CN115029746A - SLIPS surface coating suitable for multiple metal substrates and preparation method and application thereof - Google Patents
SLIPS surface coating suitable for multiple metal substrates and preparation method and application thereof Download PDFInfo
- Publication number
- CN115029746A CN115029746A CN202210875259.5A CN202210875259A CN115029746A CN 115029746 A CN115029746 A CN 115029746A CN 202210875259 A CN202210875259 A CN 202210875259A CN 115029746 A CN115029746 A CN 115029746A
- Authority
- CN
- China
- Prior art keywords
- porous
- nickel
- coating
- copper
- electroplating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 82
- 239000011248 coating agent Substances 0.000 title claims abstract description 81
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 40
- 230000003075 superhydrophobic effect Effects 0.000 claims abstract description 29
- 230000001050 lubricating effect Effects 0.000 claims abstract description 28
- 238000012986 modification Methods 0.000 claims abstract description 22
- 230000004048 modification Effects 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000004070 electrodeposition Methods 0.000 claims abstract description 16
- 239000010687 lubricating oil Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 130
- 229910052759 nickel Inorganic materials 0.000 claims description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 61
- 229910052802 copper Inorganic materials 0.000 claims description 61
- 239000010949 copper Substances 0.000 claims description 61
- 238000009713 electroplating Methods 0.000 claims description 59
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 50
- 238000007747 plating Methods 0.000 claims description 29
- 239000011780 sodium chloride Substances 0.000 claims description 25
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 9
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 8
- 239000002608 ionic liquid Substances 0.000 claims description 8
- 150000002815 nickel Chemical class 0.000 claims description 8
- 239000010702 perfluoropolyether Substances 0.000 claims description 8
- 229920001223 polyethylene glycol Polymers 0.000 claims description 8
- 239000004094 surface-active agent Substances 0.000 claims description 8
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 7
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 7
- 239000004327 boric acid Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- QTRSWYWKHYAKEO-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-henicosafluorodecyl-tris(1,1,2,2,2-pentafluoroethoxy)silane Chemical compound FC(F)(F)C(F)(F)O[Si](OC(F)(F)C(F)(F)F)(OC(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QTRSWYWKHYAKEO-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 5
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 5
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 5
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 5
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 5
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 5
- 235000011152 sodium sulphate Nutrition 0.000 claims description 5
- DGSDBJMBHCQYGN-UHFFFAOYSA-N sodium;2-ethylhexyl hydrogen sulfate Chemical compound [Na+].CCCCC(CC)COS(O)(=O)=O DGSDBJMBHCQYGN-UHFFFAOYSA-N 0.000 claims description 5
- VBGGLSWSRVDWHB-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-henicosafluorodecyl-tris(trifluoromethoxy)silane Chemical compound FC(F)(F)O[Si](OC(F)(F)F)(OC(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F VBGGLSWSRVDWHB-UHFFFAOYSA-N 0.000 claims description 4
- 235000021355 Stearic acid Nutrition 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 4
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 4
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000008117 stearic acid Substances 0.000 claims description 4
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 4
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 4
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- 229910021538 borax Inorganic materials 0.000 claims description 2
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 claims description 2
- 238000003760 magnetic stirring Methods 0.000 claims description 2
- 229940083037 simethicone Drugs 0.000 claims description 2
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 2
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 claims description 2
- 230000000844 anti-bacterial effect Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 abstract description 6
- 238000005536 corrosion prevention Methods 0.000 abstract description 5
- 241000894006 Bacteria Species 0.000 abstract description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 229920002545 silicone oil Polymers 0.000 description 12
- 238000005498 polishing Methods 0.000 description 8
- 238000004321 preservation Methods 0.000 description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 239000011664 nicotinic acid Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Abstract
The invention provides a SLIPS surface coating suitable for various metal substrates and a preparation method and application thereof, wherein the preparation method comprises the following steps: s1, performing electrodeposition on the surface of a metal base material by using a hydrogen bubble template method to obtain a porous coating; s2, performing super-hydrophobic modification on the porous coating obtained in the step S1 to obtain a hydrophobic layer; and S3, pouring lubricating oil into the hydrophobic layer obtained in the step S2 to form a lubricating layer, and finally obtaining the SLIPS surface coating which is composed of the hydrophobic layer and the lubricating layer and is suitable for various metal base materials. The coating obtained by the invention has smooth characteristic and self-repairing performance, and can be used in the fields of corrosion prevention, pollution prevention, bacteria resistance and the like.
