrate; a receiving chip electrically connected to an output terminal of the package substrate; the packaging shell is fixed on the packaging substrate, and the transmitting chip and the receiving chip are packaged in the packaging shell; wherein: a directional light transmitting layer is coated outside the transmitting chip and/or the receiving chip; the packaging shell comprises a reflection layer positioned at the innermost side and at least one metal shielding layer positioned outside the reflection layer; and the receiving chip receives the light rays emitted by the emitting chip through the matching of the directional light transmitting layer and the reflecting layer. Therefore, the influence of the environmental temperature on the performance of the chip can be effectively reduced, and the stability, the reliability and the external interference resistance of the whole optical coupler device can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of optical coupler packaging, and particularly relates to a packaging structure of a surface mount type optical coupler.
Background
An optical coupler, also called as a photoelectric isolator or a photoelectric coupler (optical coupler for short), is a device for transmitting electric signals by using light as a medium, and has the advantages of no contact, insulation between output and input, unidirectional signal transmission and the like, so that the optical coupler is widely applied to digital circuits. The existing optical coupler usually encapsulates a light emitter and a light receiver in the same tube shell, when an input end is electrified with a signal, the light emitter emits light, and the light receiver generates photocurrent after receiving the light and flows out from an output end, so that 'electricity-light-electricity' conversion is realized.
However, most of the existing optical couplers are mainly plastic-packaged, have large volume, and are difficult to adapt to the development trend of miniaturization and ultrathin type of electronic products. Aiming at the problems, in recent years, foreign manufacturers develop ultra-thin patch type optocouplers which are packaged and molded by packaging glue, although the size of the optocoupler is reduced by the packaging method, the consistency of the packaged optocoupler is poor, the optocoupler is greatly influenced by the change of the environmental temperature, and the stability and the reliability of the optocoupler are greatly influenced.
Disclosure of Invention
In view of the above, in order to solve the problems in the background art, the present invention provides a package structure of a surface mount optical coupler.
In order to achieve the purpose, the invention provides the following technical scheme:
a packaging structure of a patch type optical coupler comprises:
a package substrate having an input end and an output end;
the transmitting chip is electrically connected to the input end of the packaging substrate;
a receiving chip electrically connected to an output terminal of the package substrate;
the packaging shell is fixed on the packaging substrate, and the transmitting chip and the receiving chip are packaged in the packaging shell;
wherein
A directional light transmitting layer is coated outside the transmitting chip and/or the receiving chip;
the packaging shell comprises a reflection layer positioned at the innermost side and at least one metal shielding layer positioned outside the reflection layer;
and the receiving chip receives the light rays emitted by the emitting chip through the matching of the directional light transmitting layer and the reflecting layer.
Preferably, the light-transmitting layer includes, but is not limited to, one or more of a microlens and a light-transmissive adhesive layer.
Preferably, at least one of the transmitting chip and the receiving chip is provided.
Preferably, the light emitted by one of the emitting chips is received by at least one of the receiving chips.
Preferably, one of the receiving chips receives at least one of the light emitted from the emitting chip.
Preferably, the emitting chip includes, but is not limited to, one or more of a far infrared LED chip, an LED module, a laser chip, a laser module, and a light radiation component.
Preferably, the receiving chip includes, but is not limited to, one or more of a photo-triode chip, a photo-sensitive chip, a photoelectric conversion material, and a photoelectric conversion device.
Preferably, the lower electrodes of the transmitting chip and the receiving chip are correspondingly fixed on the input end and the output end of the packaging substrate in a die bonding manner.
Preferably, the upper electrodes of the transmitting chip and the receiving chip are correspondingly connected with the input end and the output end of the packaging substrate through welding gold wires.
Preferably, the cross-sectional shape of the package housing is a hemisphere or a polygon.
Compared with the prior art, the invention has the following beneficial effects:
in the packaging structure provided by the invention, the transmitting chip and the receiving chip are packaged on the packaging substrate together, and then the packaging shell capable of wrapping the transmitting chip and the receiving chip is welded on the packaging substrate, so that the whole structure and the packaging operation are simple, and the packaging shell comprises at least one metal shielding layer, therefore, the external interference resistance of the whole optocoupler can be effectively improved, and the influence of the ambient temperature on the performance of the chip can be effectively reduced. In addition, the transmitting chip and/or the receiving chip are/is coated with the directional light transmitting layer, and the innermost side of the packaging shell is provided with the reflecting layer, so that light rays emitted by the transmitting chip can be accurately received by the receiving chip along the preset direction, and the stability and the reliability of the whole optical coupler device are greatly improved.
Drawings
FIGS. 1-3 are schematic structural views of the package structure of the present invention;
in the figure: 1-packaging substrate, 2-transmitting chip, 3-receiving chip and 4-packaging shell.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a package structure of a patch type optical coupler, and the package structure specifically includes: package substrate 1, transmitting chip 2, receiving chip 3 and package body 4.
The package substrate 1 has an input terminal a and an output terminal b. Wherein: the input end a and the output end b are respectively provided with an input circuit and an output circuit (not shown in the specific circuit diagram) corresponding to the input end a and the output end b, and the material of the integral packaging substrate 1 is ceramic, glass fiber, copper alloy, aluminum or aluminum alloy.
