CN115032828A - Display device and manufacturing method of color film substrate - Google Patents
Display device and manufacturing method of color film substrate Download PDFInfo
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- CN115032828A CN115032828A CN202110240686.1A CN202110240686A CN115032828A CN 115032828 A CN115032828 A CN 115032828A CN 202110240686 A CN202110240686 A CN 202110240686A CN 115032828 A CN115032828 A CN 115032828A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Abstract
The invention discloses a display device and a manufacturing method of a color film substrate, which comprises the following steps: a display panel; the display panel includes: a color film substrate; the color film substrate comprises: substrate base plate, transparent protective layer, light shield layer and various rete, transparent protective layer sets up between light shield layer and substrate base plate, like this at the impression formation light shield layer pattern in-process, the impression mould runs through the light shield layer. Because the transparent protective layer exists, the light shielding layer can be penetrated in the imprinting process, the light shielding layer is prevented from being left, the transparent protective layer has good light transmission, and the influence on the color film layer can be almost ignored. The method has the advantages of avoiding the waste of photoresist, improving the manufacturing efficiency, reducing the manufacturing cost and avoiding the influence of the shading layer on the color film layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display device and a manufacturing method of a color film substrate.
Background
Currently, a Liquid Crystal Display (LCD) includes an array substrate and a color filter substrate that are disposed opposite to each other, and a Liquid Crystal layer located between the array substrate and the color filter substrate. The color film substrate comprises a substrate, a black matrix, a color resistance layer and the like, and in the process of manufacturing the black matrix at present, in order to avoid the problems of environmental pollution and material waste caused by manufacturing the black matrix by using a photoetching method, a nano-imprinting method is usually adopted for manufacturing, and the process does not need a photoetching process when the black matrix is manufactured, so that the production efficiency is high, and photoresist waste is avoided.
However, in the process of nanoimprinting, the mold is generally pressed into the substrate to a depth less than the thickness of the photoresist for the protection of the substrate and the mold. Thus, a certain photoresist residue is formed in the recess of the substrate after the mold release. When the method is used for manufacturing the black matrix, black residues are caused in the pixel area, the subsequent manufacturing of the pixel resin layer is influenced, and finally color deviation is caused.
Disclosure of Invention
In some embodiments of the present invention, a display panel includes: a color film substrate; the color film substrate comprises: substrate base plate, transparent protective layer, light shield layer and various rete, transparent protective layer sets up between light shield layer and substrate base plate, and like this at the impression formation light shield layer pattern in-process, the impression mould pierces through the light shield layer and forms a plurality of fretwork portions. Because of the transparent protective layer, the transparent protective layer can penetrate through the shading layer in the impressing process, the shading layer is prevented from being left, the transparent protective layer has good light transmission, and the influence on the color film layer can be almost ignored. The method has the advantages of avoiding the waste of photoresist, improving the manufacturing efficiency, reducing the manufacturing cost and avoiding the influence of the shading layer on the color film layer.
In some embodiments of the present invention, the light-shielding layer includes a plurality of hollow portions; the color film layer comprises a plurality of color film units, and the color film units correspond to the hollow parts one by one.
In some embodiments of the present invention, the transparent protection layer includes a plurality of concave portions, and an orthographic projection of the concave portions on the substrate coincides with an orthographic projection of the hollow portions on the substrate. In the process of impressing and forming the pattern of the light shielding layer, the impressing mold penetrates through the light shielding layer and is partially embedded into the transparent protective layer, and the light shielding layer is ensured not to be left in the light transmitting part.
In some embodiments of the present invention, the transparent protective layer is made of transparent photoresist; the shading layer is made of black photoresist.
In some embodiments of the present invention, the color film unit includes: the color filter comprises a red color film unit, a green color film unit and a blue color film unit.
In some embodiments of the present invention, the color film substrate further includes: the conducting layer is positioned on one side, away from the substrate, of the color film layer and the shading layer, the conducting layer has the function of forming an electric field between the conducting layer and a pixel electrode in the display panel, and liquid crystal molecules between the color film substrate and the array substrate are turned over under the action of the electric field, so that the light transmittance of a light source is changed; the shock insulator is located the conducting layer and deviates from one side of light shield layer, and the forward projection of shock insulator at the base plate is located the range of the forward projection of light shield layer at the substrate base plate to prevent the influence of shock insulator to regional light of pixel.
In some embodiments of the present invention, a method for manufacturing a color film substrate includes: firstly, providing a substrate, coating a layer of material of a transparent protective layer on the substrate, and coating a layer of material of a shading layer on one side of the transparent protective layer, which is far away from the substrate; providing an imprinting mold, aligning the imprinting mold with the substrate forming the light shielding layer, and contacting the imprinting mold with the light shielding layer; and then applying pressure to the stamping die to enable the stamping die to penetrate through the shading layer, and finally removing the stamping die to form the pattern of the shading layer. In the process of forming the light shielding layer pattern by using the imprinting mold, the imprinting mold penetrates through the light shielding layer. The method avoids the etching process of the photoetching method, avoids the waste of photoresist, improves the manufacturing efficiency, reduces the manufacturing cost and simultaneously avoids the influence of the shading layer on the color film layer.
In some embodiments of the present invention, imprinting the light shielding layer and the transparent protective layer with an imprinting mold includes: adopt the impression mould to carry out the impression to light shield layer and transparent protective layer, make the impression mould penetrate the light shield layer and partly imbed transparent protective layer to form a plurality of fretwork portions at the light shield layer, form a plurality of depressed parts at transparent protective layer. Therefore, the shading layer is completely penetrated, and the shading layer residue does not exist in the light-transmitting part, so that the influence of the shading layer on the color film layer is avoided.
In some embodiments of the present invention, the transparent protective layer and the light-shielding layer are heated to a temperature above the glass transition temperature before the light-shielding layer and the transparent protective layer are imprinted with the imprinting mold so that the imprinting mold penetrates through the light-shielding layer, and then the imprinted transparent protective layer and the light-shielding layer are cooled, and the imprinting mold is removed to form the light-shielding layer pattern.
In some embodiments of the present invention, the glass transition temperatures of the transparent protective layer and the light-shielding layer are 50 to 200 ℃.
In some embodiments of the invention, the transparent protective layer has a thickness of 0.01 to 5 μm; the light-shielding layer has a thickness of 1-10 μm.
In some embodiments of the present invention, the imprinting mold applies a pressure to the light-shielding layer and the transparent protective layer in a range of 1-100 bar.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a color film substrate according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a manufacturing method of a color film substrate according to an embodiment of the present invention;
fig. 3a to fig. 3f are schematic cross-sectional structures corresponding to steps of a manufacturing method of a color film substrate according to an embodiment of the present invention.
The manufacturing method comprises the following steps of 11-a substrate, 12-a transparent protective layer, 13-a shading layer, 14-a color film layer, 15-a conducting layer, 16-a spacer, 20-an embossing mold, 141-a red color film unit, 142-a green color film unit, 143-a blue color film unit, an E-hollow part and an S-concave part.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described in conjunction with the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are for illustrative purposes only and do not represent true scale.
Two display devices commonly used at present are a liquid crystal display device and an organic light emitting diode display device, and the liquid crystal display device mainly comprises a backlight module and a liquid crystal display panel. The liquid crystal display panel does not emit light, and brightness display needs to be realized by a backlight source in the backlight module.
The liquid crystal display device adopts the development principle that a liquid crystal layer is arranged between an array substrate and a color film substrate, and is driven by an electric field between electrodes on two sides of the liquid crystal layer to cause the electric field effect of liquid crystal molecule distortion so as to control the transmission or shielding function of a backlight source, thereby displaying an image.
In the organic light emitting diode display device, the backlight module is not needed to provide backlight, but the organic light emitting diode is directly used for image display, and when the organic light emitting diode adopts a white organic light emitting diode, a color film substrate can be arranged on the light emitting side of the display panel, so that the display panel can display color images.
Therefore, color film substrates can be arranged in both the liquid crystal display panel and the organic light emitting diode display panel to display color images.
Fig. 1 is a schematic cross-sectional structure diagram of a color film substrate according to an embodiment of the present invention.
Referring to fig. 1, the color filter substrate includes: the light-shielding layer comprises a substrate base plate 11, a transparent protective layer 12, a light-shielding layer 13, a color film layer 14, a conductive layer 15 and a spacer 16.
The substrate 11 is located at the bottom of the color film substrate and has supporting and bearing functions. The substrate base plate 11 is typically a rectangular structure, and when applied to a shaped display device, its shape is adapted to the shape of the display device.
In the embodiment of the invention, the transparent glass used for the substrate 11 is made of transparent glass with higher thermal conductivity coefficient to manufacture the substrate 11, so that light can smoothly penetrate through the substrate 11 and enter the color film layer 14 to realize color display, heat can be quickly dissipated in the subsequent process of manufacturing the color film substrate, the problem of element damage caused by overhigh temperature is avoided, and in addition, the surface of the glass substrate is smooth and flat, thereby being beneficial to the later-stage processing and manufacturing.
In order to cover the metal wires in the display panel and prevent the problem of poor display effect of the display panel caused by light reflection of the metal wires, a black matrix needs to be arranged on the substrate 11, and the black matrix is made of opaque black or dark color and is used for shading light. The problems of environmental pollution and material waste exist in the process of manufacturing the black matrix by using the photoetching method at present, so that the process of manufacturing the black matrix by using the nano-imprinting method does not need the photoetching process when the black matrix is manufactured, the production efficiency is high, and the photoresist waste is avoided.
However, in the case of nanoimprinting, the depth of the imprint mold generally requires the thickness of the film layer to be imprinted for protection of the substrate and the imprint mold. However, if the black matrix is manufactured in such a manner, a certain amount of black material residue may be formed in the recess of the substrate after demolding, which affects the subsequent manufacture of the color film layer and finally causes color deviation.
In view of this, the color filter substrate provided in the embodiment of the invention includes the transparent protective layer 12, and the light-shielding layer 13 is disposed on a side of the transparent protective layer away from the substrate 11, so that the imprint mold penetrates through the light-shielding layer 13 in the process of imprinting to form the pattern of the light-shielding layer 13. Due to the transparent protective layer, the transparent protective layer can penetrate through the shading layer in the imprinting process to avoid the shading layer from being left, and the transparent protective layer 12 has good light transmission and almost has negligible influence on the color film layer 14. The method has the advantages of avoiding the waste of photoresist, improving the manufacturing efficiency, reducing the manufacturing cost and avoiding the influence of the shading layer 13 on the color film layer 14.
The transparent protective layer 12 is located on the base substrate 11, and the shape of the transparent protective layer 12 is the same as that of the base substrate 11. The transparent protective layer 12 plays a role in protecting the substrate base plate 11 in the subsequent process of manufacturing the light shielding layer 13 by stamping, and the transparent protective layer 12 can enable light rays to smoothly penetrate through the transparent protective layer 12 to enter the color film layer 14, so that color display is realized.
During the manufacturing process, the imprint mold may just penetrate the light shielding layer 13, or the imprint mold may penetrate the light shielding layer 13 and be embedded inside the transparent protective layer 12. When the imprint mold penetrates through the light shielding layer 13 and is embedded into the transparent protection layer 12, as shown in fig. 1, the transparent protection layer 12 includes a plurality of concave portions S, and the concave portions S are formed in the process of fabricating the light shielding layer 13 by imprinting, in the embodiment of the present invention, the transparent protection layer 12 is made of transparent photoresist.
The light shielding layer 13 is located on the transparent protection layer 12, the whole shape of the light shielding layer 13 is the same as that of the transparent protection layer 12, the light shielding layer 13 includes a plurality of hollow parts E (formed by stamping of a stamping die), and the light shielding layer 13 is used for shielding metal wires in the display panel and preventing the problem of poor display effect of the display panel caused by light reflection of the metal wires.
In the embodiment of the present invention, the material used for the light shielding layer 13 is black photoresist.
The color film layer 14 is located on the side of the transparent protective layer 12 and the shading layer 13 away from the substrate 11, and at least covers the opening area of the shading layer 13. The color film layer 14 includes color film units corresponding to the hollow portions E one to one, and in an embodiment of the present invention, the color film layer may include: a red color film unit 141, a green color film unit 142, and a blue color film unit 143.
In practical applications, since the thickness of the color film layer 14 required by different display devices is different, the thickness of the color film layer 14 needs to be designed and determined according to practical application environments, which is not limited herein.
In the embodiment of the present invention, the color film layer 14 may be a color resist layer made of a resin material, and is used for realizing color display; or, the material used for the color film layer 14 may also be a quantum dot conversion material, and the blue light emitted by the light source is converted into red light and green light by the quantum dot conversion material, and the transmitted blue light is matched, so as to realize color display.
The conducting layer 15 is located on the color film layer 14 and the shading layer 13, an electric field is formed between the conducting layer 15 and a pixel electrode in the display panel, and liquid crystal molecules between the color film substrate and the array substrate are turned over under the action of the electric field, so that the light transmittance of the light source is changed.
In the embodiment of the present invention, the material of the conductive layer 15 may include a transparent conductive material, such as an Indium Tin Oxide (ITO) material, an Indium Zinc Oxide (IZO) material, a carbon nanotube, or graphene.
The spacer 16 is positioned on the conductive layer 15, and the orthographic projection of the spacer 16 on the base substrate 11 is positioned within the range of the orthographic projection of the light shielding layer 13 on the base substrate 11, thereby preventing the spacer 16 from affecting the light of the pixel region.
The spacer 16 is used to keep a certain interval between the array substrate and the color filter substrate, so as to inject a liquid crystal layer between the array substrate and the color filter substrate.
The spacer 16 is typically made of polycarbonate PC.
In specific implementation, the shape of the spacer 16 may be a simple cylindrical shape, and the cross-sectional pattern thereof may be a trapezoid, a square, or the like, which is not limited herein.
At present, in the process of manufacturing the black matrix, in order to avoid the problems of environmental pollution and material waste caused by the fact that the black matrix is manufactured by using a photoetching method, the black matrix is manufactured by adopting a nano-imprinting method generally, and the process does not need a photoetching process when the black matrix is manufactured, so that the production efficiency is high, and photoresist waste is avoided.
However, in the process of nanoimprinting, the mold is generally pressed into the substrate to a depth less than the thickness of the photoresist for the protection of the substrate and the mold. Thus, a certain photoresist residue is formed in the concave part of the substrate after demolding. When the method is used for manufacturing the black matrix, black residues are caused in the pixel area, the subsequent manufacturing of the pixel resin layer is influenced, and finally color deviation is caused.
In view of this, an embodiment of the present invention provides a method for manufacturing a color filter substrate, as shown in fig. 2, the method includes:
s10, providing a substrate, and forming a transparent protective layer on the substrate;
s20, forming a light shielding layer on one side of the transparent protective layer, which is far away from the substrate;
s30, embossing the shading layer and the transparent protective layer by using an embossing mold to enable the embossing mold to penetrate through the shading layer to form a plurality of hollow parts;
s40, forming a color film layer on one side of the shading layer and the transparent protective layer, which is far away from the substrate; the color film layer comprises a plurality of color film units, and the color film units correspond to the hollow parts one by one.
Wherein, the step S30 includes: adopt the impression mould to carry out the impression to light shield layer and transparent protective layer, make the impression mould penetrate the light shield layer and partly imbed transparent protective layer to form a plurality of fretwork portions at the light shield layer, form a plurality of depressed parts at transparent protective layer.
And before the light shielding layer is imprinted by the imprint mold, further comprising: heating transparent protective layer and light shield layer earlier and reaching more than its glass-transition temperature, adopt the impression mould to carry out the impression to light shield layer and transparent protective layer again, make the impression mould pass through the light shield layer, later cool down transparent protective layer and light shield layer after the impression again, take off the impression mould, form the light shield layer figure.
Fig. 3a to fig. 3f are schematic cross-sectional views corresponding to steps of a method for manufacturing a color filter substrate according to an embodiment of the present invention.
Specifically, referring to fig. 3a, in the method for manufacturing a color filter substrate according to the embodiment of the present invention, a substrate 11 is provided, a material of a transparent protective layer 12 is coated on the substrate 11, the thickness of the transparent protective layer 12 is 0.01 to 5 μm, and in the embodiment of the present invention, the material of the transparent protective layer 12 is a transparent photoresist.
Referring to fig. 3b, a layer of light-shielding layer 13 material is coated on the side of the transparent protective layer 12 facing away from the base substrate 11; the thickness of the light shielding layer 13 is 1-10 μm, and in the embodiment of the present invention, the material used for the light shielding layer 13 is black photoresist.
Referring to fig. 3c and 3d, providing an imprinting mold 20, and aligning the imprinting mold 20 with the substrate 11 on which the light-shielding layer 13 is formed; bringing the imprint mold 20 into contact with the light shielding layer 13; heating the transparent protective layer 12 and the shading layer 13 to be higher than the glass transition temperature of the transparent protective layer 12 and the shading layer 13, wherein in the embodiment of the invention, the glass transition temperature of the transparent protective layer 12 and the shading layer 13 is 50-200 ℃; and then applying pressure to the imprint mold 20 to make the imprint mold 20 penetrate through the light shielding layer 13, wherein in the embodiment of the invention, the imprint mold 20 applies pressure to the light shielding layer 13 and the transparent protective layer 12 in a range of 1-100 bar. Then cooling the transparent protective layer 12 and the shading layer 13; finally, the imprint mold 20 is removed to form the pattern of the light-shielding layer.
Specifically, in the process of the imprint mold 20 penetrating through the light-shielding layer 13, as shown in fig. 3c, the imprint mold 20 may penetrate through only the light-shielding layer 13 to form a plurality of hollow portions E in the light-shielding layer 13. Alternatively, as shown in fig. 3d, the imprint mold 20 penetrates the light-shielding layer 13 and is partially embedded in the transparent protection layer 12, a plurality of hollow portions E are formed on the light-shielding layer 13, and a plurality of concave portions S are formed on the transparent protection layer 12.
In the embodiment of the present invention, the imprinting mold 20 applies a pressure ranging from 1 to 100bar to the light-shielding layer 13 and the transparent protective layer 12. Then cooling the transparent protective layer 12 and the shading layer 13; finally, the imprint mold 20 is removed, and the transparent protection layer 12 is partially embedded into the light-shielding layer 13 after the imprint mold 20 penetrates through the light-shielding layer 13, so as to form the pattern of the light-shielding layer 13 as shown in fig. 3 e.
In the process of forming the pattern of the light shielding layer 13 by imprinting using the imprinting mold 20, the imprinting mold 20 penetrates the light shielding layer 13. Although the photoresist residue (the transparent protection layer 12) is also present in the process, the effect of the transparent protection layer 12 on the color film layer 14 is almost negligible. The method avoids the etching process of the photoetching method, avoids the waste of photoresist, improves the manufacturing efficiency, reduces the manufacturing cost and avoids the influence of the shading layer 13 on the color film layer 14.
Referring to fig. 3f, a color film layer 14 is formed on the light-shielding layer 13 and the transparent protective layer 12 on the side away from the substrate 11, the color film layer 14 includes a plurality of color film units, and the color film units correspond to the hollow portions E one to one, in an embodiment of the present invention, the color film units may include: a red color film unit 141, a green color film unit 142, and a blue color film unit 143.
Then, sequentially forming a conductive layer 15 as shown in fig. 1 on the color film layer 14; then, a spacer 16 is patterned on the conductive layer 15.
According to the first invention concept, the color film substrate comprises a transparent protective layer, and the light shielding layer is arranged on one side of the transparent protective layer, which is far away from the substrate, so that the imprinting mold penetrates through the light shielding layer in the process of imprinting and forming the light shielding layer pattern. Because of the transparent protective layer, the transparent protective layer can penetrate through the shading layer in the impressing process, the shading layer is prevented from being left, the transparent protective layer has good light transmission, and the influence on the color film layer can be almost ignored. The method has the advantages of avoiding the waste of photoresist, improving the manufacturing efficiency, reducing the manufacturing cost and avoiding the influence of the shading layer on the color film layer.
According to the second inventive concept, the transparent protective layer plays a role in protecting the substrate in the subsequent process of manufacturing the light shielding layer by imprinting, and light can smoothly penetrate through the transparent protective layer and enter the color film layer by the transparent protective layer, so that color display is realized.
According to the third inventive concept, the light shielding layer functions to shield the metal lines in the display panel, thereby preventing the problem of poor display effect of the display panel due to light reflection of the metal lines.
According to the fourth invention concept, the transparent glass with high thermal conductivity is used for manufacturing the substrate base plate, so that light can smoothly penetrate through the substrate base plate and enter the color film layer to realize color display, heat can be quickly dissipated in the subsequent process of manufacturing the color film base plate, the problem of element damage caused by overhigh temperature is avoided, in addition, the surface of the glass base plate is smooth and flat, and the later-stage processing and manufacturing are facilitated.
According to a fifth inventive concept, the method for manufacturing the color film substrate comprises the following steps: firstly, providing a substrate, coating a layer of material of a transparent protective layer on the substrate, and coating a layer of material of a shading layer on one side of the transparent protective layer, which is far away from the substrate; providing an imprinting mold, and aligning the imprinting mold with the substrate on which the light shielding layer is formed; contacting the imprint mold with the light shielding layer; and then applying pressure to the stamping die to enable the stamping die to penetrate through the shading layer, and finally removing the stamping die to form the pattern of the shading layer.
According to a sixth inventive concept, imprinting the light shielding layer and the transparent protective layer using the imprinting mold includes: adopt the impression mould to carry out the impression to light shield layer and transparent protective layer, make the impression mould penetrate the light shield layer and partly imbed transparent protective layer to form a plurality of fretwork portions at the light shield layer, form a plurality of depressed parts at transparent protective layer.
