CN115087279A - Manufacturing method of HTCC multilayer ceramic tube shell - Google Patents
Manufacturing method of HTCC multilayer ceramic tube shell Download PDFInfo
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- CN115087279A CN115087279A CN202210879235.7A CN202210879235A CN115087279A CN 115087279 A CN115087279 A CN 115087279A CN 202210879235 A CN202210879235 A CN 202210879235A CN 115087279 A CN115087279 A CN 115087279A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 title claims abstract 15
- 238000007639 printing Methods 0.000 claims abstract description 31
- 238000000462 isostatic pressing Methods 0.000 claims abstract description 29
- 238000004080 punching Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000005245 sintering Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 238000001465 metallisation Methods 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims 1
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 description 7
- 238000005553 drilling Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 4
- 238000010344 co-firing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a manufacturing method of an HTCC multilayer ceramic tube shell, which mainly comprises the following steps: providing a green ceramic chip, printing a metallization pattern on the green ceramic chip, punching a cavity, and forming a multilayer ceramic tube shell green body with a cavity structure inside through laminating and isostatic pressing processes; carrying out hot cutting on the green body of the multilayer ceramic tube shell to form a green body unit of a single multilayer ceramic tube shell; opening the side wall of the green body unit through laser to form a green body unit with a side wall cavity; and after side printing is carried out on the green unit with the side wall cavity, sintering is carried out to form the HTCC multilayer ceramic tube shell. According to the manufacturing method, in the forming process of the HTCC multilayer ceramic tube shell, the side wall cavity is formed after the isostatic pressing process and is combined with a laser hole opening mode, so that the problem that the HTCC multilayer ceramic tube shell is easy to collapse and deform in the forming process of the side wall cavity in the existing process is solved.
Description
Technical Field
The invention belongs to the technical field of high-temperature ceramic tube shell processing, and particularly relates to a manufacturing method of an HTCC multilayer ceramic tube shell.
Background
High Temperature co-fired Ceramic HTCC (High Temperature co-fired Ceramic) is an integrated Ceramic that is formed into a multilayer circuit by High Temperature sintering (typically greater than 1200 ℃) of unsintered cast Ceramic material (typically alumina) laminated together. The HTCC has the advantages of corrosion resistance, high temperature resistance, long service life, high efficiency, energy conservation, uniform temperature, good heat conducting property, high thermal compensation speed and the like, so the HTCC has wide application prospect in a high-power micro-assembly circuit, and the main application directions at present comprise an HTCC heating body, an HTCC multilayer ceramic substrate and an HTCC ceramic tube shell.
The HCTT ceramic tube shell has very wide application in the field of optical communication, can provide electrical connection and mechanical support protection for an optical communication device, and generally needs to be provided with a cavity (namely a side wall cavity) on the side wall of an end head for welding an optical window support. However, the conventional HTCC multilayer ceramic package is formed by isostatic pressing after printing, cavity punching and lamination, and the sidewall cavities are formed in the isostatic pressing step. In the case of products requiring opening at the middle portion, the cavity collapses and deforms by directly performing isostatic pressing. The sidewall cavities of the HTCC multilayer ceramic capsule cannot be realized using conventional isostatic pressing processes.
Disclosure of Invention
In view of the above, the present invention is directed to a method for manufacturing an HTCC multilayer ceramic tube shell, in which the formation of a sidewall cavity is performed after an isostatic pressing process in the forming process of the HTCC multilayer ceramic tube shell and a laser drilling manner is combined, so as to solve the problem that the sidewall cavity of the HTCC multilayer ceramic tube shell is easy to collapse and deform in the forming process of the HTCC multilayer ceramic tube shell in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a manufacturing method of an HTCC multilayer ceramic tube shell, which comprises the following steps:
providing a green ceramic chip, printing a metalized pattern on the green ceramic chip, punching a cavity, and forming a multilayer ceramic tube shell green body with a cavity structure inside through lamination and isostatic pressing processes;
carrying out hot cutting on the green body of the multilayer ceramic tube shell to form a green body unit of a single multilayer ceramic tube shell;
opening the side wall of the green body unit through laser to form a green body unit with a side wall cavity;
and after side printing is carried out on the green unit with the side wall cavity, sintering is carried out to form the HTCC multilayer ceramic tube shell.
In a further scheme, the raw ceramic chips are made of aluminum oxide.
In a further scheme, the green ceramic chip is prepared by mixing alumina powder and then carrying out tape casting, and the components of the green ceramic chip are 90-96 wt% of ceramic.
Further, the paste for printing the metallization pattern is tungsten paste or tungsten-molybdenum paste.
In a further scheme, the cavity punching mode is mechanical cavity punching or laser cavity punching.
In a further scheme, the temperature of the isostatic pressing process is 40-80 ℃, and the pressure is 500-5000 psi.
In a further scheme, the temperature of the hot cutting table surface is 40-80 ℃, and the temperature of the blade is 40-80 ℃.
Further, the type of the laser is selected from one or a combination of more than two of ultraviolet nanosecond, ultraviolet picosecond, green light and optical fiber.
Further, the processing parameters of the laser are 10-50W of laser power, 20-150kHz of laser frequency and 10-200 times of scanning times.
Compared with the prior art, the invention has the following beneficial effects:
according to the manufacturing method of the HTCC multilayer ceramic tube shell, the step of forming the side wall cavity is placed after the isostatic pressing process, and the cavity is opened by combining laser, so that the deformation and the collapse of the cavity can be effectively avoided. Particularly, the side wall cavity is opened by adopting a laser processing mode after the isostatic pressing process, the shape of the HTCC multilayer ceramic tube shell cannot be damaged due to the stress-free laser processing mode, and the laser processing mode is flexible and can process and form a cavity with any shape, size and depth.
Drawings
FIG. 1 is a schematic illustration of printed graphics for L01, L14, L19, and L23-BOT layers in an exemplary embodiment of the invention;
FIG. 2 is a schematic illustration of a first cavity pattern and a second cavity pattern in an exemplary embodiment of the invention;
FIG. 3 is a comparison of green bodies of ceramic envelopes of example 1 of the present invention with both open and round ends;
fig. 4 is a diagram of a ceramic envelope green object after side printing in example 1 of the present invention.
Detailed Description
The following detailed description of embodiments of the invention is intended to be illustrative, and is not to be construed as limiting the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In an exemplary embodiment of the present invention, a method for manufacturing an HTCC multilayer ceramic package is provided, which includes the steps of:
providing a green ceramic chip, printing a metalized pattern on the green ceramic chip, punching a cavity, and forming a multilayer ceramic tube shell green body with a cavity structure inside through lamination and isostatic pressing processes;
hot cutting the green multilayer ceramic tube shell to form a green unit of a single multilayer ceramic tube shell;
opening the side wall of the green body unit through laser to form a green body unit with a side wall cavity;
and after side printing is carried out on the green unit with the side wall cavity, sintering is carried out to form the HTCC multilayer ceramic tube shell.
According to the invention, on the basis of the conventional HTCC multilayer ceramic tube shell process, the cavity opening of the side wall cavity is carried out after isostatic pressing forming, and the cavity opening is carried out on the formed tube shell green body in a laser mode, so that the problem that the side wall cavity is easy to collapse and deform caused by isostatic pressing in the original process is avoided, the laser cavity opening mode is flexible, stress-free in processing is realized, and the side wall cavity with any shape, size and depth can be processed and formed according to actual needs.
Further, the type of the green ceramic chip used herein is not particularly limited, and may be a material commonly used for HTCC ceramics, and in some specific embodiments of the present invention, the green ceramic chip is an alumina green ceramic chip, and the processing method thereof is not particularly limited, according to embodiments of the present invention, the green ceramic chip is made by mixing alumina powder and then tape casting, and the composition of the green ceramic chip is 90 wt% to 96 wt% of ceramic.
The printing of metallization patterns, punching cavities, lamination, and isostatic pressing processes, etc., described herein, may all be performed in a manner conventional in the art. Specifically, the green ceramic chip can be printed with the metallization pattern according to design requirements, and the slurry for printing the metallization pattern can be tungsten slurry, and can be tungsten-molybdenum slurry, and it can be understood that any slurry capable of being used for green ceramic chip printing in the art can be used. In addition, it is understood that the specific metallization pattern printing can be adjusted according to the number of layers of the green ceramic chip and the thickness of the entire package, and fig. 1 shows a schematic diagram of the metallization pattern printing on the green ceramic chip, and L01, L14, L19 and L23-BOT patterns are printed on the corresponding green ceramic chips, respectively, according to an exemplary embodiment of the present invention.
The punching cavity is specifically a cavity punched on an independent raw ceramic chip according to design requirements, and the punched cavity is a cavity inside the tube shell and does not include punching of a side wall cavity. Fig. 2 shows a first cavity pattern and a second cavity pattern respectively formed on a green ceramic sheet by punching the cavity patterns according to an exemplary embodiment of the present invention. The punching manner of the cavity is not particularly limited, and a conventional manner in the art may be adopted, and specific examples that may be mentioned include, but are not limited to, mechanical punching, laser punching, and the like, and other punching manners in the art may also be adopted, which are not specifically set forth herein.
The lamination refers to the lamination of the green ceramic chips according to the corresponding sequence according to the product structure design, and is not specifically described herein. The laminated green ceramic sheets are subjected to isostatic pressing, and the specific isostatic pressing process can be adjusted according to actual conditions (such as the thickness, the number of layers and the like of the green ceramic sheets), and in some specific embodiments of the invention, the temperature of the isostatic pressing process is 40-80 ℃, and the pressure is 500-5000 psi.
The multilayer ceramic cartridge green body with the cavity inside can be formed through an isostatic pressing process, the multilayer ceramic cartridge green body is cut into a plurality of green body units of the multilayer ceramic cartridge as required, the specific cutting mode can be selected conventionally in the field, such as hot cutting and the like, in some specific embodiments of the invention, the hot cutting is carried out by using a hot cutting machine, the table surface temperature of the hot cutting machine is 40-80 ℃, and the blade temperature is 40-80 ℃.
Further, the green unit is processed by laser open sidewall cavity treatment, the specific laser type is not limited, and the mentioned examples include but not limited to one or more of uv nanosecond, uv picosecond, green light, and optical fiber, the specific processing parameters are adjusted according to the different laser types and the different sidewall cavities, and the like, in some typical embodiments of the invention, the laser power is 10-50W, the laser frequency is 20-150kHz, and the scanning times are 10-200 times. The laser-opened side wall cavity has the advantages of stress-free processing and flexible processing mode, and the side wall cavity with any shape, depth or size can be formed according to the requirement. And because the side wall cavity is formed after isostatic pressing, the problem of cavity collapse or deformation caused by isostatic pressing is avoided.
The present invention is illustrated below by way of specific examples, which are intended to be illustrative only and not to limit the scope of the present invention in any way, and reagents and materials used therein are commercially available, unless otherwise specified, and conditions or steps thereof are not specifically described.
Example 1
The method for manufacturing the HTCC multilayer ceramic tube shell in the embodiment comprises the following specific steps:
printing a green ceramic chip: preparing 23 aluminum oxide green ceramic tiles with the same batch and the thickness of 0.25mm, marking the single green ceramic tiles in sequence, and printing metalized graphs of L01, L14, L19 and L23-BOT on the back surfaces of the 1 st layer green ceramic tile, the 14 th layer green ceramic tile, the 19 th layer green ceramic tile and the 23 rd layer green ceramic tile respectively;
punching a cavity in a green ceramic chip: punching a first cavity pattern as shown in figure 2 on the layer 1-13 green ceramic chips and a second cavity pattern as shown in figure 2 on the layer 14-18 green ceramic chips by using a mechanical punching machine, wherein the cavity pattern does not need to be punched on the layer 19-23;
lamination and isostatic pressing: in order from layer 23 to layer 1, followed by hot pressing in a warm water isostatic press. The hot pressing temperature is 50 ℃, the hot pressing pressure is 2000psi, and the heat preservation and pressure maintaining time is 10 min;
hot cutting: hot-cutting the green body subjected to isostatic pressing to form a single-tube-shell green body;
laser processing of the sidewall cavity: fixing a single tube shell green body on a positioning tool, performing cavity opening treatment on the side wall of the tube shell by using an ultraviolet nanosecond laser drilling machine, and adjusting the cavity opening effect by adjusting parameters such as laser power and frequency, wherein the laser power is 13.5W, the frequency is set to be 50kHz, the scanning speed is 500mm/s, and the scanning times are set to be 50 times; a comparison of the shells before and after the sidewall cavities are open is shown in fig. 3;
side printing: carrying out metallization pattern printing on two sides of the tube shell, and carrying out metallization pattern printing on the end head of the tube shell cavity;
and (3) sintering: and sintering and molding the processed ceramic tube shell green body in a high-temperature co-firing furnace, wherein the sintering temperature is controlled to be 1500-1600 ℃, the sintering time is 1-2h, and the final finished product of the HTCC multilayer ceramic tube shell prepared in the embodiment is shown in figure 4.
Example 2
The method for manufacturing the HTCC multilayer ceramic tube shell in the embodiment comprises the following specific steps:
printing a green ceramic chip: preparing 23 green ceramic tiles with the same batch and the thickness of 0.25mm, marking the single green ceramic tiles in sequence, and printing metalized patterns of L01, L14, L19 and L23-BOT on the back surfaces of the 1 st layer, the 14 th layer, the 19 th layer and the 23 rd layer respectively;
punching a cavity of the green ceramic chip: punching a first cavity pattern on the 1 st to 13 th layers of green ceramic chips by using a laser drilling machine, punching a second cavity pattern on the 14 th to 18 th layers of green ceramic chips, and punching no cavity on the 19 th to 23 th layers;
lamination and isostatic pressing: sequentially laminating from the 23 rd layer to the 1 st layer, and then performing hot pressing in a warm water isostatic press at the temperature of 60 ℃ and the pressure of 3000psi for 10 min;
hot cutting: cutting the green body subjected to isostatic pressing into a single-tube-shell green body;
laser processing a side wall cavity: fixing the single-tube shell green body on a positioning tool, and performing cavity opening treatment on the side wall of the shell by using an ultraviolet nanosecond laser drilling machine; the cavity opening effect is adjusted by adjusting parameters such as laser power, frequency and the like, specifically, the laser power is 12W, the frequency is set to be 100kHz, the scanning speed is 500mm/s, and the scanning times are set to be 70 times;
side printing: carrying out metallization pattern printing on two sides of the tube shell, and carrying out metallization pattern printing on the end head of the tube shell cavity;
and (3) sintering: sintering and molding the processed ceramic green body in a high-temperature co-firing furnace, wherein the sintering temperature is controlled at 1500-1600 ℃, and the sintering time is 1-2 h.
Example 3
The manufacturing method of the HTCC multilayer ceramic tube shell in the embodiment mainly comprises the following steps:
printing a green ceramic chip: preparing 23 green ceramic tiles with the same batch and the thickness of 0.25mm, marking the single green ceramic tiles in sequence, and printing metalized patterns of L01, L14, L19 and L23-BOT on the back surfaces of the 1 st layer, the 14 th layer, the 19 th layer and the 23 rd layer respectively;
punching a cavity of the green ceramic chip: punching a first cavity pattern on the 1 st to 13 th layers of green ceramic chips by using a laser drilling machine, punching a second cavity pattern on the 14 th to 18 th layers of green ceramic chips, and punching no cavity on the 19 th to 23 th layers;
lamination and isostatic pressing: sequentially from layer 23 to layer 1, followed by hot pressing in a warm water isostatic press; the hot pressing temperature is 70 ℃, the hot pressing pressure is 3000psi, and the heat preservation and pressure maintaining time is 10min respectively;
hot cutting: cutting the green body subjected to isostatic pressing into a single-tube-shell green body;
laser processing of the sidewall cavity: fixing the green body of the single tube shell on a positioning tool, and performing cavity opening treatment on the side wall of the tube shell by using an optical fiber laser drilling machine; the cavity opening effect is adjusted by adjusting parameters such as laser power, frequency and the like, specifically, the laser power is 40W, the frequency is set to be 150kHz, the scanning speed is 1000mm/s, and the scanning times are set to be 10 times;
side printing: carrying out metallization pattern printing on two sides of the tube shell, and carrying out metallization pattern printing on the end head of the tube shell cavity;
and (3) sintering: sintering and molding the processed ceramic green body in a high-temperature co-firing furnace, wherein the sintering temperature is controlled at 1500-1600 ℃, and the sintering time is 1-2 h.
The HTCC multilayer ceramic tube shell prepared by the embodiment has the advantages that the side wall cavity is free from collapse and deformation, and the forming quality is good.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A manufacturing method of an HTCC multilayer ceramic tube shell is characterized by comprising the following steps:
providing a green ceramic chip, printing a metalized pattern on the green ceramic chip, punching a cavity, and forming a multilayer ceramic tube shell green body with a cavity structure inside through lamination and isostatic pressing processes;
carrying out hot cutting on the green body of the multilayer ceramic tube shell to form a green body unit of a single multilayer ceramic tube shell;
opening the side wall of the green body unit through laser to form a green body unit with a side wall cavity;
and after side printing is carried out on the green unit with the side wall cavity, sintering is carried out to form the HTCC multilayer ceramic tube shell.
2. The method of making an HTCC multilayer ceramic package in accordance with claim 1, wherein said green ceramic tile is comprised of alumina.
3. The method of making an HTCC multilayer ceramic envelope of claim 2, wherein the green tiles are cast from alumina powder mixed and made of 90-96 wt% porcelain.
4. The method of making an HTCC multilayer ceramic package of claim 1, wherein the paste used to print the metallization pattern is a tungsten paste or a tungsten molybdenum paste.
5. The method of making an HTCC multilayer ceramic package of claim 1, wherein the cavity is punched by mechanical punching or laser punching.
6. The method of making an HTCC multilayer ceramic capsule of claim 1, wherein the isostatic pressing process is at a temperature of 40-80 ℃ and a pressure of 500-5000 psi.
7. The method of making an HTCC multilayer ceramic envelope of claim 1, wherein the hot-cut table temperature is 40-80 ℃ and the blade temperature is 40-80 ℃.
8. The method of making an HTCC multilayer ceramic package of claim 1, wherein the laser is of a type selected from the group consisting of uv nanosecond, uv picosecond, green, and fiber optics, or a combination of two or more thereof.
9. The method of making an HTCC multilayer ceramic package of claim 1, wherein the laser processing parameters are laser power 10-50W, laser frequency 20-150kHz, and 10-200 scan passes.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| CN107926122A (en) * | 2015-10-09 | 2018-04-17 | 日立金属株式会社 | The manufacture method of multi-layered ceramic substrate |
| CN109152221A (en) * | 2018-09-06 | 2019-01-04 | 中国电子科技集团公司第三十八研究所 | The forming method of shallow-layer circuit shape cavity on a kind of low-temperature co-fired ceramic substrate |
| CN114096083A (en) * | 2021-12-09 | 2022-02-25 | 中国振华集团云科电子有限公司 | Multilayer island ceramic circuit substrate based on co-fired ceramic and preparation method thereof |
-
2022
- 2022-07-25 CN CN202210879235.7A patent/CN115087279A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| CN107926122A (en) * | 2015-10-09 | 2018-04-17 | 日立金属株式会社 | The manufacture method of multi-layered ceramic substrate |
| CN109152221A (en) * | 2018-09-06 | 2019-01-04 | 中国电子科技集团公司第三十八研究所 | The forming method of shallow-layer circuit shape cavity on a kind of low-temperature co-fired ceramic substrate |
| CN114096083A (en) * | 2021-12-09 | 2022-02-25 | 中国振华集团云科电子有限公司 | Multilayer island ceramic circuit substrate based on co-fired ceramic and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 吕琴红;乔海灵;: "浅谈LTCC工艺及设备的发展", 山西电子技术, no. 03, 15 June 2017 (2017-06-15) * |
| 薛耀平;王颖麟;: "LED的LTCC封装基板研究", 电子工艺技术, no. 04, 18 July 2012 (2012-07-18) * |
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