The transmitting chip 2 is electrically connected to the input end a of the package substrate 1, and the receiving chip 3 is electrically connected to the output end b of the package substrate 1. Specifically, the method comprises the following steps: the lower electrodes of the transmitting chip 2 and the receiving chip 3 are correspondingly fixed on the input end a and the output end b of the packaging substrate 1 in a die bonding mode, and the upper electrodes of the transmitting chip 2 and the receiving chip 3 are correspondingly connected with the input end a and the output end b of the packaging substrate 1 through welding gold threads.
The package body 4 is used for covering the transmitting chip 2 and the receiving chip 3, and the cross-sectional shape of the package body 4 is a hemisphere or a polygon as can be seen from the figure.
Specifically, a directional light-transmitting layer is coated outside the transmitting chip 2 and/or the receiving chip 3, and the package housing 4 includes a reflective layer located at the innermost side and at least one metal shielding layer located outside the reflective layer. The directional light transmitting layer is provided with a light path capable of changing the direction of light, the reflecting layer can reflect the light, and therefore the receiving chip 3 can accurately receive the light emitted by the emitting chip 2 through the matching of the directional light transmitting layer and the reflecting layer. In addition, the metal shielding layer can effectively improve the external interference resistance of the whole optical coupler device and effectively reduce the influence of the environmental temperature on the performance of the chip.
Preferably, the light-transmitting layer includes, but is not limited to, one or more of a microlens and a light-transmissive adhesive layer.
Preferably, the metal shielding layer can be made of pure metal material or alloy material.
At least one of the transmitting chip 2 and the receiving chip 3 is set, and the light transmission between the transmitting chip 2 and the receiving chip 3 is set to be one-to-one transmission, many-to-one transmission, or one-to-many transmission.
One-to-one transmission: the light emitted by a transmitting chip 2 is received by a receiving chip 3 matched with the transmitting chip;
many-to-one transmission: one receiving chip 3 can receive the light emitted by two or more emitting chips 2;
one-to-many transmission: the light emitted from one emitting chip 2 can be received by two or more receiving chips 3.
And further: the emitting chip 2 includes, but is not limited to, one or more of a far infrared LED chip, an LED module, a laser chip, a laser module, and a light radiation component. The receiving chip 3 includes, but is not limited to, one or more of a photo-triode chip, a photo-sensitive chip, a photo-electric conversion material, and a photo-electric conversion device.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a packaging structure of SMD opto-coupler device which characterized in that includes:
a package substrate (1) having an input end and an output end;
an emitting chip (2) electrically connected to an input terminal of the package substrate (1);
a receiving chip (3) electrically connected to an output terminal of the package substrate (1);
the packaging shell (4) is fixed on the packaging substrate (1), and the transmitting chip (2) and the receiving chip (3) are both packaged in the packaging shell (4);
wherein
A directional light transmitting layer is coated outside the transmitting chip (2) and/or the receiving chip (3);
the packaging shell (4) comprises a reflection layer positioned at the innermost side and at least one metal shielding layer positioned outside the reflection layer;
and the receiving chip (3) receives the light rays emitted by the emitting chip (2) through the matching of the directional light transmitting layer and the reflecting layer.
2. The package structure of the surface mount optical coupler device according to claim 1, wherein: the light-transmitting layer includes but is not limited to one or more of a micro lens and a light-transmitting adhesive layer.
3. The package structure of the surface mount optical coupler device according to claim 1, wherein: at least one transmitting chip (2) and at least one receiving chip (3) are arranged.
4. The package structure of the surface mount optical coupler device according to claim 2, wherein: the light emitted by one emitting chip (2) is received by at least one receiving chip (3).
5. The packaging structure of the patch type optical coupler device according to claim 3 or 4, wherein: one receiving chip (3) at least receives the light emitted by one emitting chip (2).
6. The packaging structure of the surface mount optical coupler device according to claim 3, wherein: the emitting chip (2) comprises one or more of a far infrared LED chip, an LED module, a laser chip, a laser module and a light radiation component.
7. The packaging structure of the surface mount optical coupler device according to claim 3, wherein: the receiving chip (3) comprises one or more of but not limited to a photoelectric triode chip, a photosensitive chip, a photoelectric conversion material and a photoelectric conversion component.
8. The package structure of the surface mount optical coupler device according to claim 1, wherein: and the lower electrodes of the transmitting chip (2) and the receiving chip (3) are correspondingly fixed on the input end and the output end of the packaging substrate (1) in a die bonding mode.
9. The package structure of the surface mount optical coupler device according to claim 1, wherein: and the upper electrodes of the transmitting chip (2) and the receiving chip (3) are correspondingly connected with the input end and the output end of the packaging substrate (1) through welding gold threads.
10. The package structure of the surface mount optical coupler device according to claim 1, wherein: the cross section of the packaging shell (4) is hemispherical or polygonal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210743553.0A CN115117044A (en) | 2022-06-27 | 2022-06-27 | Packaging structure of SMD opto-coupler device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210743553.0A CN115117044A (en) | 2022-06-27 | 2022-06-27 | Packaging structure of SMD opto-coupler device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115117044A true CN115117044A (en) | 2022-09-27 |
Family
ID=83331099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210743553.0A Withdrawn CN115117044A (en) | 2022-06-27 | 2022-06-27 | Packaging structure of SMD opto-coupler device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115117044A (en) |
-
2022
- 2022-06-27 CN CN202210743553.0A patent/CN115117044A/en not_active Withdrawn
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220927 |