Description
Technical Field
The invention belongs to the technical field of bionic super-smooth coatings, and particularly relates to a SLIPS surface coating suitable for various metal substrates, and a preparation method and application thereof.
Background
The bionic super-smooth coating has gained great attention in the fields of corrosion prevention, pollution prevention, ice prevention, drag reduction and the like due to the unique performance. The construction of the bionic super-smooth coating is generally divided into three steps: (1) constructing a porous structure; (2) performing super-hydrophobic modification; (3) the pouring of lubricating oil, in which the construction of a porous structure is the most critical factor, directly determines the pouring amount and stable maintenance of the lubricating medium. The porous structure can be constructed in various ways, such as anodic oxidation, chemical etching, hydrothermal method and the like, but the current ways have certain limitations and can only be used for specific metal base materials.
Disclosure of Invention
The invention aims to solve the technical problem of providing a SLIPS surface coating suitable for various metal substrates, a preparation method and application thereof, wherein the obtained coating has smooth characteristic and self-repairing performance and can be used in the fields of corrosion prevention, pollution prevention, bacteria resistance and the like.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a preparation method of SLIPS surface coating suitable for various metal substrates comprises the following steps:
s1, performing electrodeposition on the surface of a metal substrate by using a hydrogen bubble template method to obtain a porous coating;
s2, performing super-hydrophobic modification on the porous coating obtained in the step S1 to obtain a hydrophobic layer;
and S3, pouring lubricating oil into the hydrophobic layer obtained in the step S2 to form a lubricating layer, and finally obtaining the SLIPS surface coating which is composed of the hydrophobic layer and the lubricating layer and is suitable for various metal base materials.
Furthermore, the porous plating layer is a porous nickel plating layer or a porous copper plating layer, and the pore diameter of pores in the porous plating layer is 5-150 micrometers.
Further, the porous nickel plating layer is prepared by the following steps: and (3) carrying out electrodeposition in a porous nickel electroplating solution by taking nickel as an anode and a metal base material as a cathode at the temperature of 30-60 ℃, wherein the pH value of the porous nickel electroplating solution is 3-5, the current density is 1-200A/dm 2, and the time is 20-3600 s, so as to obtain the porous nickel plating layer.
Further, the porous nickel electroplating solution is prepared by the following steps: dissolving nickel salt, sodium chloride, a complexing agent and a surfactant in pure water at room temperature, and magnetically stirring until the nickel salt, the sodium chloride and the surfactant are uniformly mixed to obtain a porous nickel electroplating solution, wherein the concentration of the nickel salt in the porous nickel electroplating solution is 0.05-5 mol/L, the concentration of the sodium chloride is 0.1-2 mol/L, the concentration of the complexing agent is 10-50 g/L, and the concentration of the surfactant is 0.05-0.2 g/L; the nickel salt is one or more of nickel chloride, nickel sulfate and nickel sulfamate, the complexing agent is one or more of citric acid, boric acid, sodium borate, potassium pyrophosphate and sodium pyrophosphate, and the surfactant is one or more of 2-ethylhexyl sodium sulfate, sodium dodecyl sulfate and alkylphenol polyoxyethylene ether sodium sulfate.
Further, the porous copper plating layer is prepared by the following steps: and (3) carrying out electrodeposition in a porous copper electroplating solution by taking phosphorus copper as an anode and a metal base material as a cathode at the temperature of 30-60 ℃, wherein the pH value of the porous copper electroplating solution is 3-5, the current density is 5-300A/dm 2, and the time is 20-3600 s, so as to obtain the porous copper plating layer.
Further, the porous copper plating solution of the present invention is prepared by the steps of: dissolving copper salt, acid and an additive in pure water at room temperature, and magnetically stirring until the mixture is uniformly mixed to obtain a porous copper electroplating solution, wherein the concentration of the copper salt in the porous copper electroplating solution is 0.1-5 mol/L, the concentration of the acid is 0.1-3 mol/L, and the concentration of the additive is 30-1000 mg/L; the copper salt is one or two of copper sulfate and copper chloride, the acid is one or two of sulfuric acid and hydrochloric acid, and the additive is one or two of sodium chloride and polyethylene glycol.
Further, the metal substrate of the present invention is made of copper, nickel, stainless steel or titanium.
