CN115059904A - Bionic surface reinforced heat transfer radiator - Google Patents

Bionic surface reinforced heat transfer radiator Download PDF

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Publication number
CN115059904A
CN115059904A CN202210714871.4A CN202210714871A CN115059904A CN 115059904 A CN115059904 A CN 115059904A CN 202210714871 A CN202210714871 A CN 202210714871A CN 115059904 A CN115059904 A CN 115059904A
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CN
China
Prior art keywords
fin
substrate
heat transfer
lamp
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210714871.4A
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Chinese (zh)
Inventor
周建阳
田植群
李昌铮
蒙浩盛
黄敏津
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Guangxi University
Original Assignee
Guangxi University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangxi University filed Critical Guangxi University
Priority to CN202210714871.4A priority Critical patent/CN115059904A/en
Publication of CN115059904A publication Critical patent/CN115059904A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The invention discloses a bionic surface enhanced heat transfer radiator, which comprises: the lower surface of the substrate is used for mounting a lamp; the heat conduction column is arranged on the substrate and is positioned on the upper surface of the substrate; and a plurality of fins, it is a plurality of the fin along the axis evenly distributed of heat conduction post in the surface of heat conduction post, every there is clearance space between the fin, every be hollow structure and form the cavity in the fin, this cavity intussuseption is filled with the honeycomb panel to form a plurality of honeycomb holes, every honeycomb hole runs through the upper end and the lower extreme of fin. According to the bionic surface enhanced heat transfer radiator, the lamp is arranged on the lower surface of the substrate, heat generated by the lamp is quickly absorbed by the heat conduction column and is transferred to the surrounding environment in a natural convection mode through the fins with the honeycomb holes, so that the cooling effect is achieved, and the lamp can work at the safe working temperature range. The service life of the lamp is prolonged.

Description

Bionic surface reinforced heat transfer radiator
Technical Field
The invention relates to the technical field of radiators, in particular to a bionic surface enhanced heat transfer radiator.
Background
Semiconductor Light Emitting Diodes (LEDs) also generate heat during operation, which depends somewhat on the overall luminous efficiency. Under the action of external electric energy, electrons and holes are radiated and recombined to generate electroluminescence, and light radiated from the vicinity of a PN junction can reach the outside (air) through a semiconductor medium and an encapsulation medium of a chip. By integrating the current injection efficiency, the radiant luminescence quantum efficiency, the chip external light extraction efficiency and the like, only 30-40% of input electric energy is converted into light energy finally, and the rest 60-70% of energy is mainly converted into heat energy in the form of lattice vibration generated by non-radiative recombination.
Generally, whether the LED lamp works stably or not, the quality is good or bad, the LED lamp is crucial to heat dissipation of a lamp body, and natural heat dissipation is often adopted for heat dissipation of high-brightness LED lamps in the market, so that the effect is not ideal. An LED lamp manufactured by an LED light source consists of an LED, a heat dissipation structure, a driver and a lens, so that heat dissipation is also an important part, and if the LED cannot dissipate heat well, the service life of the LED can be influenced.
Currently, due to technical limitations, the photoelectric conversion efficiency of LEDs is still very low, and most of the electric energy is converted into heat energy. Because the operating characteristics of semiconductor devices are extremely sensitive to temperature, if heat is not dissipated in time, the higher the temperature of the LED light source is, the lower the luminous efficiency of the LED is, and light attenuation is caused to influence the service life of the LED lamp. Therefore, heat dissipation design for LEDs becomes very important.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a bionic surface enhanced heat transfer radiator, so that the defects of poor radiating effect of the radiator, shortened service life of a lamp and the like are overcome.
In order to achieve the above object, the present invention provides a bionic surface enhanced heat transfer radiator, comprising: the lower surface of the substrate is used for mounting a lamp; the heat conduction column is arranged on the substrate and is positioned on the upper surface of the substrate; and a plurality of fins, it is a plurality of the fin along the axis evenly distributed of heat conduction post in the surface of heat conduction post, every there is clearance space between the fin, every be hollow structure and form the cavity in the fin, this cavity intussuseption is filled with the honeycomb panel to form a plurality of honeycomb holes, every honeycomb hole runs through the upper end and the lower extreme of fin.
Preferably, among the above-mentioned technical scheme, be equipped with the ventilation hole on the fin, the ventilation hole with honeycomb holes mutually perpendicular sets up, runs through the plate body of fin both sides.
Preferably, in the above technical solution, the vent hole is disposed near one end of the substrate.
Preferably, in the above technical solution, the heat conduction column is a cylindrical structure.
Preferably, in the above technical solution, the fin has a fan-shaped structure.
Preferably, in the above technical solution, the substrate, the heat conduction column, and the fin are made of an aluminum alloy material.
Preferably, in the above technical solution, mounting threaded holes are distributed on the lower surface of the substrate.
Compared with the prior art, the invention has the following beneficial effects: according to the bionic surface enhanced heat transfer radiator, the lamp is arranged on the lower surface of the substrate, heat generated by the lamp is quickly absorbed by the heat conduction column and is transferred to the surrounding environment in a natural convection mode through the fins with the honeycomb holes, so that the cooling effect is achieved, and the lamp can work at the safe working temperature range. The service life of the LED lamp is prolonged. The radiator is particularly suitable for radiating the LED lamp.
Drawings
FIG. 1 is a schematic structural diagram of a bionic surface enhanced heat transfer radiator according to the present invention;
FIG. 2 is a partially enlarged schematic view of a fin of the bionic surface enhanced heat transfer radiator according to the present invention;
FIG. 3 is a schematic side view of a bionic surface enhanced heat transfer heat sink according to the present invention;
description of the main reference numerals:
1-substrate, 2-heat-conducting column, 3-fin, 4-gap space and 5-honeycomb plate. 6-honeycomb holes and 7-vent holes.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in fig. 1 to 3, a bionic surface enhanced heat transfer radiator according to an embodiment of the present invention includes a substrate 1, a heat-conducting pillar 2, and fins 3. The lamps and lanterns are installed on the lower surface of basement 1, and heat conduction post 2 is installed at the upper surface of basement 1, and the surface evenly distributed of heat conduction post 2 has a plurality of fins 3. Heat generated by the work of the lamp is conducted to the heat conducting column 2 through the substrate 1, the heat conducting column 2 absorbs the heat rapidly, and the heat is transferred to the surrounding environment through the fins 3.
The specific mechanism is as follows: the substrate 1 is a circular mechanism and is made of aluminum alloy materials. Preferably, a plurality of mounting threaded holes are distributed on the lower surface of the substrate 1, so that the radiator can be conveniently fixed on the lamp body by using screws. I.e. the lamp is mounted on the lower surface of the base. The surface mounting has heat conduction post 2 on the basement 1, and heat conduction post 2 can be cylindrical, cuboid structure, and this embodiment is preferred to be cylindrical. The heat conduction column is made of aluminum alloy materials. The outer surface of the heat conduction column 2 is provided with a fin 3. Fin 3 is made for the aluminum alloy material. A plurality of fins 3 are circumference evenly distributed at the surface of heat conduction post 2 along the axis direction of heat conduction post, have clearance space 4 between the fin. So as to enhance the natural convection heat exchange effect. Be hollow structure and vacuole formation in the fin 2, the cavity intussuseption is filled with honeycomb panel 5 and forms a plurality of honeycomb holes 6, and every honeycomb hole 6 runs through the upper end and the lower extreme of fin 3. The cross section of the honeycomb holes 6 is of a hexagonal structure. Preferably, the honeycomb panel 5 is integrally formed with the body of the fin 3.
Lamps and lanterns during operation, the heat conducts to heat conduction post 2 through basement 1, and heat conduction post 2 absorbs the heat fast, and fin 3 is hollow structure, is equipped with a plurality of honeycomb holes 6 that run through 3 upper ends of fin and lower extreme in the cavity. Be equipped with honeycomb holes 6 in the fin 3, can increase heat radiating surface area, the absorptive heat of heat conduction post reaches rapid cooling's effect through natural convection mode with heat transfer to surrounding environment through fin 3. A gap space 4 is arranged between the fins 2, and the gap space 4 can enhance the natural convection heat exchange effect.
Preferably, fins 3 are fan-shaped structures, and the fan-shaped structures of the fins are arranged on the cylindrical heat conducting column 2, so that the structure of the whole radiator is more compact. And the surface area of the radiating fin is large, so that the radiating surface area is increased.
Preferably, be equipped with ventilation hole 7 on the fin 3, ventilation hole 7 sets up with honeycomb holes 6 mutually perpendicular, runs through the plate body of fin 3 both sides. The ventilation holes 7 are arranged to accelerate air convection and enhance the heat dissipation effect of the fins.
Preferably, the vent 7 is located close to the lower end of the fin 3, i.e. the vent 7 is located close to one end of the substrate 1. Because the heat temperature near the substrate 1 is higher, the vent holes 7 are arranged near the substrate 1, so that the air circulation in the area can be accelerated, and the heat dissipation effect is enhanced.
The foregoing description of specific exemplary embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (7)

