CN115032867B - Double-layer freely-moving high-precision alignment platform - Google Patents

Double-layer freely-moving high-precision alignment platform Download PDF

Info

Publication number
CN115032867B
CN115032867B CN202210528770.8A CN202210528770A CN115032867B CN 115032867 B CN115032867 B CN 115032867B CN 202210528770 A CN202210528770 A CN 202210528770A CN 115032867 B CN115032867 B CN 115032867B
Authority
CN
China
Prior art keywords
air
fixedly connected
plate
water storage
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210528770.8A
Other languages
Chinese (zh)
Other versions
CN115032867A (en
Inventor
陈志特
王�华
黄海浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Keshi Optical Technology Co ltd
Original Assignee
Guangdong Keshi Optical Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Keshi Optical Technology Co ltd filed Critical Guangdong Keshi Optical Technology Co ltd
Priority to CN202210528770.8A priority Critical patent/CN115032867B/en
Publication of CN115032867A publication Critical patent/CN115032867A/en
Application granted granted Critical
Publication of CN115032867B publication Critical patent/CN115032867B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

The invention discloses a double-layer freely-moving high-precision alignment platform, which belongs to the technical field of circuit board exposure, double-sided alignment of a circuit board is realized through a first platform plate and a second platform plate which are matched with an adjusting component, exposure treatment is facilitated, a water-cooling heat absorbing mechanism absorbs heat through aqueous solution in the circuit board exposure process, the aqueous solution is stirred to flow by means of a deformation memory spring, heat absorption is more complete and achieves the effect of cooling, a thermal extrusion mechanism drives an extrusion air bag to inject air into an air injection cylinder to enable the extrusion air bag to blow a stirring rod to move, a cold expansion adsorption mechanism drives ammonium chloride powder to be rapidly decomposed into hydrogen chloride gas and ammonia gas by means of the movement of the stirring rod, heat absorption and cooling are carried out, cold air is extruded to be blown into a telescopic air bag to extend, cold air is driven to diffuse, cooling is more complete, cooling effect is further enhanced, the circuit board is tightly absorbed by means of negative pressure, deviation is not easy to occur, and precision is improved.

