CN115020253A - Preparation method of substitute chip of visual platform of flip chip molding underfill process - Google Patents
Preparation method of substitute chip of visual platform of flip chip molding underfill process Download PDFInfo
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- CN115020253A CN115020253A CN202210599380.XA CN202210599380A CN115020253A CN 115020253 A CN115020253 A CN 115020253A CN 202210599380 A CN202210599380 A CN 202210599380A CN 115020253 A CN115020253 A CN 115020253A
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000000465 moulding Methods 0.000 title claims abstract description 17
- 230000000007 visual effect Effects 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 63
- 239000010959 steel Substances 0.000 claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 claims abstract description 51
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000002390 adhesive tape Substances 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000012800 visualization Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 abstract description 15
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 6
- 238000012858 packaging process Methods 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a preparation method of a substitute chip of a visual platform of a flip chip molding underfill process, which comprises the steps of cleaning two transparent substrates, respectively sticking transparent double-sided adhesive tapes with the same size as the transparent substrates to obtain two transparent substrates with adhesive surfaces; the glue surface of one of the transparent substrates faces upwards, the steel mesh is buckled downwards to enable the groove to fix the transparent substrate, and the through hole surface on the steel mesh is kept on the upper side and is horizontally placed; leading excessive solder balls into the steel net, and directly dropping the solder balls on the adhesive surface of the transparent substrate through the through holes; and turning over the steel mesh, taking out the transparent substrate embedded with the solder balls from the grooves, and pressing and fixing the solder spherical surface and the adhesive surface of the other transparent substrate to obtain the substitute chip. The invention can be used for building an equivalent visual experiment platform which can carry out multiple flow experiments, avoid waste, has low cost, is simple and convenient to manufacture, is visual and can well reflect the characteristics of the flip chip.
Description
Technical Field
The invention relates to the technical field of flip chips, in particular to a preparation method of a substitute chip of a visual platform of a flip chip molding underfill process.
Background
With the increasing demand of people, the requirements for chip production are gradually increased, and the advantages of short interconnection, dense bumps and the like of the flip chip gradually occupy an important position in the market. In flip chip, the underfill process is one of the important process steps to ensure the reliability. The molding underfill process is a traditional injection molding process which simultaneously completes injection molding (molding) and underfill (underfilling), and brings higher reliability to a molded chip sample on the basis of quick filling. However, the disadvantages of mold underfill are also significant, since the filling speed is high and the flow imbalance is very severe, and there are high resistance areas with dense bumps in the flip chip, where the air entrapment due to too low flow rate is very likely to occur, leading to serious reliability problems after curing.
At present, there are 3 methods for analyzing related mechanisms in a molding and packaging process, one is to study the flow process by a direct curing method after incomplete flow of injection molding, which needs a real chip and an injection molding machine, and needs to consume many times in the process of studying the flow; one is to build a transparent experiment table, but the used chip salient points are large in size, about 600 mu m, and are mainly used for observing the deformation of the chip; one is to build a transparent and heatable experiment table, but the cavity and the content structure manufactured by the method are only suitable for the POP packaging condition.
The above-mentioned method for analyzing the related mechanism in the mold packaging process can not well study the forming mechanism of the air pocket formed by trapped air in the mold packaging process, and since the study of the forming mechanism of the air pocket formed by trapped air in the mold packaging process needs to perform a plurality of flow experiments, it is necessary to build an equivalent visual experiment platform which can perform a plurality of flow experiments, avoid waste, has low cost, is easy and convenient to manufacture, is visual, and can well reflect the characteristics of the flip chip. For the visual experiment platform, if a real chip is used, a large amount of available chips are easily wasted, and the visual experiment requirements cannot be met.
Disclosure of Invention
In view of the defects, the invention provides the preparation method of the substitute chip of the visual platform of the flip chip molding underfill process, which can be used for building an equivalent visual experimental platform which can be used for carrying out multiple flow experiments, avoids waste, has low cost, is simple and convenient to manufacture, is visual and can well reflect the characteristics of the flip chip.
In order to achieve the aim, the invention provides a preparation method of a substitute chip of a visual platform of a flip chip molding underfill process, wherein the raw materials of the preparation method comprise a transparent substrate, a transparent double-sided adhesive tape, a steel mesh and a solder ball; the steel mesh comprises a planar steel plate, the planar steel plate is internally provided with a groove which is matched with the shape of the transparent substrate and has a depth larger than the thickness of the transparent substrate, the bottom surface of the groove is provided with a plurality of through holes, the distribution of the through holes is the same as that of the bumps on the flip chip to be analyzed, and the diameter of the solder balls is the same as that of the bumps on the flip chip to be analyzed; the preparation method specifically comprises the following steps:
the method comprises the following steps: cleaning two transparent substrates, and respectively adhering transparent double-sided adhesive tapes with the same size as the transparent substrates to one surfaces of the two transparent substrates to obtain two transparent substrates with adhesive surfaces;
step two: the glue surface of one of the transparent substrates with the glue surface is upward, the steel mesh is buckled downwards to enable the groove to fix the transparent substrate, and the through hole surface on the steel mesh is kept upward and horizontally placed;
step three: guiding excessive solder balls onto the steel mesh so that the solder balls directly fall onto the adhesive surface of the transparent substrate through the through holes;
step four: and turning over the steel mesh, taking out the transparent substrate embedded with the solder balls from the grooves, pressing the solder ball surface on the adhesive surface of the other transparent substrate with the adhesive surface, and fixing in a pressing manner to obtain the substitute chip with the flip chip salient points to be analyzed.
According to one aspect of the invention, the ratio of the diameter of the solder balls to the diameter of the through holes is 0.9-1.
According to one aspect of the invention, the transparent substrate is a readily cut-processable PMMA sheet or a glass sheet.
According to one aspect of the invention, the through holes on the steel mesh are distributed in an array.
In accordance with one aspect of the invention, a plurality of independent grooves are provided in one of the steel nets.
According to an aspect of the invention, the thickness of the transparent substrate differs from the depth of the groove by 0.1 mm.
In accordance with one aspect of the present invention, the solder balls are solder balls.
According to one aspect of the present invention, the transparent double-sided adhesive tape has a glue layer thickness of less than 10um and a total thickness of 50 um.
In accordance with one aspect of the invention, the solder balls have a diameter of at least 200 um.
The invention has the beneficial effects that:
(1) the preparation cost is low, and the preparation is simple and convenient;
(2) the substitute chip prepared by the method can be used for carrying out multiple flow experiments;
(3) the substitute chip prepared from the transparent substrate and the transparent double-sided adhesive tape has the advantage of good visualization effect;
(4) the use of a real chip and an injection molding machine is avoided, and the consumption in the process of researching the fluidity is reduced;
(5) the method can prepare the substitute chip with the size of the salient point of the chip as small as 200um, and has wider application range.
Drawings
FIG. 1 is a schematic diagram of a preparation process of the present invention;
FIG. 2 is a schematic view of 12X 12 arrays of through holes with a diameter of 200um and a pitch of 400um in a steel mesh according to example 1 of the present invention;
fig. 3 is a schematic diagram of an equivalent visual experimental platform in embodiment 4 of the present invention;
FIG. 4 is a schematic structural view of a transparent mold in example 4 of the present invention;
fig. 5 is a schematic structural diagram of a cavity structure similar to the flip-chip molding packaging process in embodiment 4 of the present invention.
Reference numerals: 1. a first transparent substrate; 2. a second transparent substrate; 3. transparent double-sided adhesive tape; 4. a steel mesh; 5. a groove; 6. a through hole; 7. a solder ball; 8. a thrust device; 9. an injection system; 10. an observation system; 11. a transparent mold; 12. instead of a chip.
Detailed Description
In order that the invention may be more readily understood, reference will now be made to the following examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention, and it should be understood that the described examples are only a portion of the examples of the present invention, rather than the entire scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless otherwise defined, the terms used hereinafter are consistent with the meaning understood by those skilled in the art; unless otherwise specified, the starting materials and reagents referred to herein may be purchased from commercial sources or prepared by known methods.
As shown in fig. 1, a method for preparing a substitute chip 12 of a visualization platform of a flip chip molding underfill process, the raw materials of the preparation method include a transparent substrate (first transparent substrate 1), a transparent double-sided adhesive tape 3, a steel mesh 4 and solder balls 7; the steel mesh 4 comprises a planar steel plate, a groove 5 which is matched with the transparent substrate in shape and is deeper than the transparent substrate is arranged in the planar steel plate in a sunken mode, a plurality of through holes 6 are formed in the bottom surface of the groove 5, the distribution of the through holes 6 is the same as that of bumps on the flip chip to be analyzed, and the diameter of the solder ball 7 is the same as that of the bumps on the flip chip to be analyzed; the preparation method specifically comprises the following steps:
the method comprises the following steps: cleaning two transparent substrates (a first transparent substrate 1 and a second transparent substrate 2), and respectively sticking transparent double-sided adhesive tapes 3 with the same size as the transparent substrates on one surfaces of the two transparent substrates to obtain two transparent substrates (the first transparent substrate 1 and the second transparent substrate 2) with adhesive surfaces;
step two: the glue surface of one of the transparent substrates (the first transparent substrate 1) with the glue surface faces upwards, the steel mesh 4 is buckled downwards so that the groove 5 fixes the transparent substrate (the first transparent substrate 1), and the through hole 6 on the steel mesh 4 is kept on the upper surface and is horizontally placed;
step three: introducing excessive solder balls 7 onto the steel mesh 4, so that the solder balls 7 directly fall onto the adhesive surface on the transparent substrate through the through holes 6;
step four: and turning over the steel mesh 4, taking out the transparent substrate embedded with the solder balls 7 from the grooves 5, pressing the surface of the solder balls 7 on the adhesive surface of the other transparent substrate (the second transparent substrate 2) with the adhesive surface, and pressing and fixing to obtain the substitute chip 12 with the bumps of the flip chip to be analyzed.
The solder balls 7 are used for embodying an interconnection structure between the electrode plates of the flip chip, and the corresponding solder balls 7 are prepared according to the sizes of the bumps of the replaced chip. The bottom surface of the groove 5 on the steel mesh 4 is very thin (0.1mm), because the through hole 6 needs to be formed on the bottom surface and the falling of the solder ball 7 is not influenced, the steel mesh 4 is divided into two layers, specifically, the groove 5 layer and the through hole 6 layer, and in the preparation process of the steel mesh 4, the groove 5 layer and the through hole 6 layer are separately processed and then welded and fixed.
Preferably, the diameter ratio of the solder ball 7 to the through hole 6 is 0.9-1, which is to ensure that the solder ball 7 can smoothly fall onto the glue surface on the transparent substrate.
Preferably, the transparent substrate is a PMMA sheet or a glass sheet which is easy to cut and process, so that the substrate is low in cost and easy to cut and process.
Preferably, the through holes 6 on the steel mesh 4 are distributed in an array.
Preferably, a plurality of independent grooves 5 are formed on one of the steel nets 4 for the purpose of saving cost.
Preferably, the thickness of the transparent substrate differs from the depth of the grooves 5 by 0.1mm, for the purpose of ensuring.
Preferably, the solder ball 7 is a solder ball.
Preferably, the glue layer thickness of transparent double faced adhesive tape 3 is for being less than 10um, the gross thickness of double faced adhesive tape is 50um, and its purpose is to ensure that the double faced adhesive tape is transparent shape, realizes replacing chip 12's visualization.
Preferably, the diameter of the solder ball 7 is 200um at the minimum.
Example 1
Flow experiments were performed using a custom steel mesh 4 pattern to make a 12 x 12 array of substitute chips 12 of dimensions 7.5mm x 0.5mm, patterned with a diameter of 200um and a pitch of 400 um.
Customizing steel mesh 4, 6 layer thickness 0.1mm of steel mesh 4 through-hole of preparation, 5 layer thickness of recess are slightly higher than chip thickness (chip thickness 0.5mm), are 0.6mm, can make a plurality of size chips and multiple pattern on same 4 printing device of steel mesh. The specific chip sample manufacturing process is as follows:
the method comprises the following steps: cleaning two transparent substrates (a first transparent substrate 1 and a second transparent substrate 2) with the size of 7.5mm multiplied by 0.5mm, respectively sticking a transparent double-sided adhesive tape 3 with the same size as the transparent substrates on one surface of the two transparent substrates, wherein the thickness of the transparent double-sided adhesive tape 3 is less than 10um, and the total thickness of the transparent double-sided adhesive tape 3 and the base material adhered with the transparent double-sided adhesive tape 3 is about 50um, so as to obtain two transparent substrates (the first transparent substrate 1 and the second transparent substrate 2) with adhesive surfaces;
step two: the method comprises the following steps of (1) enabling the adhesive surface of one of the transparent substrates (first transparent substrate 1) with the adhesive surface to face upwards, buckling a groove 5 of a 12 x 12 array of through holes 6 with the diameter of 200um and the pitch of 400um on a steel mesh 4 to enable the groove 5 to fix the transparent substrate (first transparent substrate 1), and keeping the through holes 6 on the steel mesh 4 to face upwards and horizontally place;
step three: introducing excessive solder balls with the diameter of 200um onto the steel mesh 4, so that the solder balls 7 directly fall onto the adhesive surface of the transparent substrate through the through holes 6;
step four: and (3) turning the steel mesh 4, taking the transparent substrate embedded with the solder balls 7 out of the grooves 5, pressing the surface of the solder balls 7 on the adhesive surface of another transparent substrate (the second transparent substrate 2) with the adhesive surface, and pressing and fixing to obtain the substitute chip 12 with the bumps of the flip chip to be analyzed.
Example 2
Flow experiments were performed using a custom steel mesh 4 pattern to make a 10 x 10 array of substitute chips 12 measuring 7.5mm x 0.5mm in size, patterned with a diameter of 250um and a pitch of 500 um.
Customizing steel mesh 4, 6 layer thickness 0.1mm of steel mesh 4 through-hole of preparation, 5 layer thickness of recess are slightly higher than chip thickness (chip thickness 0.5mm), are 0.6mm, can make a plurality of size chips and multiple pattern on same 4 printing device of steel mesh. The specific chip sample manufacturing process is as follows:
the method comprises the following steps: cleaning two transparent substrates (a first transparent substrate 1 and a second transparent substrate 2) with the size of 7.5mm multiplied by 0.5mm, respectively sticking a transparent double-sided adhesive tape 3 with the same size as the transparent substrates on one surface of the two transparent substrates, wherein the thickness of the transparent double-sided adhesive tape 3 is less than 10um, and the total thickness of the transparent double-sided adhesive tape 3 and the base material adhered with the transparent double-sided adhesive tape 3 is about 50um, so as to obtain two transparent substrates (the first transparent substrate 1 and the second transparent substrate 2) with adhesive surfaces;
step two: the glue surface of one of the transparent substrates (the first transparent substrate 1) with the glue surface faces upwards, the grooves 5 of the through holes 6 with the diameter of 250um and the pitch of 500um in the 10 multiplied by 10 array are found on the steel mesh 4 and buckled downwards, so that the transparent substrates (the first transparent substrate 1) are fixed by the grooves 5, and the through holes 6 on the steel mesh 4 are kept on the upper surface and are horizontally placed;
step three: leading excessive solder balls with the diameter of 250um into the steel mesh 4, so that the solder balls 7 directly fall on the glue surface of the transparent substrate through the through holes 6;
step four: and (3) turning the steel mesh 4, taking the transparent substrate embedded with the solder balls 7 out of the grooves 5, pressing the surface of the solder balls 7 on the adhesive surface of another transparent substrate (the second transparent substrate 2) with the adhesive surface, and pressing and fixing to obtain the substitute chip 12 with the bumps of the flip chip to be analyzed.
Example 3
Flow experiments were performed using a custom steel mesh 4 pattern to make an 8 x 8 array of substitute chips 12 measuring 7.5mm x 0.5mm in size, patterned with a diameter of 300um and a pitch of 600 um.
Customizing steel mesh 4, 6 layer thickness 0.1mm of steel mesh 4 through-hole of preparation, 5 layer thickness of recess are slightly higher than chip thickness (chip thickness 0.5mm), are 0.6mm, can make a plurality of size chips and multiple pattern on same 4 printing device of steel mesh. The specific chip sample manufacturing process is as follows:
the method comprises the following steps: cleaning two transparent substrates (a first transparent substrate 1 and a second transparent substrate 2) with the size of 7.5mm multiplied by 0.5mm, respectively sticking a transparent double-sided adhesive tape 3 with the same size as the transparent substrates on one surface of the two transparent substrates, wherein the thickness of the transparent double-sided adhesive tape 3 is less than 10um, and the total thickness of the transparent double-sided adhesive tape 3 and the base material adhered with the transparent double-sided adhesive tape 3 is about 50um, so as to obtain two transparent substrates (the first transparent substrate 1 and the second transparent substrate 2) with adhesive surfaces;
step two: the glue surface of one of the transparent substrates (the first transparent substrate 1) with the glue surface faces upwards, the lower part of the groove 5 of the 8 x 8 array of through holes 6 with the diameter of 300um and the pitch of 600um found on the steel mesh 4 is buckled, so that the groove 5 fixes the transparent substrate (the first transparent substrate 1), and the through holes 6 on the steel mesh 4 are kept on the upper part and are horizontally placed;
step three: introducing excessive solder balls with the diameter of 300um onto the steel mesh 4, so that the solder balls 7 directly fall onto the adhesive surface of the transparent substrate through the through holes 6;
step four: and (3) turning the steel mesh 4, taking the transparent substrate embedded with the solder balls 7 out of the grooves 5, pressing the surface of the solder balls 7 on the adhesive surface of another transparent substrate (the second transparent substrate 2) with the adhesive surface, and pressing and fixing to obtain the substitute chip 12 with the bumps of the flip chip to be analyzed.
Example 4
The flow mechanism research in the molding underfill process is carried out by using the substitute chip 12 sample manufactured in the preparation process of the embodiments 1 to 3 of the present invention, and the built experimental platform and the real object diagram of the platform are shown in fig. 3.
The experimental platform mainly comprises a thrust device 8, an injection system 9, an observation system 10, a transparent mould 11 and a substitute chip 12 sample placed in the transparent mould 11, and can simulate the flowing process of the mould underfill. The injection speed is simulated by controlling the pushing speed by a stepping motor, the customized transparent mold 11 replaces the injection transparent mold 11, the high-viscosity silicone oil replaces the molten molding filler, the replaced chip 12 replaces a real chip, and the specific experiment and observation steps are as follows:
step 1: using an injector to suck silicon oil as filling fluid, placing the outlet of the injector upwards for a period of time, and discharging bubbles in the liquid in the injector;
step 2: opening the transparent mold 11 up and down, and fixing the prepared substitute chip 12 sample into a cavity in the transparent mold 11 through the transparent double-sided adhesive tape 3, wherein the picture of the transparent mold 11 is shown in fig. 4;
and step 3: the transparent mold 11 is aligned and folded up and down, the transparent mold 11 is fixed up and down by using bolts, and the structure in the cavity at the moment is similar to the cavity structure in the flip chip molding and packaging process, as shown in fig. 5;
and 4, step 4: the outlet of the injector is connected with the inlet of the transparent mould 11 by a pipeline, and the pushing speed is set to be 0.35mm/s on the stepping motor controller;
and 5: recording the flow of the fluid in the cavity of the substitute chip 12 sample, wherein the substitute chip is transparent and has the bump feature pattern of the flip chip, so that the flow process of the fluid in the transparent mold 11 and the area of the formed cavity can be obviously observed;
by replacing the sample of the replacement chip 12 with a different pattern, the effect of bump pattern, size, etc. on mold underfill flow can be obtained to better study the mechanism of gas trapping.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention disclosed herein are intended to be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. The invention discloses a preparation method of a substitute chip of a visual platform of a flip chip molding underfill process, which is characterized in that the raw materials of the preparation method comprise a transparent substrate, a transparent double-sided adhesive tape, a steel mesh and a solder ball; the steel mesh comprises a planar steel plate, the planar steel plate is internally provided with a groove which is matched with the shape of the transparent substrate and has a depth larger than the thickness of the transparent substrate, the bottom surface of the groove is provided with a plurality of through holes, the distribution of the through holes is the same as that of the bumps on the flip chip to be analyzed, and the diameter of the solder balls is the same as that of the bumps on the flip chip to be analyzed; the preparation method specifically comprises the following steps:
the method comprises the following steps: cleaning two transparent substrates, and respectively sticking transparent double-sided adhesive tapes with the same size as the transparent substrates on one surfaces of the two transparent substrates to obtain two transparent substrates with adhesive surfaces;
step two: the glue surface of one of the transparent substrates with the glue surface is upward, the steel mesh is buckled downwards to enable the groove to fix the transparent substrate, and the through hole surface on the steel mesh is kept upward and horizontally placed;
step three: leading excessive solder balls into the steel net, and directly dropping the solder balls on the adhesive surface of the transparent substrate through the through holes;
step four: and turning over the steel mesh, taking out the transparent substrate embedded with the solder balls from the groove, and pressing and fixing the solder spherical surface and the adhesive surface of the other transparent substrate with the adhesive surface to obtain the substitute chip with the bumps of the flip chip to be analyzed.
2. The method of claim 1, wherein the ratio of the diameter of the solder balls to the diameter of the through holes is 0.9-1.
3. The method of manufacturing a replacement chip for a visualization platform in a flip chip molding underfill process of claim 1, wherein the transparent substrate is a PMMA sheet or glass sheet that is easy to cut and process.
4. The method of claim 1, wherein the array of through holes on the steel mesh are distributed.
5. The method of claim 1, wherein a plurality of independent grooves are formed in one of the steel meshes.
6. The method of manufacturing a replacement chip for a visualization platform in a flip chip molding underfill process of claim 1, wherein the thickness of the transparent substrate differs from the depth of the recess by 0.1 mm.
7. The method of claim 1, wherein the solder balls are solder balls.
8. The method of claim 6, wherein the transparent double-sided adhesive tape has a glue layer thickness of less than 10um and a total thickness of 50 um.
9. The method of claim 1, wherein the solder balls have a minimum diameter of 200 um.
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| CN202210599380.XA CN115020253A (en) | 2022-05-30 | 2022-05-30 | Preparation method of substitute chip of visual platform of flip chip molding underfill process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116759389A (en) * | 2023-08-16 | 2023-09-15 | 长电集成电路(绍兴)有限公司 | Analog packaging module and preparation method thereof, and preparation method of chip packaging structure |
| CN116759390A (en) * | 2023-08-16 | 2023-09-15 | 长电集成电路(绍兴)有限公司 | Analog chip and preparation method thereof |
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2022
- 2022-05-30 CN CN202210599380.XA patent/CN115020253A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116759389A (en) * | 2023-08-16 | 2023-09-15 | 长电集成电路(绍兴)有限公司 | Analog packaging module and preparation method thereof, and preparation method of chip packaging structure |
| CN116759390A (en) * | 2023-08-16 | 2023-09-15 | 长电集成电路(绍兴)有限公司 | Analog chip and preparation method thereof |
| CN116759389B (en) * | 2023-08-16 | 2024-06-25 | 长电集成电路(绍兴)有限公司 | Analog packaging module and preparation method thereof, and preparation method of chip packaging structure |
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