CN115088175A

CN115088175A - Power conversion device and method for manufacturing power conversion device

Info

Publication number: CN115088175A
Application number: CN202180013907.XA
Authority: CN
Inventors: 小岛和成
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2020-02-27
Filing date: 2021-01-11
Publication date: 2022-09-20
Also published as: JP2021136794A; WO2021171801A1; JP7230852B2

Abstract

A power conversion device includes an input terminal block (70), a first capacitor unit (40), a second capacitor unit (50), and a case (10) that houses the above components. The housing has a first housing (11) and a second housing (12). The first case has a first capacitor unit fixed thereto, and the second case has a second capacitor unit fixed thereto in a state where the input terminal block is connected thereto. The first housing is provided with a connector opening (11c) into which an input connector section (73) provided on the input terminal block is inserted. The first capacitor unit and the second capacitor unit have a first opposing portion (43a) and a second opposing portion (51a) that are arranged in the insertion direction of the input connector portion and that face each other. The shortest separation distance (L1) in the insertion direction of the two facing portions is greater than the insertion amount (L2) of the input connector portion into the connector opening.

Description

Power conversion device and method for manufacturing power conversion device

Citation of related applications

The present application is based on the patent application No. 2020-.

Technical Field

The present disclosure relates to a power conversion device that converts direct current into alternating current or converts the magnitude of voltage, and a method for manufacturing the power conversion device.

Background

Patent document 1 describes a power conversion device including an input terminal block, a capacitor, a semiconductor module, a case, and the like.

The input terminal block has a connector portion connected to an external battery connector, and is electrically connected to the capacitor. The semiconductor module converts electric power input through the input terminal block from direct current to alternating current. The capacitor smoothes voltage pulsation of the power. The case accommodates the input terminal block, the capacitor, and the semiconductor module, and has an opening into which the connector portion is inserted. The housing is divided into a first housing having the opening and a second housing fastened to the first housing.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 6308091

Disclosure of Invention

In a structure in which a semiconductor module is fixed to a first case, a capacitor is fixed to a second case, and then the two cases are fastened and combined, if an input terminal block is mounted on the capacitor and unitized, the following technical problems occur. That is, with the unitization, the input terminal block is held in the second housing together with the capacitor. In this case, the connector portion held in the second housing needs to be inserted into the opening of the first housing.

However, a semiconductor module is fixed in the first case, and a capacitor is fixed in the second case. Therefore, at the time point when the connector portion is provided in the opening portion and is to be inserted, the semiconductor module and the capacitor may interfere with each other, and the above-described arrangement may not be performed.

In addition, if such an input terminal block is constituted by two parts of a first part having a connector portion and a second part electrically connected to the capacitor, it is possible to hold the first part in the first housing and the second part in the second housing. As a result, the first connector portion can be provided in the opening portion without causing the interference. However, in this case, the number of parts of the input terminal block increases.

An object of the disclosure is to provide a power conversion device and a manufacturing method of the power conversion device capable of reducing the number of components of a terminal block.

A power conversion device according to an aspect of the present disclosure includes:

a terminal block electrically connected to an external battery or a motor;

a first electrical component and a second electrical component for converting a supply power from a battery from a direct current to an alternating current or converting a magnitude of a voltage of the supply power; and

a housing that accommodates the first electrical component, the second electrical component, and the terminal block,

the housing has a first housing and a second housing,

the first housing has an opening into which a part of the terminal block is inserted and fixed with a first electric component,

a second electric component which is combined with the first housing and is electrically connected with the terminal block is fixed on the second housing,

the first and second electric components have opposing portions arranged in an insertion direction in which a part of the terminal block is inserted into the opening portion and opposing each other,

the facing part of the first electrical component is a first facing part, the facing part of the second electrical component is a second facing part,

the shortest distance in the insertion direction between the first facing portion and the second facing portion is greater than the amount of insertion from the inside of the housing into the opening portion into the terminal block.

According to the power conversion device, the shortest distance between the two electrical components in the insertion direction is longer than the insertion amount of the terminal block into the opening. Therefore, at the time point when a part of the terminal block is provided in the opening and is about to be inserted, the two electrical components can be prevented from interfering with each other. Therefore, it is not necessary to divide the terminal block and hold the terminal block in the two cases, and a part of the terminal block can be inserted into the opening. That is, the number of components of the terminal block can be reduced.

According to a method for manufacturing a power conversion device according to an aspect of the present disclosure, the power conversion device includes:

a terminal block electrically connected to an external battery or a motor;

the housing has a first housing and a second housing,

the second housing is fastened to the first housing, and a second electrical component electrically connected to the terminal block is fixed to the second housing,

the shortest separation distance in the insertion direction of the first facing portion and the second facing portion is greater than the insertion amount of the terminal block from the inside of the housing to the opening portion,

the method for manufacturing the power conversion device includes:

a first fixing step of fixing the first electrical component to the first housing;

a second fixing step of electrically connecting a second electrical component to the terminal block and fixing the second electrical component to the second housing;

a pre-arrangement step of arranging the first housing and the second housing in a manner of relatively shifting in the insertion direction from a position where the terminal block can be fastened so that the entire terminal block is located outside the opening portion after the first fixing step and the second fixing step;

an insertion step of inserting a part of the terminal block into the opening by relatively moving the first housing and the second housing in an insertion direction after the provision step; and

and a housing fastening step of fastening the first housing and the second housing to each other after the insertion step.

In the power converter which is the subject of the above-described manufacturing method, the shortest separation distance of the two electrical components in the insertion direction is larger than the insertion amount of the terminal block into the opening. Therefore, the first electrical component and the second electrical component can be prevented from interfering with each other when the provisioning process is performed. Therefore, it is not necessary to divide the terminal block and hold the terminal block in the two cases, and a part of the terminal block can be inserted into the opening. That is, the number of components of the terminal block can be reduced.

Drawings

Fig. 1 is a diagram showing a circuit configuration of a power conversion device according to a first embodiment.

Fig. 2 is a sectional view of the power conversion device of the first embodiment.

Fig. 3 is a perspective view showing a state in which the first capacitor unit, the second capacitor unit, and the input terminal block are connected to each other in the first embodiment.

Fig. 4 is an exploded view of the power conversion device shown in fig. 2.

Fig. 5 is a flowchart showing steps of a manufacturing process of the method of manufacturing the power converter according to the first embodiment.

Fig. 6 is a diagram showing a state in a pre-arrangement process of the power converter according to the first embodiment.

Fig. 7 is a diagram showing a state in the insertion process of the power converter of the first embodiment.

Detailed Description

Hereinafter, a plurality of embodiments for carrying out the present disclosure will be described with reference to the drawings. In each of the embodiments, the same reference numerals are given to functionally and/or structurally corresponding portions, and redundant description thereof may be omitted. In the case where only a part of the structure is described in each embodiment, the other embodiments described above can be applied to the other parts of the structure.

The portions explicitly described as being capable of being specifically combined in each embodiment can be combined with each other. Note that, as long as the combination does not cause any hindrance, the embodiments and the modified examples, and the modified examples can be partially combined with each other even if the combinations are not explicitly shown as combinable.

Hereinafter, the vertical direction in a state where the power converter is mounted on the vehicle is referred to as the z direction, and a direction orthogonal to the z direction is referred to as the x direction. In addition, a direction orthogonal to both the z direction and the x direction is represented as a y direction. The arrow in the figure indicating the z direction is located on the upper side in the vehicle mounted state.

(first embodiment)

First, an outline of a circuit formed by the power converter 1 will be described with reference to fig. 1.

The power conversion device 1 of the present embodiment is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. The power conversion device 1 converts a dc voltage supplied from a battery 2 (dc power supply) mounted in a vehicle into a three-phase ac voltage, and outputs the three-phase ac voltage to a three-phase ac motor 3 (in-vehicle motor). The motor 3 functions as a travel drive source of the vehicle. The power converter 1 may convert the electric power generated by the motor 3 into a direct current to charge the battery 2. The power conversion device 1 can perform bidirectional power conversion.

As shown in fig. 1, the power conversion device 1 includes a control substrate 30, a semiconductor module 21, a capacitor 40C, a capacitor 50C, a reactor 60L, an input terminal block 70, and an output terminal block 80.

The semiconductor module 21 has a switching element 21i, a terminal connected to the switching element 21i, and a molding material. The molding material is made of resin for molding the switching element 21 i. The terminals include a P terminal, an N terminal, and a signal terminal 21s, which will be described later. In the example shown in fig. 1, one semiconductor module 21 has two switching elements 21i, and one upper and lower arm circuit is formed.

The power conversion apparatus 1 includes a plurality of semiconductor modules 21. One of the plurality of semiconductor modules 21 is connected to reactor 60L. The semiconductor module 21 connected to the reactor 60L is a DC-DC converter and functions as a converter circuit for boosting a DC voltage. The other semiconductor modules 21 are DC-AC converters and function as inverter circuits that convert input DC power into three-phase AC power of a predetermined frequency and output the three-phase AC power to the motor 3. The inverter circuit also has a function of converting ac power generated by the motor 3 into dc power.

