CN115092916B - Graphene-based thermal interface material with sandwich structure and preparation method thereof - Google Patents
Graphene-based thermal interface material with sandwich structure and preparation method thereof Download PDFInfo
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- CN115092916B CN115092916B CN202210719764.0A CN202210719764A CN115092916B CN 115092916 B CN115092916 B CN 115092916B CN 202210719764 A CN202210719764 A CN 202210719764A CN 115092916 B CN115092916 B CN 115092916B
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- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/20—Graphene characterized by its properties
- C01B2204/24—Thermal properties
Abstract
The invention provides a graphene-based thermal interface material with a sandwich structure and a preparation method thereof, wherein graphene film and graphene aerogel are respectively in-plane and out-of-plane high thermal conductivity, graphene oxide and polymer fiber are used as precursors, a surface solute is inclined to be horizontally arranged by controlling a bidirectional evaporation process of moisture, an inner cavity solute is still in a randomly oriented hydrogel state, and the graphene-based thermal interface material with the sandwich structure is formed by a surface compact film and a 3D porous cavity after freeze drying and thermal reduction. Due to the double heat conduction channels in the horizontal and vertical directions, the graphene-based thermal interface material prepared by the invention can not only avoid the problem of local hot spots, but also realize the rapid transfer of heat flow from a heat source to a heat sink.
Description
Technical Field
The invention relates to the field of thermal interface materials, in particular to a graphene-based thermal interface material with a sandwich structure and a preparation method thereof.
Background
In recent years, the power density of electronic devices is remarkably improved, so that a large amount of heat is accumulated in a short time in the operation process of the electronic products, and the temperature of chips is rapidly increased. If the accumulated heat is not dissipated quickly and effectively, premature aging, abnormality or damage of the electronic components may be caused. Because the solid surface inevitably has rugged gaps, the bonding surface of the heating device and the heat sink is easy to be filled with air with poor heat conductivity, so that higher contact thermal resistance is generated. To overcome this problem, thermal interface materials are often used to fill the micro-gap between the heat source and the heat sink to reduce the interface thermal resistance and increase the heat dissipation efficiency. The heat interface material commonly used at present is mainly formed by compounding a plurality of high heat conduction ceramic fillers and a polymer matrix, and the heat conductivity is generally 0.1-5W m -1 K -1 It is difficult to satisfy the new type brought by the rapid development of electronic equipmentHeat dissipation requirements.
Graphene is formed from a single layer sp 2 Hexagonal crystal with hybridized carbon atoms arranged and its theoretical heat conductivity is as high as 5300 and 5300W m -1 K -1 The graphene is one of the materials with the best heat conduction performance, and the graphene is the strongest material in the world, and the Young modulus exceeds 1TPa. The unique physical and chemical characteristics are enriched, so that the material is considered as an optimal heat conduction candidate material, and the material is favored by a large number of heat management researchers in recent years.
The graphene film is widely applied to an in-plane thermal diffusion material due to the ultrahigh in-plane thermal conductivity so as to realize uniform distribution of heat and avoid local hot spots. Patent CN 114408908A uses graphene oxide slurry as a precursor, and the graphene oxide slurry is prepared into the material with the in-plane thermal conductivity exceeding 1100W m through processes such as coating, graphitization, hot pressing and the like -1 K -1 Is a graphene film of (a). However, the dense laminate structure results in graphene films with higher compressive modulus and poorer out-of-plane thermal conductivity, which limits their application to thermal interface materials.
Due to the typical 3D interconnection structure, graphene aerogel can extend the excellent planar thermal conductivity on 2D graphene sheets to the out-of-plane direction, and has good compressibility, and has great development prospects in the development of high-performance thermal interface materials. However, the high surface roughness makes it difficult for graphene aerogel to achieve rapid diffusion of high heat from the surface of the heat source, which is likely to cause local hot spot problems.
Based on the above consideration, if the advantages of the graphene film and aerogel are drawn, the thermal interface material with the sandwich structure, which is composed of the dense surface film and the 3D aerogel cavity, can be designed, so that the purposes of in-plane soaking and out-of-plane heat transfer can be achieved at the same time. However, no research has been reported on the construction method of this specific structure.
Disclosure of Invention
Aiming at the defects of the prior art, the invention ensures that the surface graphene is prone to be horizontally arranged by controlling the bidirectional evaporation process of water, and the inner cavity graphene is still in a randomly oriented hydrogel state, and the thermal interface material with compact surface layer and 3D porous structure of the inner cavity is obtained after freeze drying and thermal reduction, thereby constructing a double heat conduction channel in the horizontal and vertical directions in the system; meanwhile, the ultra-fine polymer fiber is used as a 1D reinforcement, and the 3D heat conduction network is further consolidated through covalent action, so that the construction of the sandwich structure is realized.
In order to achieve the above purpose, the embodiment of the invention provides a preparation method of a graphene-based thermal interface material with a sandwich structure, which comprises the following steps:
(1) Taking graphene oxide to be ultrasonically dispersed into deionized water, then adding polymer fibers, and uniformly dispersing the polymer fibers in a graphene oxide aqueous solution through mechanical stirring to obtain a mixed solution;
(2) Transferring the mixed solution to a double-sided evaporator, slowly assembling in an oven, and stopping heating when a compact film layer is formed on the surface of the slurry to obtain an assembly formed by a compact film and hydrogel;
(3) And performing vacuum freeze drying on the assembly, performing heat treatment under an argon atmosphere, and applying a certain pressure to obtain the thermal interface material with the sandwich structure.
Preferably, the ultrasonic dispersion time in the step (1) is 30-120 min.
Preferably, the polymer fiber in the step (1) is one or more of polypropylene fiber, polyacrylonitrile fiber, polyimide fiber, polyvinyl alcohol fiber, polyester fiber, aramid fiber, aromatic polyamide fiber and asphalt fiber. The surfaces of the high polymer fibers contain rich active groups, a strong affinity effect exists between the high polymer fibers and graphene oxide, and covalent crystals can be formed between the high polymer fibers and the graphene oxide in the heat treatment process, so that a uniform and firm 3D frame is constructed in a system, and the heat conduction performance and the mechanical strength of a sample are improved.
Preferably, the rotation speed of the mechanical stirring in the step (1) is 200-20000 r/min.
Preferably, in the step (2), the diameter of the double-sided evaporator is 50mm, the substrate is a porous base material, and the pore size is 0.2-0.5 μm. The porous substrate allows smaller sized water molecules to pass through while the movement of graphene and polymer fibers is hindered.
Preferably, the assembly temperature in step (2) is 30 to 60 ℃.
Preferably, the heat treatment temperature in the step (3) is 1000-3000 ℃ and the time is 1-3 h. The high-temperature treatment can eliminate oxygen-containing or nitrogen-containing groups, repair crystal defects, promote rearrangement of interfacial carbon atoms and form an integrated all-carbon composite material.
Preferably, the pressure applied in step (3) is between 0 and 100KPa. The application of a certain pressure can effectively remove low heat-conducting medium (air) in the inner cavity of the aerogel film, and increase the phonon transmission path.
Preferably, the thickness of the graphene-based thermal interface material with the sandwich structure in the step (3) is regulated by changing the dosage of the mixed solution or the mass concentration of the solute in the step (1).
Based on an invention general conception, the invention also provides the graphene-based thermal interface material with the sandwich structure, wherein the in-plane thermal conductivity and the out-of-plane thermal conductivity of the graphene-based thermal interface material are respectively 8-160 Wm -1 K -1 And 1 to 15. 15W m -1 K -1 。
The principle of the invention is as follows: in the initial stage of evaporation assembly, graphene oxide and polymer fibers are randomly oriented in an aqueous solution due to a large electrostatic repulsion effect, so that the maximum volume exclusion is realized. As evaporation proceeds, the concentration of the solution gradually increases. At this time, each component tends to decrease the exclusion volume to increase the translational degree of freedom. Driven by the volume exclusion effect, graphene oxide sheets with typical 2D structures are forced to be arranged horizontally, preferentially forming a layer of dense film structure on the upper and lower surfaces of the slurry. Most of the solutes still remain in the original random distribution, as the evaporation process does not proceed thoroughly. Therefore, after freeze drying and thermal reduction, the graphene-based thermal interface material with a sandwich structure, which is composed of the surface film layer and the 3D porous cavity, is obtained. In addition, the polymer fiber is used as a 1D reinforcement, covalent connection is formed between the polymer fiber and the graphene through interfacial carbon atom rearrangement at a high temperature stage, and heat flow transmission and energy release are further promoted, so that excellent heat conduction and mechanical properties are given to the thermal interface material.
Compared with the prior art, the invention has the following beneficial effects:
1. the mutual contact between the components can be promoted by the bidirectional thermal motion of the water molecules, so that the interface coupling effect is enhanced, and the integrated all-carbon composite material is formed in the heat treatment process.
2. The polymer fibers are uniformly dispersed and entangled in the system to form a stable and firm 3D frame, and then covalent bonding is formed between the polymer fibers and the graphene sheets in the heat treatment stage, so that the structural stability of the thermal interface material is enhanced.
3. The dense surface film structure protects the fragile porous cavities like two solid "shields" and thus gives the thermal interface material excellent processability, making it easy to complete the encapsulation process.
4. In the typical sandwich structure, the graphite surface layers which are orderly arranged in the horizontal direction are beneficial to the uniform distribution of the hot spot temperature so as to avoid the problem of local overheating; the 3D porous network of the inner cavity provides the thermal interface material with good compressibility while also assuming rapid transfer of heat flow from the heat source to the heat sink.
5. The invention has simple process and wide sources of used raw materials, and provides an effective way for developing high-performance graphene-based thermal interface materials.
Drawings
FIG. 1 is a flow chart of an experiment of an embodiment of the present invention;
FIG. 2 is a high definition photograph of a graphene-based thermal interface material according to an embodiment of the present invention;
fig. 3 is a scanning electron microscope image of a graphene-based thermal interface material according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved more apparent, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
Unless defined otherwise, all technical and scientific terms used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the scope of the present invention.
Unless otherwise specifically indicated, the various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or may be prepared by existing methods.
Thermal interface materials are commonly used to fill the micro-gap between the heat source and the heat sink to reduce the interface thermal resistance and increase the heat dissipation efficiency. The heat interface material commonly used at present is mainly formed by compounding a plurality of high heat conduction ceramic fillers and a polymer matrix, and the heat conductivity is generally 0.1-5W m -1 K -1 It is difficult to meet the new heat dissipation requirements brought by the rapid development of electronic devices. Graphene is formed from a single layer sp 2 Hexagonal crystal with hybridized carbon atoms arranged and its theoretical heat conductivity is as high as 5300 and 5300W m -1 K -1 The graphene film is a material with the best heat conducting performance, and has ultrahigh in-plane thermal conductivity, so that the graphene film is widely applied to in-plane thermal diffusion materials to realize uniform heat distribution and avoid local hot spots. However, the dense laminated structure results in a graphene film with higher compression modulus and poorer out-of-plane heat conduction capability, and the higher surface roughness makes it difficult for graphene aerogel to realize rapid diffusion of high heat on the surface of a heat source, which is easy to cause local hot spot problems.
The invention provides a graphene-based thermal interface material with a sandwich structure and a preparation method thereof.
As shown in fig. 1, an embodiment of the present invention provides an experimental flowchart of a preparation method of a graphene-based thermal interface material with a sandwich structure.
Example 1
0.35g of graphene oxide is added into 100ml of deionized water, ultrasonic dispersion is carried out for 60min, 0.15g of polymer fiber is added, and the polymer fiber is uniformly dispersed in the graphene oxide solution through mechanical stirring. Transferring the mixed solution into a double-sided evaporator, slowly assembling in a 40 ℃ oven until the slurry surface formsIn the case of dense film layers, the heating is stopped. And freeze-drying the obtained assembly, and then performing heat treatment at 1000 ℃ for 2 hours in an argon atmosphere to obtain the graphene-based thermal interface material with the sandwich structure. The thermal conductivity of the thermal interface material was 7.6W m in-plane and out-of-plane respectively -1 K -1 And 1.1W m -1 K -1 。
Example 2
The difference from example 1 is that: the thermal interface material was heat treated at 3000 ℃ for 2 hours under argon atmosphere, and tested to have in-plane and out-of-plane thermal conductivities of 26.8W m, respectively -1 K -1 And 2.5. 2.5W m -1 K -1 。
Example 3
0.35g of graphene oxide is added into 100ml of deionized water, ultrasonic dispersion is carried out for 60min, 0.15g of polymer fiber is added, and the polymer fiber is uniformly dispersed in the graphene oxide solution through mechanical stirring. And transferring the mixed solution to a double-sided evaporator, slowly assembling in an oven at 40 ℃, and stopping heating when a compact film layer is formed on the surface of the slurry. And freeze-drying the obtained assembly, and then carrying out heat treatment for 2 hours at 3000 ℃ in an argon atmosphere to obtain the graphene-based thermal interface material with the sandwich structure. The thermal interface material was subjected to a pressure of 2KPa to a compression of about 25% and tested for in-plane and out-of-plane thermal conductivities of 40.3W m, respectively -1 K -1 And 3.5. 3.5W m -1 K -1 。
Example 4
The difference from example 3 is that: the thermal interface material was subjected to a pressure of 10KPa to a compression of about 50% and tested for in-plane and out-of-plane thermal conductivities of 72.1W m, respectively -1 K -1 And 14.5. 14.5W m -1 K -1 。
Example 5
The difference from example 3 is that: the thermal interface material was subjected to a pressure of 60KPa to a compression of about 75%, and tested for in-plane and out-of-plane thermal conductivities of 158.4W m, respectively -1 K -1 And 3.6. 3.6W m -1 K -1 。
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.
Claims (6)
1. The preparation method of the graphene-based thermal interface material with the sandwich structure is characterized by comprising the following steps of:
(1) Taking graphene oxide to be dispersed in deionized water by ultrasonic, adding polymer fibers, and mechanically stirring to uniformly disperse the graphene oxide in a graphene oxide aqueous solution to obtain a mixed solution;
(2) Transferring the mixed solution to a double-sided evaporator, slowly assembling in an oven, and stopping heating when a compact film layer is formed on the surface of the slurry to obtain an assembly formed by a compact film and hydrogel;
(3) Vacuum freeze-drying the assembly, performing heat treatment under argon atmosphere, and applying certain pressure to obtain the graphene-based thermal interface material with the sandwich structure;
the assembling temperature in the step (2) is 30-60 ℃;
the pressure applied in the step (3) is 0-100 Kpa;
the diameter of the double-sided evaporator in the step (2) is 50mm, the substrate is a porous base material, and the pore size is 0.2-0.5 mu m;
the heat treatment temperature in the step (3) is 1000-3000 ℃ and the time is 1-3 h.
2. The preparation method of claim 1, wherein the ultrasonic dispersion time in the step (1) is 30-120 min.
3. The method according to claim 1, wherein the polymer fiber in the step (1) is one or more of polypropylene fiber, polyacrylonitrile fiber, polyimide fiber, polyvinyl alcohol fiber, polyester fiber, aramid fiber, aromatic polyamide fiber, and asphalt fiber.
4. The preparation method of claim 1, wherein the rotation speed of mechanical stirring in the step (1) is 200-20000 r/min.
5. The method according to claim 1, wherein the thickness of the graphene-based thermal interface material having a sandwich structure is controlled by changing the amount of the mixed solution in step (1) or the mass concentration of the solute thereof.
6. The graphene-based thermal interface material with a sandwich structure obtained by the preparation method according to any one of claims 1 to 5, wherein the in-plane and out-of-plane thermal conductivities of the graphene-based thermal interface material are 8-160 wm respectively -1 K -1 And 1 to 15W m -1 K -1 。
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105542728A (en) * | 2016-01-24 | 2016-05-04 | 北京大学 | Method for preparing vertical orientation graphene sheet/high polymer thermal interface material |
| CN109956466A (en) * | 2019-04-10 | 2019-07-02 | 湖南大学 | It is a kind of to have both direction and the graphene-based composite membrane of thickness direction high heat conductance and preparation method thereof in face |
| CN110357076A (en) * | 2019-07-17 | 2019-10-22 | 常州富烯科技股份有限公司 | A kind of grapheme foam and preparation method thereof, graphene carbon composite material and preparation method |
| CN110655624A (en) * | 2019-10-18 | 2020-01-07 | 东南大学 | Anisotropic structure color hydrogel film doped based on reduced graphene oxide and preparation method and application thereof |
| CN110951114A (en) * | 2019-11-24 | 2020-04-03 | 上海大学 | Three-dimensional carbon fiber graphene aerogel high-molecular composite material and preparation method thereof |
| CN114058081A (en) * | 2021-12-21 | 2022-02-18 | 深圳清华大学研究院 | Preparation method and application of graphene-based heat-conducting and heat-dissipating composite material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9605193B2 (en) * | 2012-10-19 | 2017-03-28 | The Hong Kong University Of Science And Technology | Three dimensional interconnected porous graphene-based thermal interface materials |
| US10005099B2 (en) * | 2015-07-20 | 2018-06-26 | Nanotek Instruments, Inc. | Production of highly oriented graphene oxide films and graphitic films derived therefrom |
| CN107963623A (en) * | 2016-10-18 | 2018-04-27 | 中国科学院山西煤炭化学研究所 | The method for preparing carbon material-graphene composite material film |
-
2022
- 2022-06-23 CN CN202210719764.0A patent/CN115092916B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105542728A (en) * | 2016-01-24 | 2016-05-04 | 北京大学 | Method for preparing vertical orientation graphene sheet/high polymer thermal interface material |
| CN109956466A (en) * | 2019-04-10 | 2019-07-02 | 湖南大学 | It is a kind of to have both direction and the graphene-based composite membrane of thickness direction high heat conductance and preparation method thereof in face |
| CN110357076A (en) * | 2019-07-17 | 2019-10-22 | 常州富烯科技股份有限公司 | A kind of grapheme foam and preparation method thereof, graphene carbon composite material and preparation method |
| CN110655624A (en) * | 2019-10-18 | 2020-01-07 | 东南大学 | Anisotropic structure color hydrogel film doped based on reduced graphene oxide and preparation method and application thereof |
| CN110951114A (en) * | 2019-11-24 | 2020-04-03 | 上海大学 | Three-dimensional carbon fiber graphene aerogel high-molecular composite material and preparation method thereof |
| CN114058081A (en) * | 2021-12-21 | 2022-02-18 | 深圳清华大学研究院 | Preparation method and application of graphene-based heat-conducting and heat-dissipating composite material |
Non-Patent Citations (1)
| Title |
|---|
| 石墨烯基环氧树脂复合热界面材料的制备及热性能;唐波等;硅酸盐学报(01);132-137 * |
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