1. A bionic surface enhanced heat transfer radiator is characterized by comprising:
the lower surface of the substrate is used for mounting a lamp;
the heat conduction column is arranged on the substrate and is positioned on the upper surface of the substrate; and
a plurality of fins, it is a plurality of the fin along the axis direction evenly distributed in the surface of heat conduction post, every there is clearance space, every in the fin be hollow structure and vacuole formation in, this cavity intussuseption is filled with the honeycomb panel to form a plurality of honeycomb holes, every the honeycomb hole runs through the upper end and the lower extreme of fin.
2. The bionic surface enhanced heat transfer radiator of claim 1, wherein the fin is provided with a vent hole, the vent hole is perpendicular to the honeycomb holes and penetrates through the plate bodies on two sides of the fin.
3. The bionic surface enhanced heat transfer radiator of claim 2, wherein the vent hole is arranged near one end of the substrate.
4. The bionic surface enhanced heat transfer radiator of claim 1, wherein the heat conducting column is a cylindrical structure.
5. The bionic surface enhanced heat transfer radiator of claim 1, wherein the fins are fan-shaped.
6. The bionic surface enhanced heat transfer radiator of claim 1, wherein the substrate, the heat conduction column and the fin are made of aluminum alloy materials.
7. The bionic surface enhanced heat transfer radiator of claim 1, wherein mounting threaded holes are distributed on the lower surface of the substrate.
CN202210714871.4A 2022-06-14 2022-06-14 Bionic surface reinforced heat transfer radiator Pending CN115059904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210714871.4A CN115059904A (en) 2022-06-14 2022-06-14 Bionic surface reinforced heat transfer radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210714871.4A CN115059904A (en) 2022-06-14 2022-06-14 Bionic surface reinforced heat transfer radiator

Publications (1)

Publication Number Publication Date
CN115059904A true CN115059904A (en) 2022-09-16

Family

ID=83201897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210714871.4A Pending CN115059904A (en) 2022-06-14 2022-06-14 Bionic surface reinforced heat transfer radiator

Country Status (1)

Country Link
CN (1) CN115059904A (en)

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