CN115084105A - LED packaging structure and disinfection device and disinfection lamp applied to same - Google Patents

LED packaging structure and disinfection device and disinfection lamp applied to same Download PDF

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Publication number
CN115084105A
CN115084105A CN202110277321.6A CN202110277321A CN115084105A CN 115084105 A CN115084105 A CN 115084105A CN 202110277321 A CN202110277321 A CN 202110277321A CN 115084105 A CN115084105 A CN 115084105A
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China
Prior art keywords
led
ultraviolet
wafers
band
disinfection
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Pending
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CN202110277321.6A
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Chinese (zh)
Inventor
陈必寿
陈鸣
李闪
何孝亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Sansi Technology Co Ltd
Shanghai Sansi Electronic Engineering Co Ltd
Jiashan Sansi Photoelectric Technology Co Ltd
Pujiang Sansi Optoelectronics Technology Co Ltd
Original Assignee
Shanghai Sansi Technology Co Ltd
Shanghai Sansi Electronic Engineering Co Ltd
Jiashan Sansi Photoelectric Technology Co Ltd
Pujiang Sansi Optoelectronics Technology Co Ltd
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Application filed by Shanghai Sansi Technology Co Ltd, Shanghai Sansi Electronic Engineering Co Ltd, Jiashan Sansi Photoelectric Technology Co Ltd, Pujiang Sansi Optoelectronics Technology Co Ltd filed Critical Shanghai Sansi Technology Co Ltd
Priority to CN202110277321.6A priority Critical patent/CN115084105A/en
Priority to US18/281,965 priority patent/US20240050612A1/en
Priority to PCT/CN2021/096092 priority patent/WO2022193435A1/en
Publication of CN115084105A publication Critical patent/CN115084105A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/08—Radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/24—Apparatus using programmed or automatic operation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L9/00—Disinfection, sterilisation or deodorisation of air
    • A61L9/16—Disinfection, sterilisation or deodorisation of air using physical phenomena
    • A61L9/18—Radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

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  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Veterinary Medicine (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)

Abstract

The invention provides an LED packaging structure and a disinfection device and a disinfection lamp applied by the LED packaging structure, comprising: the LED wafer unit comprises a plurality of ultraviolet waveband LED wafers and visible waveband LED wafers; the control unit is used for controlling whether the LED wafers in the ultraviolet wave bands emit light or not and the light intensity to emit light rays with different killing wave bands and killing effects according to requirements, and controlling the LED wafers in the visible light wave bands to emit lighting and/or warning light rays, so that the technical effect of one lamp with multiple purposes is achieved. Meanwhile, as the invention adopts one product structure to meet various disinfection requirements, compared with the traditional disinfection lamp with single function, the structure is more compact, the occupied space is smaller, and the ultraviolet disinfection lamp has an indication function, thereby improving the safety of ultraviolet disinfection.

Description

LED packaging structure and disinfection device and disinfection lamp applying same
Technical Field
The invention relates to the field of LED packaging, in particular to an LED packaging structure and a disinfection device and a disinfection lamp applied to the LED packaging structure.
Background
The current ultraviolet sterilization and disinfection mode has been widely accepted in the industry, but the current ultraviolet disinfection lamp is often a single wave band and can not be adjusted, and the following problems are easily encountered in practical use: (1) different germs need different wave bands of ultraviolet rays to kill; (2) the ultraviolet light requirements for sterilization of various articles vary, such as clothing, which requires a long wavelength to increase penetration.
Therefore, there is a need in the art for an ultraviolet disinfection lamp that can meet the disinfection requirements for different germs and various articles in life.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by the present invention is to provide an LED package structure, comprising: the LED wafer unit comprises a plurality of ultraviolet waveband LED wafers and visible waveband LED wafers; and the control unit is used for controlling whether the LED wafers in the ultraviolet wave bands emit light or not and the light intensity to emit light rays with different killing wave bands and killing effects according to requirements, and controlling the LED wafers in the visible light wave bands to emit lighting and/or warning light rays.
In some embodiments of the present invention, the LED package structure further includes: a supporting unit including a substrate and a chip dam; the chip box dam is arranged on the substrate and used for separating the substrate into a plurality of independent spaces for respectively arranging the ultraviolet band LED wafers and the visible band LED wafers.
In some embodiments of the present invention, the ultraviolet band LED chips include at least a UVA band LED chip, a UVB band LED chip, a UVC band LED chip; the independent space formed by dividing the chip dam is respectively provided with a UVA wave band LED wafer, a UVB wave band LED wafer, a UVC wave band LED wafer and a visible light wave band LED wafer.
In some embodiments of the present invention, a transparent filler is disposed on each of the LED chips, and the transparent filler is fixed on the substrate by using an adhesive material.
In some embodiments of the present invention, the adhesive material is a moisture-proof and insulating material.
In some embodiments of the present invention, the transparent filler at least comprises quartz glass, a lens or a transparent adhesive.
In some embodiments of the present invention, the supporting unit includes a plurality of strip-shaped chip dams arranged in a staggered manner, and is configured to divide the substrate into a plurality of independent spaces adjacent to each other.
In some embodiments of the present invention, the supporting unit includes a plurality of annular chip dams arranged in a nested manner, for partitioning the substrate into a plurality of independent spaces in a nested annular shape.
To achieve the above object, the present invention provides a sterilizing device comprising: the LED packaging structure comprises a plurality of ultraviolet wave band LED wafers and visible light wave band LED wafers; and the control unit is electrically connected with the LED wafers of all the wave bands and is used for controlling whether the LED wafers of all the ultraviolet wave bands emit light or not and controlling the LED wafers of all the ultraviolet wave bands to emit light rays with different killing wave bands and killing effects according to requirements by controlling the LED wafers of the visible light wave bands to emit illumination and/or warning light rays.
In order to achieve the above object, the present invention provides a sterilizing lamp including the LED package structure.
As described above, the LED package structure, and the applied disinfection device and disinfection lamp thereof according to the present invention have the following advantages: the LED chip is provided with an LED chip capable of converting light wave bands into a plurality of ultraviolet wave bands. Although different germs need different wave band ultraviolet rays to be killed and different articles have different requirements on the ultraviolet rays for sterilization and disinfection, the invention can emit light rays with different disinfection wave bands and disinfection effects according to requirements by controlling whether each ultraviolet wave band LED wafer and each visible light wave band LED wafer emit light or not and the luminous intensity, and can emit lighting and/or warning light rays by controlling the visible light wave band LED wafers, thereby realizing the technical effect of one lamp with multiple purposes. Meanwhile, as the invention adopts one product structure to meet various disinfection requirements, compared with the traditional disinfection lamp with single function, the structure is more compact, the occupied space is smaller, and the ultraviolet disinfection lamp has an indication function, thereby improving the safety of ultraviolet disinfection.
Drawings
Fig. 1 is an exploded view of an LED package structure according to an embodiment of the invention.
Fig. 2A is a schematic view of an LED package without a transparent filling material according to an embodiment of the invention.
Fig. 2B is a schematic view of an LED package structure with a transparent filling material mounted thereon according to an embodiment of the invention.
Fig. 3A is a schematic diagram illustrating an arrangement of LED chips according to an embodiment of the invention.
FIG. 3B is a schematic diagram of an arrangement of LED chips according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," "retained," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," and/or "comprising," when used in this specification, specify the presence of stated features, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, operations, elements, components, items, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions or operations are inherently mutually exclusive in some way.
The invention provides an LED packaging structure and a disinfection device and a disinfection lamp applied by the LED packaging structure. The LED packaging structure can be applied to LED disinfection equipment, so that disinfection of different wave bands and visible light illumination and indication functions are realized. In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention are further described in detail by the following embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The first embodiment is as follows:
the invention provides an LED packaging structure, which comprises an LED wafer unit; the LED wafer unit comprises a plurality of ultraviolet waveband LED wafers and visible light waveband LED wafers; and the control unit is connected with the LED wafers externally, and is used for controlling whether the LED wafers in the ultraviolet wave bands emit light or not and the light intensity to emit light rays with different killing wave bands and killing effects according to requirements and controlling the LED wafers in the visible light wave bands to emit lighting and/or warning light rays.
For example, at night when there is no need for disinfection, the control unit can control to turn on the visible light band LED chip to emit illumination light; under the condition that has specific disinfection demand, the steerable wave band LED wafer that corresponds of the control unit comes the light that corresponds the wave band of killing and effect of killing, and the penetrating power that this wave band light was adjusted to the accessible is adjusted luminous intensity to can be when ultraviolet wave band LED wafer is opened, steerable visible light wave band LED wafer is through warning light such as scintillation and/or color variation, reminds the crowd around not to be close to.
In some examples, the LED package structure further includes a supporting unit; the supporting unit comprises a substrate and a chip dam; the chip box dam is arranged on the substrate and used for dividing the substrate into a plurality of independent spaces for respectively arranging the ultraviolet band LED wafers and the visible band LED wafers.
It should be noted that the control unit may specifically be an arm (advanced RISC machines) controller, an fpga (field Programmable Gate array) controller, an soc (system on chip) controller, a dsp (digital Signal processing) controller, or an mcu (micro controller unit) controller. It should be noted that the LED package structure provided in this embodiment can be applied to the fields of LED disinfection, LED illumination, and the like, and certainly can also be applied to the field of display screen, and this embodiment is not limited.
For ease of understanding, the LED package structure shown in fig. 1 is specifically illustrated in an exploded view. The substrate 11 is provided with a chip dam 12, the chip dam 12 divides the substrate 11 into a plurality of independent spaces, and each independent space is provided with each LED chip 13, thereby playing a role of isolating the fluorescent powder.
The substrate 11 is mainly used to support the individual LED chips, and provides insulation and good heat conduction when the LED chips are electrically operated. Different LED wafers are independently powered by respective positive polarity and negative polarity, are conducted to work, independently work according to control voltage and current, and independently emit different UV wave band light rays or visible light rays. Through different conduction control combinations and conduction in different time lengths, light rays with different killing wave bands and killing effects can be emitted according to requirements; after the visible light wave band chip is conducted, the illuminating light or the warning light is emitted.
In the present embodiment, the LED chip 13 includes an ultraviolet band LED chip and a visible band LED chip. The ultraviolet band LED wafer at least comprises a UVA band LED wafer, a UVB band LED wafer and a UVC band LED wafer. Therefore, the substrate 11 is divided into four independent spaces by the chip dam 12, and the UVA band LED chip, the UVB band LED chip, the UVC band LED chip, and the visible band LED chip are respectively disposed in the four independent spaces.
It should be understood that the above UVA band LED chip, UVB band LED chip, and UVC band LED chip are divided according to the wavelength of the ultraviolet band, and the ultraviolet bands and the visible bands are explained as follows:
the UVA wave band refers to long-wave black spot effect ultraviolet rays, and the wavelength range is 400nm to 320 nm; it has strong penetrating power and can penetrate most transparent glass and plastics. More than 98% of long-wave ultraviolet rays contained in sunlight can penetrate through an ozone layer and a cloud layer to reach the surface of the earth, and can directly reach the dermis layer of skin, so that elastic fibers and collagen fibers are damaged, and the skin is tanned; UVA ultraviolet rays with the wavelength of 360nm accord with the phototaxis response curve of insects, and the trap lamp can be manufactured.
The UVB wave band refers to medium wave erythema effect ultraviolet rays, and the wavelength range is 320nm to 275 nm; has medium penetrating power, and its short wavelength part is absorbed by transparent glass, while the ultraviolet ray in sunlight is absorbed by ozone layer mostly, and less than 2% of the ultraviolet ray can reach the earth surface, especially in summer and afternoon. UVB ultraviolet ray has erythema effect on human body, and can promote mineral metabolism and vitamin D formation in vivo. The ultraviolet health-care lamp and the plant growth lamp are made of special purple-transparent glass and fluorescent powder with the peak value near 300 nm.
The UVC wave band refers to short wave sterilization ultraviolet rays, and the wavelength range is 275nm to 200 nm; it has the weakest penetrating power and can not penetrate most transparent glass and plastics. The short wave ultraviolet ray contained in sunlight is almost completely absorbed by the ozone layer, the short wave ultraviolet ray has great harm to human body, and the skin can be burnt by short time irradiation. The ultraviolet ray disinfection emits UVC short wave ultraviolet rays.
The visible light wave band is a part which can be perceived by human eyes in an electromagnetic spectrum, the wavelength of the electromagnetic wave which can be perceived by the human eyes is between 780 and 400nm, and the electromagnetic wave is composed of seven colors of light such as red, orange, yellow, green, blue, indigo and purple. Common visible light lamps include incandescent lamps, halogen lamps, fluorescent lamps, energy-saving lamps, LED lamps, high-pressure sodium lamps, neon lamps and the like.
In this embodiment, one or more of the UVA band LED wafer, the UVB band LED wafer, the UVC band LED wafer, and the visible band LED wafer may be combined as necessary, and light may be used for indication or illumination while ultraviolet light is used for sterilization. Preferred combinations are: one of a visible light band LED wafer and an ultraviolet band LED wafer, namely, the visible light band LED wafer + UVA band LED wafer/UVB band LED wafer/UVC band LED wafer; or, two of the visible light band LED wafer and the ultraviolet band LED wafer, namely, the visible light band LED wafer + (UVA band LED wafer + UVB band LED wafer)/(UVA band LED wafer + UVC band LED wafer)/(UVB band LED wafer + UVC band LED wafer); or, the visible light band LED wafer and the three ultraviolet band LED wafers, that is, the visible light band LED wafer + UVA band LED wafer + UVB band LED wafer + UVC band LED wafer. The visible light wave band comprises white light, red light, blue light, green light and the like, and can be used as an indicator light or an illuminating light.
It should be noted that the above examples are only for reference and are not intended to limit the scope of the present invention, and the present invention is not limited to the number of the LED chips in the ultraviolet band.
In some examples, each of the LED chips 13 is provided with a transparent filler 14 thereon, and the transparent filler is fixed on the substrate 11 using an adhesive material 15. The substrate 11 may be a ceramic substrate, a metal substrate (such as an aluminum substrate, a copper substrate), an organic substrate, or the like.
Furthermore, the bonding material is made of a moisture-proof and insulating material, or the surface of the bonding material is coated with moisture-proof insulating paint. The transparent filler may be quartz glass, a lens, or a transparent material (e.g., glue), etc. According to the scheme, the number of the LED chips in each independent space is not limited, and the LED chips can be attached to the substrate or fixed on the substrate in other modes.
Fig. 2A and 2B respectively show an assembly diagram of the LED package structure corresponding to the exploded diagram of the LED package structure shown in fig. 1. Fig. 2A shows a schematic view of an LED package without a transparent filling material, and fig. 2B shows a schematic view of an LED package with a transparent filling material. After the LED packaging structure is assembled, the power-on mode can be conductive connection, preferably gold wire connection with high conductivity, corrosion resistance and excellent toughness, and also can be circuit board connection.
In some examples, the supporting unit includes a plurality of strip-shaped chip dams arranged in a staggered manner to divide the substrate into a plurality of independent spaces adjacent to each other. For example, as shown in fig. 3A, the chip dam divides the substrate into two adjacent 4 independent spaces, and the independent spaces are used for arranging the visible light band LED chip, the UVA band LED chip, the UVB band LED chip, and the UVC band LED chip, respectively.
In some examples, the support unit includes a plurality of annular chip dams arranged in a nested arrangement for partitioning the substrate into a plurality of independent spaces in a nested annular shape. For example, as shown in fig. 3B, the chip dam divides the substrate into 4 independent spaces in a nested ring shape, and the independent spaces are used for arranging the visible light band LED chip, the UVA band LED chip, the UVB band LED chip, and the UVC band LED chip, respectively.
In summary, although different germs need different bands of ultraviolet rays to be killed, and different articles need different ultraviolet rays for sterilization and disinfection, the LED package structure of the embodiment can emit light rays with different sterilization bands and sterilization effects as required by controlling whether each ultraviolet band LED wafer emits light and the intensity of the light emission, and can emit illumination and/or warning light rays by controlling the visible band LED wafer, thereby achieving the technical effect of one lamp with multiple purposes.
Example two:
the embodiment provides an LED disinfection device, which comprises an LED packaging structure and a control unit; the LED packaging structure comprises a plurality of ultraviolet waveband LED wafers and visible light waveband LED wafers; the control unit is electrically connected with the LED wafers of all wave bands and is used for controlling whether the LED wafers of all ultraviolet wave bands emit light or not and controlling the LED wafers of all ultraviolet wave bands to emit light rays with different killing wave bands and killing effects according to requirements by controlling the LED wafers of all visible wave bands and controlling the LED wafers of all visible light bands to emit lighting and/or warning light rays.
The LED disinfection apparatus provided in this embodiment may specifically be an LED lamp or an LED display screen, and the embodiment is not limited. It should be noted that the LED package structure has been explained in detail in the above embodiments, and thus the description of the embodiment is omitted. The control unit may be an arm (advanced RISC machines) controller, an fpga (field Programmable Gate array) controller, an soc (system on chip) controller, a dsp (digital Signal processing) controller, or an mcu (micro controller unit) controller.
Example three:
the present embodiment provides a disinfection lamp, which includes the above-mentioned LED package structure, and the LED package structure has been explained in detail in the above-mentioned embodiments, so that the details of this embodiment are not repeated.
It should be understood that uv disinfection is based on the principle of radiation, electromagnetic wave energy that is transmitted through air and space at the speed of light. The working principle of the ultraviolet disinfection lamp is that the lamp tube is made of quartz glass with high ultraviolet transmittance as a protective outer tube, and life genetic materials of bacteria and virus accounting are destroyed and drastic chemical changes are generated in molecules to make the low-pressure mercury discharge lamp incapable of reproducing when the ultraviolet with the artificial wavelength of 254nm has a maximum absorption value by accounting.
In summary, the present invention provides an LED package structure, and a sterilization device and a sterilization lamp using the same, wherein the LED package structure is provided with an LED chip capable of converting light wave bands into a plurality of ultraviolet wave bands. Although different germs need different wave band ultraviolet rays to be killed and different articles have different requirements on the ultraviolet rays for sterilization and disinfection, the invention can emit light rays with different disinfection wave bands and disinfection effects according to requirements by controlling whether each ultraviolet wave band LED wafer and each visible light wave band LED wafer emit light or not and the luminous intensity, and can emit lighting and/or warning light rays by controlling the visible light wave band LED wafers, thereby realizing the technical effect of one lamp with multiple purposes. Meanwhile, as the invention adopts one product structure to meet various disinfection requirements, compared with the traditional disinfection lamp with single function, the structure is more compact, the occupied space is smaller, and the ultraviolet disinfection lamp has an indication function, thereby improving the safety of ultraviolet disinfection. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. An LED package structure, comprising:
the LED wafer unit comprises a plurality of ultraviolet waveband LED wafers and visible waveband LED wafers;
and the control unit is used for controlling whether the LED wafers in the ultraviolet wave bands emit light or not and the light intensity to emit light rays with different killing wave bands and killing effects according to requirements, and controlling the LED wafers in the visible light wave bands to emit lighting and/or warning light rays.
2. The LED package structure of claim 1, further comprising:
a supporting unit including a substrate and a chip dam;
the chip box dam is arranged on the substrate and used for dividing the substrate into a plurality of independent spaces for respectively arranging the ultraviolet band LED wafers and the visible band LED wafers.
3. The LED package structure of claim 2, wherein the ultraviolet band LED die comprises at least a UVA band LED die, a UVB band LED die, a UVC band LED die; the independent space formed by dividing the chip dam is respectively provided with a UVA wave band LED wafer, a UVB wave band LED wafer, a UVC wave band LED wafer and a visible light wave band LED wafer.
4. The LED package structure of claim 2, wherein a transparent filler is disposed on each LED chip, and an adhesive material is used to fix the transparent filler on the substrate.
5. The LED package structure of claim 4, wherein the adhesive material is a moisture-proof and insulating material.
6. The LED package structure of claim 4, wherein the transparent filler comprises at least quartz glass, a lens, or a transparent glue.
7. The LED package structure of claim 2, wherein the supporting unit comprises a plurality of strip-shaped chip dams arranged in a staggered manner, and used for dividing the substrate into a plurality of independent spaces adjacent to each other in pairs.
8. The LED package structure of claim 2, wherein said support unit comprises a plurality of annular chip dams arranged in a nested arrangement for partitioning said substrate into a plurality of independent spaces in a nested annular shape.
9. An LED disinfection device, comprising:
the LED packaging structure comprises a plurality of ultraviolet wave band LED wafers and visible light wave band LED wafers;
and the control unit is electrically connected with the LED wafers in the wavelength bands and is used for controlling the control unit to emit light rays with different killing wave bands and killing effects according to the requirements by controlling whether the LED wafers in the ultraviolet wave bands emit light or not and the light intensity, and controlling the LED wafers in the visible light wave bands to emit illumination and/or warning light rays.
10. A disinfection lamp, comprising the LED package structure of any one of claims 1 to 8.
CN202110277321.6A 2021-03-15 2021-03-15 LED packaging structure and disinfection device and disinfection lamp applied to same Pending CN115084105A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202110277321.6A CN115084105A (en) 2021-03-15 2021-03-15 LED packaging structure and disinfection device and disinfection lamp applied to same
US18/281,965 US20240050612A1 (en) 2021-03-15 2021-05-26 Led package structure, and disinfection device and disinfection lamp applying same
PCT/CN2021/096092 WO2022193435A1 (en) 2021-03-15 2021-05-26 Led package structure, and disinfection device and disinfection lamp applying same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110277321.6A CN115084105A (en) 2021-03-15 2021-03-15 LED packaging structure and disinfection device and disinfection lamp applied to same

Publications (1)

Publication Number Publication Date
CN115084105A true CN115084105A (en) 2022-09-20

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CN202110277321.6A Pending CN115084105A (en) 2021-03-15 2021-03-15 LED packaging structure and disinfection device and disinfection lamp applied to same

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