CN115107104A - PCB cooling and drilling system - Google Patents
PCB cooling and drilling system Download PDFInfo
- Publication number
- CN115107104A CN115107104A CN202210911890.6A CN202210911890A CN115107104A CN 115107104 A CN115107104 A CN 115107104A CN 202210911890 A CN202210911890 A CN 202210911890A CN 115107104 A CN115107104 A CN 115107104A
- Authority
- CN
- China
- Prior art keywords
- drilling
- cooling
- pcb
- refrigeration
- drilling system
- Prior art date
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Links
- 238000005553 drilling Methods 0.000 title claims abstract description 122
- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 238000005057 refrigeration Methods 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000000428 dust Substances 0.000 claims description 14
- 238000009833 condensation Methods 0.000 claims description 9
- 239000003507 refrigerant Substances 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000009713 electroplating Methods 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 230000005494 condensation Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000002023 wood Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of PCB processing, and discloses a PCB cooling and drilling system, which comprises: the drilling equipment is used for drilling holes in the PCB, a drilling platform used for supporting the PCB to be drilled is arranged on the drilling equipment, and a cooling groove is formed in the drilling platform; the refrigeration equipment comprises a refrigeration assembly and an evaporator, wherein the refrigeration assembly is connected with the evaporator and provides a cooled refrigeration medium for the evaporator, the evaporator comprises a heat-conducting metal pipe, the heat-conducting metal pipe is arranged in the cooling groove, and the refrigeration medium circulates between the refrigeration assembly and the evaporator and flows through the heat-conducting metal pipe. The PCB cooling and drilling system provided by the invention can maintain the drilling operation area in a lower temperature state so as to reduce the temperature of the PCB to be drilled and the drill bit, thereby reducing the drilling fouling amount generated by softening and melting the resin and ensuring the electroplating quality after drilling.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a PCB cooling and drilling system.
Background
In the manufacturing process of the printed circuit board, the multi-layer board needs to realize the electric signal conduction of any layer through the processes of mechanical drilling, whole board electroplating and the like. However, in the mechanical drilling process, the drill bit and the plate (containing epoxy resin) rub at a high speed, so that the local temperature rises to exceed the Tg value (glass transition temperature) of the resin, the resin is softened and melted into paste to be coated on the hole wall, glue residue is formed after cooling, if the hole wall is not cleaned up before the whole plate is electroplated, the electric signal conduction of copper plating on the hole wall and inner layer copper is blocked after the whole plate is electroplated, and the open circuit abnormality is seriously caused.
Therefore, a PCB cooling drilling system is needed to solve the above technical problems.
Disclosure of Invention
Based on the above, the present invention is directed to a PCB cooling and drilling system, which can maintain a drilling operation area at a low temperature to lower the temperature of a PCB to be drilled and a drill, thereby reducing the amount of drilling dirt generated by softening and melting resin and ensuring the plating quality after drilling.
In order to achieve the purpose, the invention adopts the following technical scheme:
there is provided a PCB cooling drilling system comprising:
the drilling equipment is used for drilling holes in the PCB, a drilling platform used for supporting the PCB to be drilled is arranged on the drilling equipment, and a cooling groove is formed in the drilling platform;
the refrigeration equipment comprises a refrigeration assembly and an evaporator, wherein the refrigeration assembly is connected with the evaporator and provides a cooled refrigeration medium for the evaporator, the evaporator comprises a heat-conducting metal pipe, the heat-conducting metal pipe is arranged in the cooling groove, and the refrigeration medium circulates between the refrigeration assembly and the evaporator and flows through the heat-conducting metal pipe.
As an optional technical scheme of the PCB cooling drilling system, the cooling grooves are uniformly laid in the area where the drilling platform is used for supporting the PCB, and the heat-conducting metal pipe penetrates through the cooling grooves.
As an optional technical solution of the PCB cooling drilling system, the cooling groove is reciprocally extended along a winding shape and disposed on the drilling platform, and the heat conducting metal pipe is correspondingly disposed in a winding structure.
As an optional technical solution of the PCB cooling drilling system, the cooling grooves are distributed on the drilling platform along a convolution shape, and the heat conducting metal pipes are correspondingly arranged in a convolution shape structure.
As an optional technical scheme of PCB cooling drilling system, refrigeration subassembly includes compressor, condenser and throttling element, the compressor with the end intercommunication of giving vent to anger of evaporimeter, throttling element with the feed liquor end intercommunication of evaporimeter, the condenser with the compressor with throttling element intercommunication, the compressor is used for compressing gaseous refrigerant, the condenser is used for cooling the liquefaction with the refrigerant after compressing, throttling element is used for reducing after the liquefaction the pressure of refrigerant.
As an optional technical scheme of the PCB cooling drilling system, a drying filter is further arranged between the condenser and the throttling element and is used for filtering moisture, impurities and oxides in a refrigerating medium.
As an optional technical solution of the PCB cooling drilling system, a solenoid valve is disposed on a pipe between the condenser and the throttling element, and the solenoid valve is used for controlling a flow rate of the refrigerant flowing into the throttling element.
As an optional technical solution of the PCB cooling drilling system, the refrigeration equipment further includes a condensation preventing pipe, and the condensation preventing pipe is serially arranged in a pipeline between the condenser and the throttling element.
As an optional technical solution of the PCB cooling drilling system, the drilling apparatus further includes:
and the dust suction end of the dust suction device is arranged above the drilling platform and can suck dust generated by drilling from bottom to top and accelerate cold air to flow upwards.
As an optional technical solution of the PCB cooling drilling system, the depth of the cooling groove is set to 8mm to 12 mm; and/or
The width of the cooling groove is set to be 8mm to 12 mm.
The invention has the beneficial effects that:
the PCB cooling and drilling system comprises drilling equipment and refrigerating equipment, wherein a heat conducting metal pipe of an evaporator in the refrigerating equipment is arranged in a cooling groove of a drilling platform, when drilling operation is carried out, a PCB to be drilled is arranged on the drilling platform, a refrigerating assembly conveys a cooled refrigerating medium to the heat conducting metal pipe, and the refrigerating medium absorbs heat of the drilling platform and air above the drilling platform, so that the temperature of the drilling platform and the air above the drilling platform is reduced, a drilling operation area is maintained in a lower temperature state, the temperature of the PCB to be drilled and a drill bit is reduced, the drilling pollution amount generated by softening and melting of resin is reduced, and the electroplating quality after drilling is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a schematic layout view of a PCB cooling drilling system provided by the present invention;
FIG. 2 is a schematic structural view of a drilling platform and a heat conducting metal tube provided by the present invention;
fig. 3 is a schematic view of the operation state of the drilling equipment provided by the invention.
In the figure:
100. drilling equipment; 1. drilling a platform; 2. a drill bit; 3. a dust collection device; 4. a wood board; 5. a base plate; 11. cooling the groove; 201. a heat conductive metal tube; 202. a compressor; 203. a condenser; 204. a throttling element; 205. drying the filter; 206. an electromagnetic valve; 207. a condensation prevention pipe; 300. a PCB is provided.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
The present embodiment provides a PCB cooling and drilling system for drilling holes on the PCB300, and conducting the circuit layers of the PCB300 by plating copper on the hole walls.
As shown in fig. 1-3, the PCB cooling and drilling system includes a drilling device 100 and a refrigeration device, wherein the drilling device 100 is used for drilling a hole on a PCB300, the drilling device 100 is provided with a drilling platform 1 for supporting the PCB300 to be drilled, and the drilling platform 1 is provided with a cooling groove 11; the refrigeration equipment comprises a refrigeration assembly and an evaporator, the refrigeration assembly is connected with the evaporator and provides cooled refrigeration media for the evaporator, the evaporator comprises a heat conduction metal pipe 201, the heat conduction metal pipe 201 is arranged in the cooling groove 11, and the refrigeration media circulate between the refrigeration assembly and the evaporator and flow through the heat conduction metal pipe 201.
Specifically, the PCB cooling and drilling system provided by the embodiment includes the drilling device 100 and the refrigeration device, the heat conducting metal pipe 201 of the evaporator in the refrigeration device is arranged in the cooling groove 11 of the drilling platform 1, during the drilling operation, the PCB300 to be drilled is arranged on the drilling platform 1, the refrigeration component conveys the cooled refrigeration medium to the heat conducting metal pipe 201, and the refrigeration medium absorbs the heat of the air above the drilling platform 1, so that the temperature of the air above the drilling platform 1 is reduced, the drilling operation area is maintained in a lower temperature state, so as to reduce the temperature of the PCB300 to be drilled and the drill bit 2, thereby reducing the drilling pollution amount generated by softening and melting of the resin, and ensuring the electroplating quality after drilling. The cooling mode contrast of PCB cooling drilling system that this embodiment provided adopts lubricated coating drill bit 2, increases the jump bit distance, adds conventional reduction production of heat or increase the heat dissipation capacity measure such as cover aluminum sheet, and the cooling effect is better, ambient temperature is lower, and the cooling degree is more controllable.
Alternatively, the heat conductive metal pipe 201 is entirely buried or partially buried in the cooling groove 11.
Optionally, the cooling groove 11 is uniformly laid in the region of the drilling platform 1 for supporting the PCB300, and the heat conducting metal pipe 201 is disposed in the cooling groove 11 in a penetrating manner. The region of drilling platform 1 that is used for bearing PCB300 is not limited to under the drilling station, still includes the region of neighbouring drilling station, and cooling groove 11 tiles in drilling platform 1's above-mentioned region, can increase the refrigeration medium in the heat conduction tubular metal resonator 201 and outside heat transfer area, improves cooling efficiency.
Specifically, cooling groove 11 sets up in drilling platform 1 along circuitous form reciprocating extension, and heat conduction tubular metal resonator 201 corresponds and sets up to circuitous column structure, and the both ends of cooling groove 11 extend to drilling platform 1's edge respectively to be equipped with inlet and gas vent respectively, the refrigeration medium flows in from the one end that heat conduction tubular metal resonator 201 corresponds the inlet, and flows out from the one end that heat conduction tubular metal resonator 201 corresponds the gas vent.
In other embodiments, the cooling grooves 11 may also be distributed along the circle on the drilling platform 1, and the heat conducting metal pipe 201 is correspondingly configured as a circle structure.
Optionally, the drilling equipment 100 further includes a dust suction device 3, a dust suction end of the dust suction device 3 is disposed above the drilling platform 1, and extends to the position of the drill bit 2 through a dust suction pipe, so as to suck dust generated by drilling from bottom to top and accelerate cold air to flow upwards. On one hand, debris generated by drilling is quickly sucked away, so that the residue of solid waste is reduced; on the other hand, the dust suction device 3 sucks air upwards to drive the upper part of the drilling platform 1 to form an air circulation path of 'external air descends from the peripheral part of the drilling platform 1, cooled cold air gradually rises from the drilling platform 1', air which is in time sucked near the drill bit 2 to take away heat released in the drilling process, air which is just cooled on the surface of the drilling platform 1 is driven to flow upwards, the drilling area is maintained at a lower temperature, and the cooling effect is further improved.
Optionally, the refrigeration assembly includes a compressor 202, a condenser 203 and a throttling element 204, the compressor 202 is communicated with an air outlet end of the evaporator, the throttling element 204 is communicated with an air inlet end of the evaporator, the condenser 203 is communicated with the compressor 202 and the throttling element 204, the compressor 202 is used for compressing gaseous refrigeration medium, the condenser 203 is used for cooling and liquefying the compressed refrigeration medium, and the throttling element 204 is used for reducing the pressure of the liquefied refrigeration medium. The evaporator, the compressor 202, the condenser 203 and the throttling element 204 are all conventional components in the existing refrigeration equipment, and the specific structures of the components are not described in detail herein.
In the present embodiment, the throttling element 204 is a capillary tube.
Optionally, a dry filter 205 is further disposed between the condenser 203 and the throttling element 204, and the dry filter 205 is used for filtering out moisture, impurities and oxides in the refrigerant medium. The filter-drier 205 is a conventional component in the existing refrigeration equipment, and the specific structure thereof will not be described herein.
Preferably, a solenoid valve 206 is arranged on a pipeline between the condenser 203 and the throttling element 204, the solenoid valve 206 is particularly arranged on a pipeline between the throttling element 204 and the dry filter 205, and the solenoid valve 206 is used for controlling the flow rate of the refrigerating medium flowing into the throttling element 204.
Preferably, the refrigeration equipment further comprises a condensation preventing pipe 207, the condensation preventing pipe 207 is serially arranged in a pipeline between the condenser 203 and the throttling element 204, the condensation preventing pipe 207 is specifically serially arranged on a pipeline between the condenser 203 and the drying filter 205, and is made of materials such as Polyvinyl chloride (PVC), so that condensation outside the pipeline is prevented.
Optionally, the drilling platform 1 is made of steel, copper or other metal materials, so as to improve the heat conduction efficiency between the cooling medium in the heat-conducting metal pipe 201 and the outside, and further improve the cooling efficiency.
Optionally, a wood board 4 and a backing plate 5 are further sequentially arranged on the drilling platform 1 from bottom to top, the PCB300 to be drilled is placed on the upper surface of the backing plate 5, a yielding hole is formed in the backing plate 5 corresponding to a drilling position, and the wood board 4 and the backing plate 5 respectively play roles in protecting the drilling platform 1 and assisting in drilling.
Alternatively, the heat conductive metal pipe 201 may be in direct contact with the PCB300 to directly absorb heat, or in indirect contact with the PCB300 through the wood board 4 and the pad 5 to indirectly absorb heat.
Alternatively, the outer diameter of the heat-conductive metal pipe 201 does not exceed the smaller one of the depth dimension and the width dimension of the cooling groove 11.
Preferably, the depth of the cooling groove 11 is set to 8mm to 12mm, and the width of the cooling groove 11 is set to 8mm to 12 mm.
In the present embodiment, the depth and width of the cooling groove 11 are set to 10mm, and the outer diameter of the heat conductive metal pipe 201 is set to 10 mm.
Preferably, the heat conducting metal pipe 201 is a copper pipe.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A PCB cooling drilling system, comprising:
the drilling equipment (100) is used for drilling holes in the PCB (300), a drilling platform (1) used for supporting the PCB (300) to be drilled is arranged on the drilling equipment (100), and a cooling groove (11) is formed in the drilling platform (1);
refrigeration equipment, including refrigeration subassembly and evaporimeter, the refrigeration subassembly with the evaporimeter is connected and for the refrigeration medium after the evaporimeter provides the cooling, the evaporimeter includes heat conduction metal pipe (201), heat conduction metal pipe (201) are arranged in cooling recess (11), the refrigeration medium is in the refrigeration subassembly with circulation between the evaporimeter flows through heat conduction metal pipe (201).
2. The PCB cooling drilling system according to claim 1, wherein the cooling groove (11) is uniformly laid on the drilling platform (1) in an area for supporting the PCB (300), and the heat-conducting metal pipe (201) is penetratingly arranged on the cooling groove (11).
3. A PCB cooling drilling system according to claim 2, wherein the cooling groove (11) is arranged in the drilling platform (1) in a winding-like reciprocating extension, and the heat conducting metal tube (201) is correspondingly arranged in a winding-like structure.
4. The PCB cooling drilling system according to claim 2, wherein the cooling grooves (11) are distributed in the drilling platform (1) along a convolution shape, and the heat conducting metal pipes (201) are correspondingly arranged in a convolution-shaped structure.
5. The PCB cooling drilling system of claim 1, wherein the refrigeration assembly comprises a compressor (202), a condenser (203) and a throttling element (204), the compressor (202) is communicated with a gas outlet end of the evaporator, the throttling element (204) is communicated with a liquid inlet end of the evaporator, the condenser (203) is communicated with the compressor (202) and the throttling element (204), the compressor (202) is used for compressing gaseous refrigeration medium, the condenser (203) is used for cooling and liquefying the compressed refrigeration medium, and the throttling element (204) is used for reducing the pressure of the liquefied refrigeration medium.
6. A PCB cooling drilling system according to claim 5, characterized in that a dry filter (205) is further arranged between the condenser (203) and the throttling element (204), and the dry filter (205) is used for filtering out moisture, impurities and oxides in the refrigerant medium.
7. A PCB cooling drilling system according to claim 5, characterized in that a solenoid valve (206) is arranged in the conduit between the condenser (203) and the throttling element (204), the solenoid valve (206) being adapted to control the flow of cooling medium into the throttling element (204).
8. A PCB cooling drilling system according to claim 5, wherein the cooling device further comprises an anti-condensation tube (207), the anti-condensation tube (207) being arranged in series in a conduit between the condenser (203) and the restriction element (204).
9. A PCB cooling drilling system according to any of claims 1-8, wherein the drilling apparatus (100) further comprises:
the dust collection device (3), the dust collection end of the dust collection device (3) is arranged above the drilling platform (1), and can suck dust generated by drilling from bottom to top and accelerate cold air to flow upwards.
10. A PCB cooling drilling system according to any of claims 1-8, characterised in that the depth of the cooling groove (11) is set to 8-12 mm; and/or
The width of the cooling groove (11) is set to be 8mm to 12 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210911890.6A CN115107104B (en) | 2022-07-29 | 2022-07-29 | PCB cooling drilling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210911890.6A CN115107104B (en) | 2022-07-29 | 2022-07-29 | PCB cooling drilling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115107104A true CN115107104A (en) | 2022-09-27 |
| CN115107104B CN115107104B (en) | 2023-12-05 |
Family
ID=83334521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210911890.6A Active CN115107104B (en) | 2022-07-29 | 2022-07-29 | PCB cooling drilling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115107104B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534755A (en) * | 2014-12-02 | 2015-04-22 | 青岛澳柯玛超低温冷冻设备有限公司 | Refrigerating system with automatic defrosting function |
| CN208343019U (en) * | 2018-05-31 | 2019-01-08 | 广州兴森快捷电路科技有限公司 | Cooling piece and pcb board Micro-role Drilling device |
| CN209158566U (en) * | 2018-11-13 | 2019-07-26 | 山东科技大学 | A kind of automated machine vegetable cutter |
| CN110779228A (en) * | 2019-11-27 | 2020-02-11 | 中航光电科技股份有限公司 | Compression driving type two-phase indirect cooling system |
| US20210170619A1 (en) * | 2019-12-09 | 2021-06-10 | Dalian University Of Technology | Multi-adaptive fast loading attached air-cooled dust removal equipment |
| CN114043570A (en) * | 2021-09-28 | 2022-02-15 | 王玉亲 | Cleaning device for drilling of circuit board |
-
2022
- 2022-07-29 CN CN202210911890.6A patent/CN115107104B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534755A (en) * | 2014-12-02 | 2015-04-22 | 青岛澳柯玛超低温冷冻设备有限公司 | Refrigerating system with automatic defrosting function |
| CN208343019U (en) * | 2018-05-31 | 2019-01-08 | 广州兴森快捷电路科技有限公司 | Cooling piece and pcb board Micro-role Drilling device |
| CN209158566U (en) * | 2018-11-13 | 2019-07-26 | 山东科技大学 | A kind of automated machine vegetable cutter |
| CN110779228A (en) * | 2019-11-27 | 2020-02-11 | 中航光电科技股份有限公司 | Compression driving type two-phase indirect cooling system |
| US20210170619A1 (en) * | 2019-12-09 | 2021-06-10 | Dalian University Of Technology | Multi-adaptive fast loading attached air-cooled dust removal equipment |
| CN114043570A (en) * | 2021-09-28 | 2022-02-15 | 王玉亲 | Cleaning device for drilling of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115107104B (en) | 2023-12-05 |
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