According to the seventh inventive concept, the transparent protective layer and the shading layer are heated to a temperature above the glass transition temperature before the shading layer and the transparent protective layer are imprinted, the imprinting mold is then used for imprinting the shading layer and the transparent protective layer to enable the imprinting mold to penetrate through the shading layer, then the imprinted transparent protective layer and the shading layer are cooled, the imprinting mold is removed, and the shading layer pattern is formed.
According to the eighth inventive concept, in the imprinting forming of the light shielding layer pattern using the imprinting mold, the imprinting mold penetrates through the light shielding layer. Although the photoresist residue (transparent protection layer) is also present in the process, the influence of the transparent protection layer on the color film layer is almost negligible. The method avoids the etching process of the photoetching method, avoids the waste of photoresist, improves the manufacturing efficiency, reduces the manufacturing cost and simultaneously avoids the influence of the shading layer on the color film layer.
According to the ninth inventive concept, the glass transition temperatures of the transparent protective layer and the light shielding layer are 50 to 200 ℃.
According to the tenth inventive concept, the transparent protective layer has a thickness of 0.01 to 5 μm; the light-shielding layer has a thickness of 1-10 μm.
According to the eleventh inventive concept, the imprinting mold applies a pressure ranging from 1 to 100bar to the light-shielding layer and the transparent protective layer.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display device, comprising:
the display panel is used for displaying images and comprises a color film substrate;
the color film substrate comprises:
the substrate base plate has supporting and bearing functions;
the transparent protective layer is positioned on one side of the substrate base plate;
the light shielding layer is positioned on one side, away from the substrate, of the transparent protective layer and comprises a plurality of hollow parts;
and the color film layer is positioned on one side of the transparent protective layer, which is far away from the substrate base plate, and comprises a plurality of color film units, and the color film units correspond to the hollow parts one to one.
2. The display device of claim 1, wherein the transparent protective layer comprises a plurality of recesses; the orthographic projection of the concave part on the substrate base plate is superposed with the orthographic projection of the hollow part on the substrate base plate.
3. The display device according to claim 1, wherein the transparent protective layer is made of a transparent photoresist; the shading layer is made of black photoresist.
4. The display device according to claim 1, wherein the color film unit comprises: the color filter comprises a red color film unit, a green color film unit and a blue color film unit.
5. The display device according to any one of claims 1 to 4, wherein the color filter substrate further comprises:
the conducting layer is positioned on one side of the color film layer and the shading layer, which are far away from the substrate;
and the spacer is positioned on one side of the conducting layer, which is far away from the shading layer, and the orthographic projection of the spacer on the substrate is positioned in the range of the orthographic projection of the shading layer on the substrate.
6. A manufacturing method of a color film substrate is characterized by comprising the following steps:
providing a substrate, and forming a transparent protective layer on the substrate;
forming a light shielding layer on one side of the transparent protective layer, which is far away from the substrate;
impressing the light shielding layer by adopting an impressing mold, so that the impressing mold penetrates through the light shielding layer to form a plurality of hollow parts;
forming a color film layer on one side of the shading layer and the transparent protective layer, which is far away from the substrate; the color film layer comprises a plurality of color film units, and the color film units correspond to the hollow parts one to one.
7. The method according to claim 6, wherein the imprinting the light-shielding layer with an imprinting mold so that the imprinting mold penetrates the light-shielding layer to form a plurality of hollow portions comprises:
and impressing the light shielding layer and the transparent protective layer by adopting an impressing mould, so that the impressing mould penetrates through the light shielding layer and is partially embedded into the transparent protective layer, a plurality of hollow parts are formed on the light shielding layer, and a plurality of concave parts are formed on the transparent protective layer.
8. The method according to claim 6, further comprising, before the imprinting the light-shielding layer with the imprinting mold:
heating the transparent protective layer and the shading layer to a temperature higher than the glass transition temperature;
after the light shielding layer and the transparent protective layer are imprinted by the imprinting mold and the imprinting mold penetrates through the light shielding layer, the method further includes:
and cooling the embossed transparent protective layer and the embossed shading layer.
9. The method according to claim 8, wherein the glass transition temperatures of the transparent protective layer and the light shielding layer are 50 to 200 ℃;
the pressure applied by the imprinting mould to the light shading layer is 1-100 bar.
10. The production method according to any one of claims 6 to 8, wherein the thickness of the transparent protective layer is 0.01 to 5 μm; the thickness of the light shielding layer is 1-10 μm.
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