CN115058100A - Modified carbon fiber heat-conducting composite material and preparation method thereof - Google Patents
Modified carbon fiber heat-conducting composite material and preparation method thereof Download PDFInfo
- Publication number
- CN115058100A CN115058100A CN202210566181.9A CN202210566181A CN115058100A CN 115058100 A CN115058100 A CN 115058100A CN 202210566181 A CN202210566181 A CN 202210566181A CN 115058100 A CN115058100 A CN 115058100A
- Authority
- CN
- China
- Prior art keywords
- carbon fiber
- composite material
- preparation
- resin
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000002131 composite material Substances 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 45
- 239000004917 carbon fiber Substances 0.000 claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000011049 filling Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000005011 phenolic resin Substances 0.000 claims abstract description 7
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 7
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 5
- 229920001225 polyester resin Polymers 0.000 claims abstract description 5
- 239000004645 polyester resin Substances 0.000 claims abstract description 5
- 238000001723 curing Methods 0.000 claims description 36
- 239000002270 dispersing agent Substances 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 239000010405 anode material Substances 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 7
- 238000004070 electrodeposition Methods 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 7
- 239000003945 anionic surfactant Substances 0.000 claims description 5
- 239000010406 cathode material Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- -1 polyoxyethylene Polymers 0.000 claims description 5
- 239000003093 cationic surfactant Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000002736 nonionic surfactant Substances 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 239000002888 zwitterionic surfactant Substances 0.000 claims description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 238000003811 acetone extraction Methods 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 claims description 2
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 2
- 125000003275 alpha amino acid group Chemical group 0.000 claims description 2
- 229960003237 betaine Drugs 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims description 2
- 238000001227 electron beam curing Methods 0.000 claims description 2
- 238000011416 infrared curing Methods 0.000 claims description 2
- 239000011244 liquid electrolyte Substances 0.000 claims description 2
- 238000003847 radiation curing Methods 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 238000009210 therapy by ultrasound Methods 0.000 claims description 2
- 125000005456 glyceride group Chemical group 0.000 claims 1
- 150000003856 quaternary ammonium compounds Chemical group 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 6
- 230000000704 physical effect Effects 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 229920006305 unsaturated polyester Polymers 0.000 description 3
- 238000003828 vacuum filtration Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A modified carbon fiber heat-conducting composite material and a preparation method thereof belong to the field of heat-conducting material preparation. The invention aims to solve the problem that phonon scattering thermal resistance cannot be reduced in the heat conduction process of the existing filling type heat conduction composite material, the heat conduction composite material is the filling type heat conduction composite material and comprises a filler component and a matrix component, the matrix component is one of epoxy resin, phenolic resin, polyester resin or polyamide resin, the filler component is metal modified recycled chopped carbon fiber and is doped into an epoxy resin matrix in the form of a filler. The composite material has the advantages of simple and easily obtained raw materials and simple and easy preparation method. The filler component is modified carbon fiber, the matrix component is resin, and the carbon fiber has mechanical properties of high strength and high modulus and excellent heat conductivity; the selected resin has good heat resistance and stability, and makes full use of the physical properties of the resin and the resin.
Description
Technical Field
The invention belongs to the field of preparation of heat conduction materials, and particularly relates to a modified carbon fiber heat conduction composite material and a preparation method thereof.
Background
In recent years, with the rapid development of new package technologies such as system-in-package, electronic products are increasingly being thinned and integrated, but this usually results in higher heat generation temperature. Overheating often causes the service life and the operation stability of the device to be greatly reduced, and how to realize effective heat dissipation gradually becomes a bottleneck problem restricting the development of electronic devices.
The epoxy resin molecules have strong cohesive force and compact molecular structure, so the epoxy resin has the characteristics of high mechanical property, strong adhesive force, good stability, small expansion coefficient, good dielectric property, small curing shrinkage, corrosion resistance and the like. It is widely used in the electronics industry due to its excellent electrical insulation and chemical resistance.
Due to the complexity of the orientation process and the intervention of organic components, the filled heat-conducting composite material can not reduce a large amount of interface thermal resistance consumed between the particles and the polymer chain in the transmission process of phonons. The problem is avoided by controlling the fillers to be directly interconnected to form a three-dimensional continuous heat conduction network, the maximum heat conduction efficiency of the heat conduction particles is directly exerted, the heat conduction enhancement effect on the composite material is further remarkable, and the research method is concerned.
With the rapid development of microelectronic technology, electronic components are developing towards multifunction, miniaturization, high power density and low cost, and therefore, it is urgently needed to develop a thermal management material with high thermal conductivity to dissipate heat generated by the electronic components, so as to ensure the reliability and stability of the electronic components in service.
Disclosure of Invention
The invention aims to solve the problem that phonon scattering thermal resistance cannot be reduced in the heat conduction process of the existing filling type heat conduction composite material, and provides a modified carbon fiber heat conduction composite material and a preparation method thereof.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the modified carbon fiber heat-conducting composite material is a filling type heat-conducting composite material and comprises a filler component and a matrix component, wherein the matrix component is one of epoxy resin, phenolic resin, polyester resin or polyamide resin, the filler component is metal modified recycled chopped carbon fibers, the metal modified recycled chopped carbon fibers are doped into the epoxy resin matrix in the form of filler, the chopped carbon fibers have smaller length-diameter ratio, and a three-dimensional heat-conducting network can be established in a mutually overlapped mode. The filling type is doped in the form of filler, the filler components are filled in the epoxy resin, the short carbon fibers can be mutually overlapped, long fibers are difficult to overlap, and the specific type of the matrix epoxy resin can be changed according to design requirements in actual use so as to meet different use requirements and application places.
A preparation method of the modified carbon fiber heat-conducting composite material comprises the following steps:
the method comprises the following steps: etching the chopped carbon fibers extracted by acetone, fully dispersing the chopped carbon fibers in a dispersing agent, and preparing a chopped carbon fiber dispersion liquid into a carbon fiber felt;
step two: immersing the carbon fiber felt obtained in the step one as a cathode material and a 99.95% purity metal sheet as an anode material into an electrolyte, and performing direct current deposition to obtain a modified carbon fiber felt;
step three: and (3) immersing the modified carbon fiber felt obtained in the step two into a resin curing system, and curing to obtain the modified carbon fiber heat-conducting composite material.
Further, in the first step, the acetone extraction time is at least 24 hours; the size of the chopped carbon fiber is 3mm-50 mm; the mass fraction of the chopped carbon fibers in the dispersing agent is 2-20 wt%.
Further, in the first step, the etching method is one of plasma etching, chemical etching or electrochemical etching.
Further, in the first step, the dispersant is one or more of a nonionic surfactant, a zwitterionic surfactant, an anionic surfactant or a cationic surfactant; in the carbon fiber dispersion process, an anionic surfactant is used as a dispersant, and the chopped carbon fiber dispersion liquid which is slowly settled is obtained by fully stirring.
Further, in the first step, the nonionic surfactant is fatty acid glyceride or polyoxyethylene fatty acid ester, the zwitterionic surfactant is amino acid type betaine type, the anionic surfactant is sulfate or sulfonate, and the cationic surfactant is quaternary ammonium salt.
Further, in the second step, the electrolyte is a liquid electrolyte containing zinc ions, and is fully stirred for 40 min; the current density of the electrodeposition is 5A/dm 2 -15A/dm 2 The time is 1-30 min. The current density is too low to directly influence the deposition rate of the coating, the current density is too high, and although the deposition rate is high, the coating can be burnt; the electroplating time is increased, the thickness of the plating layer is increased, the binding force of the plating layer is increased, and the heat conduction path is more stable.
Further, in the second step, the anode material is cylindrical, so that the current density distribution in the electrodeposition process is uniform.
Further, in the third step, the curing is one of far infrared radiation curing, ultraviolet curing, electron beam curing, near infrared curing, normal temperature curing, medium temperature curing or high temperature curing.
Further, in the third step, the resin curing system is one of epoxy resin, phenolic resin, polyester resin or polyamide resin and a curing agent, fully stirring, and performing ultrasonic treatment for 30min to eliminate bubbles; the curing condition is high-temperature curing, precuring is carried out for 2h at 100 ℃, hot pressing is carried out for 2h at 120 ℃ and 180 ℃, and the pressure is 10 MPa. The mould used in the hot-press curing process is a steel strip mould coated with a release agent.
Compared with the prior art, the invention has the beneficial effects that:
(1) the composite material has the advantages of simple and easily obtained raw materials and simple and easy preparation method. The filler component is modified carbon fiber, the matrix component is resin, and the carbon fiber has mechanical properties of high strength and high modulus and excellent heat conductivity; the selected resin has good heat resistance and stability, and makes full use of the physical properties of the resin and the resin.
(2) The filler of the heat-conducting composite material has a rough surface galvanizing structure, the specific surface area is large, the bonding force with matrix resin is strong (increased from 30MPa to 37MPa), and the obtained composite material has good mechanical property.
(3) The heat-conducting composite material can construct a complete heat-conducting network in a matrix, reduce the interface thermal resistance generated by phonon scattering, improve the problem of poor heat conductivity of epoxy resin, and has high heat-conducting speed (the temperature can jump to 80 ℃ within 45 s) and good thermal stability (the glass transition temperature of the composite material is increased by 16 ℃).
(4) The heat-conducting composite material can be applied to low-temperature or high-temperature heat management places in actual use, and has universality.
Drawings
FIG. 1 is a scanning electron micrograph of unmodified chopped carbon fibers;
FIG. 2 is a scanning electron micrograph of modified chopped carbon fibers;
FIG. 3 is a scanning electron micrograph of a fracture of a thermally conductive composite;
FIG. 4 is an infrared thermal imaging of a thermally conductive composite during heat transfer;
fig. 5 is a schematic view of a site where the thermally conductive composite material is applied.
Detailed Description
The technical solutions of the present invention are further described below with reference to the drawings and the embodiments, but the present invention is not limited thereto, and modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Example 1:
a modified carbon fiber heat-conducting composite material is a filling type heat-conducting composite material and comprises a filler component and a matrix component, wherein the filler component is modified carbon fibers, the modification method is electrodeposition of metal zinc, the carbon fibers are recycled chopped carbon fibers, and the matrix component is epoxy resin.
Specifically, the manufacturing steps of the heat-conducting composite material comprise:
the method comprises the following steps: subjecting the 3mm chopped carbon fiber subjected to acetone extraction to 68% HNO 3 Acid washing and etching for 30min, fully dispersing the chopped carbon fibers in a dispersing agent SDBS for 40min, and carrying out vacuum filtration on the dispersion liquid to obtain a carbon fiber felt, wherein the carbon fiber felt is a scanning electron microscope photo of unmodified chopped carbon fibers as shown in figure 1;
step two: soaking the obtained carbon fiber felt as cathode material and zinc sheet as anode material in electrolyte ZnSO 4 At a current density of 15A/dm 2 And D, performing direct current and electrodeposition for 5min to obtain the modified carbon fiber felt, wherein as shown in FIG. 2, the modified chopped carbon fiber felt is a scanning electron microscope photo of the modified chopped carbon fiber, and the modified carbon fiber felt is known to have a scale structure on the surface, improve the roughness and obviously increase the specific surface area, and the large specific surface area is favorable for being combined with an epoxy resin matrix and improving the mechanical strength of the composite material.
Step three: and (3) immersing the obtained modified carbon fiber felt into an E-51 epoxy resin curing system, wherein the epoxy resin: 32, carrying out high-temperature hot pressing on a curing agent, wherein the curing condition is precuring for 2h at 100 ℃, the curing condition is pre-curing for 2h at 120 ℃, the curing condition is hot pressing for 2h at 180 ℃, and the pressure is 10MPa, so as to obtain the modified carbon fiber/epoxy resin heat-conducting composite material, and characterizing the section of the heat-conducting composite material by using a scanning electron microscope, wherein the section is a fracture morphology graph of the modified carbon fiber heat-conducting composite material as shown in FIG. 3;
example 2:
the embodiment is different from embodiment 1 in that the manufacturing steps of the heat-conducting composite material include:
the method comprises the following steps: carrying out plasma etching on 5mm chopped carbon fibers extracted by acetone for 40min to obtain a rough surface structure, fully dispersing the chopped carbon fibers in a dispersant hydroxymethyl cellulose for 40min, and carrying out vacuum filtration on the dispersion to obtain the carbon fiber felt.
Step two: soaking the obtained carbon fiber felt as cathode material and zinc sheet as anode material in electrolyte ZnSO 4 At a current density of 15A/dm 2 And D, performing direct current electrodeposition for 10min to obtain the modified carbon fiber felt.
Step three: and (2) immersing the obtained modified carbon fiber felt into a phenolic resin curing system, wherein the using amount of a curing agent is 5-10%, and curing at 180 ℃ for 2 hours to obtain the modified carbon fiber/phenolic resin heat-conducting composite material.
The obtained heat-conducting composite material is placed on a thermal platform at 150 ℃, and an infrared thermal imager is used for recording the change of the surface temperature within 45s along with the time so as to investigate the heat-conducting rate of the heat-conducting composite material. As shown in fig. 4, the heat transfer rate is significantly increased, i.e., the application location of the prepared heat-conductive composite material, as shown in fig. 5, can be used in the heat dissipation field of CPU.
Example 3:
the embodiment is different from embodiment 1 in that the manufacturing steps of the heat-conducting composite material include:
the method comprises the following steps: and performing electrochemical etching on the 10mm chopped carbon fiber extracted by acetone for 30min, fully dispersing the chopped carbon fiber in a dispersing agent polyoxyethylene alkylphenol ether for 40min, and performing vacuum filtration on the dispersion liquid to obtain the carbon fiber felt.
Step two: soaking the obtained carbon fiber felt as cathode material and zinc sheet as anode material in electrolyte ZnSO 4 At a current density of 15A/dm 2 And D, performing direct current electrodeposition for 30min to obtain the modified carbon fiber felt.
Step three: and (3) immersing the obtained modified carbon fiber felt into an unsaturated polyester curing system, wherein the unsaturated polyester: initiator: and (3) curing the accelerant at the curing condition of 50 ℃ for 30min under the pressure of 2MPa with the ratio of 100:2:1 to obtain the modified carbon fiber/unsaturated polyester heat-conducting composite material.
The obtained heat-conducting composite material is placed on a thermal platform at 150 ℃, and an infrared thermal imager is used for recording the change of the surface temperature in 45s with the time, so that the surface temperature of the composite material is rapidly increased along with the increase of the time for placing a heat source, and is increased from 26 ℃ to 106 ℃ in 45s, and the temperature jump of 80 ℃ is realized.
Claims (10)
1. The modified carbon fiber heat-conducting composite material is characterized in that: the heat-conducting composite material is a filling type heat-conducting composite material, and comprises a filler component and a matrix component, wherein the matrix component is one of epoxy resin, phenolic resin, polyester resin or polyamide resin, and the filler component is metal modified chopped carbon fibers and is doped into an epoxy resin matrix in the form of a filler.
2. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 1, characterized in that: the method comprises the following steps:
the method comprises the following steps: etching the chopped carbon fibers extracted by acetone, fully dispersing the chopped carbon fibers in a dispersing agent, and preparing a chopped carbon fiber dispersion liquid into a carbon fiber felt;
step two: soaking the carbon fiber felt obtained in the step one as a cathode material and a metal sheet as an anode material into electrolyte, and performing direct current deposition to obtain a modified carbon fiber felt;
step three: and D, immersing the modified carbon fiber felt obtained in the step two into a resin curing system, and curing to obtain the modified carbon fiber heat-conducting composite material.
3. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the first step, the acetone extraction time is at least 24 h; the size of the short carbon fiber is 3mm-50 mm; the mass fraction of the chopped carbon fibers in the dispersing agent is 2-20 wt%.
4. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the first step, the etching method is one of plasma etching, chemical etching or electrochemical etching.
5. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the first step, the dispersant is one or more of a nonionic surfactant, a zwitterionic surfactant, an anionic surfactant or a cationic surfactant.
6. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 5, wherein the preparation method comprises the following steps: in the first step, the nonionic surfactant is fatty glyceride or polyoxyethylene fatty acid ester, the zwitterionic surfactant is amino acid type betaine type, the anionic surfactant is sulfate or sulfonate, and the cationic surfactant is quaternary ammonium compound.
7. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the second step, the electrolyte is liquid electrolyte containing zinc ions, and is fully stirred for 40 min; the current density of the electrodeposition is 5A/dm 2 -15A/dm 2 The time is 1-30 min.
8. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the second step, the anode material is cylindrical.
9. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the third step, the curing is one of far infrared radiation curing, ultraviolet curing, electron beam curing, near infrared curing, normal temperature curing, medium temperature curing or high temperature curing.
10. The preparation method of the modified carbon fiber heat-conducting composite material as claimed in claim 2, wherein the preparation method comprises the following steps: in the third step, the resin curing system is one of epoxy resin, phenolic resin, polyester resin or polyamide resin and a curing agent, fully stirring, and performing ultrasonic treatment for 30min to eliminate bubbles; the curing condition is high-temperature curing, precuring is carried out for 2h at 100 ℃, hot pressing is carried out for 2h at 120 ℃ and 180 ℃, and the pressure is 10 MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210566181.9A CN115058100A (en) | 2022-05-23 | 2022-05-23 | Modified carbon fiber heat-conducting composite material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210566181.9A CN115058100A (en) | 2022-05-23 | 2022-05-23 | Modified carbon fiber heat-conducting composite material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115058100A true CN115058100A (en) | 2022-09-16 |
Family
ID=83198027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210566181.9A Pending CN115058100A (en) | 2022-05-23 | 2022-05-23 | Modified carbon fiber heat-conducting composite material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115058100A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101531804A (en) * | 2009-04-13 | 2009-09-16 | 天津大学 | Electromagnetic shielding compound material made from three-dimensional braided nickel-plated carbon fiber and epoxy resin and method for preparing same |
| CN110157159A (en) * | 2019-05-27 | 2019-08-23 | 长春工业大学 | A kind of carbon fibre composite and preparation method thereof of metallic copper/nano-sized carbon multi-scale reinforcing body modification |
| CN110714330A (en) * | 2019-09-29 | 2020-01-21 | 南京理工大学 | Multi-scale carbon fiber, reinforced and toughened epoxy composite material and preparation method thereof |
| US20220134721A1 (en) * | 2019-03-06 | 2022-05-05 | Agency For Science, Technology And Research | Conductive carbon fiber reinforced composite and method of forming thereof |
-
2022
- 2022-05-23 CN CN202210566181.9A patent/CN115058100A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101531804A (en) * | 2009-04-13 | 2009-09-16 | 天津大学 | Electromagnetic shielding compound material made from three-dimensional braided nickel-plated carbon fiber and epoxy resin and method for preparing same |
| US20220134721A1 (en) * | 2019-03-06 | 2022-05-05 | Agency For Science, Technology And Research | Conductive carbon fiber reinforced composite and method of forming thereof |
| CN110157159A (en) * | 2019-05-27 | 2019-08-23 | 长春工业大学 | A kind of carbon fibre composite and preparation method thereof of metallic copper/nano-sized carbon multi-scale reinforcing body modification |
| CN110714330A (en) * | 2019-09-29 | 2020-01-21 | 南京理工大学 | Multi-scale carbon fiber, reinforced and toughened epoxy composite material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| SEUNGGUN YU等: "Enhanced thermal conductibity of epoxy/Cu-plated carbon fiber fabric composites", MACROMOLECULAR RESEARCH, vol. 25, no. 6, XP036280270, DOI: 10.1007/s13233-017-5114-9 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109913185B (en) | Multilayer structure heat-conducting composite material containing heat-conducting film and preparation method thereof | |
| KR102051272B1 (en) | Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device | |
| US6113730A (en) | Metal-foil-clad composite ceramic board and process for the production thereof | |
| US10424706B2 (en) | LED flip chip die-bond conductive adhesive structure and mounting method thereof | |
| US8007897B2 (en) | Insulating sheet and method for producing it, and power module comprising the insulating sheet | |
| TWI633813B (en) | Boron nitride-resin composite circuit substrate, boron nitride-resin composite heat release plate integrated circuit substrate | |
| CN100588308C (en) | High heat conductivity ceramic base printed circuit board and method for making the same | |
| CN105819882B (en) | A kind of ceramet composite substrate and its preparation process | |
| KR101480731B1 (en) | Dimensionally stable, leak-free graphite substrate | |
| KR102524428B1 (en) | Insulation Sheets and Laminates | |
| CN1784784A (en) | Composite material, electrical circuit or electric module | |
| CN111117063B (en) | High-thermal-conductivity composite material and preparation and application thereof | |
| CN114426774B (en) | High-heat-conductivity gasket and preparation method thereof | |
| Li et al. | Polymer‐based nanocomposites in semiconductor packaging | |
| CN115058100A (en) | Modified carbon fiber heat-conducting composite material and preparation method thereof | |
| CN111448258A (en) | Resin composition, prepreg, and laminate | |
| CN101431140A (en) | Heat conductive paste, light emitting diode substrate using the same and manufacturing method thereof | |
| CN110775969B (en) | Graphene composite membrane and preparation method thereof | |
| CN111269575B (en) | Heat-conducting silicon rubber, preparation method thereof and laser projection equipment | |
| CN114316868B (en) | Heat-conducting glue and preparation method and application thereof | |
| CN205058726U (en) | High heat conduction metal matrix composite base plate | |
| JP2005339953A (en) | Prepreg for fuel cell, separator for fuel cell consisting of this prepreg and manufacturing method for it | |
| WO2023190236A1 (en) | Composite and production method therefor, and assembly, circuit substrate, and power module | |
| CN115558241B (en) | High-heat-conductivity carbon fiber fabric composite material and preparation method thereof | |
| Sakamoto et al. | Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250° C |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |