CN115046578A - Circuit structure integrating multiple sensing assemblies and terminal comprising circuit structure - Google Patents
Circuit structure integrating multiple sensing assemblies and terminal comprising circuit structure Download PDFInfo
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Abstract
The invention relates to a circuit structure fusing multiple sensing assemblies and a terminal comprising the circuit structure. Under the condition that the collected data exceed a preset threshold value, the first acceleration sensing assembly can generate interruption to awaken the processing module in a dormant state, and the processing module responds to the awakening interruption of the first acceleration sensing assembly and opens the second acceleration sensing assembly to collect the data.
Description
Technical Field
The invention belongs to the field of circuit structures of sensors, and particularly relates to a circuit structure integrating multiple sensors, in particular to a circuit structure integrating a vibration sensor and a terminal comprising the circuit structure. The terminal may be used for sensing vibrations and/or trajectories and/or gestures etc.
Background
Vibration sensor can gather the vibration data analysis of testee especially high-frequency vibration, passes through high in the clouds or local computer with these data, alright realize many operations including but not limited to: and diagnosing faults of the industrial equipment. When the vibration of the measured target exceeds a set threshold value, the abnormal data can be collected by the vibration sensor and an alarm signal is sent out, so that related personnel are informed to check, and property loss is avoided.
The track sensor is used for measuring the real-time operation of object, and the swing orbit passes through high in the clouds or local computer with these data, alright realize many operations, including but not limited to: power line detection, geological disasters such as landslide alarm and the like. The sensor can send the target operation track to the server in real time, and when abnormal data is detected, relevant personnel are informed to take corresponding measures, such as people evacuation and the like.
Attitude sensor is used for the static inclination of analysis target, with these data through high in the clouds or local computer, alright realize many operations, including but not limited to: and (4) dangerous wall detection, namely judging that the target is possibly dangerous when the sensor detects that the inclination angle of the detected target exceeds a threshold value, and informing related personnel to take corresponding measures.
The existing sensor has a single technical function, can only measure one of vibration, track and posture, and cannot meet the scene with more demands.
Under the scene that a plurality of parameters need to be measured, the prior art meets the measurement requirement by combining a plurality of different sensors. However, the method causes higher system power consumption and cost, is troublesome and labor-consuming, cannot realize unified management, and even more, a sensor is matched with a special data acquisition terminal, so that the time, labor and financial cost are greatly increased.
The patent with publication number CN106840095A discloses a method for improving measurement accuracy of an inclinometer by paralleling a plurality of tilt sensor chips, which comprises the steps of firstly measuring gravity acceleration tilt data by using a plurality of MEMS tilt sensor chips, improving the signal-to-noise ratio of the system by using a white noise superposition principle, converting the gravity acceleration value of each axis into an angle value to obtain a high-accuracy tilt value, and drawing a positioning screen on a PCB board to ensure the measurement accuracy, so as to ensure the alignment of the axes of each MEMS tilt sensor chip. The invention is designed only aiming at a plurality of tilt sensor chips, belongs to the same sensor configuration and can only acquire one parameter, thereby improving the precision. The invention does not allow simultaneous acquisition of multiple parameters.
The invention with patent publication number CN103479361B discloses intelligent glasses with inertial sensors and a method for monitoring sports, preventing myopia and correcting sitting posture by using the intelligent glasses. The inertial sensor adopts an accelerometer or an angular velocity sensor, or an inertial measurement unit or an attitude and heading reference system which is formed by combining single, double and three axes of the accelerometer or the angular velocity sensor. The invention can only measure attitude data.
Patent publication No. CN205506187U discloses a dynamic weighing system for a forklift truck. Both attitude sensors and pressure sensors are used. According to the device, a plurality of attitude sensors and pressure sensors are independently arranged at different positions respectively, and collected data are processed through a control unit. The sensor can collect various data, but can not be installed uniformly, needs to be installed independently, and cannot be deployed quickly.
The patent publication No. CN209625014U relates to a rail image and inertia information acquisition device for a subway vehicle. The device includes: the device comprises a CCD camera, an acceleration sensor, a tilt angle sensor, a gyroscope, a host module, a pulse module, an ADC (analog to digital converter) board card, a DAC (digital to analog converter) board card, a hard disk and a power supply module for supplying power. The acceleration sensor and the inclination angle sensor are respectively connected with the host module through the ADC board card. And the DAC board card is respectively connected with the ADC board card and the host module. The CCD camera, the gyroscope and the hard disk are respectively connected with the host module. The pulse module is respectively connected with the CCD camera and the host module. The data signals processed by this patent are of a wide variety. Different data conversion board cards are required to be arranged aiming at different sensors. The host is used for processing data, the hard disk is used for storing the data, so that the device body is time-consuming and labor-consuming to install, the operation cost is high, and the data is difficult to manage in a unified mode.
The method for measuring the underwater track and the attitude of the navigation body is trained in a reference document [1] the Ji sea [ J ] ship science and technology, 2014,36(01): 147-. The document installs a measurement component on a target to be measured, and realizes measurement of a motion track and an attitude of the target through mathematical calculation.
In summary, the prior art has the following disadvantages:
1. the prior art adopts an independent acceleration sensor, and can not meet the requirements of object vibration, high-precision track analysis, high-precision attitude analysis and the application of three different occasions.
2. The prior art adopts the mode of combining multiple different sensors together, leads to the system consumption higher and cost, because of there is certain installation deviation between sensor and the sensor because of physical factor when the object moves, the axial of data is difficult to align.
3. The prior art adopts the mode of combining multiple different sensors together, and the installation is wasted time and energy, and the operation cost is high, and the data variety of collection is difficult unified management.
Furthermore, on the one hand, due to the differences in understanding to the person skilled in the art; on the other hand, since the applicant has studied a great deal of literature and patents when making the present invention, but the disclosure is not limited thereto and the details and contents thereof are not listed in detail, it is by no means the present invention has these prior art features, but the present invention has all the features of the prior art, and the applicant reserves the right to increase the related prior art in the background.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a terminal fusing multiple sensing assemblies. The terminal provided by the invention can comprise a first acceleration sensing assembly, a second acceleration sensing assembly and a processing module. The first acceleration sensing assembly and the second acceleration sensing assembly are connected with the processing module through a communication protocol interface. The first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in a mode that collected data are aligned according to mutual axial parallel and level, and the processing module is convenient for processing the data collected by the first acceleration sensing assembly and the second acceleration sensing assembly. Preferably, the first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in an axis alignment mode, at least one reference parameter is the same when the first acceleration sensing assembly and the second acceleration sensing assembly acquire data, and a processing module of the terminal can conveniently perform fusion processing on data from different sensing assemblies. Preferably, a plurality of sensing assemblies including the first acceleration sensing assembly, the second acceleration sensing assembly, the inertia measurement sensing assembly and the inclination angle sensing assembly can be fused on the terminal. Preferably, the core components of the first acceleration sensing assembly, the second acceleration sensing assembly, the inertial measurement sensing assembly and the tilt sensing assembly all comprise accelerometers. According to the terminal, the plurality of sensing assemblies taking the accelerometer as the core device are arranged on the board body of the same circuit structure in an axis alignment mode, so that at least one parameter (such as position height, relative coordinates and the like) of the sensing assemblies is the same, parameters required to be processed when a processing module of the terminal performs fusion processing on data acquired by the sensing assemblies can be reduced, and rapid processing is realized.
According to a preferred embodiment, the first acceleration sensing component can generate an interrupt to wake up the processing module in the sleep state when the acquired data exceeds a preset threshold, and the processing module responds to the wake-up interrupt of the first acceleration sensing component to turn on the second acceleration sensing component for data acquisition. Preferably, the processing module of the terminal may further wake up other sensing components fused on the terminal, including the inertial measurement sensing component and the tilt angle sensing component.
According to a preferred embodiment, the first acceleration sensing assembly comprises at least a first acceleration sensor, and the first acceleration sensor can directly transmit collected direct current multi-axial data to the processing module for processing through a communication protocol interface. Preferably, the first acceleration sensor of the first acceleration sensing assembly does not enter a sleep state. The first acceleration sensor maintains real-time data acquisition of a target object. Preferably, the first acceleration sensor is provided with at least two data acquisition thresholds including a first threshold and a second threshold greater than the first threshold. When the data collected by the first acceleration sensor is lower than a first threshold value, the first acceleration sensor keeps collecting the real-time data of the target object, but does not send a wake-up interrupt to the processing module, and the processing module keeps a dormant state. When the data acquired by the first acceleration sensor is higher than a first threshold value but lower than a second threshold value, the first acceleration sensor transmits a first awakening interrupt to the processing module while keeping real-time data acquisition on the target object, the processing module enters a working state from a dormant state in response to the receipt of the first awakening interrupt, and the processing module entering the working state processes the data acquired by the first acceleration sensor and received through the communication protocol interface. When data acquired by the first acceleration sensor is higher than a second threshold value, the first acceleration sensor transmits a second awakening interrupt to the processing module while real-time data acquisition is carried out on a target object, the processing module responds to the receipt of the second awakening interrupt and enters a working state from a dormant state, the processing module entering the working state awakens a second acceleration sensing assembly in various sensing assemblies fused with a terminal by running a preset program, and the second acceleration sensing assembly which has higher bandwidth and can acquire higher-frequency data than the first acceleration sensing assembly (namely the first acceleration sensor) acquires the data of the target object.
According to a preferred embodiment, the second acceleration sensing component at least comprises a second acceleration sensor, a filter, a voltage follower and a high-speed ADC, and the second acceleration sensor transmits acquired data in the single axial direction of the acquired alternating current to the processing module through a communication protocol interface after sequentially passing through the filter, the voltage follower and the high-speed ADC. Preferably, the second acceleration sensing component is in a dormant state when a terminal fusing multiple sensing components is initially installed to collect data of a target object. And if and only when a first acceleration sensing assembly arranged in the terminal of the multiple sensing assemblies sends an instruction for waking up the second acceleration sensing assembly to a processing module of the terminal, the processing module wakes up the second acceleration sensing assembly to acquire data and processes the acquired data of the second acceleration sensing assembly received through the communication protocol interface.
According to a preferred embodiment, said first acceleration sensing member and said second acceleration sensing member are arranged on the plate body at a position distant from the surrounding mechanical mounting holes, so as to avoid external stresses from being transmitted to the sensor. According to the terminal integrating the multiple sensing assemblies, the sensing assemblies are placed on the circuit board in the middle, so that the problem that the data acquisition result of the sensing assemblies is inaccurate due to the fact that stress generated by the circuit board is transferred to the circuit board to place the sensing assemblies due to the fact that the terminal is packaged is solved.
According to a preferred embodiment, the first acceleration sensing assembly and the second acceleration sensing assembly are configured to be driven by current through an I/O port of the processing module to control on/off. After being awakened by the first acceleration sensing assembly, the processing module of the terminal fusing the multiple sensing assemblies can enable the processing module to supply power to the second acceleration sensing assembly through an I/O port of the second acceleration sensing assembly by running a preset program, so that the second acceleration sensing assembly is started to enable the second acceleration sensing assembly to carry out data acquisition.
According to a preferred embodiment, the processing module comprises a processing chip, a random access memory and a read-only memory. The processing module processes data collected by various sensors fused on the terminal through the processing chip, the random access memory and the read-only memory.
According to a preferred embodiment, the terminal can further integrate a temperature sensing component, an inertia measurement sensing component and an inclination angle sensing component to realize the acquisition of the temperature, the track and the attitude data of the measured object. Preferably, the processing module of the terminal fusing multiple sensing assemblies provided by the invention can receive data collected by the temperature sensing assembly, the inertia measurement sensing assembly and the inclination angle sensing assembly through a communication protocol interface. The processing module can also set an interrupt through the I/O port to wake up/shut down the temperature sensing component, the inertia measurement sensing component, and the tilt angle sensing component.
According to a preferred embodiment, the first acceleration sensing assembly is capable of collecting data at a lower frequency than the second acceleration sensing assembly. Preferably, the terminal of the present invention realizes a wider spectrum acquisition range than a single sensing component by fusing the first acceleration sensing component and the second acceleration sensing component capable of acquiring higher frequency data. The terminal provided by the invention integrates the complementation of the first acceleration sensing assembly and the second acceleration sensing assembly, so that the precision of measured data is higher.
The invention also provides a circuit structure fusing the multiple sensing assemblies. The circuit structure at least comprises a first acceleration sensing component, a second acceleration sensing component and a processing module. The first acceleration sensing assembly and the second acceleration sensing assembly are connected with the processing module through a communication protocol interface. The first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in a mode of being axially aligned with each other so that acquired data are aligned. Preferably, the circuit structure can integrate one or more of the first acceleration sensing assembly, the second acceleration sensing assembly, the temperature sensing assembly, the inertia measurement sensing assembly and the inclination angle sensing assembly.
Drawings
Fig. 1 is a schematic diagram of a preferred embodiment of the terminal of the present invention;
FIG. 2 is a schematic circuit diagram of a processing chip of a preferred processing module of the terminal of the present invention;
FIG. 3 is a schematic circuit diagram of a preferred first acceleration sensing assembly of the terminal of the present invention;
FIG. 4 is a schematic circuit diagram of a preferred temperature sensing assembly of the terminal of the present invention;
FIG. 5 is a schematic circuit diagram of a preferred inertial measurement sensing assembly of the terminal of the present invention;
FIG. 6 is a schematic circuit diagram of a preferred tilt sensing assembly of the terminal of the present invention;
FIG. 7 is a schematic circuit diagram of a preferred second acceleration sensing assembly of the terminal of the present invention;
FIG. 8 is a schematic diagram of a preferred embodiment of the circuit configuration of the present invention;
FIG. 9 is a schematic circuit configuration diagram of a preferred embodiment of example 3 of the present invention;
FIG. 10 is a schematic diagram of a terminal according to a preferred embodiment of example 4 of the present invention;
fig. 11 is a schematic circuit diagram of a preferred embodiment of embodiment 4 of the present invention.
List of reference numerals
100: a terminal; 110: a processing module; 111: processing the chip; 112: a random access memory; 113: a read-only memory; 120: a first acceleration sensing assembly; 130: a temperature sensing component; 140: an inertial measurement sensing assembly; 150: a tilt angle sensing assembly; 160: a second acceleration sensing assembly; 161: a second acceleration sensor; 162: a filter; 163: a voltage follower; 164: high-speed ADC.
Detailed Description
The following detailed description is made with reference to fig. 1 to 11.
As sensor technology develops, more and more sensors are used. But the sensor technology is single in function. In the case of acquiring multiple data, multiple sensors are usually arranged or data acquired by one sensor is mathematically analyzed to obtain multiple data. In the field of mechanical fault diagnosis and predictive maintenance, a sensor with a vibration data acquisition function is required to analyze high-frequency vibration acceleration data of mechanical equipment. In the field of geological disaster monitoring and early warning, a sensor with track data acquisition and vibration data acquisition functions is required to analyze the movement of debris flow, collapse, landslide and the like, calculate the vibration amplitude and the sliding amplitude of rocks or soil and analyze dangerous data. A sensor with a track data acquisition function is needed in the field of marine disaster monitoring and early warning, and marine wave height data are analyzed. The sensor with the functions of vibration data acquisition, attitude data acquisition and track data acquisition is needed in the field of civil engineering structure safety monitoring, and the safety of the civil engineering structure, such as bridge vibration analysis and building dangerous wall inclination monitoring, is analyzed. The method is characterized in that a sensor with functions of attitude data acquisition and trajectory data acquisition is required in the field of safety monitoring and early warning of power transmission line engineering, the inclination of an electric power iron tower and the elliptical galloping of a power line are analyzed, and the dangerous conditions of the electric power iron tower and the galloping of the power line are detected. According to the invention, by designing the circuit structure, various sensors are fused on one terminal, so that under the condition that various data are required to be acquired, the acquisition of various data can be realized only by arranging one terminal. The terminal provided by the invention can solve the problems of vibration, track and posture analysis of objects in the industries of mechanical fault diagnosis and predictive maintenance, geological disaster monitoring and early warning, marine disaster monitoring and early warning, civil engineering structure safety monitoring and early warning, power transmission line engineering safety monitoring and early warning and the like.
The principle of simultaneously carrying out vibration analysis, high-precision track analysis and high-precision attitude analysis is to design a circuit structure integrating multiple sensing assemblies, and the circuit structure can comprise a first acceleration sensing assembly, an inertia measurement sensing assembly and an inclination angle sensing assembly. Every sensing component all is connected with processing module, when the equipment that is detected produces data, for example detect equipment vibrations, the vibration sensor just can produce a signal notification processing module, and processing module awakens corresponding sensor collection data up to with data terminal detection is sent to the collection data.
Example 1
The sensor is required to solve the problems of vibration, track and attitude analysis of objects in the industries of mechanical fault diagnosis and predictive maintenance, geological disaster monitoring and early warning, marine disaster monitoring and early warning, civil engineering structure safety monitoring and early warning, transmission line engineering safety monitoring and early warning and the like. At present, the methods for simultaneously measuring the vibration, track and attitude (static inclination angle) parameters of an object by using one sensor in the prior art have the following two methods:
a. one is to use an acceleration sensor to calculate the vibration of the object and the tilt angle of the object (vs. gravity acceleration analysis), while the displacement of each axis can be calculated by mathematical integration using the acceleration data.
b. The other is to combine several complete sensor devices together to realize simultaneous measurement of vibration, track and attitude (static inclination angle) parameters of an object, for example, an inertia measurement sensor is combined with an acceleration sensor, the acceleration sensor measures vibration and attitude of the object, and the inertia measurement sensor measures track motion of the object.
In summary, the prior art has the following defects:
1. the prior art adopts an independent acceleration sensor, and can not meet the requirements of object vibration, high-precision track analysis, high-precision attitude analysis and the application of three different occasions.
2. The prior art adopts the mode of combining multiple different sensors together, leads to the system consumption higher and cost, because of there is certain installation deviation between sensor and the sensor physical factor when the object moves, and the axial of data is difficult to align.
3. The prior art adopts the mode of combining multiple different sensors together, and the installation is wasted time and energy, and the operation cost is high, and data is difficult for unified management.
4. The existing sensor has single function and can only directly measure one of vibration, track and attitude.
The existing sensing terminal has single technical function and can only measure one data of vibration, track, posture, temperature, humidity, air pressure, gas, wind speed, sound wave and illumination. To address the above deficiencies, the present embodiment discloses a terminal incorporating multiple sensing components. The present embodiment may be used for sensors that sense vibration, trajectory, attitude, temperature, humidity, air pressure, gas, wind speed, sound waves, and light. Preferably, the terminal provided by the invention is internally provided with a circuit structure fusing multiple sensing assemblies, and the circuit structure can integrate a vibration sensor, a track sensor and an attitude sensor. The invention can simultaneously measure the parameters of the vibration, the track and the attitude (static inclination angle) of the object. Fig. 1 is a schematic diagram of a preferred embodiment of the terminal 100 according to the embodiment. The present invention provides that a terminal 100 may include a processing module 110, a first acceleration sensing assembly 120, a temperature sensing assembly 130, an inertial measurement sensing assembly 140, a tilt sensing assembly 150, and a second acceleration sensing assembly 160.
Preferably, the terminal 100 is configured with a processing module 110. The processing module 110 mainly comprises a processing chip 111, a random access memory 112 and a read only memory 113. The processing module 110 receives the data sent by the sensing component through the communication protocol interface, so as to process the received data. Fig. 2 is a schematic circuit diagram of the processing chip 111 of the processing module 110. Preferably, the processing chip 111 may be STM32F446ZET 6. Preferably, the random access memory 112 may be an SDRAM. Preferably, the read only memory 113 may be FLASH. Preferably, the communication protocol interface may be an SPI communication protocol interface and/or an I/O interface.
Preferably, the terminal 100 is configured with a first acceleration sensing assembly 120. The first acceleration sensing assembly 120 is connected to the processing module 110 via a communication protocol interface. The first acceleration sensing assembly 120 transmits the measured vibration data to the processing module 110 via the communication protocol interface. Preferably, the communication protocol may be an SPI communication protocol. Preferably, the first acceleration sensing assembly 120 includes at least a first acceleration sensor. Preferably, the first acceleration sensor may be a MEMS high frequency acceleration sensor. Fig. 3 is a schematic circuit diagram of a preferred first acceleration sensing assembly 120. Preferably, the MEMS high-frequency acceleration sensor adopts a high-frequency acceleration sensor KX 132. The sensor is specially designed for high-frequency vibration analysis, the output frequency of the sensor is up to 25.6KHz, the output bandwidth is up to 8.2KHz, and compared with the traditional acceleration sensor, the high-frequency acceleration sensor used in the invention has better high-frequency vibration measurement effect, and the accuracy of analyzing the vibration frequency through the acceleration signal of the sensor is higher.
Preferably, the terminal 100 is configured with a temperature sensing assembly 130. The temperature sensing component 130 is coupled to the processing module 110 via a communication protocol interface. The temperature sensing component 130 transmits the measured temperature data to the processing module 110 through the communication protocol interface. Preferably, the communication protocol interface may be an I/F interface. FIG. 4 is a schematic circuit diagram of a preferred temperature sensing assembly. Preferably, the temperature sensing component 130 may be a MEMS temperature sensor. Preferably, the MEMS temperature sensor employs NST 1001. NST1001 has a pulse count type digital output and a characteristic of high accuracy in a wide temperature range. The NST1001 may be directly connected to the processing module 110, so that the terminal reduces overhead while ensuring measurement accuracy. The NST1001 device supports a maximum measurement accuracy of ± 0.5 ℃ over a temperature range of-50 ℃ to 150 ℃ with extremely high resolution (0.0625 ℃), without the need for system calibration or software and hardware compensation in use.
Preferably, terminal 100 is configured with an inertial measurement sensing assembly 140. The inertial measurement sensing component 140 is coupled to the processing module 110 via a communication protocol interface. The inertial measurement sensing component 140 transmits the measured trajectory data to the processing module 110 via a communication protocol interface. Preferably, the communication protocol may be an SPI communication protocol. FIG. 5 is a schematic circuit diagram of a preferred inertial measurement sensing assembly. Preferably, the inertial measurement sensing component 140 may be a MEMS inertial measurement sensor. Preferably, the MEMS inertial measurement sensor employs a 6-axis sensor BMI 085. The 6-axis sensor integrates acceleration and angular velocity sensors, and the acceleration noise is lower than that of the sensor
Noise at angular velocity lower than
The invention uses the 6-axis sensor to independently analyze the motion track of the object, the angular velocity and the axial direction of the acceleration are calibrated when the chip leaves a factory, and the analysis accuracy of the motion track is higher.
Preferably, the terminal 100 is configured with a tilt angle sensing assembly 150. The tilt angle sensing assembly 150 is coupled to the processing module 110 via a communication protocol interface. The tilt sensing assembly 150 transmits the measured attitude data to the processing module 110 via a communication protocol interface. Preferably, the communication protocol may be an SPI communication protocol. FIG. 6 is a schematic circuit diagram of a preferred tilt angle sensing assembly. Preferably, the tilt sensing assembly 150 may be a MEMS tilt sensor. Preferably, the MEMS tilt sensor employs the tilt sensors SCL 3300-D01. The measured angle precision reaches 0.0055 degrees, the noise is lower than 0.001 degrees V Hz, and the accuracy of calculation is higher than that of the conventional acceleration sensor after the internal calibration of the sensor.
Preferably, the terminal 100 is provided with a second acceleration sensing assembly 160. The second acceleration sensing assembly 160 is coupled to the processing module 110 via a communication protocol interface. The second acceleration sensing assembly 160 transmits the measured vibration data to the processing module 110 via a communication protocol interface. Preferably, the communication protocol may be an SPI communication protocol. The second acceleration sensing block 160 is composed of at least a second acceleration sensor 161, a filter 162, a voltage follower 163, and a high-speed ADC 164. Preferably, the second acceleration sensor 161 may be a MEMS-IEPE high frequency acceleration sensor. Preferably, the MEMS-IEPE high frequency acceleration sensor employs an acceleration sensor ADXL 100X. The second acceleration sensor 161 outputs an analog signal, which is sampled by the filter 162, the voltage follower 163, and the high-speed ADC164, and then output to the processing module 110 for processing.
Fig. 7 is a schematic circuit diagram of a preferred second acceleration sensing assembly 160. Preferably, the second acceleration sensing component 160 circuit includes at least a second acceleration sensor 161, a filter 162, a voltage follower 163, and a high-speed ADC 164. As shown in fig. 7, after passing through the filter 162 and the voltage follower 163, the second acceleration sensor 161 samples the voltage signal of the second acceleration sensor 161 through the high-speed ADC164, and then is connected to the processing module 110 through the SPI bus, so that the voltage signal of the second acceleration sensor 161 is collected, and the system of the second acceleration sensing assembly 160 is highly integrated. Preferably, the second acceleration sensor 161 may be an ADXL100X series MEMS-IEPE chip. Preferably, the filter 162 may be a band-limiting filter. Preferably, the band-limiting filter circuit is mainly composed of an operational amplifier and at least one resistor and at least one capacitor. Preferably, the voltage follower 163 is composed of at least two operational amplifiers. Preferably, the operational amplifier may be OPA 4325. Preferably, the high speed ADC chip may be MCP 3561. The ADXL100X chip has the lowest noise at a supply voltage of 5V. To improve the accuracy of data acquisition by the second acceleration sensing assembly 160, the present embodiment provides power to ADXL100X after converting the system power DC to 5V. The MEMS-IEPE chip is connected with a band-limiting filter at the rear stage, so that the accuracy of the high-frequency response of the sensor is improved. And the high-speed ADC164 unit is powered by 3V 3. The output of the amplifier is divided by the resistor through the band-limiting filter circuit and then output to the voltage follower, so that the 5V signal is linearly reduced to a range of 3V3, and after passing through the voltage follower 163, the impedance of the MEMS-IEPE chip signal is reduced, and the high-speed ADC164 is more accurate in sampling.
Preferably, the first acceleration sensing assembly 120, the inertial measurement sensing assembly 140, the tilt sensing assembly 150, and the second acceleration sensing assembly 160 all transmit data using SPI ports. The sensing assembly containing the accelerometer uses the same communication protocol. Preferably, the communication protocol may be an SPI communication protocol.
Preferably, the invention uses an SPI port for the kx132 acceleration sensor to transmit data. Preferably, the communication speed of the SPI port connected with the kx132 acceleration sensor is set to be 10MHZ, so that the situation that data overflow is caused due to the fact that the communication speed is too low due to the fact that the sampling rate of the sensor is set to be too high is avoided.
Preferably, each sensing element is configured to operate only when in use and remain off when not in use, taking into account power consumption issues of the terminal 100. The method does not adopt a conventional mos tube to control the power on-off mode, but is driven by the current of the I/O port, so that the power consumption is reduced, and the size is further reduced.
Preferably, the first acceleration sensing component 120 can generate an interrupt to wake up the processing module 110 in the sleep state if the collected data exceeds a preset threshold. The processing module 110 turns on the second acceleration sensing component 160 for data collection in response to a wake-up interrupt of the first acceleration sensing component 120. Preferably, the processing module 110 of the terminal 100 can also wake up other sensing components fused on the terminal 100, including the inertia measurement sensing component 140 and the tilt sensing component 150.
Example 2
The embodiment discloses a circuit structure fusing multiple sensing assemblies. The circuit configuration of the present embodiment includes at least the first acceleration sensing component 120, the inertial measurement sensing component 140, and the tilt angle sensing component 150.
Fig. 8 is a schematic diagram of a preferred embodiment of a circuit configuration incorporating multiple sensing elements according to the present invention.
The first acceleration sensing assembly 120, the inertial measurement sensing assembly 140, and the tilt sensing assembly 150 are shown in FIG. 8 as being disposed on the same circuit board. The sensing assembly needs to be mounted away from the surrounding mechanical mounting holes to avoid external stresses being transmitted to the sensing assembly. The three sensing assemblies are arranged in an axis alignment mode, so that data alignment is kept when data are processed conveniently, and high-precision data fusion is realized.
Preferably, only the first acceleration sensing assembly 120 may be disposed on the circuit board in the case where only vibration analysis of the object is required. The first acceleration sensing component 120 is mounted away from the surrounding mechanical mounting holes, reducing the transmission of external stresses to the first acceleration sensing component 120.
Preferably, only the inertial measurement sensing assembly 140 may be disposed on the circuit board in the case where only the motion trajectory analysis of the object is required. Preferably, the present invention reduces the transmission of external stresses to the inertial measurement sensing component 140, with the inertial measurement sensing component 140 centered.
Preferably, in the case where only the posture analysis of the object is required, only the inclination sensing assembly 150 may be provided on the circuit board. Preferably, the tilt angle sensing assembly 150 is disposed at a position far from the edge mounting hole of the circuit board, so that the external stress can be reduced from being transmitted to the tilt angle sensing assembly 150.
Preferably, in the case where vibration analysis and motion trajectory analysis of the object are required, only the first acceleration sensing assembly 120 and the inertia measurement sensing assembly 140 may be disposed on the circuit board. The first acceleration sensing component 120 and the inertial measurement sensing component 140 are disposed on the circuit board in an axis-aligned manner at a position away from the mounting hole, so that the stress at the mounting hole is prevented from being transmitted to the first acceleration sensing component 120 and the inertial measurement sensing component 140. The first acceleration sensing component 120 and the inertial measurement sensing component 140 are arranged in an axis alignment manner, so that the acquired data keep data alignment, and high-precision data fusion is realized.
Preferably, in the case that the vibration analysis and the motion trace analysis of the object are required and the requirement on the accuracy of the motion trace analysis is low, only the first acceleration sensing assembly 120 may be disposed on the circuit board. The first acceleration sensing assembly 120 can calculate the vibration of the object, and simultaneously calculate the displacement of each axis through mathematical integration according to the acceleration data, so as to analyze the motion track of the object. The mounting of the first acceleration sensing assembly 120 in the middle of the circuit board away from the edge can avoid stress at the edge mounting holes.
Preferably, in the case where vibration analysis and attitude analysis of the object are required, at least the first acceleration sensing assembly 120 and the inclination sensing assembly 150 are disposed on the circuit board. The first acceleration sensing assembly 120 and the tilt angle sensing assembly 150 are in axial alignment on the circuit board. The first acceleration sensing assembly 120 and the tilt sensing assembly 150 are placed in the middle of the circuit board. The first acceleration sensing assembly 120 and the tilt angle sensing assembly 150 are far away from the mounting hole on the circuit board, so that the data collection of the sensing assemblies can be prevented from being influenced by the stress at the mounting hole. The first acceleration sensing assembly 120 and the tilt sensing assembly 150 are axially aligned on the circuit board. Data collected by the first acceleration sensing assembly 120 and the inclination angle sensing assembly 150 are kept aligned during data processing, and high-precision data fusion is achieved.
Preferably, in a case where vibration analysis and attitude analysis of the object are required and the requirement for the accuracy of the motion trajectory analysis is low, only the first acceleration sensing assembly 120 may be disposed on the circuit board. The first acceleration sensing component 120 is capable of calculating the vibration of the object while obtaining the attitude of the object by analyzing against the gravitational acceleration. The mounting location of the first acceleration sensing component 120 is remote from the mounting hole, thereby avoiding the first acceleration sensing component 120 being stressed at the edge mounting hole.
Preferably, in the case that the posture analysis and the motion trail analysis of the object are required, the inclination angle sensing assembly 150 and the inertial measurement sensing assembly 140 are disposed on the circuit board. The tilt angle sensing assembly 150 and the inertial measurement sensing assembly 140 are mounted away from surrounding mechanical mounting holes, reducing the transmission of external stresses to the tilt angle sensing assembly 150 and the inertial measurement sensing assembly 140. The tilt angle sensing assembly 150 and the inertial measurement sensing assembly 140 keep the axes aligned, so that data alignment is kept during data processing, and high-precision data fusion is realized.
Preferably, in the case where the attitude analysis and the motion trajectory analysis of the object are required, only the inertial measurement sensing assembly 140 may be disposed on the circuit board. And the attitude analysis and the motion trail analysis of the object are realized through mathematical calculation. The inertial measurement sensing component 140 is mounted at a position far away from the mounting hole of the circuit board and is positioned in the middle of the circuit board, so that the influence on the data acquisition of the sensing component caused by the stress at the mounting hole can be avoided.
Preferably, only the first acceleration sensing assembly 120 may be configured on the circuit board in the case where vibration analysis, motion trajectory analysis and posture analysis of the object are required and the requirement for data acquisition accuracy is low. The first acceleration sensing component 120 is far away from the mounting hole on the circuit board, so that the influence on the data acquisition of the sensing component caused by the stress at the mounting hole can be avoided.
Preferably, in the case where vibration analysis, high-precision motion trajectory analysis, and high-precision attitude analysis of the object are required, the first acceleration sensing assembly 120, the inertial measurement sensing assembly 140, and the tilt sensing assembly 150 are simultaneously disposed on the circuit board. The sensing assembly needs to be mounted away from the surrounding mechanical mounting holes to avoid external stresses from being transmitted to the sensing assembly. The three sensing assemblies are arranged in an axis alignment mode. Meanwhile, the sensor is well calibrated when leaving a factory, and the axial alignment of the sensor is ensured to be within a certain error range. Data collected by the sensing assembly keep data alignment during data processing, and high-precision data fusion is achieved.
According to actual use requirements, only one or two of the three sensing assemblies, namely the first acceleration sensing assembly 120, the inertia measurement sensing assembly 140 and the inclination angle sensing assembly 150, may be arranged on the circuit board, or all the three sensing assemblies may be arranged on the circuit board.
Preferably, the first acceleration sensing component 120 may be a MEMS high frequency acceleration sensor. Preferably, the inertial measurement sensing component 140 may be a MEMS inertial measurement sensor. Preferably, the tilt sensing assembly 150 may be a MEMS tilt sensor. As shown in fig. 8, the MEMS high-frequency acceleration sensor (i.e., the first acceleration sensor), the MEMS inertial measurement sensor, and the MEMS tilt sensor are integrated on one circuit board. The size of the circuit board is small. Preferably, the overall circuit board dimensions are about 40 x 27.7 mm. The sensor needs to be mounted away from the surrounding mechanical mounting holes to avoid external stresses being transmitted to the sensor. The three sensors are arranged in an axis alignment mode, so that data alignment is kept when data are processed conveniently, and high-precision data fusion is realized.
Preferably, the first acceleration sensing assembly 120, the inertial measurement sensing assembly 140, and the tilt sensing assembly 150 can be disposed on separate circuit boards. When in actual use, the required circuit board is mounted on one circuit board.
Preferably, the first acceleration sensing component 120, the inertia measurement sensing component 140, the tilt angle sensing component 150 and their connected components used in this embodiment are the same as those in embodiment 1, and are not described herein again.
Example 3
This embodiment is a further improvement on embodiments 1 and 2 and their combination, and repeated details are not repeated.
Preferably, only the circuit board configured with the second acceleration sensing assembly 160 is mounted as shown in fig. 9. The second acceleration sensing assembly 160 transmits the measured vibration data to the processing module 110 via a communication protocol interface. Preferably, the communication protocol may be an SPI communication protocol. The second acceleration sensing block 160 is composed of at least a second acceleration sensor 161, a filter 162, a voltage follower 163, and a high-speed ADC 164. Preferably, the second acceleration sensor 161 may be a MEMS-IEPE high frequency acceleration sensor. Preferably, the MEMS-IEPE high-frequency acceleration sensor adopts an ADXL100X series MEMS IEPE chip. The second acceleration sensor 161 outputs an analog signal, which is sampled by the filter 162, the voltage follower 163 and the high-speed ADC164 and then output to the processing module 110 for signal processing. The circuit board is small in size. Preferably, the overall circuit board dimensions are about 40 x 27.7 mm. The sensor is installed at a position far away from the surrounding mechanical installation hole, and external stress is prevented from being transmitted to the sensor. The sensor is placed in the middle, and no installation device is arranged behind the sensor, so that the sensor is guaranteed to be minimally interfered by external force.
Preferably, the second acceleration sensing assembly 160 and its connected components used in this embodiment are the same as those in embodiments 1 and 2, and are not described again here.
Example 4
This embodiment is a further improvement on embodiments 1, 2, and 3 and their combination, and repeated details are not repeated.
The prior art has 2 schemes about the measurement of vibration signals, firstly, a single ACC accelerometer is used, but the single ACC accelerometer can only measure the vibration signals with the direct current frequency within 10KHz, and the scheme has the defect that the high-frequency vibration cannot be measured; and secondly, an IEPE accelerometer is used, and due to the limitation of the IEPE, the scheme can only measure the unidirectional vibration of alternating current and high frequency (not lower than 10 KHz). There are limitations to either approach. Two sensors are simultaneously installed on the tested device to simultaneously measure the acceleration of alternating current, direct current, high frequency, low frequency and multiple axes. The present embodiment provides a terminal 100 that can be used for vibration measurement. The terminal 100 of this embodiment only realizes the advantages of both the ACC accelerometer and the IEPE accelerometer on one set of equipment, and realizes both ac signal measurement and dc measurement, both low frequency measurement and high frequency measurement, and the measurement direction is not single. The terminal 100 of the present embodiment provides a circuit structure designed to fuse a plurality of sensors on one circuit board and protect the sensors from external stress, electromagnetism, and the like.
Referring to fig. 10, the terminal 100 of the present embodiment may include a first acceleration sensing assembly 120, a second sensing assembly 160 and a processing module 110. The first acceleration sensing component 120 and the second acceleration sensing component 160 of the present invention are connected to the processing module 110 through a communication protocol interface. Preferably, the first acceleration sensing component 120 includes at least a first acceleration sensor, and the first acceleration sensor can directly transmit the acquired direct current multi-axial data to the processing module 110 through the communication protocol interface for processing. Preferably, the first acceleration sensor of the first acceleration sensing assembly 120 does not enter a sleep state. The first acceleration sensor maintains real-time data acquisition of the target object. Preferably, the first acceleration sensor is provided with at least two data acquisition thresholds including a first threshold and a second threshold greater than the first threshold. When the data acquired by the first acceleration sensor is lower than the first threshold, the first acceleration sensor keeps acquiring real-time data of the target object, but does not send a wakeup interrupt to the processing module 110, and the processing module 110 keeps a sleep state. When the data acquired by the first acceleration sensor is higher than the first threshold but lower than the second threshold, the first acceleration sensor sends a "first wake-up interrupt" to the processing module 110 while keeping real-time data acquisition on the target object, the processing module 110 enters a working state from a dormant state in response to the "receipt of the first wake-up interrupt", and the processing module 110 entering the working state processes the data acquired by the first acceleration sensor received through the communication protocol interface. When the data acquired by the first acceleration sensor is higher than the second threshold, the first acceleration sensor sends a "second wake-up interrupt" to the processing module 110 while keeping real-time data acquisition on the target object, the processing module 110 enters a working state from a dormant state in response to "receipt of the second wake-up interrupt", the processing module 110 entering the working state wakes up the second acceleration sensing component 160 in the multiple sensing components fused with the terminal 100 by running a preset program, and the second acceleration sensing component 160 having a higher bandwidth and capable of acquiring higher-frequency data than the first acceleration sensing component 120 (i.e., the first acceleration sensor) acquires data on the target object.
Preferably, the second acceleration sensing assembly 160 includes at least a second acceleration sensor 161, a filter 162, a voltage follower 163, and a high-speed ADC 164. The second acceleration sensor 161 transmits the acquired data in the single axial direction of the acquired alternating current to the processing module 110 through a communication protocol interface after passing through the filter 162, the voltage follower 163 and the high-speed ADC164 in sequence. Preferably, the second acceleration sensing component 160 is in a dormant state when the terminal 100 fusing various sensing components is initially installed to collect data of the target object. If and only when the first acceleration sensing component 120 disposed in the terminal 100 of the multiple sensing components sends an instruction that the second acceleration sensing component 160 needs to be woken up to the processing module 110 of the terminal 100, the processing module 110 may wake up the second acceleration sensing component 160 to perform data acquisition and process the acquired data of the second acceleration sensing component 160 received through the communication protocol interface.
The first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 are disposed on the same plate body in a manner that they are axially flush with each other such that the collected data are aligned, which is convenient for the processing module 110 to process the data collected by the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160. Specifically, referring to fig. 11, the first acceleration sensor of the first acceleration sensing assembly 120 and the second acceleration sensor 161 of the second acceleration sensing assembly 160 are disposed on the same plate body in an axially aligned manner. Preferably, the first acceleration sensor may be a MEMS high frequency acceleration sensor, and the specific model may be KX 132. Preferably, the second acceleration sensor 161 may be an ADXL100X series MEMS-IEPE chip.
Preferably, after the first acceleration sensing component 120 and the second acceleration sensing component 160 are disposed on the same board body in an axis alignment manner, at least one reference parameter is the same when data acquisition is performed on the first acceleration sensing component 120 and the second acceleration sensing component 160, which is convenient for the processing module 110 of the terminal 100 to perform fusion processing on data from different sensing components. Preferably, the core components of the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 both include accelerometers. The terminal 100 of the present invention may arrange a plurality of sensing components using accelerometers as core devices on a board body of the same circuit structure in an axis alignment manner, so that at least one parameter (e.g., position height, relative coordinate, etc.) of the sensing components is the same, thereby reducing parameters required to be processed when the processing module 110 of the terminal 100 performs fusion processing on data acquired by the sensing components, and achieving fast processing.
Preferably, the first acceleration sensing unit 120 and the second acceleration sensing unit 160 are disposed on the plate body at positions far from the surrounding mechanical mounting holes, so as to prevent external stress from being transmitted to the sensors. The terminal 100 integrating multiple sensing assemblies provided by the invention places all the sensing assemblies on the circuit board in the middle, so that the problem that the data acquisition result of the sensing assemblies is inaccurate because the stress generated by the circuit board is transferred to the circuit board for placing the sensing assemblies due to the fact that the terminal 100 is packaged is avoided.
Preferably, the first acceleration sensing component 120 and the second acceleration sensing component 160 are configured to be driven by current through the I/O port of the processing module 110 to control on/off. After being awakened by the first acceleration sensing component 120, the processing module 110 of the terminal 100 integrated with multiple sensing components can enable the processing module 110 to supply power to the second acceleration sensing component 160 through the I/O port of the second acceleration sensing component 160 by running a preset program, so that the second acceleration sensing component 160 is started to enable the second acceleration sensing component 160 to acquire data.
Preferably, the processing module 110 includes a processing chip 111, a random access memory 112, and a read only memory 113. The processing module 110 processes the data collected by the various sensors integrated on the terminal 100 through the processing chip 111, the random access memory 112 and the read only memory 113.
Preferably, the first acceleration sensing assembly 120 is capable of collecting data at a lower frequency than the second acceleration sensing assembly 160. Preferably, the terminal 100 of the present invention achieves a wider spectrum acquisition range than a single sensing component by fusing the first acceleration sensing component 120 and the second acceleration sensing component 160 capable of acquiring higher frequency data. The terminal of the invention integrates the complementation of the first acceleration sensing component 120 and the second acceleration sensing component 160, so that the precision of the measured data is higher. The first acceleration sensing assembly 120 can measure a vibration signal with a frequency within 10KHz, a direct current signal, and a 3-axis direction by using the first acceleration sensor, but cannot measure a vibration signal with a frequency above 10 KHz. The second acceleration sensing assembly 160 is capable of measuring alternating signals, uniaxial, vibrations at frequencies above 10 KHz. The invention combines two acceleration sensing components, perfectly combines the advantages of the two acceleration sensing components, has wide application and greatly improves the measurable range.
It should be noted that the above-mentioned embodiments are exemplary, and that those skilled in the art, having benefit of the present disclosure, may devise various arrangements that are within the scope of the present disclosure and that fall within the scope of the invention. It should be understood by those skilled in the art that the present specification and figures are illustrative only and are not intended to be limiting on the claims. The scope of the invention is defined by the claims and their equivalents. Throughout this document, the features referred to as "preferably" are only an optional feature and should not be understood as necessarily requiring that such applicant reserves the right to disclaim or delete the associated preferred feature at any time. The present description contains several inventive concepts, such as "preferably", "according to a preferred embodiment" or "optionally", each indicating that the respective paragraph discloses a separate concept, the applicant reserves the right to submit divisional applications according to each inventive concept.
Claims (10)
1. The terminal integrating multiple sensing assemblies is characterized by at least comprising a first acceleration sensing assembly (120), a second acceleration sensing assembly (160) and a processing module (110), wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are connected with the processing module (110) through a communication protocol interface, the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are arranged on the same plate body in a mode that the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are axially flush with each other so that collected data are aligned, and the processing module (110) is convenient to process the data collected by the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160).
2. The terminal integrating multiple sensing assemblies according to claim 1, wherein the first acceleration sensing assembly (120) is capable of generating an interrupt to wake up the processing module (110) in the sleep state if the collected data exceeds a preset threshold, and the processing module (110) turns on the second acceleration sensing assembly (160) for data collection in response to the wake-up interrupt of the first acceleration sensing assembly (120).
3. The terminal of claim 1 or 2, wherein the first acceleration sensing component (120) comprises at least a first acceleration sensor capable of directly transmitting the acquired direct current multi-axial data to the processing module (110) for processing via a communication protocol interface.
4. The terminal integrating multiple sensing assemblies according to any one of claims 1 to 3, wherein the second acceleration sensing assembly (160) at least comprises a second acceleration sensor (161), a filter (162), a voltage follower (163) and a high-speed ADC (164), and the second acceleration sensor (161) transmits the acquired data in the single axial direction of the acquired alternating current to the processing module (110) for processing through a communication protocol interface after sequentially passing through the filter (162), the voltage follower (163) and the high-speed ADC (164).
5. The terminal of one of claims 1 to 4, wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are disposed on the board body at positions far away from the surrounding mechanical mounting holes, so as to avoid external stress from being transmitted to the sensor.
6. The terminal of any one of claims 1 to 5, wherein the first acceleration sensing component (120) and the second acceleration sensing component (160) are configured to be driven by a current through an I/O port of the processing module (110) to control on/off.
7. The terminal with the multi-sensor assembly fused according to any one of claims 1 to 6, wherein the processing module (110) comprises a processing chip (111), a random access memory (112) and a read only memory (113).
8. The terminal integrating multiple sensing assemblies according to any one of claims 1 to 7, wherein the terminal is further capable of integrating a temperature sensing assembly (130), an inertial measurement sensing assembly (140) and an inclination angle sensing assembly (150) to acquire temperature, track and attitude data of a measured object.
9. The terminal of any of claims 1 to 8, wherein the first acceleration sensing component (120) is capable of collecting data at a lower frequency than the second acceleration sensing component (160).
10. The circuit structure fused with multiple sensing assemblies is characterized by at least comprising a first acceleration sensing assembly (120), a second acceleration sensing assembly (160) and a processing module (110), wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are connected with the processing module (110) through a communication protocol interface, and the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are arranged on the same plate body in an axial collinear mode.
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