Further, step S2 of the present invention is: placing the porous coating obtained in the step S1 in a super-hydrophobic modifying solution, soaking for 20-40 minutes, taking out, placing in a drying oven at 120 ℃, and keeping the temperature for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modifying solution is composed of a super-hydrophobic modifying agent and a solvent in a volume ratio of 1: 49-99, the super-hydrophobic modifying agent is one or more of stearic acid, perfluorodecyl trimethoxy silane and perfluorodecyl triethoxy silane, and the solvent is ethanol; the step S3 is: and (4) dripping lubricating oil into the hydrophobic layer obtained in the step S2, fully filling the lubricating oil into pores of the porous coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, and discharging redundant lubricating oil to finally obtain the SLIPS surface coating which is composed of the hydrophobic layer and the lubricating layer and is suitable for various metal base materials, wherein the lubricating oil is one or more of perfluoropolyether, simethicone and ionic liquid.
Compared with the prior art, the invention has the following beneficial effects:
the invention firstly utilizes a hydrogen bubble template method to form a porous coating on a metal substrate by electrodeposition, then carries out super-hydrophobic modification and lubricating liquid perfusion in sequence, and can form the porous coating with a porous structure and a larger specific surface area by a cathodic hydrogen evolution reaction by using the hydrogen bubble template method, and the bonding force of the porous coating and the metal substrate is stronger, so the coating is suitable for various metal substrates, and the porous structure can effectively increase the filling amount of lubricating oil, so that the obtained coating has the smooth characteristic and the self-repairing performance, and can be used in the fields of drag reduction, corrosion prevention, pollution prevention, bacteria resistance and the like.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is an SEM topography of a SLIPS surface coating prepared in example 1 of the present invention;
fig. 2 is a schematic view of the contact angle of the hydrophobic layer obtained in step S2 in example 1 of the present invention;
fig. 3 is a schematic view of the contact angle of the lubricant layer obtained in step S3 in example 1 of the present invention.
Detailed Description
The invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed embodiment.
Example 1: the SLIPS surface coating was prepared as follows:
s1, using a metal base material which is pure copper as a cathode after oil removal, rust removal and polishing, and performing electrodeposition in a porous nickel electroplating solution by using nickel as an anode at the temperature of 50 ℃, the pH value of the porous nickel electroplating solution is 4.5, and the current density is 5A/dm 2 The time is 1200s, and then the porous nickel coating is obtained; the porous nickel electroplating solution is prepared by the following steps: dissolving nickel sulfate, sodium chloride, boric acid and sodium dodecyl sulfate in pure water at room temperature, and magnetically stirring until the nickel sulfate, the sodium chloride, the boric acid and the sodium dodecyl sulfate are uniformly mixed to obtain a porous nickel electroplating solution, wherein the concentration of the nickel sulfate in the porous nickel electroplating solution is 0.5mol/L, the concentration of the sodium chloride is 0.5mol/L, the concentration of the boric acid is 35g/L, and the concentration of the sodium dodecyl sulfate is 0.1 g/L;
s2, placing the porous nickel coating obtained in the step S1 in a super-hydrophobic modification solution for soaking for 30 minutes, taking out the porous nickel coating, placing the porous nickel coating in a 120-DEG C oven for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of perfluorodecyl triethoxysilane and ethanol in a volume ratio of 1: 99;
s3, dripping 1000 mu L of perfluoropolyether into the hydrophobic layer obtained in the step S2, fully pouring the perfluoropolyether into pores of the porous nickel coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, discharging redundant perfluoropolyether, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 2: the SLIPS surface coating was prepared as follows:
s1, taking 316L stainless steel as a metal base material, deoiling, derusting and polishing the stainless steel to be used as a cathode, taking nickel as an anode to carry out electrodeposition in porous nickel electroplating solution at the temperature of 50 ℃, the pH value of the porous nickel electroplating solution is 4.5, and the current density is 10A/dm 2 The time is 1200s, and then the porous nickel coating is obtained; the porous nickel electroplating solution is prepared by the following steps: nickel chloride, sodium chloride and boric acid at room temperatureAnd sodium dodecyl sulfate are dissolved in pure water, and the porous nickel electroplating solution is obtained by magnetic stirring until the mixture is uniformly mixed, wherein the concentration of nickel sulfate in the porous nickel electroplating solution is 0.5mol/L, the concentration of sodium chloride is 1mol/L, the concentration of boric acid is 35g/L, and the concentration of sodium dodecyl sulfate is 0.1 g/L;
s2, placing the porous nickel coating obtained in the step S1 in a super-hydrophobic modification solution for soaking for 30 minutes, taking out the porous nickel coating, placing the porous nickel coating in a 120-DEG C oven for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of perfluorodecyl triethoxysilane and ethanol in a volume ratio of 1: 49;
s3, dripping 1000 mu L of dimethyl silicone oil into the hydrophobic layer obtained in the step S2, fully filling the dimethyl silicone oil into pores of the porous nickel coating to form a lubricating layer, then inclining for 45 degrees, placing for 1 hour, discharging redundant dimethyl silicone oil, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 3: the SLIPS surface coating was prepared as follows:
s1, using a metal base material which is pure copper as a cathode after oil removal, rust removal and polishing, and performing electrodeposition in a porous copper electroplating solution by using phosphorus copper as an anode at the temperature of 50 ℃, the pH value of the porous copper electroplating solution is 4.5, and the current density is 5A/dm 2 The time is 1200s, and then the porous copper plating layer is obtained; the porous copper electroplating solution is prepared by the following steps: dissolving copper sulfate, sulfuric acid and sodium chloride in pure water at room temperature, and magnetically stirring until the copper sulfate, the sulfuric acid and the sodium chloride are uniformly mixed to obtain a porous copper electroplating solution, wherein the concentration of copper sulfate in the porous copper electroplating solution is 0.5mol/L, the concentration of sulfuric acid is 1mol/L, and the concentration of sodium chloride is 500 mg/L;
s2, placing the porous copper plating layer obtained in the step S1 in a super-hydrophobic modification solution for soaking for 30 minutes, taking out the porous copper plating layer, placing the porous copper plating layer in a drying oven at 120 ℃ for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of stearic acid and ethanol in a volume ratio of 1: 99;
s3, dripping 1000 mu L of dimethyl silicone oil into the hydrophobic layer obtained in the step S2, fully filling the dimethyl silicone oil into pores of the porous copper plating layer to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, discharging redundant dimethyl silicone oil, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 4: the SLIPS surface coating was prepared as follows:
s1, taking 316L stainless steel as a metal base material, deoiling, derusting and polishing the stainless steel to be used as a cathode, taking phosphorus copper as an anode to carry out electrodeposition in porous copper electroplating solution at the temperature of 50 ℃, the pH value of the porous copper electroplating solution being 4.5 and the current density being 5A/dm 2 The time is 1200s, and then the porous copper plating layer is obtained; the porous copper electroplating solution is prepared by the following steps: dissolving copper sulfate, sulfuric acid and polyethylene glycol in pure water at room temperature, and magnetically stirring until the copper sulfate, the sulfuric acid and the polyethylene glycol are uniformly mixed to obtain porous copper electroplating solution, wherein the concentration of copper sulfate in the porous copper electroplating solution is 0.5mol/L, the concentration of sulfuric acid is 1mol/L, and the concentration of the polyethylene glycol is 100 mg/L;
s2, placing the porous copper plating layer obtained in the step S1 in a super-hydrophobic modification solution for soaking for 30 minutes, taking out the porous copper plating layer, placing the porous copper plating layer in a drying oven at 120 ℃ for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of stearic acid and ethanol in a volume ratio of 1: 49;
s3, dripping 1000 mu L of dimethyl silicone oil into the hydrophobic layer obtained in the step S2, fully filling the dimethyl silicone oil into pores of the porous copper plating layer to form a lubricating layer, then inclining for 45 degrees, placing for 1 hour, discharging redundant dimethyl silicone oil, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
By referring to example 1, the coating formed by examples 2-4 was characterized with respect to morphology and wettability, and similar characterization results to example 1 were obtained. In conclusion, the method overcomes the limitation of the existing coating construction method, is suitable for various metal substrates, and the obtained coating has the smooth characteristic and the self-repairing performance and can be used in the fields of drag reduction, corrosion prevention, pollution prevention, bacteria resistance and the like.
Example 5: the SLIPS surface coating was prepared according to the following steps:
s1, using a metal base material which is pure copper as a cathode after oil removal, rust removal and polishing, and performing electrodeposition in a porous nickel electroplating solution by using nickel as an anode at the temperature of 30 ℃, the pH value of the porous nickel electroplating solution is 3, and the current density is 200A/dm 2 And the time is 20s, and the porous nickel coating is obtained; the porous nickel electroplating solution is prepared by the following steps: at room temperatureDissolving nickel sulfamate, sodium chloride, citric acid and 2-ethylhexyl sodium sulfate in pure water, and magnetically stirring until the nickel sulfamate, the sodium chloride, the citric acid and the 2-ethylhexyl sodium sulfate are uniformly mixed to obtain a porous nickel electroplating solution, wherein the concentration of the nickel sulfamate in the porous nickel electroplating solution is 5mol/L, the concentration of the sodium chloride is 2mol/L, the concentration of the citric acid is 10g/L, and the concentration of the 2-ethylhexyl sodium sulfate is 0.05 g/L;
s2, placing the porous nickel coating obtained in the step S1 in a super-hydrophobic modification solution for soaking for 20 minutes, taking out the porous nickel coating, placing the porous nickel coating in a drying oven at 120 ℃ for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution consists of perfluorodecyl trimethoxy silane and ethanol in a volume ratio of 1: 59;
s3, dripping 1000 mu L of ionic liquid into the hydrophobic layer obtained in the step S2, fully filling the ionic liquid into pores of the porous nickel coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, discharging redundant ionic liquid, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 6: the SLIPS surface coating was prepared as follows:
s1, taking titanium as a metal base material, removing oil, removing rust and polishing the titanium to be used as a cathode, taking nickel as an anode to carry out electrodeposition in a porous nickel electroplating solution, wherein the temperature is 60 ℃, the pH value of the porous nickel electroplating solution is 5, and the current density is 1A/dm 2 And the time is 3600s, and the porous nickel coating is obtained; the porous nickel electroplating solution is prepared by the following steps: dissolving nickel sulfate, sodium chloride, sodium pyrophosphate and alkylphenol polyoxyethylene ether sodium sulfate in pure water at room temperature, and magnetically stirring until the nickel sulfate, the sodium chloride and the alkylphenol polyoxyethylene ether sodium sulfate are uniformly mixed to obtain porous nickel electroplating solution, wherein the concentration of the nickel sulfate in the porous nickel electroplating solution is 0.05mol/L, the concentration of the sodium chloride is 0.1mol/L, the concentration of the sodium pyrophosphate is 50g/L, and the concentration of the alkylphenol polyoxyethylene ether sodium sulfate is 0.2 g/L;
s2, placing the porous nickel coating obtained in the step S1 in a super-hydrophobic modification solution for soaking for 40 minutes, taking out the porous nickel coating, placing the porous nickel coating in a 120-DEG C oven for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of perfluorodecyl triethoxysilane and ethanol in a volume ratio of 1: 79;
s3, dripping 1000 mu L of dimethyl silicone oil into the hydrophobic layer obtained in the step S2, fully pouring the dimethyl silicone oil into pores of the porous nickel coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, discharging redundant dimethyl silicone oil, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 7: the SLIPS surface coating was prepared as follows:
s1, taking a metal substrate as nickel, performing oil removal, rust removal and polishing on the metal substrate to obtain a cathode, performing electrodeposition in a porous copper electroplating solution at the temperature of 30 ℃, the pH value of the porous copper electroplating solution being 3, and the current density being 300A/dm 2 And the time is 20s, and the porous copper plating layer is obtained; the porous copper electroplating solution is prepared by the following steps: dissolving copper chloride, hydrochloric acid and sodium chloride in pure water at room temperature, and magnetically stirring until the copper chloride, the hydrochloric acid and the sodium chloride are uniformly mixed to obtain porous copper electroplating solution, wherein the concentration of the copper chloride in the porous copper electroplating solution is 0.1mol/L, the concentration of the hydrochloric acid is 0.1mol/L, and the concentration of the sodium chloride is 30 mg/L;
s2, placing the porous copper plating layer obtained in the step S1 in a super-hydrophobic modification solution for soaking for 20 minutes, taking out the porous copper plating layer, placing the porous copper plating layer in a drying oven at 120 ℃ for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of perfluorodecyl trimethoxy silane and ethanol in a volume ratio of 1: 79;
s3, dripping 1000 mu L of perfluoropolyether into the hydrophobic layer obtained in the step S2, fully pouring the perfluoropolyether into pores of the porous copper plating layer to form a lubricating layer, then inclining for 45 degrees, placing for 1 hour, discharging redundant perfluoropolyether, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
Example 8: the SLIPS surface coating was prepared as follows:
s1, taking a metal substrate as titanium, deoiling, derusting and polishing the titanium to be used as a cathode, taking phosphorus copper as an anode to carry out electrodeposition in porous copper electroplating solution at the temperature of 60 ℃, the pH value of the porous copper electroplating solution being 5, and the current density being 150A/dm 2 And the time is 3600s, and the porous copper plating layer is obtained; the porous copper electroplating solution is prepared by the following steps: dissolving copper chloride, hydrochloric acid and polyethylene glycol in pure water at room temperature, and magnetically stirring until the copper chloride, the hydrochloric acid and the polyethylene glycol are uniformly mixed to obtain porous copper electroplating solution, wherein the concentration of the copper chloride in the porous copper electroplating solution is 5mol/L, the concentration of the hydrochloric acid is 3mol/L, and the concentration of the polyethylene glycol is 1000 mg/L;
s2, placing the porous copper plating layer obtained in the step S1 in a super-hydrophobic modification solution for soaking for 40 minutes, taking out the porous copper plating layer, placing the porous copper plating layer in a drying oven at 120 ℃ for heat preservation for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modification solution is composed of perfluorodecyl triethoxysilane and ethanol in a volume ratio of 1: 59;
s3, dripping 1000 mu L of ionic liquid into the hydrophobic layer obtained in the step S2, fully filling the ionic liquid into pores of the porous copper coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, discharging redundant ionic liquid, and finally obtaining the SLIPS surface coating consisting of the hydrophobic layer and the lubricating layer.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A preparation method of SLIPS surface coating suitable for various metal substrates is characterized by comprising the following steps:
s1, performing electrodeposition on the surface of a metal base material by using a hydrogen bubble template method to obtain a porous coating;
s2, performing super-hydrophobic modification on the porous coating obtained in the step S1 to obtain a hydrophobic layer;
and S3, pouring lubricating oil into the hydrophobic layer obtained in the step S2 to form a lubricating layer, and finally obtaining the SLIPS surface coating which is composed of the hydrophobic layer and the lubricating layer and is suitable for various metal base materials.
2. The method of claim 1, wherein the porous coating is a porous nickel coating or a porous copper coating, and wherein pores in the porous coating have a pore size of 5-150 μm.
3. The method of claim 2, wherein the porous nickel coating is formed by: carrying out electrodeposition in a porous nickel electroplating solution at 30-60 ℃ and with a nickel anode and a metal substrate cathode, wherein the porous nickel electroplating solution has a pH of 3-5 and a current density of 1-200A/dm 2 And (5) the time is 20-3600 s, and the porous nickel coating is obtained.
4. The method of claim 3, wherein the porous nickel electroplating solution is prepared by the steps of: dissolving nickel salt, sodium chloride, a complexing agent and a surfactant into pure water at room temperature, and performing magnetic stirring until the nickel salt, the sodium chloride and the surfactant are uniformly mixed to obtain a porous nickel electroplating solution, wherein the concentration of the nickel salt in the porous nickel electroplating solution is 0.05-5 mol/L, the concentration of the sodium chloride is 0.1-2 mol/L, the concentration of the complexing agent is 10-50 g/L, and the concentration of the surfactant is 0.05-0.2 g/L; the nickel salt is one or more of nickel chloride, nickel sulfate and nickel sulfamate, the complexing agent is one or more of citric acid, boric acid, sodium borate, potassium pyrophosphate and sodium pyrophosphate, and the surfactant is one or more of 2-ethylhexyl sodium sulfate, sodium dodecyl sulfate and alkylphenol polyoxyethylene ether sodium sulfate.
5. The method of claim 2, wherein the porous copper coating is formed by: carrying out electrodeposition in a porous copper electroplating solution at 30-60 ℃ by taking phosphorus copper as an anode and a metal substrate as a cathode, wherein the pH value of the porous copper electroplating solution is 3-5, and the current density is 5-300A/dm 2 And the time is 20-3600 s, and the porous copper plating layer is obtained.
6. The method of claim 5, wherein the porous copper electroplating solution is prepared by the steps of: dissolving copper salt, acid and an additive in pure water at room temperature, and magnetically stirring until the mixture is uniformly mixed to obtain a porous copper electroplating solution, wherein the concentration of the copper salt in the porous copper electroplating solution is 0.1-5 mol/L, the concentration of the acid is 0.1-3 mol/L, and the concentration of the additive is 30-1000 mg/L; the copper salt is one or two of copper sulfate and copper chloride, the acid is one or two of sulfuric acid and hydrochloric acid, and the additive is one or two of sodium chloride and polyethylene glycol.
7. The method of claim 1, wherein the metal substrate is made of copper, nickel, stainless steel or titanium.
8. The method of claim 1, wherein step S2 is performed by: placing the porous coating obtained in the step S1 in a super-hydrophobic modifying solution, soaking for 20-40 minutes, taking out, placing in a drying oven at 120 ℃, and keeping the temperature for 60 minutes to obtain a hydrophobic layer, wherein the super-hydrophobic modifying solution is composed of a super-hydrophobic modifying agent and a solvent in a volume ratio of 1: 49-99, the super-hydrophobic modifying agent is one or more of stearic acid, perfluorodecyl trimethoxy silane and perfluorodecyl triethoxy silane, and the solvent is ethanol; the step S3 is: and (4) dripping lubricating oil into the hydrophobic layer obtained in the step S2, fully filling the lubricating oil into pores of the porous coating to form a lubricating layer, then inclining for 45 degrees, standing for 1 hour, and discharging redundant lubricating oil to finally obtain the SLIPS surface coating which is composed of the hydrophobic layer and the lubricating layer and is suitable for various metal base materials, wherein the lubricating oil is one or more of perfluoropolyether, simethicone and ionic liquid.
9. The SLIPS surface coating obtained by the preparation method according to any one of claims 1-8 and suitable for various metal substrates.
10. The use of the SLIPS surface coating of claim 9 for a variety of metal substrates in drag reduction, corrosion protection, soil resistance, or anti-bacterial applications.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210875259.5A CN115029746B (en) | 2022-07-21 | 2022-07-21 | SLIPS surface coating applicable to various metal substrates, and preparation method and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210875259.5A CN115029746B (en) | 2022-07-21 | 2022-07-21 | SLIPS surface coating applicable to various metal substrates, and preparation method and application thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115029746A true CN115029746A (en) | 2022-09-09 |
CN115029746B CN115029746B (en) | 2024-03-26 |
Family
ID=83130718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210875259.5A Active CN115029746B (en) | 2022-07-21 | 2022-07-21 | SLIPS surface coating applicable to various metal substrates, and preparation method and application thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115029746B (en) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103046088A (en) * | 2012-12-20 | 2013-04-17 | 华南理工大学 | Micro-nano composite porous copper surface structure and preparation method and device thereof |
WO2014036785A1 (en) * | 2012-09-06 | 2014-03-13 | 上海造币有限公司 | Plating solution and plating process for multi-layer cyanide-free plating copper-tin alloy coating, and coins made by the process |
CN103849910A (en) * | 2014-03-26 | 2014-06-11 | 哈尔滨工业大学 | Preparation method of super-hydrophobic meshy material |
CN106637211A (en) * | 2016-11-16 | 2017-05-10 | 哈尔滨工业大学 | Preparation method of aluminum-based liquid injection type drag reduction surface |
CN106987875A (en) * | 2017-03-03 | 2017-07-28 | 四川农业大学 | A kind of preparation method of super-hydrophobic superoleophobic material |
CN108950641A (en) * | 2018-06-25 | 2018-12-07 | 北京科技大学 | A kind of liquid coating and preparation method thereof and device |
CN109112599A (en) * | 2018-08-22 | 2019-01-01 | 大连理工大学 | A kind of preparation method obtaining sliding porous surface on aluminum substrate |
CN110721888A (en) * | 2019-10-23 | 2020-01-24 | 中国科学院宁波材料技术与工程研究所 | Lubricating grease filled porous structure antifouling surface, and preparation method and application thereof |
CN111892305A (en) * | 2020-06-23 | 2020-11-06 | 华南理工大学 | Method for forming super-smooth surface on glass substrate and prepared glass sheet with super-smooth surface |
CN111945141A (en) * | 2020-08-13 | 2020-11-17 | 湖北大学 | Preparation method of multifunctional super-smooth surface based on hollow zinc oxide nano structure |
CN111974647A (en) * | 2020-07-21 | 2020-11-24 | 华帝股份有限公司 | Surface treatment method of base material |
CN113737247A (en) * | 2021-09-28 | 2021-12-03 | 湖南大学 | Sliding surface, preparation method and application thereof |
CN113751295A (en) * | 2021-08-27 | 2021-12-07 | 浙江大学 | Preparation method and application of durable, super-smooth and super-hydrophobic surface |
-
2022
- 2022-07-21 CN CN202210875259.5A patent/CN115029746B/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014036785A1 (en) * | 2012-09-06 | 2014-03-13 | 上海造币有限公司 | Plating solution and plating process for multi-layer cyanide-free plating copper-tin alloy coating, and coins made by the process |
CN103046088A (en) * | 2012-12-20 | 2013-04-17 | 华南理工大学 | Micro-nano composite porous copper surface structure and preparation method and device thereof |
CN103849910A (en) * | 2014-03-26 | 2014-06-11 | 哈尔滨工业大学 | Preparation method of super-hydrophobic meshy material |
CN106637211A (en) * | 2016-11-16 | 2017-05-10 | 哈尔滨工业大学 | Preparation method of aluminum-based liquid injection type drag reduction surface |
CN106987875A (en) * | 2017-03-03 | 2017-07-28 | 四川农业大学 | A kind of preparation method of super-hydrophobic superoleophobic material |
CN108950641A (en) * | 2018-06-25 | 2018-12-07 | 北京科技大学 | A kind of liquid coating and preparation method thereof and device |
CN109112599A (en) * | 2018-08-22 | 2019-01-01 | 大连理工大学 | A kind of preparation method obtaining sliding porous surface on aluminum substrate |