The semiconductor modules 21 as inverter circuits are provided for the three phases of the motor 3, respectively.

As the switching element 21i, an n-channel type Insulated Gate Bipolar Transistor (IGBT) is used. The collector of the IGBT on the upper arm is connected to the high-potential power line Hi. The emitter of the IGBT of the lower arm is connected to the low potential power line Lo. Further, the emitter of the IGBT of the upper arm and the collector of the IGBT of the lower arm are connected to each other.

Capacitor 40C is connected between a wire connecting reactor 60L and battery 2 and low-potential power line Lo. The capacitor 40C is included in the converter circuit. The capacitor 40C functions to store electric charge for boosting. The capacitor 40C is accommodated in at least one of a first capacitor unit 40 and a second capacitor unit 50 described later.

The reactor 60L boosts the voltage of the battery 2 in accordance with the switching operation of the semiconductor module 21 functioning as a converter circuit.

The capacitor 50C is connected between the high-potential power line Hi and the low-potential power line Lo. The capacitor 50C is connected in parallel with the semiconductor module 21. The capacitor 50C smoothes the dc current boosted by the converter circuit. The capacitor 50C accumulates charges of the boosted dc voltage.

The control board 30 includes a control unit and a drive circuit unit (driver). The control unit generates a drive command for operating the switching element 21i based on a torque request input from the host ECU and signals detected by various sensors. The control unit includes a microcomputer (microcomputer) and outputs a PWM signal as a drive command. The driver controls the on/off operation of the switching element 21i in accordance with a drive command output from the control unit.

Specific examples of the various sensors include a current sensor 81, a voltage sensor, and a rotation angle sensor. The current sensor 81 detects phase currents flowing through windings of the respective phases of the motor 3. The rotation angle sensor detects a rotation angle of the rotor of the motor 3.

Next, various units and components constituting the power conversion device 1 will be described with reference to fig. 2 to 4.

The power conversion device 1 includes a case 10, a semiconductor unit 20, a control substrate 30, a first capacitor unit 40, a second capacitor unit 50, a reactor unit 60, an input terminal block 70, and an output terminal block 80. In fig. 2 to 4, the output terminal block 80 is not shown.

The housing 10 is made of metal, and is formed by die casting using, for example, an aluminum-based material. The case 10 internally houses the semiconductor unit 20, the control board 30, the first capacitor unit 40, the second capacitor unit 50, the reactor unit 60, the input terminal block 70, and the output terminal block 80.

The housing 10 is divided into two, a first housing 11 and a second housing 12. The first case 11 and the second case 12 are fastened by a bolt B1. The division surfaces of the first case 11 and the second case 12 are perpendicular to the z direction. A first flange surface 11f is formed in the first housing 11, and a second flange surface 12f is formed in the second housing 12. The first flange face 11f and the second flange face 12f abut against each other. The first flange surface 11f and the second flange surface 12f correspond to the dividing surfaces. The first flange surface 11f and the second flange surface 12f are each flat and open perpendicularly to the z direction, and the fastening direction of the bolt B1 is the z direction.

The opening 11b formed in the lower side of the first housing 11 and the opening 12b formed in the upper side of the second housing 12 communicate with each other by the fastening. The first flange surface 11f and the second flange surface 12f are shaped to extend annularly around the z direction so as to surround the opening 11b and the opening 12 b.

An opening 11a that opens upward is formed in the first housing 11. The opening 11a is covered by a first cover 13 fastened to the first housing 11 with a bolt B2. An opening 12a that opens downward is formed in the second housing 12. The opening 12a is covered by the second cover 14 fastened to the second case 12 with a bolt B3.

The first housing 11 is formed with a connector opening 11c and a pipe opening 11 d. An input connector portion 73 described later is inserted and disposed in the connector opening portion 11c, and a refrigerant pipe 23 described later is inserted and disposed in the pipe opening portion 11 d. The connector opening 11c opens toward one side in the x direction. The pipe opening 11d is open toward the other side in the x direction. The cylindrical portion 110 of the first housing 11, which forms the opening 11c for the connector, has a cylindrical shape extending in the x direction.

The semiconductor unit 20 has the semiconductor module 21, the cooler, the elastic member 24, and the base member 25 described in fig. 1.

The cooler cools the semiconductor module 21, has a heat exchange unit 22 and a refrigerant pipe 23, and forms a part of a circulation path through which a liquid refrigerant circulates. The refrigerant pipe 23 includes a refrigerant pipe for inflow of the refrigerant from the outside of the semiconductor unit 20 and a refrigerant pipe for outflow of the refrigerant to the outside of the semiconductor unit 20.

The heat exchange portion 22 communicates with inflow and outflow refrigerant pipes 23. The heat exchanger 22 is in contact with the semiconductor module 21 via an insulator having good thermal conductivity, and cools the semiconductor module 21 whose temperature has increased due to heat generation of the switching element 21 i.

The plurality of semiconductor modules 21 are arranged in the x direction and stacked. The heat exchanging portion 22 is disposed between the adjacent semiconductor modules 21. That is, the plurality of heat exchanging units 22 and the semiconductor modules 21 are alternately stacked. An elastic force generated by elastic deformation of the elastic member 24 is applied to the stacked body including the plurality of semiconductor modules 21 and the heat exchange unit 22 through the base member 25. The semiconductor module 21 and the heat exchanger 22 are pressed against each other by the elastic force.

As described above, the terminals of the semiconductor module 21 include the P terminal, the N terminal, and the signal terminal 21s, which are not shown. The P terminal is connected to the emitter of the switching element 21i constituting the upper arm. The P terminal is connected to one end of a first P bus bar 42P described later, and the other end of the first P bus bar 42P is connected to an electrode on the high potential side of the capacitor 50C. That is, the P terminal has the same potential as the high-potential power line Hi.

The N terminal is connected to a collector of the switching element 21i constituting the lower arm. The N terminal is connected to one end of the first N bus 42N, and the other end of the first N bus 42N is connected to a low potential side electrode of the capacitor 50C. That is, the N terminal has the same potential as the low-potential power line Lo.

The signal terminal 21s is connected to the gate of the switching element 21 i. The signal terminals 21s are mounted (e.g., insert-mounted) on the control board 30. The signal terminals 21s extend from the molding material toward the upper side. In addition, the P-terminal and the N-terminal extend from the molding material toward the lower side.

The control board 30 is disposed above the semiconductor unit 20 in the z direction and at a position facing the opening 11a of the first housing 11. The control board 30 has a connector 31 connected to an external ECU. A part of the connector 31 is exposed from an opening, not shown, formed in the first cover 13. The control board 30 acquires various vehicle information and vehicle exterior information from the external ECU via the connector 31.

The control board 30 includes a processor for executing arithmetic processing according to a predetermined program, and a memory in which the program and the like are stored. For example, the processor and the memory described above are packaged as a microcomputer (microcomputer). The control board 30 has a drive circuit that outputs a drive signal to the switching element 21 i. The microcomputer instructs the operation of the semiconductor module 21 based on various information acquired through the connector 31. Based on the instruction, the drive circuit outputs a drive signal.

Here, the capacitance required for the capacitor 50C shown in fig. 1 is extremely large. Therefore, the required capacitance is actually satisfied by connecting the plurality of capacitors 50C in parallel.

The plurality of capacitors 50C are arranged to be divided into the first capacitor unit 40 and the second capacitor unit 50. Further, the number of capacitors 50C included in the first capacitor unit 40 is set to be larger than the number of capacitors 50C included in the second capacitor unit 50.

The first capacitor unit 40 has a first capacitor case 41, a plurality of capacitors 50C, a first P bus bar 42P, a first N bus bar 42N, and an electrical insulator 43. The plurality of capacitors 50C are housed inside the first capacitor case 41. The first capacitor case 41 is filled with a resin material (not shown) that covers the entire capacitor 50C.

A high-potential-side electrode of the capacitor 50C and an emitter of the switching element 21i are connected to the first P bus line 42P. The low potential side electrode of the capacitor 50C and the collector of the switching element 21i are connected to the first N bus bar 42N.

The first P busbar 42P and the first N busbar 42N are plate-shaped and have plate surfaces (opposing plate surfaces) opposing each other. A plate-like electrical insulator 43 is disposed between the opposing plate surfaces. The electrical insulator 43 is made of resin having electrical insulation properties.

The second capacitor unit 50 has a second capacitor case 51, a plurality of capacitors 50C, a second P bus bar 52P, and a second N bus bar 52N. The plurality of capacitors 50C are housed inside the second capacitor case 51. The second capacitor case 51 is filled with a resin material (not shown) that covers the entire capacitor 50C. One ends of second P bus bar 52P and second N bus bar 52N are connected to first P bus bar 42P and first N bus bar 42N included in first capacitor unit 40.

The capacitor 50C is a film capacitor formed by winding a film. The size and number of capacitors 50C are adjusted by adjusting the width of the film, the number of turns, and the number of film capacitors used. Further, by adjusting the configuration of the plurality of capacitors 50C described above, it is achieved that the first capacitor case 41 and the second capacitor case 51 are formed into desired shapes. In addition, as the capacitor 40C, a film capacitor in a shape in which a film is wound is used, similarly to the capacitor 50C.

All the film capacitors included in the first capacitor unit 40 are arranged so that the winding center line thereof faces the y direction. All the film capacitors included in the second capacitor unit 50 are arranged so that the winding center line thereof faces the z direction. In summary, the winding center line of the first capacitor unit 40 is orthogonal to the winding center line of the second capacitor unit 50.

The reactor unit 60 has a reactor case 61 and a reactor 60L. The reactor 60L is housed inside the reactor case 61. The reactor unit 60 is disposed below the semiconductor unit 20 in the z direction and at a position facing the opening 12a of the second case 12. Further, the reactor unit 60 is also disposed below the first capacitor unit 40 and the second capacitor unit 50 in the z direction. One end of the reactor 60L is connected to the semiconductor module 21 via a bus bar not shown. The other end of the reactor 60L is connected to the high potential side of the battery 2 via the input terminal block 70.

The input terminal block 70 includes a main body case 71, an input P bus 72P, an input N bus 72N, and an input connector section 73. The main body case 71 is made of an electrically insulating resin, and holds the input P bus 72P, the input N bus 72N, and the input connector unit 73.

The input connector portion 73 has a connector fitting portion and a connector terminal. The connector fitting portion is formed integrally with the main body housing 71 and made of resin, and is fitted with the fitting portion of the external connector. The external connector is mounted on the front end of a cable connected to the battery 2. The connector terminal is disposed in the connector fitting portion and electrically connected to a terminal of the external connector in accordance with the fitting.

Input P bus 72P is connected to reactor 60L, and input N bus 72N is connected to second N bus 52N. Further, although the power conversion device 1 of the present embodiment includes the reactor unit 60, the reactor unit 60 may be eliminated. In this case, input P bus 72P is connected to second P bus 52P.

The output terminal block 80 includes a current sensor 81, a main body case not shown, an output bus bar, and an output connector portion. The main body case is made of resin having electrical insulation properties, and holds the output bus bar and the output connector section. The output connector portion is connected to a cable connector connected to the motor 3.

The above-described x-direction, y-direction, and z-direction are defined in the following manner. The z direction is a direction perpendicular to the plate surface of the control board 30. The x direction is a direction in which the semiconductor unit 20 and the second capacitor unit 50 are arranged along the plate surface. . The y-direction is a direction perpendicular to the z-direction and the x-direction.

The first capacitor unit 40 corresponds to a "first electrical component" fixed to the first case 11. The second capacitor unit 50 corresponds to a "second electrical component" fixed to the second case 12 in a state where the input terminal block 70 is electrically connected. Therefore, in order to prevent the first capacitor unit 40 and the second capacitor unit 50 from interfering with each other at the time point when the connector portion of the input connector portion 73 is set at the relative position of the connector opening 11c and is just about to be inserted, the following configuration is adopted in the present embodiment.

In the following description, a direction (x direction) in which the input connector portion 73, which is a part of the input terminal block 70, is inserted into the connector opening 11c is referred to as an insertion direction. The first capacitor unit 40 and the second capacitor unit 50 have a first facing portion 43a and a second facing portion 51a that are aligned in the insertion direction and face each other.

Specifically, the first opposing portion 43a, which is the opposing portion of the first capacitor unit 40, is a portion of the electrical insulator 43 that opposes the second capacitor case 51. The second opposing portion 51a, which is an opposing portion of the second capacitor unit 50, is a portion of the second capacitor case 51 that opposes the electrical insulator 43. The first facing portion 43a and the second facing portion 51a are flat and spread perpendicularly to the insertion direction.

The shortest separation distance L1 (see fig. 2) in the insertion direction of the first facing portion 43a and the second facing portion 51a is greater than the insertion amount L2 (see fig. 2) of the input connector portion 73 into the connector opening 11 c.

Next, a method for manufacturing the power conversion device 1 will be described with reference to fig. 5 and 6. In fig. 5, the start is denoted by S and the end is denoted by E.

First, the jobs of steps S11, S12 and the jobs of steps S21, S22 of fig. 5 are executed, respectively.

In the first assembly process of step S11, the semiconductor unit 20, the control substrate 30, and the first capacitor unit 40 are manufactured. Thereafter, in step S11, the semiconductor unit 20, the control substrate 30, and the first capacitor unit 40 are connected to each other. Thereby, the first assembly U1 shown in fig. 6 is manufactured.

Specifically, the semiconductor module 21, the heat exchange portion 22, and the refrigerant pipe 23 are mutually assembled to manufacture the semiconductor unit 20. The control board 30 is manufactured by mounting the connector 31, the microcomputer, and the like on a substrate. Capacitor 50C with first P bus bar 42P and first N bus bar 42N connected thereto is disposed in first capacitor case 41. After that, the first capacitor case 41 is filled with a resin material, and the electrical insulator 43 is disposed between the two bus bars, thereby manufacturing the first capacitor unit 40.

Then, the first P bus bar 42P and the first N bus bar 42N are connected to the P terminal and the N terminal of the semiconductor unit 20. As this connection method, for example, welding can be employed. The signal terminals 21s of the semiconductor unit 20 are connected to the control board 30. As this connection method, for example, insertion mounting can be employed. Thereby, the first assembly U1 is manufactured.

Next, in a first fixing process of step S12, the first assembly U1 manufactured in step S11 is fixed to the first housing 11. Specifically, bracket 41a provided in first capacitor unit 40 shown in fig. 3 is fixed to first case 11 with bolts. Thus, the first capacitor unit 40 is fixed to the first case 11.

In the second assembling process of step S21, the second capacitor unit 50 and the input terminal block 70 are manufactured. After that, in step S21, the second capacitor unit 50 and the input terminal block 70 are connected to each other. Thereby, the second assembly U2 shown in fig. 6 is manufactured.

Specifically, capacitor 50C with second P bus bar 52P and second N bus bar 52N connected thereto is disposed in second capacitor case 51. After that, the second capacitor case 51 is filled with a resin material, thereby manufacturing the second capacitor unit 50. Further, an input P bus 72P, an input N bus 72N, and an input connector section 73 are provided in the main body case 71, thereby manufacturing the input terminal block 70.

After that, the second N bus bar 52N and the input N bus bar 72N are connected to each other. The connection may be a bolt fastening or a welding. Thereby, the second assembly U2 is manufactured.

Next, in a second fixing process of step S22, the second assembly U2 manufactured in step S21 is fixed to the second housing 12. Specifically, a bracket, not shown, provided in the second capacitor unit 50 is fixed to the second case 12 with bolts. Thus, the second capacitor unit 50 is fixed to the second case 12.

In the pre-arrangement process of step S30, which is executed after steps S12 and S22, the first housing 11 is temporarily placed on the second housing 12 so that the input connector portion 73 (input terminal block 70) is entirely present outside the connector opening 11c, as shown in fig. 7. The first housing 11 in the temporarily placed state is located at a position relatively shifted in the insertion direction from a position where it can be fastened to the second housing 12. For example, with the above-described staggered position maintained, the first assembly U1 is approached to the second assembly U2 in the z-direction as shown in fig. 6 and temporarily placed over the second assembly U2 as shown in fig. 7.

In the step of temporarily placing in this way, the cylindrical portion 110 of the first housing 11 separates the cylindrical portion 110 and the input connector portion 73 in the x direction so as not to interfere with the input connector portion 73. However, if the separation distance is too large, the first facing portion 43a interferes with the second facing portion 51 a. Therefore, the cylindrical portion 110 and the input connector portion 73 are separated in the x direction to such an extent that the first facing portion 43a does not interfere with the second facing portion 51 a. As described above, since the shortest separation distance L1 is set to be larger than the insertion amount L2, the positional relationship of non-interference as described above can be achieved.

In the insertion process of step S40 performed later, the first housing 11 and the second housing 12 are relatively moved in the insertion direction. That is, the input connector portion 73 is inserted into the connector opening 11c by the insertion amount L2. Then, the first housing 11 is moved to a normal position where it can be fastened to the second housing 12. In this movement, the first flange surface 11f of the first housing 11 is slid while being in contact with the second flange surface 12f of the second housing 12. At the regular position, the shortest separation distance L1 is greater than the insertion amount L2.

In the case fastening process of step S50 performed later, the first case 11 and the second case 12 located in the normal positions are fastened to each other with bolts B1.

In the bus bar fastening process of step S60 performed later, the first assembly U1 and the second assembly U2 are electrically connected. Specifically, first P bus bar 42P and second P bus bar 52P are connected. Further, the first N bus bar 42N is connected to the second N bus bar 52N. The connection may be bolt fastening or welding. In addition, as explained in step S30, the first assembly U1 is temporarily placed from above the second assembly U2. Therefore, first P bus bar 42P is disposed so as to overlap the upper side of second P bus bar 52P. The first N bus bar 42N is disposed so as to overlap the upper side of the second N bus bar 52N.

In the cover fastening process of step S70 performed later, the first cover 13 is fastened to the first case 11 with bolts B2. The second cover 14 is fastened to the second housing 12 with a bolt B3. In addition, the process of step S70 may be performed in steps S12 and S22.

Effects including the above-described structure will be described below.

As described above, in the power conversion device 1, the first capacitor unit 40 is fixed to the first case 11. The second capacitor unit 50 is fixed to the second case 12 in a state where the input terminal block 70 is electrically connected. The shortest separation distance L1 in the insertion direction of the first capacitor cell 40 and the second capacitor cell 50 is greater than the insertion amount L2 of the input connector portion 73 into the connector opening 11 c.

Therefore, at the time point when the input connector portion 73 is set at the position opposite to the connector opening 11c and is about to be inserted, the first capacitor unit 40 and the second capacitor unit 50 can be prevented from interfering with each other. Therefore, according to the present embodiment, it is not necessary to divide the input terminal block 70 and hold it in the first housing 11 and the second housing 12, respectively, and it is possible to form a structure in which the input connector section 73 can be inserted into the connector opening 11 c. That is, the number of components of the input terminal block 70 can be reduced.

In the present embodiment, the power conversion device 1 in which the shortest separation distance L1 is set to be larger than the insertion amount L2 is manufactured by the following manufacturing method. In this manufacturing method, first capacitor unit 40 and second capacitor unit 50 are fixed to first case 11 and second case 12, respectively. Thereafter, the first housing 11 and the second housing 12 are temporarily placed in a state of being shifted from each other in the insertion direction from the normal positions (pre-placement step). Thereafter, the input connector portion 73 is inserted into the connector opening 11c by relatively moving the first housing 11 and the second housing 12 in the insertion direction. After that, the first housing 11 and the second housing 12 are fastened to each other.

Thereby, the first capacitor unit 40 and the second capacitor unit 50 can be prevented from interfering with each other when the pre-arrangement process is performed. Therefore, it is not necessary to divide the input terminal block 70 and hold it in the first case 11 and the second case 12, respectively, and it is possible to insert a part of the terminal block of the input terminal block 70 (the input connector section 73) into the connector opening 11 c.

In the present embodiment, the first capacitor unit 40 as the first electrical component includes the first P bus bar 42P and the first N bus bar 42N. The bus bar generates heat by being energized. In addition, the second capacitor unit 50 as the second electrical component has a capacitor 50C. In general, the capacitor 50C is an electrical component that is susceptible to thermal damage. That is, the first electrical component has a heat generating portion, and the second electrical component has an electrical component that is easily thermally damaged.

In view of this, in the present embodiment, the first facing portion 43a defining the shortest separation distance L1 is the electrical insulator 43 sandwiched between the bus bars serving as the heat generating portions. In addition, the second opposing portion 51a that determines the shortest separation distance L1 is an electrical component that is susceptible to thermal damage. Therefore, by making the shortest separation distance L1 larger than the insertion amount L2, the separation distance between the heat generating portion and the electric component becomes larger. Therefore, the heat dissipation of the electrical component can be improved. That is, the shortest separation distance L1 can function as a gap for offset mounting, and can also function as a heat dissipation gap for a heat generating portion, and the power conversion device 1 can be downsized.

(other embodiments)

The disclosure in the specification, drawings, and the like are not limited to the illustrated embodiments. The present disclosure includes the illustrated embodiments and variations thereon by those skilled in the art. For example, the combination of the components and/or elements shown in the embodiments is not limited. The disclosure may be implemented in various combinations. The present disclosure may have an additional part that can be added to the embodiment. The present disclosure includes embodiments in which components and/or elements of the embodiments are omitted. The disclosure includes permutations or combinations of parts and/or elements between one embodiment and other embodiments.

In the first embodiment, the first opposite portion 43a is a part of the electrical insulator 43, but may be a part of the first P bus bar 42P or the first N bus bar 42N. The first opposing portion 43a is not limited to a heat generating portion that generates heat by conduction, and may be a part of the first capacitor case 41, for example.

In the first embodiment, the second opposing portion 51a is a part of the second capacitor case 51, but may be a heat generating portion that generates heat by conduction. Specific examples of the heat generating portion include a part of the second P bus bar 52P and the second N bus bar 52N.

In the first embodiment described above, the first capacitor unit 40 having the capacitor 50C is the first electrical component. In contrast, for example, the semiconductor unit 20 and the reactor unit 60 may be the first electrical component. Similarly, the semiconductor unit 20 and the reactor unit 60 may be the second electrical component. The power conversion device 1 may include a DCDC converter that converts the magnitude of the voltage of the dc power. In this case, the first or second electrical component may also be a DCDC converter.

In the first embodiment, the terminal block connected and held to the second electrical component is used as the input terminal block 70, but the terminal block may be used as the output terminal block 80.

In the first embodiment, the plurality of semiconductor modules 21 are arranged in the y direction and stacked. In contrast, the plurality of semiconductor modules 21 may be arranged in a stacked manner along the x direction. In short, the stacking direction of the semiconductor modules 21 may be orthogonal to or parallel to the arrangement direction of the capacitor cells and the terminal cells.

The power conversion device 1 of the first embodiment includes: an inverter circuit for converting the supply power from the battery 2 from direct current to alternating current; and a converter circuit for converting the magnitude of the voltage of the supplied power. In contrast, the power conversion device may be configured such that one of the inverter circuit and the converter circuit is eliminated and the other is included.

Claims

1. A power conversion device comprising:

terminal blocks (70, 80) electrically connected to an external battery (2) or an external motor (3);

a first electrical component (40) and a second electrical component (540) for converting the supply power from the battery from direct current to alternating current or converting the magnitude of the voltage of the supply power; and

a case (10) that houses the first electrical component, the second electrical component, and the terminal block,

the housing has a first housing (11) and a second housing (12),

the first case has an opening (11c) into which a part of the terminal block is inserted and disposed, and the first electric component is fixed,

the second housing is combined with the first housing, and a second electrical component in a state where the terminal block is electrically connected is fixed,

the first and second electrical components have opposing portions (43a, 51a) that are arranged in an insertion direction in which a portion of the terminal block is inserted into the opening and face each other,

the opposing portion of the first electrical component is a first opposing portion (43a), the opposing portion of the second electrical component is a second opposing portion (51a),

a shortest separation distance (L1) in the insertion direction between the first facing portion and the second facing portion is greater than an insertion amount (L2) of the terminal block from the inside of the case into the opening.

2. The power conversion apparatus according to claim 1,

one of the first facing portion and the second facing portion is a heat generating portion that generates heat by energization.

3. The power conversion apparatus according to claim 2,

the other of the first electrical component and the second electrical component, which has the first opposing portion and the second opposing portion, includes a capacitor (40C, 50C).

4. The power conversion apparatus according to claim 1,

the second electrical component includes a capacitor (40C, 50C), and the first electrical component has:

a P bus (42P) electrically connected to a high potential side of the capacitor; an N bus (42N) electrically connected to a low potential side of the capacitor; and

an electrical insulator (43) disposed between the P bus bar and the N bus bar,

the first opposing portion is any one of the P bus bar, the N bus bar, and the electrical insulator.

5. A method of manufacturing a power conversion device, the power conversion device comprising:

the housing has a first housing (11) and a second housing (12),

the second housing is fastened to the first housing, and a second electrical component in a state where the terminal block is electrically connected is fixed,

a shortest separation distance (L1) in the insertion direction of the first facing portion and the second facing portion is greater than an insertion amount (L2) of the terminal block from the inside of the housing to the opening portion,

the method for manufacturing the power conversion device includes:

a first fixing step (S12) of fixing the first electrical component to the first housing;

a second fixing step (S22) of electrically connecting the second electrical component to the terminal block and fixing the second electrical component to the second housing;

a pre-arrangement step (S30) in which the first housing and the second housing are arranged so as to be shifted relative to each other in the insertion direction from a position at which the terminal block can be fastened, so that the entire terminal block is located outside the opening, after the first fixing step and the second fixing step;

an insertion step (S40) in which, after the provision step, a part of the terminal block is inserted into the opening by relatively moving the first case and the second case in the insertion direction; and

a case fastening process (S50) in which the first case and the second case are fastened to each other after the insertion process.