Description

Double-layer freely-moving high-precision alignment platform
Technical Field
The invention relates to the technical field of circuit board exposure, in particular to a double-layer free-moving high-precision alignment platform.
Background
The high-precision alignment platform can be used in the machining, detection and assembly processes of a plurality of products, the products are arranged on the movable alignment platform, the alignment work of the products and the processing tool or other products is completed by the movable alignment platform, the rapid development of the double-sided exposure technology of the PCB is carried out in recent years, but the existing alignment platform is mostly single-sided alignment, and the efficiency is lower.
Chinese patent CN201910842481.3 proposes a double-deck freely movable high accuracy alignment platform, through an alignment platform cooperation circuit board splint device, when counterpointing in the double-sided exposure machine, realize the counterpoint of upper and lower film and circuit board, realize two-sided counterpoint, but the circuit board is influenced by ultraviolet irradiation in the exposure process, and the heat of easily accumulating makes it take place to damage easily under the high temperature to influence to two-sided counterpoint, reduce the precision.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a double-layer freely-moving high-precision alignment platform, the double-sided alignment of a circuit board is realized through the first platform plate and the second platform plate which are matched with an adjusting component, so that double-sided exposure treatment is facilitated, in the exposure process of the circuit board, a water cooling heat absorbing mechanism absorbs heat irradiated on the first platform plate and the second platform plate by ultraviolet rays through aqueous solution, the aqueous solution is stirred to flow by means of the extension of a deformation memory spring, so that heat absorption is more complete and the effect of cooling is achieved, a hot extrusion mechanism drives an extrusion air bag to inject air into an air injection cylinder by means of the extension of the deformation memory spring, the air injection is enabled to blow a toggle rod to move, a cold expansion adsorption mechanism drives ammonium chloride powder to be rapidly decomposed into hydrogen chloride gas and ammonia gas by means of the movement of the toggle rod, the heat is absorbed, the temperature is reduced, and the expansion air bag is inflated to stretch into the telescopic air bag to drive the cold air to be dispersed, so that the cooling effect is further enhanced, the circuit board is tightly adsorbed by means of negative pressure effect, the cold air is enabled not to be easily offset, and the precision is effectively improved.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The utility model provides a double-deck freely movable's high accuracy counterpoint platform, includes unable adjustment base, unable adjustment base's upside is equipped with first platen and second platen respectively, be equipped with adjusting part between unable adjustment base and the first platen, be equipped with adjusting part between first platen and the second platen, two heat conduction frames of upper end all fixedly connected with of first platen and second platen, the inside of heat conduction frame is equipped with water-cooling heat absorption mechanism and thermal extrusion mechanism respectively, the inside of first platen and second platen all is equipped with the cavity, the inside of cavity is equipped with cold expansion adsorption mechanism, thermal extrusion mechanism includes the jet cylinder of top fixed connection in with the heat conduction frame, open between heat conduction frame and the cavity has the intercommunication mouth, the lower extreme of jet cylinder is located the intercommunication mouth, the inside sliding connection of jet cylinder has the piston, fixedly connected with tensile cord between piston and the cylinder, the left and right sides end of jet cylinder all fixedly connected with extrusion air bag, two the outer ends of extrusion are all fixedly connected with stripper plate, and remove the movable air compressor and the fixed connection of air compressor, the fixed connection has the air compressor and the fixed connection of air compressor and the inner side of air compressor and fixed connection, the fixed connection has the air compressor and the fixed connection of air compressor, the fixed connection has the fixed connection to the inner side of expansion bag, fixed connection has the air compressor and fixed connection, fixed connection has the inner expansion link, fixed connection has the inner side of the fixed expansion, the inside sliding connection of cavity has two push plates, fixedly connected with flexible gasbag between push plate and the fixed bag body, and flexible gasbag is linked together with the inside of fixed bag body, a plurality of evenly distributed ventilative micropore have all been seted up between cavity and first platen and the second platen, ventilative micropore is located between two push plates, this scheme realizes the two-sided counterpoint of circuit board through first platen and second platen cooperation regulation subassembly, be convenient for its two-sided exposure treatment, and water-cooling heat absorption mechanism is in circuit board exposure process, absorb the heat that ultraviolet irradiation on first platen and second platen through aqueous solution, and stir aqueous solution flow by means of deformation memory spring, make it heat absorption more abundant comprehensive, and the effect of cooling is reached, and hot extrusion mechanism drives extrusion gasbag gas injection to jet-propelled cylinder by means of deformation memory spring, make it jet-propelled toggle lever move, cold expansion adsorption mechanism drives ammonium chloride powder fast to decompose into hydrogen chloride gas and ammonia by the motion of toggle lever motion, the absorption heat, reduce the temperature, and expansion sacculus expansion air is blown into the air drum to be convenient for its two-sided exposure treatment, and