CN115097664A - Method and device for bonding substrates - Google Patents

Method and device for bonding substrates Download PDF

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Publication number
CN115097664A
CN115097664A CN202210811823.7A CN202210811823A CN115097664A CN 115097664 A CN115097664 A CN 115097664A CN 202210811823 A CN202210811823 A CN 202210811823A CN 115097664 A CN115097664 A CN 115097664A
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substrate
deviation
middle plate
coordinate data
mark
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柯昌义
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Henan Huarui Photoelectric Industry Co ltd
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Henan Huarui Photoelectric Industry Co ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

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  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses a method and a device for laminating a substrate. The method comprises the following steps: acquiring mark coordinate data of a first substrate and a second substrate; determining deviation parameters of the first middle plate and the second middle plate and offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate; determining a correction parameter according to the deviation parameter and the offset; and bonding the first substrate and the second substrate, and correcting according to the correction parameters. Not only can guarantee the timeliness of counterpointing, can reduce the deviation difference between the different medium plates simultaneously at the counterpoint mark of medium plate and the skew direction of the counterpoint mark of base plate different, and then can reduce the phenomenon that part medium plate has the light leak after the laminating, improve the accuracy of the laminating counterpoint of first base plate and second base plate, and then improved the product percent of pass of base plate laminating. Or the phenomenon that the local point on the middle plate of the first substrate and the second substrate is out of specification can be improved.

Description

Method and device for bonding substrates
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a method and a device for laminating a substrate.
Background
When a liquid crystal display panel is manufactured, a Thin Film Transistor (TFT) substrate and a Color Filter (CF) substrate need to be precisely attached together in a vacuum environment to form a liquid crystal cell. In general, the bonding accuracy is required to be controlled to be within 1 μm. In the laminating process, the TFT substrate and the CF substrate can be laminated by adopting a four-corner alignment mode and a central point laminating mode. The method comprises the steps of identifying the positions of 4 groups of alignment marks on a TFT substrate and a CF substrate through a Charge-coupled Device (CCD), respectively calculating the central points of the TFT substrate and the CF substrate according to the positions of the 4 groups of alignment marks, then enabling the central points of the TFT substrate and the CF substrate to be superposed by moving the substrate (which can be the TFT substrate or the CF substrate) on a lower table plate of a laminating machine in the laminating process according to the relative deviation of the central points of the TFT substrate and the CF substrate of the difference values of the central points, and then carrying out pressing action to realize the laminating of the TFT substrate and the CF substrate. For example, when the relative deviation of the center points of the TFT substrate and the CF substrate is (dx, dy, d θ), the amount of movement of the substrate on the lower stage is (-dx, -dy, -d θ). Where dx is the deviation of the center points of the TFT substrate and the CF substrate on the X axis in the coordinate system, dy is the deviation of the center points of the TFT substrate and the CF substrate on the Y axis in the coordinate system, and d θ is the rotational deviation of the TFT substrate and the CF substrate in the coordinate system.
The TFT substrate and the CF substrate each include a plurality of middle plates disposed opposite to each other, and each of the middle plates has alignment marks, for example, the alignment marks of the middle plates may be disposed at four corners of the middle plate. When the TFT substrate and the CF substrate are bonded using 4 sets of alignment marks of the substrates, if the alignment marks of the middle plate and the alignment marks of the substrates are different from each other, for example, the alignment marks of the middle plate and the alignment marks of the substrates are different in offset direction, or the alignment marks on the middle plate have a local point position over gauge when the TFT substrate and the CF substrate are supplied. After the center points of the TFT substrate and the CF substrate are aligned, the center points of the middle plates may not be aligned, or the deviation values between the middle plates are different greatly, which may result in the misalignment of some middle plates, and further cause the light leakage phenomenon in the display panel formed by the middle plates, so that the product transmittance of the display panel is relatively low.
Disclosure of Invention
The invention provides a method and a device for laminating a substrate, which are used for improving the timeliness and the accuracy of alignment during the lamination of the substrate.
In a first aspect, an embodiment of the present invention provides a method for attaching a substrate, including:
acquiring mark coordinate data of a first substrate and a second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
determining deviation parameters of the first middle plate and the second middle plate and offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
determining a correction parameter according to the deviation parameter and the offset;
and adhering the first substrate and the second substrate, and correcting according to the correction parameters.
Optionally, determining a deviation parameter of the first middle plate and the second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate includes:
determining the central coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and calculating the deviation parameter according to each center coordinate deviation.
Optionally, when directions of center coordinate deviations of each pair of oppositely arranged first midplane and second midplane coincide, calculating the deviation parameter according to each center coordinate deviation includes:
and calculating an average value according to each central coordinate deviation, and taking the average value as the deviation parameter.
Optionally, when directions of center coordinate deviations of each pair of oppositely disposed first midplane and second midplane are not consistent, calculating the deviation parameter according to each center coordinate deviation, including:
and calculating a median according to each central coordinate deviation and using the median as the deviation parameter.
Optionally, determining a center coordinate deviation of each pair of oppositely disposed first middle plate and second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining the center coordinate of each first middle plate according to the mark coordinate data of the first substrate;
determining the center coordinate of each second middle plate according to the mark coordinate data of the second substrate;
and determining the center coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the difference between the center coordinate of the first middle plate and the center coordinate of the oppositely arranged second middle plate.
Optionally, determining the offset amount of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate includes:
determining the center coordinate of the first substrate according to the mark coordinate data of the first substrate;
determining the center coordinate of the second substrate according to the mark coordinate data of the second substrate;
determining an angular deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and determining the offset of the first substrate and the second substrate according to the difference between the central coordinate of the first substrate and the central coordinate of the second substrate and the angle deviation.
Optionally, determining the angular deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate includes:
determining quadrant angle deviation of the first substrate and the second substrate in each quadrant in a coordinate system according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
determining the angular deviation according to a quadrant angular deviation of the first substrate and the second substrate in each quadrant.
Optionally, after determining a correction parameter according to the deviation parameter and the offset amount, the method further includes:
attaching the third substrate and the fourth substrate, and correcting according to the correction parameters; wherein the third substrate and the first substrate have the same production lot and model, and the fourth substrate and the second substrate have the same production lot and model.
Optionally, determining a correction parameter according to the deviation parameter and the offset amount includes:
and determining the correction parameter according to the difference between the deviation parameter and the offset.
In a second aspect, an embodiment of the present invention further provides a device for attaching a substrate, including:
the acquisition module is used for acquiring mark coordinate data of the first substrate and the second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
a first determining module, configured to determine, according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate, a deviation parameter of the first middle plate and the second middle plate and an offset of the first substrate and the second substrate;
the second determining module is used for determining a correction parameter according to the deviation parameter and the offset;
and the attaching module is used for attaching the first substrate and the second substrate and correcting according to the correction parameters.
According to the technical scheme of the embodiment of the invention, the mark coordinate data of the first substrate and the mark coordinate data of the second substrate are obtained, the offset of the first substrate and the second substrate and the deviation parameter of the first middle plate and the second middle plate are calculated according to the mark coordinate data, then the offset is corrected through the deviation parameter, and the first substrate and the second substrate are attached through the corrected offset, so that the alignment timeliness can be ensured, meanwhile, the deviation difference between different middle plates can be reduced when the offset directions of the alignment mark of the middle plate and the alignment mark of the substrate are different, further, the phenomenon that part of the middle plates have light leakage after being attached can be reduced, the accuracy of the attachment alignment of the first substrate and the second substrate is improved, and further, the product yield of substrate attachment is improved. Or when the materials are supplied from the first substrate and the second substrate and the local point position overstepping exists in the alignment mark on the middle plate, the phenomenon of the local point position overstepping is improved, so that the phenomenon that part of the middle plate has light leakage after being attached can be reduced, and the accuracy of attaching alignment of the first substrate and the second substrate is improved.
Drawings
Fig. 1 is a flowchart of a method for bonding a substrate according to an embodiment of the present invention;
FIG. 2 is a flow chart of another method for bonding a substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first substrate according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a second substrate according to an embodiment of the invention;
fig. 5 is a schematic diagram illustrating relative positions of a first substrate and a second substrate according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a substrate bonding apparatus according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a flowchart of a method for bonding a substrate according to an embodiment of the present invention, where this embodiment is applicable to a case where a TFT substrate and a CF substrate are bonded when a liquid crystal display panel is manufactured, and the method may be executed by a substrate bonding apparatus, and specifically includes the following steps:
s110, acquiring mark coordinate data of the first substrate and the second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
the first substrate and the second substrate may be a TFT substrate and a CF substrate, respectively. Illustratively, the first substrate may be a TFT substrate, and the second substrate may be a CF substrate. Alternatively, the first substrate may be a CF substrate and the second substrate may be a TFT substrate. The first substrate and the second substrate are provided with alignment marks, namely the large plate alignment mark of the first substrate and the large plate alignment mark of the second substrate. Exemplarily, four corners of the first substrate and the second substrate are respectively provided with one alignment mark, and the first substrate includes four large board alignment marks respectively corresponding to the four corners of the first substrate; the second substrate comprises four large plate alignment marks which respectively correspond to four corners of the second substrate. Each substrate may include a plurality of middle plates, and each middle plate also has an alignment mark, i.e. an alignment mark of the middle plate. Illustratively, each first midplane includes four midplane alignment marks corresponding to four corners of the first midplane, and each second midplane includes four midplane alignment marks corresponding to four corners of the second midplane. The mark coordinate data may include large plate alignment mark coordinate data of the substrate and middle plate alignment mark coordinate data, which are respectively used to represent the positions of the large plate alignment mark of the substrate and the middle plate alignment mark. When the substrate is formed, the mark on the substrate has preset coordinates, and the preset coordinates are coordinates of the preset position of the mark in a preset coordinate system. The preset coordinate system is a coordinate system formed by taking the central point of the substrate as an original point and taking a symmetrical line of the substrate as an axis. After the substrate is formed, the marks on the substrate have actual coordinates that have a certain deviation from the preset coordinates due to a process or the like. The mark coordinate data may be a difference between the actual coordinates and the preset coordinates, and is used to represent the actual coordinates of the mark on the substrate. For example, the mark coordinate data of the first substrate may include alignment mark coordinates of four corners of the first substrate, and alignment mark coordinates of four corners of each of the first middle plates. The mark coordinate data of the second substrate may include alignment mark coordinates of four corners of the second substrate, and alignment mark coordinates of four corners of each second middle plate.
The mark coordinate data may be measured and stored at the time of manufacturing the substrate. For example, when the first substrate is manufactured, the mark coordinate data of the first substrate may be measured by a dimension measuring device, uploaded to a Distributed File System (DFS) server in a Computer Integrated Manufacturing System (CIMS) through a File Transfer Protocol (FTP) of an ethernet, and stored in a data folder corresponding to the first substrate for storage. The data folder corresponding to each first substrate can be identified through the identification of the first substrate. For example, different first substrates may be numbered in sequence, that is, the number serves as the identifier of the first substrate, and the mark coordinate data of each first substrate may be stored in the data folder corresponding to the number. Similarly, when the second substrate is manufactured, the marking coordinate data of the second substrate may be measured by the dimension measuring device, and uploaded to a Distributed File System (DFS) server in a Computer Integrated Manufacturing System (CIMS) through a File Transfer Protocol (FTP) of an ethernet, and stored in a data folder corresponding to the second substrate for storage. And the data folder corresponding to each second substrate can be identified through the identification of the second substrate. For example, different second substrates may be numbered in sequence, that is, the number serves as the identifier of the second substrate, and the mark coordinate data of each second substrate may be stored in the data folder of the corresponding number.
When the mark coordinate data of the first substrate and the second substrate are obtained, the mark coordinate data of the corresponding mark can be searched in the DFS server according to the marks of the first substrate and the second substrate, and the mark coordinate data can be respectively used as the mark coordinate data of the first substrate and the mark coordinate data of the second substrate.
S120, determining deviation parameters of the first middle plate and the second middle plate and offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
the mark coordinate data may include mark coordinate data of the substrate and mark coordinate data of the middle plate. After the mark coordinate data of the first substrate and the mark coordinate data of the second substrate are obtained, the offset of the first substrate and the offset of the second substrate can be calculated according to the difference value between the mark coordinate data of the substrate in the first substrate and the mark coordinate data of the substrate in the second substrate, and meanwhile, the deviation parameters of the first middle plate and the second middle plate can be calculated according to the mark coordinate data of the middle plate in the first substrate and the mark coordinate data of the middle plate in the second substrate. The offset of the first substrate and the offset of the second substrate may include an offset of an X axis, an offset of a Y axis, and an offset of a rotation angle in a preset coordinate system. The deviation parameters of the first middle plate and the second middle plate may include an X-axis deviation amount and a Y-axis deviation amount in a preset coordinate system.
S130, determining a correction parameter according to the deviation parameter and the offset;
after determining the deviation parameters of the first middle plate and the second middle plate and the offset of the first substrate and the second substrate, the offset can be adjusted according to the deviation parameters, and the adjusted offset can be used as the correction parameters of the first substrate and the second substrate. Make first base plate and second base plate in the laminating in-process, when carrying out the alignment according to the offset after the adjustment, not only can guarantee the timeliness of counterpointing, can reduce the deviation difference between the different medium plates simultaneously at the counterpoint mark of medium plate and the skew direction of the counterpoint mark of base plate is different, and then can reduce the phenomenon that part medium plate has the light leak after the laminating, improve the accuracy of the laminating counterpoint of first base plate and second base plate, and then improved the product percent of pass of base plate laminating. Or when the materials are supplied from the first substrate and the second substrate and the local point position overstepping exists in the alignment mark on the middle plate, the phenomenon of the local point position overstepping is improved, so that the phenomenon that part of the middle plate has light leakage after being attached can be reduced, and the accuracy of attaching alignment of the first substrate and the second substrate is improved.
S140, the first substrate and the second substrate are bonded, and correction is performed according to the correction parameters.
After the correction parameters are determined, when the first substrate and the second substrate are attached, the first substrate or the second substrate can be adjusted first to enable the first substrate and the second substrate to be roughly aligned, then the first substrate or the second substrate is adjusted again according to the correction parameters, the first substrate and the second substrate are aligned and corrected to enable the first substrate and the second substrate to be accurately aligned, and then the first substrate and the second substrate are pressed to achieve attachment of the first substrate and the second substrate. When the first substrate and the second substrate are adjusted, the substrate arranged on the lower bedplate of the laminating machine can be adjusted.
According to the technical scheme, the mark coordinate data of the first substrate and the mark coordinate data of the second substrate are obtained, the offset of the first substrate and the offset of the second substrate are calculated according to the mark coordinate data, the deviation parameters of the first medium plate and the second medium plate are calculated, the offset is corrected through the deviation parameters, the first substrate and the second substrate are attached through the corrected offset, the alignment timeliness can be guaranteed, meanwhile, the deviation difference between different medium plates can be reduced when the alignment marks of the medium plates are different from the offset directions of the alignment marks of the substrates, the phenomenon that part of the medium plates have light leakage after being attached can be reduced, the accuracy of attachment alignment of the first substrate and the second substrate is improved, and the product yield of substrate attachment is improved. Or when the materials are supplied from the first substrate and the second substrate and the local point position overstepping exists in the alignment mark on the middle plate, the phenomenon of the local point position overstepping is improved, so that the phenomenon that part of the middle plate has light leakage after being attached can be reduced, and the accuracy of attaching alignment of the first substrate and the second substrate is improved.
On the basis of the above embodiments, the present embodiment is a refinement of the above embodiments. Fig. 2 is a flowchart of another method for attaching a substrate according to an embodiment of the present invention, as shown in fig. 2, the method includes:
s210, acquiring mark coordinate data of the first substrate and the second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
s220, determining the central coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
the first substrate and the second substrate are provided with a plurality of pairs of first middle plates and second middle plates which are arranged oppositely, and in one pair of the first middle plates and the second middle plates, the difference value of the center coordinates of the first middle plates and the center coordinates of the second middle plates is the center coordinate deviation. The mark coordinate data of the first substrate comprises alignment mark data of each first middle plate, the mark coordinate data of the second substrate comprises alignment mark data of each second middle plate, and the center coordinate deviation of a pair of the first middle plate and the second middle plate can be calculated through the alignment mark data of the pair of the first middle plate and the second middle plate. By analogy, the center coordinate deviation of each pair of the first middle plate and the second middle plate can be respectively calculated according to the alignment mark data of each pair of the first middle plate and the second middle plate.
Optionally, determining a center coordinate deviation of each pair of the first middle plate and the second middle plate oppositely arranged according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining the center coordinate of each first middle plate according to the mark coordinate data of the first substrate;
the mark coordinate data of the first substrate comprises alignment mark data of each first middle plate. And determining the center coordinate of the first middle plate according to the alignment mark data of the first middle plate. Exemplarily, fig. 3 is a schematic structural diagram of a first substrate according to an embodiment of the present invention. As shown in fig. 3, the first substrate includes 6 first middle plates, and the 6 first middle plates are arranged in 2 rows and 3 columns. The four corners of each first middle plate are provided with marks, and each mark corresponds to one mark coordinate data. For example, the marker coordinate data of the four corners of the first middle plate of the first row and first column are P1, P2, P3 and P4, respectively, the marker coordinate data of the four corners of the first middle plate of the first row and second column are P5, P6, P7 and P8, respectively, the marker coordinate data of the four corners of the first middle plate of the first row and third column are P9, P10, P11 and P12, respectively, the marker coordinate data of the four corners of the first middle plate of the second row and first column are P13, P14, P15 and P16, respectively, the marker coordinate data of the four corners of the first middle plate of the second row and second column are P17, P18, P19 and P20, the marker coordinate data of the first middle plate of the second row and third column are P21, P22, P23 and P24, respectively, wherein each marker coordinate data is in the form of coordinates (Xi, Yi is 1, and is an integer equal to or more, and the corresponding pair of markers are located on a first middle plate line, the mark corresponding to the mark coordinate data with the even number i is positioned on the other diagonal line of the first middle plate. After determining the alignment mark data of the first midplane, the center coordinates of the first midplane may be determined based on the alignment mark data of the first midplane. The center coordinate of the first middle plate is the intersection coordinate of two diagonal lines of the first middle plate, and is marked as T0j (X0j, Y0j), and j is used for representing the number of the first middle plate and is an integer which is greater than or equal to 1 and less than or equal to 6.
For example, a first midplane in a first row and a first column is taken as an example for description. The mark coordinate data of four corners of the first middle plate of the first row and first column are P1(X1, Y1), P2(X2, Y2), P3(X3, Y3) and P4(X4, Y4), respectively, and P1 and P3 are located on a diagonal line of the first middle plate of the first row and first column, and P2 and P4 are located on another diagonal line of the first middle plate of the first row and first column. The center coordinate of the first middle plate of the first row and first column is T01(X01, Y01). Wherein the content of the first and second substances,
X01＝[(X1Y3-Y1X3)(X2-X4)-(X1-X3)(X2y4-Y2X4)]/[(X1-X3)(Y2-Y4)-(Y1-Y3)(X2-X4)]，
y01 ═ [ (X1Y3-Y1X3) (Y2-Y4) - (Y1-Y3) (X2Y4-Y2X4) ]/[ (X1-X3) (Y2-Y4) - (Y1-Y3) (X2-X4) ]. By analogy, the center coordinates of each first middle plate can be calculated respectively.
It should be noted that, when the first substrate and the second substrate are attached to each other and the first substrate needs to be turned over, the center coordinate of the first middle plate in the first substrate needs to be changed, so as to ensure that the center coordinate of the first middle plate is suitable after the first substrate is turned over. For example, the center coordinates of the first midplane in the first row and the first column are taken as an example for explanation. When the first substrate is turned 180 ° in the Y-axis direction when it is attached, X01 in the center coordinates T01(X01, Y01) of the first middle plate of the first row and first column is transformed into:
X01＝[(-X1Y3+Y1X3)(-X2+X4)-(-X1+X3)(-X2y4+Y2X4))/((-X1+X3)(Y2-Y4)-(Y1-Y3)(-X2+X4)]。
determining the center coordinate of each second middle plate according to the mark coordinate data of the second substrate;
the mark coordinate data of the second substrate comprises alignment mark data of each second middle plate. And determining the center coordinate of the second middle plate according to the alignment mark data of the second middle plate. Exemplarily, fig. 4 is a schematic structural diagram of a second substrate according to an embodiment of the present invention. As shown in fig. 4, the second substrate includes 6 second middle plates, and the 6 second middle plates are arranged in 2 rows and 3 columns. And four corners of each second middle plate are provided with marks, and each mark corresponds to one mark coordinate data. The calculation process of the center coordinate of the second middle plate is similar to that of the first middle plate, and is not described herein again. The center coordinate of the second middle plate is the intersection coordinate of two diagonal lines of the second middle plate, and is marked as C0j (x0j, y0j), and j is used for representing the number of the second middle plate and is an integer which is greater than or equal to 1 and less than or equal to 6.
And determining the center coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the difference between the center coordinate of the first middle plate and the center coordinate of the oppositely arranged second middle plate.
After the center coordinates of the first midplane and the second midplane are determined, the center coordinates of each pair of the first midplane and the second midplane may be subtracted, and the difference value is used as the center coordinate deviation of the pair of the first midplane and the second midplane, so that the center coordinate deviation of each pair of the first midplane and the second midplane may be determined.
And S230, calculating deviation parameters according to the deviation of each central coordinate.
After the center coordinate deviation of each pair of the first middle plate and the second middle plate is determined, the center coordinate deviations can be used as a reference for processing, deviation parameters are obtained, the deviation parameters can take account of the difference between the center coordinate deviation of the pairs of the first middle plate and the second middle plate and the offset of the first base plate and the second base plate, then after the offset is corrected according to the deviation parameters, the deviation difference between different middle plates can be reduced when the offset directions of the alignment marks of the middle plates and the alignment marks of the base plates are different in the process of attaching the first base plate and the second base plate, or the phenomenon that the local point positions exceed the gauge can be improved when the alignment marks on the middle plates come from the first base plate and the second base plate and have the local point positions exceeding the gauge.
Optionally, when directions of center coordinate deviations of each pair of oppositely arranged first midplane and second midplane are consistent, calculating a deviation parameter according to each center coordinate deviation, comprising:
an average value is calculated from each center coordinate deviation and used as a deviation parameter.
When the directions of the central coordinate deviations of each pair of oppositely arranged first middle plate and second middle plate are consistent, the central coordinates of each pair of first middle plate and second middle plate are simultaneously biased to the same quadrant of the coordinate system, and the coaxial values of the central coordinate deviations of each pair of first middle plate and second middle plate in the coordinate system are simultaneously larger than zero or smaller than zero. Exemplarily, the center coordinates of the first middle plate and the second middle plate are deviated by a difference (X0j-X0j, Y0j-Y0j) of the center coordinate T0j (X0j, Y0j) of the first middle plate and the center coordinate C0j (X0j, Y0j) of the second middle plate. When the directions of the coordinate deviations of the centers of each pair of oppositely arranged first middle plates and second middle plates are consistent, when j is different, X0j-X0j is greater than or equal to 0, Y0j-Y0j is greater than or equal to 0, and the first middle plate is deviated towards a first quadrant relative to the second middle plate; or X0j-X0j is less than or equal to 0, Y0j-Y0j is greater than or equal to 0, and the first middle plate is deviated towards the second quadrant relative to the second middle plate; or X0j-X0j is more than or equal to 0, Y0j-Y0j is less than or equal to 0, and the first middle plate is deviated towards the fourth quadrant relative to the second middle plate; or X0j-X0j is less than or equal to 0, Y0j-Y0j is less than or equal to 0, and the first middle plate is deviated towards the third quadrant relative to the second middle plate.
When the directions of the central coordinate deviations of each pair of oppositely arranged first middle plates and second middle plates are consistent, the average value of the central coordinate deviations of each pair of first middle plates and second middle plates can be calculated, the average value is used as a deviation parameter, so that the deviation parameter can take account of the difference value between the central coordinate deviation of each pair of first middle plates and second middle plates and the offset of the first substrate and the second substrate, and then after the offset is corrected according to the deviation parameter, the deviation difference between different middle plates can be reduced in the process of attaching the first substrate and the second substrate, or the local point position overstep phenomenon can be improved when the alignment marks on the middle plates have the local point position overstep.
Optionally, when directions of center coordinate deviations of each pair of oppositely arranged first midplane and second midplane are not consistent, calculating a deviation parameter according to each center coordinate deviation, comprising:
and calculating a median according to each central coordinate deviation and using the median as a deviation parameter.
When the directions of the central coordinate deviations of each pair of oppositely arranged first middle plates and second middle plates are not consistent, the central coordinates of each pair of first middle plates and second middle plates are offset to quadrants different from the coordinate system, and at this time, the signs of the values of the central coordinate deviations of at least one pair of first middle plates and second middle plates which are coaxial in the coordinate system are different from the signs of the values of the central coordinate deviations of other pairs of first middle plates and second middle plates which are coaxial in the coordinate system. Illustratively, the center coordinates of the first middle plate and the second middle plate are deviated by a difference (X0j-X0j, Y0j-Y0j) of a center coordinate T0j (X0j, Y0j) of the first middle plate and a center coordinate C0j (X0j, Y0j) of the second middle plate. When the directions of the coordinate deviations of the centers of each pair of oppositely arranged first middle plates and second middle plates are not consistent, when j is different, the value of at least one X0j-X0j is greater than 0, and the value of at least one X0j-X0j is less than 0, at the moment, at least one first middle plate is deviated towards the positive direction of the X axis relative to the second middle plate, and at least one first middle plate is deviated towards the negative direction of the X axis relative to the second middle plate. Or at least one of Y0j-Y0j is greater than 0 and at least one of Y0j-Y0j is less than 0, when at least one first middle plate is offset in the positive direction of the Y axis relative to the second middle plate and at least one first middle plate is offset in the negative direction of the Y axis relative to the second middle plate.
When the directions of the central coordinate deviations of each pair of oppositely arranged first middle plate and second middle plate are not consistent, the median of the central coordinate deviations can be determined according to the central coordinate deviations, and the median is used as a deviation parameter, so that the deviation parameter can take account of the difference between the central coordinate deviations of a plurality of pairs of first middle plates and second middle plates and the offset of the first substrate and the second substrate, and then after the offset is corrected according to the deviation parameter, the deviation between different middle plates can be reduced when the offset directions of the alignment marks of the middle plates and the alignment marks of the substrates are different in the process of attaching the first substrate and the second substrate, or the phenomenon that the local point positions are out of specification can be improved when the local point positions of the alignment marks on the middle plates are fed from the first substrate and the second substrate.
S240, determining the offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
s250, determining a correction parameter according to the deviation parameter and the offset;
and S260, bonding the first substrate and the second substrate, and correcting according to the correction parameters.
On the basis of the above technical solutions, determining the offset between the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate includes:
determining the center coordinates of the first substrate according to the mark coordinate data of the first substrate;
the mark coordinate data of the first substrate comprises large plate alignment mark data of the first substrate. The center coordinates of the first substrate may be determined from the large panel alignment mark data of the first substrate. With continued reference to fig. 3, fig. 3 exemplarily shows that the first substrate includes 4 large board alignment mark data, M1, M2, M3 and M4, corresponding to the alignment marks of the four corners of the first substrate. Each large plate mark coordinate data is in the form of coordinates (Pm, Qm), m is an integer greater than or equal to 1 and less than or equal to 4, and in the first substrate, marks corresponding to mark coordinate data with m being an odd number are located on one diagonal of the first substrate, and marks corresponding to mark coordinate data with m being an even number are located on the other diagonal of the first substrate. The center coordinate of the first substrate is the intersection coordinate of two diagonal lines of the first substrate, and is denoted as TO (Tx, Ty). Then:
Tx＝[(-P1Q3+Q1P3)(-P2+P4)-(-P1+P3)(-P2Q4+Q2P4)]/[(-P1+P3)(Q2-Q4)-(Q1-Q3)(-P2+P4)]；
Ty＝[(P1Q3-Q1P3)(Q2-Q4)-(Q1-Q3)(P2Q4-Q2P4)]/[(P1-P3)(Q2-Q4)-(Q1-Q3)(P2-P4)]。
determining the center coordinates of the second substrate according to the mark coordinate data of the second substrate;
the mark coordinate data of the second substrate comprises large plate alignment mark data of the second substrate. And determining the center coordinates of the second substrate according to the large plate alignment mark data of the second substrate. With continued reference to fig. 4, fig. 4 also exemplarily shows that the second substrate includes 4 large plate alignment mark data, the center coordinates of the second substrate are denoted as CO (Cx, Cy), and the calculation process thereof is similar to the calculation process of the center coordinates of the first substrate, and is not repeated here.
Determining an angle deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
wherein, the first substrate and the second substrate may have an angular deviation therebetween. Exemplarily, fig. 5 is a schematic diagram of relative positions of a first substrate and a second substrate according to an embodiment of the present invention. As shown in fig. 5, the first substrate has a rotation angle with respect to the second substrate such that there is an angular deviation between the first substrate and the second substrate. When calculating the angular deviation between the first substrate and the second substrate, the inverse tangent value of the angle may be calculated according to the distances from the vertex of the first substrate to the X-axis and the Y-axis, and the angle between the vertex of the first substrate and the coordinate axis may be determined according to the inverse tangent value of the angle. And then determining the angle deviation of the first substrate and the second substrate according to the difference between the angle of the vertex of the first substrate and the coordinate axis and the angle of the vertex of the second substrate and the coordinate axis.
Optionally, determining the angular deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate includes:
determining quadrant angle deviation of the first substrate and the second substrate in each quadrant in a coordinate system according to the marking coordinate data of the first substrate and the marking coordinate data of the second substrate;
the mark coordinate data of the first substrate comprise large plate mark coordinate data of the first substrate, and each large plate mark coordinate data can calculate the inverse tangent value of the distance calculation angle from the vertex of the first substrate to the X axis and the Y axis. Exemplarily, referring to fig. 5, fig. 5 exemplarily shows that the first substrate includes 4 large board alignment mark data, respectively denoted as M1(P1, Q1), M2(P2, Q2), M3(P3, Q3), and M4(P4, Q4), corresponding to alignment mark positions of 4 vertexes of the first substrate. The second substrate includes 4 large panel alignment mark data, which are respectively denoted as M1 '(R1, S1), M2' (R2, S2), M3 '(R3, S3) and M4' (R4, S4), corresponding to the alignment mark positions of the 4 vertices of the second substrate. The angle of the vertex of the first substrate with the Y-axis can be calculated from the distances of the vertex Mn from the X-axis and the Y-axis in the first substrate. Wherein n is an integer greater than or equal to 1 and less than or equal to 4. The angle between the vertex of the first substrate and the Y axis is specifically arctan (Pm/Qm). Similarly, the angle between the vertex of the second substrate and the Y-axis may be calculated according to the distances from the vertex Mn' in the second substrate to the X-axis and the Y-axis. Wherein n is an integer greater than or equal to 1 and less than or equal to 4. The angle between the vertex of the second substrate and the Y axis is specifically arctan (Rm/Sm). The angular deviation D θ n of the first substrate and the second substrate is arctan (Pm/Qm) -arctan (Rm/Sm). For example, the angular deviation of the first and second substrates in the first quadrant is D θ 2 ═ arctan (P2/Q2) -arctan (R2/S2). By analogy, the angular deviation do 1 of the first substrate and the second substrate in the second quadrant, the angular deviation do 4 of the first substrate and the second substrate in the third quadrant, and the angular deviation do 3 of the first substrate and the second substrate in the fourth quadrant can be calculated, respectively.
And determining the angular deviation according to the quadrant angular deviation of the first substrate and the second substrate in each quadrant.
Wherein, after confirming the quadrant angular deviation of first base plate and second base plate in each quadrant, then can ask the average to the quadrant angular deviation of first base plate and second base plate in each quadrant to as the angular deviation of first base plate and second base plate, thereby make the angular deviation of first base plate and second base plate can compromise the angular deviation of different quadrants, can reduce the difference of the angular deviation of different quadrants, be favorable to improving the accuracy of the laminating counterpoint of first base plate and second base plate, and then improved the product percent of pass of base plate laminating.
And determining the offset of the first substrate and the second substrate according to the difference between the central coordinate of the first substrate and the central coordinate of the second substrate and the angle deviation.
When there is an angular deviation between the first substrate and the second substrate, the offset amount of the first substrate and the second substrate may be represented by (DX, DY, D θ), where DX is a difference between a center coordinate of the first substrate and a center coordinate of the second substrate on the X axis, that is, DX is Tx-Cx, DY is a difference between the center coordinate of the first substrate and a center coordinate of the second substrate on the Y axis, that is, DY is Ty-Cy, and D θ is an angular deviation between the first substrate and the second substrate.
In addition to the above technical solutions, after determining the correction parameter according to the deviation parameter and the offset amount, the method further includes:
bonding the third substrate and the fourth substrate, and correcting according to the correction parameters; the third substrate and the first substrate have the same production batch and model, and the fourth substrate and the second substrate have the same production batch and model.
Wherein a large number of substrates are produced in the same production batch. When the number of the substrates in the same production batch is large, data testing can be performed on only a part of the substrates in the same production batch to meet the production efficiency requirement, and only a part of the substrates have the mark coordinate data. When the same type of substrate is produced in the same production batch, the marking errors of different substrates are substantially the same. After the mark coordinate data of the first substrate and the second substrate are obtained and the correction parameters are determined, the offset of the third substrate and the offset of the fourth substrate can be directly corrected according to the correction parameters of the first substrate and the second substrate, and the third substrate and the fourth substrate are attached through the corrected offset, so that the alignment timeliness can be guaranteed, meanwhile, the deviation difference between different middle plates can be reduced when the alignment marks of the middle plates are different from the offset directions of the alignment marks of the substrates, the phenomenon that part of the middle plates have light leakage after being attached can be reduced, the accuracy of attachment alignment of the third substrate and the fourth substrate is improved, and the product yield of substrate attachment is improved. Or when the alignment mark on the middle plate has local point position overstepping, the phenomenon of the local point position overstepping is improved, so that the phenomenon that part of the middle plate has light leakage after being attached can be reduced, and the accuracy of the attaching alignment of the third substrate and the fourth substrate is improved.
It should be noted that, when the same type of substrate is produced in the same production lot, the marking errors of different substrates are substantially the same. After the mark coordinate data of the first substrate and the second substrate are obtained, the whole four-corner mark coordinate data after the plurality of first middle plates are arranged in the first substrate is close to the big plate mark coordinate data of the third substrate, the whole four-corner mark coordinate data after the plurality of second middle plates are arranged in the second substrate is close to the big plate mark coordinate data of the fourth substrate, at the moment, the big plate mark coordinate data of the third substrate can be simulated through the whole four-corner mark coordinate data after the plurality of first middle plates are arranged in the first substrate, meanwhile, the big plate mark coordinate data of the fourth substrate can be simulated through the whole four-corner mark coordinate data after the plurality of second middle plates are arranged in the second substrate, and therefore the offset of the third substrate and the fourth substrate can be determined according to the simulated big plate mark coordinate data of the third substrate and the big plate mark coordinate data of the fourth substrate. Exemplarily, with continued reference to fig. 3, the overall four-corner mark coordinate data after the arrangement of the plurality of first middle plates in the first substrate are P1, P10, P16, and P23, respectively. P1, P10, P16 and P23 may be respectively regarded as 4 large panel marker coordinate data of the third substrate. Similarly, the simulation process of the coordinate data of the 4 large plate marks of the fourth substrate is similar to the above process, and is not repeated here. In addition, when the offset includes an angle deviation, the calculation may also be performed according to the large plate mark coordinate data simulated by the third substrate and the large plate mark coordinate data simulated by the fourth substrate, and a specific calculation process thereof is similar to a calculation process of the angle deviation between the first substrate and the second substrate, and is not described herein again.
On the basis of the above technical solutions, determining a correction parameter according to the deviation parameter and the offset includes:
and determining a correction parameter according to the difference between the deviation parameter and the offset.
The offset parameter between the first midplane and the second midplane may be (DX, DY, 0), and the offset between the first substrate and the second substrate may be (DX, DY, do θ). The correction parameters (DX ', DY', D θ ') used when the first substrate and the second substrate are bonded may be DX' -DX, DY '-DY, and D θ'.
The embodiment of the invention also provides a device for bonding the substrate. Fig. 6 is a schematic structural diagram of a substrate bonding apparatus according to an embodiment of the present invention. As shown in fig. 6, the apparatus includes:
an obtaining module 10, configured to obtain mark coordinate data of the first substrate and the second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
a first determining module 20, configured to determine a deviation parameter of the first middle plate and the second middle plate and an offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
a second determining module 30, configured to determine a correction parameter according to the deviation parameter and the offset;
and the first bonding module 40 is used for bonding the first substrate and the second substrate and performing correction according to the correction parameters.
The technical scheme of the embodiment of the invention obtains the mark coordinate data of the first substrate and the mark coordinate data of the second substrate through the obtaining module, and the offset of the first substrate and the second substrate and the deviation parameter of the first middle plate and the second middle plate are calculated by a first determining module according to the mark coordinate data, then, the offset is corrected through the second determining module according to the deviation parameter, and the first attaching module attaches the first substrate and the second substrate by adopting the corrected offset, thereby not only ensuring the timeliness of alignment, meanwhile, the deviation difference between different middle plates can be reduced when the offset directions of the alignment marks of the middle plates and the alignment marks of the substrate are different, and then can reduce the phenomenon that some medium plates have the light leak after the laminating, improve the laminating counterpoint accuracy of first base plate and second base plate, and then improved the product percent of pass of base plate laminating. Or the phenomenon that the local point location is over-gauge is improved when the alignment mark on the middle plate has the local point location over-gauge in the incoming materials of the first substrate and the second substrate, so that the phenomenon that part of the middle plate has light leakage after being attached can be reduced, and the accuracy of attaching and aligning of the first substrate and the second substrate is improved.
On the basis of the technical scheme, the first determining module comprises a deviation parameter determining unit and an offset determining unit. Wherein the deviation parameter determination unit includes:
a central coordinate deviation determining subunit, configured to determine, according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate, a central coordinate deviation of each pair of oppositely-arranged first middle plate and second middle plate;
and the deviation parameter calculating subunit is used for calculating a deviation parameter according to the deviation of each central coordinate.
Optionally, when the directions of the center coordinate deviations of each pair of the first midplane and the second midplane arranged oppositely are consistent, the deviation parameter calculating subunit is specifically configured to calculate an average value according to each center coordinate deviation, and use the average value as the deviation parameter.
Optionally, when the directions of the center coordinate deviations of each pair of oppositely arranged first midplane and second midplane are not consistent, the deviation parameter calculating subunit is specifically configured to calculate a median according to each center coordinate deviation and use the median as the deviation parameter.
Optionally, the center coordinate deviation determination subunit includes:
a first central coordinate determining subunit, configured to determine a central coordinate of each first middle plate according to the mark coordinate data of the first substrate;
a second central coordinate determination subunit for determining the central coordinate of each second middle plate according to the mark coordinate data of the second substrate;
and the central coordinate deviation calculation subunit is used for determining the central coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the difference between the central coordinate of the first middle plate and the central coordinate of the oppositely arranged second middle plate.
On the basis of the above technical solution, the offset determining unit includes:
a third central coordinate determination subunit for determining the central coordinate of the first substrate according to the mark coordinate data of the first substrate;
a fourth central coordinate determination subunit for determining a central coordinate of the second substrate from the mark coordinate data of the second substrate;
an angle deviation determining subunit for determining an angle deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and an offset determining subunit, configured to determine an offset of the first substrate and the second substrate according to a difference between the center coordinate of the first substrate and the center coordinate of the second substrate and the angular deviation.
On the basis of the above technical solution, the angular deviation determination subunit includes:
a quadrant angle deviation determining subunit, configured to determine a quadrant angle deviation of the first substrate and the second substrate in each quadrant in the coordinate system according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and the angular deviation calculation subunit is used for determining the angular deviation according to the quadrant angular deviation of the first substrate and the second substrate in each quadrant.
On the basis of the above technical solutions, the apparatus further includes:
the second laminating module is used for laminating the third substrate and the fourth substrate and performing correction according to the correction parameters; the third substrate and the first substrate have the same production batch and model, and the fourth substrate and the second substrate have the same production batch and model.
On the basis of the above technical solutions, the second determining module is specifically configured to determine the correction parameter according to a difference between the deviation parameter and the offset.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in some detail by the above embodiments, the invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the invention, and the scope of the invention is determined by the scope of the appended claims.

Claims (10)

1. A method for bonding substrates, comprising:
acquiring mark coordinate data of a first substrate and a second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
determining deviation parameters of the first middle plate and the second middle plate and offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
determining a correction parameter according to the deviation parameter and the offset;
and adhering the first substrate and the second substrate, and correcting according to the correction parameters.
2. The method of claim 1, wherein determining the deviation parameter of the first middle plate and the second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining the central coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and calculating the deviation parameter according to each center coordinate deviation.
3. The method of claim 2, wherein when directions of center coordinate deviations of each pair of oppositely disposed first middle plate and second middle plate are consistent, calculating the deviation parameter according to each center coordinate deviation comprises:
and calculating an average value according to each central coordinate deviation, and taking the average value as the deviation parameter.
4. The method of claim 2, wherein when directions of center coordinate deviations of each pair of the oppositely disposed first middle plate and second middle plate are not consistent, calculating the deviation parameter according to each center coordinate deviation comprises:
and calculating a median according to the deviation of each central coordinate, and taking the median as the deviation parameter.
5. The method of claim 2, wherein determining a center coordinate deviation of each pair of oppositely disposed first and second middle plates according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining the center coordinate of each first middle plate according to the mark coordinate data of the first substrate;
determining the center coordinate of each second middle plate according to the mark coordinate data of the second substrate;
and determining the center coordinate deviation of each pair of oppositely arranged first middle plate and second middle plate according to the difference between the center coordinate of the first middle plate and the center coordinate of the oppositely arranged second middle plate.
6. The method of claim 1, wherein determining the offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining the center coordinate of the first substrate according to the mark coordinate data of the first substrate;
determining the center coordinate of the second substrate according to the mark coordinate data of the second substrate;
determining an angular deviation of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
and determining the offset of the first substrate and the second substrate according to the difference between the central coordinate of the first substrate and the central coordinate of the second substrate and the angle deviation.
7. The method of claim 6, wherein determining an angular offset of the first substrate and the second substrate based on the mark coordinate data of the first substrate and the mark coordinate data of the second substrate comprises:
determining quadrant angle deviation of the first substrate and the second substrate in each quadrant in a coordinate system according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
determining the angular deviation according to a quadrant angular deviation of the first substrate and the second substrate in each quadrant.
8. The method of claim 1, further comprising, after determining a correction parameter based on the deviation parameter and the offset amount:
attaching the third substrate and the fourth substrate, and correcting according to the correction parameters; wherein the third substrate and the first substrate have the same production lot and model, and the fourth substrate and the second substrate have the same production lot and model.
9. The method of claim 1, wherein determining a correction parameter based on the deviation parameter and the offset comprises:
and determining the correction parameter according to the difference between the deviation parameter and the offset.
10. An apparatus for bonding substrates, comprising:
the acquisition module is used for acquiring mark coordinate data of the first substrate and the second substrate; the first substrate comprises a plurality of first middle plates, the second substrate comprises a plurality of second middle plates, and each first middle plate and one second middle plate are arranged oppositely;
a first determining module, configured to determine a deviation parameter of the first middle plate and the second middle plate and an offset of the first substrate and the second substrate according to the mark coordinate data of the first substrate and the mark coordinate data of the second substrate;
the second determining module is used for determining a correction parameter according to the deviation parameter and the offset;
and the attaching module is used for attaching the first substrate and the second substrate and correcting according to the correction parameters.
CN202210811823.7A 2022-07-11 2022-07-11 Method and device for bonding substrates Pending CN115097664A (en)

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