CN115008678A - Manufacturing method of packaging tube shell for patch type sensor - Google Patents
Manufacturing method of packaging tube shell for patch type sensor Download PDFInfo
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- CN115008678A CN115008678A CN202210688006.7A CN202210688006A CN115008678A CN 115008678 A CN115008678 A CN 115008678A CN 202210688006 A CN202210688006 A CN 202210688006A CN 115008678 A CN115008678 A CN 115008678A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a manufacturing method of a packaging tube shell for a patch type sensor, belonging to the technical field of patch type sensors. The manufacturing method comprises the following steps: when the packaging tube shell is subjected to injection molding, the male die of the die presses the exposed front faces, exposed in the containing chamber, of the first conductive lead and the second conductive lead, meanwhile, the back faces of the first conductive lead and the second conductive lead are pressed through the supporting structure on the die, the leads are enabled to keep the design form and the design position, then the plastic main body is formed through injection molding, a groove is formed in the position, corresponding to the supporting structure, on the back face of the plastic main body after the die is opened, sealant is filled in the groove, and therefore the back faces of the first conductive lead and the second conductive lead are prevented from being exposed in the air. According to the invention, the back surfaces of the first conductive lead and the second conductive lead are pressed by the supporting structure, so that the leads are firmly fixed by the die, the leads are prevented from deforming and moving under the high-strength pressure impact of plastics, the leads are kept in the designed shape and the designed position, and the product percent of pass can be further ensured.
Description
Technical Field
The invention relates to a manufacturing method of a packaging tube shell for a patch type sensor, belonging to the technical field of patch type sensors.
Background
In recent years, with the development of artificial intelligence and the development of the internet of things, the patch type sensor is more convenient to produce and process and is suitable for an automatic production process due to small volume, so that the patch type sensor is widely applied to the sensor industry.
For example, the package case for a chip sensor disclosed in chinese patent application publication No. CN113091921A includes a plastic body, a metal shield, a first conductive lead, and a second conductive lead. The plastic main body forms an accommodating chamber, a supporting body is integrally formed on the plastic main body in an injection molding mode, and the metal shielding cover, the first conductive lead and the second conductive lead are fixed on the plastic main body in an injection molding mode. The first electrically conductive lead has six, and wherein four are arranged in a row in plastic main part one side, and each first electrically conductive lead all includes horizontal segment and extraction section, and extraction section is including the lead wire soldering tin foot that exposes plastic main part lateral wall, and lead wire soldering tin foot constitutes the first end of first electrically conductive lead. The partial top surface of the horizontal section is exposed out of the bottom surface of the accommodating chamber, is used for connecting a signal processing circuit and forms a second end of the first conductive lead.
The second conductive leads are arranged on the other side of the plastic main body in a row, the two second conductive leads and the remaining two first conductive leads comprise a middle section, a first connecting section and a second connecting section, the first connecting section and the second connecting section are higher than the middle section, and partial top surface of the first connecting section is exposed out of the bottom surface of the accommodating chamber to form a first exposed part used for connecting the signal processing circuit. The top surface and the side surface of the second connecting section are respectively flush with the top surface and the side surface of the supporting body to form a second exposed part for connecting the sensitive element, and two ends of the second conductive lead are positioned in the plastic main body.
The shield cover is enclosed by the shielding piece of two L shapes jointly for play the shielding effect to inside components and parts, avoid receiving external disturbance. Two shielding pieces are respectively fixed in four side walls of the plastic main body in an injection molding mode, two shielding cover soldering tin feet are arranged at the bottom of one side edge of each shielding piece, the shielding cover soldering tin feet are exposed out of the outer side wall of the plastic main body, and the plastic main body is conveniently connected with other parts.
The step of independently installing the supporting body, the shielding cover and the second conductive lead is omitted in the production and assembly process of the packaging tube shell, and the production and assembly process is simplified. However, in actual production, because the volume of the patch sensor is small, and the first conductive lead and the second conductive lead are both made of metal conductive plates with thin wall thicknesses, deformation and play are easily generated under the high-strength pressure impact of plastics during injection molding, the designed shape and position cannot be maintained, the exposed part is not exposed after curing molding, even the conductive leads are dislocated, and thus, the produced packaging tube shell is unqualified, and the defective rate is high.
Disclosure of Invention
The invention aims to provide a manufacturing method of a packaging tube shell for a patch type sensor, which aims to solve the problem that a first conductive lead and a second conductive lead are easy to deform and move under the high-strength pressure impact of plastic to cause product disqualification when the existing packaging tube shell is subjected to injection molding.
In order to achieve the purpose, the manufacturing method of the packaging tube shell for the patch type sensor adopts the following technical scheme:
a manufacturing method of a packaging tube shell for a patch type sensor comprises the following steps: when the packaging tube shell is subjected to injection molding, the male die of the mold presses the exposed front faces, used for being exposed in the containing chamber, of the first conductive lead and the second conductive lead, the back faces, back to back, of the exposed front faces of the first conductive lead and the second conductive lead are pressed through the supporting structure on the mold, the first conductive lead and the second conductive lead are enabled to keep the design shapes and the design positions, then a plastic main body is formed through injection molding, a groove is formed in the position, corresponding to the supporting structure, on the back face of the plastic main body after the mold is opened, finally sealant is filled in the groove, and a sealing structure is formed after the sealant is cured, so that the back faces of the first conductive lead and the second conductive lead are prevented from being exposed in the air.
The beneficial effects of the above technical scheme are that: the male die of the die presses the exposed front faces of the first conductive lead and the second conductive lead, which are exposed in the accommodating chamber, the supporting structure on the die presses the back faces of the first conductive lead and the second conductive lead, which are opposite to the back faces of the exposed front faces, so that the first conductive lead and the second conductive lead are firmly fixed by the die, the leads are prevented from deforming and moving under the high-strength pressure impact of plastics, the first conductive lead and the second conductive lead are enabled to keep the design form and the design position, and the product percent of pass can be further ensured. Meanwhile, due to the jacking of the supporting structure, a groove is formed in the position, corresponding to the supporting structure, on the back face of the plastic main body after the mold is opened, the sealing glue is filled in the groove, a sealing structure is formed after the sealing glue is solidified, the air tightness of the product is guaranteed, the back faces of the first conductive lead and the second conductive lead are prevented from being exposed in the air, and the product performance is prevented from being influenced.
Furthermore, the number of the first conductive leads is six, the back surfaces of the horizontal sections of the first conductive leads are flush, the number of the second conductive leads is two, the back surfaces of the first connecting sections of the two second conductive leads are flush and form a low back surface, the back surfaces of the second connecting sections of the two second conductive leads are flush and form a high back surface, and the low back surfaces of the two second conductive leads are flush with the back surfaces of the horizontal sections of the first conductive leads; the supporting structure comprises a first supporting structure used for simultaneously pressing the back surfaces of the horizontal sections of the four first conductive leads arranged in a row, and the supporting structure also comprises a second supporting structure used for simultaneously pressing the back surfaces of the horizontal sections of the two first conductive leads arranged in a row and the low back surfaces of the two second conductive leads; the groove comprises a first groove formed by corresponding to the first supporting structure and a second groove formed by corresponding to the second supporting structure, and the first groove and the second groove are both in a long strip shape.
The beneficial effects of the above technical scheme are that: the first supporting structure simultaneously presses the back surfaces of the horizontal sections of the four first conductive leads arranged in a row, and the second supporting structure simultaneously presses the back surfaces of the horizontal sections of the two first conductive leads arranged in a row and the low back surfaces of the two second conductive leads, so that the number of the supporting structures can be saved, and the structure of the die is simplified; and the first groove formed by the first supporting structure correspondingly and the second groove formed by the second supporting structure correspondingly are both in a strip shape, so that the sealant can be conveniently and uniformly filled, and the manufacturing efficiency is improved.
Further, the supporting structure further comprises a third supporting structure and a fourth supporting structure which are used for respectively pressing the high back surfaces of the two second conductive leads, and the grooves further comprise a third groove correspondingly formed by the third supporting structure and a fourth groove correspondingly formed by the fourth supporting structure.
The beneficial effects of the above technical scheme are that: the third supporting structure and the fourth supporting structure respectively press the high back surfaces of the two second conductive leads, so that the high back surfaces and the low back surfaces of the second conductive leads are both pressed, the stability and firmness of the second conductive leads are further ensured, the second conductive leads are prevented from being deformed and moved, and the product quality is ensured.
Further, the third groove and the fourth groove are both cylindrical.
The beneficial effects of the above technical scheme are that: that is, the third supporting structure and the fourth supporting structure are both cylindrical, and the processing and the manufacturing are convenient.
Furthermore, the support structure further comprises a fifth support structure for simultaneously pressing the low back surfaces of the two second conductive leads, the fifth support structure is positioned on the outer side of the second support structure, and the groove further comprises a fifth groove correspondingly formed by the fifth support structure; each first electrically conductive lead wire and each electrically conductive lead wire body coupling of second are on same metal current conducting plate during injection moulding, push down the part that exposes the plastics main part back of each first electrically conductive lead wire after accomplishing to mould plastics, decide the connection position of each first electrically conductive lead wire and metal current conducting plate and form lead wire soldering tin foot, push down the low back of the electrically conductive lead wire of second that exposes in the fifth recess simultaneously, decide the connection position of electrically conductive lead wire of second and metal current conducting plate in the fifth recess, seal inside the plastics main part completely through the sealed glue of filling in the fifth recess messenger electrically conductive lead wire's tip.
The beneficial effects of the above technical scheme are that: the first conductive leads and the second conductive leads are integrally connected to the same metal conductive plate during injection molding, so that the first conductive leads and the second conductive leads can be kept in designed shapes and positions, the parts of the first conductive leads, which are exposed out of the back surface of the plastic main body, are pressed after injection molding is finished, and the connecting parts of the first conductive leads and the metal conductive plate are cut to form lead soldering tin feet, so that the operation is simple, the manufacture is convenient, and the manufacturing efficiency can be improved; meanwhile, the fifth supporting structure is the same as the second supporting structure and is used for pressing the low back faces of the two second conductive leads, so that the stability and firmness of the second conductive leads are further ensured, the fifth supporting structure is positioned on the outer side of the second supporting structure to form a fifth groove, the low back face of the second conductive lead exposed in the fifth groove is pressed, the connecting part of the second conductive lead and the metal conductive plate is cut in the fifth groove, and then the end part of the second conductive lead is completely sealed in the plastic main body through the sealant filled in the fifth groove, so that the purpose that the end part of the second conductive lead is not exposed is realized.
Furthermore, each first conductive lead is connected with the metal conductive plate through a first transition section respectively, and the cross section size of the first transition section is the same as the end face size of the lead soldering tin foot.
The beneficial effects of the above technical scheme are that: the convenient metal current conducting plate that links to each other, and conveniently decide.
Further, two second conductive leads are connected to the metal conductive plate through a second transition section.
The beneficial effects of the above technical scheme are that: the convenient metal current conducting plate that links to each other, and conveniently decide.
Furthermore, each first conductive lead and each second conductive lead are integrally connected to the same metal conductive plate during injection molding, and the connecting parts of each first conductive lead and each second conductive lead and the metal conductive plate are cut after injection molding.
The beneficial effects of the above technical scheme are that: the first conductive lead and the second conductive lead are connected to the same metal conductive plate, so that the designed form and position of the first conductive lead and the second conductive lead are kept, and the product quality is ensured.
Furthermore, the shielding case of the packaging tube shell is formed by enclosing two L-shaped shielding sheets together, the two L-shaped shielding sheets are integrally connected onto the same metal shielding plate during injection molding, and the connecting parts of the two L-shaped shielding sheets and the metal shielding plate are cut to form the shielding case soldering tin feet after injection molding.
The beneficial effects of the above technical scheme are that: the two L-shaped shielding sheets are connected to the same metal shielding plate, so that the two L-shaped shielding sheets can keep the designed shapes and positions, and the product quality is ensured.
Furthermore, the first conductive leads and the second conductive leads are integrally connected to the same metal conductive plate during injection molding, and the connecting parts of the first conductive leads and the second conductive leads and the metal conductive plate are cut off after injection molding; the metal shielding plate and the metal conducting plate are arranged in a stacked mode, a first exposure structure used for exposing the connecting parts of the two L-shaped shielding sheets and the metal shielding plate is arranged on the metal conducting plate, and a second exposure structure used for exposing the connecting parts of the first conducting leads and the second conducting leads and the metal conducting plate is arranged on the metal shielding plate.
The beneficial effects of the above technical scheme are that: metal shield plate and the range upon range of setting of metal current conducting plate to all being equipped with separately and exposing the structure, conveniently deciding each first electrically conductive lead wire and each second electrically conductive lead wire and metal current conducting plate's connection site, conveniently deciding the connection site of shielding piece and metal shield plate simultaneously, and then conveniently making.
Drawings
Fig. 1 is a perspective view of the front view of the package tube after injection molding in the manufacturing method of the present invention (the metal shielding plate and the metal conductive plate are not cut);
fig. 2 is a top view of the package in the manufacturing method of the present invention after injection molding (the metal shielding plate and the metal conductive plate are not cut);
FIG. 3 is a perspective view of FIG. 1 with the plastic body removed;
FIG. 4 is a perspective view of the plastic body, the first conductive lead, the second conductive lead, and the metal conductive plate of FIG. 1 removed;
FIG. 5 is a perspective view of FIG. 1 with the plastic body, shield and metallic shield removed;
fig. 6 is a perspective view of the back surface of the package in the injection molding process of the present invention (the metal shielding plate and the metal conductive plate are not cut);
fig. 7 is a perspective view of the back side of the package in the injection molding process of the present invention (the metal shield plate and the metal conductive plate are cut).
In the figure: 1. a first conductive lead; 11. a horizontal segment; 12. a lead-out section; 2. a second conductive lead; 21. a first connecting section; 22. a second connecting section; 23. a middle section; 3. a shielding sheet; 31. soldering tin pins on the shielding cover; 4. a plastic body; 41. a first groove; 42. a second groove; 43. a third groove; 44. a fourth groove; 45. a fifth groove; 46. a support body; 5. a metal conductive plate; 51. a first transition section; 52. a second transition section; 53. a first exposed structure; 54. a first cutting part; 55. a second cutting part; 6. a metal shielding plate; 61. a third transition section; 62. a second exposed structure; 63. and thirdly, cutting the part.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that relational terms such as "first" and "second," and the like, which may be present, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …," or the like, does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The features and properties of the present invention are described in further detail below with reference to examples.
The invention discloses an embodiment of a manufacturing method (hereinafter referred to as a manufacturing method) of a packaging tube shell for a patch sensor, which comprises the following steps:
the structure of the package tube shell for the chip sensor (hereinafter referred to as package tube shell) aimed at by the manufacturing method of the invention is basically the same as that of the package tube shell for the chip sensor disclosed in the chinese invention patent application with application publication number CN113091921A, as shown in fig. 1 and 2, that is, the package tube shell also comprises a plastic main body 4, a metal shielding cover, a first conductive lead 1 and a second conductive lead 2. Wherein, the plastic main body 4 forms a containing chamber with an upward opening, a supporting body 46 is integrally formed in the containing chamber by injection molding, and the metal shielding cover, the first conductive lead 1 and the second conductive lead 2 are fixed on the plastic main body 4 by injection molding.
As shown in fig. 3 and 4, the metal shielding case is enclosed by two L-shaped shielding sheets 3, and is used for shielding internal components and avoiding external interference. Two shielding piece 3 are moulded plastics respectively and are fixed in four lateral walls of plastic body 4, and the bottom of one of them side of each shielding piece 3 all is provided with two shielding cover soldering tin feet 31, and shielding cover soldering tin foot 31 exposes the lateral wall of plastic body 4, conveniently is connected with other parts.
As shown in fig. 3 and 5, the number of the first conductive leads 1 is six, four of the first conductive leads 1 are arranged on one side of the plastic body 4 in a row, each first conductive lead 1 includes a horizontal section 11 and a lead-out section 12 lower than the horizontal section 11, the back surface of the lead-out section 12 is flush with the back surface of the plastic body 4, the lead-out section 12 includes a lead soldering foot exposed out of the outer side wall of the plastic body 4, and the lead soldering foot constitutes a first end of the first conductive lead 1. A partial top surface of the horizontal section 11 is exposed from the bottom surface of the receiving chamber, called the exposed front surface, for connection to a signal processing circuit, constituting a second end of the first conductive lead 1.
The two second conductive leads 2 are arranged on the other side of the plastic body 4 in a row, the two second conductive leads 2 and the remaining two first conductive leads 1 are arranged on the other side of the plastic body 4 in a row, the second conductive leads 2 comprise a middle section 23, a first connecting section 21 and a second connecting section 22, the first connecting section 23 is higher than the middle section 23, and partial top surface of the first connecting section 21 is exposed out of the bottom surface of the accommodating chamber to form a first exposed part for connecting with a signal processing circuit. The top and side surfaces of the second connecting section 22 are flush with the top and side surfaces of the support body 46, respectively, constituting a second exposed portion for connection of the sensitive element. The requirements of the finished package for the second conductive lead 2 are: neither end face is exposed, i.e. the end face of the first connecting section 21 and the end face of the second connecting section 22 are exposed.
The manufacturing method of the invention comprises the following steps:
when the packaging tube shell is subjected to injection molding, a mold cavity is formed by matching a male mold and a female mold of the mold, the male mold of the mold presses the exposed front surfaces (namely the top surfaces) of the first conductive lead 1 and the second conductive lead 2, which are exposed in the containing chamber, and simultaneously presses the first conductive lead 1 and the second conductive lead 2 through a supporting structure on the mold, and the exposed front surfaces are back to back, so that the first conductive lead 1 and the second conductive lead 2 are ensured to be firmly fixed by the mold, the leads are prevented from deforming and shifting under the high-strength pressure impact of plastics, and the first conductive lead 1 and the second conductive lead 2 are enabled to keep the design form and the design position. And then, forming a plastic main body 4 by injection molding, forming a groove at a position corresponding to the support structure on the back surface of the plastic main body 4 after the mold is opened, finally filling sealant in the groove, and forming a sealing structure after the sealant is cured so as to prevent the back surfaces of the first conductive lead 1 and the second conductive lead 2 from being exposed in the air.
Specifically, since the back surfaces of the horizontal segments 11 of the respective first conductive leads 1 are flush, the support structure includes a first support structure for simultaneously pressing the back surfaces of the horizontal segments 11 of the four first conductive leads 1 arranged in a row, and as shown in fig. 5 and 6, the groove includes a first groove 41 correspondingly formed by the first support structure. Meanwhile, because the top surface and the bottom surface of the first connecting section 21 of the second conductive lead 2 are lower than the top surface and the bottom surface of the horizontal edge of the second connecting section 22, the back surfaces of the first connecting sections 21 of the two second conductive leads 2 are flush and form a low back surface, the back surfaces of the second connecting sections 22 of the two second conductive leads 2 are flush and form a high back surface, and the low back surfaces of the two second conductive leads 2 are flush with the back surface of the horizontal section 11 of the first conductive lead 1. Therefore, the supporting structure further includes a second supporting structure for simultaneously pressing the back surfaces of the horizontal segments 11 of the two first conductive leads 1 and the lower back surfaces of the two second conductive leads 2 arranged in a row, as shown in fig. 5 and 6, the grooves further include second grooves 42 correspondingly formed by the second supporting structure, the first supporting structure and the second supporting structure are both in a long strip shape, and the first grooves 41 and the second grooves 42 are also in a long strip shape.
The first supporting structure simultaneously presses the back surfaces of the horizontal sections 11 of the four first conductive leads 1 arranged in a row, and the second supporting structure simultaneously presses the back surfaces of the horizontal sections 11 of the two first conductive leads 1 arranged in a row and the lower back surfaces of the two second conductive leads 2, so that the number of the supporting structures can be saved, and the structure of the die is simplified; and the first groove 41 formed by the first supporting structure correspondingly and the second groove 42 formed by the second supporting structure correspondingly are both in a strip shape, so that the sealant can be conveniently and uniformly filled, and the manufacturing efficiency is improved.
Furthermore, the supporting structure further comprises a third supporting structure and a fourth supporting structure which are used for respectively pressing the high back surfaces of the two second conductive leads 2, so that the high back surfaces and the low back surfaces of the second conductive leads 2 are pressed, the stability and firmness of the second conductive leads 2 are further ensured, and the deformation and the play are avoided. As shown in fig. 5 and 6, the grooves further include a third groove 43 formed by a third support structure and a fourth groove 44 formed by a fourth support structure, wherein the third support structure and the fourth support structure are cylindrical, and the third groove 43 and the fourth groove 44 are also cylindrical.
In order to better maintain the designed shape and position of the first conductive lead 1 and the second conductive lead 2 and ensure the product quality, as shown in fig. 3, 4 and 5, each first conductive lead 1 and each second conductive lead 2 are integrally connected to the same metal conductive plate 5. Specifically, each first conductive lead 1 is connected to the metal conductive plate 5 through a first transition section 51, the cross-sectional dimension of the first transition section 51 is the same as the end face dimension of the lead soldering tin foot, and the two second conductive leads 2 are connected to the metal conductive plate 5 through a second transition section 52. Therefore, after the injection molding is completed, it is necessary to press the portion of each first conductive lead 1 exposed from the back surface of the plastic body, i.e., the bottom surface of the lead-out section 12 in fig. 6 and 7, and to cut the connection portion between each first conductive lead 1 and the metal conductive plate 5 (i.e., the first cut portion 54 in fig. 5) to form a lead solder fillet.
Meanwhile, since the end surfaces of the second conductive leads 2 cannot be exposed, the supporting structure further includes a fifth supporting structure for simultaneously pressing the lower back surfaces of the two second conductive leads 2, the fifth supporting structure is located at the outer side of the second supporting structure, and the groove further includes a fifth groove 45 (shown in fig. 5 and 6) correspondingly formed by the fifth supporting structure. In the cutting step, it is necessary to press the lower back surface of the second conductive lead 2 exposed in the fifth groove 45, cut the connection portion (the second cutting portion 55 in fig. 5) between the second conductive lead 2 and the metal conductive plate 5 in the fifth groove 45, and then completely seal the end portion of the second conductive lead 2 in the plastic body 4 by the sealant filled in the fifth groove 45.
In addition, as shown in fig. 3 and 4, the shielding cover of the package case is defined by two L-shaped shielding plates 3, and the two shielding plates 3 are integrally connected to the same metal shielding plate 6 through two third transition sections 61, which is beneficial to keeping the designed shapes and positions of the two shielding plates 3. Therefore, after the injection molding is completed, the connecting portions (third cut portions 63 in fig. 4) between the two shield sheets 3 and the metal shield plate 6 need to be cut to form the shield solder legs 31. As shown in fig. 1, 2, and 3, the metal shielding plate 6 and the metal conductive plate 5 are stacked, the metal conductive plate 5 is provided with a first exposure structure 53 for exposing the connection portions of the two shielding plates 3 and the metal shielding plate 6, the metal shielding plate 6 is provided with a second exposure structure 62 for exposing the connection portions of the first conductive leads 1 and the second conductive leads 2 and the metal conductive plate 5, and both the first exposure structure 53 and the second exposure structure 62 are holes.
According to the manufacturing method, the supporting structure on the die is used for pressing the back surfaces of the first conductive lead 1 and the second conductive lead 2, so that the first conductive lead 1 and the second conductive lead 2 are firmly fixed by the die, the leads are prevented from deforming and moving under the high-strength pressure impact of plastics, the first conductive lead 1 and the second conductive lead 2 are enabled to keep the design form and the design position, and the product yield can be further ensured.
In other embodiments of the method for manufacturing a package case for a patch sensor: the metal shielding plate and the metal conductive plate are not provided with an exposure structure, and two plates are required to be cut simultaneously when the cutting is carried out.
In other embodiments of the method for manufacturing a package case for a patch sensor: the first and second conductive leads may be directly connected to the metal conductive plate.
In other embodiments of the method for manufacturing a package case for a patch sensor: the two shielding plates can be not integrally connected on the same metal shielding plate but independently arranged, and meanwhile, the first conductive lead and the second conductive lead can also be not integrally connected on the same metal conductive plate and are also independently arranged.
In other embodiments of the method for manufacturing a package case for a patch sensor: the mould does not include fifth bearing structure, does not have the fifth recess this moment yet, and the second electrically conducts the lead wire and the deciding mode of metal conducting plate is the same with first electrically conductive lead wire, can cover the terminal surface of second electrically conducts the lead wire through the processing of later stage this moment.
In other embodiments of the method for manufacturing a package case for a patch sensor: the third groove and the fourth groove may both be square.
In other embodiments of the method for manufacturing the package case for the patch sensor: the mold does not include the third support structure and the fourth support structure, nor does the mold have the third recess and the fourth recess.
In other embodiments of the method for manufacturing a package case for a patch sensor: the first supporting structure does not simultaneously press the back surfaces of the horizontal sections of the four first conductive leads arranged in a row, the second supporting structure does not simultaneously press the back surfaces of the horizontal sections of the two first conductive leads arranged in a row and the low back surfaces of the two second conductive leads, but the back surfaces of the horizontal sections of the first conductive leads and the low back surfaces of the second conductive leads are correspondingly provided with supporting structures, and the grooves formed at the moment are more.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.
Claims (10)
1. A manufacturing method of a packaging tube shell for a patch type sensor is characterized by comprising the following steps: when the packaging tube shell is subjected to injection molding, the male die of the mold presses the exposed front faces, used for being exposed in the accommodating chamber, of the first conductive lead (1) and the second conductive lead (2), meanwhile, the back faces, opposite to the exposed front faces, of the first conductive lead (1) and the second conductive lead (2) are pressed through the supporting structure on the mold, the first conductive lead (1) and the second conductive lead (2) are enabled to keep the design shapes and the design positions, then the plastic main body (4) is formed through injection molding, a groove is formed in the position, corresponding to the supporting structure, of the back face of the plastic main body (4) after the mold is opened, finally, sealant is filled in the groove, and a sealing structure is formed after the sealant is solidified, so that the back faces of the first conductive lead (1) and the second conductive lead (2) are prevented from being exposed in the air.
2. The manufacturing method of the package casing for the patch sensor according to claim 1, wherein six first conductive leads (1) are provided, the back surface of the horizontal section (11) of each first conductive lead (1) is flush, two second conductive leads (2) are provided, the back surfaces of the first connecting sections (21) of the two second conductive leads (2) are flush and form a low back surface, the back surfaces of the second connecting sections (22) of the two second conductive leads (2) are flush and form a high back surface, and the low back surfaces of the two second conductive leads (2) are flush with the back surface of the horizontal section (11) of the first conductive lead (1); the support structure comprises a first support structure for simultaneously pressing the back surfaces of the horizontal sections (11) of the four first conductive leads (1) arranged in a row, and further comprises a second support structure for simultaneously pressing the back surfaces of the horizontal sections (11) of the two first conductive leads (1) arranged in a row and the low back surfaces of the two second conductive leads (2); the grooves comprise a first groove (41) formed by a first supporting structure correspondingly and a second groove (42) formed by a second supporting structure correspondingly, and the first groove (41) and the second groove (42) are both in a long strip shape.
3. The method of manufacturing a package for a patch sensor according to claim 2, wherein the support structures further include a third support structure and a fourth support structure for respectively pressing the high back surfaces of the two second conductive leads (2), and the recesses further include a third recess (43) formed by the third support structure and a fourth recess (44) formed by the fourth support structure.
4. The method of manufacturing the package case for the patch sensor according to claim 3, wherein the third recess (43) and the fourth recess (44) are cylindrical.
5. The method for manufacturing a package case for a patch sensor according to any one of claims 2-4, wherein the support structure further comprises a fifth support structure for simultaneously pressing the low back surfaces of the two second conductive leads (2), the fifth support structure is located outside the second support structure, and the recess further comprises a fifth recess (45) correspondingly formed by the fifth support structure; when the plastic injection molding is carried out, the first conductive leads (1) and the second conductive leads (2) are integrally connected onto the same metal conductive plate (5), the part, exposed out of the back face of the plastic main body (4), of each first conductive lead (1) is pressed after the plastic injection molding is finished, the connecting part of each first conductive lead (1) and the metal conductive plate (5) is cut to form a lead soldering tin pin, meanwhile, the low back face of the second conductive lead (2) exposed out of the fifth groove (45) is pressed, the connecting part of the second conductive lead (2) and the metal conductive plate (5) is cut in the fifth groove (45), and the end part of the second conductive lead (2) is completely sealed inside the plastic main body (4) through sealant filled in the fifth groove (45).
6. The manufacturing method of the package case for the patch sensor according to claim 5, wherein each of the first conductive leads (1) is connected to the metal conductive plate (5) through a first transition section (51), and a cross-sectional dimension of the first transition section (51) is the same as an end face dimension of a solder foot of the lead.
7. The method of manufacturing a package for a surface mount sensor according to claim 5, wherein the two second conductive leads (2) are connected to the metal conductive plate (5) through a second transition (52).
8. The method for manufacturing the package case for the surface mount sensor according to any one of claims 1 to 4, wherein the first conductive leads (1) and the second conductive leads (2) are integrally connected to the same metal conductive plate (5) during injection molding, and the connection portions between the first conductive leads (1) and the second conductive leads (2) and the metal conductive plate (5) are cut after the injection molding.
9. The manufacturing method of the package case for the surface mount sensor according to any one of claims 1 to 4, wherein the shield case of the package case is defined by two L-shaped shield sheets (3), the two L-shaped shield sheets (3) are integrally connected to the same metal shield plate (6) during injection molding, and the connecting portion of the two L-shaped shield sheets (3) and the metal shield plate (6) is cut to form the shield case solder tails (31).
10. The manufacturing method of the package case for the patch sensor according to claim 9, wherein the first conductive leads (1) and the second conductive leads (2) are integrally connected to a same metal conductive plate (5) during injection molding, and the connection portions between the first conductive leads (1) and the second conductive leads (2) and the metal conductive plate (5) are cut off after the injection molding; the metal shielding plate (6) and the metal conductive plate (5) are arranged in a stacked mode, a first exposure structure (53) used for exposing the connecting portion of the two L-shaped shielding sheets (3) and the metal shielding plate (6) is arranged on the metal conductive plate (5), and a second exposure structure (62) used for exposing the connecting portion of each first conductive lead (1) and each second conductive lead (2) and the metal conductive plate (5) is arranged on the metal shielding plate (6).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210688006.7A CN115008678A (en) | 2022-06-16 | 2022-06-16 | Manufacturing method of packaging tube shell for patch type sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210688006.7A CN115008678A (en) | 2022-06-16 | 2022-06-16 | Manufacturing method of packaging tube shell for patch type sensor |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204046825U (en) * | 2014-08-26 | 2014-12-24 | 歌尔声学股份有限公司 | The speaker housings of integrated injection molding |
| CN111458056A (en) * | 2019-01-21 | 2020-07-28 | 迈来芯科技有限公司 | Method of manufacturing a sensor device and a molded support structure |
| CN113091921A (en) * | 2021-03-26 | 2021-07-09 | 瓷金科技(河南)有限公司 | Packaging tube shell for patch type sensor and patch type sensor using same |
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2022
- 2022-06-16 CN CN202210688006.7A patent/CN115008678A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204046825U (en) * | 2014-08-26 | 2014-12-24 | 歌尔声学股份有限公司 | The speaker housings of integrated injection molding |
| CN111458056A (en) * | 2019-01-21 | 2020-07-28 | 迈来芯科技有限公司 | Method of manufacturing a sensor device and a molded support structure |
| CN113091921A (en) * | 2021-03-26 | 2021-07-09 | 瓷金科技(河南)有限公司 | Packaging tube shell for patch type sensor and patch type sensor using same |
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