CN115113419A - Optical modulator packaging shell and preparation method thereof - Google Patents
Optical modulator packaging shell and preparation method thereof Download PDFInfo
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- CN115113419A CN115113419A CN202210373471.1A CN202210373471A CN115113419A CN 115113419 A CN115113419 A CN 115113419A CN 202210373471 A CN202210373471 A CN 202210373471A CN 115113419 A CN115113419 A CN 115113419A
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- solder
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- shell
- mounting hole
- frequency assembly
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/0102—Constructional details, not otherwise provided for in this subclass
- G02F1/0107—Gaskets, spacers or sealing of cells; Filling and closing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an optical modulator packaging shell and a preparation method thereof, wherein the optical modulator packaging shell comprises a shell, wherein a high-frequency assembly mounting hole is horizontally formed in the shell for inserting and positioning a high-frequency assembly, an air hole is formed in the shell for communicating the high-frequency assembly mounting hole with a step cavity of the shell, one end of a lead of the high-frequency assembly extends into the step cavity of the shell through the air hole, and the other end of the lead extends out of the high-frequency assembly mounting hole; and the shell is provided with a solder hole which is positioned above the high-frequency assembly mounting hole and is communicated with the high-frequency assembly mounting hole along the vertical direction so as to load solder, and the bottom of the high-frequency assembly mounting hole is provided with a solder storage groove along the vertical direction so as to allow the solder to flow downwards and be stored. The invention solves the problem that the high-frequency component in the miniaturized packaging tube shell is not easy to weld, and the high-frequency component can be observed whether to be filled with the welding flux fully through the welding flux hole during the brazing so as to optimize the parameters such as the welding flux amount, the welding temperature and the like, thereby obtaining the high-frequency welding structure with higher reliability.
Description
Technical Field
The invention relates to the field of photoelectricity, in particular to an optical modulator packaging shell and a preparation method thereof.
Background
The optical modulator is a key device of high-speed optical communication, is one of the most important integrated optical devices, and mainly comprises an optical fiber, a ceramic plate, a modulation chip, a thin film resistor and a packaging tube shell, wherein the packaging tube shell mainly plays a role in mechanical support, internal and external electrical connection and airtight protection of internal electronic components, particularly chips, so that the airtightness and reliability of the packaging tube shell can directly influence the service life of the modulator. Because the electric connection of the packaging tube shell to the internal chip is mainly realized through the low-frequency pins and the high-frequency component which are sealed on the tube shell in advance, the packaging airtightness of the pins and the high-frequency component has a vital influence on the airtightness and reliability of the tube shell.
At present, a low-frequency pin is directly sealed on a tube shell through a glass insulator or is firstly sealed on a metal component through the glass insulator and then the metal component is brazed on the tube shell, and a high-frequency component is usually directly welded in a component hole corresponding to the tube shell by adopting a gold-tin solder. At present mainstream high frequency assembly's welding method can satisfy the demand that is mostly modulator encapsulation tube shell, but if need prepare miniaturized encapsulation tube shell, because encapsulation tube undersize, the conch wall is extremely thin, receive the structure size restriction, can't adopt conventional mode to weld, and adopt traditional welding method can't direct observation to the inside welded condition of high frequency assembly, must detect the filling state of solder through means such as X ray irradiation is shot, waste time and energy, consequently, wait to solve urgently.
Disclosure of Invention
In order to avoid and overcome the technical problems in the prior art, the invention provides the optical modulator packaging shell, which solves the problems that a high-frequency component of a miniaturized packaging tube shell is difficult to weld and the internal welding state is difficult to directly observe during welding; the invention also provides a method for preparing the optical modulator packaging shell.
In order to achieve the purpose, the invention provides the following technical scheme:
a light modulator packaging shell and a preparation method thereof comprise a shell, wherein a high-frequency assembly mounting hole is horizontally formed in the shell for inserting and positioning a high-frequency assembly, an air hole is formed in the shell for communicating the high-frequency assembly mounting hole with a step cavity of the shell, one end of a lead of the high-frequency assembly extends into the step cavity of the shell through the air hole, and the other end of the lead extends out of the high-frequency assembly mounting hole;
and the shell is provided with a solder hole which is positioned above the high-frequency assembly mounting hole and is communicated with the high-frequency assembly mounting hole along the vertical direction so as to load solder, and the bottom of the high-frequency assembly mounting hole is provided with a solder storage groove along the vertical direction so as to allow the solder to flow downwards and be stored.
As a further scheme of the invention: the solder hole is a two-section stepped columnar hole with a wide upper part and a narrow lower part, the solder positioning piece is in plug fit with the large-aperture section of the solder hole, the bottom of the solder positioning piece is provided with a solder groove with a diameter matched with that of the small-aperture section of the solder hole for the solder to be loaded, and the solder positioning piece is provided with a vent hole communicated with the solder groove.
As a still further scheme of the invention: the solder positioning piece is convexly provided with a positioning boss along the circumferential direction, and the positioning boss is abutted against the shell to position the depth of the solder positioning piece inserted into the solder hole.
As a still further scheme of the invention: the vent holes are axially arranged along the solder positioning piece, and the hole walls of the vent holes are plated with gold.
As a still further scheme of the invention: and one side of the shell, which is far away from the step cavity, is horizontally provided with a positioning hole which is coaxial with the high-frequency assembly mounting hole and has a diameter larger than that of the high-frequency assembly mounting hole, and the high-frequency assembly mounting hole is positioned between the positioning hole and the step cavity and is communicated with the positioning hole.
As a still further scheme of the invention: the shell is made of SS304L stainless steel materials, and the solder is Au80Sn20 eutectic solder.
As a still further scheme of the invention: and guide pipes communicated with the step cavities are reserved at two ends of the shell.
As a still further scheme of the invention: the high-frequency assembly comprises an assembly ring, a glass insulator and a lead, wherein the assembly ring and the lead are made of Kovar 4J29, and the glass insulator is made of Corning 7070.
A method of making a light modulator package comprising the steps of:
s1, processing and molding the shell according to a preset shape, and integrally plating nickel and gold;
s2, processing the hole wall of the small-aperture section of the solder hole to remove the plating layer;
s3, installing the high-frequency assembly in the high-frequency assembly mounting hole, and arranging a positioning die in the positioning hole so as to compress the high-frequency assembly, so that the high-frequency assembly is tightly attached to the high-frequency assembly mounting hole;
s4, solder is filled in the solder groove, and the solder positioning piece is inserted into the solder hole to ensure that the positioning boss is tightly attached to the shell;
s5, placing the assembled shell, the high-frequency assembly and the solder positioning piece into a brazing furnace with preset furnace temperature for brazing, preserving heat at 300-350 ℃ for 20 +/-5 min, taking out the shell after cooling, and removing the solder positioning piece to obtain a finished product.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention solves the problem that the high-frequency component in the miniaturized packaging tube shell is not easy to weld, the welding flux is melted and flows to fill the high-frequency component mounting hole and the gap of the high-frequency component to form a welding joint so as to complete welding, and whether the high-frequency component is fully filled by the welding flux can be observed through the welding flux hole during the welding, so that the parameters of the welding flux, the welding temperature and the like can be optimized, and the high-frequency welding structure with higher reliability can be obtained.
2. The solder hole is designed into a two-section stepped columnar hole, a solder positioning piece can be independently designed to be inserted into the solder hole, a plurality of soldering lugs can be simultaneously arranged in the solder positioning piece for welding, the welding is stable, and the solder positioning piece cannot shake; because the solder positioning piece only has the vent holes for gold plating and no plating layer is arranged at all other positions, the gold-tin solder can be ensured to flow into gaps between the high-frequency assembly mounting hole and the high-frequency assembly under the influence of gravity at high temperature to form a soldered joint without wetting with the inner wall of the solder positioning piece, the soldering firmness is ensured to the maximum extent, and the vent holes plated with gold on the inner wall can adsorb the gold-tin solder which is splashed out while the water vapor of the solder is enabled to escape, so that the poor splashing of the solder on the shell is improved.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of another view angle of the present invention.
FIG. 3 is a detailed view of the high frequency components of the present invention.
Fig. 4 is a schematic structural view of the structure shown in fig. 3 after the solder positioning element and the solder are added.
Fig. 5 is a schematic structural diagram of a solder positioning member according to the present invention.
Fig. 6 is a cross-sectional view of a solder positioning member in accordance with the present invention.
In the figure:
1. a housing; 11. positioning holes; 12. a conduit; 13. a step cavity; 14. a solder hole;
15. a solder retention groove; 16. an air hole; 17. a high frequency component mounting hole;
2. a high frequency component; 21. a lead;
3. a solder positioning member; 31. positioning the boss; 32. a vent hole; 33. a solder bath;
4. welding flux;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, in an embodiment of the invention, an optical modulator package housing and a manufacturing method thereof include a housing 1, where a step cavity 13 is formed on a surface of the housing 1 from top to bottom for placing and mounting other electronic components. Two positioning holes 11 are horizontally formed in the side wall of the shell 1 and used for placing a graphite mold to compress the high-frequency assembly 2. The hole bottom of the positioning hole 11 is provided with a high-frequency component mounting hole 17 extending towards the step cavity 13 along the horizontal direction, so that the high-frequency component 2 is placed in, and the shape of the high-frequency component mounting hole 17 is matched with that of the high-frequency component 2. The bottom of the high-frequency component mounting hole 17 is provided with a solder storage groove 15 in the vertical direction, so that the solder 4 flows downward and is stored.
An air hole 16 is formed horizontally in the housing 1 so as to communicate the stepped chamber 13 with a high-frequency component mounting hole 17. Wherein the inner lead of the high frequency assembly 2 passes through the air hole 16 to reach the step cavity 13, and the outer lead of the high frequency assembly 2 extends into the positioning hole 11. The diameter of the air hole is 0.2-0.3 mm, and the length of the air hole is 0.5-1.0 mm. There is a thin wall between the high-frequency component 2 and the stepped cavity 13.
The surface of the shell 1 is provided with a solder hole 14 along the vertical direction, the solder hole 14 is a two-section stepped columnar hole with a wide upper part and a narrow lower part, and the diameter of a small aperture section of the solder hole 14 is 0.8-1 mm. The diameter of the large aperture section of the solder hole 14 is 0.2-0.4 mm larger than that of the small aperture section, the depth is 0.1-0.3 mm, and the large aperture section is processed by a milling cutter.
The solder positioning member 3 carries the solder 4 and inserts into the solder hole 14 to start the soldering process. The solder positioning piece 3 is a cylindrical body, a positioning boss 31 is convexly arranged on the surface of the cylindrical body along the circumferential direction, and the depth of the solder positioning piece 3 inserted into the solder hole 14 can be positioned when the positioning boss 31 is abutted against the shell 1.
The bottom of the solder positioning piece 3 is provided with a solder groove 33 matched with the diameter of the small aperture section of the solder hole 14 for the solder 4 to be loaded, and the solder positioning piece 3 is vertically provided with a vent hole 32 along the axis thereof, so that the solder groove 33 is communicated with the outside air. The height of the solder groove 33 is 1.2-1.6 mm, so that a plurality of solder 4 can be placed, and the hole walls of the vent holes 32 are plated with gold.
The solder spacer 3 is made of the same material as the case 1 so as to maintain the same thermal expansion coefficient, and is preferably made of a SS304L stainless steel material, and the solder 4 is Au80Sn20 eutectic solder.
The outer diameter of the solder positioning piece 3 is 0.02-0.04 mm smaller than the large aperture section of the solder hole 14, so that the solder positioning piece 3 can be well matched with the large aperture section of the solder hole 14, and the solder positioning piece 3 can be well detached after high-temperature brazing. The height of the solder positioning piece 3 is consistent with or smaller than 0.02-0.04 mm than the depth of the large-aperture section of the solder hole 14, so that the positioning boss 31 can be attached to the housing 1 to ensure the stability of the solder positioning piece 3.
The high frequency module 2 is a commercially available component, and therefore, not described in detail, is composed of a module ring, a glass insulator and a lead 21, wherein the module ring and the lead 21 are made of kovar 4J29, and the glass insulator is made of corning 7070.
The method for preparing the optical modulator packaging shell comprises the following steps:
s1, processing and molding the shell 1 according to a preset shape, and integrally plating nickel and gold;
the whole process comprises the steps of firstly removing oil from the shell 1, activating, electroplating nickel and electroplating gold, wherein the electroplating nickel is 3-11 um, and the electroplating gold is 1-3 um;
s2, processing the hole wall of the small-hole diameter section of the solder hole 14 to remove a plating layer;
s3, installing the high-frequency assembly 2 in the high-frequency assembly mounting hole 17, and arranging a positioning die in the positioning hole 11 so as to tightly press the high-frequency assembly 2, so that the high-frequency assembly 2 is tightly attached to the high-frequency assembly mounting hole 17;
the positioning mould is a graphite mould, the shape is not limited, and the high-frequency component 2 is tightly propped from the outer side.
S4, solder 4 is filled in the solder groove 33, and the solder positioning piece 3 is overturned to be inserted into the solder hole 14, so that the positioning boss 31 is ensured to be tightly attached to the shell 1;
s5, placing the assembled shell 1, the high-frequency assembly 2 and the solder positioning piece 3 into a brazing furnace with preset furnace temperature for brazing, enabling the solder to flow under capillary force during brazing to finish welding, keeping the temperature at 300-350 ℃ for 20 +/-5 min after the welding is finished, taking out the shell 1 after cooling, and removing the solder positioning piece 3 to obtain a finished product.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably herein. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.
Claims (9)
1. The optical modulator packaging shell is characterized by comprising a shell (1), wherein a high-frequency assembly mounting hole (17) is horizontally formed in the shell (1) to enable a high-frequency assembly (2) to be inserted and positioned, an air hole (16) is formed in the shell (1) to communicate the high-frequency assembly mounting hole (17) with a step cavity (13) of the shell (1), one end of a lead (21) of the high-frequency assembly (2) extends into the step cavity (13) of the shell (1) through the air hole (16), and the other end of the lead extends out of the high-frequency assembly mounting hole (17);
and a solder hole (14) which is positioned above the high-frequency component mounting hole (17) and is communicated with the high-frequency component mounting hole (17) is formed in the shell (1) along the vertical direction so as to load the solder (4), and a solder storage groove (15) is formed in the hole bottom of the high-frequency component mounting hole (17) along the vertical direction so as to allow the solder (4) to flow downwards and be stored.
2. An optical modulator package housing according to claim 1, wherein the solder hole (14) is a two-step stepped cylindrical hole with a wide top and a narrow bottom, the solder positioning member (3) is inserted into and fitted with the large aperture section of the solder hole (14), a solder groove (33) matching with the small aperture section of the solder hole (14) is formed at the bottom of the solder positioning member (3) for accommodating the solder (4), and the solder positioning member (3) is provided with a vent hole (32) communicating with the solder groove (33).
3. A light modulator package housing according to claim 2, wherein the solder positioning member (3) is provided with a positioning boss (31) protruding along a circumferential direction, and the positioning boss (31) abuts against the housing (1) to position a depth of the solder positioning member (3) inserted into the solder hole (14).
4. A light modulator package housing according to claim 2, wherein the vent holes (32) are arranged axially along the solder positioning member (3), and the wall of the vent holes (32) are gold plated.
5. The optical modulator package of claim 1, wherein a side of the housing (1) away from the step cavity (13) is horizontally provided with a positioning hole (11) coaxial with the high-frequency component mounting hole (17) and having a diameter larger than that of the high-frequency component mounting hole (17), and the high-frequency component mounting hole (17) is located between the positioning hole (11) and the step cavity (13) and is communicated with the positioning hole (11).
6. A light modulator package according to claim 1, wherein the housing (1) is of SS304L stainless steel material and the solder (4) is of Au80Sn20 eutectic solder.
7. A light modulator package according to claim 1, characterized in that the two ends of the housing (1) are reserved with conduits (12) communicating with the stepped cavity (13).
8. A light modulator package according to claim 1, wherein the high frequency device (2) comprises a device ring, a glass insulator and a lead (21), wherein the device ring and the lead (21) are made of kovar 4J29, and the glass insulator is made of corning 7070.
9. A method of making a light modulator package of any of claims 1 to 7, comprising the steps of:
s1, processing and molding the shell (1) according to a preset shape, and integrally plating nickel and gold;
s2, processing and deplating the hole wall of the small-hole section of the solder hole (14);
s3, installing the high-frequency assembly (2) in the high-frequency assembly mounting hole (17), and arranging a positioning die in the positioning hole (11) so as to compress the high-frequency assembly (2), so that the high-frequency assembly (2) is tightly attached to the high-frequency assembly mounting hole (17);
s4, solder (4) is filled in the solder groove (33), and the solder positioning piece (3) is inserted into the solder hole (14) to ensure that the positioning boss (31) is tightly attached to the shell (1);
s5, placing the assembled shell (1), the high-frequency assembly (2) and the solder positioning piece (3) into a brazing furnace with a preset furnace temperature for brazing, preserving the heat at 300-350 ℃ for 20 +/-5 min, taking out the shell (1) after cooling, and removing the solder positioning piece (3) to obtain a finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210373471.1A CN115113419A (en) | 2022-04-11 | 2022-04-11 | Optical modulator packaging shell and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210373471.1A CN115113419A (en) | 2022-04-11 | 2022-04-11 | Optical modulator packaging shell and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115113419A true CN115113419A (en) | 2022-09-27 |
Family
ID=83324694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210373471.1A Pending CN115113419A (en) | 2022-04-11 | 2022-04-11 | Optical modulator packaging shell and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115113419A (en) |
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2022
- 2022-04-11 CN CN202210373471.1A patent/CN115113419A/en active Pending
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