CN115078469A - Glass substrate defect detection method and device - Google Patents
Glass substrate defect detection method and device Download PDFInfo
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- CN115078469A CN115078469A CN202210692023.8A CN202210692023A CN115078469A CN 115078469 A CN115078469 A CN 115078469A CN 202210692023 A CN202210692023 A CN 202210692023A CN 115078469 A CN115078469 A CN 115078469A
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- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 230000007547 defect Effects 0.000 title claims abstract description 25
- 239000011521 glass Substances 0.000 title claims abstract description 22
- 238000001514 detection method Methods 0.000 title abstract description 12
- 239000000523 sample Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 239000002346 layers by function Substances 0.000 claims description 2
- 238000013507 mapping Methods 0.000 claims 1
- 239000012634 fragment Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
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Abstract
The invention discloses a glass substrate defect detection method and a device, which comprises a TFT substrate, wherein a TFT circuit module is arranged on the TFT substrate, a conducting ring is arranged at the edge of the TFT substrate, a pair of probes are arranged on the conducting ring and are connected with an ohmmeter through wires, a closed conducting ring is designed at the edge of the TFT substrate, the resistance value of the conducting ring on the TFT substrate is measured by matching with the ohmmeter and two groups of probes, the measured resistance value and a set resistance are subjected to deviation calculation and are compared with a set resistance deviation threshold value, so that the defect of the substrate is judged, and the method and the device can accurately detect the edge crack quality defect of the TFT glass substrate on line; the problem of productivity reduction caused by fragment in the production process is avoided, low efficiency and accuracy of manual detection can be avoided, and the processing efficiency and reliability are improved.
Description
Technical Field
The invention belongs to the technical field of glass substrate detection, and particularly relates to a glass substrate defect detection method and device.
Background
The OLED light-emitting display comprises a TFT glass substrate and a cover plate, wherein the TFT substrate is cleaned firstly, then vacuum coating is carried out on the TFT substrate in an evaporation machine, and finally the TFT substrate and the cover plate are packaged and then cut into a display panel. Wherein during vacuum coating, the base plate needs bear mechanism's gravity in the coating by vaporization cavity after closely the pressfitting with the mask plate to in the material through the accurate target area who adheres to the base plate of mask plate, if there are defects such as tiny crackle or breach at the base plate edge, just very easily break during the pressure-bearing, whole processing procedure needs to stop with the clearance fragment this moment, the productivity suffers very big influence, and easily causes the mask plate to damage, causes obvious economic loss. At present, a TFT substrate only has the detection of more obvious defects such as unfilled corners and the like, and has no detection means aiming at edge fine cracks, for example, the fine cracks are often difficult to be detected by naked eyes by means of manual visual inspection, and in addition, no online substrate integrity detection means exists in a vacuum re-evaporation process.
Disclosure of Invention
The present invention is directed to a method and an apparatus for detecting defects of a glass substrate, so as to solve the problems of the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a glass substrate defect detecting device, includes the TFT base plate, be provided with TFT circuit module on the TFT base plate, the edge of TFT base plate is provided with the conducting ring, install a pair of probe on the conducting ring, and a pair of probe passes through the wire and is connected with the ohmmeter, carries out the resistance value to the conducting ring in order to make things convenient for and detects to judge the condition whether defective of base plate according to the resistance value.
Preferably, the conducting ring is located on one side of the TFT substrate circuit and can be made by stacking single-layer or multi-layer conducting materials, and the conducting ring and the conducting functional layer of the TFT substrate bottom layer circuit are manufactured by the same array process and the same photomask.
Preferably, the conductive ring has a rectangular structure, but is not limited to a circular ring and an irregular shape, and has a distance from an edge of less than 8mm, a width of greater than 1mm, and a height of less than a height of the packaging adhesive, so as to avoid affecting the packaging effect.
A glass substrate defect detection method; s1: the probes are mapped to preset positions of conducting rings on the TFT substrate, the two probes are connected with a resistance measuring instrument, and when the TFT substrate enters a probe mounting area, the TFT substrate or the probes are lifted until the conducting rings are attached to the probes;
s2: then, conducting resistance value measurement on the conducting ring, wherein the conducting ring is divided into two conductors by two probes, and the measured resistance is an equivalent resistance value formed by connecting the two conducting rings in parallel; when the glass substrate is broken or cracked, the conducting ring is broken, and the measured resistance value is the conductor on one side of the non-broken circuit and the non-equivalent resistance;
s3: then, the deviation c between the measured resistance a and the set resistance b is calculated, and the deviation is compared with a set resistance deviation threshold value d; c = | (a-b)/b |;
if Δ d > c, the substrate is normal and has no defect;
if Δ d < c, the substrate is abnormal, and there is a defect of cracks or missing corners.
Compared with the prior art, the invention has the beneficial effects that: the method and the device can accurately detect the quality defect of the edge crack of the TFT glass substrate on line; the problem of productivity reduction caused by fragment in the production process is avoided, low efficiency and accuracy of manual detection can be avoided, and the processing efficiency and reliability are improved.
Drawings
FIG. 1 is a schematic structural view of a TFT glass substrate according to the present invention;
FIG. 2 is a schematic view of the TFT glass substrate inspection of the present invention;
in the figure: 1. a TFT substrate; 2. a TFT circuit module; 3. and (6) conducting the ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides a technical solution: the utility model provides a glass substrate defect detecting device, includes TFT base plate 1, is provided with TFT circuit module 2 on the TFT base plate 1, and the edge of TFT base plate 1 is provided with conducting ring 3, installs a pair of probe on the conducting ring 3, and a pair of probe passes through the wire and is connected with the ohmmeter, for the convenience judge whether unusual the base plate, whether have the defect of crack, unfilled corner.
In this embodiment, preferably, the conductive ring 3 is located on one side of the TFT substrate circuit, and may be formed by stacking single-layer or multi-layer conductive materials, and is manufactured by the same array process and the same photomask as the conductive function layer of the TFT substrate bottom circuit; in the embodiment, preferably, the conductive ring 3 has a rectangular structure, but is not limited to a circular ring and an irregular shape, and has a distance from the edge of less than 8mm, a width of greater than 1mm, and a height of less than the height of the packaging adhesive.
A glass substrate defect detection method comprises the following steps: s1: the probes are mapped to preset positions of a conducting ring 3 on the TFT substrate 1, the two probes are connected with a resistance measuring instrument, and when the TFT substrate 1 enters a probe mounting area, the TFT substrate 1 or the probes are lifted to the conducting ring 3 to be attached to the probes;
s2: then, conducting resistance value measurement on the conducting ring, wherein the conducting ring is divided into two conductors by two probes, and the measured resistance is an equivalent resistance value formed by connecting the two conducting rings in parallel; when the glass substrate is broken or cracked, the conducting ring is broken, and the measured resistance value is the conductor on one side of the non-broken circuit and the non-equivalent resistance;
s3: then, the deviation c between the measured resistance a and the set resistance b is calculated, and the deviation is compared with a set resistance deviation threshold value d; c = | (a-b)/b |;
if Δ d > c, the substrate is normal and has no defect;
if Δ d < c, the substrate is abnormal, and there is a defect of cracks or missing corners.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a glass substrate defect detecting device, includes TFT base plate (1), be provided with TFT circuit module (2) on TFT base plate (1), its characterized in that: the edge of the TFT substrate (1) is provided with a conducting ring (3), a pair of probes is mounted on the conducting ring (3), and the pair of probes is connected with the ohmmeter through a conducting wire.
2. The glass substrate defect detecting apparatus according to claim 1, wherein: the conducting ring (3) is positioned on one side of the TFT substrate circuit and can be made by stacking single-layer or multi-layer conducting materials, and the conducting ring and the conducting functional layer of the TFT substrate bottom layer circuit are manufactured by the same array process and the same photomask.
3. The glass substrate defect detecting apparatus according to claim 1, wherein: the conducting ring (3) is of a rectangular structure, but not limited to a circular ring and irregular shapes, the distance between the conducting ring and the edge is less than 8mm, the width is greater than 1mm, and the height is less than the height of the packaging adhesive.
4. The method for detecting defects of a glass substrate according to any one of claims 1 to 3, wherein: s1: the method comprises the following steps of mapping probes to preset positions of conducting rings (3) on a TFT substrate (1), connecting the two probes with a resistance measuring instrument, and lifting the TFT substrate (1) or the probes until the conducting rings (3) are attached to the probes when the TFT substrate (1) enters a probe mounting area;
s2: then, conducting resistance value measurement on the conducting ring, wherein the conducting ring is divided into two conductors by two probes, and the measured resistance is an equivalent resistance value formed by connecting the two conducting rings in parallel; when the glass substrate is broken or cracked, the conducting ring is broken, and the measured resistance value is the conductor on one side of the non-broken circuit and the non-equivalent resistance;
s3: then, the deviation c between the measured resistance a and the set resistance b is calculated, and the deviation is compared with a set resistance deviation threshold value d; c = | (a-b)/b |;
if Δ d > c, the substrate is normal and has no defect;
if Δ d < c, the substrate is abnormal, and there is a defect of cracks or missing corners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210692023.8A CN115078469A (en) | 2022-06-17 | 2022-06-17 | Glass substrate defect detection method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210692023.8A CN115078469A (en) | 2022-06-17 | 2022-06-17 | Glass substrate defect detection method and device |
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| Publication Number | Publication Date |
|---|---|
| CN115078469A true CN115078469A (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210692023.8A Pending CN115078469A (en) | 2022-06-17 | 2022-06-17 | Glass substrate defect detection method and device |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201654182U (en) * | 2010-04-06 | 2010-11-24 | 北京京东方光电科技有限公司 | Substrate detecting equipment |
| CN103792702A (en) * | 2014-01-23 | 2014-05-14 | 北京京东方光电科技有限公司 | Substrate with detection frame, manufacturing method of substrate with detection frame and detection device of substrate with detection frame |
| CN105393165A (en) * | 2014-07-15 | 2016-03-09 | 华为技术有限公司 | Method for detecting substrate crack, substrate and detection circuit |
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2022
- 2022-06-17 CN CN202210692023.8A patent/CN115078469A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201654182U (en) * | 2010-04-06 | 2010-11-24 | 北京京东方光电科技有限公司 | Substrate detecting equipment |
| CN103792702A (en) * | 2014-01-23 | 2014-05-14 | 北京京东方光电科技有限公司 | Substrate with detection frame, manufacturing method of substrate with detection frame and detection device of substrate with detection frame |
| CN105393165A (en) * | 2014-07-15 | 2016-03-09 | 华为技术有限公司 | Method for detecting substrate crack, substrate and detection circuit |
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