CN115015876A - Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method of torsion structure - Google Patents
Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method of torsion structure Download PDFInfo
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- CN115015876A CN115015876A CN202110248475.2A CN202110248475A CN115015876A CN 115015876 A CN115015876 A CN 115015876A CN 202110248475 A CN202110248475 A CN 202110248475A CN 115015876 A CN115015876 A CN 115015876A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
- G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
Abstract
A torsion structure of a scanning galvanometer, the scanning galvanometer and a manufacturing method of the scanning galvanometer are provided, wherein in the scanning galvanometer, a first separating piece, the torsion structure, the separating piece and a reflecting mirror are sequentially arranged on a substrate in a stacking mode and are fixed through welding treatment. The fixed laminated structure is realized through welding treatment, and the structure with complex and different level requirements can be realized in the out-of-plane direction, so that the processing capacity of the out-of-plane structure of the mirror surface of the large-size scanning galvanometer can be improved to meet the design requirement of the scanning galvanometer, the structure of the scanning galvanometer is more compact, the whole size is smaller, and the use of the MEMS process can be avoided, so that the process cost can be effectively controlled.
Description
Technical Field
The invention relates to the field of laser detection, in particular to a torsion structure of a scanning galvanometer, the scanning galvanometer and a manufacturing method of the scanning galvanometer.
Background
With the rise of unmanned vehicle technology, laser radar is increasingly gaining attention as an important detection component. As its name implies, lidar is a radar system that detects characteristic quantities such as a position and a velocity of a target by emitting a laser beam.
The working principle of the laser radar is to transmit a detection signal (laser beam) to a target, then compare the received signal (target echo) reflected from the target with the transmitted signal, and after appropriate processing, obtain the relevant characteristic quantities of the target, such as target distance, azimuth, height, speed, attitude, even shape and other parameters. The laser radar can detect, track and identify targets such as airplanes and missiles.
Lidar is classified into mechanical, hybrid solid state, and pure solid state lidar. In the solid-state laser radar, in order to reduce the cost, a mechanical rotating structure is not used, and one of the adopted methods is to integrate all mechanical parts into a single chip by using an MEMS galvanometer and produce the single chip by using a semiconductor process.
However, the conventional scanning galvanometer often has the problems of small mirror surface size or excessive processing difficulty.
Disclosure of Invention
The invention solves the problems that: on the premise of not increasing the process difficulty, how to form the scanning galvanometer with large mirror surface size.
In order to solve the above problems, the present invention provides a torsion structure of a scanning galvanometer, including: at least one torsion beam, the setting that the at least one torsion beam is range upon range of is on the separator.
Optionally, the at least one torsion beam and the spacer are fixed by welding.
Optionally, the torsion structure includes: the torsion bar comprises a first torsion beam and a second torsion beam, wherein the extension direction of the second torsion beam intersects with the extension direction of the first torsion beam.
Optionally, the first torsion beam and the second torsion beam are sequentially stacked, a stacking direction is perpendicular to an extending direction of the first torsion beam, and a stacking direction is perpendicular to an extending direction of the second torsion beam.
Correspondingly, the invention also provides a method for forming the torsion structure of the scanning galvanometer, which comprises the following steps: at least one torsion beam is arranged on the partition in a stacked mode; a welding process is performed to secure between the at least one torsion beam and the spacer.
Optionally, the step of providing the at least one torsion beam includes: and sequentially stacking a first torsion beam and a second torsion beam which are intersected in the extending direction on the partition, wherein the stacking direction is vertical to the extending direction of the first torsion beam, and the stacking direction is vertical to the extending direction of the second torsion beam.
The invention provides a scanning galvanometer, comprising: a substrate; the torsion structure is stacked on the substrate and is suitable for providing torsion moment; a first divider located between the base and the torsional structure; a mirror stacked on the torsion structure; a second divider between the mirror and the torsional structure.
Optionally, the base, the torsion structure, the reflector, the first spacer and the second spacer are fixed by welding.
Optionally, the method further includes: a solder between each of the substrate, the torsion structure, the reflector, the first divider, and the second divider.
Optionally, the reflector is made of a non-weldable material; the assembly surface of the reflector is provided with a connecting layer which is made of weldable materials.
Correspondingly, the invention also provides a manufacturing method of the scanning galvanometer, which comprises the following steps: providing a substrate; stacking a first separator on the substrate; arranging torsion structures on the first separator in a stacked manner; a second separator is arranged on the torsion structure in a stacking mode; a mirror is stacked on the second separator; performing a soldering process to secure the substrate, the first spacer, the torsion structure, the second spacer, and the mirror therebetween.
Optionally, between two steps of the step of providing the substrate, the step of providing the first spacer, the step of providing the torsion structure, the step of providing the second spacer, and the step of providing the mirror, the manufacturing method further includes: solder is provided.
Optionally, before the step of performing the welding process, the method further includes: securing a stack assembly including the base, the first spacer, the torsional structure, the second spacer, and the mirror with a clamp.
Optionally, after the first spacer, the torsion structure, the second spacer, and the mirror are sequentially disposed on the substrate, a welding process is performed.
Optionally, the reflector is made of a non-weldable material; before the step of arranging the reflecting mirror in a stacked manner, the method further includes: and forming a connecting layer on the assembling surface of the reflector, wherein the connecting layer is made of weldable materials.
Optionally, the reflector is made of a weldable material; before the step of arranging the reflecting mirror in a laminated manner, the method further includes: and polishing the assembling surface of the reflector.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the technical scheme, the first separating piece, the torsion structure, the separating piece and the reflector are sequentially stacked on the substrate and fixed through welding. The fixed laminated structure is realized through welding treatment, and the structure with complex and different level requirements can be realized in the out-of-plane direction, so that the processing capacity of the out-of-plane structure can be improved to meet the design requirement of the scanning galvanometer, the scanning galvanometer is more compact in structure and smaller in overall size, and the use of an MEMS process can be avoided, thereby effectively controlling the process cost.
In an alternative aspect of the present invention, solder is provided between the substrate, the torsion structure, the mirror, the first spacer, and the second spacer. Through the selection of the solder, the temperature of the welding process can be controlled, the process temperature can be controlled, the deformation of each part can be effectively reduced, and the accuracy of forming the scanning galvanometer is improved.
In an alternative of the present invention, before the welding process, a stack assembly may be fixed by a fixture, and the stack assembly may include the substrate, the first spacer, the torsion structure, the second spacer, and the reflector, that is, after all the structural components are stacked, the components are fixed by one-time welding, which not only simplifies the process and reduces the process steps, but also effectively improves the uniformity of the welding process among the components, balances the stress on the components, and reduces the possibility of deformation.
Drawings
FIGS. 1 to 6 are schematic structural diagrams corresponding to steps of a method for manufacturing a scanning galvanometer according to an embodiment of the invention;
FIG. 7 is a schematic structural diagram corresponding to another step of the method for manufacturing a scanning galvanometer of the present invention;
FIG. 8 is a schematic structural diagram of a scanning galvanometer manufacturing method according to yet another embodiment of the present invention.
Detailed Description
As known from the background art, the scanning galvanometer in the prior art has the problems of small mirror surface size and high processing difficulty.
From the optical perspective, the small and micro-size vibrating mirrors can cause insufficient light reflection capability, so that the detection effect of the laser radar is reduced, and therefore, the vibrating mirrors with large-size mirror surfaces are required on some laser radar products. However, the use of large-sized mirror surface vibrating mirrors makes the originally limited space in the laser radar more restrictive.
Moreover, the existing scanning galvanometer is generally formed by a MEMS process. However, when the size of the structural part is too large, the strength of the structural part under the MEMS technology cannot be guaranteed; moreover, the processing cost of the MEMS process is too high, which has a cost disadvantage.
In addition, although the existing scanning galvanometer based on the metal structure can realize a complex structure within one layer, the capability of realizing a multi-layer complex structure in the out-of-plane direction is insufficient. For example, although a mirror surface with a complex pattern can be processed, different members of the scanning galvanometer cannot be processed synchronously, so that the process procedure is easily increased, and time and labor are wasted.
In order to solve the technical problem, the invention provides a method for processing a scanning galvanometer, which comprises the following steps:
providing a substrate; stacking a first separator on the substrate; arranging torsion structures on the first separator in a stacked manner; stacking a second separator on the torsion structure; a mirror is stacked on the second separator; performing a soldering process to fix the substrate, the first spacer, the torsion structure, the second spacer, and the mirror therebetween.
In the technical scheme of the invention, the first separator, the torsion structure, the separator and the reflector are sequentially stacked on the substrate and fixed through welding treatment. The fixed laminated structure is realized through welding treatment, and the structure with complex and different level requirements can be realized in the out-of-plane direction, so that the processing capacity of the out-of-plane structure can be improved to meet the design requirement of the scanning galvanometer, the scanning galvanometer is more compact in structure and smaller in overall size, and the use of an MEMS process can be avoided, thereby effectively controlling the process cost.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 1 to fig. 6 are schematic structural diagrams corresponding to each step of an embodiment of a method for manufacturing a scanning galvanometer of the present invention.
Referring to fig. 1 and 2, wherein fig. 2 is a view of the structure in block 010 of fig. 1 along direction a, a substrate 110 is provided.
The substrate 110 is used as a base of the scanning galvanometer, and can provide a foundation for manufacturing and assembling the scanning galvanometer and provide mechanical support for other structural components of the scanning galvanometer.
In some embodiments of the present invention, in the step of providing the substrate 110, the substrate 110 is disposed on the processing fixture 100. As shown in fig. 1, a plurality of substrates 110 are disposed on the processing jig 100. Specifically, M × N substrates 110 are disposed on the processing fixture 100. And meanwhile, the scanning galvanometers are manufactured on the basis of the M × N substrates 110, and finally, finished products of the M × N scanning galvanometers can be obtained simultaneously. By the method, batch processing of the scanning galvanometers can be realized. In addition, in other embodiments of the present invention, a plurality of substrates may be sequentially disposed on a flow production line, so as to implement batch processing of the scanning galvanometer.
As shown in fig. 1, in the present embodiment, the substrate 110 is rectangular. In other embodiments of the present invention, the shape of the substrate may be a frame shape, a circle shape, or other shapes.
Thereafter, referring to fig. 3, a first separator 112 is stacked on the substrate 110; a torsion structure 120 is stacked on the first separator 112.
Fig. 3 to 5 are views corresponding to fig. 2.
The torsion structure 120 is used for supporting the reflector and providing torque for the reciprocating motion of the reflector; the first spacer 112 serves to support and fix the torsion structure 120 on the substrate 110, and occupies a space between the torsion structure 120 and the substrate 110 to form a gap, thereby providing an allowance space for the torsion structure 120 and the vibration of the mirror.
In some embodiments of the present invention, between two of the steps of providing the substrate 110, disposing the first spacer 112, and disposing the torsion structure 120, the method further comprises: solder is provided. Through the selection of the solder, the temperature of the subsequent welding process can be controlled, the process temperature can be controlled, the deformation of each part can be effectively reduced, and the precision of over-forming the scanning galvanometer is improved. The selection of the solder is based on the material of the bonding surface, and the feasibility, convenience and cost of the process operation are considered. For example, the bonding welding surface is copper, nickel and the like, the solder can be selected from soldering tin, on one hand, the soldering tin is low in price, the soldering tin can be used for firmly welding the copper and the nickel, on the other hand, the soldering tin does not need too high welding temperature, and the method is very friendly to precision parts such as a galvanometer.
It should be noted that the type of the solder and the thickness of the solder are related to process parameters such as process temperature and process time of the subsequent soldering process, so the thickness of the solder needs to be set based on the design requirement of the scanning galvanometer by comprehensively considering the process parameters of the soldering process. In general, the thickness of the solder is set so that the stacked components are kept parallel. Each stack assembly is obtained by linear cutting or etching, and the thickness of each stack assembly is difficult to be consistent, for example, as shown in fig. 6, in the present embodiment, the thicknesses of both ends of the substrate 110 and the first separating member 112 are not consistent, so that the distance between one end of the first separating member 112 and the surface of the substrate 110 is D, and the distance between the other end of the first separating member 112 and the surface of the substrate 110 is D, so that the thickness compensation can be realized by setting the solder thickness, i.e. the difference between the distance D and the distance D is compensated. Similarly, this may occur between other stacked components. The solder can play a role in thickness compensation, and all the stacked components are combined together to be parallel to each other, so that the quality of the finished product of the vibrating mirror is improved, and laser can be reflected more precisely in the laser radar.
Specifically, as shown in fig. 3, after the substrate 110 is disposed on the processing fixture 100 and fixed, a solder 111a is disposed above the substrate 110; disposing the first separator 112 above the solder 111 a; then, solder 111b is provided over the first separator 112; a torsion structure 120 is disposed over the solder 111 b.
In some embodiments of the invention, before the step of performing the welding process, the manufacturing method further comprises: the stack assembly, which includes at least the base 110 and the first spacer 112, is fixed by a jig.
Specifically, after the solder 111a, the first separator 112, the solder 111b, and the torsion structure 120 are disposed, the structural components may be fixed and aligned with each other by a jig or other auxiliary fixture.
The position where the solder 111a/111b is provided is determined based on the specific structure of the scanning galvanometer. The solder 111a is used for realizing the fixed connection between the first separator 112 and the substrate 110, and the solder 111b is used for realizing the fixed connection between the torsion structure 120 and the first separator 112; the solder 111a is disposed at a position corresponding to the position of the first separator 112 on the substrate 110, and the solder 112b is disposed at a position corresponding to the position where the torsion structure 120 and the first separator 112 are in contact.
In some embodiments of the present invention, the torsion structure 120 includes: at least one torsion beam, the at least one torsion beam is arranged on the separator in a stacked mode. As shown in fig. 3 and 4, in the present embodiment, the torsion structure 120 includes: a first torsion beam 121 and a second torsion beam 122 on the first divider 112, an extending direction of the second torsion beam 122 intersecting an extending direction of the first torsion beam 121. Specifically, the extending direction of the second torsion beam 122 is perpendicular to the extending direction of the first torsion beam 121. Wherein fig. 4 is a view of the torsional structure 120 of fig. 3 taken along direction B.
Referring to fig. 5, a second separator 123 is stacked on the torsion structure 120; a reflecting mirror 130 is stacked on the second separator 123.
The reflector 130 is used for reflecting light; the second spacer 123 serves to support and fix the mirror 130 on the torsion structure 120 and to occupy a space between the mirror 130 and the torsion structure 120 to form a gap, thereby providing a margin space for vibration of the mirror 130.
In some embodiments of the present invention, the reflector 130 includes a reflective surface 132 and a mounting surface 131 disposed opposite to each other, the reflective surface 132 facing away from the substrate 110 is suitable for reflecting light, and the mounting surface 131 facing the substrate 110 is suitable for solder mounting.
As shown in fig. 5, in the present embodiment, the material of the reflector 130 is a non-weldable material; before the step of disposing the reflecting mirror 130 in a stacked manner, the manufacturing method further includes: a connecting layer 133 is formed on the mounting surface 131 of the reflector 130, and the connecting layer 133 is a solderable material. The non-weldable material is a material that cannot be subjected to welding treatment, such as glass, quartz, sapphire, or silicon carbide, or a non-weldable iron-based metal such as stainless steel or cast iron, or a non-weldable metal such as aluminum. The solderable material is a material that can be subjected to a soldering process, and is, for example, a solderable metal such as copper, gold, or silver.
It should be further noted that the step of forming the connection layer 133 includes: the connection layer 133 is formed by electroplating or melt coating, that is, the connection layer 133 is a plating layer or a coating layer. In this embodiment, the connection layer 113 is formed by a standard plating process, such as evaporation plating or sputtering. Specifically, in this embodiment, the connection layer 113 is formed by using an evaporation plating standard process, that is, after steps of preparation before plating, vacuum pumping, ion bombardment, baking, pre-melting, evaporation, workpiece taking, film layer surface treatment, and the like are performed in sequence, the connection layer 113 is formed. In other embodiments of the present invention, the connecting layer is formed by a standard sputtering process, wherein the sputtering process includes at least one of ion sputtering and cathode sputtering.
In some embodiments of the present invention, between two steps of the step of providing the torsion structure 120, the step of providing the second separator 123, and the step of providing the reflector 130, the manufacturing method further includes: solder is provided.
Specifically, as shown in fig. 5, after the torsion structure 120 is disposed, a solder 124a is disposed above the torsion structure 120; disposing the second spacer 123 over the solder 124 a; then, solder 124b is provided over the second spacer 123; the mirror 130 is disposed over the solder 124 b.
In addition, in some embodiments, before the step of performing the welding process, the manufacturing method further includes: the stack assembly, which may further include the torsion structure 120, the second spacer 123, and the mirror 130, is fixed by a jig.
Specifically, after the solder 124a, the second spacer 123, the solder 124b, and the reflector 130 are disposed, all the structural components may be fixed and aligned with each other by a jig or other auxiliary fixture.
In this embodiment, after each component (for example, the first separator 112, the torsion structure 120, the second separator 123, the reflector 130, or the solder 111a/111b/124a/124b) is disposed, the components are fixed and aligned by a jig or other auxiliary fixture. In other embodiments of the present invention, after the reflector is disposed, a stack assembly including the substrate, the first separator, the torsion structure, the second separator, and the reflector may be fixed by a jig or other auxiliary fixture, that is, after the structural components are stacked, the stacked stack assembly may be uniformly fixed by the jig or other auxiliary fixture, and the structural components may be aligned with each other.
It should be noted that the position where the solder 124a/124b is disposed depends on the specific structure of the scanning galvanometer. The solder 124a is used for realizing the fixed connection between the second separating member 123 and the torsion structure 120, and the solder 124b is used for realizing the fixed connection between the second separating member 123 and the reflector 130; the position where the solder 124a is disposed corresponds to the position of the second spacer 123 on the torsion structure 120, and the position where the solder 124b is disposed corresponds to the position where the second spacer 123 and the mirror 130 are in contact.
Referring to fig. 5 in combination, a welding process 140 is performed to fix the substrate 110, the first spacer 112, the torsion structure 120, the second spacer 123, and the reflector 130.
In some embodiments of the present invention, after the first separator 112, the torsion structure 120, the second separator 123 and the reflector 130 are sequentially disposed on the substrate 110, the welding process 140 is performed, that is, after all the structural components are stacked, the components are fixed by one-time welding, which not only simplifies the process and reduces the process steps, but also effectively improves the uniformity of the welding process among the components, balances the stress on the components, and reduces the possibility of deformation.
Specifically, the welding process 140 may be performed in a welding furnace or a welding machine to complete the fixation of the various structural components of the scanning galvanometer.
It should be noted that, in some embodiments of the present invention, after the welding process to fix the respective structural components, the manufacturing method further includes: and (5) post-welding treatment. Specifically, the post-welding treatment includes: and removing the fixed clamp and the jig, trimming burr and leftover materials and the like to obtain a finished scanning galvanometer product.
Fig. 7 is a schematic structural diagram corresponding to steps of another embodiment of the scanning galvanometer manufacturing method of the present invention.
The present embodiment is the same as the previous embodiments, and the description of the present invention is omitted. The present embodiment is different from the previous embodiments in that, in the present embodiment, the material of the reflector 230 is a weldable material; therefore, before the mirror 230 is stacked, the manufacturing method further includes: the fitting surface 231 of the reflecting mirror 230 is polished. The polishing process can improve the assembling flatness of the assembling face 231, which is advantageous for improving the assembling quality.
In addition, in other embodiments of the present invention, the scanning galvanometer may include other structural components (as shown in fig. 8) such as a mirror surface mounting frame 331, an anchor area (not shown), and the like, besides the substrate 310, the first torsion beam 321, the second torsion beam 322, and the fingerprint of the reflector 330, which is not described herein again.
Accordingly, the present invention provides a scanning galvanometer, and with particular reference to FIG. 5, a side view of one embodiment of the scanning galvanometer of the present invention is shown.
The scanning galvanometer includes: a substrate 110; a torsion structure 120, wherein the torsion structure 120 is stacked on the substrate 110 and adapted to provide a torsion moment; a first spacer 112, the first spacer 112 being located between the base 110 and the torsion structure 120; a mirror 130, wherein the mirror 130 is stacked on the torsion structure 120; a second divider 123, the second divider 123 located between the mirror 130 and the torsional structure 120; the substrate 110, the torsion structure 120, the reflector 130, the first spacer 112 and the second spacer 123 are fixed by welding.
The substrate 110 serves as a base of the scanning galvanometer, and can provide a foundation for manufacturing and assembling the scanning galvanometer and provide mechanical support for other structural components of the scanning galvanometer.
As shown in fig. 5, in the present embodiment, the substrate 110 is rectangular. In other embodiments of the present invention, the shape of the substrate may be a frame shape, a circle shape, or other shapes.
The torsion structure 120 is used for supporting the reflector and providing torque for the reciprocating motion of the reflector; the first spacer 112 serves to support and fix the torsion structure 120 on the substrate 110, and occupies a space between the torsion structure 120 and the substrate 110 to form a gap, thereby providing an allowance space for the torsion structure 120 and the vibration of the mirror.
In some embodiments of the present invention, the torsion structure 120 comprises: at least one torsion beam stacked on the spacer. As shown in fig. 5, in the present embodiment, the torsion structure 120 includes: a first torsion beam 121 and a second torsion beam 122 above the first spacer 112, an extending direction of the second torsion beam 122 intersecting an extending direction of the first torsion beam 121. Specifically, the extending direction of the second torsion beam 122 is perpendicular to the extending direction of the first torsion beam 121. Wherein fig. 4 is a view of the torsional structure 120 of fig. 3 along direction B.
The reflector 130 is used for reflecting light; the second spacer 123 serves to support and fix the mirror 130 on the torsion structure 120 and occupies a space between the mirror 130 and the torsion structure 120 to form a gap, thereby providing a margin space for vibration of the mirror 130.
In some embodiments of the present invention, the reflector 130 includes a reflective surface 132 and a mounting surface 131 disposed opposite to each other, the reflective surface 132 facing away from the substrate 110 is suitable for reflecting light, and the mounting surface 131 facing the substrate 110 is suitable for solder mounting.
As shown in fig. 5, in the present embodiment, the material of the reflector 130 is a non-weldable material; the mounting surface 131 of the reflector 130 has a connecting layer 133 thereon, and the connecting layer 133 is a solderable material. The weldable material is a material that cannot be subjected to welding treatment, such as glass, quartz, sapphire, or silicon carbide, or a non-weldable iron-based metal, such as stainless steel or cast iron, or a non-weldable metal, such as aluminum. (ii) a The solderable material is a material that can be subjected to a soldering process, and is, for example, a solderable metal such as copper, gold, or silver. The connection layer 133 is a plating layer or a coating layer.
It should be noted that, in some embodiments of the present invention, the scanning galvanometer further includes: a solder between each of the substrate, the torsion structure, the reflector, the first divider, and the second divider. The type of the solder and the thickness of the solder are related to process parameters such as process temperature and process time of the soldering process, so that the thickness of the solder needs to be set by comprehensively considering the process parameters of the soldering process based on the design requirements of the scanning galvanometer.
Specifically, as shown in fig. 5, the solder 111a is located above the substrate 110; the first separator 112 is located above the solder 111 a; the solder 111b is located on the first separator 112; the torsion structure 120 is located on the solder 111 b; the torsion structure 120 is located on the solder 111 b; the solder 124a is located above the torsion structure 120; the second spacer 123 is located above the solder 124 a; the solder 124b is located above the second spacer 123; the mirror 130 is located over the solder 124 b.
In addition, before the scanning galvanometer is manufactured by adopting the technical scheme of the invention, all structural parts of the scanning galvanometer need to be prepared. Therefore, the invention also provides a method for forming the torsion structure of the scanning galvanometer, which specifically comprises the following steps: at least one torsion beam is arranged on the partition in a stacked mode; a welding process is performed to secure between the at least one torsion beam and the spacer.
Specifically, referring to fig. 7, a side view of an embodiment of a method for forming a torsion structure of a scanning galvanometer provided by the present invention is shown.
First, at least one torsion beam is stacked on the spacer. In this embodiment, the separator is a first separator 212 stacked on the substrate 210.
As shown in fig. 7, in some embodiments of the present invention, the step of providing the torsion beam includes: a first torsion beam 221 and a second torsion beam 222, which intersect in the extending direction, are sequentially stacked on the partition 212, the stacking direction z is perpendicular to the extending direction x of the first torsion beam 221, and the stacking direction z is perpendicular to the extending direction y of the second torsion beam 222.
In this embodiment, the substrate 210 is disposed on the surface of the fixture 200, the first torsion beam 221 extends along the x direction parallel to the surface of the substrate 210, the second torsion beam 222 extends along the y direction parallel to the surface of the substrate 210, so that the second torsion beam 222 and the first torsion beam 221 are stacked along the z direction away from the substrate 210, that is, the stacking direction z is perpendicular to the surface of the substrate 210, and the first torsion beam 221 is stacked above the second torsion beam 222.
After the at least one torsion beam is disposed, a welding process 240 is performed to secure the at least one torsion beam and the spacer therebetween.
In this embodiment, the welding process 240 is performed after the mirror 230 is set. In other embodiments of the present invention, the welding process 240 may be performed after the second torsion beam 222 is disposed.
In some embodiments of the present invention, between the steps of performing the welding process 240, the forming method further comprises: solder is provided. Further, in the present embodiment, the step of providing the torsion beam includes: the first torsion beam 221 and the second torsion beam 222 are sequentially stacked; thus, between the step of providing the first torsion beam 221 and the step of providing the second torsion beam 222, the forming method further includes: solder is provided.
Specifically, as shown in fig. 7, before the first torsion beam 221 is provided, a solder 223a is provided above the first separator 212; disposing the first torsion beam 221 above the solder 223 a; providing a solder 223b on the first torsion beam 221; the second torsion beam 222 is provided on the solder 223 b.
Correspondingly, the invention also provides a torsion structure of the scanning galvanometer. Specifically, referring to FIG. 7, a side view of an embodiment of the torsional configuration of the scanning galvanometer of the present invention is shown.
The torsion structure includes: at least one torsion beam, which is stacked on the separator; the at least one torsion beam and the separator are fixed by welding.
As shown in fig. 7, in the present embodiment, the spacer is a first spacer 212 stacked on a substrate 210.
Furthermore, in some embodiments of the present invention, the torsion structure comprises: a first torsion beam 221 and a second torsion beam 222, an extending direction of the second torsion beam 222 intersecting an extending direction of the first torsion beam 221.
In this embodiment, the first torsion beam 221 and the second torsion beam 222 are sequentially stacked, and the stacking direction is perpendicular to the extending direction of the first torsion beam 221, and the stacking direction is perpendicular to the extending direction of the second torsion beam 222.
Specifically, the substrate 210 is located on the surface of the fixture 200; the first torsion beam 221 above the first spacer 221 extends in an x-direction parallel to the surface of the substrate 210; the second torsion beam 222 extends in a y direction parallel to the surface of the substrate 210, so that the second torsion beam 222 and the first torsion beam 221 are stacked in a z direction away from the substrate 210, i.e. the stacking direction z is perpendicular to the surface of the substrate 210, and the first torsion beam 221 is stacked above the second torsion beam 222.
In summary, in the technical solution of the present invention, the first separator, the torsion structure, the separator, and the reflector are sequentially stacked on the substrate and fixed by a welding process. The fixed laminated structure is realized through welding treatment, and the structure with complex and different level requirements can be realized in the out-of-plane direction, so that the processing capacity of the out-of-plane structure can be improved to meet the design requirement of the scanning galvanometer, the scanning galvanometer is more compact in structure and smaller in overall size, and the use of an MEMS (micro-electromechanical system) process can be avoided so as to effectively control the process cost.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (16)
1. A torsion structure of a scanning galvanometer is characterized by comprising:
a separator;
at least one torsion beam is arranged on the separator in a stacked mode.
2. The torsional structure of the scanning galvanometer of claim 1, wherein the at least one torsion beam and the spacer are secured by welding.
3. The torsional structure of a scanning galvanometer of claim 1, wherein the torsional structure comprises: the torsion bar comprises a first torsion beam and a second torsion beam, wherein the extension direction of the second torsion beam intersects with the extension direction of the first torsion beam.
4. The torsional structure of claim 3, wherein the first torsion beam and the second torsion beam are sequentially stacked, wherein the stacking direction is perpendicular to the extending direction of the first torsion beam, and the stacking direction is perpendicular to the extending direction of the second torsion beam.
5. A method for forming a torsion structure of a scanning galvanometer is characterized by comprising the following steps:
at least one torsion beam is arranged on the partition in a stacked mode;
a welding process is performed to secure between the at least one torsion beam and the spacer.
6. The method of claim 5, wherein the step of providing the at least one torsion beam comprises: and sequentially stacking a first torsion beam and a second torsion beam which are intersected in the extending direction on the partition, wherein the stacking direction is vertical to the extending direction of the first torsion beam, and the stacking direction is vertical to the extending direction of the second torsion beam.
7. A scanning galvanometer, comprising:
a substrate;
the torsion structure is stacked on the substrate and is suitable for providing torsion moment;
a first divider located between the base and the torsional structure;
a mirror stacked on the torsion structure;
a second spacer located between the mirror and the torsional structure.
8. The scanning galvanometer of claim 7, wherein said base, said torsional structure, said mirror, said first spacer and said second spacer are secured by welding.
9. The scanning galvanometer of claim 8, further comprising: a solder between each of the substrate, the torsion structure, the reflector, the first divider, and the second divider.
10. The scanning galvanometer of claim 7, wherein the material of the mirror is a non-weldable material; the assembly surface of the reflector is provided with a connecting layer which is made of weldable materials.
11. A method for manufacturing a scanning galvanometer is characterized by comprising the following steps:
providing a substrate;
stacking a first separator on the substrate;
arranging torsion structures on the first separator in a stacked manner;
a second separator is arranged on the torsion structure in a stacking mode;
a mirror is stacked on the second separator;
performing a soldering process to secure the substrate, the first spacer, the torsion structure, the second spacer, and the mirror therebetween.
12. The method of claim 11, wherein the steps of providing a substrate, providing a first spacer, providing a torsion structure, providing a second spacer, and providing a mirror are repeated between the steps of: solder is provided.
13. The method of claim 11, further comprising, prior to the step of performing a welding process: securing a stack assembly including the base, the first spacer, the torsional structure, the second spacer, and the mirror with a clamp.
14. The method of claim 11, wherein a soldering process is performed after the first spacer, the torsion structure, the second spacer, and the mirror are sequentially disposed on the substrate.
15. The method for manufacturing a scanning galvanometer of claim 11, wherein the material of the reflecting mirror is a non-weldable material; before the step of arranging the reflecting mirror in a laminated manner, the method further includes: and forming a connecting layer on the assembling surface of the reflector, wherein the connecting layer is made of weldable materials.
16. The method of claim 11, wherein the reflector is made of a weldable material; before the step of arranging the reflecting mirror in a stacked manner, the method further includes: and polishing the assembling surface of the reflector.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248475.2A CN115015876A (en) | 2021-03-05 | 2021-03-05 | Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method of torsion structure |
| PCT/CN2021/140840 WO2022183816A1 (en) | 2021-03-05 | 2021-12-23 | Torsion structure of scanning galvanometer, and scanning galvanometer and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248475.2A CN115015876A (en) | 2021-03-05 | 2021-03-05 | Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method of torsion structure |
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| Publication Number | Publication Date |
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| CN115015876A true CN115015876A (en) | 2022-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110248475.2A Pending CN115015876A (en) | 2021-03-05 | 2021-03-05 | Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method of torsion structure |
Country Status (2)
| Country | Link |
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| CN (1) | CN115015876A (en) |
| WO (1) | WO2022183816A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7317255B2 (en) * | 2004-09-30 | 2008-01-08 | Kyocera Wireless Corp. | Reliable printed wiring board assembly employing packages with solder joints |
| US7139113B1 (en) * | 2005-07-29 | 2006-11-21 | Texas Instruments Incorporated | Digital micro-mirror device with free standing spring tips and distributed address electrodes |
| JP4665959B2 (en) * | 2007-11-30 | 2011-04-06 | 日本電気株式会社 | Vacuum package |
| CN101562947B (en) * | 2008-04-18 | 2011-04-20 | 群康科技(深圳)有限公司 | Welding structure and welding method |
| CN101530655B (en) * | 2009-04-28 | 2010-09-15 | 北京金海创科技发展有限公司 | Three-lens vertical light-incident medical and beautifying scanning vibrating mirror assembly |
| CN108089174B (en) * | 2017-11-10 | 2021-12-03 | 无锡英菲感知技术有限公司 | Double-scanning view field sharing window laser radar system based on micro-mirror |
| CN215340301U (en) * | 2021-03-05 | 2021-12-28 | 上海禾赛科技股份有限公司 | Scanning galvanometer and torsion structure thereof |
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- 2021-03-05 CN CN202110248475.2A patent/CN115015876A/en active Pending
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| WO2022183816A1 (en) | 2022-09-09 |
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