CN115106330A - Stripping and hanging groove for vertical continuous electroplating of circuit board and cleaning method thereof - Google Patents
Stripping and hanging groove for vertical continuous electroplating of circuit board and cleaning method thereof Download PDFInfo
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- CN115106330A CN115106330A CN202210736259.7A CN202210736259A CN115106330A CN 115106330 A CN115106330 A CN 115106330A CN 202210736259 A CN202210736259 A CN 202210736259A CN 115106330 A CN115106330 A CN 115106330A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 167
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 167
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 239000010949 copper Substances 0.000 claims abstract description 59
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 27
- 239000003814 drug Substances 0.000 abstract description 9
- 238000003756 stirring Methods 0.000 description 42
- 230000000694 effects Effects 0.000 description 14
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 7
- 235000017491 Bambusa tulda Nutrition 0.000 description 7
- 241001330002 Bambuseae Species 0.000 description 7
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 7
- 239000011425 bamboo Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The application provides a stripping and hanging tank for vertical continuous electroplating of a circuit board and a cleaning method thereof. The cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board comprises the following steps: establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence under the conditions of preset stripping time, preset femtoque copper thickness and preset corrosion rate; detecting the concentration of copper ions in the stripping groove to obtain an actual concentration value of the copper ions; sequentially comparing the actual concentration value of the copper ions with a plurality of copper ion concentrations of a database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one copper ion concentration value of the database; according to the target value of the concentration of the copper ions, the corresponding concentration value of the dissolving agent is adjusted; the concentration of the dissolving agent in the stripping and hanging groove is adjusted, the cleaning efficiency of the pinch roll clamp is improved, the amount of the liquid medicine is saved, residual copper does not need to be embedded by a manual tool, and the problem that the pinch roll clamp is short in service life is solved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a stripping groove for vertical continuous electroplating of a circuit board and a cleaning method thereof.
Background
In the plating process of the circuit board manufacturing, the substrate needs to be clamped by the flying bar to carry out copper plating in the plating copper cylinder, and because the flying bar needs to conduct electricity, the flying bar clamp inevitably carries out copper plating along with the copper plating process on the substrate in the plating process. In order to remove the copper nodules of the flying bar clamp, a stripping groove needs to be added after the copper electroplating cylinder to remove the copper nodules on the flying bar clamp.
However, in the actual production process, the biting rate for removing copper ions and the use time of the stripping groove are set manually according to visual observation and by combining experience, so that the copper nodules of the flying bar clamp are difficult to remove completely at one time, the residual copper of the flying bar is difficult to clean and follow, multiple cleaning is needed or the concentration of the liquid medicine is increased continuously, the cleaning efficiency of the copper nodules is low, and the liquid medicine is wasted; if not many times wash, adopt the hand tool to inlay the incomplete copper, then lead to flying to a bus clip very easily damaged, make flying to a bus clip life is lower.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides the stripping and hanging groove for the vertical and continuous electroplating of the circuit board, which has higher cleaning efficiency, saves liquid medicine and does not influence the service life of the femto clamp, and the cleaning method thereof.
The purpose of the invention is realized by the following technical scheme:
a cleaning method of a stripping and hanging groove for vertical continuous electroplating of a circuit board comprises the following steps:
establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence under the conditions of preset stripping time, preset femtoque copper thickness and preset corrosion rate;
detecting the concentration of the copper ions in the stripping groove to obtain an actual concentration value of the copper ions;
sequentially comparing the actual copper ion concentration value with a plurality of copper ion concentrations in the database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values in the database;
according to the target value of the copper ion concentration, a corresponding concentration value of the dissolving agent is adjusted to obtain the target value of the dissolving agent concentration;
and adjusting the concentration of the dissolving agent in the stripping groove until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent.
In one embodiment, the dissolution agent is hydrogen peroxide or sulfuric acid.
In one embodiment, after the step of adjusting the concentration of the dissolving agent in the stripping tank, the cleaning method further comprises: the interior of the stripping groove is regularly cleaned.
In one embodiment, the preset stripping time is 7-8 min.
In one embodiment, the predetermined femto copper thickness is 35 μm to 40 μm.
In one embodiment, the predetermined bite rate is 5 μm/min to 6 μm/min.
In one embodiment, before the step of obtaining the target copper ion concentration value of the database by sequentially comparing the actual copper ion concentration value with the plurality of copper ion concentrations of the database, and after the step of detecting the copper ion concentration in the stripping tank, the cleaning method further includes:
judging whether the actual concentration value of the copper ions is less than or equal to a preset concentration threshold value or not;
and if not, replacing the new stripping and hanging groove.
In one embodiment, the preset concentration threshold value is 19-22 g/L.
In one embodiment, the preset concentration threshold is 20 g/L.
A hanging stripping groove for vertical and continuous electroplating of a circuit board is used for cleaning a femto clamp by adopting the cleaning method of the hanging stripping groove for vertical and continuous electroplating of the circuit board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
according to the cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board, firstly, under the conditions of preset stripping time, preset copper thickness of the flying bar and preset etching rate, a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence is established, and according to the one-to-one correspondence of the plurality of copper ion concentration values and the plurality of dissolving agent concentration values, each copper ion concentration value and the corresponding dissolving agent concentration value are used as reference data to strip the copper nodules of the flying bar clamp together, so that the applicability and the cleaning effect of the cleaning method are improved; secondly, detecting the concentration of copper ions in the stripping groove to obtain an actual concentration value of the copper ions, namely detecting the actual concentration of the copper ions of the cleaning liquid in the stripping groove; then, sequentially comparing the actual concentration value of the copper ions with a plurality of copper ion concentrations of a database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values of the database, and the copper ion concentration target value is closer to the actual concentration value of the copper ions; then, a corresponding dissolving agent concentration value is called according to the copper ion concentration target value to obtain a dissolving agent concentration target value, and the copper ion concentration target value is closer to the copper ion actual concentration value, so that the dissolving agent concentration of the cleaning solution is better adapted to the cleaning of the copper nodules of the femto clamp, the cleaning effect of the residual copper of the femto clamp is improved, and the operation of embedding the residual copper is not needed; finally, the concentration of the dissolving agent in the stripping groove is adjusted until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent, so that the cleaning solution in the stripping groove can better clean the flying bar clamp, the cleaning efficiency of the flying bar clamp is improved, the amount of the liquid medicine is saved, a manual tool is not needed to embed residual copper, and the problem that the service life of the flying bar clamp is short is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for cleaning a stripping tank for vertical continuous electroplating of a circuit board according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a cleaning method of a stripping and hanging groove for vertical continuous electroplating of a circuit board, which comprises the following steps: establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence under the conditions of preset stripping time, preset femtoque copper thickness and preset corrosion rate; detecting the concentration of the copper ions in the stripping groove to obtain an actual concentration value of the copper ions; sequentially comparing the actual copper ion concentration value with a plurality of copper ion concentrations in the database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one copper ion concentration value in the database; according to the target value of the copper ion concentration, a corresponding concentration value of the dissolving agent is adjusted to obtain a target value of the dissolving agent concentration; and adjusting the concentration of the dissolving agent in the stripping groove until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent.
According to the cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board, firstly, under the conditions of preset stripping time, preset flying copper thickness and preset etching rate, a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence is established, and according to the condition that the plurality of copper ion concentration values and the plurality of dissolving agent concentration values are in one-to-one correspondence and serve as reference data, each copper ion concentration value and the corresponding dissolving agent concentration value are used for stripping the copper nodules of the flying clip together, so that the applicability and the cleaning effect of the cleaning method are improved; secondly, detecting the concentration of copper ions in the stripping groove to obtain an actual concentration value of the copper ions, namely detecting the actual concentration of the copper ions of the cleaning liquid in the stripping groove; then, sequentially comparing the actual concentration value of the copper ions with a plurality of copper ion concentrations of a database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values of the database, and the copper ion concentration target value is closer to the actual concentration value of the copper ions; then, a corresponding dissolving agent concentration value is called according to the copper ion concentration target value to obtain a dissolving agent concentration target value, and the copper ion concentration target value is closer to the actual copper ion concentration value, so that the dissolving agent concentration of the cleaning solution is better adapted to the cleaning of the copper nodules of the flying bar clamp, the cleaning effect of the residual copper of the flying bar clamp is improved, and the operation of embedding and removing the residual copper is not needed; finally, the concentration of the dissolving agent in the stripping groove is adjusted until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent, so that the cleaning solution in the stripping groove can better clean the flying bar clamp, the cleaning efficiency of the flying bar clamp is improved, the amount of the liquid medicine is saved, a manual tool is not needed to embed residual copper, and the problem that the service life of the flying bar clamp is short is solved.
In order to better understand the technical solution of the present application, the following further explains the technical solution of the present application:
as shown in fig. 1, the cleaning method of the stripping groove for vertical continuous plating of the circuit board according to the embodiment is used for cleaning the femto clip to remove the copper nodules of the femto clip. Further, the cleaning method comprises part or all of the following steps:
s101, establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence under the conditions of preset stripping time, preset flying copper thickness and preset corrosion rate.
In the embodiment, under the conditions of preset stripping time, preset flying bar copper thickness and preset etching rate, a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence is established, and according to the reference data in which the plurality of copper ion concentration values and the plurality of dissolving agent concentration values are in one-to-one correspondence, each copper ion concentration value and the corresponding dissolving agent concentration value are used for stripping the copper nodules of the flying bar clamp together, so that the applicability and the cleaning effect of the cleaning method are improved. In this embodiment, the database is a data table in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence, wherein the copper ion concentration value is expressed by a unit of g/L, and the concentration value of the dissolving agent is expressed by% that is, the proportion of the dissolving agent in the cleaning solution is calculated by adding the dissolving agent in proportion. Under the conditions of preset stripping time, preset copper thickness of flying bars and preset corrosion rate, establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence, wherein the database is shown in the following table:
TABLE 1
As can be seen from the above table, under the conditions of the preset stripping time, the preset copper thickness of the femto zone and the preset etching rate, the concentration value of the dissolving agent is lower as the concentration value of the copper ions is higher. In one embodiment, the dissolving agent is hydrogen peroxide or sulfuric acid, and in actual operation, one dissolving agent is selected, the concentration value is different for different types of dissolving agents, and for specific copper ion concentration, the lower limit value and the upper limit value of the concentration value of the dissolving agent are different, that is, the concentration value of the dissolving agent is a range value, and the two end values of the range value of the concentration value of the dissolving agent are different.
S103, detecting the concentration of the copper ions in the stripping groove to obtain the actual concentration value of the copper ions.
In this embodiment, the concentration of copper ions in the stripping groove is detected to obtain the actual concentration value of copper ions. Specifically, the concentration of copper ions in the stripping groove is detected by a titration analysis method to obtain an actual concentration value of the copper ions.
S105, sequentially comparing the actual copper ion concentration value with a plurality of copper ion concentrations in the database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values in the database.
In this embodiment, the actual concentration value of copper ions is sequentially compared with a plurality of copper ion concentrations in the database, so as to obtain a target copper ion concentration value of the database, where the target copper ion concentration value is one of the copper ion concentration values in the database, and the target copper ion concentration value is closer to the actual concentration value of copper ions. Specifically, the sequentially comparing the actual concentration value of copper ions with the plurality of concentrations of copper ions in the database specifically comprises: and respectively carrying out difference comparison on the actual concentration value of the copper ions and the concentrations of the copper ions in the database to obtain a target value of the concentration of the copper ions in the database. It should be noted that the difference between the target copper ion concentration and the actual copper ion concentration is small, i.e. the target copper ion concentration is the closest value of the difference between the actual copper ion concentration.
S107, the corresponding dissolving agent concentration value is adjusted according to the copper ion concentration target value, so that the dissolving agent concentration target value is obtained.
In this embodiment, the corresponding dissolving agent concentration value is called according to the copper ion concentration target value to obtain the dissolving agent concentration target value, and because the copper ion concentration target value is closer to the actual copper ion concentration value, the dissolving agent concentration of the cleaning solution is better adapted to the cleaning of the copper nodules of the flying bar clamp, so that the cleaning effect of the residual copper of the flying bar clamp is improved, and the operation of embedding the residual copper is not needed.
S109, the concentration of the dissolving agent in the stripping groove is adjusted until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent.
In this embodiment, it is right peel off the dissolving agent concentration in the groove and adjust, until the current value of the dissolving agent concentration in the groove of peeling off equals dissolving agent concentration target value, make the washing liquid of peeling off in the groove rinse the flying bar clip better, improved the cleaning efficiency of flying bar clip, practice thrift the liquid medicine quantity simultaneously, also need not to adopt hand tool to inlay incomplete copper again, avoided flying bar clip life lower problem.
According to the cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board, firstly, under the conditions of preset stripping time, preset flying copper thickness and preset etching rate, a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence is established, and according to the condition that the plurality of copper ion concentration values and the plurality of dissolving agent concentration values are in one-to-one correspondence and serve as reference data, each copper ion concentration value and the corresponding dissolving agent concentration value are used for stripping the copper nodules of the flying clip together, so that the applicability and the cleaning effect of the cleaning method are improved; secondly, detecting the concentration of copper ions in the stripping groove to obtain an actual concentration value of the copper ions, namely detecting the actual concentration of the copper ions of the cleaning liquid in the stripping groove; then, sequentially comparing the actual concentration value of the copper ions with a plurality of copper ion concentrations of a database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values of the database, and the copper ion concentration target value is closer to the actual concentration value of the copper ions; then, a corresponding dissolving agent concentration value is called according to the copper ion concentration target value to obtain a dissolving agent concentration target value, and the copper ion concentration target value is closer to the actual copper ion concentration value, so that the dissolving agent concentration of the cleaning solution is better adapted to the cleaning of the copper nodules of the flying bar clamp, the cleaning effect of the residual copper of the flying bar clamp is improved, and the operation of embedding and removing the residual copper is not needed; finally, the concentration of the dissolving agent in the stripping and hanging groove is adjusted until the current value of the concentration of the dissolving agent in the stripping and hanging groove is equal to the target value of the concentration of the dissolving agent, so that the cleaning solution in the stripping and hanging groove can better clean the femto clip, the cleaning efficiency of the femto clip is improved, the amount of the liquid medicine is saved, the residual copper does not need to be embedded by a manual tool, the problem that the service life of the femto clip is short is solved, the cleaning quality of the femto clip is improved, and the problem that the residual copper of the femto clip is too much and easily adheres to the substrate is avoided.
In one embodiment, the preset stripping time is 7-8 min. In one embodiment, the predetermined femtobar copper thickness is between 35 μm and 40 μm. In one embodiment, the predetermined bite rate is 5 μm/min to 6 μm/min for better cleaning of the femto clip.
In one embodiment, before the step of obtaining the target copper ion concentration value of the database by sequentially comparing the actual copper ion concentration value with the plurality of copper ion concentrations of the database, and after the step of detecting the copper ion concentration in the stripping tank, the cleaning method further includes: judging whether the actual concentration value of the copper ions is less than or equal to a preset concentration threshold value or not; if not, the stripping groove is replaced newly, the problem that the biting efficiency is low in the process of removing the copper nodules of the flying bar clamp due to the fact that the copper ion concentration of the cleaning liquid in the stripping groove is too high is solved, namely the problem that the copper nodule removal efficiency of the flying bar clamp is low due to the fact that the copper ion concentration of the cleaning liquid in the stripping groove is too high is solved, and the removal effect of the residual copper of the flying bar clamp is improved under the conditions of preset stripping time and preset flying bar copper thickness. In one embodiment, the preset concentration threshold is 19-22 g/L. In the embodiment, the preset concentration threshold is 20g/L, and when the device is used, the concentration threshold is flexibly set according to actual conditions, so that the removal effect of residual copper of the flying bar clamp is improved.
Further, before the step of detecting the concentration of copper ions in the stripping tank: stirring the cleaning liquid in the stripping groove for preset stirring time, and detecting the copper ion concentration of the cleaning liquid in the stripping groove to obtain the actual copper ion concentration value accurately. In this embodiment, the preset stirring time is 2min to 3min, so that the copper ion concentration of the cleaning solution in the stripping tank is relatively uniform, and the detection precision of the actual concentration value of the copper ions is improved. Furthermore, the step of stirring the cleaning liquid in the stripping tank for a preset stirring time comprises the following steps: the cleaning solution in the stripping groove is stirred clockwise for a first preset stirring time, and then the cleaning solution in the stripping groove is stirred counterclockwise for a second preset stirring time, so that the concentration of copper ions in the cleaning solution in the stripping groove is more uniform, and the detection precision of the actual concentration value of the copper ions is further improved. The sum of the first preset stirring time and the second preset stirring time is equal to the preset stirring time.
Furthermore, the step of stirring the cleaning liquid in the stripping tank for a preset stirring time specifically comprises the following steps: adopt the stirring roller brush to stir the washing liquid of shelling in the groove and predetermine the churning time, stirring roller brush roll simultaneously and wipe in the internal perisporium of shelling the groove, make the copper ion of adhesion in the internal perisporium of shelling the groove dissolve in the washing liquid better, make the actual concentration value of obtaining copper ion more accurate simultaneously. In this embodiment, the stirring roller brush includes that the stirring rotates a section of thick bamboo and rotates a plurality of brush strips that a section of thick bamboo interval set up along the stirring, makes the stirring roller brush stir the washing liquid in the groove of hanging of peeling off better, makes the stirring roller brush roll better simultaneously and wipes in the internal perisporium of the groove of hanging off. In one embodiment, each rolling brush strip is arranged at a preset inclination angle along the tangential direction of the rotation direction of the outer peripheral wall of the stirring and rotating cylinder, so that the stirring roller brush can better stir the cleaning liquid in the stripping groove, and meanwhile, the stirring roller brush can better roll and wipe the inner peripheral wall of the stripping groove. In this embodiment, the predetermined inclination angle is 45 ° to 60 °. The preset inclination angle is 50 degrees, so that the rolling brush strip can better act on the inner wall of the stripping and hanging groove when rotating along the stirring rotating cylinder, and meanwhile, the stirring roller brush can better stir the cleaning liquid. Further, a stirring rotation section of thick bamboo includes barrel and axis of rotation, and the barrel cup joints in the axis of rotation, and the barrel can be dismantled with the axis of rotation and be connected, and each round brush strip is installed on the periphery wall of barrel, makes each round brush strip install on a stirring rotation section of thick bamboo, and when round brush strip wearing and tearing are more serious, can change the barrel, has improved the life of stirring cylinder brush. Furthermore, the outer peripheral wall of the cylinder body is provided with a protruding sheet spirally arranged around the outer peripheral wall of the cylinder body, and when the stirring rotating cylinder rotates, the outer peripheral wall of the cylinder body and the rolling brush strip can act on the liquid in the stripping groove in the rotating process of the cylinder body. Further, be equipped with at least a set of brush strip between two adjacent lugs, every group brush strip includes m brush strips, m brush strip interval sets up, m is the integer that is greater than or equal to 10, two adjacent lugs can carry out the butt jointly to every brush strip of corresponding group when a section of thick bamboo rotates in the stirring spacing, avoid the crooked great easy problem of damaging of each brush strip, make a section of thick bamboo better brush when rotatory and act on and shell a string inslot internal perisporium, make a section of thick bamboo stirring rotation washing liquid simultaneously. Each rolling brush strip is higher than the height of each lug by the height of the barrel, so that the problem that the lug scrapes the inner wall of the stripping groove to cause large abrasion is avoided. In this embodiment, the lug is the silica gel piece, makes the lug have better elasticity, even if the round brush strip breaks, the lug directly acts on the internal perisporium in peeling off the groove, also can avoid peeling off the great problem of inner wall wearing and tearing in hanging the groove.
In one embodiment, after the step of adjusting the concentration of the dissolving agent in the stripping tank, the cleaning method further comprises: regular cleaning is carried out in the stripping and hanging groove, the problem that the cleaning effect or efficiency is influenced by more impurities existing in the stripping and hanging groove due to long-term continuous use is avoided, and the cleaning efficiency and the cleaning effect of the flying bar clamp are improved. Further, regularly wash through stirring roller brush in to shelling hanging groove, so operate at stirring and the shared stirring roller brush of cleaning process, reduced the quantity of the auxiliary assembly who shells hanging groove, and then reduced the cleaning cost who shells hanging groove. For reducing the impurity that the stirring cylinder brushed and adhering to, furtherly, the stirring cylinder brush still includes annular hose and spray connection pipe, annular hose is around setting up along the periphery wall spiral of barrel, annular hose sets up the jet orifice that a plurality of intervals set up, annular hose's one end communicates in spray connection pipe's one end, spray connection pipe's the other end and be used for external pressure water source, spray on the whole stirring cylinder brush even of brush strip after making annular hose lead to water, it adheres to have reduced the impurity that the stirring cylinder brushed, the cleaning efficiency who peels off the groove is improved, can reduce the impurity that the stirring cylinder brushed simultaneously and adhere to. The annular hose is less than the height of lug in the height on barrel surface, and the lug is formed with and keeps away the position recess, encircles the hose and is located and keep away the position recess and be connected with the lug, makes to encircle the hose and is fixed in the periphery wall of barrel better to avoid encircling the hose and interfering the internal perisporium of hanging groove easily when the round brush.
The application also provides a stripping and hanging groove for vertical and continuous electroplating of the circuit board, and the flying bar clamp is cleaned by adopting the cleaning method of the stripping and hanging groove for vertical and continuous electroplating of the circuit board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
according to the cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board, firstly, under the conditions of preset stripping time, preset flying copper thickness and preset etching rate, a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence is established, and according to the condition that the plurality of copper ion concentration values and the plurality of dissolving agent concentration values are in one-to-one correspondence and serve as reference data, each copper ion concentration value and the corresponding dissolving agent concentration value are used for stripping the copper nodules of the flying clip together, so that the applicability and the cleaning effect of the cleaning method are improved; secondly, detecting the concentration of copper ions in the stripping groove to obtain an actual concentration value of the copper ions, namely detecting the actual concentration of the copper ions of the cleaning liquid in the stripping groove; then, sequentially comparing the actual concentration value of the copper ions with a plurality of copper ion concentrations of a database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values of the database, and the copper ion concentration target value is closer to the actual concentration value of the copper ions; then, a corresponding dissolving agent concentration value is called according to the copper ion concentration target value to obtain a dissolving agent concentration target value, and the copper ion concentration target value is closer to the actual copper ion concentration value, so that the dissolving agent concentration of the cleaning solution is better adapted to the cleaning of the copper nodules of the flying bar clamp, the cleaning effect of the residual copper of the flying bar clamp is improved, and the operation of embedding and removing the residual copper is not needed; finally, the concentration of the dissolving agent in the stripping groove is adjusted until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent, so that the cleaning solution in the stripping groove can better clean the flying bar clamp, the cleaning efficiency of the flying bar clamp is improved, the amount of the liquid medicine is saved, a manual tool is not needed to embed residual copper, and the problem that the service life of the flying bar clamp is short is solved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A cleaning method of a stripping and hanging groove for vertical continuous electroplating of a circuit board is characterized by comprising the following steps:
establishing a database in which a plurality of copper ion concentration values and a plurality of dissolving agent concentration values are in one-to-one correspondence under the conditions of preset stripping time, preset femtoque copper thickness and preset corrosion rate;
detecting the concentration of the copper ions in the stripping groove to obtain an actual concentration value of the copper ions;
sequentially comparing the actual copper ion concentration value with a plurality of copper ion concentrations in the database to obtain a copper ion concentration target value of the database, wherein the copper ion concentration target value is one of the copper ion concentration values in the database;
according to the copper ion concentration target value, a corresponding dissolving agent concentration value is adjusted to obtain the dissolving agent concentration target value;
and adjusting the concentration of the dissolving agent in the stripping groove until the current value of the concentration of the dissolving agent in the stripping groove is equal to the target value of the concentration of the dissolving agent.
2. The method for cleaning a stripping tank for vertically and continuously electroplating a circuit board according to claim 1, wherein the dissolving agent is hydrogen peroxide or sulfuric acid.
3. A cleaning method for a peeling groove used for vertical continuous electroplating of a circuit board according to claim 1, characterized in that after the step of adjusting the concentration of the dissolving agent in the peeling groove, the cleaning method further comprises: the interior of the stripping groove is regularly cleaned.
4. The cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board according to claim 1, characterized in that the preset stripping time is 7-8 min.
5. The method for cleaning the peeling groove for the vertical continuous electroplating of the circuit board according to claim 1, wherein the preset femto copper thickness is 35 μm to 40 μm.
6. The method for cleaning the peeling groove for the vertical continuous electroplating of the circuit board according to claim 1, wherein the preset etching rate is 5 μm/min to 6 μm/min.
7. The method for cleaning a hanging groove for vertically and continuously electroplating a circuit board according to claim 1, wherein before the step of obtaining the target value of the copper ion concentration in the database by sequentially comparing the actual copper ion concentration value with the plurality of copper ion concentrations in the database, and after the step of detecting the copper ion concentration in the hanging groove, the method further comprises:
judging whether the actual concentration value of the copper ions is less than or equal to a preset concentration threshold value or not;
and if not, replacing the new stripping and hanging groove.
8. The cleaning method of the stripping groove for the vertical continuous electroplating of the circuit board according to claim 7, wherein the preset concentration threshold is 19-22 g/L.
9. The method for cleaning the peeling groove for the vertical continuous electroplating of the circuit board as claimed in claim 8, wherein the preset concentration threshold is 20 g/L.
10. A stripping and hanging groove for vertical continuous electroplating of a circuit board, which is characterized in that a flying bar clamp is cleaned by the method for cleaning the stripping and hanging groove for vertical continuous electroplating of the circuit board as claimed in any one of claims 1 to 9.
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| CN202210736259.7A CN115106330A (en) | 2022-06-27 | 2022-06-27 | Stripping and hanging groove for vertical continuous electroplating of circuit board and cleaning method thereof |
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| CN202210736259.7A CN115106330A (en) | 2022-06-27 | 2022-06-27 | Stripping and hanging groove for vertical continuous electroplating of circuit board and cleaning method thereof |
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| CN115106330A true CN115106330A (en) | 2022-09-27 |
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