the air pump is moved by means of expansion mechanism, make the cold air pump effect of expansion mechanism is more compression piston, make the cold air is more compressed and the expansion mechanism is moved by means of deformation memory spring, make the cold air pump air injection into the jet cylinder, make the cooling effect is more comprehensive, make it is more comprehensive, make the cooling effect is cooled down, and the cooling effect is by means of expansion, and the cold air is compressed and the motion is compressed by the expansion, the motion of the expansion air cylinder is compressed by the expansion of the compression air, make the ammonium chloride powder fully heated decompose, quick cooling, and it decomposes into hydrogen chloride gas and ammonia and drive the expansion sacculus inflation, cool air in the fixed bag body of extrusion is to flexible gasbag in, make it extend and promote the push pedal to both sides motion, drive cool air dispersion, make the cooling more comprehensive, further strengthen cooling effect, and the push pedal moves the air of both sides in the extrusion cavity to both sides, make the air in the outside supplement to cavity centre department, with the help of the negative pressure effect, tightly adsorb the circuit board, make it be difficult for taking place the skew, the effectual precision that has improved.
Further, the water-cooling heat absorption mechanism comprises two water storage frames fixedly connected with the inner walls of the heat conduction frames, aqueous solution is arranged in the water storage frames, moving rods are arranged in the water storage frames, the upper end and the lower end of each moving rod are fixedly connected with straight rods, the two straight rods are connected with the water storage frames in a sliding mode, through holes are formed in the inner walls of the water storage frames, the left end and the right end of each moving rod penetrate through the through holes and extend to the outer sides of the water storage frames, deformation memory springs are fixedly connected between the inner walls of the heat conduction frames and the straight rods, the water-cooling heat absorption mechanism absorbs heat of ultraviolet irradiation on the first platform plate and the second platform plate through the aqueous solution, the temperature in the water-cooling heat absorption mechanism is gradually increased along with continuous absorption of the heat, the deformation memory springs are driven to be heated and extend, the moving rods and the straight rods are pushed to move, the aqueous solution is stirred to flow, the aqueous solution is alternately cooled, and the temperature is reduced, so that the aqueous solution is fully absorbed to the heat.
Further, the deformation memory spring adopts shape memory alloy material to make, deformation memory spring's initial condition is the shrink state, the surface of heat conduction frame is equipped with the diamond powder layer, through the deformation memory spring that uses shape memory alloy material to make after the temperature rises, extends, and after reducing, resumes to initial condition, realizes driving the movable rod and stirs aqueous solution and flow, reinforcing heat absorption effect, and is equipped with the diamond powder layer, makes things convenient for the heat conduction frame to heat conduction to the water storage frame in.
Further, two the one end that the straight-bar kept away from each other has all excavated spherical groove, the rotation is connected with the ball in the spherical groove, the outer end of ball contacts with the inner wall of water storage frame, through the setting of ball, makes straight-bar and movable rod keep steady motion.
Further, the inner wall fixedly connected with sealing washer of through-hole, the inner wall and the outer end in close contact of movable rod of sealing washer, through the setting of sealing washer, make aqueous solution be difficult for outwards spilling over through the gap between through-hole and the movable rod, reinforcing leakproofness.
Further, the inner wall fixedly connected with motion type of air duct sprays the bottle neck, the fumarole sets up for the slope, through the setting of motion type spraying the bottle neck, realizes realizing the air circulation between extrusion gasbag and the jet-propelled section of thick bamboo under the extrusion effect.
Furthermore, the cold expansion powder is made of ammonium chloride material, the outer end of the telescopic air bag is in a corrugated shape, the ammonium chloride powder is used for absorbing heat and decomposing into hydrogen chloride gas and ammonia gas after the temperature is increased, the ammonium chloride powder is synthesized again after the temperature is reduced, and the outer end of the telescopic air bag is in a corrugated shape, so that the telescopic air bag can be rapidly extended after the gas is blown in.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) The proposal realizes the double-sided alignment of the circuit board through the matching and adjusting components of the first platform plate and the second platform plate, is convenient for the double-sided exposure treatment, in the exposure process of the circuit board, the water-cooling heat absorbing mechanism absorbs the heat irradiated on the first platform plate and the second platform plate by the ultraviolet rays through the aqueous solution, and stirs the aqueous solution to flow by means of the extension of the deformation memory spring, so that the heat absorption is more complete and the effect of cooling is achieved, the thermal extrusion mechanism drives the extrusion air bag to inject air into the air injection cylinder by means of the extension of the deformation memory spring, so that the air injection is driven to blow the toggle rod to move, the cold expansion adsorption mechanism drives the ammonium chloride powder to be rapidly decomposed into hydrogen chloride gas and ammonia gas by means of the movement of the toggle rod, absorbs the heat, reduces the temperature, and the expansion air bag expands and extrudes the cold air to be blown into the telescopic air bag to extend to drive the cold air to disperse, the cooling effect is more comprehensive, the cooling effect is further enhanced, the circuit board is tightly adsorbed by means of negative pressure, the circuit board is not easy to deviate, the precision is effectively improved, the hot extrusion mechanism extrudes air in the extrusion air bag through the movement of the moving rod, the extrusion piston moves downwards, the extrusion air is ejected through the air ejection holes, the subsequent heat dissipation is convenient, the cold expansion adsorption mechanism absorbs heat and cools through the thermal decomposition of the ammonium chloride powder, the toggle rod is blown by the air ejected from the air ejection cylinder to move, the ammonium chloride powder is fully heated and decomposed, the temperature is quickly lowered, the ammonium chloride gas and the ammonia gas are decomposed into hydrogen chloride gas to drive the expansion air bag to expand, the cold air in the fixed air bag body is extruded into the telescopic air bag, the expansion push plate is extended to push the push plate to move to two sides, the cold air is driven to disperse, the temperature is more comprehensive, the cooling effect is further enhanced, and the push plate moves to two sides to squeeze air at two sides in the cavity, so that the air at the outer side is supplemented to the middle of the cavity, and the circuit board is tightly adsorbed by means of negative pressure, so that the circuit board is not easy to deviate, and the precision is effectively improved.
(2) The water-cooling heat absorption mechanism comprises two water storage frames fixedly connected with the inner walls of the heat conduction frames, water solution is arranged in the water storage frames, moving rods are arranged in the water storage frames, straight rods are fixedly connected to the upper ends and the lower ends of the moving rods, the two straight rods are connected with the water storage frames in a sliding mode, two through holes are formed in the inner walls of the water storage frames in a left-right direction, the left ends and the right ends of the moving rods penetrate through the through holes and extend to the outer sides of the water storage frames, deformation memory springs are fixedly connected between the inner walls of the heat conduction frames and the straight rods, the water-cooling heat absorption mechanism absorbs heat of ultraviolet rays irradiated on the first platform plate and the second platform plate through the water solution, the temperature inside the water-cooling heat absorption mechanism is gradually increased along with continuous absorption of the heat, the deformation memory springs are caused to be heated and extend, the moving rods and the straight rods are pushed to move, the water solution is stirred to alternate the heat and the water solution is cooled, the temperature is reduced, and the heat is fully absorbed.
(3) The deformation memory spring is made of shape memory alloy materials, the initial state of the deformation memory spring is a contracted state, the surface of the heat conduction frame is provided with a diamond powder layer, the deformation memory spring made of the shape memory alloy materials extends after the temperature rises, and after the deformation memory spring is lowered, the deformation memory spring is restored to the initial state, the movable rod is driven to stir aqueous solution to flow, the heat absorption effect is enhanced, and the diamond powder layer is arranged, so that the heat conduction frame is convenient for conducting heat into the water storage frame.
(4) The spherical groove is cut at the one end that two straight-bars kept away from each other, and the rotation is connected with the ball in the spherical groove, and the outer end of ball contacts with the inner wall of water storage frame, through the setting of ball, makes straight-bar and movable rod keep steady motion.
(5) The inner wall fixedly connected with sealing washer of through-hole, the inner wall and the outer end in close contact of movable rod of sealing washer, through the setting of sealing washer, make aqueous solution be difficult for outwards spilling over through the gap between through-hole and the movable rod, reinforcing leakproofness.
(6) The inner wall fixedly connected with motion type of air duct sprays the bottle neck, and the fumarole is the slope setting, through the setting of motion type injection bottle neck, realizes realizing the circulation of air between extrusion gasbag and the jet-propelled section of thick bamboo under the extrusion effect.
(7) The cold expansion powder is made of ammonium chloride material, the outer end of the telescopic air bag is in a corrugated shape, the ammonium chloride powder is used for absorbing heat and decomposing into hydrogen chloride gas and ammonia gas after the temperature is increased, the ammonium chloride powder is synthesized again after the temperature is reduced, and the outer end of the telescopic air bag is in a corrugated shape, so that the telescopic air bag can be rapidly extended after the gas is blown in.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of a heat conducting frame according to the present invention;
FIG. 3 is a schematic view of a partial cross-sectional structure of a water-cooled heat absorbing mechanism according to the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3A;
FIG. 5 is a schematic cross-sectional view of a thermal extrusion mechanism according to the present invention;
FIG. 6 is an enlarged schematic view of the structure of FIG. 5B;
FIG. 7 is a schematic view showing a partial cross-sectional structure of the cold expansion adsorption mechanism of the present invention;
FIG. 8 is a schematic diagram of the structure of the ventilation micropores of the present invention.
The reference numerals in the figures illustrate:
100. a fixed base; 200. a first platen; 300. a second platen; 400. an adjustment assembly; 500. a heat conduction frame; 600. a water-cooling heat absorbing mechanism; 601. a water storage frame; 602. a moving rod; 603. a deformation memory spring; 604. a straight rod; 6041. a ball; 700. a thermal extrusion mechanism; 701. an air-jet cylinder; 702. a piston; 703. a tension rope; 704. an extrusion plate; 705. extruding the air bag; 706. an air duct; 7061. sports type spray bottle mouth; 707. a gas injection hole; 800. a cold expansion adsorption mechanism; 801. fixing the bag body; 802. inflating the balloon; 803. an elastic membrane; 804. a toggle rod; 805. a telescopic air bag; 806. a push plate; 807. ventilation micropores.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples:
referring to fig. 1-8, a double-layer free moving high precision alignment platform comprises a fixed base 100, a first platform board 200 and a second platform board 300 are respectively arranged on the upper side of the fixed base 100, an adjusting component 400 is arranged between the fixed base 100 and the first platform board 200, an adjusting component 400 is arranged between the first platform board 200 and the second platform board 300, two heat conducting frames 500 are fixedly connected to the upper ends of the first platform board 200 and the second platform board 300, a water cooling heat absorbing mechanism 600 and a thermal extrusion mechanism 700 are respectively arranged in the heat conducting frames 500, cavities are respectively arranged in the first platform board 200 and the second platform board 300, a cold expansion adsorption mechanism 800 is arranged in the cavities, the thermal extrusion mechanism 700 comprises an air injection cylinder 701 fixedly connected with the inner top ends of the heat conducting frames 500, a communication port is cut between the heat conducting frames 500 and the cavities, the lower end of the air injection cylinder 701 is positioned in the communication port, the inside sliding connection of the air injection cylinder 701 has a piston 702, a tension rope 703 is fixedly connected between the piston 702 and the air injection cylinder 701, the left and right ends of the air injection cylinder 701 are fixedly connected with extrusion air bags 705, the outer ends of the two extrusion air bags 705 are fixedly connected with extrusion plates 704, the extrusion plates 704 are fixedly connected with a movable rod 602, an air duct 706 is fixedly connected between the extrusion air bags 705 and the air injection cylinder 701, the lower end of the air injection cylinder 701 is provided with a plurality of air injection holes 707, the cold expansion adsorption mechanism 800 comprises a fixed bag body 801 fixedly connected with the inner bottom end of a cavity, the fixed bag body 801 is positioned at the lower side of a communication port, the upper side of the fixed bag body 801 is provided with a poking rod 804, the upper end of the fixed bag body 801 is provided with a movable port, the poking rod 804 penetrates through the movable port and extends into the fixed bag body 801, an elastic membrane is fixedly connected between the poking rod 804 and the movable port, the lower end of the poking rod 804 is fixedly connected with an expansion ball 802, the inside of the expansion balloon 802 is provided with cold expansion powder, the inside of the cavity is connected with two push plates 806 in a sliding way, a telescopic balloon 805 is fixedly connected between the push plates 806 and the fixed balloon body 801, the telescopic balloon 805 is communicated with the inside of the fixed balloon body 801, a plurality of uniformly distributed ventilation micropores 807 are respectively cut between the cavity and the first platform plate 200 and the second platform plate 300, the ventilation micropores 807 are positioned between the two push plates 806, the double-sided alignment of the circuit board is realized through the first platform plate 200 and the second platform plate 300 in the scheme by matching the regulating component 400, the double-sided exposure treatment is convenient, in addition, the water-cooling heat absorbing mechanism 600 absorbs the heat irradiated on the first platform plate 200 and the second platform plate 300 by ultraviolet rays through aqueous solution in the exposure process of the circuit board, and stirs the aqueous solution to flow by virtue of the extension of the deformation memory spring 603, so that the heat absorption is more complete and the cooling effect is achieved, the thermal extrusion mechanism 700 drives the extrusion air bag 705 to inject air into the air injection cylinder 701 by virtue of the extension of the deformation memory spring 603, so that the air injection blows the poking rod 804 to move, the cold expansion adsorption mechanism 800 drives the ammonium chloride powder to be rapidly decomposed into hydrogen chloride gas and ammonia gas by virtue of the movement of the poking rod 804, the heat is absorbed, the temperature is reduced, the expansion air bag 802 expands and extrudes the cold air to be blown into the telescopic air bag 805 to extend, the cold air is driven to disperse, the cooling is more comprehensive, the cooling effect is further enhanced, the circuit board is tightly adsorbed by virtue of the negative pressure effect, the offset is not easy to occur, the precision is effectively improved, the thermal extrusion mechanism 700 extrudes the air inside the extrusion air bag 705 by virtue of the movement of the moving rod 602 to be injected into the air injection cylinder 701, the extrusion piston 702 moves downwards, the extrusion air is ejected out through the air injection holes 707, the subsequent heat dissipation is convenient, the cold expansion adsorption mechanism 800 absorbs heat and cools down through the thermal decomposition of ammonium chloride powder, and the air sprayed out of the air spraying cylinder 701 blows the poking rod 804 to move, so that the ammonium chloride powder is fully heated and decomposed, the temperature is quickly lowered, and the ammonia gas and the hydrogen chloride gas are decomposed into drive the expansion balloon 802 to expand, the cold air in the fixed balloon 801 is extruded into the telescopic balloon 805, the push plate 806 is extended to push the push plate 806 to move to two sides, the cold air is driven to disperse, the cooling effect is more comprehensive, the cooling effect is further enhanced, the push plate 806 moves to two sides to extrude the air at two sides in the cavity, the air at the outer side is supplemented to the middle of the cavity, the circuit board is tightly adsorbed by the action of negative pressure, the circuit board is not easy to deviate, and the precision is effectively improved.
Referring to fig. 2-3, the water-cooling heat absorbing mechanism 600 includes two water storage frames 601 fixedly connected to the inner wall of the heat conducting frame 500, an aqueous solution is disposed in the water storage frames 601, a moving rod 602 is disposed in the water storage frames 601, two straight rods 604 are fixedly connected to the upper and lower ends of the moving rod 602, the two straight rods 604 are slidably connected to the water storage frames 601, two left and right through holes are cut in the inner wall of the water storage frames 601, the left and right ends of the moving rod 602 pass through the through holes and extend to the outer side of the water storage frames 601, a deformation memory spring 603 is fixedly connected between the inner wall of the heat conducting frame 500 and the straight rods 604, and the water-cooling heat absorbing mechanism 600 absorbs heat of the first platen 200 and the second platen 300 by the aqueous solution, and gradually increases the temperature inside along with the continuous absorption of the heat, the deformation memory spring 603 is caused to be heated and extend, the moving rod 602 and the straight rods 604 are pushed to move, the aqueous solution is stirred to flow, the aqueous solution is cooled and heated and alternate, the temperature is lowered, and the sufficient absorption of the heat is facilitated.
Referring to fig. 2-4, the deformation memory spring 603 is made of a shape memory alloy material, the initial state of the deformation memory spring 603 is a contracted state, a diamond powder layer is arranged on the surface of the heat conducting frame 500, after the temperature of the deformation memory spring 603 made of the shape memory alloy material rises, the deformation memory spring is extended, and after the deformation memory spring is lowered, the deformation memory spring returns to the initial state, the movable rod 602 is driven to stir aqueous solution to flow, the heat absorbing effect is enhanced, the diamond powder layer is arranged, the heat conducting frame 500 is convenient to conduct heat into the water storage frame 601, spherical grooves are formed in one ends, far away from each other, of the two straight rods 604, balls 6041 are rotatably connected in the spherical grooves, the outer ends of the balls 6041 are in contact with the inner wall of the water storage frame 601, the straight rods 604 and the movable rod 602 are kept in stable motion through the arrangement of the balls 6041, the inner wall of the through hole is fixedly connected with a sealing ring, the inner wall of the sealing ring is in close contact with the outer end of the movable rod 602, and the sealing ring is not easy to overflow the aqueous solution outwards through a gap between the through the arrangement of the sealing ring, and the sealing performance is enhanced.
Referring to fig. 6, an inner wall of an air duct 706 is fixedly connected with a moving type injection bottle nozzle 7061, and an air injection hole 707 is arranged in an inclined manner, so that air communication between an extrusion air bag 705 and an air injection cylinder 701 is realized under the extrusion action through the arrangement of the moving type injection bottle nozzle 7061.
Referring to fig. 2 and 7, the cold expansion powder is made of an ammonium chloride material, the outer end of the telescopic airbag 805 is provided with a corrugated shape, and the outer end of the telescopic airbag 805 is provided with a corrugated shape by using the ammonium chloride powder to decompose hydrogen chloride gas and ammonia gas after the temperature is increased and to re-synthesize the ammonium chloride powder after the temperature is reduced, so that the telescopic airbag 805 is rapidly extended after the gas is blown in.
In the invention, when a related technician is used, firstly, a circuit board is placed on the first platform board 200 and the second platform board 300, and the first platform board 200 and the second platform board 300 are driven to move by the adjusting component 400, so that the double-sided exposure treatment is facilitated, then in the exposure process, the aqueous solution absorbs the heat of ultraviolet rays irradiated on the first platform board 200 and the second platform board 300, the temperature in the aqueous solution gradually rises along with the continuous absorption of the heat, the deformation memory spring 603 is driven to be heated and extended, the moving rod 602 and the straight rod 604 are pushed to move, the aqueous solution is stirred to flow, the aqueous solution is enabled to alternate cold and hot, the temperature is reduced, the sufficient absorption of the heat is facilitated, the movement of the moving rod 602 extrudes the air in the extrusion air bag 705 to be injected into the air injection cylinder 701, the extrusion piston 702 moves downwards, extrusion air is sprayed out through the air spraying holes 707, the poking rod 804 is blown to move, the ammonium chloride powder in the expansion balloon 802 is heated, decomposed and absorbed to be cooled, the poking rod 804 moves to drive the expansion balloon 802 to move, the ammonium chloride powder is fully heated and decomposed to be rapidly cooled, and the ammonia gas and the hydrogen chloride gas are decomposed to drive the expansion balloon 802 to expand, cold air in the extrusion fixing balloon 801 is extruded into the telescopic air bag 805, the push plate 806 is extended to push the push plate 806 to move to two sides, the cold air is driven to disperse, the cooling effect is more comprehensive, the cooling effect is further enhanced, the push plate 806 moves to two sides to extrude air at two sides in the cavity, the air at the outer side is supplemented to the middle of the cavity, the circuit board is tightly adsorbed by virtue of the negative pressure effect, the circuit board is not easy to deviate, and the precision is effectively improved.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.

Claims (7)

1. The utility model provides a double-deck freely movable's high accuracy platform of counterpointing, includes unable adjustment base (100), its characterized in that: the upper side of unable adjustment base (100) is equipped with first landing plate (200) and second landing plate (300) respectively, be equipped with adjusting part (400) between unable adjustment base (100) and first landing plate (200), be equipped with adjusting part (400) between first landing plate (200) and second landing plate (300), the upper end of first landing plate (200) and second landing plate (300) all fixedly connected with two heat conduction frames (500), the inside of heat conduction frame (500) is equipped with water-cooling heat absorption mechanism (600) and hot extrusion mechanism (700) respectively, the inside of first landing plate (200) and second landing plate (300) all is equipped with the cavity, the inside of cavity is equipped with cold expansion adsorption mechanism (800), hot extrusion mechanism (700) include with heat conduction frame (500) in top fixed connection's jet cylinder (701), open between heat conduction frame (500) and the cavity has the intercommunication mouth, the lower extreme of jet cylinder (701) is located the intercommunication mouth, the inside sliding connection of jet cylinder (701) has piston (702), the inside of jet cylinder (701) has piston (702) to extrude the both sides (702) and have the fixed connection between two extrusion ropes (702) and two compression ropes (702) are connected with each other, and squeeze plate (704) and movable rod (602) fixed connection, fixedly connected with air duct (706) between squeeze gasbag (705) and jet-propelled section of thick bamboo (701), the lower extreme of jet-propelled section of thick bamboo (701) is excavated and is had a plurality of fumaroles (707), cold expansion adsorption mechanism (800) including fixed bag body (801) with cavity inner bottom fixed connection, fixed bag body (801) are located the downside of intercommunication mouth, the upside of fixed bag body (801) is equipped with toggle rod (804), the upper end of fixed bag body (801) is excavated and is had the movable mouth, toggle rod (804) are worn the movable mouth to extend to in fixed bag body (801), fixedly connected with elastic membrane (803) between toggle rod (804) and the movable mouth, the lower extreme fixedly connected with inflation balloon (802) of toggle rod (804), the inside of inflation balloon (802) is equipped with cold expansion powder, the inside sliding connection of cavity has two push pedal (806), between push pedal (801) and fixed bag body (805) and the inside of flat-bed plate (805) are evenly connected with, and two flat-bed plate (801) and evenly distributed and two flat-plate (805) are connected with each other, and two flat-plate (805) are evenly connected with each other, and two flat-plate (300) and two flat-plate (805) are connected with each other, the ventilation micro-holes (807) are located between two push plates (806).
2. The dual-layer free-moving high-precision alignment platform of claim 1, wherein: the water-cooling heat absorption mechanism (600) comprises two water storage frames (601) fixedly connected with the inner wall of the heat conduction frame (500), an aqueous solution is arranged in the water storage frames (601), a movable rod (602) is arranged in the water storage frames (601), straight rods (604) are fixedly connected to the upper end and the lower end of the movable rod (602), the two straight rods (604) are in sliding connection with the water storage frames (601), two through holes are cut on the inner wall of the water storage frames (601) and are formed in the left and right positions, the left and right ends of the movable rod (602) penetrate through the through holes and extend to the outer side of the water storage frames (601), and a deformation memory spring (603) is fixedly connected between the inner wall of the heat conduction frame (500) and the straight rods (604).
3. The dual-layer free-moving high-precision alignment platform of claim 2, wherein: the deformation memory spring (603) is made of a shape memory alloy material, the initial state of the deformation memory spring (603) is a contracted state, and a diamond powder layer is arranged on the surface of the heat conduction frame (500).
4. The dual-layer free-moving high-precision alignment platform of claim 2, wherein: the two straight rods (604) are provided with spherical grooves at the ends far away from each other, the spherical grooves are rotationally connected with balls (6041), and the outer ends of the balls (6041) are contacted with the inner wall of the water storage frame (601).
5. The dual-layer free-moving high-precision alignment platform of claim 2, wherein: the inner wall of the through hole is fixedly connected with a sealing ring, and the inner wall of the sealing ring is tightly contacted with the outer end of the movable rod (602).
6. The dual-layer free-moving high-precision alignment platform of claim 1, wherein: the inner wall of the air duct (706) is fixedly connected with a movable injection bottle nozzle (7061), and the air jet holes (707) are obliquely arranged.
7. The dual-layer free-moving high-precision alignment platform of claim 1, wherein: the cold expansion powder is made of ammonium chloride material, and the outer end of the telescopic airbag (805) is arranged in a corrugated manner.
CN202210528770.8A 2022-05-16 2022-05-16 Double-layer freely-moving high-precision alignment platform Active CN115032867B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210528770.8A CN115032867B (en) 2022-05-16 2022-05-16 Double-layer freely-moving high-precision alignment platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210528770.8A CN115032867B (en) 2022-05-16 2022-05-16 Double-layer freely-moving high-precision alignment platform

Publications (2)

Publication Number Publication Date
CN115032867A CN115032867A (en) 2022-09-09
CN115032867B true CN115032867B (en) 2023-05-02

Family

ID=83121097

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210528770.8A Active CN115032867B (en) 2022-05-16 2022-05-16 Double-layer freely-moving high-precision alignment platform

Country Status (1)

Country Link
CN (1) CN115032867B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060069998A (en) * 2004-12-20 2006-06-23 삼성전자주식회사 Electronic cabinet of exposure apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58109701A (en) * 1981-12-24 1983-06-30 Mitsui Eng & Shipbuild Co Ltd Thermo-hydraulic convertor
CN110488577A (en) * 2019-09-06 2019-11-22 东莞科视自动化科技有限公司 A kind of free-moving high-precision of bilayer is to bit platform
CN113467581A (en) * 2021-04-18 2021-10-01 刘明杰 Data acquisition platform based on big data processing
CN113966143A (en) * 2021-09-27 2022-01-21 深圳鸿图新创科技有限公司 High-efficient heat dissipation formula vehicle-mounted charging power supply
CN113969972B (en) * 2021-10-08 2023-03-14 浙江午马减速机有限公司 Special planetary gear speed reducer for high-strength vehicle-mounted lifting truss
CN114315135A (en) * 2021-12-28 2022-04-12 广东光华永盛科技有限公司 Hollow glass and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060069998A (en) * 2004-12-20 2006-06-23 삼성전자주식회사 Electronic cabinet of exposure apparatus

Also Published As

Publication number Publication date
CN115032867A (en) 2022-09-09

Similar Documents

Publication Publication Date Title
CN115032867B (en) Double-layer freely-moving high-precision alignment platform
CN105499577A (en) 3D printing head for molten metal and printing method
CN113467581A (en) Data acquisition platform based on big data processing
CN108284613B (en) Method for adsorbing instrument panel skin
WO2023103383A1 (en) Metal powder delivery device and selective laser melting equipment
CN207166884U (en) A kind of HDI presses processing unit (plant)
CN213593728U (en) Baseball bat processing aerating device for baseball training
CN205343836U (en) 3D printer cooling device
CN205270863U (en) Molten metal 3D prints shower nozzle
CN112661556A (en) Efficient fermentation equipment for fertilizer production by using fermented food waste as raw material
CN115157044B (en) Low-temperature type efficient polishing method for pipe orifice for mold processing
CN116604775A (en) Arc-shaped bending manufacturing line for light-weight plastic automobile body of automobile
CN207617026U (en) A kind of injection molding machine just discharging mode
CN112218439B (en) Drying equipment for flexible circuit board production
CN114986846A (en) Polyethylene foaming extrusion molding device and method
CN108556355A (en) Printing shaping platform
CN218256817U (en) Heat dissipation device for 3D double-color printer
CN113103533A (en) Injection mold of working of plastics
CN215040038U (en) Injection mold with cooling structure for automobile sealing strip
CN215095554U (en) Bottom rod wrapping prevention device applied to bidirectional stretching hollow blow molding mold
CN216466410U (en) Precision type extrusion die
CN212194174U (en) Cooling mechanism for plastic blow molding machine
CN217968349U (en) Plastic uptake machine with quick cooling function
CN213463864U (en) Moisture-absorbing and sweat-releasing children garment
CN217831797U (en) A quick cooling device for automobile mold processing

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant