CN115116714A - Coil device - Google Patents
Coil device Download PDFInfo
- Publication number
- CN115116714A CN115116714A CN202110295427.9A CN202110295427A CN115116714A CN 115116714 A CN115116714 A CN 115116714A CN 202110295427 A CN202110295427 A CN 202110295427A CN 115116714 A CN115116714 A CN 115116714A
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- Prior art keywords
- guide member
- core
- coil
- base
- fitting
- Prior art date
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 47
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 238000005096 rolling process Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims 1
- 238000004804 winding Methods 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000576 Laminated steel Inorganic materials 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
A coil device according to an embodiment of the present invention includes: an element unit including a core and a coil; a guide member that guides a lead-out wire of the coil; a pedestal disposed on a circuit board perpendicular to a Z direction, positioning the element portion and the guide member with respect to the circuit board, the guide member including a columnar head portion disposed on the core and extending in a Y direction perpendicular to the Z direction, the head portion having formed on an outer peripheral portion thereof: a guide groove extending in the circumferential direction of the head portion and guiding the lead wire; and a rotary guide surface as a curved surface extending in a circumferential direction of the head portion to guide rolling or rotational sliding of the guide member on the core, wherein the guide member includes a pressing portion that presses the lead wire from a side opposite to the guide groove so that the lead wire does not come out of the guide groove.
Description
Technical Field
The present invention relates to a coil device.
Background
Documents of the prior art
Patent literature
Patent document 1: japanese patent laid-open publication No. 2010-34429
Disclosure of Invention
Problems to be solved by the invention
In the coil component described in patent document 1, since a step of connecting lead wires of the coil to the lead terminals is required, the number of steps of the assembly operation is large. In addition, when a wire having a large cross-sectional area and high rigidity is used for the coil, it is difficult to manually bend the wire and fit the wire into the bent groove, and it is necessary to bend the wire using a jig, which increases the number of steps in the assembly work.
The present invention has been made in view of the above circumstances, and an object thereof is to facilitate assembly of a coil device that can be directly mounted on a circuit board.
Means for solving the problems
One embodiment of the present invention provides a coil device including: an element unit including a core and a coil; a guide member that guides a lead-out wire of the coil; a pedestal which is arranged on a circuit board perpendicular to a Z direction, positions the element portion and the guide member with respect to the circuit board, wherein the guide member includes a columnar head portion arranged on the core and extending in a Y direction perpendicular to the Z direction, and wherein: a guide groove extending in the circumferential direction of the head portion and guiding the lead wire; and a rotary guide surface as a curved surface extending in a circumferential direction of the head to guide rolling or rotational sliding of the guide member on the core, wherein the guide member includes a pressing portion that presses the lead wire from a side opposite to the guide groove so that the lead wire does not come off from the guide groove.
In the coil device, the following configuration may be adopted: the guide member includes a base extending in a Z direction from one end portion of the head in an X direction perpendicular to the Y direction and the Z direction toward the circuit board, the base having a back surface disposed toward the core, and the guide groove extending over the entire length of the front surface of the base in the Z direction.
In the coil device, the following configuration may be adopted: the pair of side walls of the guide groove are respectively provided with an extension portion extending forward from the front end of the base, the pair of extension portions are connected via the pressing portion, and the base and the pressing portion are arranged at a predetermined interval in the Z direction.
In the coil device, the following configuration may be adopted: the core has a wall portion erected on the circuit board via a pedestal and extending in the Y direction, the main body portion of the coil is disposed on the back side of the wall portion, the head portion of the guide member is disposed on the wall portion, the lead wire is bent in a U-shape along a guide groove formed in the head portion of the guide member, and the tip portion of the lead wire is disposed on the front side of the wall portion.
In the coil device, the following configuration may be adopted: the lower surface of the head and the back surface of the base are planes perpendicular to each other, and a corner formed by the upper surface and the outer side surface of the wall portion of the core is accommodated in a corner portion formed by the lower surface of the head and the plane of the base.
In the coil device, the following configuration may be adopted: the pedestal is provided with: a pedestal positioning unit for positioning the pedestal relative to the circuit substrate; an element part positioning unit that positions the element part with respect to the base; and a first fitting portion that fits with the guide member, wherein the guide member includes a second fitting portion that fits with the first fitting portion and positions the guide member with respect to the base.
In the coil device, the following configuration may be adopted: the second fitting portion is a front end portion of the guide member, and the first fitting portion has a first fitting groove into which the front end portion of the guide member is fitted.
In the coil device, the following configuration may be adopted: inclined surfaces are formed on both side surfaces of the front end of the guide member so that the width thereof becomes narrower toward the rear surface.
In the coil device, the following configuration may be adopted: a projection for preventing the second fitting part from coming off the first fitting groove is formed on the edge of the first fitting groove.
In the coil device, the following configuration may be adopted: the first fitting portion is formed with a second fitting groove into which the lead wire is fitted.
In the coil device, the following configuration may be adopted: the first fitting portion has a pair of opposing protruding portions protruding from both side surfaces of the first fitting groove, and a second fitting groove is formed by the tip end surfaces of the pair of protruding portions and the bottom surface of the first fitting groove.
In the coil device, the following configuration may be adopted: the upper surface of the projection is in contact with the tip of the guide member, and the guide member is positioned in the Z direction perpendicular to the circuit board.
In the coil device, the following configuration may be adopted: the pedestal positioning unit includes a recess portion that is fitted to the core and positions the element portion with respect to the pedestal.
In the coil device, the following configuration may be adopted: an opening through which the coil passes is formed in the bottom of the base.
Effects of the invention
According to an embodiment of the present invention, the coil device that can be directly mounted on the circuit board can be easily assembled.
Drawings
Fig. 1 is an external view of a reactor according to an embodiment of the present invention.
Fig. 2 is an external view of a reactor according to an embodiment of the present invention.
Fig. 3 is an exploded view of a reactor according to an embodiment of the present invention.
Fig. 4 is an external view of a pedestal according to an embodiment of the present invention.
Fig. 5 is an external view of a guide member according to an embodiment of the present invention.
Fig. 6 is an external view of a guide member according to an embodiment of the present invention.
Fig. 7 is a longitudinal sectional view of a guide member according to an embodiment of the present invention.
Fig. 8A is a diagram showing a procedure of drawing out wires using a guide member.
Fig. 8B is a diagram illustrating a step of bending the lead wire using the guide member.
Fig. 8C is a diagram showing a step of bending the lead wire using the guide member.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same or corresponding items will be denoted by the same or corresponding reference numerals, and redundant description thereof will be omitted. In the drawings, when a plurality of items common to the symbols are displayed, the symbols are appropriately omitted from some of the plurality of items displayed.
Fig. 1 and 2 are external views of a reactor 1 (coil device) according to an embodiment of the present invention. Fig. 3 is an exploded view of the reactor 1.
In the following description, a direction from the upper right to the lower left in fig. 1 is defined as an X direction, a direction from the upper left to the lower right is defined as a Y direction, and a direction from the lower side to the upper side is defined as a Z direction. The X direction and the Y direction are horizontal directions orthogonal to each other, and the Z direction is a vertical direction. The reactor 1 may be used vertically in any one of the X direction, the Y direction, the Z direction, and a direction between these directions in fig. 1.
The reactor 1 according to the embodiment of the present invention described below is configured to be mountable on a dedicated circuit board (specifically, an opening portion formed to penetrate a coil portion 11 of a coil 10 described later). Wherein, the Z direction is the vertical direction of the circuit substrate.
As shown in fig. 3, the reactor 1 includes an element portion 1a that performs an electrical function, and a socket 1b for mounting the element portion 1a on a circuit board.
The element unit 1a includes a coil 10 (winding), a core 20 (magnetic core), and insulating sheets 31 and 32 for ensuring insulation between the coil 10 and the core 20.
The coil 10 is formed by winding a conductive wire coated with an insulating film such as enamel or an insulating film in a spiral shape (a winding shape). The wire uses a straight or round wire formed of, for example, copper or aluminum. More specifically, the coil 10 of the present embodiment is formed by edgewise winding a rectangular wire, but the sectional shape or winding form of the wire is not limited to this configuration.
The coil 10 includes a spiral portion 11 (main body portion) formed by winding a lead wire in a spiral shape, and a pair of lead wires 12 extending from both ends of the spiral portion 11.
The core 20 is an 8-shaped powder magnetic core formed by combining an approximately rectangular cylindrical O-shaped core 21 (frame-shaped magnetic core) and an elongated cylindrical I-shaped core 22 (rod-shaped magnetic core). As shown in fig. 1, the O-shaped core 21 connects a pair of linear portions extending in the X direction, which are outer legs 20b of the core 20, and a pair of linear portions extending in the Y direction, which are yoke portions 20c of the core 20, into a frame shape.
The I-shaped core 22 is disposed between the pair of outer legs 20b with the longitudinal direction thereof oriented in the X direction, and serves as a center leg portion of the core 20. The I-core 22 passes through the hollow portion of the coil 10, and is accommodated in the hollow portion of the O-core 21 together with the coil 10.
The inner peripheral surface of the O-core 21 is covered with an insulating sheet 31 to ensure insulation between the O-core 21 and the coil 10. Further, the outer peripheral surface of the I-core 22 is covered with the insulating sheet 32, ensuring insulation between the I-core 22 and the coil 10.
The O-core 21 of the present embodiment is formed by concentrically (i.e., so that the center lines thereof coincide) overlapping and joining two substantially rectangular cylindrical O-core units 211. The two O-core units 211 are joined by, for example, welding, brazing, or bonding. The O-core 21 may be constituted by a single O-core unit 211, or may be constituted by three or more O-core units 211. By changing the number of O-core cells 211 constituting the O-core 21, the performance (e.g., inductance value, etc.) of the reactor 1 can be adjusted. Since the O-core 21 is made into a unit system, the reactors 1 having various performances can be manufactured by the single-sized O-core unit 211, and thus the manufacturing cost can be reduced by the common use of the components.
The socket 1b includes a base 40 for positioning the element portion 1a (directly, the core 20) with respect to the circuit board, and a guide member 50 for guiding the lead wires 12 of the coil 10. The base 40 and the guide member 50 are made of electrically insulating material such as phenol resin, epoxy resin, unsaturated polyester resin, urethane resin, bmc (bulk Molding compound), pps (polyphenylene sulfide), pbt (polybutylene terephthalate), or the like.
As shown in fig. 2, columnar legs 411 are formed at four corners of the bottom surface of the pedestal 40. By providing the legs 411, the pedestal 40 can be stably placed in parallel on the upper surface of the circuit board.
In addition, two positioning pins 42 (pedestal positioning unit) are vertically embedded in the bottom surface of the pedestal 40. Two positioning pins 42 are provided at positions separated in a diagonal direction of the bottom surface of the pedestal 40. If the reactor 1 is mounted on a circuit board, the positioning pins 42 are fitted into and soldered to positioning holes provided in the circuit board. Thereby, the reactor 1 is positioned and fixed with respect to the circuit board in the X-axis and Y-direction.
The positioning pins 42 are formed of a metal wire such as a steel wire, and are subjected to surface treatment such as tin plating so as to be soldered to the circuit board. The positioning pins 42 are embedded in the bottom surface of the pedestal 40 by press-fitting or insert molding.
Fig. 4 is a perspective view of the pedestal 40. A rectangular recess 44 (element portion positioning unit) for accommodating the bottom portion of the core 20 is formed in the upper surface of the pedestal 40. The recess 44 is formed to have a size in which the bottom of the core 20 is fitted substantially without a gap. Therefore, the element portion 1a is positioned in the X direction, the Y direction, and the Z direction with respect to the pedestal 40 by fitting the bottom portion of the core 20 into the recess 44.
An opening 43 through which the spiral portion 11 of the coil 10 passes is formed in the center of the bottom of the recess 44. An opening portion having the same size is also formed in a position corresponding to the opening portion 43 in the circuit board on which the pedestal 40 is mounted. Further, a cooling plate is disposed on the back side of the circuit board. When the reactor 1 is mounted on a circuit board, the lower portion of the coil portion 11 passes through the opening 43 of the base 40 and the opening of the circuit board, and contacts the cooling plate. Thus, heat generated by the reactor 1 during use is released to the cooling plate, and the reactor 1 is maintained at an appropriate temperature, whereby the performance of the reactor 1 is stabilized.
The base 40 is formed with fitting portions 40f (first fitting portions) at two locations separated in the other diagonal direction of the bottom surface of the base 40 (i.e., the diagonal direction in which the positioning pins 42 are not provided). The fitting portion 40f is fitted to a fitting portion 50f and lead wires 12, which will be described later, formed at the distal end portion of the guide member 50, and positions the guide member 50 and the lead wires 12 with respect to the base 40.
The fitting portion 40f has a protruding portion 45 protruding upward from the upper surface of the base 40. A square groove 46 (first fitting groove) extending vertically is formed on the front surface (the surface opposite to the core 20) of the protrusion 45. The fitting portion 50f of the guide member 50 is accommodated in the square groove 46. A small linear protrusion, i.e., a claw 49, extending along an edge of the square groove 46 is formed at a lower portion of the pair of side surfaces 46a of the square groove 46. Since the interval between the pair of claws 49 is narrower than the width of the fitting portion 50f of the guide member 50, the fitting portion 50f is prevented from coming out of the square groove 46 by the pair of claws 49. Instead of the linear claws 49 of the present embodiment, a single dot-shaped protrusion or a plurality of dot-shaped protrusions arranged along the edge of the square groove 46 may be provided.
The square groove 46 is formed to have a size such that the fitting portion 50f of the guide member 50 is fitted substantially without a gap. Therefore, if the fitting portion 50f is fitted into the square groove 46, the guide member 50 is positioned in the X-axis and Y-axis directions with respect to the base 40.
The square groove 46 extends to the lower end of the pedestal 40. A pair of plate-shaped protruding portions 47 protruding perpendicularly from both side surfaces 46a are formed at the lower portion of the square groove 46. The front end surfaces 47a of the pair of projections 47 and the bottom surface 46b of the square groove 46 form a square groove 48 (second fitting groove).
The width of the square groove 48 is set to a size that the lead wire 12 is fitted substantially without a gap. Further, if the fitting portion 50f of the guide member 50 is fitted to the fitting portion 40f of the base 40, the lead wire 12 is pressed to the bottom of the square groove 48 by a pressing portion 54 of the guide member 50, which will be described later. Therefore, the lead wires 12 are positioned in the X direction and the Y direction with respect to the pedestal 40 at the portion near the front end.
Fig. 5 and 6 are external views of the guide member 50, and fig. 7 is a cross-sectional view of the guide member 50 taken along a plane perpendicular to the Y direction. In the following description of the guide member 50, the surface facing the positive direction in the X direction in fig. 5 to 7 is referred to as the front surface of the guide member 50, and the surface facing the negative direction in the X direction is referred to as the back surface of the guide member 50.
The guide member 50 includes a columnar head 51 extending in the Y direction, a flat plate-like base 52 extending downward from a front end portion (one end portion in the X direction) of the head 51, and a pair of parallel side walls 53 erected on both end portions in the width direction (Y direction) of the head 51 and the base 52. A side wall 53 is formed from the front surface of the base 52 to the upper surface of the head 51. The head 51 and the base 52 are interposed between the lead wires 12 and the core 20, respectively, to reliably insulate them. The head 51, the base 52, and the pair of side walls 53 form a groove 55 (guide groove) as a square groove extending in the Z direction. The side wall 53 extends forward from the front end of the base 52. A portion of the side wall 53 extending forward from the front end of the base 52 is referred to as an extension 531. A flat plate-shaped pressing portion 54 to which the pair of extending portions 531 are connected is formed at a lower portion of the guide member 50.
At a front end 532 of extension 531 of side wall 53, rear end surface 532a of side wall 53 is retreated to the front side, and step 533 is formed. Further, on both side surfaces of the distal end portion 532 of the extension portion 531, inclined surfaces 532b are formed so that the width of the guide member 50 (the distance between both ends in the Y direction) becomes gradually narrower toward the rear surface. Pressing portion 54 has a pair of side walls 53 connected to a distal end 532 of extension 531. The distal end portions 532 of the pair of side walls 53 and the pressing portion 54 constitute an engaging portion 50f (second engaging portion) of the guide member 50.
If the fitting portion 50f of the guide member 50 is fitted to the fitting portion 40f of the base 40, the lower portion of the guide member 50 (i.e., the distal end portions 532 of the pair of side walls 53 and the pressing portion 54 constituting the fitting portion 50 f) is accommodated in the square groove 46 of the fitting portion 40f of the base 40. By providing the step 533 at the front end portion 532 of the side wall 53, interference of the back plate 451 of the projection 45 of the pedestal 40 and the guide member 50 is avoided.
As shown in fig. 7, the outer peripheral surface of the head portion 51 of the guide member 50 includes a linear portion 51a, a curved portion 51b, a linear portion 51c, a curved portion 51d, and a linear portion 51 e. The linear portions 51a, 51c, and 51e are flat surfaces, and the curved portions 51b and 51d are cylindrical surfaces. The linear portion 51a, the curved portion 51b, the linear portion 51c, the curved portion 51d, and the linear portion 51e are smoothly connected in this order (i.e., continuously connected in curvature). The linear portion 51e is a lower surface 51e of the head portion 51. The lower surface 51e of the head 51 is perpendicularly connected to the back surface 52b of the base 52, and a corner portion 50C is formed by the lower surface 51e of the head 51 and the back surface 52b of the base 52 (fig. 8C). A corner portion 20d formed by the upper surface and the outer side surface of the yoke portion 20c (wall portion) of the core 20 is accommodated in the corner portion 50 c.
The end surface of the side wall 53 of the guide member 50 has a linear portion 53a, a curved portion 53b, a linear portion 53c, a curved portion 53d, and a linear portion 53e formed on the outer periphery of the head portion 51. The linear portions 53a, 53c, and 53e are flat surfaces, and the curved portions 53b and 53d are cylindrical surfaces. The linear portion 53a, the curved portion 53b, the linear portion 53c, the curved portion 53d, and the linear portion 53e are smoothly connected in this order. As shown in fig. 7, the curved portion 51d of the head 51 and the curved portion 53d of the side wall 53 are smoothly connected in projection onto a plane perpendicular to the Y direction. Therefore, the head 51 (or the side wall 53 formed on the outer periphery of the head 51) can be pressed against the upper surface of the core 20, and the guide member 50 can be smoothly rotated and slid around the axis (Y axis) parallel to the Y direction passing through the head 51.
Fig. 8A to 8C are diagrams for explaining a step of mounting the guide member 50. As shown in fig. 8, after the element portion 1a is assembled, the lead wire 12 of the coil 10 extends straight upward from the end of the spiral portion 11.
In the step of attaching the guide member 50, first, the head 51 of the guide member 50 shown in fig. 7 is directed downward, and the tip of the lead wire 12 is fitted into the linear portion 55a of the groove 55. If the guide member 50 is lowered in a state where the lead wires 12 are fitted into the grooves 55, the lead wires 12 are passed between the base 52 and the pressing portions 54. Then, the guide member 50 is lowered, and the linear portion 53a of the head portion 51 of the guide member 50 touches the upper surface of the core 20.
Next, as shown in fig. 8B to 8C, if the head 51 of the guide member 50 (or the side wall 53 formed on the outer periphery of the head 51) is brought into contact with the upper surface of the core 20 while the guide member 50 is rotated about the Y axis about the head 51, the lead wire 12 is pressed in the rotation direction of the guide member 50 (i.e., the circumferential direction of the circle about the rotation axis) by the pressing portion 54, and the lead wire 12 rotates together with the guide member 50.
As shown in fig. 8A to 8C, the guide member 50 is rotated by 180 ° in a state where the head 51 is in contact with the upper surface of the core 20. At this time, the lead wire 12 is bent in a U shape along the outer peripheral surface (the linear portion 51a, the curved portion 51b, the linear portion 51c, and the curved portion 51d) of the head portion 51 of the guide member 50.
When the guide member 50 rotates, the surface that contacts the upper surface of the core 20 is sequentially switched from the linear portion 53c of the side wall 53 to the curved portion 53d, the linear portion 53e, the curved portion 51d of the head 51, and then the linear portion 51e, as shown in fig. 7. Since the linear portion 53c, the curved portion 53d, the linear portion 53e, the curved portion 51d, and the linear portion 51e are smoothly connected in projection onto a plane perpendicular to the Y direction, the guide member 50 can be smoothly rotated (rolled or rotationally slid) on the core 20. That is, the linear portion 53c, the curved portion 53d, the linear portion 53e, the curved portion 51d, and the linear portion 51e constitute a rotational guide surface which is a curved surface for guiding the rotation of the guide member 50.
Further, the fitting portion 50f of the guide member 50 is fitted into the fitting portion 40f of the pedestal 40 from the front (i.e., from the X direction) (fig. 4). At this time, the fitting portion 50f of the guide member 50 is guided to the square groove 46 of the fitting portion 40f of the base 40 by the pair of inclined surfaces 532 b. If the fitting portion 50f of the guide member 50 is completely accommodated in the square groove 46 of the base 40, the pair of claws 49 formed at the fitting portion 40f of the base 40 (specifically, the edge of the square groove 46) prevents the fitting portion 50f from coming out of the square groove 46. The leading end portions of the lead wires 12 protruding from the lower end of the guide member 50 are guided to the square grooves 48 by the pair of guide slopes 47b formed in the fitting portion 40f of the base 40.
If the fitting portion 50f of the guide member 50 is fitted to the fitting portion 40f of the base 40, the guide member 50 is disposed such that the back surface 52b of the base 52 is in contact with (or closely opposed to) the side surface of the core 20 and the lower surface 51e of the head 51 is in contact with (or closely opposed to) the side surface of the core 20.
Since the fitting portion 50f of the guide member 50 is fitted to the fitting portion 40f of the base 40, the leading end portions of the lead wires 12 held by the guide member 50 are positioned with respect to the base 40 in the X-axis and Y-directions and fixed to the base 40.
The base 52 and the pressing portion 54 of the guide member 50 are arranged at a predetermined distance d in the Z direction, which is the direction in which the lead wires 12 held by the guide member 50 extend. The distance between base 52 and pressing portion 54 in the X direction is substantially equal to the thickness of lead wire 12. Therefore, for example, if base 52 and pressing portion 54 are not provided with a space (or in a manner of being partially overlapped) in the Z direction, the gap becomes smaller when lead wires 12 are passed between base 52 and pressing portion 54, and therefore, it is difficult to pass lead wires 12. In the present embodiment, base 52 and pressing portion 54 are disposed at predetermined interval d, and therefore lead wire 12 is easily inserted between base 52 and pressing portion 54. Further, since the space for passing the lead wire 12 in the Z direction is enlarged, not in the X direction for positioning, the lead wire 12 can be easily passed without lowering the positioning accuracy.
As shown in fig. 2, the leading ends of the lead wires 12 protrude from the lower surface of the base 40. The leading end portion of the lead wire 12 is inserted into and soldered to a through hole formed at a corresponding position on the circuit board when the reactor 1 is mounted on the circuit board.
A counterbore (enlarged hole, countersunk hole) 412 is formed in the lower surface of the base 40 around the tip end of the lead wire 12. The spot facing 412 of the present embodiment is formed by the lower end of the square groove 46 and the lower surfaces of the pair of projections 47. By providing the spot facing 412, the distance between the position where the lead wire 12 is fixed to the circuit board and the position where the lead wire 12 is fixed to the base 40 becomes longer, and therefore, the force applied to the lead wire 12 due to the displacement between the through hole and the fitting portion 40f is alleviated.
In the reactor 1 of the present embodiment, the guide member 50 is provided, so that the lead wire 12 can be easily bent. Further, by wiring the lead wires 12 using the guide member 50, the lead wires 12 are pulled and bent outward in the X direction indicated by the arrow P in fig. 8C, so that a space can be provided between the spiral portion 11 of the coil 10 and the lead wires 12. This prevents the lead wire 12 from rubbing against the spiral portion 11, which may cause poor insulation.
Further, by providing the base 52 having a predetermined thickness between the lead wire 12 after being bent and the core 20, the lead wire 12 is pulled in the direction of the arrow P (fig. 8C) by the thickness of the base 52 when the lead wire 12 is bent. This allows the lead wire 12 to be fixed in a state in which the lead wire is pulled out, and therefore, a space can be provided more reliably between the spiral portion 11 of the coil 10 and the lead wire 12. The above is a description of the embodiments of the present invention, but the present invention is not limited to the configurations of the above embodiments, and various modifications are possible. For example, a configuration in which at least a part of the technical configuration of one or more embodiments described in the specification and a known technical configuration are appropriately combined is included in the scope of the present invention.
In the above embodiment, the groove 55 of the guide member 50 is a square groove, but the present invention is not limited to this configuration, and the cross-sectional shape of the groove 55 is determined in accordance with the cross-sectional shape of the lead wire 12 to be accommodated. For example, when a round wire is used as the lead wire 12, the groove 55 having an arc-shaped or U-shaped cross section is formed.
In the above embodiment, the rotation guide surfaces are provided on both sides of the groove 55, but the rotation guide surfaces may be provided only on one side of the groove 55.
In the above embodiment, the insulating sheets 31 and 32 are used to ensure insulation between the coil 10 and the core 20, but when the coil 10 or the core 20 is sufficiently insulated and covered, the insulating sheets 31 and 32 may not be used.
The O-core 21 of the above embodiment is constituted by a plurality of O-core units 211, but the O-core 21 may be constituted by a single member. The I-core 22 may be configured by, for example, connecting a plurality of I-core units in the longitudinal direction.
The core 20 of the above embodiment is a combination of the O-core 21 and the I-core 22, but other types of cores such as an EI-core in which an E-core and an I-core are combined, an EE-core in which two E-cores are combined, an EER core or a PQ core which is a modification of the EE-core, or a pot-shaped core (for example, a PP-shaped core, an RM-shaped core, or an EP-shaped core) may be used. Further, the O-core 21 may be formed by combining two U-cores.
The core 20 of the above embodiment is a dust core, but other types of cores (for example, a laminated steel plate, a ferrite core, a nanocrystal core, a metal composite core formed of a resin containing magnetic particles, or the like) may be used.
The above-described embodiment is an example in which the present invention is applied to a reactor, but the present invention is not limited to the reactor, and can be applied to other types of coil devices such as a transformer and a choke coil.
Description of the symbols
1 reactor
10 coil
20 core
40 pedestal
50 guide the components.
Claims (14)
1. A coil device is provided with:
an element unit including a core and a coil;
a guide member that guides lead-out wires of the coil;
a base disposed on a circuit board, the base positioning the element portion and the guide member with respect to the circuit board,
the guide member includes a columnar head portion disposed on the core and extending in a Y direction perpendicular to a Z direction which is a vertical direction of the circuit board,
the head portion has an outer peripheral portion formed with:
a guide groove extending in a circumferential direction of the head portion and guiding the lead wire;
a rotary guide surface as a curved surface extending in a circumferential direction of the head portion, guiding rolling or rotational sliding of the guide member on the core,
the guide member includes a pressing portion that presses the lead wire from a side opposite to the guide groove so that the lead wire does not come off from the guide groove.
2. The coil apparatus according to claim 1,
the guide member includes a base extending in the Z direction toward the circuit board from one end portion of the head portion in an X direction perpendicular to the Y direction and the Z direction,
the base is disposed with the back surface facing the core,
the guide groove extends over the entire length of the front surface of the base in the Z direction.
3. The coil apparatus according to claim 2,
the pair of side walls of the guide groove are respectively provided with an extension part extending forward from the front end of the base,
the pair of extension portions are connected to each other via the pressing portion,
the base and the pressing portion are disposed at a predetermined interval in the Z direction.
4. The coil apparatus according to claim 2,
the core has a wall portion standing on the circuit board via the pedestal and extending in the Y direction,
the main body portion of the coil is disposed on the back side of the wall portion,
the head portion of the guide member is disposed on the wall portion,
the lead wire is bent in a U shape along the guide groove formed in the head portion of the guide member, and a tip portion of the lead wire is arranged on a front surface side of the wall portion.
5. The coil apparatus according to claim 4,
the lower surface of the head and the back surface of the base are mutually perpendicular planes,
a corner portion formed by an upper surface and an outer side surface of the wall portion of the core is accommodated at a corner portion formed by a lower surface of the head portion and a plane of the base.
6. The coil apparatus according to claim 1,
the pedestal is provided with:
a pedestal positioning unit that positions the pedestal with respect to the circuit substrate;
an element portion positioning unit that positions the element portion with respect to the pedestal;
a first fitting portion that is fitted to the guide member,
the guide member is provided with a second fitting portion,
the second fitting portion is fitted to the first fitting portion, and positions the guide member with respect to the base.
7. The coil apparatus according to claim 6,
the second fitting portion is a front end portion of the guide member,
the first fitting portion has a first fitting groove into which a tip end portion of the guide member is fitted.
8. The coil apparatus according to claim 7,
slopes are formed on both side surfaces of the front end portion of the guide member so that the width thereof gradually decreases toward the rear surface.
9. The coil apparatus according to claim 7,
a projection for preventing the second fitting portion from coming out of the first fitting groove is formed at an edge of the first fitting groove.
10. The coil apparatus according to claim 7,
a second fitting groove into which the lead wire is fitted is formed in the first fitting portion.
11. The coil apparatus according to claim 10,
the first fitting portion has a pair of opposing protruding portions protruding from both side surfaces of the first fitting groove,
the second fitting groove is formed by the tip end surfaces of the pair of protruding portions and the bottom surface of the first fitting groove.
12. The coil apparatus of claim 11,
an upper surface of the projection is in contact with a leading end of the guide member, positioning the guide member in the Z direction.
13. The coil device of claim 6, wherein
The pedestal positioning unit includes a concave portion,
the recess portion is fitted to the core, and positions the element portion with respect to the pedestal.
14. The coil apparatus according to claim 1,
an opening is formed in the bottom of the base to pass through the coil.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110295427.9A CN115116714A (en) | 2021-03-19 | 2021-03-19 | Coil device |
JP2022028742A JP2022145557A (en) | 2021-03-19 | 2022-02-26 | Coil device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110295427.9A CN115116714A (en) | 2021-03-19 | 2021-03-19 | Coil device |
Publications (1)
Publication Number | Publication Date |
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CN115116714A true CN115116714A (en) | 2022-09-27 |
Family
ID=83322913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110295427.9A Pending CN115116714A (en) | 2021-03-19 | 2021-03-19 | Coil device |
Country Status (2)
Country | Link |
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JP (1) | JP2022145557A (en) |
CN (1) | CN115116714A (en) |
-
2021
- 2021-03-19 CN CN202110295427.9A patent/CN115116714A/en active Pending
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2022
- 2022-02-26 JP JP2022028742A patent/JP2022145557A/en active Pending
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JP2022145557A (en) | 2022-10-04 |
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