CN115020177B - Vortex gas input device for vapor deposition hollow cathode composite electrode - Google Patents
Vortex gas input device for vapor deposition hollow cathode composite electrode Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
Abstract
The invention belongs to the field of semiconductor material preparation, and particularly relates to a vortex gas input device of a vapor deposition hollow cathode composite electrode. The device comprises an electrode for vapor deposition, wherein two sides of the electrode are respectively connected with a power supply and a fixed pipeline, and the positive electrode of the power supply is grounded. The surface of the electrode is uniformly distributed with penetrating round holes, and the inside of the electrode is distributed with buffer grooves, distribution rings, communication holes and air inlets. The air inlets are uniformly distributed on the side wall of the through round hole and are connected with the distribution ring, and the distribution ring is distributed on the periphery of the through round hole and is communicated with the buffer groove. The device improves the uniformity of air inlet and generates a stable and constant vortex gas flow field by arranging the buffer groove penetrating through the round hole and air inlet and regulating and controlling the direction of the air inlet hole, generates more stable and uniform hollow cathode discharge, ensures the uniformity of plasma and further improves the gas ionization rate, and is favorable for realizing uniform and efficient deposition of large-area diamond heat dissipation plates.
Description
Technical Field
The invention belongs to the field of semiconductor material preparation, and particularly relates to a vortex gas input device of a vapor deposition hollow cathode composite electrode.
Technical Field
The Hollow Cathode Effect (Hollow-Cathode Effect) refers to that when the distance between electrode plates is reduced to a certain degree in a system with opposite electrode plates and each electrode plate is independently discharged, the negative glow areas of the electrode plates are combined, the glow intensity and the current density are greatly increased, and the plasma is promoted to be severely ionized, and the technology is also called a future discharge mode.
With the growing importance of the third generation of diamond in the electronics industry, the acquisition of large-size and high-quality diamond has placed higher demands on equipment. Although mainstream diamond preparation methods such as hot filament CVD, microwave plasma CVD, direct current arc plasma jet CVD and the like have been developed for many years, problems of expensive equipment, complicated process, limited area of the obtained product, low quality and the like still exist, and development of diamond in the field of heat dissipation is limited to some extent. The problems caused by the air inlet mode still exist (CN 109881182A) after a plurality of years of improvement, and the conditions of uneven gas distribution and inconstant flow field state exist in the traditional air inlet mode inevitably, so that the improvement degree of the gas ionization rate is low, the uniformity of plasmas is poor, the uniformity and the quality of films are seriously influenced, and the process stability of equipment is difficult to ensure even under the air sources with different proportions and flow rates. The invention designs a more reasonable device structure, improves the uniformity of air inlet and generates a stable vortex gas flow field by the design of the array air inlet buffer flow channel of the micro unit and the regulation and control of the air inlet direction, ensures the uniformity of plasma and further improves the gas ionization rate, and is beneficial to realizing uniform and efficient deposition of large-area diamond heat dissipation plates.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a vortex gas input device of a vapor deposition hollow cathode composite electrode, which improves the uniformity of air inlet and generates a stable vortex gas flow field by arranging a through round hole, a buffer groove and regulating and controlling the direction of an air inlet hole, generates more stable and uniform hollow cathode discharge, ensures the uniformity of plasma and further improves the gas ionization rate. In order to achieve the above purpose, the technical scheme of the invention is as follows:
the utility model provides a hollow cathode composite electrode vortex gas input device of vapor deposition, its characterized in that this device includes an electrode that is used for vapor deposition, electrode both sides are connected power and fixed pipeline respectively, and the electrode surface evenly distributes and runs through the round hole, and electrode inside distributes has buffer tank, distribution ring, intercommunicating pore and inlet port. The through round holes are uniformly distributed on two sides of the buffer groove, the buffer groove is connected with each distribution ring through communication holes, the distribution rings are concentrically arranged around the through round holes, and the air inlet holes are uniformly distributed in the middle of the side wall of the through round hole and are connected with the distribution rings. The positive electrode of the power supply is grounded, and the negative electrode is connected with the composite electrode. The device realizes that each hollow cathode discharge unit can independently supply air in multiple directions by arranging the through round holes, the buffer grooves, the distribution rings, the communication holes and the air inlet holes, ensures the uniformity of air inlet and the stability of the air flow field by changing the air inlet direction to generate a gas vortex flow field, generates more stable and uniform hollow cathode discharge, improves the uniformity of plasma and the ionization rate of gas, and is favorable for realizing uniform and efficient deposition of large-area diamond heat dissipation plates.
Further, the tungsten metal plate with the electrode thickness of 10-30mm is provided with uniformly distributed through round holes with the diameter D0 of 10-30mm, and the distance between the round centers of the round holes is 35-55mm.
Further, the diameter D1 of the distribution ring is 20-40mm, the diameter D1 of the line is 1-2mm, and the diameter of the communication hole is 1-2mm, so that the distribution ring and the buffer groove are connected.
Further, the diameter d0 of the air inlet hole is 1-2mm, the air inlet hole is horizontally connected with the through round hole and the distribution ring, and the included angle alpha between the direction of the air inlet hole and the diameter direction is 0-30 degrees.
Further, the buffer groove is 4-5mm wide and 5-10mm thick and is distributed with the distribution rings on two sides at equal intervals.
Further, the electrode can discharge stably within the air pressure range of 0.5-10kpa, the air flow range of the air introduced into the buffer tank is 100-500sccm, and the power supply voltage is 200-1000V.
The key of the implementation process of the invention is as follows:
the invention provides a vortex gas input device of a vapor deposition hollow cathode composite electrode, which comprises an electrode for vapor deposition, wherein two sides of the electrode are respectively connected with a power supply and a fixed pipeline, the surface of the electrode is uniformly provided with a through round hole, the inside of the electrode is provided with a buffer slot, a distribution ring, a communication hole and an air inlet hole, the air inlet hole is uniformly distributed on the side wall of the through round hole and is connected with the distribution ring, the distribution ring is distributed on the periphery of the through round hole and is communicated with the buffer slot, and the anode of the power supply is grounded. The gas enters the buffer tank from the fixed pipeline, then enters the distribution ring through the communication hole, finally uniformly flows to each air inlet hole through the distribution ring, and enters the through round hole to participate in the discharging process. Through arranging the through round hole, the buffer tank, the distribution ring, the communication hole and the air inlet hole, each hollow cathode discharge unit can independently and multidirectional air supply, and through changing the air inlet direction, a gas vortex flow field is generated, the uniformity of air inlet and the stability of the gas flow field are ensured, more stable and uniform hollow cathode discharge is generated, the uniformity of plasma and the gas ionization rate are improved, and uniform and efficient deposition of a large-area diamond heat dissipation plate is facilitated.
The key point of the gas input method is that the two sides of the electrode are respectively connected with a power supply and a fixed pipeline, the thickness of the electrode is 10-30mm, gas enters a buffer groove with the width of 4-5mm and the thickness of 5-10mm in the electrode from the fixed pipeline, distribution rings with the diameter D1 of 20-40mm and the line diameter D1 of 1-2mm are uniformly distributed on the two sides of the buffer groove, and the gas flows into the distribution rings from the buffer groove through a communication hole with the line diameter D1 of 1-2 mm. The electrode is uniformly distributed with penetrating round holes with the diameter D0 of 10-30mm and the distribution ring which are arranged concentrically, and the distance between the centers of the penetrating round holes is 35-55mm. The gas in the distribution ring enters the internal reference and discharge process of the penetrating round hole through the air inlet hole with the line diameter d1 of 1-2 mm. The included angle alpha between the direction of the air inlet and the diameter direction is 0-30 degrees. When the electrode works, the gas flow range is 100-500sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole. When the output voltage of the power supply is 200-1000V, the electrode can continuously and stably discharge in the air pressure range of 0.5-10 kpa.
Compared with the prior art, the invention has the following beneficial effects:
the invention designs a vapor deposition hollow cathode composite electrode vortex gas input device, which realizes that each hollow cathode discharge unit can independently and multidirectional supply gas by arranging a through round hole, a buffer groove, a distribution ring, a communication hole and an air inlet hole, and finally ensures the uniformity of air inlet and the stability of the gas flow field by setting the air inlet direction to generate more stable and uniform hollow cathode discharge, improves the uniformity of plasma and the ionization rate of gas, and is beneficial to realizing uniform and efficient deposition of large-area diamond radiating plates.
Drawings
FIG. 1 is a schematic diagram of a vapor deposition hollow cathode composite electrode vortex gas input device;
fig. 2 is a cross-sectional view of the gas path distribution of the electrode.
Wherein: 1-grounding; 2-a power supply; 3-fixing the pipeline; 4-penetrating the round hole; 5-an air inlet hole; 6, a buffer tank; 7-distribution ring, 8-electrode; 9-communication holes.
Detailed Description
The technical scheme of the invention is further described below with reference to specific embodiments:
as shown in the figure, the invention provides a vapor deposition hollow cathode composite electrode vortex gas input device which comprises a grounding (1), a power supply (2), a fixed pipeline (3), a penetrating round hole (4), an air inlet hole (5), a buffer groove (6), a distribution ring (7), an electrode (8) and a communication hole (9). The utility model discloses a power supply, including electrode (8), fixed pipeline (3), electrode (8), distribution ring (7), connecting hole (9) and inlet port (5), electrode (8) both sides are connected respectively, and surface evenly distributed has runs through round hole (4), inside distribution has buffer tank (6), distribution ring (7), connecting hole (9), inlet port (5) equipartition is in running through round hole (4) lateral wall and being connected with distribution ring (7), distribution ring (7) distribute in running through round hole (4) periphery and with buffer tank (6) intercommunication, positive pole ground connection (1) of power supply (2). The gas enters the buffer groove (6) from the fixed pipeline (3), then enters the distribution ring (7) through the communication hole (9), finally evenly flows to each air inlet hole (5) through the distribution ring (7) and enters the through round hole (4) to participate in the discharging process. Through arranging and penetrating round hole (4), buffer tank (6), distribution ring (7), intercommunicating pore (9) and inlet port (5), realize that every hollow cathode discharge unit can be independent, multidirectional air feed to through changing the homogeneity of admitting air and the stability of gas flow field production, produce more stable, even hollow cathode discharge, improve plasma homogeneity and gas ionization rate, be favorable to realizing even, efficient deposit large tracts of land diamond heating panel.
Example 1
According to the vapor deposition hollow cathode composite electrode vortex gas input device, through designing the structure of the gas input device, the uniformity of gas inlet is improved, a stable vortex gas flow field is generated, and uniform and efficient deposition of a large-area diamond heat dissipation plate is realized. The structure of the device is designed according to the following thought:
firstly, two sides of an electrode (8) are respectively connected with a power supply (2) and a fixed pipeline (3), wherein the electrode (8) is a tungsten metal plate with the thickness of 10mm, gas enters a buffer groove (6) with the width of 4mm and the thickness of 5mm in the electrode (8) from the fixed pipeline (3), distribution rings (7) with the diameter D1 of 20mm and the line diameter D1 of 1mm are uniformly distributed on two sides of the buffer groove (6), and the gas flows into the distribution rings (7) from the buffer groove (6) through a communication hole (9) with the line diameter D1 of 1 mm. The electrode (8) is uniformly distributed with penetrating round holes (4) with the diameter D0 of 10mm and the distribution ring (7) which are arranged concentrically, and the distance between the centers of the penetrating round holes (4) is 35mm. The gas in the distribution ring (7) enters the penetrating round hole (4) through the air inlet hole (5) with the line diameter d1 of 1mm to participate in the discharging process. The included angle alpha between the direction of the air inlet hole (5) and the diameter direction is 0 degrees. When the electrode (8) works, the gas flow range is 100sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole (4). When the output voltage of the power supply (2) is 200V, the electrode (8) can continuously and stably discharge in the air pressure range of 0.5 kpa.
Example 2
According to the vapor deposition hollow cathode composite electrode vortex gas input device, through designing the structure of the gas input device, the uniformity of gas inlet is improved, a stable vortex gas flow field is generated, and uniform and efficient deposition of a large-area diamond heat dissipation plate is realized. The structure of the device is designed according to the following thought:
firstly, two sides of an electrode (8) are respectively connected with a power supply (2) and a fixed pipeline (3), wherein the electrode (8) is a tungsten metal plate with the thickness of 15mm, gas enters a buffer groove (6) with the width of 4mm and the thickness of 7mm in the electrode (8) from the fixed pipeline (3), distribution rings (7) with the diameter D1 of 25mm and the line diameter D1 of 1mm are uniformly distributed on two sides of the buffer groove (6), and the gas flows into the distribution rings (7) from the buffer groove (6) through a communication hole (9) with the line diameter D1 of 1 mm. The electrode (8) is uniformly distributed with a penetrating round hole (4) with the diameter D0 of 15mm and the distribution ring (7) which are concentrically arranged, and the distance between the centers of the penetrating round holes (4) is 40mm. The gas in the distribution ring (7) enters the penetrating round hole (4) through the air inlet hole (5) with the line diameter d1 of 1mm to participate in the discharging process. The included angle alpha between the direction of the air inlet hole (5) and the diameter direction is 10 degrees. When the electrode (8) works, the gas flow range is 200sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole (4). When the output voltage of the power supply (2) is 400V, the electrode (8) can continuously and stably discharge in the air pressure range of 2 kpa.
Example 3
According to the vapor deposition hollow cathode composite electrode vortex gas input device, through designing the structure of the gas input device, the uniformity of gas inlet is improved, a stable vortex gas flow field is generated, and uniform and efficient deposition of a large-area diamond heat dissipation plate is realized. The structure of the device is designed according to the following thought:
firstly, two sides of an electrode (8) are respectively connected with a power supply (2) and a fixed pipeline (3), wherein the electrode (8) is a tungsten metal plate with the thickness of 20mm, gas enters a buffer groove (6) with the width of 5mm and the thickness of 8mm in the electrode (8) from the fixed pipeline (3), distribution rings (7) with the diameter D1 of 30mm and the line diameter D1 of 2mm are uniformly distributed on two sides of the buffer groove (6), and the gas flows into the distribution rings (7) from the buffer groove (6) through a communication hole (9) with the line diameter D1 of 2 mm. The electrode (8) is uniformly distributed with penetrating round holes (4) with the diameter D0 of 20mm and the distribution ring (7) which are concentrically arranged, and the distance between the centers of the penetrating round holes (4) is 45mm. The gas in the distribution ring (7) enters the penetrating round hole (4) through the air inlet hole (5) with the line diameter d1 of 1mm to participate in the discharging process. The included angle alpha between the direction of the air inlet hole (5) and the diameter direction is 15 degrees. When the electrode (8) works, the gas flow range is 300sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole (4). When the output voltage of the power supply (2) is 600V, the electrode (8) can continuously and stably discharge in the air pressure range of 5 kpa.
Example 4
According to the vapor deposition hollow cathode composite electrode vortex gas input device, through designing the structure of the gas input device, the uniformity of gas inlet is improved, a stable vortex gas flow field is generated, and uniform and efficient deposition of a large-area diamond heat dissipation plate is realized. The structure of the device is designed according to the following thought:
firstly, two sides of an electrode (8) are respectively connected with a power supply (2) and a fixed pipeline (3), wherein the electrode (8) is a tungsten metal plate with the thickness of 25mm, gas enters a buffer groove (6) with the width of 5mm and the thickness of 9mm in the electrode (8) from the fixed pipeline (3), distribution rings (7) with the diameter D1 of 35mm and the line diameter D1 of 2mm are uniformly distributed on two sides of the buffer groove (6), and the gas flows into the distribution rings (7) from the buffer groove (6) through a communication hole (9) with the line diameter D1 of 2 mm. The electrode (8) is uniformly distributed with penetrating round holes (4) with the diameter D0 of 25mm and the distribution ring (7) which are arranged concentrically, and the distance between the centers of the penetrating round holes (4) is 50mm. The gas in the distribution ring (7) enters the penetrating round hole (4) through the air inlet hole (5) with the line diameter d1 of 2mm to participate in the discharging process. The included angle alpha between the direction of the air inlet hole (5) and the diameter direction is 20 degrees. When the electrode (8) works, the gas flow range is 400sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole (4). When the output voltage of the power supply (2) is 800V, the electrode (8) can continuously and stably discharge in the air pressure range of 8 kpa.
Example 5
According to the vapor deposition hollow cathode composite electrode vortex gas input device, through designing the structure of the gas input device, the uniformity of gas inlet is improved, a stable vortex gas flow field is generated, and uniform and efficient deposition of a large-area diamond heat dissipation plate is realized. The structure of the device is designed according to the following thought:
firstly, two sides of an electrode (8) are respectively connected with a power supply (2) and a fixed pipeline (3), wherein the electrode (8) is a tungsten metal plate with the thickness of 30mm, gas enters a buffer groove (6) with the width of 5mm and the thickness of 10mm in the electrode (8) from the fixed pipeline (3), distribution rings (7) with the diameter D1 of 40mm and the line diameter D1 of 2mm are uniformly distributed on two sides of the buffer groove (6), and the gas flows into the distribution rings (7) from the buffer groove (6) through a communication hole (9) with the line diameter D1 of 2 mm. The electrode (8) is uniformly distributed with penetrating round holes (4) with the diameter D0 of 30mm and the distribution ring (7) which are arranged concentrically, and the distance between the centers of the penetrating round holes (4) is 55mm. The gas in the distribution ring (7) enters the penetrating round hole (4) through the air inlet hole (5) with the line diameter d1 of 2mm to participate in the discharging process. The included angle alpha between the direction of the air inlet hole (5) and the diameter direction is 30 degrees. When the electrode (8) works, the gas flow range is 500sccm, and the introduced gas generates a vortex gas flow field in the penetrating round hole (4). When the output voltage of the power supply (2) is 1000V, the electrode (8) can continuously and stably discharge in the air pressure range of 10 kpa.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (6)
1. A vapor deposition hollow cathode composite electrode vortex gas input device, characterized in that the device comprises: the electrode is used for the vapor deposition process, two sides of the electrode are respectively connected with a power supply and a fixed pipeline, the surface of the electrode is uniformly provided with penetrating round holes, and buffer grooves, distribution rings, communication holes and air inlets are distributed in the electrode; the penetrating round holes are distributed on two sides of the buffer groove; the air inlets are uniformly distributed on the side wall of the through round hole and are connected with the distribution ring, the distribution ring is distributed on the periphery of the through round hole and is communicated with the buffer groove, and the positive electrode of the power supply is grounded; the gas enters the buffer tank from the fixed pipeline, then enters the distribution ring through the communication hole, finally uniformly flows to each air inlet hole through the distribution ring, and enters the through round hole to participate in the discharging process; through arranging the through round hole, the buffer tank, the distribution ring, the communication hole and the air inlet hole, each hollow cathode discharge unit can independently and multidirectional air supply, and a gas vortex flow field is generated by changing the air inlet direction, so that the uniformity of air inlet and the stability of the gas flow field are ensured, more stable and uniform hollow cathode discharge is generated, the uniformity of plasma and the gas ionization rate are improved, and the large-area diamond heat dissipation plate is uniformly and efficiently deposited.
2. The vapor deposition hollow cathode composite electrode vortex gas input device according to claim 1, wherein the electrode is a tungsten metal plate with the thickness of 10-30mm, through round holes with the diameter D0 of 10-30mm are uniformly distributed on the electrode, and the center-to-center distance of the round holes is 35-55mm.
3. The vapor deposition hollow cathode composite electrode vortex gas input device according to claim 1, wherein the diameter D1 of the distribution ring is 20-40mm, the line diameter D1 is 1-2mm, and the line diameter of the communication hole is 1-2mm, and the distribution ring is connected with the buffer tank.
4. The vapor deposition hollow cathode composite electrode vortex gas input device according to claim 1, wherein the diameter d0 of the gas inlet hole is 1-2mm, the gas inlet hole is horizontally connected with the through round hole and the distribution ring, and the included angle alpha between the direction of the gas inlet hole and the diameter direction is 0-30 degrees.
5. The vapor deposition hollow cathode composite electrode vortex gas input device according to claim 1, wherein the buffer groove is 4-5mm wide and 5-10mm thick and is equidistantly distributed with the distribution rings on both sides.
6. The vapor deposition hollow cathode composite electrode vortex gas input device according to claim 1, wherein the electrode is stably discharged in the gas pressure range of 0.5-10kpa, the gas flow rate range of the gas introduced into the buffer tank is 100-500sccm, and the power supply voltage is 200-1000V.
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