CN110721888A (en) * | 2019-10-23 | 2020-01-24 | 中国科学院宁波材料技术与工程研究所 | Lubricating grease filled porous structure antifouling surface, and preparation method and application thereof |
CN111892305A (en) * | 2020-06-23 | 2020-11-06 | 华南理工大学 | Method for forming super-smooth surface on glass substrate and prepared glass sheet with super-smooth surface |
CN111974647A (en) * | 2020-07-21 | 2020-11-24 | 华帝股份有限公司 | Surface treatment method of base material |
CN111945141A (en) * | 2020-08-13 | 2020-11-17 | 湖北大学 | Preparation method of multifunctional super-smooth surface based on hollow zinc oxide nano structure |
CN113751295A (en) * | 2021-08-27 | 2021-12-07 | 浙江大学 | Preparation method and application of durable, super-smooth and super-hydrophobic surface |
CN113737247A (en) * | 2021-09-28 | 2021-12-03 | 湖南大学 | Sliding surface, preparation method and application thereof |
Non-Patent Citations (2)
Title |
---|
徐宏刚 等: "氢气泡模板法电沉积制备三维多孔铜的工艺参数研究", 矿业工程, vol. 40, no. 5, pages 115 - 119 * |
牛振江 等: "氢气泡模板电沉积多孔金属镍薄膜", 无机化学学报, vol. 22, no. 5, pages 930 - 934 * |
Also Published As
Publication number | Publication date |
---|---|
CN115029746B (en) | 2024-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108179418B (en) | Preparation method of zinc-nickel alloy coating structure suitable for strong corrosion environment | |
CN110724992B (en) | Method for preparing corrosion-resistant super-hydrophobic film on surface of aluminum alloy | |
CN109825866B (en) | Preparation method of alloy self-repairing corrosion-resistant micro-arc oxidation coating | |
CN109161941B (en) | Method for priming sintered neodymium-iron-boron magnet copper composite graphene coating to improve corrosion resistance and product | |
CN101226800B (en) | Surface treating method for sintering type Nd iron boron permanent magnetic material | |
CN106757264B (en) | A kind of wide temperature anodic oxidation electrolyte of aluminum alloy environment-friendly type and method for oxidation | |
CN104250813A (en) | Method for preparing super-hydrophobic self-cleaned corrosion-resisting surface of magnesium alloy | |
CN104818503A (en) | Preparation method of porous copper full-impregnated film of three-dimensional network structure | |
Mohamed et al. | Electrodeposition of Co–Cu alloy coatings from glycinate baths | |
CN108517549A (en) | A kind of preparation method of aluminium alloy compound anode oxide film | |
CN104649216A (en) | Preparing method of superhydrophobic concave angle T-shaped microcolumn structure | |
CN104593786A (en) | Method for microporous treatment of metal surface | |
CN109023459A (en) | A kind of multiple dimensioned surface texture and preparation method thereof for strengthening boiling of bilayer | |
CN108425137A (en) | A kind of method that electro-deposition prepares silver-nickel electrical contact | |
JP6250663B2 (en) | Electrodeposition process of nickel-cobalt coating with dendritic structure | |
CN110714219A (en) | Method for electroplating nickel on magnesium alloy micro-arc oxidation surface | |
CN115029746A (en) | SLIPS surface coating suitable for multiple metal substrates and preparation method and application thereof | |
CN107190288B (en) | Preparation method of HEDP copper-plated pore-free thin layer | |
CN110791785B (en) | Electrodeposition layer-lyophobic-super-slippery triple film with composite anticorrosion function and preparation method and application thereof | |
CN110684996A (en) | Preparation method of nickel-based super-hydrophobic corrosion-resistant coating on surface of sintered NdFeB magnet | |
CN103695977A (en) | Electroplating method capable of enabling tin coating to be level and preventing tin whisker from growing | |
CN110760906A (en) | Nano zinc-cobalt alloy coating based on double-pulse electrodeposition and preparation method thereof | |
CN105624758B (en) | A kind of preparation method of cast aluminum alloy micro-arc oxidation ceramic film | |
JP2005248319A (en) | Electroplating method of metal using gel electrolyte of organic solvent | |
CN107400909A (en) | A kind of three-D nano-porous copper and its preparation method and application |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |