CN115064326A - Electrostatic suppressor with controllable electrode gap and manufacturing method thereof - Google Patents

Electrostatic suppressor with controllable electrode gap and manufacturing method thereof Download PDF

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Publication number
CN115064326A
CN115064326A CN202210812611.0A CN202210812611A CN115064326A CN 115064326 A CN115064326 A CN 115064326A CN 202210812611 A CN202210812611 A CN 202210812611A CN 115064326 A CN115064326 A CN 115064326A
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China
Prior art keywords
layer
electrode
copper
lead
functional
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CN202210812611.0A
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Chinese (zh)
Inventor
张甦
戴剑
杨涛
李启迪
仇利民
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Semitel Electronics Co Ltd
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Semitel Electronics Co Ltd
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Priority to CN202210812611.0A priority Critical patent/CN115064326A/en
Publication of CN115064326A publication Critical patent/CN115064326A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105Varistor cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/30Apparatus or processes specially adapted for manufacturing resistors adapted for baking

Abstract

The invention discloses an electrostatic suppressor with a controllable electrode gap and a manufacturing method thereof, wherein the electrostatic suppressor comprises an upper electrode leading-out layer, a functional layer and a lower electrode leading-out layer which are sequentially arranged from top to bottom; the functional layer comprises a middle resin layer, an upper functional electrode layer and a lower functional electrode layer; the upper electrode lead-out layer comprises an upper resin layer and an upper lead-out end electrode, and the lower electrode lead-out layer comprises a lower resin layer and a lower lead-out end electrode; the upper lead-out terminal electrode, the upper functional electrode layer, the lower lead-out terminal electrode and the lower functional electrode layer are connected through metal copper filled in through holes formed in the upper resin layer, the middle resin layer and the lower resin layer; the functional layer is also filled with variable resistance slurry which penetrates up and down. The electrostatic suppressor realizes the variable resistance effect by utilizing the electrode gap and the variable resistance slurry in the micron level, thereby reducing the capacitance, improving the breakdown voltage and realizing the effective electrostatic protection effect.

Description

Electrostatic suppressor with controllable electrode gap and manufacturing method thereof
Technical Field
The invention relates to the technical field of static suppressors, in particular to a static suppressor with a controllable electrode gap and a manufacturing method thereof.
Background
The static electricity suppressor is a discrete passive element, and functions to convert a static voltage into a current that is discharged to the ground when static electricity occurs. Normally, the static electricity suppressor is in a high-resistance state, and when static electricity exists, the resistance of the element is reduced, so that the static voltage is converted into current to be discharged, and the static electricity suppressor plays a role in protection.
Static electricity can cause the semiconductor device to break down; as circuit line pitches have decreased due to advances in semiconductor chip technology, the tolerance to static electricity has also tended to decrease, thus requiring additional static suppressors for protection. The development of modern communication technology leads to faster and faster data transmission speed, but parasitic capacitance of elements has interference effect on high-frequency signals, and the faster the data transmission speed, the greater the influence of capacitance on signal transmission, so that a low-capacitance electrostatic suppressor is required.
The electrode gap of the existing static suppressor is formed in two ways, one is a cutting way, and the other is a chemical etching way. The gap formed by cutting cannot avoid metal residues formed by cutting, so that the possibility of short circuit or failure is increased, and the precision of the gap is limited due to the cutting tool and the high-speed rotation precision of the cutting tool in cutting, so that the breakdown voltage is different in size. The gap formed by chemical etching is limited by the thickness of the copper foil, generally the width is difficult to be less than 50 microns, and the electrostatic suppressor with lower breakdown voltage cannot be prepared.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide an electrostatic suppressor with a controllable electrode gap and a method for manufacturing the same. The electrostatic suppressor realizes the variable resistance effect by utilizing the electrode gap and the variable resistance slurry in the micron level, thereby reducing the capacitance, improving the breakdown voltage and realizing the effective electrostatic protection effect.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme: an electrode gap controllable static suppressor comprises an upper electrode lead-out layer, a functional layer and a lower electrode lead-out layer which are sequentially arranged from top to bottom; the functional layer comprises a middle resin layer, an upper functional electrode layer positioned on the upper surface of the middle resin layer and a lower functional electrode layer positioned on the lower surface of the middle resin layer; the upper electrode lead-out layer comprises an upper resin layer and an upper lead-out terminal electrode positioned on the upper surface of the upper resin layer, and the lower electrode lead-out layer comprises a lower resin layer and a lower lead-out terminal electrode positioned on the lower surface of the lower resin layer; the upper lead-out terminal electrode, the upper functional electrode layer, the lower lead-out terminal electrode and the lower functional electrode layer are connected through metal copper filled in through holes formed in the upper resin layer, the middle resin layer and the lower resin layer; the functional layer is also filled with variable resistance slurry which penetrates up and down.
Further, the thickness of the upper functional electrode layer and the lower functional electrode layer is 17-35 μm.
Further, the thickness of the middle resin layer is 8-35 μm, preferably 18-22 μm; the thickness of the upper resin layer and the lower resin layer is 50-150 μm.
Further, the variable resistance slurry comprises 10-45 wt% of metal powder, 5-50 wt% of inorganic powder, 3-25 wt% of rubber and 10-45 wt% of solvent; the metal powder is preferably one or the combination of more than two of aluminum powder, copper powder and nickel powder, and is further preferably aluminum powder with the particle diameter of 0.8-5 mu m; the inorganic powder is preferably one or a mixture of more than two of barium sulfate, calcium carbonate, magnesium oxide and aluminum oxide, and is further preferably barium sulfate with the particle size of 0.8-7 mu m; the rubber is preferably silicon rubber or fluorosilicone rubber; the solvent is preferably ethyl acetate or acetone.
Furthermore, the surface of the upper lead-out terminal electrode and the surface of the lower lead-out terminal electrode are both provided with a weldable coating.
The invention further provides a manufacturing method of the electrostatic suppressor with the controllable electrode gap, which comprises the following steps:
(1) providing a first resin plate coated with copper on both sides; etching through holes on the copper layers on the two surfaces of the first resin plate;
(2) pressing the resin plate I with the copper coated on the double surfaces processed in the step (1) on the resin plate II with the copper coated on the single surface, wherein the copper layer of the resin plate II with the copper coated on the single surface faces the outside;
(3) drilling the structure obtained in the step (2) at the position corresponding to the through hole to form a slurry filling hole penetrating through the first resin plate;
(4) filling variable resistance slurry in the slurry filling hole, and heating and curing;
(5) pressing a resin plate III with copper coated on one side on the upper surface of the resin plate I with copper coated on two sides; the copper layer of the resin plate III with one surface coated with copper faces to the outer layer;
(6) etching a copper layer on a resin plate III with copper coated on one side and a copper layer on a resin plate II with copper coated on one side to respectively form an upper leading-out end electrode and a lower leading-out end electrode;
(7) and (4) drilling holes at the upper leading-out terminal electrode and the lower leading-out terminal electrode corresponding to the structure formed in the step (6) to form a through filled through hole, and filling metal copper in the filled through hole.
Further, in the step (4), the varistor slurry comprises 10-45 wt% of metal powder, 5-50 wt% of inorganic powder, 3-25 wt% of rubber and 10-45 wt% of solvent; the metal powder is preferably one or the combination of more than two of aluminum powder, copper powder and nickel powder, and is further preferably aluminum powder with the particle diameter of 0.8-5 mu m; the inorganic powder is preferably one or a mixture of more than two of barium sulfate, calcium carbonate, magnesium oxide and aluminum oxide, and is further preferably barium sulfate with the particle size of 0.8-7 mu m; the rubber is preferably silicon rubber or fluorosilicone rubber; the solvent is preferably ethyl acetate or acetone.
Further, in the step (4), the temperature for heating and curing is 150-.
Further, in the step (7), after the metal copper is filled, a layer of weldable plating layer is respectively plated on the upper lead-out terminal electrode and the lower lead-out terminal electrode.
The invention has the beneficial effects that:
the invention adopts the micron-level middle resin layer as the electrode gap, and fills the variable resistance slurry in the electrode gap, thereby realizing the variable resistance effect by utilizing the matching of the smaller electrode gap and the variable resistance slurry, achieving the purpose of reducing the capacitance and the breakdown voltage, reducing the trigger voltage of the static suppressor, simultaneously increasing the stability, realizing the trigger of more than 50 percent of the static suppressor under the condition of 2KV, and avoiding short circuit and electric leakage caused by metal residues because the manufacturing process can ensure that no metal residues exist in the gap. The electrostatic suppressor manufactured by the invention can play an effective electrostatic protection role in wider line application.
In addition, the resin layer is used as the electrode gap, so that the smaller and more uniform electrode gap can be realized by adjusting the thickness of the resin layer; the processing process of the copper-clad resin plate is obtained by adopting an extrusion film-coating process, the processing precision of 1-3 mu m can be ensured, the processing precision is far higher than the processing precision of +/-5 mu m of a cutting process, and higher gap control precision can be realized, so that higher product consistency is ensured.
Drawings
Fig. 1 is an exploded view of an electrostatic suppressor with a controllable electrode gap according to embodiment 1 of the present invention.
Fig. 2 is an exploded schematic view of an electrostatic suppressor with a controllable electrode gap according to embodiment 2 of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
In the description of the present invention, it is to be understood that the terms "left", "right", "upper", "lower", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Example 1
The electrostatic suppressor with the controllable electrode gap of embodiment 1 includes an upper electrode lead-out layer 1, a functional layer 2, and a lower electrode lead-out layer 3, which are sequentially arranged from top to bottom; the functional layer 2 comprises an intermediate resin layer 21, an upper functional electrode layer 22 on the upper surface of the intermediate resin layer 21 and a lower functional electrode layer 23 on the lower surface of the intermediate resin layer 21; the upper electrode lead-out layer 1 comprises an upper resin layer 11 and an upper lead-out terminal electrode 12 positioned on the upper surface of the upper resin layer 11, and the lower electrode lead-out layer 3 comprises a lower resin layer 31 and a lower lead-out terminal electrode 32 positioned on the lower surface of the lower resin layer 31; the upper terminal electrode 12, the upper functional electrode layer 22, the lower terminal electrode 32, and the lower functional electrode layer 23 are connected to each other through metallic copper filled in through holes provided in the upper resin layer 11, the intermediate resin layer 21, and the lower resin layer 31; the functional layer 2 is also filled with a variable resistance paste 4 which is cured and penetrates up and down.
The thickness of the upper functional electrode layer 22 and the lower functional electrode layer 23 was 18 μm; the thickness of the intermediate resin layer 21 was 18 μm; the thickness of the upper resin layer 11 and the lower resin layer 31 was 50 μm.
In this example 1, the varistor slurry comprised 15 wt% of aluminum powder having a particle size of 1.5 μm, 35 wt% of barium sulfate powder having a particle size of 2 μm, 10 wt% of silicone rubber, and 40 wt% of ethyl acetate.
The surface of the upper lead electrode 12 and the surface of the lower lead electrode 32 are provided with solderable plating layers.
The method for manufacturing the electrostatic suppressor with a controllable electrode gap according to embodiment 1 includes the following steps:
(1) providing a first resin plate coated with copper on both sides; etching through holes on the copper layers on the two surfaces of the first resin plate; the first resin plate is used as an intermediate resin layer 21; the copper layer on the upper surface of the middle resin layer is used as an upper functional electrode layer 22, and the copper layer on the lower surface of the middle resin layer is used as a lower functional electrode layer 23;
(2) pressing the resin plate I with the copper coated on the double surfaces processed in the step (1) on the resin plate II with the copper coated on the single surface, wherein the copper layer of the resin plate II with the copper coated on the single surface faces the outside; the second resin plate serves as a lower resin layer 31;
(3) drilling the structure obtained in the step (2) at the position corresponding to the through hole by laser to form a slurry filling hole penetrating through the first resin plate;
(4) filling variable resistance slurry in the slurry filling hole, and heating and curing; the temperature of heating and curing is 150 ℃, and the curing time is 1.5 hours;
(5) pressing a resin plate III with copper coated on one side on the upper surface of the resin plate I with copper coated on both sides; the copper layer of the resin plate III with one surface coated with copper faces to the outer layer; the third resin plate is used as an upper resin layer 11;
(6) etching the copper layer on the resin plate III with one side coated with copper and the copper layer on the resin plate II with one side coated with copper to respectively form an upper leading-out terminal electrode 12 and a lower leading-out terminal electrode 32;
(7) forming a through filled through hole 5 by laser drilling at the upper leading-out terminal electrode 12 and the lower leading-out terminal electrode 32 corresponding to the structure formed in the step (6), and filling metal copper in the filled through hole 5; after filling, respectively electroplating a layer of weldable plating on the upper lead-out electrode and the lower lead-out electrode; the solderability plating layer is two layers, one layer is a nickel plating layer, and the other layer is a tin plating layer.
In this embodiment 1, an etching hole may be formed in advance by an etching process in step (2), and then laser drilling may be performed in step (7) corresponding to the position of the etching hole to form a through filled via hole 4 for filling with copper metal.
Example 2
The electrostatic suppressor with the controllable electrode gap of embodiment 2 includes an upper electrode lead-out layer 1, a functional layer 2, and a lower electrode lead-out layer 3, which are sequentially arranged from top to bottom; the functional layer 2 comprises an intermediate resin layer 21, an upper functional electrode layer 22 on the upper surface of the intermediate resin layer 21, and a lower functional electrode layer 23 on the lower surface of the intermediate resin layer 21; the upper electrode lead-out layer 1 comprises an upper resin layer 11 and an upper lead-out terminal electrode 12 positioned on the upper surface of the upper resin layer 11, and the lower electrode lead-out layer 3 comprises a lower resin layer 31 and a lower lead-out terminal electrode 32 positioned on the lower surface of the lower resin layer 31; the upper terminal electrode 12, the upper functional electrode layer 22, the lower terminal electrode 32, and the lower functional electrode layer 23 are connected to each other through metallic copper filled in through holes provided in the upper resin layer 11, the intermediate resin layer 21, and the lower resin layer 31; the functional layer 2 is also filled with variable resistance paste 4 which penetrates up and down.
The thickness of the upper functional electrode layer 22 and the lower functional electrode layer 23 was 18 μm; the thickness of the intermediate resin layer 21 was 22 μm; the thickness of the upper resin layer 11 and the lower resin layer 31 was 60 μm.
In this example 2, the varistor slurry comprised 25 wt% of aluminum powder having a particle size of 1.5 μm, 40 wt% of barium sulfate powder having a particle size of 2 μm, 15 wt% of silicone rubber, and 20 wt% of ethyl acetate.
The surface of the upper lead electrode 12 and the surface of the lower lead electrode 32 are provided with a solderable plating.
The method for manufacturing the electrostatic suppressor with a controllable electrode gap according to embodiment 2 includes the following steps:
(1) providing a first resin plate coated with copper on both sides; etching through holes on the copper layers on the two surfaces of the first resin plate; the first resin plate is used as an intermediate resin layer 21; the copper layer on the upper surface of the middle resin layer is used as an upper functional electrode layer 22, and the copper layer on the lower surface of the middle resin layer is used as a lower functional electrode layer 23;
(2) pressing the resin board I with the copper coated on the two sides after the treatment in the step (1) on the resin board II with the copper coated on the other side, wherein the copper layer of the resin board II with the copper coated on the single side faces the outside; the second resin plate serves as a lower resin layer 31;
(3) drilling the structure obtained in the step (2) at the position corresponding to the through hole to form a slurry filling hole penetrating through the first resin plate;
(4) filling variable resistance slurry in the slurry filling hole, and heating and curing; the temperature of heating and curing is 160 ℃, and the curing time is 2 hours;
(5) pressing a resin plate III with copper coated on one side on the upper surface of the resin plate I with copper coated on both sides; the copper layer of the resin plate III with one surface coated with copper faces to the outer layer; the third resin plate is used as an upper resin layer 11;
(6) etching the copper layer on the resin plate III with one side coated with copper and the copper layer on the resin plate II with one side coated with copper to respectively form an upper leading-out terminal electrode 12 and a lower leading-out terminal electrode 32;
(7) forming a through filled through hole 5 by laser drilling at the end parts of the upper leading-out terminal electrode 12 and the lower leading-out terminal electrode 32 corresponding to the structure formed in the step (6), and filling metal copper in the filled through hole 5; after filling, respectively electroplating a layer of weldable plating on the upper lead-out electrode and the lower lead-out electrode; the weldable coating is two layers, one layer is a nickel-plating layer, and the other layer is a gold-plating layer.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.

Claims (9)

1. An electrode gap controllable static suppressor is characterized by comprising an upper electrode leading-out layer, a functional layer and a lower electrode leading-out layer which are sequentially arranged from top to bottom; the functional layer comprises a middle resin layer, an upper functional electrode layer positioned on the upper surface of the middle resin layer and a lower functional electrode layer positioned on the lower surface of the middle resin layer; the upper electrode lead-out layer comprises an upper resin layer and an upper lead-out terminal electrode positioned on the upper surface of the upper resin layer, and the lower electrode lead-out layer comprises a lower resin layer and a lower lead-out terminal electrode positioned on the lower surface of the lower resin layer; the upper lead-out terminal electrode, the upper functional electrode layer, the lower lead-out terminal electrode and the lower functional electrode layer are connected through metal copper filled in through holes formed in the upper resin layer, the middle resin layer and the lower resin layer; the functional layer is also filled with variable resistance slurry which penetrates up and down.
2. An electrostatic suppressor according to claim 1, wherein the upper functional electrode layer and the lower functional electrode layer have a thickness of 17 to 35 μm.
3. An electrode gap controllable electrostatic suppressor according to claim 1 or 2, wherein said intermediate resin layer has a thickness of 8 to 35 μm; the thickness of the upper resin layer and the lower resin layer is 50-150 μm.
4. The electrostatic suppressor with the controllable electrode gap as claimed in claim 1, wherein the varistor slurry comprises 10-45 wt% of metal powder, 5-50 wt% of inorganic powder, 3-25 wt% of rubber, and 10-45 wt% of solvent.
5. An electrostatic suppressor with a controllable electrode gap as claimed in claim 1, wherein a surface of said upper lead electrode and a surface of said lower lead electrode are provided with a solderable plating.
6. A manufacturing method of an electrostatic suppressor with a controllable electrode gap is characterized in that: the method comprises the following steps:
(1) providing a first resin plate coated with copper on both sides; etching through holes on the copper layers on the two surfaces of the first resin plate;
(2) pressing the resin plate I with the copper coated on the double surfaces processed in the step (1) on the resin plate II with the copper coated on the single surface, wherein the copper layer of the resin plate II with the copper coated on the single surface faces the outside;
(3) drilling the structure obtained in the step (2) at the position corresponding to the through hole to form a slurry filling hole penetrating through the first resin plate;
(4) filling variable resistance slurry in the slurry filling hole, and heating and curing;
(5) pressing a resin plate III with copper coated on one side on the upper surface of the resin plate I with copper coated on both sides; the copper layer of the resin plate III with one surface coated with copper faces to the outer layer;
(6) etching a copper layer on a resin plate III with copper coated on one side and a copper layer on a resin plate II with copper coated on one side to respectively form an upper leading-out end electrode and a lower leading-out end electrode;
(7) and (4) drilling holes at the upper leading-out terminal electrode and the lower leading-out terminal electrode corresponding to the structure formed in the step (6) to form a through filled through hole, and filling metal copper in the filled through hole.
7. The method of claim 6, wherein the step of forming the electrostatic suppressor with a controllable electrode gap comprises: in the step (4), the varistor slurry comprises 10-45 wt% of metal powder, 5-50 wt% of inorganic powder, 3-25 wt% of rubber and 10-45 wt% of solvent.
8. The method of claim 6, wherein the step of forming the electrostatic suppressor with a controllable electrode gap comprises: in the step (4), the temperature for heating and curing is 150-170 ℃, and the curing time is 1-3 hours.
9. The method of claim 6, wherein the step of forming the electrostatic suppressor with the controllable electrode gap comprises the steps of: in the step (7), after the metal copper is filled, a layer of weldable plating layer is respectively plated on the upper lead-out terminal electrode and the lower lead-out terminal electrode.
CN202210812611.0A 2022-07-12 2022-07-12 Electrostatic suppressor with controllable electrode gap and manufacturing method thereof Pending CN115064326A (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007265713A (en) * 2006-03-28 2007-10-11 Matsushita Electric Ind Co Ltd Static electricity protective material paste and static electricity countermeasure part using it
CN101221847A (en) * 2007-12-13 2008-07-16 上海长园维安电子线路保护股份有限公司 Label type polymer base ESD protection device and manufacturing method thereof
KR20100101225A (en) * 2009-03-09 2010-09-17 주식회사 이노칩테크놀로지 Circuit protection device
US20110286142A1 (en) * 2010-05-20 2011-11-24 Murata Manufacturing Co., Ltd. Esd protection device and method for producing the same
CN103035625A (en) * 2012-12-30 2013-04-10 深圳中科系统集成技术有限公司 Processing method of one-way electrostatic discharge (ESD) protective device
CN103050492A (en) * 2012-12-30 2013-04-17 深圳中科系统集成技术有限公司 Single-path electrostatic discharge (ESD) protection device
CN103943291A (en) * 2014-02-21 2014-07-23 南京萨特科技发展有限公司 Static suppressor with overcurrent protection functions, and manufacturing method thereof
KR20190080272A (en) * 2017-12-28 2019-07-08 주식회사 아모텍 Device for protecting overvoltage and method for manufacturing the same
CN112770614A (en) * 2020-12-07 2021-05-07 深圳顺络电子股份有限公司 Electrostatic suppressor and manufacturing method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007265713A (en) * 2006-03-28 2007-10-11 Matsushita Electric Ind Co Ltd Static electricity protective material paste and static electricity countermeasure part using it
CN101221847A (en) * 2007-12-13 2008-07-16 上海长园维安电子线路保护股份有限公司 Label type polymer base ESD protection device and manufacturing method thereof
KR20100101225A (en) * 2009-03-09 2010-09-17 주식회사 이노칩테크놀로지 Circuit protection device
US20110286142A1 (en) * 2010-05-20 2011-11-24 Murata Manufacturing Co., Ltd. Esd protection device and method for producing the same
CN103035625A (en) * 2012-12-30 2013-04-10 深圳中科系统集成技术有限公司 Processing method of one-way electrostatic discharge (ESD) protective device
CN103050492A (en) * 2012-12-30 2013-04-17 深圳中科系统集成技术有限公司 Single-path electrostatic discharge (ESD) protection device
CN103943291A (en) * 2014-02-21 2014-07-23 南京萨特科技发展有限公司 Static suppressor with overcurrent protection functions, and manufacturing method thereof
KR20190080272A (en) * 2017-12-28 2019-07-08 주식회사 아모텍 Device for protecting overvoltage and method for manufacturing the same
CN112770614A (en) * 2020-12-07 2021-05-07 深圳顺络电子股份有限公司 Electrostatic suppressor and manufacturing method thereof

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